JP2010280925A - Surface treatment device and surface treatment system, method for surface treatment and band-shaped thin body treated thereby - Google Patents

Surface treatment device and surface treatment system, method for surface treatment and band-shaped thin body treated thereby Download PDF

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JP2010280925A
JP2010280925A JP2007259182A JP2007259182A JP2010280925A JP 2010280925 A JP2010280925 A JP 2010280925A JP 2007259182 A JP2007259182 A JP 2007259182A JP 2007259182 A JP2007259182 A JP 2007259182A JP 2010280925 A JP2010280925 A JP 2010280925A
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surface treatment
treatment liquid
strip
processed
thin body
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Izumi Ito
泉 伊藤
Hirofumi Asada
博文 浅田
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Panasonic Corp
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Panasonic Corp
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Priority to JP2007259182A priority Critical patent/JP2010280925A/en
Priority to TW97136867A priority patent/TW200916612A/en
Priority to PCT/JP2008/002715 priority patent/WO2009044530A1/en
Publication of JP2010280925A publication Critical patent/JP2010280925A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1619Apparatus for electroless plating
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/06Wires; Strips; Foils
    • C25D7/0614Strips or foils

Abstract

<P>PROBLEM TO BE SOLVED: To provide a surface treatment device and a surface treatment system, capable of performing high-quality surface treatment on a prescribed surface to be treated, a method for surface treatment, and a band-shaped thin body treated thereby. <P>SOLUTION: The surface treatment device 10 performs a surface treatment by flowing down a surface treatment liquid X along the surface to be treated of a band-shaped thin body S. The surface treatment device 10 includes: a wall part 12b disposed in proximate to the band-shaped thin body S through a prescribed narrow gap d provided therebetween; and a supply part 13 for supplying the surface treatment liquid X flowing down in the gap d. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、例えば、めっき処理や下地処理等を含む表面処理を行う表面処理装置および表面処理システム、表面処理方法、これによって処理された帯状薄体に関する。   The present invention relates to a surface treatment apparatus, a surface treatment system, a surface treatment method, and a strip-like thin body treated by this, for example, performing a surface treatment including a plating treatment and a base treatment.

近年、実装基板等として使用される薄膜基体の表面に対して、めっき処理等の表面処理を行う表面処理装置が用いられている。
このような表面処理装置として、例えば、特許文献1に開示された堅固な側壁に囲まれた処理液水槽中から流下してくる表面処理液に対して略鉛直方向に沿って被処理物を搬送しながら処理を行う垂直処理法や、略水平方向に沿って被処理物を搬送しながら処理を行う水平処理法等が採用されている。
また、特許文献2には、このような表面処理装置に用いられる表面処理液として、金属錯体を活用した処理液について開示されている。
特開昭61−127895号公報(昭和61年6月16日公開) 国際公開第2007/066460号パンフレット(2007年6月14日国際公開)
In recent years, surface treatment apparatuses that perform surface treatment such as plating on the surface of a thin film substrate used as a mounting substrate or the like have been used.
As such a surface treatment apparatus, for example, the object to be treated is conveyed along a substantially vertical direction with respect to the surface treatment liquid flowing down from the treatment liquid water tank surrounded by the solid side wall disclosed in Patent Document 1. A vertical processing method in which processing is performed while a horizontal processing method in which processing is performed while conveying an object to be processed along a substantially horizontal direction is employed.
Patent Document 2 discloses a treatment liquid using a metal complex as a surface treatment liquid used in such a surface treatment apparatus.
JP 61-127895 A (released on June 16, 1986) International Publication No. 2007/066460 pamphlet (International publication on June 14, 2007)

しかしながら、上記従来の表面処理方法では、以下に示すような問題点を有している。
すなわち、上記公報に開示された片面めっき方法では、めっき液が貯留された水槽の側壁部分に複数のスリットを設け、スリットから流下してくるめっき液を、被処理面が略鉛直方向に沿った状態で長手方向に搬送される帯状体に対して供給している。そして、スリットが形成された側壁と帯状体との間に流下通路を形成して、帯状体に対してめっき処理を行っている。
しかし、このようなめっき処理では、垂直処理の採用によって水平処理法の欠点である処理の不均一性は改良されるものの、側壁と帯状体との間に形成される流下通路内において処理液を確実に保持することができるとは言い難い。よって、例えば、裏面側等の被処理面以外の面への処理液の漏れ出し等が生じ易く、所定の被処理面に対してのみ高品質な表面処理を行うことは困難である。
However, the conventional surface treatment method has the following problems.
That is, in the single-sided plating method disclosed in the above publication, a plurality of slits are provided in the side wall portion of the water tank in which the plating solution is stored, and the plating solution flowing down from the slits has a surface to be processed substantially along the vertical direction. It supplies with respect to the strip | belt-shaped body conveyed in a longitudinal direction in the state. Then, a flow-down passage is formed between the side wall where the slit is formed and the belt-like body, and the plating treatment is performed on the belt-like body.
However, in such a plating process, the non-uniformity of the process, which is a disadvantage of the horizontal process method, is improved by adopting the vertical process, but the process liquid is applied in the flow-down passage formed between the side wall and the strip. It is hard to say that it can be held securely. Therefore, for example, leakage of the processing liquid to a surface other than the surface to be processed such as the back surface easily occurs, and it is difficult to perform high-quality surface processing only on a predetermined surface to be processed.

本発明の課題は、所定の被処理面に対して高品質な表面処理を実施することが可能な表面処理装置および表面処理システム、表面処理方法、これによって処理された帯状薄体を提供することにある。   An object of the present invention is to provide a surface treatment apparatus, a surface treatment system, a surface treatment method, and a strip-like thin body treated by this, capable of performing high-quality surface treatment on a predetermined surface to be treated. It is in.

第1の発明に係る表面処理装置は、被処理物の被処理面に沿って表面処理液を流下させて表面処理を行う表面処理装置であって、供給部と、第1壁部と、を備えている。供給部は、表面処理液を供給する。第1壁部は、被処理面との間に所定の微小隙間を設けた状態で近接配置されており、被処理面とその対向面との間において、供給部から供給された表面処理液を流下させて表面処理を行う。
ここでは、被処理物における特定の被処理面に対して、所定の隙間を介して近接するように第1壁部を設けている。そして、供給部から供給される表面処理液を、第1壁部と被処理面との間の隙間において流下させて表面処理を行う。
ここで、第1壁部は、例えば、被処理面に対して表面処理を行う面積に応じた大きさを有する板状の部材であって、表面処理液の特性等に応じて表面張力が働く範囲で設定された微小隙間(例えば、0.5〜10.0mm)を介して被処理面に近接配置されている。なお、近接配置される第1壁部と被処理面との間の隙間については、表面処理液の流量や性状に応じて表面張力が作用する範囲内で適宜調整されればよい。
A surface treatment apparatus according to a first aspect of the present invention is a surface treatment apparatus that performs surface treatment by flowing down a surface treatment liquid along a surface to be treated of an object to be treated, and includes a supply unit and a first wall unit. I have. The supply unit supplies the surface treatment liquid. The first wall portion is disposed close to the surface to be processed with a predetermined minute gap between them, and the surface treatment liquid supplied from the supply unit is placed between the surface to be processed and the opposite surface. The surface is treated by flowing down.
Here, the 1st wall part is provided so that it may adjoin via the predetermined clearance gap with respect to the specific to-be-processed surface in a to-be-processed object. Then, the surface treatment is performed by causing the surface treatment liquid supplied from the supply unit to flow down in the gap between the first wall and the surface to be processed.
Here, the first wall portion is, for example, a plate-like member having a size corresponding to the area for performing the surface treatment on the surface to be treated, and the surface tension works according to the characteristics of the surface treatment liquid. It is arranged close to the surface to be processed through a minute gap (for example, 0.5 to 10.0 mm) set in a range. In addition, the gap between the first wall portion and the surface to be processed that are disposed close to each other may be appropriately adjusted within the range in which the surface tension acts according to the flow rate and properties of the surface treatment liquid.

これにより、被処理面と第1壁部との間に流下される表面処理液を、表面張力によって効率よく面方向に広げることができる。この結果、被処理面と第1壁部とが所定の隙間を介して対向する部分内において流下していくように、表面処理液を保持することができる。よって、被処理物における被処理面以外の部分へ表面処理液が移動することを抑制して、被処理面において均一で高品質な表面処理を実施することができる。また、表面張力によって上記隙間内に表面処理液を薄く広げた状態で保持することができるため、第1壁部に沿った下流側の部分において表面処理液が分流してしまうことを防止することができる。この結果、被処理面と第1壁部との対向面間において流下する表面処理液の流れを面方向において均一にして、高品質な表面処理を実施することができる。   Thereby, the surface treatment liquid flowing down between the surface to be treated and the first wall can be efficiently spread in the surface direction by the surface tension. As a result, the surface treatment liquid can be held so that the surface to be treated and the first wall portion flow down in a portion facing each other with a predetermined gap. Accordingly, it is possible to suppress the surface treatment liquid from moving to a portion other than the surface to be processed in the object to be processed, and to perform a uniform and high quality surface treatment on the surface to be processed. Moreover, since the surface treatment liquid can be held in a state of being thinly spread in the gap due to surface tension, it is possible to prevent the surface treatment liquid from being diverted in the downstream portion along the first wall portion. Can do. As a result, a high-quality surface treatment can be performed by making the flow of the surface treatment liquid flowing down between the opposed surfaces of the surface to be treated and the first wall portion uniform in the surface direction.

第2の発明に係る表面処理装置は、第1の発明に係る表面処理装置であって、長尺の被処理物を、長手方向に沿って所定の方向へ連続搬送する搬送機構を、さらに備えている。
ここでは、被処理物が、例えば、長尺のシート部材の場合において、この長尺の被処理物を長手方向に連続搬送しながら、第1壁部との対向面において表面処理を行う。
ここで、搬送機構には、搬送方向の上下流側に上記第1壁部を挟み込むようにそれぞれ配置された一対の搬送ローラ等が含まれる。
これにより、長尺の被処理物を連続搬送しながら、連続的に高品質な表面処理を実施することができる。また、被処理面と第1壁部との対向面間において表面張力によって表面処理液を保持することができるため、表面処理を行う箇所の上流側および下流側に配置された搬送ローラを締め付けて表面処理液の液切りを行う必要がない。よって、搬送ローラ等の締め付けによって被処理物の表面を傷付ける等の不具合の発生を防止して、最終製品の品質劣化や製品歩留りの低下を回避することができる。
A surface treatment apparatus according to a second invention is the surface treatment apparatus according to the first invention, further comprising a conveyance mechanism for continuously conveying a long object to be processed in a predetermined direction along the longitudinal direction. ing.
Here, when the object to be processed is, for example, a long sheet member, surface treatment is performed on the surface facing the first wall portion while continuously conveying the long object to be processed in the longitudinal direction.
Here, the transport mechanism includes a pair of transport rollers and the like arranged so as to sandwich the first wall portion on the upstream and downstream sides in the transport direction.
Thereby, a high quality surface treatment can be continuously carried out while continuously conveying a long object to be treated. Further, since the surface treatment liquid can be held by the surface tension between the opposed surfaces of the surface to be treated and the first wall portion, the conveyance rollers disposed on the upstream side and the downstream side of the portion where the surface treatment is performed are tightened. It is not necessary to drain the surface treatment liquid. Therefore, it is possible to prevent the occurrence of defects such as scratching the surface of the object to be processed by tightening the transport roller or the like, and to avoid the quality degradation of the final product and the decrease in product yield.

第3の発明に係る表面処理装置は、第1または第2の発明に係る表面処理装置であって、第1壁部および被処理物の上方に配置されており、供給部から供給される表面処理液を一旦貯留しながら所定量の表面処理液を流下させる貯留部を、さらに備えている。
ここでは、表面処理が行われる被処理物と第1壁部との対向面同士の間に、上方から表面処理液を安定的に供給するために、第1壁部の上方に貯留部を設けている。
ここで、貯留部には、表面処理液を貯留するための水槽のようなものが含まれる。
これにより、供給部から供給される表面処理液を一旦貯留部に貯えた上で、被処理面と第1壁部の対向面との間に安定して流下させることができる。この結果、供給部からの表面処理液の供給量がばらついた場合でも、貯留部から安定して被処理面と第1壁部の対向面との間に表面処理液を流下させることで、高品質な表面処理を実施することができる。
A surface treatment apparatus according to a third aspect of the present invention is the surface treatment apparatus according to the first or second aspect of the present invention, which is disposed above the first wall and the object to be processed and is supplied from the supply unit A storage unit is further provided that allows a predetermined amount of the surface treatment liquid to flow down while temporarily storing the treatment liquid.
Here, in order to stably supply the surface treatment liquid from above between the opposed surfaces of the object to be treated and the first wall, a reservoir is provided above the first wall. ing.
Here, the storage unit includes a water tank for storing the surface treatment liquid.
Thereby, after surface treatment liquid supplied from a supply part is once stored in a storage part, it can be made to flow stably between a to-be-processed surface and the opposed surface of the 1st wall part. As a result, even when the supply amount of the surface treatment liquid from the supply unit varies, the surface treatment liquid can flow stably between the surface to be treated and the opposing surface of the first wall portion from the storage unit. Quality surface treatment can be performed.

第4の発明に係る表面処理装置は、第1から第3の発明のいずれか1つに係る表面処理装置であって、被処理物における第1壁部との対向面とは反対側の面に近接配置された裏当て部を、さらに備えている。
ここでは、被処理物の裏面(第1壁部との対向面とは反対側の面)側に対して、例えば、板状の裏当て部を近接配置している。
これにより、被処理物がシート状の薄体である場合において、被処理面と第1壁部との対向面間に形成される微小隙間において流下する表面処理液の供給量等のばらつきによって薄体が不安定になった場合でも、薄体の裏面側を裏当て部によって支持することができる。この結果、第1壁部に対する被処理物の相対位置を安定化させて、さらに高品質な表面処理を実施することができる。
A surface treatment apparatus according to a fourth aspect of the present invention is the surface treatment apparatus according to any one of the first to third aspects of the present invention, wherein the surface of the object to be processed is opposite to the surface facing the first wall portion. And a backing portion disposed in the vicinity.
Here, for example, a plate-like backing portion is disposed close to the back surface (surface opposite to the surface facing the first wall portion) of the object to be processed.
As a result, when the object to be processed is a sheet-like thin body, the surface treatment liquid is thinned due to variations in the amount of surface treatment liquid flowing down in a minute gap formed between the opposed surfaces of the surface to be processed and the first wall portion. Even when the body becomes unstable, the back side of the thin body can be supported by the backing portion. As a result, it is possible to stabilize the relative position of the object to be processed with respect to the first wall portion and to perform a higher quality surface treatment.

第5の発明に係る表面処理装置は、第1から第4の発明のいずれか1つに係る表面処理装置であって、第1壁部は、表面処理液が流下する方向に沿って、被処理面と対向する面から突出する整流部を有している。
ここでは、表面張力によって被処理面との間において表面処理液を保持する第1壁部の面に、表面処理液の流下方向に沿って突出した整流部を設けている。
これにより、第1壁部と被処理面との間の隙間において流下する表面処理液が、狭い帯状になって流下することを防止することができる。よって、表面処理液の流れ落ちる際の流れを整えて被処理面全体へ均一に表面処理液を広げることができる。
A surface treatment apparatus according to a fifth aspect is the surface treatment apparatus according to any one of the first to fourth aspects, wherein the first wall portion is covered along the direction in which the surface treatment liquid flows down. It has a rectification | straightening part which protrudes from the surface facing a process surface.
Here, the rectification | straightening part which protruded along the flow-down direction of surface treatment liquid is provided in the surface of the 1st wall part which hold | maintains surface treatment liquid between surface treatment surfaces with surface tension.
Thereby, it can prevent that the surface treatment liquid which flows down in the clearance gap between a 1st wall part and a to-be-processed surface flows into a narrow strip | belt shape. Therefore, the surface treatment liquid can be spread uniformly over the entire surface to be processed by adjusting the flow of the surface treatment liquid.

第6の発明に係る表面処理装置は、第1から第5の発明のいずれか1つに係る表面処理装置であって、第1壁部は、表面処理液が流下する方向に略垂直な方向における両端部付近に、流下する方向に沿って被処理面と対向する面から突出する両端突部を有している。
ここでは、表面処理液の流下する方向に沿って、第1壁部における被処理面に対向する面から突出するように両側に形成された両端突部を設けている。
これにより、被処理面に対して上方から流下する表面処理液が、左右の端部から漏れ出すことを防止することができる。
A surface treatment apparatus according to a sixth invention is the surface treatment apparatus according to any one of the first to fifth inventions, wherein the first wall portion is a direction substantially perpendicular to the direction in which the surface treatment liquid flows down. In the vicinity of both end portions, a both-end protruding portion that protrudes from a surface that faces the surface to be processed along the flow-down direction.
Here, both end protrusions formed on both sides so as to protrude from the surface of the first wall portion facing the surface to be processed are provided along the direction in which the surface treatment liquid flows down.
Thereby, it can prevent that the surface treatment liquid which flows down from the upper side with respect to a to-be-processed surface leaks out from a right-and-left end part.

第7の発明に係る表面処理装置は、第1から第6の発明のいずれか1つに係る表面処理装置であって、被処理面と第1壁部の対向面との間の間隔を調整する調整機構をさらに備えている。
ここでは、被処理面と第1壁部との間の隙間の大きさを調整可能としている。
ここで、調整機構には、被処理物側を移動させる機構や、第1壁部側を移動させる機構、あるいは被処理物および第1壁部の双方を移動させる機構が含まれる。
これにより、例えば、上記隙間へ供給される表面処理液の流量や特性等に応じて、表面張力が働く範囲内において隙間の大きさを調整することで、できるだけ少量の表面処理液を用いて効率よく表面処理を実施することができる。
A surface treatment apparatus according to a seventh aspect of the present invention is the surface treatment apparatus according to any one of the first to sixth aspects, wherein the distance between the surface to be processed and the facing surface of the first wall portion is adjusted. And an adjusting mechanism that further includes the adjusting mechanism.
Here, the size of the gap between the surface to be processed and the first wall portion can be adjusted.
Here, the adjustment mechanism includes a mechanism that moves the workpiece, a mechanism that moves the first wall, or a mechanism that moves both the workpiece and the first wall.
Thus, for example, by adjusting the size of the gap within the range in which the surface tension works according to the flow rate or characteristics of the surface treatment liquid supplied to the gap, the efficiency can be increased using as little surface treatment liquid as possible. Surface treatment can be performed well.

第8の発明に係る表面処理装置は、第1から第7の発明のいずれか1つに係る表面処理装置であって、被処理面は、被処理物における第1壁部に対向配置された表面とその裏面とを含んでいる。そして、裏面側の被処理面に対して近接配置された第2壁部を、さらに備えている。
ここでは、例えば、シート状の被処理物における表裏の両面に対して、表と裏の両面に対して近接配置した第1壁部、第2壁部との間の隙間において表面処理液を流下させて両面に表面処理を行う。
これにより、表裏両面において、それぞれ表面処理液の漏れ出し等がない高品質な表面処理を実施することができる。
第9の発明に係る表面処理システムは、第1から第8の発明のいずれか1つに係る表面処理装置を、長尺の被処理物の搬送方向に沿って複数配置して構成されている。
ここでは、長尺の被処理物の搬送方向に沿って、上述した表面処理装置を複数配置している。
これにより、下地処理やめっき処理等のような種類の異なる複数の表面処理を、複数の表面処理装置によって連続的に実施することができる。
A surface treatment apparatus according to an eighth aspect of the present invention is the surface treatment apparatus according to any one of the first to seventh aspects, wherein the surface to be processed is disposed opposite to the first wall portion of the object to be processed. It includes a front surface and its back surface. And it has further provided the 2nd wall part arrange | positioned in proximity with respect to the to-be-processed surface of the back side.
Here, for example, the surface treatment liquid flows down in the gap between the first wall portion and the second wall portion that are arranged close to both the front and back surfaces of the front and back surfaces of the sheet-like workpiece. And surface treatment on both sides.
As a result, high-quality surface treatment can be performed on both the front and back surfaces without any leakage of the surface treatment liquid.
A surface treatment system according to a ninth aspect is configured by arranging a plurality of the surface treatment apparatuses according to any one of the first to eighth aspects along a conveying direction of a long workpiece. .
Here, a plurality of the above-described surface treatment apparatuses are arranged along the conveying direction of the long workpiece.
As a result, a plurality of different types of surface treatments such as base treatment and plating treatment can be continuously performed by a plurality of surface treatment apparatuses.

第10の発明に係る表面処理方法は、長手方向に走行する長尺の帯状薄体の広幅面を略縦方向に保ち、該帯状薄体の片面ないしは両面を表面処理する方法において、帯状薄体を浮き壁として利用して対峙する側壁の間に表面処理液を流下させる浮き壁方式の表面処理方法である。
これにより、側壁と帯状薄体との対向面間を流下していく表面処理液の表面張力によって、上記対向面において表面処理液を均一に広げることができ、かつ双方の対向面における流動抵抗によって流下速度を一定に保つことができる。そして、側壁と帯状薄体との対向面間に形成される流下経路においては、下流になるほど分流が生じて流れが乱れ易いが、本方法ではそのような不安定要因を浮き壁の効果によって抑えることができる。
第11の発明に係る帯状薄体は、第10の発明に係る表面処理方法によって処理されている。
これにより、上述した表面処理方法によって処理されているため、被処理面以外の部分へ表面処理液が移動することを抑制して、被処理面において均一で高品質な表面処理が実施された帯状薄体を得ることができる。
According to a tenth aspect of the present invention, there is provided a surface treatment method in which a wide surface of a long strip-shaped thin body traveling in a longitudinal direction is maintained in a substantially vertical direction, and one or both surfaces of the strip-shaped thin body are surface-treated. This is a floating wall type surface treatment method in which a surface treatment liquid is caused to flow down between the opposing side walls by using as a floating wall.
As a result, the surface treatment liquid that flows down between the opposing surfaces of the side wall and the strip-shaped thin body can uniformly spread the surface treatment liquid on the opposing surface, and the flow resistance on both opposing surfaces. The flow rate can be kept constant. And in the flow path formed between the opposing surfaces of the side wall and the strip-shaped thin body, the flow is likely to be disturbed as the flow is further downstream, but in this method, such an unstable factor is suppressed by the effect of the floating wall. be able to.
The strip-shaped thin body according to the eleventh invention is treated by the surface treatment method according to the tenth invention.
Thereby, since it is processed by the above-mentioned surface treatment method, it is suppressed that the surface treatment liquid moves to a portion other than the surface to be treated, and a strip shape in which a uniform and high quality surface treatment is performed on the surface to be treated. A thin body can be obtained.

本発明に係る表面処理装置によれば、処理物における被処理面以外の部分へ表面処理液が移動することを抑制して、被処理面において均一で高品質な表面処理を実施することができる。   According to the surface treatment apparatus of the present invention, the surface treatment liquid can be prevented from moving to a portion other than the surface to be treated in the treatment object, and uniform and high quality surface treatment can be performed on the surface to be treated. .

本発明の一実施形態に係る表面処理装置10について、図1〜図4を用いて説明すれば以下の通りである。
[表面処理装置10全体の構成]
本実施形態に係る表面処理装置10は、図1および図2に示すように、略鉛直方向に沿って配置された帯状薄体(被処理物)Sの表面に、所定の表面処理液Xを流下させて表面処理を行う装置である。そして、表面処理装置10は、筐体部11と、処理部12と、供給部13と、搬送ローラ対15,16と、裏当て部17と、を備えている。なお、表面処理の種類としては、例えば、表面洗浄、表面改質、洗浄、触媒付与、活性化、ニッケルめっきや銅めっき等が挙げられ、多くの表面処理に対応できる。
ここで、被処理物としての帯状薄体Sは、幅50cm、38μm厚を有する長尺のポリイミドのフィルムである。帯状薄体Sは、後述する搬送機構(搬送ローラ対15,16)によって送り速度0.3m/分で所定の方向に搬送されながら表面処理が施される。
The surface treatment apparatus 10 according to an embodiment of the present invention will be described below with reference to FIGS.
[Configuration of entire surface treatment apparatus 10]
As shown in FIGS. 1 and 2, the surface treatment apparatus 10 according to the present embodiment applies a predetermined surface treatment liquid X to the surface of a strip-shaped thin body (object to be treated) S arranged along a substantially vertical direction. It is an apparatus that performs surface treatment by flowing down. The surface treatment apparatus 10 includes a casing unit 11, a processing unit 12, a supply unit 13, conveyance roller pairs 15 and 16, and a backing unit 17. Examples of the surface treatment include surface cleaning, surface modification, cleaning, catalyst application, activation, nickel plating, copper plating, and the like, and can handle many surface treatments.
Here, the strip-shaped thin body S as an object to be processed is a long polyimide film having a width of 50 cm and a thickness of 38 μm. The strip-shaped thin body S is subjected to surface treatment while being conveyed in a predetermined direction at a feeding speed of 0.3 m / min by a conveyance mechanism (conveyance roller pair 15 and 16) described later.

表面処理液Xとしては、帯状薄体Sに対して施される表面処理の種類に応じて、例えば、洗浄用の蒸留水や脱脂液、無電解ニッケル液等の各種表面処理液を用いることができる。また、表面処理液Xは、室温または加温された状態で、図示しない循環ポンプによって筐体部11の下部から再び供給部13へと戻りながら表面処理装置10内を循環する。
筐体部11は、図1に示すように、表面処理装置10の外郭を構成する部材であって、内部に、処理部12や供給部13等を包含している。また、筐体部11は、処理部12を経て流下してきた表面処理液Xを下部において貯留し、図示しないポンプ等を用いて供給部13へと戻している。
処理部12は、図1に示すように、筐体部11の内部に配置されており、略水平方向(帯状薄体Sの長手方向)に沿って搬送される帯状薄体Sの被処理面に対して、供給部13から供給される表面処理液Xを用いて所定の表面処理を行う。なお、処理部12の構成については、後段にて詳述する。
As the surface treatment liquid X, for example, various surface treatment liquids such as distilled water for washing, a degreasing liquid, and an electroless nickel liquid may be used depending on the type of surface treatment applied to the thin strip S. it can. In addition, the surface treatment liquid X circulates in the surface treatment apparatus 10 while returning to the supply unit 13 from the lower portion of the housing unit 11 by a circulation pump (not shown) in a room temperature or heated state.
As shown in FIG. 1, the housing unit 11 is a member that constitutes the outline of the surface treatment apparatus 10, and includes a processing unit 12, a supply unit 13, and the like inside. Moreover, the housing | casing part 11 stores the surface treatment liquid X which flowed down through the process part 12 in the lower part, and has returned to the supply part 13 using the pump etc. which are not shown in figure.
As illustrated in FIG. 1, the processing unit 12 is disposed inside the housing unit 11, and the processing target surface of the strip-shaped thin body S that is transported along a substantially horizontal direction (longitudinal direction of the strip-shaped thin body S). On the other hand, a predetermined surface treatment is performed using the surface treatment liquid X supplied from the supply unit 13. The configuration of the processing unit 12 will be described in detail later.

供給部13は、図1に示すように、処理部12の上方に配置された円柱状のパイプであって、帯状薄体Sの搬送方向に沿って形成された複数の孔部13aから処理部12の貯留部12aに対して表面処理液Xを供給する。
搬送ローラ対15,16は、図2に示すように、帯状薄体Sの搬送方向において処理部12を挟み込むように配置された一対の搬送ローラ15a,15bおよび搬送ローラ16a,16bによって構成されている。そして、搬送ローラ対15,16は、長尺の帯状薄体Sを長手方向に沿って連続的に搬送する。また、搬送ローラ対15,16は、搬送する帯状薄体Sと後述する壁部12bとの間に、0.5〜10.0mmの微小隙間d(図4参照)が形成されるように、筐体部11内において移動する。これにより、上記隙間dの大きさを適宜調整することができる。
As shown in FIG. 1, the supply unit 13 is a cylindrical pipe disposed above the processing unit 12, and the processing unit includes a plurality of holes 13 a formed along the conveying direction of the strip-shaped thin body S. The surface treatment liquid X is supplied to the 12 reservoirs 12a.
As shown in FIG. 2, the pair of conveyance rollers 15 and 16 includes a pair of conveyance rollers 15 a and 15 b and conveyance rollers 16 a and 16 b arranged so as to sandwich the processing unit 12 in the conveyance direction of the thin strip S. Yes. And the conveyance roller pairs 15 and 16 convey the elongate strip | belt-shaped thin body S continuously along a longitudinal direction. Further, the transport roller pairs 15 and 16 are formed so that a minute gap d (see FIG. 4) of 0.5 to 10.0 mm is formed between the belt-like thin body S to be transported and a wall portion 12b described later. It moves in the housing part 11. Thereby, the magnitude | size of the said clearance gap d can be adjusted suitably.

裏当て部17は、図2に示すように、搬送ローラ15b,16bに対して取り付けられた38μm厚のポリイミドシートであって、搬送される帯状薄体Sにおける被処理面とは反対側(裏面側)に対して近接配置されている。これにより、裏当て部17によって帯状薄体Sを裏面側から支持することで、処理部12における表面処理を安定して実施することができる。また、裏当て部17は、搬送ローラ15b,16bの回転によって、帯状薄体Sの搬送速度と同じ速度で同じ方向に搬送回転される。これにより、裏当て部17との接触による帯状薄体Sの表面の傷等を防止することができる。
(処理部12)
処理部12は、上述したように、帯状薄体Sに対して表面処理を行う部位であって、図1および図2に示すように、貯留部12aと、壁部(第1壁部)12bと、堰部12cと、支持部12dと、を備えている。
As shown in FIG. 2, the backing portion 17 is a 38 μm-thick polyimide sheet attached to the transport rollers 15b and 16b, and is opposite to the surface to be processed in the strip-shaped thin body S to be transported (back surface). Side). Thereby, the surface treatment in the process part 12 can be stably implemented by supporting the strip | belt-shaped thin body S from the back surface side by the backing part 17. FIG. Further, the backing portion 17 is transported and rotated in the same direction at the same speed as the transport speed of the belt-like thin body S by the rotation of the transport rollers 15b and 16b. Thereby, the damage | wound etc. of the surface of the strip | belt-shaped thin body S by the contact with the backing part 17 can be prevented.
(Processing unit 12)
As described above, the processing unit 12 is a part that performs a surface treatment on the strip-shaped thin body S, and as illustrated in FIGS. 1 and 2, the storage unit 12 a and the wall (first wall) 12 b. And a weir portion 12c and a support portion 12d.

貯留部12aは、処理部12の上部に配置された水槽状の部分であって、供給部13から供給された表面処理液Xを一時的に貯留している。そして、貯留部12aは、堰部12cを越えた所定量の表面処理液Xだけを、帯状薄体Sとこれに対向する壁部12bとの間の隙間d(図4参照)に供給する。これにより、供給部13からの供給量のばらつきの影響を抑え、上記隙間dに対して安定して表面処理液Xを供給して表面処理を安定化することができる。
壁部12bは、図2および図3に示すように、略鉛直方向に立てた状態で略水平方向に搬送される帯状薄体Sの被処理面に対してほぼ平行になるように、略鉛直方向に沿って配置されている。また、壁部12bは、貯留部12aにおける表面処理液Xの流出側の下方に配置されており、貯留部12aから堰部12cを越えて供給される表面処理液Xがこの壁部12bの表面に沿って流下する。さらに、壁部12bは、図4に示すように、搬送される帯状薄体Sとの間に微小な隙間dを設けるように、帯状薄体Sの被処理面に対して近接配置されている。この隙間dに流入した表面処理液Xには、表面張力が働き、帯状薄体Sと壁部12bとの対向面同士の間の隙間dの両端部には、図4に示すように、内側へ引き込まれるように凹んだ界面X1が形成される。これにより、隙間dの両端部から表面処理液Xが漏れ出してしまうことを効果的に防止しつつ、この隙間d内において均一な表面処理を実施することができる。なお、隙間dの大きさは、表面処理液Xの粘度や性状等の条件に応じて適宜調整することが可能であるが、例えば、0.5〜10.0mmの範囲内で設定されていればよい。
The storage unit 12 a is a water tank-like portion disposed on the upper part of the processing unit 12, and temporarily stores the surface treatment liquid X supplied from the supply unit 13. And the storage part 12a supplies only the predetermined amount of surface treatment liquid X beyond the dam part 12c to the clearance gap d (refer FIG. 4) between the strip | belt-shaped thin body S and the wall part 12b facing this. Thereby, the influence of the variation in the supply amount from the supply unit 13 can be suppressed, and the surface treatment liquid X can be stably supplied to the gap d to stabilize the surface treatment.
As shown in FIGS. 2 and 3, the wall portion 12b is substantially vertical so as to be substantially parallel to the surface to be processed of the strip-shaped thin body S that is conveyed in a substantially horizontal direction in a state of being substantially vertically oriented. Arranged along the direction. The wall portion 12b is disposed below the outflow side of the surface treatment liquid X in the storage portion 12a, and the surface treatment liquid X supplied from the storage portion 12a over the dam portion 12c is the surface of the wall portion 12b. It flows down along. Furthermore, as shown in FIG. 4, the wall portion 12 b is disposed close to the processing surface of the strip-shaped thin body S so as to provide a minute gap d between the strip-shaped thin body S being conveyed. . The surface treatment liquid X that has flowed into the gap d is subjected to surface tension, and at both ends of the gap d between the opposing surfaces of the strip-like thin body S and the wall portion 12b, as shown in FIG. An interface X1 that is recessed so as to be drawn into the surface is formed. Thereby, the surface treatment liquid X can be effectively prevented from leaking out from both ends of the gap d, and a uniform surface treatment can be performed in the gap d. In addition, although the magnitude | size of the clearance gap d can be suitably adjusted according to conditions, such as a viscosity and the property of the surface treatment liquid X, For example, it may be set within the range of 0.5-10.0 mm. That's fine.

また、壁部12bの高さは、ほぼ帯状薄体Sの幅に対応しており、その幅は表面処理条件や帯状薄体Sの走行速度に応じて設定される。壁部12bと帯状薄体Sの被処理面との間の隙間dでは、表面処理液Xが親液性の表面や帯状薄体Sを一様に濡らす表面処理液の性状や流量等によって整流され、壁部12bに対して帯状薄体Sが一定の間隔になるように保持される。なお、この壁部12bに対する帯状薄体Sの隙間dの大きさは、表面処理液Xの流量や性状に依存して変化するが、一般的に、0.3〜1.0mmの範囲が操作し易い範囲である。
堰部12cは、貯留部12a内に設けられており、貯留部12aの底面から上方へ突出する部材であって、貯留部12aから上記隙間dに対して供給される表面処理液Xの量を安定化させるために設けられている。
Further, the height of the wall portion 12b substantially corresponds to the width of the strip-shaped thin body S, and the width is set according to the surface treatment conditions and the traveling speed of the strip-shaped thin body S. In the gap d between the wall portion 12b and the surface to be treated of the strip-shaped thin body S, the surface treatment liquid X is rectified by the lyophilic surface and the properties and flow rate of the surface treatment liquid that uniformly wets the strip-shaped thin body S. Then, the belt-like thin body S is held at a constant interval with respect to the wall portion 12b. In addition, although the magnitude | size of the clearance gap d of the strip | belt-shaped thin body S with respect to this wall part 12b changes depending on the flow volume and property of the surface treatment liquid X, generally the range of 0.3-1.0 mm is operation. This is an easy range.
The dam portion 12c is provided in the storage portion 12a and protrudes upward from the bottom surface of the storage portion 12a, and the amount of the surface treatment liquid X supplied from the storage portion 12a to the gap d is determined. It is provided for stabilization.

支持部12dは、壁部12bに対して略垂直に交差するように接続されており、筐体部11と連結するように、壁部12bを支持している。
<表面処理装置10による表面処理>
ここでは、搬送される帯状薄体Sを壁部12bの対向壁として利用する、いわゆる浮き壁方式を採用した表面処理装置10における表面処理について説明する。
まず、表面処理液Xは、供給部13から貯留部12aに対して供給される。そして、表面処理液Xは、貯留部12aから堰部12cを越えて、帯状薄体Sと壁部12bとの対向面同士の間の隙間dに流入し、下方へと流下していく。
このとき、表面処理液Xは、表面張力によって、壁部12bの全面に薄く広がって対向する帯状薄体Sの被処理面を程良く濡らすように流下している。なお、仮に、壁部12bにおける下方領域において表面処理液Xの流れが分離する等、不安定になった場合には、表面処理液Xの循環量をわずかに増やすことで簡単に解消できる。
The support part 12 d is connected so as to intersect the wall part 12 b substantially perpendicularly, and supports the wall part 12 b so as to be coupled to the housing part 11.
<Surface treatment by the surface treatment apparatus 10>
Here, the surface treatment in the surface treatment apparatus 10 adopting a so-called floating wall system in which the belt-like thin body S to be conveyed is used as the opposing wall of the wall portion 12b will be described.
First, the surface treatment liquid X is supplied from the supply unit 13 to the storage unit 12a. Then, the surface treatment liquid X flows from the storage portion 12a over the dam portion 12c into the gap d between the opposing surfaces of the strip-shaped thin body S and the wall portion 12b and then flows downward.
At this time, the surface treatment liquid X flows down so as to moderately wet the surface to be treated of the strip-shaped thin body S spreading thinly across the entire surface of the wall portion 12b due to surface tension. If the surface treatment liquid X becomes unstable in the lower region of the wall portion 12b, for example, it becomes unstable by slightly increasing the circulation amount of the surface treatment liquid X.

本実施形態では、表面処理液Xを安定して流下させる状況下において、一定速度で帯状薄体Sを搬送し、被処理面を表面処理液Xと接触させながら表面処理を行う。帯状薄体Sの搬送速度としては、表面処理条件によって異なるが、0.1〜3.0m/分が無理のない範囲である。長尺の帯状薄体Sは、ロール状態から解かれ、一連の表面処理が施された後、最終的には再び巻き取られる。この間、搬送ローラ15a,15b等で案内されながら搬送されるが、表面処理液Xの漏れを防止するために、表面処理によって活性化した被処理面に接触する部品は一切ないように構成されている。
また、これらの一連の部品は、筐体部11内にコンパクトに収められているため、筐体部11内におけるクリーン度を高く保持し、外部汚染を防いでいる。
本実施形態では、以上のように、帯状薄体Sの被処理面とこれに近接配置された壁部12bとの間の隙間に、表面張力が働く状態で表面処理液Xを供給し、流下させている。
In the present embodiment, the surface treatment liquid X is transported at a constant speed and the surface treatment is performed while the surface to be treated is brought into contact with the surface treatment liquid X under a situation where the surface treatment liquid X flows down stably. Although it changes with surface treatment conditions as a conveyance speed of the strip | belt-shaped thin body S, 0.1-3.0 m / min is a reasonable range. The long strip-shaped thin body S is unwound from the roll state, and after a series of surface treatments, is finally wound up again. During this time, it is conveyed while being guided by the conveying rollers 15a, 15b, etc., but in order to prevent the surface treatment liquid X from leaking, it is configured so that there are no parts that contact the surface to be treated activated by the surface treatment. Yes.
Moreover, since these series of components are housed in the housing unit 11 in a compact manner, the cleanliness in the housing unit 11 is kept high and external contamination is prevented.
In the present embodiment, as described above, the surface treatment liquid X is supplied to the gap between the surface to be treated of the strip-shaped thin body S and the wall portion 12b disposed in proximity to the surface treatment liquid X in a state where the surface tension is applied. I am letting.

これにより、表面張力によって、被処理面と帯状薄体Sとの間の微小な隙間dに表面処理液Xを均一に広げることができる。よって、帯状薄体Sの被処理面に対して、所定の表面処理を均一に実施することができる。
また、表面張力によって、上記隙間d内において表面処理液Xを保持することができるため、被処理面以外への表面処理液Xの漏れ出しを防止して、高品質な表面処理を行うことができる。
なお、帯状薄体Sの厚みが、例えば、12.5μmという極めて薄い場合には、表面処理液Xの供給量等によって帯状薄体Sが変形して流れが不安定になる等の問題が生じるおそれがある。この場合には、図1および図2に示すように、帯状薄体Sの裏面側に裏当て部17を近接して設けることで、安定した表面処理を行うことができる。また、裏当て部17は、帯状薄体Sと同じ速度で同じ方向に搬送されているため、帯状薄体Sと裏当て部17間における接触により帯状薄体Sの表面に傷等が形成されることを防止することができる。
Thereby, the surface treatment liquid X can be uniformly spread in the minute gap d between the surface to be treated and the strip-shaped thin body S by the surface tension. Therefore, a predetermined surface treatment can be performed uniformly on the surface to be processed of the strip-shaped thin body S.
Further, since the surface treatment liquid X can be held in the gap d by the surface tension, it is possible to prevent the surface treatment liquid X from leaking to a surface other than the surface to be treated and perform a high quality surface treatment. it can.
In addition, when the thickness of the strip-shaped thin body S is extremely thin, for example, 12.5 μm, there arises a problem that the strip-shaped thin body S is deformed due to the supply amount of the surface treatment liquid X and the flow becomes unstable. There is a fear. In this case, as shown in FIG. 1 and FIG. 2, a stable surface treatment can be performed by providing the backing portion 17 close to the back surface side of the strip-shaped thin body S. Further, since the backing portion 17 is conveyed in the same direction at the same speed as the strip-shaped thin body S, scratches or the like are formed on the surface of the strip-shaped thin body S due to contact between the strip-shaped thin body S and the backing portion 17. Can be prevented.

[本表面処理装置10の特徴]
(1)
本実施形態の表面処理装置10は、帯状薄体Sにおける被処理面に沿って表面処理液Xを流下させて表面処理を行う装置であって、図1等に示すように、帯状薄体Sに対して所定の微小な隙間dを介して近接配置された壁部12bと、この隙間d内において流下する表面処理液Xを供給する供給部13と、を備えている。
これにより、微小な隙間dにおいて流下する表面処理液Xには、隙間d内において表面張力を働かせることができる。よって、隙間dにおいて流下する表面処理液Xを、被処理面において容易に均一に広げることができる。そして、表面張力によって、上記隙間d内において表面処理液Xを保持することができる。この結果、帯状薄体Sと壁部12bとの間において、均一に広がった状態で保持された表面処理液Xによって、被処理面以外への表面処理液の漏れ出しを防止して高品質な表面処理を実施することができる。
[Characteristics of the surface treatment apparatus 10]
(1)
The surface treatment apparatus 10 of the present embodiment is an apparatus that performs surface treatment by flowing down the surface treatment liquid X along the surface to be treated in the strip-shaped thin body S. As shown in FIG. , A wall portion 12b that is disposed in close proximity via a predetermined minute gap d, and a supply portion 13 that supplies the surface treatment liquid X flowing down in the gap d.
As a result, surface tension can be applied to the surface treatment liquid X flowing down in the minute gap d within the gap d. Therefore, the surface treatment liquid X flowing down in the gap d can be easily and uniformly spread on the surface to be treated. The surface treatment liquid X can be held in the gap d by surface tension. As a result, the surface treatment liquid X held in a uniformly spread state between the strip-shaped thin body S and the wall portion 12b prevents the surface treatment liquid from leaking to the surface other than the surface to be treated and has high quality. A surface treatment can be performed.

(2)
本実施形態の表面処理装置10では、図2に示すように、2組の搬送ローラ対15,16を用いて、シート状の帯状薄体Sを所定の方向へ搬送しながら、上記隙間dにおいて表面処理を実施している。
これにより、長尺の帯状薄体Sを連続搬送しながら表面処理を実施することで、被処理物を1個ずつセットして処理を行うバッチ式の構成と比較して、長尺の被処理物に対する処理効率を格段に向上させることができる。
(3)
本実施形態の表面処理装置10では、図1等に示すように、壁部12bの上部に、表面処理が行われる隙間dに対して表面処理液Xを供給する貯留部12aを設けている。
(2)
In the surface treatment apparatus 10 of the present embodiment, as shown in FIG. 2, the sheet-like strip-shaped thin body S is conveyed in a predetermined direction by using two pairs of conveyance rollers 15 and 16, and the gap d Surface treatment is performed.
Thereby, by carrying out surface treatment while continuously transporting the long strip-shaped thin body S, it is longer than the batch type configuration in which processing is performed by setting the objects to be processed one by one. The processing efficiency with respect to a thing can be improved significantly.
(3)
In the surface treatment apparatus 10 of the present embodiment, as shown in FIG. 1 and the like, a reservoir 12a that supplies the surface treatment liquid X to the gap d where the surface treatment is performed is provided above the wall 12b.

これにより、供給部13から供給される表面処理液Xを安定して隙間dに対して供給することができるため、隙間dにおける表面処理を安定して実施することができる。
(4)
本実施形態の表面処理装置10では、図1および図4に示すように、帯状薄体Sにおける被処理面とは反対側の面に対して、裏当て部17を近接配置している。
これにより、帯状薄体Sが非常に薄い場合でも、帯状薄体Sを裏面側から支持することで、表面処理液Xの流動の影響等を受けて帯状薄体Sが膨らんで表面処理液Xの流れが不安定になることを防止することができる。この結果、帯状薄体Sを常に安定して搬送しながら、高品質な表面処理を行うことができる。
(5)
本実施形態の表面処理装置10では、図2に示すように、帯状薄体Sを搬送しながら支持する搬送ローラ対15,16を、壁部12bの面に対して近接離間させる機構を有している。
Thereby, since the surface treatment liquid X supplied from the supply part 13 can be stably supplied with respect to the clearance gap d, the surface treatment in the clearance gap d can be implemented stably.
(4)
In the surface treatment apparatus 10 of the present embodiment, as shown in FIGS. 1 and 4, the backing portion 17 is disposed close to the surface of the strip-shaped thin body S opposite to the surface to be treated.
Thereby, even when the belt-like thin body S is very thin, the belt-like thin body S is swollen due to the influence of the flow of the surface treatment liquid X by supporting the belt-like thin body S from the back side, and the surface treatment liquid X Can be prevented from becoming unstable. As a result, high-quality surface treatment can be performed while always transporting the strip-shaped thin body S stably.
(5)
As shown in FIG. 2, the surface treatment apparatus 10 of the present embodiment has a mechanism for moving the transport roller pairs 15 and 16 that support the belt-like thin body S while transporting the strip-shaped thin body S close to and away from the surface of the wall portion 12 b. ing.

これにより、壁部12bに対する帯状薄体Sの相対位置を、表面処理液Xの性状等に応じて適切に調整することができる。この結果、壁部12bと帯状薄体Sとの対向面同士の間の隙間dにおいて、適切に表面張力を働かせて、表面処理液Xを均一に広げつつ保持しながら表面処理を行うことができる。
(6)
本実施形態の表面処理装置10では、図1に示すように、壁部12bに対向して近接配置された帯状薄体Sを、浮き壁のように利用して、その間の隙間dにおいて表面処理を行う。
これにより、隙間dにおいて、表面張力が働いた状態で表面処理液Xを均一に広げつつ、隙間d内において保持することができる。この結果、帯状薄体Sと壁部12bとの間において、均一に広がった状態で保持された表面処理液Xによって、被処理面以外への表面処理液Xの漏れ出しを防止して高品質な表面処理を実施することができる。
Thereby, the relative position of the strip-shaped thin body S with respect to the wall part 12b can be adjusted appropriately according to the property etc. of the surface treatment liquid X. As a result, in the gap d between the opposing surfaces of the wall portion 12b and the strip-shaped thin body S, the surface treatment can be performed while appropriately spreading the surface treatment liquid X while holding the surface treatment liquid X by appropriately applying the surface tension. .
(6)
In the surface treatment apparatus 10 of the present embodiment, as shown in FIG. 1, the strip-like thin body S disposed close to the wall 12 b is used like a floating wall, and the surface treatment is performed in the gap d therebetween. I do.
Thereby, in the gap d, the surface treatment liquid X can be held in the gap d while being uniformly spread while the surface tension is applied. As a result, the surface treatment liquid X held in a uniformly spread state between the strip-shaped thin body S and the wall portion 12b prevents the surface treatment liquid X from leaking to other than the surface to be treated, resulting in high quality. Surface treatment can be performed.

(7)
本実施形態の帯状薄体Sは、図1等に示すように、上述した表面処理装置10によって表面処理が施されている。
これにより、所望の被処理面に対して均一で高品質な表面処理された被処理物を得ることができる。
(7)
As shown in FIG. 1 and the like, the strip-shaped thin body S of the present embodiment is subjected to a surface treatment by the surface treatment apparatus 10 described above.
Thereby, it is possible to obtain a surface-treated object that is uniform and high-quality on a desired surface to be processed.

本発明に係る一実施例として、上述した表面処理装置10を複数配置して構成される表面処理システム100について、図10を用いて説明すれば以下の通りである。
本実施例の表面処理システム100は、図10に示すように、長尺の帯状薄体Sを長手方向に連続搬送しながら、直列配置された複数の表面処理装置10a〜10gにおいて、それぞれ異なる表面処理を連続的に行うシステムである。なお、複数の表面処理装置10a〜10gは、ほぼ同様の構成を備えているものとし、処理内容(処理液)の種類が異なっている。また、長尺の帯状薄体Sの搬送については、各表面処理装置10a〜10gに含まれる図示しない搬送機構によって行われるものとする。
なお、各表面処理装置10a〜10gにおいては、例えば、壁部と帯状薄体Sとの対向面同士の間の隙間に、厚さが約0.4mmになるように表面処理液Xを保持して連続的に表面処理を行った。各表面処理装置10a〜10gに含まれる壁部の長手方向の長さは、20〜70cmに設定されている。
As one embodiment according to the present invention, a surface treatment system 100 configured by arranging a plurality of the above-described surface treatment apparatuses 10 will be described below with reference to FIG.
As shown in FIG. 10, the surface treatment system 100 according to the present embodiment has different surfaces in a plurality of surface treatment apparatuses 10 a to 10 g arranged in series while continuously conveying a long thin strip S in the longitudinal direction. It is a system that performs processing continuously. In addition, the several surface treatment apparatus 10a-10g shall be provided with the substantially the same structure, and the kind of process content (process liquid) differs. Moreover, about the conveyance of the elongate strip | belt-shaped thin body S, it shall be performed by the conveyance mechanism which is not shown in each surface treatment apparatus 10a-10g.
In each of the surface treatment apparatuses 10a to 10g, for example, the surface treatment liquid X is held in the gap between the opposing surfaces of the wall portion and the strip-shaped thin body S so that the thickness is about 0.4 mm. The surface treatment was performed continuously. The length of the longitudinal direction of the wall part contained in each surface treatment apparatus 10a-10g is set to 20-70 cm.

表面処理装置10aでは、帯状薄体Sの表面の脱脂処理(表面処理)を行った。なお、脱脂液(表面処理液)としては、標準的なモノエタトルアミン44%、ポリオキシエチレンアルキルエーテル1.7%に若干のキレート剤を含む水溶液を用いた。
表面処理装置10bは、表面処理装置10aの直下流側に配置されており、蒸留水での洗浄を経て表面の浄化処理を行った。
表面処理装置10cは、表面処理装置10bの直下流側に配置されており、KOH3mol/L程度の濃度の表面処理液によって、帯状薄体Sのポリイミド表面のアルカリ加水分解処理を行った。
表面処理装置10dは、表面処理装置10cの直下流側に配置されており、帯状薄体Sの活性表面へのパラジウム付与処理を行った。なお、表面処理液としては、WO2007/066460(特願2005−351998号)に開示されているようにパラジウム錯体を用いて、帯状薄体Sのポリイミド表面にパラジウム付与を行った。
In the surface treatment apparatus 10a, the degreasing treatment (surface treatment) of the surface of the strip-shaped thin body S was performed. As the degreasing solution (surface treatment solution), an aqueous solution containing 44% of standard mono-ethanolamine and 1.7% of polyoxyethylene alkyl ether and some chelating agents was used.
The surface treatment apparatus 10b is disposed immediately downstream of the surface treatment apparatus 10a, and has been subjected to surface purification treatment after washing with distilled water.
The surface treatment apparatus 10c is disposed immediately downstream of the surface treatment apparatus 10b, and an alkali hydrolysis treatment of the polyimide surface of the strip-shaped thin body S is performed with a surface treatment liquid having a concentration of about 3 mol / L KOH.
The surface treatment apparatus 10d is disposed immediately downstream of the surface treatment apparatus 10c, and performs a process for imparting palladium to the active surface of the thin strip S. As the surface treatment liquid, palladium was applied to the polyimide surface of the strip-shaped thin body S using a palladium complex as disclosed in WO2007 / 066460 (Japanese Patent Application No. 2005-351998).

この時点で、一連の表面処理が施されたポリイミド膜を、50m毎に幅20cmに切り取り、ESCAにてパラジウムの分布状況を測定した。その結果、パラジウムの濃度分布は、絶対濃度は低いものの長さ方向、幅方向ともに処理の偏りは認められず、全体として±7%以内であった。
なお、KOHで表面処理を施した後に、無電解めっきでパラジウムを被着する従来からの方法で作製した膜表面での濃度分布では、平均の絶対濃度はかなり高く、その分布は±15%以内と大きかった。
表面処理装置10eは、表面処理装置10dの直下流側に配置されており、硫酸ニッケル、塩化ニッケル、次亜燐酸塩等からなる一般市販の無電解ニッケル液を用いて表面処理を行った。
At this time, the polyimide film subjected to a series of surface treatments was cut into a width of 20 cm every 50 m, and the distribution state of palladium was measured by ESCA. As a result, the concentration distribution of palladium was within ± 7% as a whole, although the absolute concentration was low, but no treatment bias was observed in the length direction and the width direction.
The concentration distribution on the surface of the film prepared by the conventional method of depositing palladium by electroless plating after surface treatment with KOH is quite high, and the distribution is within ± 15%. It was big.
The surface treatment apparatus 10e is disposed immediately downstream of the surface treatment apparatus 10d, and surface treatment is performed using a general commercially available electroless nickel solution made of nickel sulfate, nickel chloride, hypophosphite, or the like.

表面処理装置10fは、表面処理装置10eの直下流側に配置されており、蒸留水で表面の洗浄を行った。
ここで、帯状薄体S上の0.1μmの薄いニッケル膜厚のバラツキを蛍光X線解析を用いて検査した結果、±8%以内に収まっていた。つまり、実施例において処理された帯状薄体Sの被処理面では、長さ方向、上下方向ともにほぼ均一で、偏った濃度分布は認められなかった。なお、この値は、比較のために作製した従来方法におけるニッケルの濃度分布とほぼ同じであった。
さらに、表面処理装置10gは、表面処理装置10fの直下流側に配置されており、約8μmの厚さの銅の電解めっき(表面処理)を施した。
ここでも、上述のように試料を切り取り、銅層とポリイミド膜との間の剥離強度試験(JIS C 6471 8.1)を行った。具体的には、金属層を3mm幅にエッチングし、引っ張り強度試験器(例えば、TEST STAND MODEL-1310DWおよびFORCE ANALYZER EXPLORER II(ともにアイコーエンジニアリング社製))を用いて、引張速度50mm/分、引張角度90°で金属層を引き剥がした際の強度を測定することにより確認した。
The surface treatment apparatus 10f is disposed immediately downstream of the surface treatment apparatus 10e, and the surface is cleaned with distilled water.
Here, as a result of inspecting the variation of the thin nickel film thickness of 0.1 μm on the strip-shaped thin body S using the fluorescent X-ray analysis, it was within ± 8%. That is, on the surface to be processed of the strip-shaped thin body S processed in the example, the length direction and the vertical direction were almost uniform, and no uneven concentration distribution was observed. This value was almost the same as the nickel concentration distribution in the conventional method prepared for comparison.
Furthermore, the surface treatment apparatus 10g is disposed immediately downstream of the surface treatment apparatus 10f, and is subjected to electrolytic plating (surface treatment) of copper having a thickness of about 8 μm.
Here again, the sample was cut as described above, and a peel strength test (JIS C 6471 8.1) between the copper layer and the polyimide film was performed. Specifically, the metal layer is etched to a width of 3 mm, and using a tensile strength tester (for example, TEST STAND MODEL-1310DW and FORCE ANALYZER EXPLORER II (both manufactured by Aiko Engineering Co., Ltd.)) This was confirmed by measuring the strength when the metal layer was peeled off at an angle of 90 °.

銅のポリイミド膜への剥離強度は、形成直後では約0.6〜0.8N/mであり、一般に報告されているスパッタ法での剥離強度に遜色無く、非常に高強度であることが判明した。
従来の液浸漬法での付着強度より大幅に改善されていた。また、150℃、168時間の高温処理後の0.4N/m前後の値を保持しており、一般的な実装基板の特性要求を満たすことが確認できた。液浸法では、初めての例と言える。
このような結果は、本実施例において採用された帯状薄体Sと壁部12bとを近接配置して表面処理液Xを表面張力によって隙間内に保持する浮き壁方式による均一な表面処理によって優れた剥離強度が得られたものと推定される。また、被処理面におけるローラ等による擦り傷の解消等もその一因として考えられる。
The peel strength of copper on the polyimide film is about 0.6 to 0.8 N / m immediately after the formation, and it is found that the peel strength by the sputtering method generally reported is inferior and very high. did.
The adhesion strength in the conventional liquid immersion method was significantly improved. Further, the value of about 0.4 N / m after high temperature treatment at 150 ° C. for 168 hours was maintained, and it was confirmed that the characteristic requirements of general mounting substrates were satisfied. This is the first example of immersion.
Such a result is excellent by the uniform surface treatment by the floating wall method in which the strip-like thin body S and the wall portion 12b adopted in the present embodiment are arranged close to each other and the surface treatment liquid X is held in the gap by the surface tension. It is presumed that the peel strength was obtained. Another possible cause is the elimination of scratches caused by rollers or the like on the surface to be processed.

ここで、本実施例で得られた帯状薄体Sを試料片として用いて、斜光法によって表面擦り傷の評価を実施した。
この結果、本実施例の表面処理システム100において処理された被処理面では、擦り傷と認められる事象は全く観測されなかった。
一方、従来のローラなどで締め付ける垂直法では、ローラが精度よく調整されていない場合には、帯状薄体の表面に明らかな擦り傷等が多数認められた。この後、ローラの調整を行っても、表面の擦り傷等を無くすことは困難であった。
以上のように、表面処理液の表面張力を利用して所定の隙間内に表面処理液を保持する本実施例と、ローラによって帯状薄体を締め付けることで表面処理液の液切りを行う従来の構成との間で、帯状薄体の表面に形成される擦り傷の数に差が生じるのは、採用された処理装置の根本的な原理の違いから当然の結果と言える。
Here, the surface scratches were evaluated by the oblique light method using the strip-like thin body S obtained in this example as a sample piece.
As a result, on the surface to be processed that was processed in the surface processing system 100 of the present example, no event that was recognized as a scratch was observed.
On the other hand, in the vertical method of tightening with a conventional roller or the like, many obvious scratches or the like were observed on the surface of the strip-shaped thin body when the roller was not accurately adjusted. After this, even if the roller was adjusted, it was difficult to eliminate surface scratches and the like.
As described above, the surface treatment liquid is held in a predetermined gap by utilizing the surface tension of the surface treatment liquid, and the conventional surface treatment liquid is drained by tightening the belt-like thin body with a roller. The difference in the number of scratches formed on the surface of the belt-like thin body between the structures is a natural result due to the difference in the fundamental principle of the processing apparatus employed.

また、従来の構成では、ローラの調整は、非常に微妙なものであってプロセス上における大きな障害となるとともに歩留まり低下を招いている。一方、本実施例では、ローラの高精度な調整は不要であるため、そのような問題は無いことは明らかである。
以上のように、上述した表面処理装置10a〜10gを複数直列に配置した表面処理システム100では、各表面処理装置10a〜10gにおいて連続的に異なる種類の表面処理を行うことができる。よって、1つの被処理面に対して複数種類の表面処理を実施する必要がある場合でも、所定の処理を非常に効率よく行うことができる。
[他の実施形態]
以上、本発明の一実施形態について説明したが、本発明は上記実施形態に限定されるものではなく、発明の要旨を逸脱しない範囲で種々の変更が可能である。
Further, in the conventional configuration, the adjustment of the roller is very delicate, which becomes a major obstacle in the process and lowers the yield. On the other hand, in the present embodiment, since it is not necessary to adjust the roller with high accuracy, it is clear that there is no such problem.
As described above, in the surface treatment system 100 in which a plurality of the above-described surface treatment apparatuses 10a to 10g are arranged in series, different types of surface treatment can be continuously performed in each of the surface treatment apparatuses 10a to 10g. Therefore, even when it is necessary to perform a plurality of types of surface treatments on one surface to be processed, the predetermined processing can be performed very efficiently.
[Other Embodiments]
As mentioned above, although one Embodiment of this invention was described, this invention is not limited to the said embodiment, A various change is possible in the range which does not deviate from the summary of invention.

(A)
上記実施形態では、帯状薄体Sに対して近接配置される壁部12bが、ほぼフラットな表面を有している例を挙げて説明した。しかし、本発明はこれに限定されるものではない。
例えば、図5および図6に示すように、壁部12bの両端部に、壁部12bの表面から表面処理液Xの流下方向に沿って突出する両端突部12eがそれぞれ形成されていてもよい。この構成によれば、例えば、帯状薄体Sが所定の方向へ連続的に搬送されながら表面処理が施されている場合でも、帯状薄体Sと壁部12bとの対向面の間の隙間において保持される表面処理液Xが搬送方向における両端部付近から漏れ出してしまうことを抑制することができる。この結果、帯状薄体Sの所定の被処理面に対して、さらに確実に高品質な表面処理を実施することができる。
(A)
In the said embodiment, the wall part 12b arrange | positioned in proximity with the strip | belt-shaped thin body S gave and demonstrated the example which has a substantially flat surface. However, the present invention is not limited to this.
For example, as shown in FIGS. 5 and 6, both end protrusions 12e that protrude along the flow-down direction of the surface treatment liquid X from the surface of the wall 12b may be formed at both ends of the wall 12b. . According to this configuration, for example, even in the case where the surface treatment is performed while the strip-shaped thin body S is continuously conveyed in a predetermined direction, in the gap between the opposed surfaces of the strip-shaped thin body S and the wall portion 12b. It can suppress that the surface treatment liquid X hold | maintained leaks out from the both ends vicinity in a conveyance direction. As a result, a high-quality surface treatment can be more reliably performed on a predetermined surface to be treated of the thin strip S.

また、図7に示すように、壁部12bの表面において表面処理液Xの流下方向に沿ってほぼ等間隔で配置されており、被処理面との対向面から突出する複数の整流部12fが形成されていてもよい。この構成によれば、壁部12bと被処理面との間の微小隙間において流下していく表面処理液Xが壁部12bにおける下部領域において帯状に分かれてしまう等、表面処理液Xの流れが乱れてしまうことを、整流部12fによって防止することができる。
ここで、上記実施例における表面処理装置10aにおける脱脂処理の際に、敢えて表面処理液の流量を増やして、表面処理液の厚さを約4mmになるまで厚くした。上部の堰(図1の堰部12c等参照)から溢れ出る表面処理液が下流近くで狭まり、帯状薄体Sが膨れあがる様子が認められた。
Further, as shown in FIG. 7, a plurality of rectifying units 12 f that are arranged at substantially equal intervals along the flow-down direction of the surface treatment liquid X on the surface of the wall 12 b and project from the surface facing the surface to be treated. It may be formed. According to this configuration, the flow of the surface treatment liquid X is such that the surface treatment liquid X flowing down in the minute gap between the wall 12b and the surface to be treated is separated into a strip shape in the lower region of the wall 12b. Disturbance can be prevented by the rectifying unit 12f.
Here, during the degreasing process in the surface treatment apparatus 10a in the above-described embodiment, the flow rate of the surface treatment liquid was increased and the thickness of the surface treatment liquid was increased to about 4 mm. It was recognized that the surface treatment liquid overflowing from the upper weir (see the weir portion 12c and the like in FIG. 1) was narrowed near the downstream, and the strip-shaped thin body S was swollen.

この時、本実施形態のように、例えば、約5cm間隔で高さ約3mmの整流板、終端整流板を合計7本設置したところ、帯状薄体Sの膨れは全く解消した。このとき、定常的な流れが得られたことから、正常な表面処理が施されたと推定される。
また、両端突部12eや整流部12fが、表面処理液Xの厚さよりも0.5〜2.0mm低い高さである場合には、流れの安定性向上に効果が有り、両端部から表面処理液Xの流れがはみ出ないようにする効果がある。なお、整流部12fの先端は、表面処理液X内に沈んだ状態であるため、整流部12fが帯状薄体Sの表面に直接接触することはない。特に、表面処理液Xが堰部1cの高さを約3〜4mmを超える厚さの場合には、流下する表面処理液Xの下部に脈動が認められることがあるが、整流部12fを設けることによってこの脈動の発生を抑える効果が認められた。
At this time, for example, when a total of seven rectifying plates and terminal rectifying plates having a height of about 3 mm were installed at intervals of about 5 cm as in the present embodiment, the swollen band-like thin body S was completely eliminated. At this time, since a steady flow was obtained, it is estimated that normal surface treatment was performed.
Further, when both end protrusions 12e and the rectification unit 12f are 0.5 to 2.0 mm lower than the thickness of the surface treatment liquid X, there is an effect in improving flow stability, and the surface from both ends is improved. There is an effect of preventing the flow of the processing liquid X from protruding. In addition, since the front-end | tip of the rectification | straightening part 12f is the state which sank in the surface treatment liquid X, the rectification | straightening part 12f does not contact the surface of the strip | belt-shaped thin body S directly. In particular, when the surface treatment liquid X has a thickness that exceeds the height of the weir portion 1c by about 3 to 4 mm, pulsation may be observed in the lower portion of the surface treatment liquid X that flows down, but a rectifying portion 12f is provided. Thus, the effect of suppressing the occurrence of this pulsation was recognized.

(B)
上記実施形態では、帯状薄体Sの片面に対してのみ、表面処理液Xを用いた表面処理を行う例を挙げて説明した。しかし、本発明はこれに限定されるものではない。
例えば、図8に示すように、帯状薄体Sの左右両側にそれぞれ貯留部52a、壁部(第1壁部、第2壁部)52bおよび堰部52cを含む処理部52を配置して、表面処理液Xを用いて両面の同時処理を行う表面処理装置60であってもよい。
この場合には、左右の処理部52において、処理条件やプロセス条件は上記実施例と同様とすればよい。これにより、12.5μmの極薄のポリイミド膜を帯状薄体として用いた場合でも、帯状薄体Sの左右の隙間において非常に安定して表面処理液が流下していくことが分かった。そして、上述した片面処理の場合とは違って、安定した表面処理液の流れ、帯状薄体Sの走行が見られた。
(B)
In the said embodiment, the example which performs the surface treatment using the surface treatment liquid X only on the single side | surface of the strip | belt-shaped thin body S was demonstrated and demonstrated. However, the present invention is not limited to this.
For example, as shown in FIG. 8, a processing unit 52 including a storage part 52a, a wall part (first wall part, second wall part) 52b, and a dam part 52c is arranged on each of the left and right sides of the thin strip S, A surface treatment apparatus 60 that performs simultaneous treatment on both sides using the surface treatment liquid X may be used.
In this case, the processing conditions and process conditions in the left and right processing units 52 may be the same as those in the above embodiment. Thus, it was found that the surface treatment liquid flows down very stably in the left and right gaps of the strip-shaped thin body S even when an extremely thin polyimide film of 12.5 μm is used as the strip-shaped thin body. And unlike the case of the single-sided processing described above, a stable surface treatment liquid flow and running of the strip-shaped thin body S were observed.

ここで、本実施形態において、上記実施例と同様の処理条件およびプロセスを経て両面処理を実施し、50m毎に幅20cmに切り取り、ESCAにてパラジウムの分布状況を測定した。この結果、両面とも、絶対濃度は低いものの、濃度分布としては長さ方向、幅方向ともに偏りは見られず、全体として±9%以内の範囲であり、上記実施例と類似の結果が得られた。
なお、このような両面処理の場合には、帯状薄体が非常に薄く搬送中に不安定になり易い場合でも、帯状薄体の両面から対称的に表面処理液が流下するため、安定した表面処理を行うことができた。
(C)
上記実施形態では、1つの帯状薄体Sに対して、表面処理液Xを用いた表面処理を行う例を挙げて説明した。しかし、本発明はこれに限定されるものではない。
Here, in this embodiment, double-sided processing was performed through the same processing conditions and processes as in the above example, cut into a width of 20 cm every 50 m, and the distribution state of palladium was measured by ESCA. As a result, although the absolute density is low on both sides, there is no deviation in the length direction and the width direction in the concentration distribution, and the range is within ± 9% as a whole, and a result similar to the above example is obtained. It was.
In the case of such double-sided treatment, the surface treatment liquid flows down symmetrically from both sides of the strip-shaped thin body even when the strip-shaped thin body is very thin and easily becomes unstable during conveyance. The process could be done.
(C)
In the said embodiment, the example which performs the surface treatment using the surface treatment liquid X with respect to one strip | belt-shaped thin body S was demonstrated and demonstrated. However, the present invention is not limited to this.

例えば、図9に示すように、壁部(第1壁部)72bを中心として左右両側に貯留部72aおよび堰部72cを含む処理部72をそれぞれ配置した表面処理装置80であってもよい。この構成では、図9に示すように、壁部72bの左右両側に、それぞれ帯状薄体S1,S2を近接配置して、その対向面同士の間の隙間に表面処理液Xを流下させる。
これにより、それぞれの帯状薄体S1,S2の被処理面に対して同時に表面処理を実施することができる。この結果、1台の表面処理装置80において、上記実施形態の表面処理装置10と比較して、生産効率を2倍にすることができる。
(D)
上記実施形態では、シート状の帯状薄体Sを所定の方向へ連続搬送しながら、所定の面に表面処理を行う例を挙げて説明した。しかし、本発明はこれに限定されるものではない。
For example, as shown in FIG. 9, a surface treatment apparatus 80 in which treatment units 72 including a storage unit 72 a and a weir unit 72 c are arranged on both the left and right sides around a wall (first wall) 72 b may be used. In this configuration, as shown in FIG. 9, the strip-like thin bodies S1 and S2 are arranged close to each other on the left and right sides of the wall 72b, and the surface treatment liquid X is caused to flow into the gap between the facing surfaces.
Thereby, surface treatment can be simultaneously performed with respect to the to-be-processed surface of each strip | belt-shaped thin body S1, S2. As a result, the production efficiency can be doubled in one surface treatment apparatus 80 as compared with the surface treatment apparatus 10 of the above embodiment.
(D)
In the embodiment described above, an example in which the surface treatment is performed on a predetermined surface while continuously conveying the sheet-like strip-shaped thin body S in a predetermined direction has been described. However, the present invention is not limited to this.

表面処理が施される被処理物としては、必ずしも連続搬送されるものでなくてもよい。
例えば、被処理物ごとに所定の位置にセットして、表面処理を行うバッチ式の処理方法を採用することもできる。
ただし、被処理物がシート状である等、被処理物の搬送が可能である場合には、処理効率、生産効率の観点から、上記実施形態のような処理方法を採用することがより好ましい。
(E)
上記実施形態では、被処理物として、シート状の帯状薄体Sを用いた例を挙げて説明した。しかし、本発明はこれに限定されるものではない。
被処理物としてはシート状のものに限定されるものではなく、例えば、ある程度厚みのある板状の物体であってもよい。あるいは、ブロック状の物体であってもよい。
The workpiece to be surface-treated does not necessarily have to be continuously conveyed.
For example, it is possible to adopt a batch type processing method in which a surface treatment is performed by setting each object to be processed at a predetermined position.
However, when the object to be processed is transportable, such as in the form of a sheet, it is more preferable to adopt the processing method as in the above embodiment from the viewpoint of processing efficiency and production efficiency.
(E)
In the said embodiment, the example using the sheet-like strip | belt-shaped thin body S was given and demonstrated as a to-be-processed object. However, the present invention is not limited to this.
The object to be processed is not limited to a sheet-like object, and may be, for example, a plate-like object having a certain thickness. Or a block-shaped object may be sufficient.

この場合でも、表面処理装置の第1壁部に対して、被処理物の被処理面を近接配置することで、表面処理液の表面張力を利用しつつ、高品質な表面処理を実施することができる。
(F)
上記実施例では、表面処理装置10a〜10gにおいて、それぞれ脱脂処理、浄化処理、アルカリ加水分解処理、パラジウム付与処理、電解めっき処理等を実施した例を挙げて説明した。しかし、本発明はこれに限定されるものではない。
例えば、上記とは異なる種類の表面処理液を用いて、上記以外の表面処理を実施してもよい。
(G)
上記実施形態では、壁部12bの上方に、供給部13から供給された表面処理液Xを一旦貯留する貯留部12aを設けた例を挙げて説明した。しかし、本発明はこれに限定されるものではない。
Even in this case, a high-quality surface treatment is performed while utilizing the surface tension of the surface treatment liquid by arranging the treatment surface of the treatment object close to the first wall portion of the surface treatment apparatus. Can do.
(F)
In the said Example, the surface treatment apparatuses 10a-10g demonstrated and demonstrated the example which implemented the degreasing process, the purification process, the alkali hydrolysis process, the palladium provision process, the electrolytic plating process, etc., respectively. However, the present invention is not limited to this.
For example, a surface treatment other than the above may be performed using a different type of surface treatment liquid.
(G)
In the said embodiment, the example which provided the storage part 12a which temporarily stores the surface treatment liquid X supplied from the supply part 13 above the wall part 12b was demonstrated and demonstrated. However, the present invention is not limited to this.

例えば、供給部から被処理面と第1壁部との対向面同士の間の隙間に対して直接的に表面処理液を供給するような構成であってもよい。
ただし、供給部からの表面処理液の供給量のバラつきに伴う上記隙間への供給量の不安定化を緩和するという意味では、供給部から直接的に上記隙間へ表面処理液を供給するのではなく、上記実施形態のように、一旦貯留部に貯えた後で供給することがより好ましい。
(H)
上記実施形態および実施例では、上述した表面処理液、処理条件によって、上述した被処理物に対して表面処理を行う例を挙げて説明したが、例えば、表面処理液の種類や、被処理物の搬送速度等の処理条件に関しては、それぞれの表面処理に応じて適宜変更が可能である。
For example, the structure which supplies a surface treatment liquid directly with respect to the clearance gap between the opposing surfaces of a to-be-processed surface and a 1st wall part from a supply part may be sufficient.
However, in order to alleviate the instability of the supply amount to the gap due to the variation in the supply amount of the surface treatment liquid from the supply unit, the surface treatment liquid is not directly supplied from the supply unit to the gap. Instead, it is more preferable to supply after having once stored in the storage part as in the above embodiment.
(H)
In the said embodiment and Example, although the example which surface-treats with respect to the to-be-processed object mentioned above was given and demonstrated by the surface-treating liquid and process conditions mentioned above, for example, the kind of surface-treating liquid and the to-be-processed object The processing conditions such as the conveyance speed can be appropriately changed according to each surface treatment.

本発明の表面処理装置は、被処理物における被処理面以外の部分へ表面処理液が移動することを抑制して、被処理面において均一で高品質な表面処理を実施することができるという効果を奏することから、めっき処理以外の各種表面処理に対しても広く適用可能である。   The surface treatment apparatus of the present invention has an effect that the surface treatment liquid can be prevented from moving to a portion other than the surface to be treated in the object to be treated, and a uniform and high quality surface treatment can be performed on the surface to be treated. Therefore, it can be widely applied to various surface treatments other than plating treatment.

本発明の一実施形態に係る表面処理装置全体の構成を示す断面図。Sectional drawing which shows the structure of the whole surface treatment apparatus which concerns on one Embodiment of this invention. 図1のA−A線矢視断面図。FIG. 2 is a cross-sectional view taken along line AA in FIG. 1. 図1の表面処理装置に含まれる処理部の周辺の構成を示す斜視図。The perspective view which shows the structure of the periphery of the process part contained in the surface treatment apparatus of FIG. 図2のZ部を示す拡大図。The enlarged view which shows the Z section of FIG. 本発明の他の実施形態に係る表面処理装置において両端突部を含む処理部周辺の構成を示す斜視図。The perspective view which shows the structure of the treatment part periphery containing a both-ends protrusion in the surface treatment apparatus which concerns on other embodiment of this invention. 図5の両端突部周辺の構成を示す平面図。The top view which shows the structure of the both-ends protrusion periphery of FIG. 本発明のさらに他の実施形態に係る表面処理装置において整流部を含む処理部周辺の構成を示す斜視図。The perspective view which shows the structure around the process part containing a rectification | straightening part in the surface treatment apparatus which concerns on further another embodiment of this invention. 本発明のさらに他の実施形態に係る両面処理用の表面処理装置の構成を示す断面図。Sectional drawing which shows the structure of the surface treatment apparatus for double-sided processing which concerns on further another embodiment of this invention. 本発明のさらに他の実施形態に係る2つの帯状薄体へ同時に処理を行う表面処理装置の構成を示す断面図。Sectional drawing which shows the structure of the surface treatment apparatus which processes simultaneously to two strip | belt-shaped thin bodies based on further another embodiment of this invention. 図1の表面処理装置を複数含むように構成された表面処理システムの構成を示す正面図。The front view which shows the structure of the surface treatment system comprised so that multiple surface treatment apparatuses of FIG. 1 might be included.

符号の説明Explanation of symbols

10 表面処理装置
10a〜10g 表面処理装置
11 筐体部
12 処理部
12a 貯留部
12b 壁部(第1壁部)
12c 堰部
12d 支持部
12e 両端突部
12f 整流部
13 供給部
13a 孔部
52 処理部
52a 貯留部
52b 壁部(第1壁部、第2壁部)
52c 堰部
60 表面処理装置
72 処理部
72a 貯留部
72b 壁部(第1壁部)
72c 堰部
80 表面処理装置
100 表面処理システム
d 隙間
S,S1,S2 帯状薄体(被処理物)
X 表面処理液
X1 界面
DESCRIPTION OF SYMBOLS 10 Surface treatment apparatus 10a-10g Surface treatment apparatus 11 Housing | casing part 12 Processing part 12a Storage part 12b Wall part (1st wall part)
12c Weir part 12d Support part 12e Both ends protrusion part 12f Rectification part 13 Supply part 13a Hole part 52 Processing part 52a Storage part 52b Wall part (1st wall part, 2nd wall part)
52c Weir part 60 Surface treatment apparatus 72 Processing part 72a Storage part 72b Wall part (1st wall part)
72c Weir part 80 Surface treatment apparatus 100 Surface treatment system d Crevice S, S1, S2 Strip thin body (object to be treated)
X Surface treatment solution X1 Interface

Claims (11)

被処理物の被処理面に沿って表面処理液を流下させて表面処理を行う表面処理装置であって、
前記表面処理液を供給する供給部と、
前記被処理面との間に所定の微小隙間を設けた状態で近接配置されており、前記被処理面とその対向面との間において、前記供給部から供給された前記表面処理液を流下させて表面処理を行う第1壁部と、
を備えている表面処理装置。
A surface treatment apparatus for performing a surface treatment by flowing a surface treatment liquid along a surface to be treated,
A supply unit for supplying the surface treatment liquid;
The surface treatment liquid is disposed close to the surface to be treated with a predetermined minute gap, and the surface treatment liquid supplied from the supply unit is caused to flow down between the surface to be treated and the surface facing the surface. A first wall for surface treatment,
A surface treatment apparatus comprising:
長尺の前記被処理物を、長手方向に沿って所定の方向へ連続搬送する搬送機構を、さらに備えている、
請求項1に記載の表面処理装置。
A transport mechanism for continuously transporting the long object to be processed in a predetermined direction along the longitudinal direction;
The surface treatment apparatus according to claim 1.
前記第1壁部および前記被処理物の上方に配置されており、前記供給部から供給される前記表面処理液を一旦貯留しながら所定量の前記表面処理液を流下させる貯留部を、さらに備えている、
請求項1または2に記載の表面処理装置。
A storage section that is disposed above the first wall section and the object to be processed, and that allows a predetermined amount of the surface treatment liquid to flow down while temporarily storing the surface treatment liquid supplied from the supply section; ing,
The surface treatment apparatus according to claim 1 or 2.
前記被処理物における前記第1壁部との対向面とは反対側の面に近接配置された裏当て部を、さらに備えている、
請求項1から3のいずれか1項に記載の表面処理装置。
A backing portion disposed in proximity to a surface opposite to the surface facing the first wall portion of the object to be processed;
The surface treatment apparatus of any one of Claim 1 to 3.
前記第1壁部は、前記表面処理液が流下する方向に沿って、前記被処理面と対向する面から突出する整流部を有している、
請求項1から4のいずれか1項に記載の表面処理装置。
The first wall portion includes a rectifying portion that protrudes from a surface facing the surface to be processed along a direction in which the surface treatment liquid flows down.
The surface treatment apparatus of any one of Claim 1 to 4.
前記第1壁部は、前記表面処理液が流下する方向に略垂直な方向における両端部付近に、前記流下する方向に沿って前記被処理面と対向する面から突出する両端突部を有している、
請求項1から5のいずれか1項に記載の表面処理装置。
The first wall portion has both end protrusions protruding from a surface facing the surface to be processed along the flowing direction, in the vicinity of both end portions in a direction substantially perpendicular to the flowing direction of the surface treatment liquid. ing,
The surface treatment apparatus of any one of Claim 1 to 5.
前記被処理面と前記第1壁部の対向面との間の間隔を調整する調整機構をさらに備えている、
請求項1から6のいずれか1項に記載の表面処理装置。
An adjustment mechanism for adjusting an interval between the surface to be processed and the opposing surface of the first wall portion;
The surface treatment apparatus of any one of Claim 1 to 6.
前記被処理面は、前記被処理物における前記第1壁部に対向配置された表面とその裏面とを含み、
前記裏面側の被処理面に対して近接配置された第2壁部を、さらに備えている、
請求項1から7のいずれか1項に記載の表面処理装置。
The surface to be processed includes a front surface and a back surface of the surface to be processed which are opposed to the first wall portion,
A second wall portion disposed close to the surface to be processed on the back surface side;
The surface treatment apparatus of any one of Claim 1 to 7.
請求項1から8のいずれか1項に記載の表面処理装置を、長尺の前記被処理物の搬送方向に沿って複数配置した、表面処理システム。   A surface treatment system in which a plurality of the surface treatment apparatuses according to any one of claims 1 to 8 are arranged along a conveying direction of the long object to be treated. 長手方向に走行する長尺の帯状薄体の広幅面を略縦方向に保ち、該帯状薄体の片面ないしは両面を表面処理する方法において、
該帯状薄体を浮き壁として利用して対峙する側壁の間に表面処理液を流下させる浮き壁方式の表面処理方法。
In the method of keeping the wide surface of the long strip-shaped thin body running in the longitudinal direction substantially in the vertical direction, and surface treating one side or both sides of the strip-shaped thin body,
A surface treatment method of a floating wall system in which a surface treatment liquid is caused to flow down between side walls facing each other using the thin strip as a floating wall.
請求項10に記載の表面処理方法によって処理された帯状薄体。   A strip-shaped thin body treated by the surface treatment method according to claim 10.
JP2007259182A 2007-10-02 2007-10-02 Surface treatment device and surface treatment system, method for surface treatment and band-shaped thin body treated thereby Pending JP2010280925A (en)

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JP2007259182A JP2010280925A (en) 2007-10-02 2007-10-02 Surface treatment device and surface treatment system, method for surface treatment and band-shaped thin body treated thereby
TW97136867A TW200916612A (en) 2007-10-02 2008-09-25 Surface treatment device and surface treatment system, method for surface treatment, and band-shaped thin body treated thereby
PCT/JP2008/002715 WO2009044530A1 (en) 2007-10-02 2008-09-29 Surface treatment device and surface treatment system, method for surface treatment, and band-shaped thin body treated thereby

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CN106350840A (en) * 2016-11-04 2017-01-25 北京曙光航空电气有限责任公司 Surface protection method for large length-diameter ratio hollow shaft part inner wall
DE102011051912B4 (en) 2010-07-22 2019-07-18 Denso Corporation Cleaning and drying process and cleaning and drying device

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JP5126312B2 (en) * 2010-07-22 2013-01-23 株式会社デンソー Washing and drying equipment
JP5986848B2 (en) * 2012-08-27 2016-09-06 上村工業株式会社 Surface treatment equipment
JP6306128B2 (en) * 2016-11-09 2018-04-04 上村工業株式会社 Surface treatment equipment

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JPS61127895A (en) * 1984-11-26 1986-06-16 Hitachi Cable Ltd Method and device for plating band-like body
JP2003129281A (en) * 2001-10-26 2003-05-08 Alps Electric Co Ltd Device and process for electrolytic treatment

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Publication number Priority date Publication date Assignee Title
DE102011051912B4 (en) 2010-07-22 2019-07-18 Denso Corporation Cleaning and drying process and cleaning and drying device
CN106350840A (en) * 2016-11-04 2017-01-25 北京曙光航空电气有限责任公司 Surface protection method for large length-diameter ratio hollow shaft part inner wall

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