JP6306128B2 - Surface treatment equipment - Google Patents

Description

  The present invention relates to a technique for performing surface treatment such as electroless plating, desmear treatment, pretreatment or posttreatment on an object to be treated such as a printed circuit board.

  Conventionally, as shown in FIG. 19, a plurality of plate-like workpieces 10 accommodated in a rack R are immersed in a treatment liquid Q stored in a tank to perform electroless plating (Patent Document 1). . Here, the electroless plating is a plating method capable of plating only by immersing a non-treated material in a plating solution, unlike electroplating in which energization is performed. By electroless plating, it is possible to plate even non-conductors (for example, insulators such as plastic and ceramic).

  Here, the problem of dissolved oxygen in electroless plating and desmear treatment will be mentioned. The presence of dissolved oxygen in the electroless copper plating solution is a problem because it has an effect of suppressing the reaction between the electroless copper plating solution and the catalyst adhering to the workpiece, and reduces the deposition of the plating. Further, the presence of dissolved oxygen in the etching solution used for the desmear process is a problem because it has an effect of promoting the reaction of the etching solution with respect to the workpiece and excessively etches the wetted part. Therefore, it is necessary to reduce the amount of dissolved oxygen in these processing solutions as much as possible.

  As another plating apparatus, as shown in FIG. 20, in the tank V provided with the side walls W1 and W2 arranged close to the plate-like workpiece 10, when the plate-like workpiece 10 descends, it is in the processing liquid Q. In order to smoothly draw in, the treatment liquid Q flows upward from the tank V through the taper-shaped opening (Patent Document 2) or vertically toward the lower surface of the workpiece held horizontally. There is also an electroplating apparatus (Patent Document 3) that jets out water.

JP 2011-32538 A JP 2006-118019 A Japanese Patent Laid-Open No. 9-31696

(I) However, since the technique of Patent Document 1 shown in FIG. 19 requires an elevating mechanism for dipping the rack, there is a problem that facilities for electroless plating become complicated and large, Since it is necessary to immerse in the accumulated electroless plating treatment solution Q, there is a problem that a large amount of treatment solution is required.

(Ii) When the technique of Patent Document 2 is used for electroless plating, the treatment liquid Q may travel along the side surfaces W1 and W2 in the tank V, and a desired plating quality may not be obtained. There is also a problem that a large amount of plating solution is required.

  Further, in the technique of Patent Document 2 shown in FIG. 20, since the processing liquid is ejected downward from the horizontal plane from the liquid ejection headers 53L and 53R (FIG. 1 of Patent Document 2), the process liquid hits the work due to the influence of gravity. The flow rate of the processing liquid increases and the incident angle with respect to the plate-like workpiece 10 increases. For this reason, when a processing liquid collides with a workpiece | work, foaming arises and air is involved in a processing liquid, As a result, the amount of dissolved oxygen in a processing liquid increases and the quality of surface treatment deteriorates. In addition, the workpiece may be bent or collide with the surroundings.

(Iii) The technique of Patent Document 3 performs plating on only one side (lower surface) of a workpiece conveyed in a state of being held horizontally, and the technique of the workpiece conveyed in a state of holding the workpiece in a vertical direction. Plating treatment cannot be performed on the front and back. Further, since it is necessary to eject a large amount of the processing liquid Q upward with respect to the lower surface of the work, it cannot be used for a thin work.

  An object of the present invention is to perform surface treatment such as electroless plating with high quality on a workpiece held in a vertical direction.

(1) The surface treatment apparatus of the present invention is
A transport hanger for transporting an object to be processed while being held in a vertical direction;
Inside, a tank body for attaching a processing liquid to the object to be processed conveyed by the conveying hanger;
A liquid ejection part for ejecting the treatment liquid obliquely upward with respect to a horizontal plane from the ejection port toward the object to be treated;
A transport mechanism for transporting the transport hanger into the tank;
It is characterized by having.

  Thereby, surface treatments, such as an electroless-plating process, can be performed with high quality with respect to the workpiece | work hold | maintained at the perpendicular direction.

(2) The surface treatment apparatus of the present invention is
The treatment liquid ejected obliquely upward from the ejection port moves on a parabola, and the ejection angle of the treatment liquid is set so that the treatment liquid hits the object to be treated near the top of the parabola,
It is characterized by.

  Thereby, surface treatments such as electroless plating can be performed with higher quality by applying the sprayed treatment liquid near the top of the parabola to the workpiece held in the vertical direction.

(3) The surface treatment apparatus of the present invention is
The liquid ejection part includes a pipe member having a space inside,
The spout is composed of a plurality of holes arranged at predetermined intervals in the longitudinal direction of the pipe member;
It is characterized by.

  Thereby, surface treatments, such as an electroless-plating process, can be performed further in high quality by applying the process liquid ejected from the some hole with respect to the workpiece | work hold | maintained at the perpendicular direction.

(4) The surface treatment apparatus of the present invention is
The liquid ejection part includes a pipe member having a space inside,
The spout is composed of a long hole extending in the longitudinal direction of the tube member;
It is characterized by.

  Thereby, surface treatments, such as an electroless-plating process, can be performed with further high quality by applying the process liquid ejected from the long hole with respect to the workpiece | work hold | maintained at the perpendicular direction.

(5) The surface treatment apparatus of the present invention is
A current transformation member is attached to the outer periphery of the liquid ejection part so as to cover the ejection port,
The treatment liquid ejected from the ejection port hits the object to be treated after hitting the current transformation member;
It is characterized by.

  As a result, surface treatment such as electroless plating is performed with a higher quality by uniformly applying the treatment liquid ejected from the continuous long hole to the workpiece to be processed on the workpiece held in the vertical direction. be able to.

(6) The surface treatment apparatus of the present invention is
The jetting angle of the processing liquid jetted from the jetting port can be changed to an arbitrary angle,
It is characterized by.

  Thereby, a process liquid can be ejected with respect to the workpiece | work hold | maintained at the perpendicular direction by arbitrary ejection angles.

(7) The surface treatment apparatus of the present invention is
The liquid ejecting part is arranged in a plurality of stages in the tank body,
It is characterized by.

  Thereby, the amount of the processing liquid can be applied to the plate-like workpiece from the liquid ejection portions provided at a plurality of positions.

(8) The surface treatment apparatus of the present invention is
An ejection angle of the processing liquid ejected from the ejection port is within a range of 5 ° to 85 ° upward with respect to a horizontal plane;
It is characterized by.

  Thereby, the amount of the processing liquid can be applied to the plate-shaped workpiece within a range of 5 ° to 85 ° upward with respect to the horizontal plane.

(9) The surface treatment apparatus of the present invention is
A scattering prevention member provided vertically below the transport hanger;
It is characterized by.

  Thereby, it can prevent that the process liquid which fell along with the to-be-processed object bounces off, and adheres to an object to be processed again.

(10) The surface treatment apparatus of the present invention is
A liquid storage tank communicating with the bottom of the tank body, the liquid storage tank having a bottom provided at a position lower than the bottom of the tank body;
It is characterized by.

  Thereby, a process liquid can be automatically flowed into a liquid storage tank. Moreover, it becomes possible to attach apparatuses, such as a heater, to the upper surface of a liquid storage tank, and can maintain an apparatus easily.

(11) The surface treatment apparatus of the present invention comprises:
The tank body is provided with a notch that extends in the vertical direction and through which the workpiece is passed when the transport hanger moves.
It is characterized by.

  Thereby, it becomes possible to convey a to-be-processed object horizontally through a notch, and space saving of a surface treatment apparatus can be achieved.

(14) The surface treatment apparatus of the present invention comprises:
A transport hanger for transporting an object to be processed while being held in a vertical direction;
Inside, a tank body for attaching a processing liquid to the object to be processed conveyed by the conveying hanger;
A scattering prevention member provided vertically below the transport hanger;
A transport mechanism for transporting the transport hanger into the tank;
It is characterized by having.

  Thereby, it can prevent that the process liquid which fell along with the to-be-processed object bounces off, and adheres to an object to be processed again.

(15) The surface treatment apparatus of the present invention comprises:
A transport hanger for transporting an object to be processed while being held in a vertical direction;
Inside, a tank body for attaching a processing liquid to the object to be processed conveyed by the conveying hanger;
A transport mechanism for transporting the transport hanger into the tank;
A liquid storage tank communicating with the bottom of the tank body, the liquid storage tank having a bottom provided at a position lower than the bottom of the tank body;
It is characterized by comprising.

  Thereby, a process liquid can be automatically flowed into a liquid storage tank. Moreover, it becomes possible to attach apparatuses, such as a heater, to the upper surface of a liquid storage tank, and can maintain an apparatus easily.

It is the arrangement plan which looked at surface treatment device 300 from the upper part. It is the side view which looked at the surface treatment apparatus 300 from (alpha) direction. 3 is a β-β cross-sectional view of an electroless copper plating tank 200 that constitutes a part of the surface treatment apparatus 300. FIG. It is a figure which shows the state which looked at the electroless copper plating tank 200 from upper direction. FIG. 3 is a diagram illustrating a configuration of a liquid ejection unit 4. It is a figure which shows the flow of the process liquid Q ejected from the jet nozzle 6 of the liquid ejection part 4. FIG. It is a figure which shows the example of improvement which provided the current transformation member 40 in the liquid ejection part 4. FIG. FIG. 6 is a cross-sectional view of the liquid flow of the processing liquid Q before and after hitting the current transformation member 40. FIG. 9A is a diagram showing a connection relationship for controlling the movement operation of the transport mechanism 18, and FIG. 9B is a diagram showing a cross section of the guide rail 14 between the third water washing tank 312 and the electroless copper plating tank 200. It is. It is a figure which shows the structure of the plating process tank 201 in other embodiment. It is a figure which shows the detail of the scattering prevention member 60. FIG. It is a figure which shows the structure of the plating process tank 202 in other embodiment. It is a figure which shows the structure of the liquid ejection part 4 in other embodiment. It is a figure which shows the structure of the liquid ejection part 4 in other embodiment. It is a figure which shows the example which provided the multistage liquid ejection part. It is a figure which shows the example which arranged the surface treatment apparatus adjacent to multiple rows. It is a figure which shows the structure of the hanger for conveyance 16 'in other embodiment. It is a figure which shows the conveyance assistance apparatus in other embodiment. It is a figure which shows the electroless-plating processing method in a prior art. It is a figure which shows the structure of the processing tank V in a prior art. It is a figure which shows the liquid ejection part 4 'of other embodiment. It is a figure which shows the surface treatment apparatus in other embodiment.

1. Configuration of Surface Treatment Apparatus 300 First, the configuration of the surface treatment apparatus 300 of the present invention will be described using FIG. 1 and FIG. FIG. 1 is a layout view of the surface treatment apparatus 300 as viewed from above. FIG. 2 is a side view of the surface treatment apparatus 300 shown in FIG. 1 as viewed from the α direction. In FIG. 1, the transport hanger 16 and the transport mechanism 18 shown in FIG. 2 are omitted.

  As shown in FIG. 1, the surface treatment apparatus 300 includes a load unit 302, a first water washing tank 304, a desmear tank 306, a first one along the conveyance direction X of the plate-like workpiece 10 (FIG. 2) that is the object to be treated. 2 The water washing tank 308, the pretreatment tank 310, the third water washing tank 312, the electroless copper plating tank 200, the water washing tank 314, and the unloading part 316 are provided in this order. A process is performed. Each tank is provided with a notch 8 (FIG. 1) extending in the vertical direction to form a passage for the transport hanger 16 shown in FIG. Details of each process will be described later.

  Furthermore, the surface treatment apparatus 300 conveys the hanger 16 for conveyance which conveys the plate-shaped workpiece | work 10 hold | gripped by the clamp 15 (FIG. 2) and hold | maintained to the vertical direction in a horizontal direction, and each conveyance hanger 16 in each tank. And a transport mechanism 18. FIG. 2 shows a state where the plate-like workpiece 10 is attached to the transport hanger 16 by the load portion 302.

  After the plate-like workpiece 10 is attached by the load unit 302, the transport mechanism 18 starts moving in the horizontal direction X, whereby the plate-like workpiece 10 moves inside each tank (such as the electroless copper plating tank 200). pass. Thereafter, the transport mechanism 18 finally stops at the unload unit 316, and the plate-like workpiece 10 on which the plating process has been performed is removed from the transport hanger 16.

  FIG. 3 is a β-β cross-sectional view of electroless copper plating tank 200 (FIG. 1) constituting a part of surface treatment apparatus 300. FIG. 4 is a diagram illustrating a state where the electroless copper plating tank 200 illustrated in FIG. 3 is viewed from above. In FIG. 4, the transport hanger 16 and the transport mechanism 18 are omitted.

  The electroless copper plating tank 200 shown in FIG. 3 has a tank body 2 placed on a frame 56 and a treatment liquid Q (electroless copper plating solution) stored at the bottom of the tank body 2. And a circulation pump 50 for supplying and circulating.

  In order to perform the process with respect to the plate-shaped workpiece 10, the liquid jet part 4 which has the jet nozzle 6 is provided in each tank, such as the electroless copper plating tank 200. FIG. As shown in FIG. 3, the processing liquid Q is ejected obliquely upward with respect to the horizontal plane from the ejection port 6 of the liquid ejection part 4 toward the plate-like workpiece 10. Thereby, in the inside of the tank body 2, the process liquid Q (electroless copper plating liquid) is applied to the upper part of the plate-shaped workpiece | work 10 hold | gripped with the hanger 16 for conveyance. As a result, the processing liquid Q can be adhered to the surface of the plate-shaped workpiece 10 while the processing liquid Q moves along the plate-shaped workpiece 10. The detailed structure of the liquid ejection part 4 will be described later.

  In this way, by adopting a method in which the circulated processing liquid Q is transmitted to the plate-shaped workpiece 10 without immersing the plate-shaped workpiece 10 in the stored processing liquid Q, compared with the immersion type. Thus, the total amount of the treatment liquid Q used in the entire surface treatment apparatus 300 can be reduced.

  The transport mechanism 18 includes guide rails 12 and 14, a support member 20, and transport rollers 22 and 24 illustrated in FIG. 3. Conveying rollers 22 and 24 for the transport mechanism 18 to move on the guide rails 12 and 14 are attached to the bottom of the support member 20. The transport rollers 22 and 24 are driven by a motor (not shown). The guide rails 12 and 14 are fixed on the frames 52 and 54, respectively. Since the sheet is conveyed in such a horizontal direction, the lifting and lowering operation of the plate-like workpiece is not required, and the height of the apparatus can be reduced, so that the space can be saved.

  As shown in FIG. 3, the transport hanger 16 is fixed below a support member 20 attached so as to be suspended over the two guide rails 12, 14. Thereby, the vibration of the plate-like workpiece 10 can be reduced, and the distortion of the structure (guide rails 12, 14, frames 52, 54, etc.) that supports the transport mechanism 18 can be reduced.

  A plurality of magnets 21 are embedded at predetermined positions on the guide rails 12 and 14 shown in FIG. The transport mechanism 18 includes a magnetic sensor 19 for detecting the magnet 21 on the guide rails 12 and 14. The magnetic sensor 19 is provided below the support member 20 (one place on the guide rail 14 side).

  Thereby, the transport hanger 16 moved into the electroless copper plating tank 200 can be stopped at a predetermined position (for example, the center position of the electroless copper plating tank 200 shown in FIG. 4).

  As shown in FIG. 3, the circulation pump 50 provided in each tank is connected to the bottom of the tank body 2, and the tank body 2 and the liquid ejection part 4 are communicated via the circulation pump 50 (indicated by dotted arrows). Show). As a result, the processing liquid Q collected at the bottom of the tank body 2 is supplied again to the liquid ejection part 4 by the circulation pump 50.

  The tank body 2 is composed of side walls 2a, 2b and a bottom portion 2c, and these can be formed as an integral member by assembling them by processing, bonding or the like such as PVC (polyvinyl chloride). it can. The tank body 2 receives the processing liquid applied to the plate-like workpiece 10 at the bottom part 2c below. In addition, the thing of the same shape is used for each tank other than the electroless copper plating tank 200 shown in FIG. That is, the structure of each tank is the same, and only the types of treatment liquids (plating liquid, desmear liquid, washing water, etc.) used in each tank are different.

  Moreover, the slit 8 which is a notch extended | stretched to the perpendicular direction is shape | molded by the side wall 2b of the tank 2 shown in FIG. Thereby, the plate-like workpiece 10 can pass through the slit 8 when the transport hanger 16 is transported. If the lower end 8a of the slit 8 is set too low, the processing liquid Q accumulated in the tank body 2 may overflow and flow out to the outside.

  For this reason, it is necessary to adjust the supply amount of the processing liquid Q so that the liquid surface H (FIG. 3) of the processing liquid Q accumulated in the tank body 2 is always located below the lower end 8 a of the slit 8. In this embodiment, the total amount of the treatment liquid Q to be used is determined so that the liquid surface H (FIG. 3) of the treatment liquid Q accumulated in the tank body 2 is located below the lower end 8a of the slit 8, and The tank body 2 and the liquid ejection part 4 are communicated with each other via the circulation pump 50.

[Structure of liquid ejection part 4]
FIG. 5 shows the structure of the liquid ejection part 4. FIG. 5 is an enlarged view of the liquid ejection portion 4 shown in FIG.

  As shown in FIG. 5, the liquid ejection part 4 is attached by being fastened by two U-shaped fasteners F <b> 2 on a base F <b> 1 provided by fixing a square pipe material to the side wall 2 a. In this embodiment, the liquid ejection part 4 is tightened with an appropriate strength that can be manually rotated.

  As shown in FIG. 4, the liquid ejection part 4 is configured by a round pipe that is a tube member having a space inside, and both ends in the longitudinal direction are sealed. Moreover, the jet nozzle 6 is comprised by the some hole arrange | positioned in a longitudinal direction at predetermined intervals. In addition, a flexible pipe T <b> 1 and a pipe T <b> 2 are connected to the liquid ejection part 4 so as to penetrate and communicate with the side wall 2 a of the tank body. The pipe T2 is connected to the discharge port of the pump 50. Thereby, the processing liquid Q received from the pump 50 can be ejected from the ejection port 6.

  As shown in FIG. 6A, the ejection angle θ of the ejection port 6 is installed in an obliquely upward direction (for example, a range of 5 ° to 85 °) with respect to the horizontal plane L. For this reason, the liquid flow of the processing liquid Q ejected from the ejection port 6 moves on the parabola. The position of the vertex Z is determined by the jet velocity V of the processing liquid Q and the jet angle θ. Note that the ejection flow velocity V of the processing liquid Q depends on the pressure from the pump 50 and the size of the ejection port 6.

  In this embodiment, the processing liquid Q ejected at the ejection flow velocity V is at the apex Z of the parabola under the condition in which the liquid retaining portion 4 (radius r) is disposed at a position away from the plate workpiece 10 by a predetermined distance D. The ejection angle θ is designed to hit the plate-like workpiece 10. At the position of the vertex Z of the parabola shown in FIG. 6B, the vertical velocity component Vy of the processing liquid Q is eliminated, and only the horizontal velocity component Vx when ejected remains, so that the occurrence of foaming can be reduced. Because.

  Further, since the liquid flow hits the surface of the plate-like workpiece 10 perpendicularly, the processing liquid Q hitting the plate-like workpiece 10 spreads uniformly on the surface in a concentric manner. In addition, you may make it contact | abut in front of the vertex vicinity, ie, the predetermined distance from the vertex Z, or back.

  When the processing liquid Q is not ejected obliquely upward with respect to the horizontal plane L, but is ejected in the horizontal direction or downward from the horizontal direction, the velocity component Vy in the vertical direction of the processing liquid Q continues to increase, and the combined velocity V also increases. Increase by minutes. As a result, the processing liquid Q that has hit the plate-like workpiece 10 is likely to be scattered by scattering in the y direction.

  As described above, by ejecting the treatment liquid obliquely upward with respect to the horizontal plane L, generation of bubbles generated when colliding with the workpiece is suppressed, and the amount of dissolved oxygen in the treatment liquid Q increases. Can be prevented.

  Furthermore, as shown in FIG. 7, a current-transforming member 40 for changing the direction of the flow of the processing liquid Q to be ejected may be attached to the outer periphery of the liquid ejecting portion 4 so as to cover the ejection port 6. The current-transforming member 40 is provided at a distance from the ejection port 6.

  FIG. 7 is an enlarged view showing a state in which the direction of the processing liquid Q ejected by the current transformation member 40 is changed. FIG. 8A is a γ1 cross-sectional view of the ejected processing liquid Q (before hitting the current transformation member 40). FIG. 8B is a γ2 cross-sectional view of the processing liquid Q after hitting the current transformation member 40.

  When the current-transforming member 40 is used, the liquid flow (cross-sectional area shown in FIG. 8A) exiting from each jet port 6 hits the current-transforming plate and the cross-sectional area becomes large (FIG. 8B). For this reason, when it hits the plate-shaped workpiece 10, the liquid flow from each adjacent jet nozzle 6 connects (FIG. 8B), and the process liquid Q which hits the surface of the plate-shaped workpiece 10 can be made uniform.

  That is, ideally, it can be made uniform like a liquid flow coming out from a slit (long hole) as shown in FIG. Also, in order to draw the same parabola as the liquid flow coming out of the slit (long hole), it is necessary to narrow the width of the slit (in order to obtain the same flow velocity during ejection, the slit area is the same as the total area of the holes) There is a drawback that dust is likely to clog. For this reason, the same effect as that of the slit was obtained using the holes.

2. Details of Each Process in Surface Treatment Apparatus 300 The contents of each process performed in the surface treatment apparatus 300 will be described with reference to FIG. In this embodiment, it is assumed that the treatment liquid Q used in each tank of the surface treatment apparatus 300 is constantly circulated by the circulation pump 50 of each tank.

  FIG. 9A is a diagram illustrating a connection relationship of a control unit that controls the operation of the transport mechanism 18. As shown in FIG. 9A, the magnetic sensor 19 (FIG. 4) is connected to the PLC 30 and detects that it has reached the top of the magnet disposed on the guide rail 14. A signal detected by the magnetic sensor 19 is given to the PLC 30. Upon receiving the signal, the PLC 30 turns on and off the motor 28 to control the operations (forward, backward, stop, etc.) of the transport rollers 22 and 24.

  First, in the load part 302 shown in FIG. 1, the plate-shaped workpiece 10 which is the object of the plating process is attached to the transport hanger 16 (state shown in FIG. 2) by an operator or an attachment device (not shown).

  Thereafter, when the operator depresses a transfer switch (not shown), the transfer hanger 16 moves along the guide rails 12 and 14 into the first washing tank 304. That is, the PLC 30 turns on the motor 28 to drive the transport rollers 22 and 24 forward.

  Next, in the 1st washing tank 304, a water washing process is performed by applying water to the plate-shaped workpiece 10 from both front and back surfaces. The transport hanger 16 stops for a predetermined time in the first water washing tank 304 and then moves into the desmear tank 306.

  For example, the PLC 30 stops the motor 28 for one minute after receiving a signal indicating that the magnetic sensor 19 has reached the center of the first washing tank 304. Thereafter, the motor 28 is turned on to drive the transport rollers 22 and 24 forward. The same control is performed in the second water washing tank 308, the third water washing tank 312 and the fourth water washing tank 314.

  In the desmear tank 306, the transport hanger 16 is stopped for a predetermined time (for example, 5 minutes), and desmear treatment liquid (swelling liquid, resin etching liquid, neutralizing liquid, etc.) is applied to the plate-like workpiece 10 from both the front and back surfaces. . Here, the desmear process is a process of removing smear (resin) at the time of processing remaining when a hole is made in the plate-like workpiece 10 or the like.

  For example, after receiving a signal indicating that the PLC 30 has reached the center of the desmear tank 306 from the magnetic sensor 19, the PLC 30 stops the motor 28 for 5 minutes. Thereafter, the motor 28 is turned on to drive the transport rollers 22 and 24 forward. The same control is performed in the following pretreatment tank 310.

  Next, in the 2nd water-washing tank 308, a water-washing process is performed by applying water to the plate-shaped workpiece 10 from both front and back surfaces. The transport hanger 16 stops for a predetermined time (for example, 1 minute) in the second washing tank 308 and then moves into the pretreatment tank 310.

  In the pretreatment tank 310, the transport hanger 16 is stopped for a predetermined time (for example, 5 minutes), and the pretreatment liquid is applied to the plate-like workpiece 10 from both the front and back surfaces.

  Next, in the 3rd water-washing tank 312, the water washing process is performed by applying water to the plate-shaped workpiece 10 from both front and back surfaces. The transport hanger 16 stops in the third washing tank 312 for a predetermined time (for example, 1 minute).

  Then, the following reciprocation is performed a predetermined number of times before moving into the electroless copper plating tank 200 (FIGS. 3 and 4). When holes such as through holes are formed in the plate-like workpiece 10, air (bubbles) accumulates there and there is a possibility that the treatment liquid Q does not adhere to the plate-like workpiece 10. Therefore, before performing the electroless copper plating treatment This is because air (bubbles) needs to be reliably removed.

  FIG. 9B shows a cross-sectional view of the guide rail 14 between the third washing tank 312 and the electroless copper plating tank 200 (FIG. 1). As shown in FIGS. 9B and 1, the guide rail 14 is provided with one convex portion 26 that is an impact generating portion. The treatment liquid Q can be drained by the impact of the transport roller 24 over the convex portion 26.

  For example, the PLC 30 receives the signal indicating that the magnet 21 shown in FIG. 9B has reached the center from the magnetic sensor 19 (that is, the transport roller 24 has passed over the convex portion 26), and then the transport roller 22, 24 is moved. The motor 28 is controlled so as to be driven backward by a predetermined distance (Y1 direction shown in FIG. 9B). Thereafter, the transport rollers 22 and 24 are driven forward until the magnet 21 is detected again (Y2 direction shown in FIG. 9B). After the above-described back-and-forth movement is repeated a predetermined number of times (for example, three reciprocations), the movement is stopped at the center position (FIG. 4) in the electroless copper plating tank 200.

  In the electroless copper plating tank 200, the transport hanger 16 is stopped for a predetermined time, and the electroless copper plating solution is applied to the plate-like workpiece 10 from both the front and back surfaces.

  For example, after receiving a signal indicating that the PLC 30 has reached the center of the electroless copper plating tank 200 from the magnetic sensor 19, the PLC 30 stops the motor 28 for 5 minutes. Thereafter, the motor 28 is turned on to drive the transport rollers 22 and 24 forward.

  Next, in the 4th water-washing tank 314, a water-washing process is performed by applying water to the plate-shaped workpiece 10 from both front and back surfaces. The transport hanger 16 stops for a predetermined time (for example, 1 minute) in the fourth washing tank 314 and then moves to the unload unit 316.

  Finally, the transport hanger 16 moved to the unload unit 316 is stopped. For example, the PLC 30 stops the motor 28 after receiving a signal indicating that the magnetic sensor 19 has reached the unload unit 316. Thereafter, the plate-shaped workpiece 10 is removed from the transport hanger by an operator or the like. Thereby, a series of processes of the electroless plating process is completed.

3. Structures of other plating tanks 201 and 202 (a) In the above embodiment, the treatment liquid Q that has fallen along the plate-like workpiece 10 is prevented from being scattered vertically below the transport hanger 16 as shown in FIG. You may make it receive with a member. FIG. 10 is a view showing an embodiment in which a scattering prevention member 60 is added to the plating tank 200 of FIG.

  Thereby, it is possible to prevent the processing liquid from splashing from the conveying slit of the plate-shaped workpiece and the processing liquid from splashing back to the plate-shaped workpiece. For example, a sponge, a filter, a fibrous material (chemical fiber lock (trademark) manufactured by Toyo Cushion Co., Ltd.) made of a resin excellent in chemical resistance and heat resistance can be used.

  FIG. 11 shows the structure of the scattering prevention member 60 and the movement of the treatment liquid Q.

  As shown in FIG. 11, the anti-scattering member 60 is attached while being held from below by a support portion 62 having a net material. For this reason, after falling processing liquid Q is received by scattering prevention member 60, it penetrates scattering prevention member 60 and falls to the lower liquid level. When dropped on the liquid surface, the rebound is received by the lower surface of the anti-scattering member 60 and therefore does not reach the plate-like workpiece 10.

(B) In the above embodiment, the treatment liquid Q that has fallen along the plate-like workpiece 10 is stored in the tank body 2, but as shown in FIG. 12, a liquid storage tank that communicates with the bottom of the tank body 2. 3 may be provided separately, and the processing liquid Q may be stored in the liquid storage tank 3.

  FIG. 12 is a view showing an embodiment in which the liquid storage tank 3 is added to the plating tank 201 of FIG. In addition, in this embodiment, it differs from what is shown in FIG. 10 by the point which has arrange | positioned the scattering prevention member 60 on the bottom part 2c of the tank body 2 directly.

  The bottom 3c of the liquid storage tank provided in the plating tank 202 is provided at a position lower than the bottom 2c of the tank body. Thereby, the processing liquid Q can be automatically poured into the inside. By arranging the side storage portion in communication with the bottom of the processing tank and adjacent thereto, the devices S such as a heater, a level sensor, and a stirrer can be easily attached to the upper surface 3d of the side storage portion. In FIG. 12, the device S is detachably inserted into the upper surface 3 d of the liquid storage tank 3 while being fixed to the ring G so as not to fall. For this reason, it can be removed immediately at the time of maintenance (for example, removing the plating attached to the heater). In addition, in the structure shown in FIG. 12, the scattering prevention member 60 does not need to be provided.

4). Other Embodiments In the above-described embodiment, the liquid ejecting portion 4 is attached to the tank body 2, but the liquid ejecting portion 4 may be attached to the frames 52, 54, and the like.

  In addition, in the said embodiment, although the jet nozzle 6 was comprised by the round hole, you may comprise by other shapes, such as a polygon. For example, as shown in FIG. 21, the jet outlet 6 'may be constituted by a slit having a long hole.

  In the above-described embodiment, the plurality of jet nozzles 6 are provided in the liquid jet section 4, but a plurality of nozzles N each having the jet nozzle 6 are arranged on the mounting plate W as shown in FIG. May be configured.

  In the above-described embodiment, the liquid ejection part 4 is configured by a pipe having a circular cross section, but the cross section may be configured by a pipe having another shape such as a quadrangle.

  In addition, in the said embodiment, although the liquid ejection part 4 was rotated and the angle of the ejection port 6 was changeable, as shown to FIG. 14A and B, the hole (corresponding to the angle of several steps | paragraphs in the liquid ejection part 4a ( 6a, 6b, 6c) are provided, and the angle of the jet nozzle 6 is changed by rotating the cover 4b (having the slit 6 ") covering the liquid jet part 4a fitted so as to slide on the outer periphery thereof. 14B is a cross-sectional view in the vicinity of the holes 6a, 6b, and 6c of the liquid ejection portion 4a shown in FIG.

  In addition, in the said embodiment, although the angle of the current transformation member 40 was fixed, you may attach the angle of the current transformation member 40 variably.

  In addition, although the said embodiment demonstrated the horizontal movement type surface treatment apparatus, you may apply to a descent | fall type surface treatment apparatus.

  In the above embodiment, the surface treatment apparatus 300 includes a plurality of tanks (the first washing tank 304, the desmear tank 306, the pretreatment tank 310, the electroless copper plating tank 200, etc. shown in FIG. 1). The surface treatment apparatus 300 may be configured to include at least one tank among these.

  In the above embodiment, only one liquid ejection part 4 is provided in the tank body 2, but a plurality of liquid ejection parts 4 may be provided. FIG. 15 shows an example of an electroless copper plating tank 200 ′ in which four stages of liquid ejection portions 4 are provided in four stages in the vertical direction.

  In the above embodiment, the surface treatment apparatuses 300 are arranged in one row in the transport direction X. However, as shown in FIG. 16, the surface treatment apparatuses 300 may be arranged in a plurality of rows adjacent to each other. Further, as shown in FIG. 16, a guide rail 14 ′ may be shared between these adjacent surface treatment apparatuses 300.

  Further, as shown in FIG. 22, the surface treatment apparatus is provided with a plurality of transport hangers 16 and notches 8 adjacent to each other in one tank body 2 ′ without providing the guide rail 14 ′ shown in FIG. May be configured. In this case, the liquid ejection parts 4a at both ends in the tank body 2 'may be attached to the side wall 2a, and the liquid ejection parts 4b at the center in the tank body 2 may be attached to the side wall 2b.

  In the above embodiment, the plurality of tanks constituting the surface treatment apparatus 300 are arranged on a straight line, but a moving mechanism such as a traverser is provided, and the plurality of tanks are formed in a U shape, a B shape, or an L shape. They may be arranged side by side on the mold.

  In the above embodiment, the convex portion 26 (FIG. 9B) is provided only on the guide rail 14 on one side, but the convex portion 26 may be provided on the guide rails 12 and 14 on both sides.

  In the above embodiment, the projection 26 (FIG. 9B) is provided on the guide rail 14 to generate the impact. However, the impact may be generated by another structure (for example, a recess). Good.

  In the above embodiment, one convex portion 26 (FIG. 9B) is provided on the guide rail 14, but a plurality of convex portions may be provided on the guide rail 14. Moreover, although the convex part 26 (FIG. 9B) was provided between the 3rd washing tank 312 and the electroless copper plating tank 200 (FIG. 1), you may provide the convex part 26 in another position.

  In the above-described embodiment, the transport roller 24 is controlled to reciprocate on the convex portion 26 (FIG. 9B). Good. For example, you may control so that the conveyance roller 24 (FIG. 9B) moves on the some convex part 26 provided in the guide rail 14 in a straight line.

  In the above embodiment, the conveyance roller 24 is controlled to reciprocate three times on the convex portion 26, but certain conditions are satisfied (for example, smears and bubbles are reliably removed from the plate-like workpiece 10). This may be reciprocated until it is detected by photographing the camera and recognizing the image).

  In the above embodiment, the plate-like workpiece 10 is conveyed into the tank body 2 in a state where the circulation pump 50 is always operated and the treatment liquid Q is always ejected from the ejection port 6 of the liquid ejection part 4. Or although it carried out to the tank body 2, it is not restricted to this. For example, when the plate-like workpiece 10 is stopped, the power of the circulation pump 50 is turned on to eject the processing liquid Q from the ejection port 6 of the liquid ejection unit 4, and while the plate-like workpiece 10 is moving, the circulation pump 50. It may be controlled so that the processing liquid Q is not ejected from the ejection port 6 of the liquid ejection part 4 by turning off the power source.

  In the above embodiment, PVC is used as the material of the tank body 2, but other materials (for example, PP, FRP, PPS resin, PTFE, stainless steel, etc.) may be used.

  In the above embodiment, the plate-like workpiece 10 is subjected to electroless copper plating by the surface treatment apparatus 300. However, the plate-like workpiece 10 is subjected to other electroless plating (for example, electroless nickel plating, electroless tin). Plating, electroless gold plating, etc.) may be performed.

  In the above embodiment, only the upper end of the plate-like workpiece 10 is gripped by the transport hanger 16 (FIG. 2), but a weight is attached to the lower portion of the plate-like workpiece 10 or a frame as shown in FIG. The plate-like workpiece 10 may be conveyed by being gripped by the upper end clamp 15 ′ and the lower end clamp 15 ″ of the plate-like workpiece 10 by the conveyance hanger 16 ′ having the body 17. As shown in FIG. Rotating roller standing bodies 70 and 72 that limit the movement of the plate-like work 10 may be disposed in the vicinity of the slit 8 in the tank body 2 so as to prevent the plate-like workpiece 10 from being shaken during the conveyance.

  In the above-described embodiment, the transport hangers 16 are transported by driving the transport rollers 22 and 24 of the transport mechanism 18 with a motor. However, a driving method such as a pusher, a chain, or a linear motor type transport mechanism is used. You may convey the hanger 16 for conveyance using it.

  In the above embodiment, the treatment liquid Q is applied to both the front and back surfaces of the plate-like workpiece 10 (FIG. 6B), but the treatment liquid Q may be applied to only one side of the plate-like workpiece 10.

  In the above-described embodiment, the predetermined position on the guide rails 12 and 14 is detected using the magnetic sensor. However, the predetermined position may be detected using another sensor (such as a barcode reader).

  In the above embodiment, the object to be processed is the rectangular plate-shaped workpiece 10, but the object to be processed may have other shapes (for example, a spherical shape, a rod shape, a cube, etc.).

Claims (20)

A transport hanger for transporting an object to be processed while being held in a vertical direction;
Inside, a tank body for flowing a treatment liquid to the object to be processed conveyed by the conveying hanger and performing surface treatment,
A liquid jetting part that jets the processing liquid obliquely upward with respect to a horizontal plane toward the object to be processed from a jet port, and abuts on the upper part of the object to be processed as a liquid flow;
A transport mechanism for transporting the transport hanger into the tank;
In a surface treatment apparatus comprising:
The treatment liquid ejected from the liquid ejection part is set so as to hit the same part on both surfaces of the object to be treated, and the treatment liquid flows downward from the part where the treatment liquid has come into contact with the object to be treated. Surface treatment of the object to be processed without immersing it in the treatment liquid,
The liquid ejection part includes a pipe member having a space inside,
The surface treatment apparatus, wherein the ejection port is configured by a long hole extending in a longitudinal direction of the tube member. A transport hanger for transporting an object to be processed while being held in a vertical direction;
Inside, a tank body for flowing a treatment liquid to the object to be processed conveyed by the conveying hanger and performing surface treatment,
A liquid jetting part that jets the processing liquid obliquely upward with respect to a horizontal plane toward the object to be processed from a jet port, and abuts as a liquid flow on the upper part of the object to be processed;
A transport mechanism for transporting the transport hanger into the tank;
In a surface treatment apparatus comprising:
The treatment liquid ejected from the liquid ejection part is set so as to hit the same part on both surfaces of the object to be treated, and the treatment liquid flows downward from the part where the treatment liquid has come into contact with the object to be treated. Surface treatment of the object to be processed without immersing it in the treatment liquid,
The surface treatment apparatus further comprising a scattering prevention member provided vertically below the transport hanger. A transport hanger for transporting an object to be processed while being held in a vertical direction;
Inside, a tank body for flowing a treatment liquid to the object to be processed conveyed by the conveying hanger and performing surface treatment,
A liquid ejecting portion for ejecting the processing liquid obliquely upward with respect to a horizontal plane toward the object to be processed from a spout, and moving the processing liquid on a parabola to contact the object to be processed;
A transport mechanism for transporting the transport hanger into the tank;
In a surface treatment apparatus comprising:
The treatment liquid ejected from the liquid ejection part is set so as to hit the same part on both surfaces of the object to be treated, and the treatment liquid flows downward from the part where the treatment liquid has come into contact with the object to be treated. Surface treatment of the object to be processed without immersing it in the treatment liquid,
The liquid ejection part includes a pipe member having a space inside,
The surface treatment apparatus, wherein the ejection port is configured by a long hole extending in a longitudinal direction of the tube member. A transport hanger for transporting an object to be processed while being held in a vertical direction;
Inside, a tank body for flowing a treatment liquid to the object to be processed conveyed by the conveying hanger and performing surface treatment,
A liquid ejecting portion for ejecting the processing liquid obliquely upward with respect to a horizontal plane toward the object to be processed from a spout , and moving the processing liquid on a parabola to contact the object to be processed;
A transport mechanism for transporting the transport hanger into the tank;
In a surface treatment apparatus comprising:
The treatment liquid ejected from the liquid ejection part is set so as to hit the same part on both surfaces of the object to be treated, and the treatment liquid flows downward from the part where the treatment liquid has come into contact with the object to be treated. Surface treatment of the object to be processed without immersing it in the treatment liquid,
The surface treatment apparatus further comprising a scattering prevention member provided vertically below the transport hanger. A transport hanger for transporting an object to be processed while being held in a vertical direction;
Inside, a tank body for flowing a treatment liquid to the object to be processed conveyed by the conveying hanger and performing surface treatment,
A liquid ejection part for ejecting the treatment liquid obliquely upward with respect to a horizontal plane from the ejection port toward the object to be treated;
A transport mechanism for transporting the transport hanger into the tank;
In a surface treatment apparatus comprising:
The treatment liquid ejected from the liquid ejection part is set so as to hit the same part on both surfaces of the object to be treated, and the treatment liquid flows downward from the part where the treatment liquid has come into contact with the object to be treated. Surface treatment of the object to be processed without immersing it in the treatment liquid,
The treatment liquid ejected obliquely upward from the ejection port moves on a parabola, and the ejection angle of the treatment liquid is set so that the treatment liquid hits the object to be treated near the top of the parabola,
A surface treatment apparatus characterized by the above. In the surface treatment apparatus of Claim 5,
The liquid ejection part includes a pipe member having a space inside,
The spout is composed of a long hole extending in the longitudinal direction of the tube member;
A surface treatment apparatus characterized by the above. The surface treatment apparatus according to claim 5 or 6, further comprising:
A scattering prevention member provided vertically below the transport hanger;
A surface treatment apparatus characterized by the above. In the surface treatment apparatus in any one of Claims 1-7,
The liquid ejection part includes a pipe member having a space inside,
The spout is composed of a plurality of holes arranged at predetermined intervals in the longitudinal direction of the pipe member;
A surface treatment apparatus characterized by the above. In the surface treatment apparatus in any one of Claims 1-8,
A current transformation member is attached to the outer periphery of the liquid ejection part so as to cover the ejection port,
The treatment liquid ejected from the ejection port hits the object to be treated after hitting the current transformation member;
A surface treatment apparatus characterized by the above. In the surface treatment apparatus in any one of Claims 1-9,
The jetting angle of the processing liquid jetted from the jetting port can be changed to an arbitrary angle,
A surface treatment apparatus characterized by the above. In the surface treatment apparatus in any one of Claims 1-10,
The liquid ejecting part is arranged in a plurality of stages in the tank body,
A surface treatment apparatus characterized by the above. In the surface treatment apparatus in any one of Claims 1-11,
An ejection angle of the processing liquid ejected from the ejection port is within a range of 5 ° to 85 ° upward with respect to a horizontal plane;
A surface treatment apparatus characterized by the above. In the surface treatment apparatus in any one of Claims 1-12, Furthermore,
A liquid storage tank communicating with the bottom of the tank body, the liquid storage tank having a bottom provided at a position lower than the bottom of the tank body;
A surface treatment apparatus characterized by the above. In the surface treatment apparatus according to any one of claims 1 to 13,
The tank body is provided with a notch that extends in the vertical direction and through which the workpiece is passed when the transport hanger moves.
A surface treatment apparatus characterized by the above. Inside, a tank body for attaching the processing liquid to the object to be processed held in the vertical direction,
A liquid ejection part that ejects the treatment liquid obliquely upward with respect to a horizontal plane toward the object to be treated from the ejection port and abuts as a liquid flow on the upper part of the object to be treated is fixed to a predetermined position on the inner wall,
The treatment liquid ejected from the liquid ejection part is set so as to hit the same part on both surfaces of the object to be treated, and the treatment liquid flows downward from the part where the treatment liquid has come into contact with the object to be treated. Surface treatment of the object to be processed without immersing it in the treatment liquid,
The liquid ejection part includes a pipe member having a space inside,
The tank body is characterized in that the jet port is constituted by a long hole extending in a longitudinal direction of the pipe member. Inside, a tank body for attaching a processing liquid to an object to be processed which is held in a vertical direction on a transfer hanger,
A liquid ejection part that ejects the treatment liquid obliquely upward with respect to a horizontal plane toward the object to be treated from the ejection port and abuts as a liquid flow on the upper part of the object to be treated is fixed to a predetermined position on the inner wall,
The treatment liquid ejected from the liquid ejection part is set so as to hit the same part on both surfaces of the object to be treated, and the treatment liquid flows downward from the part where the treatment liquid has come into contact with the object to be treated. Surface treatment of the object to be processed without immersing it in the treatment liquid,
A tank body further comprising a scattering prevention member provided vertically below the transport hanger. Inside, a tank body for attaching the processing liquid to the object to be processed held in the vertical direction,
A liquid ejection part that ejects the treatment liquid obliquely upward with respect to a horizontal plane toward the object to be treated from the ejection port and abuts as a liquid flow on the upper part of the object to be treated is fixed to a predetermined position on the inner wall,
The treatment liquid ejected from the liquid ejection part is set so as to hit the same part on both surfaces of the object to be treated, and the treatment liquid flows downward from the part where the treatment liquid has come into contact with the object to be treated. Surface treatment of the object to be processed without immersing it in the treatment liquid,
The treatment liquid ejected obliquely upward from the ejection port moves on a parabola, and the ejection angle of the treatment liquid is set so that the treatment liquid hits the object to be treated near the top of the parabola,
A tank body characterized by. An ejection device for attaching a treatment liquid to an object to be treated held in a vertical direction,
A spout for ejecting the supplied processing liquid toward the object to be processed and contacting the upper part of the object to be processed as a liquid flow;
From the jet outlet, the processing liquid is jetted obliquely upward with respect to a horizontal plane,
The treatment liquid ejected from the liquid ejection part is configured so as to hit the same part on both surfaces of the object to be treated, and the treatment liquid flows downward from the part where the treatment liquid has come into contact with the object to be treated. Surface treatment of the object without being immersed in
The liquid ejection part includes a pipe member having a space inside,
The jetting device is characterized in that the jetting port comprises a long hole extending in the longitudinal direction of the tube member. An ejection device for attaching a processing liquid to an object to be processed held in a vertical direction on a transport hanger,
A spout for ejecting the supplied processing liquid toward the object to be processed and contacting the upper part of the object to be processed as a liquid flow;
From the jet outlet, the processing liquid is jetted obliquely upward with respect to a horizontal plane,
The treatment liquid ejected from the liquid ejection part is configured so as to hit the same part on both surfaces of the object to be treated, and the treatment liquid flows downward from the part where the treatment liquid has come into contact with the object to be treated. Surface treatment of the object without being immersed in
An ejection device, further comprising a scattering prevention member provided vertically below the transport hanger. An ejection device for attaching a treatment liquid to an object to be treated held in a vertical direction,
A spout for ejecting the supplied processing liquid toward the object to be processed and contacting the upper part of the object to be processed as a liquid flow;
From the jet outlet, the processing liquid is jetted obliquely upward with respect to a horizontal plane,
The treatment liquid ejected from the liquid ejection part is configured so as to hit the same part on both surfaces of the object to be treated, and the treatment liquid flows downward from the part where the treatment liquid has come into contact with the object to be treated. Surface treatment of the object without being immersed in
The treatment liquid ejected obliquely upward from the ejection port moves on a parabola, and the ejection angle of the treatment liquid is set so that the treatment liquid hits the object to be treated near the top of the parabola,
A spout device characterized by.

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