CN112606585B - Device transfer printing processing method and micro microphone dustproof device transfer printing processing method - Google Patents

Device transfer printing processing method and micro microphone dustproof device transfer printing processing method Download PDF

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Publication number
CN112606585B
CN112606585B CN202011400343.9A CN202011400343A CN112606585B CN 112606585 B CN112606585 B CN 112606585B CN 202011400343 A CN202011400343 A CN 202011400343A CN 112606585 B CN112606585 B CN 112606585B
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anchor point
layer
processing method
substrate
sacrificial layer
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CN112606585A (en
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畠山庸平
林育菁
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Weifang Goertek Microelectronics Co Ltd
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Weifang Goertek Microelectronics Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • B41M3/12—Transfer pictures or the like, e.g. decalcomanias
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/025—Duplicating or marking methods; Sheet materials for use therein by transferring ink from the master sheet
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension

Abstract

The invention provides a device transfer printing processing method and a micro microphone dustproof device transfer printing processing method, wherein the device transfer printing processing method comprises the steps of forming a sacrificial layer on a substrate; arranging an anchor point layer on one side of the sacrificial layer, which is far away from the substrate, wherein the anchor point layer is fixedly connected with the substrate through an anchor point structure which protrudes and penetrates through the sacrificial layer, and the anchor point structure is arranged on at least one edge part of the anchor point layer; arranging a device on one side of the anchor point layer far away from the substrate; and fixing the device and the anchor point layer positioned on one side of the device on the transfer printing belt, and stripping the anchor point layer from the sacrificial layer and the substrate to finish the transfer printing treatment of the device. By utilizing the invention, the device on the sacrificial layer can be ensured not to be stripped under the condition that the sacrificial layer is etched, and the adherence of the device is further ensured.

Description

Device transfer printing processing method and micro microphone dustproof device transfer printing processing method
Technical Field
The invention relates to the technical field of device transfer printing processing, in particular to a device transfer printing processing method, and particularly relates to a transfer printing processing method of a dustproof device of a miniature microphone.
Background
At present, in the manufacturing process of devices with thin films, a transfer process is usually involved, and the transfer process mainly refers to a process of applying a sacrificial layer material on a substrate by dry peeling, wet peeling, or the like, and transferring the sacrificial layer material onto a belt after forming devices thereon. In the conventional transfer process, etching of the sacrificial layer cannot be performed, and for example, when a device is processed by wet etching, the sacrificial layer may be etched, and when the sacrificial layer is removed, the device may be peeled off, and the adhesiveness (including adhesion and adhesion) of the device as a transfer object may be lowered.
Specifically, when the sacrificial layer is etched, the device is stressed by the action of a shaking force in a wet etching liquid or the like, so that the possibility that the device is peeled off becomes high. Moreover, the reason why the device is peeled off is not limited to complete removal of the sacrificial layer, and if the device itself has a certain stress (for example, a stress gradient of warpage), even if the removal of the sacrificial layer is only a little erosion by side etching or the like, the device is peeled off, and there is a problem that the performance is lowered.
In the conventional solution, a physical fixing mode is usually adopted at the inner side of the device, but stress concentrated to a fixed point is generated in the transfer process, the device is cracked in serious cases, and a solution method of reducing the contact area of a fixed part can be adopted for reducing the possibility of cracking generation.
Disclosure of Invention
In view of the above problems, an object of the present invention is to provide a device transfer processing method and a micro microphone dust-proofing device transfer processing method, so as to solve the problems of the conventional transfer processing method that the device is easily peeled off and the device performance is affected.
The invention provides a device transfer printing processing method, which comprises the following steps: forming a sacrificial layer on a substrate; arranging an anchor point layer on one side of the sacrificial layer far away from the substrate, wherein the anchor point layer is fixedly connected with the substrate through an anchor point structure which protrudes and penetrates through the sacrificial layer, and the anchor point structure is arranged at least one edge part of the anchor point layer; arranging a device on one side of the anchor point layer far away from the substrate; and fixing the device and the anchor point layer positioned on one side of the device on a transfer printing belt, and stripping the anchor point layer from the sacrificial layer and the substrate to finish the transfer printing treatment of the device.
In addition, the preferred technical scheme is that the anchor point structure is arranged in the middle of four edges of the anchor point layer.
Further, it is preferable that the anchor structure has a shape having a sharp angular distribution in a cross section with respect to a peeling direction of the transfer belt.
In addition, the preferred technical scheme is that at least one edge or point of the anchor point structure is attached to the edge part of the corresponding position of the anchor point layer.
In addition, the preferred technical scheme is that at least one anchor point structure is arranged on at least one edge part of the anchor point layer.
In addition, it is preferable that the height of the anchor structure in the direction perpendicular to the substrate is not less than the thickness of the sacrificial layer.
In addition, the preferred technical scheme is that the anchor point layer, the anchor point structure and the device are of an integrated structure.
In addition, the preferred solution is to remove the anchor layer on the device after peeling the anchor layer from the sacrificial layer and the substrate.
According to another aspect of the present invention, there is provided a micro microphone dust-proofing device transfer processing method, including: forming a sacrificial layer on a substrate; forming a thin film constituting a dust-proof film on the sacrificial layer; forming a dust-proof film having a mesh pattern based on the thin film; forming a support carrier on one side of the dustproof film, wherein the support carrier comprises an anchor point structure which penetrates through the sacrificial layer and is fixedly connected with the substrate; and transferring the support carrier and the dustproof film onto a transfer printing belt, and stripping the support carrier and the dustproof film from the substrate and the sacrificial layer to finish the transfer printing treatment of the dustproof device of the miniature microphone.
In addition, the preferred technical scheme is that the anchor point structure and the support carrier are of an integrally formed structure.
By utilizing the device transfer printing processing method and the micro microphone dustproof device transfer printing processing method, the anchor point layer which partially penetrates through the sacrificial layer and is fixed with the substrate is formed on the basis of the sacrificial layer, and the device can be effectively prevented from cracking in the stripping process through the anchor point layer; in addition, the anchor point structure arranged on the side part of the anchor point layer can effectively increase the anchor point area, so that the device can bear larger shaking force (in a processing procedure), and the device can be ensured not to be peeled off even if the sacrificial layer is etched; the method for manufacturing the dustproof device of the miniature microphone can reduce the manufacturing cost and improve the product performance.
To the accomplishment of the foregoing and related ends, one or more aspects of the invention comprise the features hereinafter fully described. The following description and the annexed drawings set forth in detail certain illustrative aspects of the invention. These aspects are indicative, however, of but a few of the various ways in which the principles of the invention may be employed. Further, the present invention is intended to include all such aspects and their equivalents.
Drawings
Other objects and results of the present invention will become more apparent and more readily appreciated as the same becomes better understood by reference to the following description taken in conjunction with the accompanying drawings. In the drawings:
FIG. 1 is a flow chart of a device transfer processing method according to an embodiment of the present invention;
FIG. 2 is a state diagram during a device transfer process according to an embodiment of the present invention;
FIG. 3 is a state diagram after a device transfer process according to an embodiment of the present invention;
FIG. 4 is a top view of a device after a transfer process according to an embodiment of the present invention;
FIG. 5 is a top view of a device after a transfer process according to another embodiment of the present invention;
FIG. 6 is a flowchart of a micro microphone dust-proof device transfer processing method according to an embodiment of the present invention;
FIG. 7 is a diagram illustrating a micro microphone dust-proof device after a transfer process according to an embodiment of the present invention;
fig. 8 is a top view of the micro microphone dust-proof device after transfer processing according to the embodiment of the invention.
Wherein the reference numerals include: device 1, anchor layer 2, anchor structure 21, sacrificial layer 3, substrate 4, tape frame 5, transfer tape 6, support carrier 7, anchor structure 71, and dust-proof film 8.
The same reference numbers in all figures indicate similar or corresponding features or functions.
Detailed Description
In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of one or more embodiments. It may be evident, however, that such embodiment(s) may be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form in order to facilitate describing one or more embodiments.
In the description of the present invention, it is to be understood that the terms "center", "length", "width", "thickness", "upper", "lower", "front", "rear", "vertical", "horizontal", "inner", "outer", "axial", "radial", "circumferential", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
In order to describe the device transfer processing method and the micro microphone dust-proofing device transfer processing method of the present invention in detail, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
Fig. 1 shows a flow of a device transfer processing method according to an embodiment of the present invention.
As shown in fig. 1, a device transfer processing method of an embodiment of the present invention includes:
s110: a sacrificial layer material is laid on the substrate and a sacrificial layer is formed.
S120: the anchor point layer is arranged on one side, far away from the substrate, of the sacrificial layer, the anchor point layer is fixedly connected with the substrate through the anchor point structure protruding from the anchor point layer and penetrating through the sacrificial layer, and the anchor point structure is arranged on at least one edge portion of the anchor point layer instead of the corner portion.
Specifically, the anchor point structure is the protruding structure of setting on the anchor point layer, and anchor point structure and anchor point layer be integrated into one piece structure, sets up the anchor point structure in any one limit portion position on anchor point layer, can set up the anchor point structure in the position that the stress that the warpage of device caused is minimum, can make under the circumstances that the sacrificial layer was corroded, ensures that the device is not peeled off.
Because the separation of the anchor point structure and the sacrificial layer is gradually stripped from one direction in the stripping process of the transfer belt, the anchor point structure can be set to have a shape which is distributed in an acute angle relative to the cross section of the stripping direction of the transfer belt, and in the stripping process, the substrate is firstly separated from the acute angle part of the anchor point structure and then gradually expanded to be completely separated from the anchor point structure, so that the tearing force applied to a device in the stripping process can be reduced, and the device is prevented from cracking.
In one embodiment of the present invention, the anchor point structure may be disposed at four edge positions of the anchor point layer, or at least one arbitrary edge position, or at a middle position of each edge, etc.; in addition, anchor point structure can set up to the triangular prism structure that has at least one acute angle, and the orientation of the acute angle of triangular prism structure sets up with the relative setting of the direction of peeling off of transfer printing belt, sets up anchor point structure into the triangular prism structure and can add the anchor point area, and then improves the device and tolerates the ability of shaking power in handling process, reaches the integrality that also can ensure the device even the sacrificial layer is corroded.
S130: and arranging the device on the side of the anchor point layer far away from the substrate.
S140: and fixing the device and the anchor point layer positioned on one side of the device on a transfer printing belt, and stripping the anchor point layer from the sacrificial layer and the substrate to finish the transfer printing treatment of the device.
Specifically, the device may be a chip or a dustproof structure in various forms, and after the device is transferred to the transfer belt, the transfer belt and the substrate may be peeled off to remove the substrate and the sacrificial layer; in addition, the anchor point layer is attached to the device after being peeled off through the transfer belt, and at the moment, the anchor point layer on the device can be selectively removed or reserved according to specific production conditions and requirements, for example, when the anchor point layer and the device are in an integrally formed structure, the anchor point layer can also be selectively reserved.
In the above embodiment, since the anchor point structure on the anchor point layer needs to pass through the sacrificial layer and be fixedly connected with the substrate, it is necessary to ensure that the height of the anchor point structure in the direction perpendicular to the substrate is not less than the thickness of the sacrificial layer, so that the anchor point layer can be disposed on the upper side of the sacrificial layer away from the substrate, and the anchor point structure on the anchor point layer is fixedly connected with the substrate.
In the specific application process, the anchor point layer and the anchor point structure on the anchor point layer can be arranged into an integrated structure with the device, namely, in the process of directly forming the device on the sacrificial layer, the anchor point layer structure is formed at the same time, so that the process of independently setting the anchor point layer can be omitted, and the manufacturing process and the cost of the device are simplified.
Fig. 2 and 3 show schematic states of a device transfer processing method according to an embodiment of the present invention during processing and after transfer, respectively.
As shown in fig. 2 and fig. 3 together, before the transfer process, the anchor point layer 2 is located between the sacrificial layer 3 and the device 1, the anchor point structures are respectively arranged at the middle positions of the four side positions of the anchor point layer, and the anchor point structures 21 on the anchor point layer 2 are fixedly connected with the substrate 4 after penetrating through the sacrificial layer 3; after the transfer process, the anchor structures 21 on the anchor layer 2 are separated from the substrate 4, the device 1 together with the anchor layer 2 thereon is transferred onto the transfer belt 6, the transfer belt 6 is fixed on the corresponding belt frame 5, and the device 1 is supported and stored by the transfer belt 6.
Wherein, can also get rid of anchor point layer 2 according to the demand, but when anchor point layer 2 and device 1 structure as an organic whole, or anchor point layer 2 exist not influence the normal use and the condition of performance of device 1, also can keep this anchor point layer 2 part, optional removal anchor point layer 2 structure in the application.
Further, fig. 4 shows a plan view structure after transfer processing in the device transfer processing method according to the embodiment of the present invention.
As shown in fig. 4, in which an arrow indicates a peeling direction of transfer belt 6, anchor structures 21 having a triangular cross-section are respectively disposed at intermediate positions of four sides of anchor layer 2, and one acute angle of each anchor structure 21 is disposed opposite to the peeling direction of transfer belt 6. The anchor layer 2 and the anchor structure 21 are arranged in consideration of the peeling direction of the transfer belt 6, so that cracking during the peeling process can be effectively inhibited, and the anchor structure 21 is arranged in the middle of four sides, so that compared with the arrangement at the corner position, the difficulty of peeling the device can be improved, the device is prevented from being separated from the substrate 4 in the processing process, the manufacturing cost of the device is reduced, and the manufacturing quality is improved.
The size of the anchor point structure 21 may be adjusted according to the size of the product, and the number and shape of the anchor point structure may be variously changed.
Specifically, fig. 5 shows a structure after a device transfer process according to another embodiment of the present invention.
As shown in fig. 5, 5 anchor structures are respectively disposed at the middle position of each edge portion on the anchor point layer, and at least one edge of the anchor point structure is attached to the edge portion of the anchor point layer at the corresponding position. Wherein, the anchor point structures at the upper and lower two sides of the anchor point layer can be set as isosceles triangle structures with an acute angle in cross section, but the anchor point structures at the left and right two sides of the anchor point layer can be set as right triangle structures with an acute angle in cross section, as shown in the attached drawings.
Corresponding to the device transfer printing processing method, the invention also provides a transfer printing processing method of the miniature microphone dustproof device, and the device transfer printing processing method is applied to the manufacturing process of the miniature microphone dustproof device.
Specifically, fig. 6 shows a flow of a micro microphone dustproof device transfer processing method according to an embodiment of the present invention.
As shown in fig. 6, the transfer processing method for the dust-proof device of the miniature microphone according to the embodiment of the present invention includes:
s210: a sacrificial layer is formed on a substrate.
S220: a thin film constituting a dust-proof film is formed on the sacrifice layer.
S230: a dust-proof film having a mesh pattern is formed based on the thin film.
S240: and forming a support carrier on one side of the dustproof film, wherein the support carrier comprises an anchor point structure which penetrates through the sacrificial layer and is fixedly connected with the substrate.
S250: and transferring the support carrier and the dustproof film onto a transfer printing belt, and stripping the support carrier and the dustproof film from the substrate and the sacrificial layer to finish the transfer printing treatment of the dustproof device of the miniature microphone.
Specifically, fig. 7 and 8 show a state after a transfer process and a plan view structure of the micro microphone dust-proofing device according to the embodiment of the present invention, respectively.
As shown in fig. 7 and 8, the support carrier 7 of the micro microphone dust-proof device after transfer is fixed on the transfer belt 6 positioned by the belt frame 5, a raised anchor point structure 71 is further formed on the support carrier 7, the dust-proof film 8 is fixed on the support carrier 7, and the anchor point structure 71 is selectively retained or removed during the application of the micro microphone dust-proof device.
In other words, in the transfer process of the micro microphone dust cap device, the anchor layer may be formed by the support carrier 7, i.e. the anchor layer and the anchor structure 71 are integrally formed with the support carrier 7.
Specifically, the anchor structures 71 may be respectively provided at least one side portion of the support carrier 7, for example, at intermediate positions of four side portions of the support carrier 7 at the same time, and the anchor structures 71 may have a triangular structure having at least one acute angle in cross section in the peeling direction of the transfer belt 6.
In addition, it should be noted that, regarding the setting shapes, numbers, functions, and the like of the anchor point layers and the anchor point structures, reference may be made to the embodiments in the device transfer processing method, and details are not repeated here.
By utilizing the device transfer printing processing method and the micro microphone dustproof device transfer printing processing method, the anchor point layer which penetrates through the sacrificial layer and is fixed with the substrate is formed on the sacrificial layer, and further, the device is effectively prevented from cracking in the stripping process through the anchor point layer; in addition, the anchor point structure is arranged at the edge part of the anchor point layer, so that the tolerance capability of the device can be effectively improved, and the device can be prevented from being peeled even if the sacrificial layer is etched; the device such as the dustproof device of the miniature microphone manufactured by the method has low cost and stable and reliable performance.
The device transfer processing method and the micro microphone dust-proofing device transfer processing method according to the present invention are described above by way of example with reference to the accompanying drawings. However, it will be understood by those skilled in the art that various modifications may be made to the device transfer processing method and the micro microphone dust-proofing device transfer processing method of the present invention without departing from the scope of the present invention. Therefore, the scope of the present invention should be determined by the contents of the appended claims.

Claims (10)

1. A device transfer processing method, comprising:
forming a sacrificial layer on a substrate;
arranging an anchor point layer on one side of the sacrificial layer far away from the substrate, wherein the anchor point layer is fixedly connected with the substrate through an anchor point structure protruding and penetrating through the sacrificial layer, and the anchor point structure is arranged at least one edge part of the anchor point layer;
arranging a device on one side of the anchor point layer far away from the substrate;
and fixing the device and the anchor point layer positioned on one side of the device on a transfer printing belt, and stripping the anchor point layer from the sacrificial layer and the substrate to finish the transfer printing treatment of the device.
2. The device transfer processing method according to claim 1,
the anchor point structure is arranged in the middle of four edges of the anchor point layer.
3. The device transfer processing method according to claim 1,
the anchor structure has a shape having an acute angular distribution in cross section with respect to a peeling direction of the transfer belt.
4. The device transfer process method according to claim 1,
at least one edge or point of the anchor point structure is attached to the edge of the corresponding position of the anchor point layer.
5. The device transfer processing method according to claim 1,
and at least one anchor point structure is arranged on at least one edge part of the anchor point layer.
6. The device transfer processing method according to claim 1,
in the direction perpendicular to the substrate, the height of the anchor point structure is not less than the thickness of the sacrificial layer.
7. The device transfer processing method according to claim 1,
the anchor point layer, the anchor point structure and the device are integrally formed.
8. The device transfer processing method according to claim 1,
removing the anchor layer on the device after peeling the anchor layer from the sacrificial layer and the substrate.
9. A transfer printing processing method of a dustproof device of a miniature microphone is characterized by comprising the following steps:
forming a sacrificial layer on a substrate;
forming a thin film constituting a dust-proof film on the sacrificial layer;
forming a dust-proof film having a mesh pattern based on the thin film; forming a support carrier on one side of the dustproof film, wherein the support carrier comprises an anchor point structure which penetrates through the sacrificial layer and is fixedly connected with the substrate;
and transferring the support carrier and the dustproof film onto a transfer printing belt, and peeling the support carrier and the dustproof film from the substrate and the sacrificial layer to finish the transfer printing treatment of the miniature microphone dustproof device.
10. The micro microphone dustproof device transfer printing processing method according to claim 9, wherein the anchor point structure and the support carrier are of an integrally molded structure.
CN202011400343.9A 2020-12-02 2020-12-02 Device transfer printing processing method and micro microphone dustproof device transfer printing processing method Active CN112606585B (en)

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Publication number Priority date Publication date Assignee Title
KR101612749B1 (en) * 2006-09-06 2016-04-27 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 A two-dimensional stretchable and bendable device
TW201026513A (en) * 2009-01-08 2010-07-16 Univ Nat Cheng Kung Imprinting process of polyimide
KR101423921B1 (en) * 2011-12-19 2014-07-28 광주과학기술원 Method for fabricating transfer printing substrate using concavo-convex structure, transfer printing substrate fabricated thereby and application thereof
CN108470720B (en) * 2018-03-23 2020-07-28 广东省半导体产业技术研究院 Method for stripping substrate by wet etching
EP3550603B1 (en) * 2018-04-03 2020-11-18 IMEC vzw A method for coupling a semiconductor component to a target substrate by transfer printing

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