JP2003168760A - Interposer having conductive connection unit - Google Patents

Interposer having conductive connection unit

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Publication number
JP2003168760A
JP2003168760A JP2001367504A JP2001367504A JP2003168760A JP 2003168760 A JP2003168760 A JP 2003168760A JP 2001367504 A JP2001367504 A JP 2001367504A JP 2001367504 A JP2001367504 A JP 2001367504A JP 2003168760 A JP2003168760 A JP 2003168760A
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conductive
connection
unit
interposer
lt
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JP2001367504A
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JP3894540B2 (en )
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Toru Maruyama
徹 丸山
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Toppan Forms Co Ltd
トッパン・フォームズ株式会社
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

<P>PROBLEM TO BE SOLVED: To provide an interposer having a conductive connection unit capable of obtaining an excellent electric conduction as well as an excellent adhesion or the interposer having the conductive connection unit rigidly connecting a board, on which an IC chip is mounted for instance, and the conductive connection unit of another electric circuit with each other and whose electric connection is not broken even when external forces are concentrated on the conductive connection unit. <P>SOLUTION: The interposer having the conductive connection unit, formed on the board and on which the IC chip is mounted, in which a conductive part and a non-conductive part having a comb or lattice configuration are mixed in the conductive connection unit, is employed whereby the purpose of the interposer can be achieved. <P>COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】 【0001】 【発明の属する技術分野】本発明は、導電接続部を有するインターポーザに関するものであり、さらに詳しくは非接触ICタグなどの薄形の情報送受信型記録メディアなどのRF−ID(RadioFrequency I BACKGROUND OF THE INVENTION [0001] [Technical Field of the Invention The present invention relates to an interposer having an electrically conductive connecting part, more particularly a non-contact IC thin information transmitting and receiving-type recording medium such as a tag, such as of the RF-ID (RadioFrequency I
Dentification)メデイア、ペーパーコンピュータ、使い捨て電気製品などに適用される導電接続部を有するインターポーザに関するものである。 Dentification) media, to a paper computer, an interposer having an electrically conductive connecting part which is applied to a disposable electrical products. 【0002】 【従来の技術】本発明者は先に導電接続部同士をパターン状に形成した接着剤部を介して対接させて接続する方法を提案した(特願2001−260009号明細書)。 [0002] The present inventor has proposed a method of connecting by Taise' via an adhesive portion formed of conductive connection portions above the pattern (Japanese Patent Application No. 2001-260009 specification) . 次に、図6〜8によりアンテナ回路体がICチップ実装インターポーザとアンテナ所持体とに構成が区分けされていて、このICチップ実装インターポーザとアンテナ所持体とが予め形成され、これらを用いてアンテナ回路体(電気回路)を形成する場合の導電接続部同士の接続方法について説明する。 Then, the antenna circuit body is not configured is divided into the IC chip mounting the interposer and the antenna possessed body by 6-8, and the IC chip mounting the interposer and the antenna possession body is preformed antenna circuit using these illustrating a method for connecting the conductive connection portions of the case of forming the body (electric circuit). 【0003】図6は一方のICチップ実装インターポーザの形成過程を示していて、まず後述するアンテナ所持体の端子部分に亘るように所定の大きさとした基材1を用意し(イ)、この基材1にICチップ実装用導電部2 [0003] Figure 6 is illustrates the formation process of one IC chip mounting an interposer, first providing a substrate 1 which is a predetermined size to span the terminal portion of the later-described antenna possessed body (A), the group guiding the IC chip mounted on the timber 1 collector 2
と導電接続部3とが連続している一対の導電パターン4 A pair of conductive patterns conductive connection portion 3 and are continuous with 4
を設ける(ロ)。 The provision of (b). この後、前記ICチップ実装用導電部2に跨るようにしてICチップ5を実装してICチップ実装インターポーザAを形成し、フェノール樹脂、ポリエステル樹脂、エポキシ樹脂などの熱硬化型絶縁ペーストなどからなる封止剤20を用いてICチップ5を封止し(ハ)、少なくともICチップ5が実装されている導電接続部3(接合予定部位)の上に接着剤をパターン状に塗布して接着剤部6を形成する(ニ)。 Thereafter, by mounting the IC chip 5 by forming the IC chip mounting the interposer A and extended over the IC chip mounting conductive part 2, consisting of a phenol resin, a polyester resin, a thermosetting type insulating paste such as an epoxy resin sealing the IC chip 5 with a sealing agent 20 (c), at least the IC chip 5 is electrically conductive connection 3, which is implemented adhesive is applied to the adhesive in a pattern on the (predetermined joining portions) forming a section 6 (d). 【0004】図7は他方のアンテナ所持体Bの形成過程を示していて、所定の大きさとした基材7を用意し(イ)、この基材7にアンテナ導電部8とこのアンテナ導電部8の端部に位置して端子部分である導電接続部9 [0004] Figure 7 is shows a process of forming other antenna possessing body B, and providing a substrate 7 having a predetermined size (a), an antenna conductive portion 8 to the substrate 7 The antenna conductive portion 8 a terminal portion located on the end portion conductive connection 9
(接合予定部位)とからなる導電パターン10を設け(ロ)、これによってアンテナ所持体Bが形成される。 The conductive pattern 10 comprised of (predetermined joining portion) and provided (b), whereby the antenna possession body B is formed.
前記導電接続部9は上記ICチップ実装インターポーザAの導電接続部3と対応するように設けられている。 The conductive connection portion 9 is provided so as to correspond to the conductive connection portion 3 of the IC chip mounting the interposer A. 1
1は絶縁部である。 1 is an insulating unit. 【0005】そして、ICチップ実装インターポーザA [0005] Then, IC chip implementation interposer A
とアンテナ所持体Bとをそれぞれの導電接続部3、9がパターン状に形成された接着剤部6を介して相対するように重ね合わせて、導電接続部3、9をパターン状に形成された接着剤部6を介して接着するとともに電気的導通を図り、ICチップ実装インターポーザAとアンテナ所持体Bとを接合することで、図8に示すRF−IDメデイアCが得られるというものである。 An antenna possession body B the respective conductive connection portion 3, 9 are superimposed so as to face via an adhesive portion 6 formed in a pattern, which is formed using a conductive connection portion 3, 9 in a pattern and achieving electrical conduction as well as via an adhesive portion 6, by joining the IC chip mounting the interposer a and the antenna possession body B, and those that RF-ID media C shown in FIG. 8 is obtained. 【0006】 【発明が解決しようとする課題】しかし、この方法によると、塗布する接着剤のパターンを工夫したり、塗布する接着剤の塗工量を精度よくコントロールする必要があり、適性な接着剤のパターンや接着剤の適性塗工量を採用しないと、導電接続部同士の接着はよいが、導電接続部同士の導通が不十分であったり、逆に、導電接続部同士の導通はよいが、導電接続部同士の接着が不十分であったりする問題があり、また、封止剤20と基材1との接触面積が小さいため封止剤20と基材1との接着力が小さくICチップ5の封止が充分でないという問題があった。 [0006] The present invention is to provide, however, according to this method, devising the pattern of adhesive applied, it is necessary to accurately control the coating amount of the adhesive applied, proper adhesion If not adopted proper coverage of the pattern or the adhesive agent, although the adhesion is good between the conductive connection portion, or a conduction insufficient between the conductive connection portion, conversely, the conductive connection portion conduction between good but there is a problem that adhesion between the conductive connection portion or insufficient, also, the adhesion strength between the sealant 20 and the substrate 1 for the contact area between the encapsulant 20 and the substrate 1 is small is small sealing of the IC chip 5 there was a problem that it is not enough. 本発明の目的は、従来の問題を解決し、塗布する接着剤のパターンを工夫したり、塗布する接着剤の塗工量を精度よくコントロールしなくても、導電接続部同士の良好な接着および導通が得られ、また、封止剤によるICチップの強力な封止ができるインターポーザを提供することである。 An object of the present invention is to solve the conventional problems, devising the pattern of adhesive applied, even without accurately controlling the coating amount of the adhesive applied, good adhesion and between the conductive connection portion conduction can be obtained and is to provide an interposer which can strong sealing of the IC chip by sealant. 【0007】 【課題を解決するための手段】本発明者は前記課題を解決すべく鋭意研究を重ねた結果、前記導電接続部として、特定の形状を有する導電接続部を用いることにより、導電接続部同士の良好な接着および導通が得られることを見出し、また、基材のICチップの封止面に多数の凸部を形成することにより封止剤によるICチップの強力な封止ができることを見出し、本発明を完成するに至った。 The present inventors have Means for Solving the Problems] As a result of extensive studies to solve the above problems, as the conductive connection portion, by using a conductive connection having a specific shape, the conductive connection It found that part good adhesion and conduction between the obtained also that it is strong sealing of the IC chip by the sealing agent by forming a number of projections on the sealing surface of the IC chip of the base material heading, which resulted in the completion of the present invention. 【0008】すなわち、本発明の請求項1記載の導電接続部を有するインターポーザは、基材上に形成されたI Namely, the interposer having an electrically conductive connecting part according to claim 1 of the present invention was formed on the substrate I
Cチップを実装した導電接続部を有するインターポーザであって、前記導電接続部が導電部と非導電部が混在している形状を有することを特徴とする。 A interposer having an electrically conductive connecting part which implements the C chip, and having a shape that the conductive connection portion is electrically conductive portion and the nonconductive portion are mixed. 【0009】そして、本発明の請求項2記載の導電接続部を有するインターポーザは、基材上に形成されたIC [0009] Then, an interposer having an electrically conductive connecting part according to claim 2 of the present invention, IC formed on a substrate
チップを実装した導電接続部を有するインターポーザであって、基材のICチップの封止面に多数の凸部が形成されていることを特徴とする。 A interposer having an electrically conductive connecting part which implements the chip, wherein the plurality of convex portions are formed on the sealing surface of the IC chip of the substrate. 【0010】また、本発明の請求項3記載の導電接続部を有するインターポーザは、基材上に形成されたICチップを実装した導電接続部を有するインターポーザであって、前記導電接続部が導電部と非導電部が混在している形状を有するとともに、基材のICチップの封止面に多数の凸部が形成されていることを特徴とする。 Further, an interposer having an electrically conductive connecting part according to claim 3 of the present invention is a interposer having an electrically conductive connecting part which is mounted an IC chip formed on a substrate, wherein the conductive connection portion is electrically conductive portion and with non-conductive portion has a shape that are mixed, wherein the plurality of convex portions are formed on the sealing surface of the IC chip of the substrate. 【0011】本発明においては、導電部と非導電部が混在しているような、例えば櫛型や格子型などの凹凸形状を有する導電接続部を用いる。 [0011] In the present invention, as the conductive portion and the nonconductive portion are mixed, a conductive connection portion having an uneven shape such as comb or lattice type. 例えばICチップが実装された基板と他の電気回路の導電接続部をそれぞれ櫛型や格子型などの凹凸形状を有する導電接続部とし、両方の導電接続部が接着剤を介して相対するように重ね合わせて、押圧・加熱するなどすると、凸部に介在していた接着剤は流れて凹部に移行する。 For example, the conductive connection portion each having an uneven shape such as comb or lattice-type conductive connection portion of the substrate and the other electric circuit IC chip is mounted, so that both of the conductive connection portion is relative with an adhesive superposed, when such pressing and heating, the adhesive which has been interposed protrusion moves in the recess flows. その結果、凸部同士は接着剤を介さずに直接接触して良好な電気的導通が得られるとともに、凹部には移行してきた接着剤を含めて多量の接着剤が介在するようになるので良好な接着が得られる。 Good As a result, the convex portions has a good electrical conduction in direct contact without using the adhesive obtained, since a large amount of adhesive including an adhesive has been migrated to the recess is so interposed Do adhesion is obtained. 【0012】そして、基材のICチップの封止面に多数の凸部を形成しておき、その上に封止剤を適用してIT [0012] Then, previously formed multiple projections on the sealing surface of the IC chip substrate, IT by applying the sealing agent thereon
チップを封止すれば、多数の凸部が存在するため封止剤と基材との接触面積が大きくなり、その結果、封止剤によるICチップの強力な封止ができる。 If sealing the chip, the contact area between the sealant and the substrate due to a large number of protrusions present increases. As a result, it is strong sealing of the IC chip by sealant. 【0013】 【発明の実施の形態】以下、図面を用いて本発明の実施の一形態を説明する。 DETAILED DESCRIPTION OF THE INVENTION Hereinafter, an embodiment of the present invention will be described with reference to the drawings. 図1〜3によりアンテナ回路体(電気回路)がICチップ実装インターポーザとアンテナ所持体とに構成が区分けされていて、このICチップ実装インターポーザとアンテナ所持体とが予め形成され、これらを用いてアンテナ回路体(電気回路)を形成する場合の導電接続部同士の接続方法について説明する。 Antenna circuit body by 1-3 (electrical circuits) have been divided configuration in the IC chip mounting the interposer and the antenna possession body, and the IC chip mounting the interposer and the antenna possession body is preformed antenna using these illustrating a method for connecting the conductive connection portions of the case of forming a circuit body (electric circuit). 【0014】図1は一方のICチップ実装インターポーザの形成過程を示していて、まず後述するアンテナ所持体の端子部分に亘るように所定の大きさとした基材1を用意し(イ)、この基材1にICチップ実装用導電部2 [0014] Figure 1 is shows the formation process of one IC chip mounting an interposer, first providing a substrate 1 which is a predetermined size to span the terminal portion of the later-described antenna possessed body (A), the group guiding the IC chip mounted on the timber 1 collector 2
と櫛型の形状を有する導電接続部3Aとが連続している一対の導電パターン4を設ける(ロ)。 A conductive connection portion 3A and the pair of contiguous conductive pattern 4 is provided with a comb-like shape (B). この後、前記I After this, the I
Cチップ実装用導電部2に跨るようにしてICチップ5 As span C chip mounting conductor portion 2 IC chip 5
を実装してICチップ実装インターポーザAを形成し、 The implement formed an IC chip mounting the interposer A,
フェノール樹脂、ポリエステル樹脂、エポキシ樹脂などの熱硬化型絶縁ペーストなどからなる封止剤20を用いてICチップ5を封止し(ハ)、そして少なくともIC Phenolic resins, polyester resins, the IC chip 5 is sealed with a sealant 20 made of a thermosetting insulating paste such as an epoxy resin (C), and at least IC
チップ5が実装されている導電接続部3(接合予定部位)の上に接着剤を塗布して接着剤部6Aを形成する(ニ)。 Conductive connection portion 3 chip 5 is mounted by applying an adhesive onto the (predetermined joining portions) to form an adhesive portion 6A (d). 導電接続部3Aは、複数の導電部12と、導電部12の間に複数の非導電部13が混在している。 Conductive connection portion 3A includes a plurality of conductive portions 12, a plurality of non-conductive portion 13 between the conductive portion 12 are mixed. 導電部12は基材上に導電性ペーストを用いて印刷法により形成されたり、金属箔をエッチングするなどして形成され凸部となっている。 Conductive portion 12 is made or formed by a printing method using a conductive paste on a substrate, it is formed, for example, by etching the metal foil the convex portion. 一方、非導電部13は導電部12 On the other hand, non-conductive portion 13 conductive portion 12
が形成されていない箇所であり、凹部となっている。 A portion where but not formed, has a recess. 【0015】図2は他方のアンテナ所持体Bの形成過程を示していて、所定の大きさとした基材7を用意し(イ)、この基材7にアンテナ導電部8とこのアンテナ導電部8の端部に位置して端子部分である、導電接続部3Aと類似の櫛型の形状を有する導電接続部9A(接合予定部位)とからなる導電パターン10を設け(ロ)、 [0015] Figure 2 is illustrates the formation process of the other antenna possessing body B, and providing a substrate 7 having a predetermined size (a), an antenna conductive portion 8 to the substrate 7 The antenna conductive portion 8 a terminal portion located on the edge portion, the conductive pattern 10 consisting of the conductive connection portion 3A and the conductive connection portion 9A having a similar comb-like shape (predetermined joining portions) provided in (b),
これによってアンテナ所持体Bが形成される。 This antenna possession body B is formed. 前記導電接続部9Aは上記ICチップ実装インターポーザAの導電接続部3Aと櫛形が直交して対応するように設けられている。 The conductive connection portion 9A is provided so as to correspond to the conductive connection portion 3A and the comb of the IC chip mounting the interposer A are orthogonal. 11は絶縁部である。 11 denotes an insulating portion. 【0016】そして、ICチップ実装インターポーザA [0016] Then, IC chip implementation interposer A
とアンテナ所持体Bとをそれぞれの導電接続部3A、9 And an antenna possessed body B respective conductive connecting portion 3A, 9
Aが接着剤部6Aを介して相対するように重ね合わせて、導電接続部3A、9Aを接着するとともに電気的導通を図り、ICチップ実装インターポーザAとアンテナ所持体Bとを接合することで、図3に示すRF−IDメデイアCが得られる。 A is superposed so as to face via the adhesive part 6A, the conductive connection portion 3A, achieving electrical continuity with bonding the 9A, by joining the IC chip mounting the interposer A and the antenna possession body B, RF-ID media C shown in FIG. 3 is obtained. すなわち、ICチップ実装インターポーザAとアンテナ所持体Bとの導電接続部3A、9 That, IC chip mounting the interposer A and the conductive connection portion 3A of the antenna possession body B, 9
Aが接着剤部6Aを介して相対するように重ね合わせて、押圧・加熱するなどすると、導電部12(凸部)に介在していた接着剤は流れて非導電部13(凹部)に移行する。 A is superposed so as to face via the adhesive portion 6A migration, when such pressing and heating, the adhesive which has been interposed conductive portion 12 (convex portion) flows to the non-conductive portion 13 (recess) to. その結果、導電部12(凸部)同士は接着剤を介さずに多数の接点が直接接触して良好な電気的導通が得られるとともに、多数の非導電部13(凹部)には移行してきた接着剤を含めて多量の接着剤が介在するようになるので良好な接着が得られる。 As a result, the conductive portions 12 (projecting portions) each other in contact multiple contacts directly without an adhesive good electrical conduction is obtained, has moved to the large number of non-conductive portion 13 (recess) since a large amount of adhesive including adhesive so interposed good adhesion is obtained. 【0017】上記の実施形態においては、導電接続部3 [0017] In the above embodiment, the conductive connection portion 3
A、9Aのいずれも櫛型の形状を有する導電接続部の例を示したが、格子型、網型などでもよく、両者は同じ形状を有する導電接続部でもよいが、異なる形状の導電接続部であってもよく、本発明のインターポーザAの導電接続部3Aが導電部と非導電部が混在している形状を有する導電接続部であれば、他方は本発明の形状を有する導電接続部でなく従来の形状の導電接続部であっても差し支えない。 A, although none of 9A shows an example of the conductive connection portion having a comb shape, lattice, may be a net type, etc., they may be a conductive connection portion having the same shape, but electrically conductive connection of different shapes It may also be, if conductive connection portion having a shape conductive connection portion 3A of the interposer a of the present invention is a conductive portion and the nonconductive portion are mixed, while the conductive connection portion having the shape of the present invention no problem even conductive connection portion of a conventional shape without. 【0018】ICチップ実装インターポーザとアンテナ所持体の導電接続部の相対する導電接続部を導電接続する方法は特に限定されず、例えば導電接続部同志を位置合わせしておいてから、熱圧着、プレスによる圧着などの公知の方法で行うことができ、また光、電磁波、電子線などを用いる方法やこれらの組み合わせた方法、超音波溶接具で挟みつけて超音波により導電接続する方法などいずれでもよい。 The method for conductive connection to opposing conductive connection portion of the conductive connection portion of the IC chip mounting the interposer and the antenna possession body is not particularly limited, from left to align the example conductive connection portion comrades thermocompression bonding, press can be carried out by a known method such as crimping by, also optical, electromagnetic waves, a method and a method of combining these using an electron beam, may be any such method of connecting conductive by scissors dipped ultrasonic ultrasonic welding device . 【0019】前記実施形態では接着剤部6AをICチップ実装インターポーザAの導電接続部3Aに形成した例を示したが、接着部層6Aはアンテナ所持体B側の対応する箇所(接合予定部位)に形成してもよく、あるいはICチップ実装インターポーザA側とアンテナ所持体B [0019] The Although the embodiment shows an example of forming an adhesive portion 6A to the conductive connection portion 3A of the IC chip mounting the interposer A, corresponding portions of the bonding portion layer 6A antenna possessed body B side (joint scheduled site) It may be formed on, or IC chip mounting the interposer a side and the antenna possessed body B
側の両方に形成してもよい。 It may be formed on both sides. 【0020】また、接着剤部6AはICチップ実装インターポーザA側の全面に形成してもよく、またアンテナ所持体B側の全面に形成してもよい。 Further, the adhesive portion 6A may be formed on the entire surface of the IC chip mounting the interposer A side, or may be formed on the entire surface of the antenna possessed body B side. また、接着剤部6 In addition, the adhesive part 6
Aは、線、点、格子状、櫛状などのパターン状に形成されていてもよい。 A is a line, a point, a lattice shape, or may be formed in a pattern such as a comb. 【0021】紙基材上に形成した長さ20mm×5本、 The length 20 mm × 5 present which is formed on a paper substrate,
線間距離0.6mmの導電部12の線幅を0.05mm 0.05mm line width of the line spacing 0.6mm conductive parts 12 of the
〜0.30mmまで変化させたものを、銅箔(エッチング前)とを接着剤(ケミタイトTNP0300、東芝ケミカル社製、厚さ20μm)で貼り合わせ(0.4MP Those varied from ~0.30Mm, bonding copper foil (before etching) and the adhesive (Chemitite TNP0300, Toshiba Chemical Co., thickness 20 [mu] m) (0.4MP
a、150℃、10分)、線パターンと銅箔にテスターを当てて直流電気抵抗を測定した。 a, 0.99 ° C., 10 min), was measured DC resistance against the tester to the line pattern and the copper foil. 線幅(mm)と直流電気抵抗(Ω)との関係を表1に示す。 The relationship between line width and (mm) and the direct current resistance (Omega) shown in Table 1. 【0022】 【表1】 [0022] [Table 1] 【0023】表1から導電部12の線幅は0.05mm The line width of the conductive portion 12 from Table 1 0.05mm
以上あれば直流電気抵抗(Ω)が低く、実用性があることが判る。 If more than DC resistance (Omega) is low, it can be seen that there is a practical use. 【0024】そこで導電部12の線幅を0.1mmに固定し、長さ20mm×線幅10mmに敷き詰めた導電部12の線幅を線間距離(非導電部13の幅)を0.00 [0024] Therefore the line width of the conductive portion 12 is fixed to 0.1 mm, line width distance between the lines of the conductive portion 12 which paved the length 20 mm × line width 10mm (width of the non-conducting portion 13) 0.00
5mm〜0.60mmまで変化させたものを、銅箔(エッチング前)と接着剤(ケミタイトTNP0300、東芝ケミカル社製、厚さ20μm)で貼り合わせ(0.4 Those varied from 5Mm~0.60Mm, bonding copper foil (before etching) and adhesive (Chemitite TNP0300, Toshiba Chemical Co., thickness 20 [mu] m) (0.4
MPa、200℃、10秒)、Tピールにより接着強度を測定した(ピール条件 幅10mm、速度300mm MPa, 200 ° C., 10 sec), the adhesive strength was measured by T-peel (peel condition width 10 mm, speed 300mm
/分)。 / Min). 線間距離(mm)と接着強度g/cmとの関係を表2に示す。 The relationship between lines distance (mm) and adhesive strength g / cm are shown in Table 2. 【0025】 【表2】 [0025] [Table 2] 【0026】表2から線間距離は0.05mm以上あれば接着強度が大きく、実用性があることが判る。 [0026] Table between 2 from the line distance adhesion strength is large if more than 0.05 mm, it is found that there is a practical use. 【0027】図4(イ)〜(ロ)は、本発明の他の形状の導電接続部を模式的に示す説明図である。 FIG. 4 (a) to (b) is an explanatory view of the conductive connection portion of the other shapes of the present invention is shown schematically. 図4(イ) Figure 4 (a)
は、格子型の形状を有する導電接続部を示す。 Shows a conductive connection portion having a lattice-like shape. 導電接続部14は、複数の導電部15と、導電部15の間に複数の非導電部16が混在している形状を有する。 Conductive connection portion 14 includes a plurality of conductive portions 15, the shape in which a plurality of non-conductive portion 16 between the conductive portion 15 are mixed. 図4 Figure 4
(ロ)は、他の格子型の形状を有する導電接続部を示す。 (B) shows a conductive connection portion having another lattice-like shape. 導電接続部17は、複数の導電部15と、導電部1 Conductive connection portion 17 includes a plurality of conductive portions 15, the conductive portion 1
5の間に複数の非導電部16が混在している形状を有する。 A plurality of non-conductive portion 16 during 5 has a shape that are mixed. 【0028】図5(イ)〜(ハ)は、基材のICチップの封止面に形成された多数の凸部を説明する説明図である。 FIG. 5 (a) to (c) are explanatory views for explaining the number of protrusions formed on the sealing surface of the IC chip of the substrate. 図5(イ)の例では、基材に導電インクを用いてI In the example of FIG. 5 (b), by using a conductive ink to a substrate I
Cチップ実装用導電部2と導電接続部3とが連続している一対の導電パターンを設けるとともに、導電インクを用いて基材のICチップ5の封止面に多数の凸部30が設けてあり、前記ICチップ実装用導電部2に跨るようにしてICチップ5を実装し、フェノール樹脂、ポリエステル樹脂、エポキシ樹脂などの熱硬化型絶縁ペーストなどからなる封止剤20を用いてICチップ5を封止してICチップ実装インターポーザAが形成されている。 Provided with a pair of conductive patterns and C chip mounting conductor portion 2 and the conductive connection portion 3 are continuous, a number of projections 30 on the sealing surface of the IC chip 5 of the substrate using a conductive ink are provided There, an IC chip mounted 5 and extended over the IC chip mounting conductive portion 2, a phenol resin, the IC chip 5 with a polyester resin, sealant 20 made of a thermosetting insulating paste such as an epoxy resin sealed by mounting an IC chip interposer a is formed a.
基材のICチップ5の封止面に多数の凸部30が存在するため封止剤20と基材との接触面積が大きくなり、その結果、封止剤20によるICチップ5の強力な封止が達成できる。 The contact area between the encapsulant 20 and the substrate for a number of projections 30 are present on the sealing surface of the IC chip 5 of the substrate is increased, as a result, strong sealing of the IC chip 5 by the sealant 20 stop can be achieved. 【0029】図5(ロ)の例では、基材に導電インクを用いて互いに導通している多数の凸部31から形成されるICチップ実装用導電部2と導電接続部3とが連続している一対の導電パターンを設けるとともに、導電インクを用いて基材のICチップ5の封止面に多数の凸部3 [0029] In the example of FIG. 5 (b), it is conducting a large number of the IC chip mounting conductive portion 2 and the conductive connection portion 3 formed from convex portions 31 are continuous and each other using a conductive ink to a substrate provided with a pair of conductive patterns are a large number of projections 3 on the sealing surface of the IC chip 5 of the substrate using a conductive ink
0が設けてあり、前記ICチップ実装用導電部2に跨るようにしてICチップ5を実装し、フェノール樹脂、ポリエステル樹脂、エポキシ樹脂などの熱硬化型絶縁ペーストなどからなる封止剤20を用いてICチップ5を封止してICチップ実装インターポーザAが形成されている。 0 is provided with, and mounting the IC chip 5 so as to straddle the IC chip mounting conductive part 2, using phenol resin, polyester resin, sealant 20 made of a thermosetting insulating paste such as an epoxy resin mounting an IC chip interposer a sealing the IC chip 5 is formed Te. 基材のICチップ5の封止面に多数の凸部30が存在するため封止剤20と基材および凸部30との接触面積が大きくなり、その結果、封止剤20によるICチップ5の強力な封止が達成できるとともに、封止剤20と基材および凸部31との接触面積が大きくなり前記IC The contact area between the encapsulant 20 and the substrate and the projections 30 for a number of projections 30 are present on the sealing surface of the IC chip 5 of the substrate is increased, as a result, the IC chip 5 by the sealant 20 strong seal with can be achieved, the contact area between the encapsulant 20 and the substrate and the projecting portion 31 increases the IC of
チップ実装用導電部2が強力に接着され、かつ導通が確実になり剥がれたりせず、信頼性が向上する。 Is bonded conductive portion 2 is strongly chip mounting, and conduction does not peel off in turn ensures, reliability is improved. 【0030】図5(ハ)の例では、基材に導電インクを用いて互いに導通している多数の凸部31から形成されるICチップ実装用導電部2と導電接続部3とが連続している一対の導電パターンを設けるとともに、導電インクを用いて基材のICチップ5の封止面の一部に多数の凸部30が設けてあり、前記ICチップ実装用導電部2 [0030] In the example of FIG. 5 (c), conducting a large number of the IC chip mounting conductive portion 2 and the conductive connection portion 3 formed from convex portions 31 are continuous and each other using a conductive ink to a substrate provided with a pair of conductive patterns are a number of projections 30 in a part of the sealing surface of the IC chip 5 of the substrate using a conductive ink is provided with the IC chip mounting conductive section 2
に跨るようにしてICチップ5を実装し、フェノール樹脂、ポリエステル樹脂、エポキシ樹脂などの熱硬化型絶縁ペーストなどからなる封止剤20を用いてICチップ5を封止してICチップ実装インターポーザAが形成されている。 As straddle the implement IC chip 5, a phenol resin, polyester resin, made of a thermosetting insulating paste with a sealant 20 to seal the IC chip 5 IC chip mounting such as an epoxy resin interposer A There has been formed. 基材のICチップ5の封止面の一部に多数の凸部30が存在するため封止剤20と基材および凸部3 Sealant 20 and substrate and the projections 3 for the number of protrusions 30 are present in a part of the sealing surface of the IC chip 5 of the substrate
0との接触面積が大きくなり、その結果、封止剤20によるICチップ5の強力な封止が達成できるとともに、 0 contact area with the increases. As a result, the strong seal can be achieved in the IC chip 5 by the sealant 20,
封止剤20と基材および凸部31との接触面積が大きくなり前記ICチップ実装用導電部2が強力に接着され、 Sealant 20 and the contact area between the substrate and the projecting portion 31 increases the IC chip mounting conductive portion 2 is strongly bonded,
かつ導通が確実になり剥がれたりせず、信頼性が向上する。 And conduction does not peel off or turn ensures, reliability is improved. 【0031】上記の例では、凸部30、31は細線の例を示したが、形状は細線に限定されず、丸、四角、放射状、同心円などの形状であってもよい。 [0031] In the above example, the protrusions 30 and 31 show examples of fine line, the shape is not limited to fine lines, circles, squares, radial, or may be a shape such as concentric circles. 【0032】紙基材上に銅の細線エッチングパターン(線の幅0.05〜0.5mm)を設けたもの同士を封止剤(CRP−X4322、住友ベークライト社製、厚み200μm)を用いて貼り合わせ(0.4MPa、2 The sealing agent between that provided a paper copper fine line etching pattern on the substrate (line width 0.05~0.5mm) (CRP-X4322, Sumitomo Bakelite Co., thickness 200 [mu] m) using a bonding (0.4MPa, 2
00℃、10秒)、Tピールにより接着強度を測定した(ピール条件 幅1cm、速度300mm/分)。 00 ° C., 10 sec), the adhesive strength was measured by T-peel (peel condition width 1 cm, speed 300 mm / min). 線間距離(mm)と接着強度g/cmとの関係を表3に示す。 The relationship between lines distance (mm) and adhesive strength g / cm are shown in Table 3. 【0033】 【表3】 [0033] [Table 3] 【0034】表3から線間距離は0.3mm以下が好ましいことが判る。 [0034] between from Table 3 the line distance is found to be preferable 0.3mm or less. 【0035】本発明で用いる基材1あるいは基材7の素材としては、ガラス繊維、アルミナ繊維、ポリエステル繊維、ポリアミド繊維などの無機または有機繊維からなる織布、不織布、マット、紙あるいはこれらを組み合わせたもの、あるいはこれらに樹脂ワニスを含浸させて成形した複合基材、ポリアミド系樹脂基材、ポリエステル系樹脂基材、ポリオレフィン系樹脂基材、ポリイミド系樹脂基材、エチレン・ビニルアルコール共重合体基材、 [0035] As the material of the substrate 1 or substrate 7 used in the present invention, a combination of glass fibers, alumina fibers, polyester fibers, woven fabric made of inorganic or organic fibers such as polyamide fibers, nonwovens, mats, paper or these ones, or composite base material molded by these impregnated with resin varnish, a polyamide resin substrate, polyester resin substrate, polyolefin resin substrate, polyimide resin substrate, ethylene vinyl alcohol copolymer group wood,
ポリビニルアルコール系樹脂基材、ポリ塩化ビニル系樹脂基材、ポリ塩化ビニリデン系樹脂基材、ポリスチレン系樹脂基材、ポリカーボネート系樹脂基材、アクリロニトリルブタジエンスチレン共重合系樹脂基材、ポリエーテルスルホン系樹脂基材などのプラスチック基材、あるいはこれらにコロナ放電処理、プラズマ処理、紫外線照射処理、電子線照射処理、フレームプラズマ処理およびオゾン処理などの表面処理を施したもの、などの公知のものから選択して用いることができる。 Polyvinyl alcohol resin substrate, polyvinyl chloride resin substrate, polyvinylidene chloride resin substrate, polystyrene resin substrate, polycarbonate resin substrate, acrylonitrile butadiene styrene copolymerization system resin substrate, polyether sulfone resin plastic substrate corona discharge treatment or to, such as a substrate, a plasma treatment, ultraviolet irradiation treatment, electron beam irradiation treatment, that has been subjected to surface treatment such as flame plasma treatment and ozone treatment, and selected from known ones such as it can be used Te. 【0036】ICチップ実装インターポーザとアンテナ所持体とは同じ素材からなる基材を用いて形成してもよいし、異なる基材でもよい。 [0036] It is an IC chip mounting the interposer and the antenna possession body may be formed using a substrate made of the same material or in different substrates. またICチップ実装インターポーザ、アンテナ所持体それぞれに関する形成は1個ずつでなくともよく、それぞれ複数個(しかも同種でも異種でもよい)でも構わない。 The IC chip mounting the interposer may even formation for each antenna possession body not one by one, it may each even multiple (and may be the same or different). 【0037】上記ICチップ実装インターポーザでの導電パターン4の形成、アンテナ所持体での導電パターン10の形成、凸部30、31の形成は、それぞれ公知の方法で行うことができる。 The formation of the conductive pattern 4 in the IC chip mounting the interposer, formation of the conductive pattern 10 of the antenna possession body, formation of the projections 30 and 31 can be respectively carried out by known methods. 例えば、導電ペーストをスクリーン印刷やインクジェット方式印刷により印刷して乾燥固定化する方法、被覆あるいは非被覆金属線の貼り付け、エッチング、デイスペンス、金属箔貼り付け、金属の直接蒸着、金属蒸着膜転写、導電高分子層形成などが挙げられるがこの限りでない。 For example, a method of drying immobilizing a conductive paste is printed by screen printing or ink jet method printing, paste coating, or uncoated metal wire, etching, Deisupensu, metal foil adhered directly deposited, vapor-deposited metal film transfer of metal, conductive polymer layer formation, and the like, but this shall not apply. 【0038】またアンテナ所持体において、導電パターン10は必ずしも片面に限られることはなく、裏面にも、さらに最終的にアンテナとして働く接続が保証されるならば内層に形成されてもよい。 [0038] In the antenna possessing body, the conductive pattern 10 is not necessarily be limited to one side, also the rear surface may be formed on the inner layer if the connection is guaranteed to act as more finally antenna. またそれらを多重に複合させたアンテナでもよい。 Or it may be an antenna complexed with them multiple. さらに必要に応じてジャンパー線によって他の線を跨いだパターンでもよい。 Further it may be straddling pattern other lines by jumper wires as needed. 形成したアンテナを保護するためにコーティングしてもよい。 The formed antenna may be coated to protect. 【0039】ICチップ実装インターポーザを形成するプロセスでのICチップの実装は、ワイヤーボンデイング(WB)を始めとして、異方性導電フィルム(AC The IC chip implementation in the process of forming the IC chip mounting interposer including the wire bonding (WB), anisotropic conductive film (AC
F)、導電ペースト(ACP)、絶縁樹脂(NCP)、 F), conductive paste (ACP), an insulating resin (NCP),
絶縁フィルム(NCF)、クリーム半田ボールを用いたものなど、公知の方法で接続できる。 Insulating film (NCF), such as those using the cream solder balls, it can be connected in a known manner. 必要であれば、公知のアンダーフィル材あるいはポッティング材による接続部の保護・補強を行ってもよい。 If necessary, it may be subjected to protection and reinforcement of the connection according to known underfill material or potting material. 【0040】本発明で用いる接着剤は特に限定されるものではなく、具体的には、例えば、ホットメルト接着剤、粘着剤、熱可塑性樹脂接着剤あるいは熱硬化性樹脂接着剤あるいは紫外線、電子線などにより硬化する接着剤、天然ゴム系接着剤、合成ゴム系接着剤など、あるいはこれらの組み合わせからなる接着剤などを挙げることができる。 The adhesive used in the present invention is not particularly limited, specifically, for example, hot melt adhesives, pressure-sensitive adhesive, thermoplastic resin adhesive or a thermosetting resin adhesive or ultraviolet rays, electron beams adhesive that is cured by like, natural rubber-based adhesives, synthetic rubber-based adhesive, or the like can be given an adhesive comprising a combination thereof. またこれらの接着剤に、粉体状の金、ニッケル、銀、アルミニウムといった導電性物質を配合して導電性を付与した導電性接着剤も使用できる。 Also these adhesives, powdered gold, nickel, silver, and conductive adhesive having conductivity by blending an electrically conductive material such as aluminum can be used. 粘着剤としては天然ゴムや合成ゴムに粘着付与剤(ロジンおよびロジン誘導体、ポリテルベン樹脂、テルペンフェノール樹脂、石油樹脂)、軟化剤(液状ポリブテン、鉱油、液状ポリイソブチレン、液状ポリアクリル酸エステル)、老化防止剤などの公知の添加剤を混合したゴム系、ガラス転移温度の異なる複数のアクリル酸エステルと他種官能性単量体とを共重合したアクリル系、シリコーンゴムと樹脂からなるシリコーン系、ポリエーテルやポリウレタン系粘着剤などは好ましく使用できる。 Tackifier natural rubber or synthetic rubber as a pressure-sensitive adhesive (rosin and rosin derivatives, Poriteruben resin, terpene phenol resin, petroleum resin), softeners (liquid polybutene, mineral oil, liquid polyisobutylene, liquid polyacrylates), Aging known additives were mixed rubber-based, such as inhibitors, different glass transition temperatures plurality of acrylic acid ester and other species functional monomer and copolymerized with acrylic, silicone comprising a silicone rubber and a resin, poly and ether and polyurethane based pressure-sensitive adhesive can be preferably used. これらの接着剤や粘着剤は、溶液に溶かした溶液型のほか、水系エマルジョン型、加熱溶融塗布後冷却で固化するホットメルト型、液状オリゴマーや単量体などを塗布後、加熱や紫外線、電子線などの放射線の照射により硬化するものなどがあるが、いずれも使用できる。 These adhesives or pressure-sensitive adhesive, in addition to the solvent-dissolved in solution, aqueous emulsion type, hot melt type which is solidified at a heating molten coating after cooling, after coating and liquid oligomer or monomer, heat or ultraviolet light, electron and the like shall be cured by irradiation with radiation such as lines, but both can be used. 【0041】本発明で用いる接着剤に、必要に応じて、 The adhesive used in the present invention, if necessary,
シリカ、アルミナ、ガラス、タルク、各種ゴムなどの絶縁性粉末、あるいは離型剤、表面処理剤、充填剤、顔料、染料などの公知の添加剤を添加したりすることができる。 Silica, alumina, glass, talc, insulating powder such as various rubber, release agents, surface treatment agents, fillers, pigments, or the addition of known additives such as dyes. 【0042】上記ICチップ実装インターポーザ、アンテナ所持体、ICチップ実装用などの導電接続部は、設計上製造加工し易い任意の方法でつくればよく、ICチップ実装用導電部ほどの精密さが必要ない加工許容度の高い構造でよい。 [0042] The IC chip mounting the interposer, the antenna possessing body, the conductive connection portion, such as an IC chip mounting may be make in any way easy to design a manufacturing process, it requires precision enough conductive portion for mounting an IC chip it is a high structural free machining tolerance. 【0043】上記実施形態では非接触ICタグなどの薄形の情報送受信型記録メディアなどに用いられるRF− [0043] used like a thin form of information transmission and reception type recording medium such as a non-contact IC tag in the above embodiment RF-
IDメデイアの導電接続部同士の接続について説明したが、他の導電接続部同士の接続にも適用することができ、具体的には、例えば、ペーパーコンピュータ、使い捨て電気製品などの導電接続部同士の接続などにも適用して接着剤部を介して接着するとともに電気的導通を図ることができる。 Has been described connection of the conductive connection portions of the ID media, can also be applied to other conductive connection portions of the connection, specifically, for example, paper computer, between the conductive connection portion, such as a disposable appliances it can be electrically conductive as well as adhesion by applying to such connected via an adhesive portion. 【0044】なお、上記実施形態の説明は、本発明を説明するためのものであって、特許請求の範囲に記載の発明を限定し、或は範囲を減縮するものではない。 [0044] Incidentally, the description of the above embodiments are for describing the present invention, limiting the invention defined in the claims, or not to reducing the scope. 又、本発明の各部構成は上記実施形態に限らず、特許請求の範囲に記載の技術的範囲内で種々の変形が可能である。 The structure of each part of the present invention is not limited to the above embodiments, and various modifications are possible within the technical scope described in the appended claims. 【0045】 【実施例】以下実施例によって、本発明をさらに詳細に説明するが、本発明はこれらの実施例に限定されるものではない。 [0045] EXAMPLES The following examples, the present invention will be described in more detail, the present invention is not limited to these examples. (実施例1)剥離紙(SP−8Kアオ、リンテック社製)に対して、導電インク(LS415C−K、アサヒ化学研究所製)を用いて、アンテナ部を印刷し、150 (Example 1) release paper (SP-8K Blue, manufactured by Lintec Corporation) on the conductive ink (LS415C-K, Asahi Kagaku Kenkyusho) was used to print the antenna unit, 150
℃、30分の加熱後、タック紙(コピータック、トッパン・フォームズ社製)をゴムローラを用いて貼り合わせ(2kg/cm 、40℃)、タック紙側にアンテナ部を転写して紙基材上にアンテナを作製し、図2に示すアンテナ所持体を作った。 ° C., after heating for 30 minutes, tack paper (copy tack, Toppan Forms Co.) bonding using a rubber roller (2 kg / cm 2, 40 ° C.), a paper substrate to transfer the antenna portion to tuck the paper side to produce antenna above made antenna possession body shown in FIG. 導電接続部の形状は線間距離0.3mm、線幅0.3mmの櫛形の形状を有するものとした。 The shape of the conductive connection portion is assumed to have a line spacing 0.3 mm, a comb shape having a line width of 0.3 mm. 一方、NIP(ノンインパクトプリンター)対応紙に印刷したICチップ実装用導電部(ランド部)にICを実装し(230℃、0.4MPa、2秒)、導電接続部に接着剤を塗布して、図1に示す本発明のICチップ実装インターポーザを作製した。 Meanwhile, NIP (non-impact printers) IC chip mounting conductive portion printed on the corresponding paper (land portion) to implement the IC (230 ° C., 0.4 MPa, 2 seconds), an adhesive is applied to the conductive connection portion to prepare an IC chip mounting the interposer of the present invention shown in FIG. このようにして作製したアンテナ所持体とICチップ実装インターポーザをそれぞれの導電接続部が接着剤部を介して相対するように重ね合わせて、接着するとともに電気的導通を図り、ICチップ実装インターポーザとアンテナ所持体とを接合することで、図3に示すRF−IDメデイアCを作製した。 Thus each of the conductive connection portion of the antenna possession body and IC chip mounted interposer produced is superposed so as to face via the adhesive part, achieving electrical continuity with bonding, IC chip mounting the interposer and the antenna by joining the possession thereof, to prepare a RF-ID media C shown in FIG. これをNIPに貼り合わせた状態で85℃、 85 ℃ in the state in which the combined stuck it to the NIP,
85%RHの環境に放置したが、通信状態に変化はなく、良好な状態が維持された。 Was left at 85% RH environments, no change in the communication state, good state was maintained. また、銅箔エッチング法で図1に示すICチップ実装インターポーザを作製したものを使用し図3に示すRF−IDメデイアCを作製しても、同様に良好な状態が維持された。 Also, to prepare a RF-ID media C shown in and Figure 3 using a disk produced an IC chip mounting the interposer shown in Figure 1 with a copper foil etching method, similarly good state was maintained. 【0046】(実施例2)剥離ポリアミドフィルムに対して、導電インク(N−5845−1、昭栄化学工業社製)を用いて、アンテナ部を印刷し、180℃、30分の加熱後、両面テープ(No.500、日東電工社製) [0046] For Example 2 Peeling polyamide film, a conductive ink (N-5845-1, Shoei Chemical Industries, Ltd.) was used to print the antenna unit, 180 ° C., after heating for 30 minutes, both sides tape (No.500, manufactured by Nitto Denko Corporation)
をゴムローラを用いて貼り合わせ(2kg/cm The bonding by using a rubber roller (2kg / cm 2,
40℃)、両面テープ側にアンテナ部を転写して紙基材上にアンテナを作製し、図2に示すアンテナ所持体を作った。 40 ° C.), to produce an antenna on a paper substrate to transfer the antenna unit to the double-sided tape side, made antenna possession body shown in FIG. 導電接続部の形状は線間距離0.3mm、線幅0.3mmの櫛形の形状を有するものとした。 The shape of the conductive connection portion is assumed to have a line spacing 0.3 mm, a comb shape having a line width of 0.3 mm. 一方、N On the other hand, N
IP(ノンインパクトプリンター)対応紙に印刷したI IP (non-impact printer) was printed on the corresponding paper I
Cチップ実装用導電部(ランド部)にICを実装し(2 C chip mounting conductive portion (land portion) to implement the IC (2
30℃、0.4MPa、2秒)、導電接続部に接着剤を塗布して、図1に示す本発明のICチップ実装インターポーザを作製した。 30 ° C., 0.4 MPa, 2 seconds), an adhesive is applied to the conductive connection portion, to produce an IC chip mounting the interposer of the present invention shown in FIG. このようにして作製したアンテナ所持体とICチップ実装インターポーザをそれぞれの導電接続部が接着剤部を介して相対するように重ね合わせて、接着するとともに電気的導通を図り、ICチップ実装インターポーザとアンテナ所持体とを接合することで、図3に示すRF−IDメデイアCを作製した。 Thus each of the conductive connection portion of the antenna possession body and IC chip mounted interposer produced is superposed so as to face via the adhesive part, achieving electrical continuity with bonding, IC chip mounting the interposer and the antenna by joining the possession thereof, to prepare a RF-ID media C shown in FIG. これをNIPに貼り合わせた状態で85℃、85%RHの環境に放置したが、通信状態に変化はなく、良好な状態が維持された。 85 ° C. in a state where it was laminated to the NIP, was allowed to stand in 85% RH environment, no change in the communication state, good state was maintained. 【0047】 【発明の効果】本発明の請求項1記載の導電接続部を有するインターポーザは、基材上に形成されたICチップを実装した導電接続部を有するインターポーザであって、前記導電接続部が導電部と非導電部が混在している形状を有するので、例えば、本発明のICチップ実装インターポーザAと前記アンテナ所持体Bとをそれぞれの櫛型や格子型などの凹凸形状を有する導電接続部が接着剤を介して相対するように重ね合わせて、押圧・加熱するなどすると、多数の凸部に介在していた接着剤は流れて多数の凹部に移行し、その結果、塗布する接着剤のパターンを工夫したり、塗布する接着剤の塗工量を精度よくコントロールしなくても、凸部同士は多数の接触部において接着剤を介さずに直接接触して良好な電気的導通が得ら The interposer having an electrically conductive connecting part according to the first aspect of the present invention exhibits, a interposer having an electrically conductive connecting part which is mounted an IC chip formed on a substrate, wherein the conductive connection portion since but has a shape conductive portion and the nonconductive portion are mixed, for example, conductive connection with the IC chip mounted interposer a of the present invention and the antenna possessed body B having an uneven shape such as the respective comb or lattice type parts are superposed so as to face via the adhesive, when such pressing and heating, migrate interposed the adhesive was the large number of concave portions flows into a number of protrusions, so that the adhesive applied resulting in devising a pattern, without accurately controlling the coating amount of the adhesive applied, the convex portions has a good electrical conduction in direct contact without using the adhesive in a number of the contact portion et al. れるとともに、多数の凹部には移行してきた接着剤を含めて多量の接着剤が介在するようになるので良好な接着が得られ導電接続部に外力が集中しても電気的接続が途切れないという顕著な効果を奏する。 Together with the referred uninterrupted electrically connected concentrated external force to the conductive connection portion obtained good adhesion because a large amount of the adhesive including an adhesive has moved comes to interposed the plurality of depressions a marked effect. 【0048】本発明の請求項2記載の導電接続部を有するインターポーザは、基材上に形成されたICチップを実装した導電接続部を有するインターポーザであって、 The interposer having an electrically conductive connecting part according to claim 2 of the present invention is a interposer having an electrically conductive connecting part which is mounted an IC chip formed on a substrate,
基材のICチップの封止面に多数の凸部が形成されているので、封止剤と基材との接触面積が大きくなり、その結果、封止剤によるICチップの強力な封止ができ、信頼性が向上するという顕著な効果を奏する。 Since many protrusions are formed on the sealing surface of the IC chip of the substrate, the contact area between the sealant and the substrate is increased, as a result, strong sealing of the IC chip by sealant can, a marked effect of improving the reliability. 【0049】本発明の請求項3記載の導電接続部を有するインターポーザは、基材上に形成されたICチップを実装した導電接続部を有するインターポーザであって、 The interposer having an electrically conductive connecting part according to claim 3 of the present invention is a interposer having an electrically conductive connecting part which is mounted an IC chip formed on a substrate,
前記導電接続部が導電部と非導電部が混在している形状を有するとともに、基材のICチップの封止面に多数の凸部が形成されているので、例えば、本発明のICチップ実装インターポーザAと前記アンテナ所持体Bとをそれぞれの櫛型や格子型などの凹凸形状を有する導電接続部が接着剤を介して相対するように重ね合わせて、押圧・加熱するなどすると、多数の凸部に介在していた接着剤は流れて多数の凹部に移行し、その結果、塗布する接着剤のパターンを工夫したり、塗布する接着剤の塗工量を精度よくコントロールしなくても、凸部同士は多数の接触部において接着剤を介さずに直接接触して良好な電気的導通が得られるとともに、多数の凹部には移行してきた接着剤を含めて多量の接着剤が介在するようになるので良好な接着が And has a shape that the conductive connection portion is electrically conductive portion and the nonconductive portion are mixed, since a large number of projections are formed on the sealing surface of the IC chip of the substrate, for example, IC chip implementations of the invention When conductive connection portion having an uneven shape of the interposer a and the antenna possessed body B such as the respective comb or lattice type superposed so as to face via the adhesive to such pressing and heating, a number of projections adhesives that are present parts are shifted to plurality of depressions flows, as a result, devising the pattern of adhesive applied, even without accurately controlling the coating amount of the adhesive applied, convex parts each other with good electrical conduction in direct contact without using the adhesive in a number of the contact portions are obtained, as a large amount of the adhesive to the plurality of depressions including an adhesive has moved intervening is good adhesion since られ導電接続部に外力が集中しても電気的接続が途切れず、また、封止剤と基材との接触面積が大きくなり、その結果、封止剤によるICチップの強力な封止ができ、信頼性が向上するという顕著な効果を奏する。 Are also concentrated external force to the conductive connection portion is uninterrupted electrical connection, also the contact area between the sealant and the substrate is increased, as a result, it is strong sealing of the IC chip by sealant , a marked effect of improving the reliability.

【図面の簡単な説明】 【図1】(イ)〜(ニ)は本発明の導電接続部を備えたICチップ実装インターポーザの形成過程を示す説明図である。 BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 (a) to (d) are explanatory views showing an IC chip mounted interposer forming process having the electrically conductive connection of the present invention. 【図2】(イ)〜(ロ)はアンテナ所持体の形成過程を示す説明図である。 [2] (a) to (b) are explanatory views showing a forming process of the antenna possession thereof. 【図3】RF−IDメデイアを示す説明図である。 3 is an explanatory diagram showing an RF-ID media. 【図4】本発明の他の導電接続部の形状を示す説明図である。 4 is an explanatory view showing another conductive connection portion of the shape of the present invention. 【図5】(イ)〜(ハ)は基材のICチップの封止面に形成された多数の凸部および本発明の他の導電接続部であるICチップの実装用導電部を示す説明図である。 [5] (a) to (c) show the mounting conductor portion of the other IC chips are electrically conductive connection of a number of projections and the present invention formed on the sealing surface of the IC chip of the substrate described it is a diagram. 【図6】(イ)〜(ニ)は従来の導電接続部を備えたI 6 (a) to (d) is provided with a conventional conductive connection portion I
Cチップ実装インターポーザの形成過程を示す説明図である。 It is an explanatory view showing a process of forming a C-chip mounting the interposer. 【図7】(イ)〜(ロ)は従来の導電接続部を備えたアンテナ所持体の形成過程を示す説明図である。 7 (a) to (b) are explanatory views showing a forming process of the antenna possession body provided with a conventional conductive connection portion. 【図8】従来のRF−IDメデイアを示す説明図である。 8 is an explanatory diagram showing a conventional RF-ID media. 【符号の説明】 1 基材2 ICチップ実装用導電部3、3A 導電接続部4 導電パターン5 ICチップ6、6A 接着剤部7 基材8 アンテナ導電部9、9A 導電接続部10 導電パターン11 絶縁部12、15 導電部13、16 非導電部20 封止剤30、31 凸部A ICチップ実装インターポーザB アンテナ所持体C RF−IDメデイア [Description of Reference Numerals] 1 Substrate 2 IC chip mounting conductive portions 3,3A conductive connection portion 4 conducting pattern 5 IC chip 6,6A adhesive portion 7 substrate 8 antenna conductive portion 9,9A conductive connection portion 10 conductive patterns 11 insulating portion 12, 15 conductive parts 13, 16 non-conductive portion 20 sealant 30, 31 protrusion A IC chip mounting the interposer B antennas possessed body C RF-ID media

Claims (1)

  1. 【特許請求の範囲】 【請求項1】 基材上に形成されたICチップを実装した導電接続部を有するインターポーザであって、前記導電接続部が導電部と非導電部が混在している形状を有することを特徴とする導電接続部を有するインターポーザ。 A interposer having Claims We claim: 1. A conductive connection portion mounting the IC chips formed on a substrate, the shape of the conductive connection portion is electrically conductive portion and the nonconductive portion are mixed interposer having an electrically conductive connecting part, characterized in that it comprises a. 【請求項2】 基材上に形成されたICチップを実装した導電接続部を有するインターポーザであって、基材のICチップの封止面に多数の凸部が形成されていることを特徴とするインターポーザ。 2. A interposer having an electrically conductive connecting part which is mounted an IC chip formed on a substrate, and wherein the plurality of convex portions are formed on the sealing surface of the IC chip of the base material interposer to. 【請求項3】 基材上に形成されたICチップを実装した導電接続部を有するインターポーザであって、前記導電接続部が導電部と非導電部が混在している形状を有するとともに、基材のICチップの封止面に多数の凸部が形成されていることを特徴とするインターポーザ。 3. A interposer having an electrically conductive connecting part which is mounted an IC chip formed on a substrate, which has a shape that the conductive connection portion is electrically conductive portion and the nonconductive portion are mixed, the substrate interposer, characterized in that the sealing surface of the IC chip multiple convex portions are formed.
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