CN210478087U - Printed electronics and printed electronics manufacturing system - Google Patents

Abstract

The utility model discloses a printed electron and a printed electron manufacturing system, relating to the technical field of rapid manufacturing of electronic circuits; the printed electronic manufacturing system comprises a first printing mechanism, a second printing mechanism and a third printing mechanism, wherein the first printing mechanism is used for forming a first insulation solder resist pattern which is not adhered with low-melting-point metal on the transfer surface of the thermal transfer printing substrate; the hot pressing mechanism is used for compounding the transfer printing surface of the thermal transfer printing base material and the printing surface of the compression plastic base material; the separation mechanism is used for separating the compounded thermal transfer printing base material and the compression plastic base material to obtain the compression plastic base material with the second insulation solder resist pattern attached to the printing surface; the second insulation solder resist pattern and the first insulation solder resist pattern are in a mirror image relation; the second printing mechanism is used for forming a low-melting-point metal electronic pattern opposite to the second insulating solder resist pattern on the printing surface of the plastic pressing base material. The utility model discloses to hinder the solder mask pattern and print on the heat-transfer seal substrate, the mode through the heat-transfer seal will hinder the solder mask pattern and transfer to the baroplasticity substrate on, solved and can't form on the baroplasticity substrate and hinder the problem of solder mask pattern.

Description

Printed electronics and printed electronics manufacturing system

Technical Field

The utility model belongs to the technical field of the quick preparation of electronic circuit, especially, relate to a printing electron and printing electron preparation system.

Background

The liquid metal is a low-melting-point metal with a melting point below 300 ℃, can be in a liquid state under a proper temperature condition, and particularly is gallium-based room-temperature liquid metal which can be in a liquid state under a room-temperature environment, so that the manufactured printed electron has excellent flexibility, can achieve the effect of repeated bending, and is suitable for manufacturing flexible printed electrons. The existing manufacturing method of low-melting-point metal printed electronics mainly comprises the steps of firstly forming a solder resist pattern (similar to a mask) which is not adhered with low-melting-point metal on a base material, then printing the low-melting-point metal, and enabling the low-melting-point metal to be only adhered to an area, opposite to the solder resist pattern, of the base material to form a low-melting-point metal electronic pattern;

at present, the solder resist pattern in the manufacturing method is mainly formed by utilizing carbon powder to realize non-adhesion of low-melting-point metal through a laser carbon powder printing technology, the carbon powder is printed on a base material through high temperature by the printing technology, so that the high requirement on the thermal stability of the base material is met, and for the hot-melt base material, the base material is deformed due to the high temperature, so that the base material cannot smoothly pass through a laser carbon powder printer, and the adhesion is easily generated in the laser carbon powder printer to cause the damage of the laser carbon powder printer.

SUMMERY OF THE UTILITY MODEL

In view of the above, an object of the present invention is to provide a printed electronic manufacturing system to solve the problem that it is impossible to form solder resist patterns on a substrate with poor temperature resistance in the prior art.

In some demonstrative embodiments, the printed electronic fabrication system includes: a first printing mechanism for forming a first insulation solder resist pattern to which a low melting point metal is not adhered on a transfer surface of the thermal transfer substrate; the hot pressing mechanism is used for carrying out hot pressing compounding on the transfer printing surface of the thermal transfer printing base material and the printing surface of the compression plastic base material; the separation mechanism is used for separating the thermal transfer printing base material subjected to hot-pressing compounding from the compression plastic base material to obtain the compression plastic base material with a second insulation solder resist pattern attached to a printing surface; the second insulation solder resist pattern and the first insulation solder resist pattern are in a mirror image relation; and the second printing mechanism is used for forming a low-melting-point metal electronic pattern opposite to the second insulating solder resist pattern on the printing surface of the plastic pressing base material.

In some optional embodiments, the printed electronic fabrication system, further comprising: and the chip mounting mechanism is used for mounting the electronic element on the target area of the low-melting-point metal electronic pattern on the compression plastic substrate.

In some optional embodiments, the printed electronic fabrication system, further comprising: and the packaging mechanism is used for forming a packaging layer covering the low-melting-point metal electronic pattern on the printing surface of the pressure plastic substrate.

In some optional embodiments, the printed electronic fabrication system, further comprising: the first discharging mechanism and the second discharging mechanism; the first discharging mechanism is used for providing a thermal transfer printing substrate; the second discharging mechanism is used for providing the compression-molding base material.

In some optional embodiments, the first printing mechanism is a laser toner printer.

In some alternative embodiments, the second printing mechanism is a low melting point metal printer.

In some optional embodiments, the second printing mechanism comprises: a coating roll; and a printing roller arranged opposite to the coating roller.

In some optional embodiments, the second printing mechanism further comprises: the ink distributing roller, the ink oscillating roller and the ink discharging roller are arranged in a manner of being opposite to the coating roller; and an ink tank containing low-melting-point metal and matched with the ink outlet roller.

Another object of the present invention is to provide a printed electronic, the printed electronic manufacturing system can make the printed electronic, including: a compression-molded base material; a second insulating solder resist pattern and a low melting point metal electronic pattern attached to the printing surface of the thermoplastic substrate; wherein the second insulating solder resist pattern and the low melting point metal electronic pattern have opposite patterns.

In some optional embodiments, the printed electronics further comprise: and the printing substrate is attached and connected with the reverse surface of the printing surface of the baroplastic substrate.

Compared with the prior art, the utility model has the advantages of as follows:

the utility model discloses an at first will hinder the solder mask pattern and print on the heat-transfer seal substrate, then the mode of rethread heat-transfer seal will hinder the solder mask pattern and transfer to the baroplasticity substrate on, solved and can't form on the baroplasticity substrate and hinder the problem of solder mask pattern.

Drawings

FIG. 1 is a first example of a configuration of a printed electronics manufacturing system in an embodiment of the present invention;

FIG. 2 is a flow chart of a fabrication of an exemplary printed electronic structure in an embodiment of the present invention;

FIG. 3 is an exemplary second configuration of a printed electronics manufacturing system in an embodiment of the present invention;

FIG. 4 is a second example of a printed electronic structure in an embodiment of the present invention;

FIG. 5 is a sectional view A-A of a second example of a printed electronic structure in an embodiment of the present invention;

FIG. 6 is a B-B cross-sectional view of a second example of a printed electronic structure in an embodiment of the present invention;

FIG. 7 is a schematic diagram of a second printing mechanism in an embodiment of the present invention;

FIG. 8 is a flow chart of a method of printed electronics fabrication in an embodiment of the present invention;

FIG. 9 is a flow chart of a method of printed electronics fabrication in an embodiment of the present invention;

FIG. 10 is a flow chart of a method of printed electronics in an embodiment of the present invention;

fig. 11 is a third structural example of printed electronics in the embodiment of the present invention.

Detailed Description

The following description and the drawings sufficiently illustrate specific embodiments of the invention to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, process, and other changes. The examples merely typify possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in or substituted for those of others. The scope of embodiments of the invention encompasses the full ambit of the claims, as well as all available equivalents of the claims. Embodiments of the invention may be referred to herein, individually or collectively, by the term "invention" merely for convenience and without intending to voluntarily limit the scope of this application to any single invention or inventive concept if more than one is in fact disclosed.

It should be noted that the technical features in the embodiments of the present invention may be combined with each other without conflict.

The embodiment of the invention discloses a printed electronic manufacturing system, and as shown in fig. 1, fig. 1 is a schematic structural diagram of the printed electronic manufacturing system in the embodiment of the invention. This printing electron manufacturing system, along the moving direction of substrate, include in proper order: a first printing mechanism 11, a thermal pressing mechanism 12, a separating mechanism 13 and a second printing mechanism 14; wherein, the first printing mechanism 11 is used to form a first insulation solder resist pattern 200 without adhering low melting point metal on the transfer surface of the thermal transfer substrate 100; the hot press mechanism 12 is used for hot-press compounding the transfer surface of the thermal transfer base material 100 and the printing surface of the plastic pressing base material 300; the separation mechanism 13 is used for separating the thermal transfer printing base material 100 and the compression plastic base material 300 which are subjected to hot-pressing compounding to obtain the compression plastic base material with the printing surface attached with the second insulation solder resist pattern 400; the second printing mechanism 14 is configured to form a low melting point metal electronic pattern 500 on the printing side of the press plastic substrate 300, which is opposite to the second insulating solder resist pattern 400.

When the printed electronic manufacturing system in the embodiment of the present invention operates, the thermal transfer substrate 100 is first fed into the first printing mechanism 11, and the first printing mechanism 11 completes the process of forming the first insulation solder resist pattern 200 on the transfer surface of the thermal transfer substrate 100; then, the thermal transfer substrate 100 attached with the first insulation solder resist pattern 200 and the plastic substrate 300 are simultaneously sent into the hot pressing mechanism 12, and the hot pressing compounding process of the thermal transfer substrate 100 and the plastic substrate 300 is completed through the hot pressing mechanism 12; separating the thermal transfer printing base material 100 and the compression plastic base material 300 which are subjected to the hot-pressing compounding through the separating mechanism 13 to obtain the compression plastic base material 300 attached with the second insulation solder resist pattern 400; the plastic substrate 300 with the second insulating solder resist pattern 400 attached thereto is then fed into the second printing mechanism 14, and the formation of the low melting point metal electronic pattern 500, which is the reverse of the second insulating solder resist pattern 400, on the printing side of the plastic substrate 300 is completed by the second printing mechanism 14.

The thermoplastic substrate 300 in the embodiment of the present invention includes, but is not limited to, a hot-melt substrate (e.g., a hot-melt adhesive film), which may be referred to as a thermoplastic substrate, and a pressure-sensitive substrate, which may reach a plastic state at a proper temperature, and a property that surface adhesion increases with the increase of the substrate temperature, and specific materials include, but are not limited to, TPU, TPV, PO, PES, PA, EVA, and the like. A sub-sensitive substrate (e.g., a sub-sensitive adhesive tape) that can increase the adhesiveness of the surface of the substrate by means of extrusion is different from a hot-melt substrate in that it is in a plastic state at normal temperature without being subjected to a temperature-raising treatment.

The invention firstly prints the solder resist pattern on the thermal transfer printing base material, and then transfers the solder resist pattern to the plastic pressing base material in a thermal transfer printing mode, thereby solving the problem that the solder resist pattern can not be formed on the plastic pressing base material.

The printed electronics formed by the above method, comprising: a thermoplastic substrate 300, and a second insulating solder resist pattern 400 and a low melting point metal electronic pattern 500 attached on a print-receiving surface of the thermoplastic substrate 300. Since the press-plastic substrate 300 is selected as the bearing substrate of the second insulation solder resist pattern 400 and the low-melting-point metal electronic pattern 500, when a user sets the printed electronics, the printed electronics can be directly combined with other substrates or the surfaces of objects in a hot pressing mode and attached to the target substrate required by the user, so that the setting of the printed electronics is rapid and convenient.

The printed electronics in the embodiment of the invention can also comprise a patch process and/or a packaging process; the chip mounting process is used for mounting corresponding elements/devices in printed electronics required by electronic devices; the packaging process is used for packaging the low melting point metal electronic pattern (and electronic device) in the printed electronics having protection requirement for the low melting point metal electronic pattern, and the specific pasting and/or packaging process thereof is detailed later.

Depending on the low melting point metal electronic pattern 500 in the produced printed electronics, or the choice of the target substrate (i.e., the printing substrate in the present embodiment) for the printed electronics, different fields and different functions can be created.

For example, the printed electronics in the embodiment of the present invention may be used as a flexible circuit board (or a flexible structure performing an electrical connection function), and the low melting point metal electronic pattern 500 thereon may present a complex circuit pattern or a simple circuit pattern, which may be determined according to actual design requirements; the target substrate of choice may then include flexible stretchable substrates or flexible non-stretchable substrates, including specifically but not limited to polyimide [ PI ], polyethylene terephthalate [ PET ], woven and non-woven fabrics, silicone polymers, polyurethanes, acrylics, and the like. In some examples, the target substrate may also be a flexible composite substrate, such as a flexible substrate embedded or coated with a polymer. The flexible circuit board is particularly suitable for being used as an FPC flexible circuit board.

For example, the printed circuit board in the embodiment of the present invention can be used as a rigid circuit board (or a rigid structure performing an electrical connection function), and the low melting point metal electronic pattern 500 thereon can be determined according to the actual design requirements like the flexible circuit board, unlike the flexible circuit board, the rigid circuit board has a rigid substrate selected from rigid materials such as stone, wood, glass, and hard polymer, and the thermoplastic substrate is an insulating material, so the target substrate can also be selected from conductive materials such as metal.

For example, the printed electronics in the embodiments of the present invention may be used as an electronic label (or a local structure in an electronic label). Specific electronic tags are chipless tags and chip tags. The tag antenna in the electronic tag is used as a thinning branch of the circuit, and target base materials in the flexible circuit board and the rigid circuit board can also be selected.

For example, the printed electron in the embodiment of the present invention may be used as a water-washed label (or a local structure in a water-washed label), and when the printed electron is used as a water-washed label, a packaging layer covering the low melting point metal electronic pattern 500 is further required to be formed, and the target substrate and the packaging layer should meet corresponding flexibility and waterproof indexes.

The hot pressing temperature of the hot pressing mechanism 12 in the embodiment of the present invention should satisfy the transfer temperature of the thermal transfer substrate 100, and in the case of selecting a hot-melt substrate for the thermoplastic substrate 300, the hot-melt substrate has good adhesion.

In some embodiments, the thermoplastic substrate 300 in the embodiments of the present invention may also be a composite thermoplastic substrate formed by combining with a target substrate, so that the printed electrons are directly adhered to the target substrate, thereby eliminating the subsequent hot pressing process on the target substrate and the isolation protection on the thermoplastic substrate. Wherein the target substrate is suitable for use in a flexible substrate. In some embodiments, the target substrate may also be a temporary substrate, such as a release paper/film, for isolation protection of the thermoplastic substrate.

Referring now to fig. 3, 4, 5, and 6, in some embodiments, a printed electronics fabrication system in embodiments of the present invention may further comprise: a mounting mechanism 15 for mounting the electronic device 600 on the mounting area of the low melting point metal electronic pattern 500 on the compression plastic substrate 300. The mounting area refers to a low melting point metal pad reserved in the low melting point metal electronic pattern 500, or a connection point acting similar to the pad. The placement mechanism 15 is located behind the second printing mechanism 14 along the moving direction of the substrate, so that the plastic substrate 300 attached with the low-melting-point metal electronic pattern 500 is sent to the placement mechanism 15 to implement the placement of the electronic device/device. Specifically, electronic devices/devices include, but are not limited to, resistors, inductors, capacitors, LEDs, diodes, transistors, chips, connectors (e.g., pads), and the like.

In some embodiments, the printed electronic manufacturing system in the embodiments of the present invention may further include: a thermal pressing head 16, the thermal pressing head 16 being configured to press the electronic device 600 against the thermoplastic substrate 300 at a set temperature and a set force; when the pressure-sensitive base material 300 is a hot-melt base material, the set temperature of the hot-pressing head 16 is used for locally softening the pressure-sensitive base material 300, so that the pressure-sensitive base material 300 at the position has certain deformability and corresponding viscosity, and therefore, after a certain force is applied to the electronic device 600 at this time, the electronic device 600 can be embedded into the pressure-sensitive base material 300 for a certain depth; in this process, since the second insulating solder resist pattern 400 does not have the ability of tensile deformation, during the process of pressing the thermoplastic substrate 300, the second insulating solder resist pattern 400 will break at the pressed portion, thereby exposing the thermoplastic substrate 300 (such as the seams a and b in fig. 6) at the bottom thereof, and further allowing the electronic device 600 to contact the exposed thermoplastic substrate 300 and be fixed to the mounting area by the adhesive force of the thermoplastic substrate 300. The low-melting-point metal has good tensile property in a fluid state, and the tensile conductivity of the low-melting-point metal is more than 300%, so that the local deformation of the thermoplastic substrate 300 does not cause the fracture of the low-melting-point metal, and the low-melting-point metal electronic pattern 500 can still keep a good conductive state. The thermal head 16 in this embodiment may be provided independently of the mounting mechanism 15, or may be provided in the mounting mechanism 15 as a separate and integrated mechanism from the mounting mechanism 15.

Illustratively, the thickness of the thermoplastic substrate 300 in the present embodiment ranges between 0.1mm and 2mm, preferably ranges between 0.1mm and 0.5 mm;

illustratively, the thickness of the insulating solder resist pattern in the embodiment of the present invention ranges from 1 μm to 100 μm, and preferably ranges from 1 μm to 30 μm;

illustratively, the low melting point metal electronic pattern in the embodiments of the present invention has a thickness in the range of 1 μm to 100 μm, and preferably in the range of 3 μm to 30 μm;

illustratively, the depth of embedding of the electronic device in the embodiment of the present invention on the thermoplastic substrate 300 is between 10 μm and 500 μm, and preferably in the range of 10 μm to 100 μm.

In some embodiments, the material properties of the thermoplastic substrate 300, the material thickness, and the set temperature and the set force of the thermal head all affect the adhesion of the electronic device 600 to the thermoplastic substrate 300 exposed at the embedded depth and the fault of the electronic device 600 in the thermoplastic substrate 300, and it should be understood by those skilled in the art that the above processes can be performed by using appropriate materials and setting appropriate parameters on the premise that the above set temperature and the set force are not enough to damage the electronic device 600, which is not limited by the present invention.

In some embodiments, the printed electronic manufacturing system in the embodiments of the present invention may further include: an encapsulation mechanism (not shown) for forming an encapsulation layer 700 covering the low melting point metal electronic pattern 500 on the printing side of the thermoplastic substrate 300. The encapsulation layer 700 may be laminated or coated with a polymer adhesive. The packaging mechanism is located behind the second printing mechanism 14 along the moving direction of the substrate, so that the compression-molding substrate 300 attached with the low-melting-point metal electronic pattern 500 is sent into the packaging mechanism to package the low-melting-point metal electronic pattern 500.

In some embodiments, the printed electronics fabrication system of embodiments of the present invention may include both the patch mechanism 15 and the packaging mechanism; the chip mounting mechanism 15 and the packaging mechanism are sequentially disposed behind the second printing mechanism 14, so that the electronic device 600 can be packaged when the packaging mechanism is used for packaging. The patch mechanism 15 and the packaging mechanism in this embodiment can be activated or deactivated according to the operator's settings to meet different actual design requirements for printed electronics.

In some embodiments, the printed electronic manufacturing system in the embodiments of the present invention may further include: a first discharge mechanism 17 and a second discharge mechanism 18; wherein, the first discharging mechanism 17 is used for providing the thermal transfer substrate 100; the second discharging mechanism 18 is used for providing the plastic substrate 300; specifically, the first discharging mechanism 17 and/or the second discharging mechanism 18 may be selected from a roll structure in which the respective base material is wound, or a material roll structure in which the respective base material is conveyed. It should be understood by those skilled in the art that the printed electronic manufacturing system in the embodiment of the present invention can satisfy the operation of the printed electronic manufacturing system as long as the transportation of the corresponding substrate is ensured even if the first discharging mechanism 17 and the second discharging mechanism 18 are not provided.

In the embodiment of the present invention, the material for forming the first insulating solder resist pattern 200 may be a material that does not adhere to the low melting point metal and can be patterned, such as carbon powder; the first printing mechanism 11 may be a device capable of patterning the above materials, and includes, but is not limited to, a toner laser printer.

In the embodiment of the present invention, the low melting point metal electronic pattern 500 is formed by using a low melting point metal simple substance or alloy with a melting point below 100 ℃, including but not limited to a gallium simple substance, a gallium-based alloy, a bismuth-based alloy, etc.; preferably, gallium-indium eutectic alloy, gallium-tin eutectic alloy, gallium-indium-tin-zinc eutectic alloy, bismuth-indium-tin eutectic alloy may be selected. In this embodiment, the material of the low melting point metal can be selected according to the actual requirement of the printed electronics, and the lower the melting point of the low melting point metal is, the printed electronics formed by the low melting point metal can still keep a good fluid state in a lower temperature environment (such as a normal temperature environment), so that the printed electronics keep good flexibility, and the lower the requirement on the printing equipment is. On the other hand, the higher the melting point of the low melting point metal is, the electronic pattern formed by the low melting point metal can be solidified under a room temperature environment, so that the low melting point metal electronic pattern has certain structural strength, and can be restored to a fluid state under appropriate conditions, and self-repairing of the low melting point metal electronic pattern can be realized.

In some embodiments, suitable amounts of metal particles or non-metal particles may be mixed into the low melting point metal in embodiments of the present invention to increase the conductive properties of the low melting point metal and/or adjust the viscosity of the low melting point metal. Preferably, the metal particles and the non-metal particles are selected from micro-nano-scale particles.

The second printing mechanism 14 in the embodiment of the present invention may be a low melting point metal printing machine such as a coater, a lithographic printing machine, a gravure printing machine, a flexographic printing machine, a screen printing machine, a pad printing machine, an offset printing machine, and a pad printing machine. Among other things, the second printing mechanism 14 in the printed electronic manufacturing system in the embodiment of the present invention is particularly suitable for a coater.

As shown in fig. 7, specifically, the second printing mechanism 14 in the embodiment of the present invention may include: a coating roller 141; and a printing roll 142 arranged in counter-roll relation to the coating roll 141. The press-molded substrate 300 separated by the separating means is fed between the coating rollers 141 and 142, and the printing surface of the press-molded substrate 300 to which the second insulating solder resist pattern 400 is attached is close to the coating roller 141.

In some embodiments, the number of the second printing mechanisms 14 in the embodiments of the present invention may be multiple, and the second printing mechanisms 14 are arranged in series, so that the multiple second printing mechanisms 14 can thicken the formed low melting point metal electronic pattern 500 to achieve good conductive performance.

In some embodiments, the second printing mechanism 14 may further include: an ink distributing roller 143, an ink oscillating roller 144, and an ink discharging roller 145 provided in counter-roll with the coating roller 141; and an ink reservoir 146 containing a low melting point metal that cooperates with the ink outlet roller 145. The second printing mechanism 14 in this embodiment takes out the low melting point metal in the ink tank 146 by the ink-out roller 145 and transfers it to the applicator roller 141, and the low melting point metal attached to the applicator roller 141 is printed on the baroplastic substrate 300 after passing through the ink-uniformizing and homogenizing of the ink-uniformizing roller 143 and the ink-oscillating roller 144.

As shown in fig. 8, an embodiment of the present invention further provides a method for manufacturing a printed electronic device, including:

step S11, selecting a pretreated compression-molding base material; the printing surface of the compression plasticity base material is adhered with an insulation solder mask pattern which is not adhered with low melting point metal and can not be stretched, and an electronic pattern of the low melting point metal which is opposite to the shape of the solder mask pattern and can be stretched;

a mounting area for mounting an electronic device is preset on the compression-molding base material, and the mounting area contains a connection point on the low-melting-point metal electronic pattern for electrically connecting with the electronic device and the insulation solder resist pattern adjacent to the connection point;

step S12, providing an electronic device; and the electronic device is embedded and assembled in the mounting area, so that the electronic device is electrically connected with the connection point of the low-melting-point metal electronic pattern and is bonded with the compression plastic base material exposed by the compression fracture of the insulation solder mask pattern.

Specifically, in the case that the thermoplastic substrate is a hot-melt substrate, the thermoplastic substrate is brought into a plastic state by raising the temperature of the thermoplastic substrate located in the mounting region to a third substrate temperature in step S12. Wherein the third substrate temperature can be the pressing temperature x of the selected plastic substrate, or

Within the range. The temperature of the third substrate should not be higher than the temperature resistant temperature of the electronic device to avoid damage to the electronic device.

In some embodiments, a carrier substrate is disposed on the side of the substrate opposite the print side of the baroplastic substrate. The selection range of the carrier substrate is not described herein.

In the embodiment of the invention, the pressure plastic substrate is selected to be attached with the stretchable low-melting-point metal electronic pattern and the non-stretchable insulating solder resist pattern, in the process of pasting the electronic device, the electronic device can be directly pressed on the target area, so that the electronic device is embedded in the pressure plastic substrate, and in the process, because the low-melting-point metal electronic pattern has good stretchability, therefore, during the deformation of the compression-molded substrate, the low-melting-point metal electronic pattern is still continuous to maintain the electrical connection with the electrical device, while the non-stretchable insulating solder resist pattern is formed during the deformation of the compression-molded substrate, since the insulating solder resist pattern does not have tensile properties, a fracture is generated due to deformation of the following substrate, and the thermoplastic substrate located below the insulating solder resist pattern is exposed at the fracture, so that stable connection is formed between the electronic device and the exposed thermoplastic substrate. The method omits the traditional glue dispensing procedure, simplifies the manufacturing process, improves the manufacturing effect, and reduces the manufacturing cost because the anisotropic conductive adhesive can not be added.

As shown in fig. 9, in some embodiments, before the selecting the pretreated thermoplastic substrate, the method further comprises:

and step S10, providing a compression plastic substrate, preprocessing the compression plastic substrate, and forming the insulation solder mask pattern and the low-melting-point metal electronic pattern on the printing surface of the compression plastic substrate.

In some embodiments, the insulating solder resist pattern is a second insulating solder resist pattern; further, as shown in fig. 10, the process of forming the second insulating solder resist pattern on the printing side of the thermoplastic substrate includes:

step S101, providing a thermal transfer printing base material;

step S102, forming a first insulation solder resist pattern on the printing surface of the thermal transfer printing base material; the first insulation solder resist pattern and the second insulation solder resist pattern are in mirror image relation;

and step S103, transferring the first insulation solder mask pattern on the heat transfer base material to the printing surface of the compression plasticity base material by using a heat transfer mode to obtain the compression plasticity base material attached with the second insulation solder mask pattern.

Specifically, the step S103 of transferring the first insulating solder resist pattern on the thermal transfer substrate to the printing surface of the plastic substrate by using a thermal transfer method specifically includes: and compounding the transfer surface of the thermal transfer printing base material and the printing surface of the compression plastic base material at the temperature of a second base material, and separating to obtain the compression plastic base material attached with the second insulation solder resist pattern. Wherein the second substrate temperature is a transfer temperature to the thermal transfer substrate.

In some embodiments, the process of forming the low melting point metal electronic pattern on the bearing side of the baroplastic substrate comprises:

and step S104, printing the low-melting-point metal in a molten state on the printing surface of the plastic pressing base material, so that the low-melting-point metal is attached to the area which is not covered by the second insulation solder resist pattern, and the low-melting-point metal electronic pattern is formed.

Specifically, in the case that the thermoplastic substrate is a hot-melt substrate, the step S104 of printing the low-melting-point metal in a molten state on the printing surface of the thermoplastic substrate specifically includes: when the pressure plastic substrate reaches the first substrate temperature, the low melting point gold is addedThe printing ink is printed on the printing surface of the plastic pressing base material. Wherein the first substrate temperature is in the range

Wherein x is the pressing temperature of the hot-melt base material.

Another object of the present invention, as shown in fig. 2, 4, 5, 6 and 11, is to provide a printed electronic that can be made by any one of the above printed electronic manufacturing systems, comprising: a thermoplastic substrate 300; a second insulating solder resist pattern 400 and a low melting point metal electronic pattern 500 attached on the printing side of the thermoplastic substrate 300; wherein the second insulating solder resist pattern 400 and the low melting point metal electronic pattern 500 have opposite patterns.

In some embodiments, the printed electronics in embodiments of the present invention may further comprise: the printing substrate 800, the printing substrate 800 and the plastic substrate 300 are hot-pressed and compounded. The printing substrate 800 can be combined with the printing surface of the compression-molded substrate 300 to which the second insulating solder resist pattern 400 and the low-melting-point metal electronic pattern 500 are attached, and the printing substrate 800 in this embodiment can be matched with the compression-molded substrate 300 to realize the packaging of the low-melting-point metal electronic pattern 500. In other embodiments, the printing substrate 800 may be combined with the opposite side of the printing surface (i.e., the other side of the printing surface) of the embossed substrate 300.

In some embodiments, the printed electronics in embodiments of the present invention may further comprise: an electronic device 600, the electronic device 600 being attachable to a target area of the low melting point metal electronic pattern 500 on the thermoplastic substrate 300. The electronic device 600 includes, but is not limited to, resistors, inductors, capacitors, LEDs, diodes, transistors, chips, connectors (e.g., pads), and the like.

The mounting area comprises a connection point on the low-melting-point metal electronic pattern for electrically connecting with the electronic device and the insulating solder resist pattern adjacent to the connection point, the electrical device 600 is electrically connected with the connection point of the low-melting-point metal electronic pattern, and bonding is formed between the electrical device 600 and the compression-plastic substrate exposed by the compression fracture of the insulating solder resist pattern.

The number of the connection points in the mounting region in the embodiment of the present invention may be one or more, for example, when one bonding pad is used as an electronic device to be mounted, only one connection point may be provided; for the electronic device with multiple pins, the connection points in the mounting area correspond to the pins of the electronic device to be mounted one by one. It should be noted that pins that are not involved in electrical connections of an electronic device (e.g., a chip) may be omitted as desired by design.

Further, in a case where a plurality of connection points exist in the mounting area, the adjacent insulating solder resist patterns may be insulating solder resist patterns between the connection points.

In some embodiments, the electronic device 600 in printed electronics in embodiments of the present invention may be insert bonded to the baroplastic substrate 300; wherein the thermoplastic substrate 300 to which the electronic device 600 is adhered is a partial thermoplastic substrate 300 whose surface is exposed by the second insulating solder resist pattern 400 layer (e.g., by being pressed or other means that can achieve the effect).

In some embodiments, the printed electronics in embodiments of the present invention may further comprise: and the packaging layer 700, wherein the packaging layer 700 is attached to the printing surface of the extruded plastic substrate 300 and covers the low-melting-point metal electronic pattern 500 (and the electronic device 600).

The printed electronics in the embodiment of the invention can be applied to printed electronics such as a flexible circuit board, a rigid circuit board, an electronic tag, a fabric tag, a water-washing label and the like, or can be a local structure in the printed electronics.

Those of skill would further appreciate that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.

Claims (10)

1. A printed electronic production system, comprising:

a first printing mechanism for forming a first insulation solder resist pattern to which a low melting point metal is not adhered on a transfer surface of the thermal transfer substrate;

the hot pressing mechanism is used for carrying out hot pressing compounding on the transfer printing surface of the thermal transfer printing base material and the printing surface of the compression plastic base material;

the separation mechanism is used for separating the thermal transfer printing base material subjected to hot-pressing compounding from the compression plastic base material to obtain the compression plastic base material with a second insulation solder resist pattern attached to a printing surface; the second insulation solder resist pattern and the first insulation solder resist pattern are in a mirror image relation;

and the second printing mechanism is used for forming a low-melting-point metal electronic pattern opposite to the second insulating solder resist pattern on the printing surface of the plastic pressing base material.

2. The printed electronics manufacturing system of claim 1, further comprising:

and the chip mounting mechanism is used for mounting the electronic element on the target area of the low-melting-point metal electronic pattern on the compression plastic substrate.

3. The printed electronics manufacturing system of claim 1, further comprising:

and the packaging mechanism is used for forming a packaging layer covering the low-melting-point metal electronic pattern on the printing surface of the pressure plastic substrate.

4. The printed electronics manufacturing system of claim 1, further comprising: the first discharging mechanism and the second discharging mechanism; the first discharging mechanism is used for providing a thermal transfer printing substrate; the second discharging mechanism is used for providing the compression-molding base material.

5. The printed electronics manufacturing system of claim 1, wherein said first printing mechanism is selected from a laser toner printer.

6. A printed electronic production system according to claim 1, wherein the second printing mechanism is a low melting metal printer.

7. The printed electronics manufacturing system of claim 1, wherein said second printing mechanism comprises:

a coating roll; and a printing roller arranged opposite to the coating roller.

8. The printed electronics manufacturing system of claim 7, wherein said second printing mechanism further comprises:

the ink distributing roller, the ink oscillating roller and the ink discharging roller are arranged in a manner of being opposite to the coating roller; and an ink tank containing low-melting-point metal and matched with the ink outlet roller.

9. A printed electronic produced by the printed electronic production system of any of claims 1-8, comprising:

a compression-molded base material;

a second insulating solder resist pattern and a low melting point metal electronic pattern attached to the printing surface of the thermoplastic substrate; wherein the second insulating solder resist pattern and the low melting point metal electronic pattern have opposite patterns.

10. The printed electronics of claim 9, further comprising:

and the printing substrate is attached and connected with the reverse surface of the printing surface of the baroplastic substrate.

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