JP2010283195A - Ic package - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To facilitate identification between connecting pins in an IC package. <P>SOLUTION: The connecting pin of the IC package includes a first and a second connecting pins differed in shape, and the ratio of the number of the first connecting pins to the number of the second connecting pins is about 1:n (n is an integer of 2 or more). <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an IC package, and more particularly to a pin structure of an IC package.

  In recent years, the number of external connection terminals (lead pins) of an IC package has been steadily increasing due to the progress of high integration and multi-functionality of devices. Along with the miniaturization of the IC package, the arrangement interval of the lead pins tends to be narrowed. For this reason, it is difficult to identify the lead pin to be connected to the external terminal when mounting the solder on the printed circuit board.

  Also, in visual inspection after solder mounting, it is difficult to identify which lead pin corresponds to a poorly connected lead pin. Furthermore, when performing a debug test, it is difficult to visually identify a test terminal to which an oscilloscope or a lock analyzer probe is connected, so that the signal cannot be easily monitored.

  In Patent Document 1, for the purpose of facilitating identification between lead pins, an IC package having a specific lead pin formed by changing the color of the other lead pin or having a special identification number or the like It is shown. Patent Document 1 shows an example of changing the color of a lead pin by applying solder plating to a normal lead pin, and applying gold plating to a lead pin for a power supply terminal, for example, among the entire lead pins.

Japanese Patent Laying-Open No. 2008-177452 (FIG. 5)

  In the IC package described in the above publication, a specific lead pin is easily identified by visually identifying the specific lead pin. However, in automatic identification using a camera or the like instead of visual identification, an error may occur in the identification due to a difference in color or an identification number due to irradiation with a surrounding light source or due to dirt on a lead pin. If there is an error in identification, it will hinder inspections, so accurate identification is essential.

  In view of the above, an object of the present invention is to provide an IC package in which identification errors are unlikely to occur when identifying connection pins.

  The present invention is an IC package having connection pins, wherein the connection pins include first and second connection pins having different shapes, and the number of first connection pins and the number of second connection pins. The IC package is characterized in that the ratio is about 1: n (n is an integer of 2 or more).

  In the IC package of the present invention, the shape of the first connection pin and the second connection pin is different, so that the connection pins can be easily distinguished from each other when automatically identifying the connection pins arranged in the IC package. Become.

1 is a top view of an IC package according to a first embodiment of the present invention. (A) And (b) is AA sectional drawing and BB sectional drawing of the IC package of FIG. 1, respectively. The top view of the IC package of the modification of 1st Embodiment. Sectional drawing of the modification of the lead pin in 1st Embodiment. The top view of the IC package which concerns on the 2nd Embodiment of this invention. (A) And (b) is AA sectional drawing and BB sectional drawing of the IC package of FIG. 5, respectively. The top view of the IC package of the modification of 2nd Embodiment.

  Embodiments of the present invention will be described below with reference to the drawings. Throughout the drawings, similar elements are denoted by the same reference numerals. FIG. 1 is a top view of an IC package according to the first embodiment of the present invention. The IC package 10 includes a semiconductor integrated circuit inside, a mold case (package main body) 11 that forms the outer shape of the device, and extends from a connection terminal of the semiconductor integrated circuit provided inside the mold case 11, and is soldered to a substrate terminal. It has the lead pin 12 and the lead pin 13 which become an attaching part. The lead pin 13 is an identification lead pin (connection pin), and the lead pin 12 is a normal lead pin (connection pin).

  In the example of FIG. 1, the lead pins 13 are arranged at a rate of one out of every four lead pins. This configuration facilitates identification of the pin number of each lead pin. The lead pin 12 constitutes a second lead pin in the present invention, and the lead pin 13 constitutes a first lead pin in the present invention. The first lead pin and the second lead pin have different shapes. Specifically, the length is different. In addition to the shape difference, the color may be different.

  2A and 2B are an AA sectional view and a BB sectional view of the IC package of FIG. 1, respectively. The normal lead pin 12 shows that the portion extending from the main body of the mold case 11 is longer than the identification lead pin 13. The length of the portion connected to the substrate terminal is the same between the lead pin 12 and the lead pin 13. Specifically, the total length D of the normal lead pin 12 protruding from the mold case is D = a, and the total length D of the identification lead pin 13 protruding from the mold case 11 is D = b, where a> b.

  The present embodiment is an example in which a gull wing type lead pin is attached to a QFP type mold case 11, and the protruding length of an identification lead pin 13 is shorter than that of a normal lead pin 12. Thus, by providing the identification lead pin 13 having a different distance from the case end of the mold case 11 to the tip of the pin, the visibility of the pin position and the pin state is improved.

  In particular, for a device comprising an IC package soldered and mounted on a printed circuit board, the identification lead pins 13 are provided at a ratio of one to several normal lead pins 12, thereby facilitating the identification of the lead pins. For this reason, it is easy to specify the position of the measurement target pin when measuring electrical characteristics using a measuring instrument such as an oscilloscope or a logic analyzer. Note that the identification pin 13 may be only a lead pin used for a specific application. In this case, the contact with the measuring instrument probe is particularly facilitated. In the present embodiment, an example of a> b is shown, but b> a may also be used.

  FIG. 3 shows a modified IC package in which the configuration of the IC package of the first embodiment is applied to an SOP type mold case. Also in this modification, the length of the identification lead pin 13 is changed from the length of the normal lead pin 12 to facilitate the identification.

  In the first embodiment, the identification lead pins 13 are arranged with respect to the normal lead pins 12 at a ratio of 1: n (n is an integer of 2 or more). Depending on the total number of lead pins, it may not be an integer ratio. By adopting this configuration, for example, it is possible to easily determine which lead pin is a lead pin with poor solder attachment, and visual solder inspection is facilitated. In addition, the lead pin to be brought into contact with the probe can be easily identified. In this case, the visibility of the target pin in manufacturing inspection and debug evaluation is improved even in an IC package having a large number of lead pins.

  FIG. 4 is a modification of the shape of the lead pins in the IC package of the first embodiment. In the example of FIG. 4, a gull-wing type lead pin is adopted as the normal lead pin 12, and a flat type lead pin is adopted as the identification lead pin 14. In the present embodiment, the flat lead pin 14 differs from the normal lead pin 12 not only in the distance from the case end of the mold case 11 to the pin tip, but also in the pin shape itself. For this reason, each pin front-end | tip part is further visually emphasized, and visibility is further improved.

  FIG. 5 is a top view of an IC package according to the second embodiment of the present invention. The IC package of this embodiment is different from the IC package of FIG. 1 in that the power supply pins constituting the identification pins are leadless pins. In the present embodiment, a normal gull-wing type lead pin 12 is used as a signal lead pin, and a leadless pin 15 is used as a power supply pin. The leadless pin 15 of the present embodiment is a flat electrode attached to the side surface of the mold package 11, and the protruding length from the mold case 11 is extremely small.

  The leadless pins for power supply not only have different protrusion lengths from other lead pins, but also their shapes are greatly different, so that the visibility is further improved when they are distinguished from each other. In contrast to this example, the power supply pin may be a gull-wing lead pin, and the normal pin may be a leadless pin. Alternatively, instead of an example in which the power supply leadless pin is used as the identification pin, the grounding pin may be used as the identification leadless pin. Alternatively, both the power supply pin and the ground pin may be used as identification leadless pins. 6 shows an AA cross-sectional view and a BB cross-sectional view of the IC package of the second embodiment in the same manner as FIG.

  FIG. 7 shows an IC package according to a modification of the second embodiment. In this modification, the pin structure in the second embodiment is applied to an IC package of an SOP type mold case. In this case, the same advantages as those of the IC package of FIG. 5 can be obtained.

  The minimum configuration of the present invention will be described below. An IC package having a minimum configuration according to the present invention is an IC package having connecting lead pins, wherein the lead pins include first and second lead pins having different shapes, and the first lead pin and the second lead pin. The ratio is about 1: n (n is an integer of 2 or more).

  In the IC package of the present invention, the shapes of the first connection pin and the second connection pin are different, so that it is easy to distinguish between pins arranged side by side in the IC package. For this reason, for example, by disposing the connection pins for identification at a specific cycle, it becomes easy to identify the entire connection pins.

  As a specific example having a different shape, there is an example in which the first connection pin and the second connection pin have different lengths. In addition to the shape, the color may be different. In addition, a special shape can be adopted for the connection pin for identification, for example, a special shape for the tip portion. As an example of the arrangement of the first and second connection pins, one of the first connection pins is periodically inserted every n second connection pins that are continuous. Alternatively, a connection pin for a specific application may be used as the first connection pin. In this case, there is an example in which the first connection pin is configured as a power supply connection pin and / or a ground connection pin.

  Although the invention has been particularly shown and described with reference to illustrative embodiments, the invention is not limited to these embodiments and variations thereof. It will be apparent to those skilled in the art that various modifications can be made to the present invention without departing from the spirit and scope of the invention as defined in the appended claims.

10: IC package 11: Molded case 12: Ordinary lead pin 13: Identification lead pin 14: Flat lead pin 15: Leadless pin

Claims (5)

An IC package having connection pins,
The connection pins include first and second connection pins having different shapes, and a ratio of the number of the first connection pins to the number of the second connection pins is about 1: n (n is 2 or more) An IC package characterized by the following:   The IC package according to claim 1, wherein the first connection pin and the second connection pin have different projecting lengths from the package body.   3. The IC package according to claim 1, wherein one of the first connection pins is periodically inserted every n second connection pins in succession. 4.   The IC package according to claim 1, wherein the first connection pin includes at least one of a power supply pin and a ground pin.   The IC package according to claim 1, wherein the first connection pin is a leadless pin or a flat lead pin.

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