JP2010267913A - Device for testing light sensor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To arrange multiple light sources at fine pitches without complicating a light-emitting device or increasing cost. <P>SOLUTION: The light-emitting device includes: a first board having a plurality of internal wires and having the thickness direction set in the vertical direction; a second board arranged on a lower side of the first board in a state where the thickness direction is made coincident with that of the first board, and having a plurality of first through-holes penetrating the second board in the vertical direction; a third board arranged on a lower side of the second board in a state where the thickness direction is made coincident with that of the second board, and having a plurality of openings penetrating the third board in the thickness direction and made to communicate with the first through-holes; and a plurality of light sources supported to the first board to generate light advancing from the first through-holes to the openings, and electrically connected to the internal wires. The plurality of light sources are arranged in a plurality of lines. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a light emitting device used for testing an optical sensor including a plurality of light receiving elements such as a CCD image sensor and a CMOS image sensor.

  In general, an optical sensor such as a CCD image sensor or a CMOS image sensor is tested to determine whether each light receiving element receives light correctly. As one of this type of test apparatus, there is a technique in which light from a light emitting element is irradiated onto a light receiving element, the light is detected by the light receiving element, and the quality of the optical sensor is determined using the output signal of each light receiving element. There is (for example, Patent Document 1).

  The above prior art is arranged in the probe card portion so that the plate-like probe card portion having a through hole penetrating in the thickness direction and the light receiving element of the optical sensor is irradiated with light through the through hole of the probe card portion. Light source unit.

  In the above prior art, the light source unit includes a cylindrical member having an open part and a bottom, and a light emitting element arranged at the bottom of the cylindrical member, and the open part of the cylindrical member is aligned with the through hole of the probe card part. In addition, the light emitting element is disposed on the upper side of the probe card portion so that light from the light emitting element is emitted below the probe card portion.

  However, in the conventional technique using the light source unit as described above, the cylindrical member is large, and it is difficult to arrange a large number of light source units at a minute pitch. For this reason, in the above prior art, it is only possible to arrange several light source units on the probe card unit, and as a result, a large number of optical sensors provided on a sensor substrate such as one semiconductor wafer. It can only be tested in batches.

JP 2006-349522 A

  An object of the present invention is to make it possible to arrange a large number of light sources at a minute pitch without causing complication and cost increase of a light emitting device.

  A light-emitting device according to the present invention is a first substrate having a plurality of internal wirings, the first substrate having a thickness direction set to the up-down direction, and the thickness direction matched with the first substrate. A second substrate disposed under the first substrate, wherein the second substrate has a plurality of first through holes penetrating the second substrate in the vertical direction; A third substrate disposed on the lower side of the second substrate in a state in which the vertical direction coincides with the second substrate, penetrating the third substrate in the thickness direction, and A third substrate having a plurality of openings communicated with the first through hole, and a plurality of light sources supported by the first substrate so as to generate light from the first through hole toward the opening. And a plurality of light sources electrically connected to the internal wiring. The plurality of light sources are arranged in a plurality of rows.

  The light-emitting device according to the present invention further includes a plurality of contacts disposed on the wiring board, each of which is electrically connected to the internal wiring and is in contact with the electrode of the photosensor. A plurality of contacts having a needle tip can be included.

  The second substrate may further include a plurality of second through holes that penetrate the second substrate in the vertical direction and communicate with the opening, and each contactor has the second through hole. It may penetrate the hole and the opening, and the needle tip may protrude below the third substrate.

Each contact includes an upper member, a lower member, and a spring that biases the upper member and the lower member in a direction in which they are separated from each other, and the upper member is pressed against the lower surface of the first substrate, The lower member may protrude below the third substrate.

  The second substrate includes an upper plate disposed on the lower surface of the first substrate, a plate-shaped housing disposed on the lower surface of the upper plate, and a lower plate disposed on the lower surface of the housing. Each first through hole may penetrate the upper plate housing and the lower plate.

  The first substrate may further include a plurality of connection terminals each connected to the internal wiring and connecting the internal wiring to an external electric circuit. Each light source may include a plurality of light emitting elements.

  The light emitting device according to the present invention may further include a heat radiating plate disposed on the upper side of the first substrate. The first substrate may further include a heat conduction path that transmits heat of the light source to the heat radiating plate.

  The first substrate may further include a thermo module that absorbs heat on the light source side and releases the absorbed heat to the heat radiating plate side. The first substrate may close the first through hole.

  The light emitting device according to the present invention may further include a temperature sensor disposed on the first substrate.

  For example, when a plurality of photosensors including a large number of light receiving elements are arranged in a plurality of rows on the sensor substrate, the first, second, and third substrates have first through holes, openings, and light source arrangement directions. The apertures are maintained in a state where they coincide with the arrangement direction of the light receiving elements and each opening faces the light receiving elements.

  When each light source is turned on in the above state, the light from each light source is irradiated from the first through hole to the light receiving element through the opening. Each light receiving element detects incident light and generates an electrical signal corresponding to the amount of light received. The electrical signal generated by each light receiving element is used to determine whether the optical sensor is good or bad.

  The light emitting device according to the present invention includes a first substrate on which a plurality of light sources connected to internal wiring are arranged, and a second and third substrate each having a plurality of through holes, and each light source has a first light source. The first through hole and the opening are in communication with each other, and at least a part of each light source is positioned in the first through hole.

  For this reason, according to the present invention, although the structure is simple, the manufacture is easy, and the cost is low, a large number of light source portions can be arranged at a minute pitch and in a plurality of rows. As a result, according to the present invention, a large number of optical sensors can be tested at the same time at one time, so that the time and labor required for the test are significantly reduced.

It is a top view which shows one Example of the light-emitting device based on this invention. It is a bottom view of the light-emitting device shown in FIG. It is sectional drawing obtained along the 3-3 line in FIG. It is an expanded sectional view which shows the relationship between a through-hole and the light receiver of an optical sensor. It is a figure which shows one Example of a light source. It is sectional drawing which shows one Example of a contactor. FIG. 5 is an enlarged sectional view similar to FIG. 4, showing another embodiment of the light emitting device according to the present invention. It is sectional drawing which shows the further another Example of the light-emitting device based on this invention. It is a top view which shows one Example of the optical sensor as a to-be-inspected object.

  [Explanation of terms]

  In the present invention, in FIGS. 3 and 4, the up and down direction is referred to as the up and down direction or the Z direction, the left and right direction is referred to as the left and right direction or the X direction, and the direction perpendicular to the page is referred to as the front and rear direction or the Y direction. However, these directions differ depending on the posture of the light emitting device disposed in the test apparatus and, consequently, the posture of the object to be inspected disposed on the inspection stage.

  Therefore, according to the posture of the object to be inspected during the test, the direction described above is an inclined surface in which a plane (XY plane) including the left and right direction (X direction) and the front and rear direction (Y direction) is inclined with respect to the horizontal plane and the horizontal plane , And a vertical plane perpendicular to the horizontal plane.

  [Example of light emitting device]

  As shown in FIG. 9, the light-emitting device 10 shown in FIGS. 1 to 4 has a large number of rectangular sensor chip regions, that is, photosensors 12 on a disk-like sensor substrate 14 such as a CCD wafer or a CMOS wafer. A substrate arranged in a matrix is used as an object to be inspected, and the light receiving elements in the sensor chip region 12 are tested in a plurality of times to be used in a test apparatus that determines the quality of the optical sensor 12.

  Each optical sensor 12 has a large number of light receiving elements 16 (refer to FIG. 4) configured by CCD elements, CMOS elements and the like arranged in a matrix. As shown in FIG. 6, each light receiving element 16 is electrically connected to at least one of a plurality of electrodes 14 a provided on the sensor substrate 14 via a wiring 14 b provided on the sensor substrate 14.

  The sensor substrate 14 is releasably adsorbed to a work table of the test apparatus, that is, the inspection stage 18 (see FIGS. 3 and 4), and each sensor chip region 12 is tested in this state.

  1 to 4, the light emitting device 10 includes a plurality of optical sensors on the sensor substrate 14 together with the inspection stage 18 (see FIGS. 3 and 4) and an electric circuit (not shown) that receive the sensor substrate 14. Used in 12 test devices.

  The light-emitting device 10 has first, second, and third substrates 20, 22, and 24, each having an upper surface and a lower surface, stacked one above the other so that their thickness directions are in the vertical direction. A plurality of light sources 26 are arranged in a plurality of rows, preferably in a matrix, on the lower surface of the first substrate 20, and a plurality of contacts 28 are supported by the second substrate 22.

  In the illustrated example, the first, second and third substrates 20, 22 and 24 have disk-like shapes having the same diameter dimension. However, the first, second and third substrates 20, 22 and 24 do not need to have the same size, and have other shapes such as rectangles, octagons and other polygons in plan view. You may have.

  As shown in FIG. 4, the first substrate 20 includes a plurality of first internal wirings 30 electrically connected to the light source 26 and a plurality of second internal wirings electrically connected to the contacts 28. 32 is a wiring board having multiple layers.

  On the upper surface of the first substrate 20, a plurality of connectors 34 connected to the above-described electric circuit of the test apparatus are arranged on the outer peripheral edge, and a plurality of heat radiating plates 36 are arranged inside the arrangement area of the connectors 34. They are arranged in the region (see FIG. 1 for both).

  Each connector 34 is electrically connected to the first or second internal wiring 30 or 32, and has a plurality of connection terminals (not shown) that connect the internal wiring 30 or 32 to the above-described electric circuit. . Instead of the connection terminals of the connector 34, a plurality of connection lands may be arranged on the first substrate 20 as connection terminals in the present invention.

  Each connector 34 is detachably attached to the first substrate 20 by a plurality of screws 38 (see FIG. 1) that pass through the connector 34 from above and are screwed to the first substrate 20.

  Each heat radiating plate 36 is a known one having a plurality of heat radiating fins 36 b protruding upward from the upper surface of the plate-like base 36 a, and the lower surface is in contact with the upper surface of the first substrate 20. It is removably attached to the upper surface of one substrate 20.

  The second substrate 22 has a plurality of first through holes 40 penetrating in the thickness direction and a plurality of second through holes 42 penetrating in the thickness direction. Each light source 26 is received in the first through hole 40, and each contact 28 is disposed in the second through hole 42.

  In the illustrated example, the second substrate 22 includes an upper plate 44 disposed on the lower surface of the first substrate 20, a plate-like housing 46 disposed on the lower surface of the upper plate 44, and a lower surface disposed on the housing 46. The upper plate 44 is detachably attached to the lower surface of the first substrate 20 with the upper surface of the upper plate 44 in contact with the lower surface of the first substrate 20.

  The upper plate 44, the housing 46, and the lower plate 48 form first and second through holes 40 and 42 together. Each of the through holes 40 and 42 passes through the upper plate 44, the housing 46 and the lower plate 48. Each first through hole 40 has a rectangular or circular shape. However, each second through hole 42 has a circular shape.

  As shown in FIG. 6, the diameter dimension of the hole portions 42 a and 42 c of the upper plate 44 and the lower plate 48 among the second through holes 42 is smaller than the diameter dimension of the hole portion 42 b of the housing 46.

  The third substrate 24 is a light shielding plate having a plurality of rectangular openings 50 that penetrate the third substrate 24 in the thickness direction and communicate with the through holes 40 and 42 of the first substrate 20. It is made of an elastically deformable material such as rubber.

  In the first, second and third substrates 20, 22 and 24, the first and second through holes 40 and 42 communicate with the opening 50, and the first substrate 20 closes the first through hole 40. In this way, they are stacked and separably connected.

  As shown in FIG. 5, each light source 26 has three types of light emitting elements 52R, 52G, and 52B arranged on the bottom surface of a bottomed hole 56 that is provided in the holder 54 and opens downward, and these light emitting elements 52R and 52G. , 52B is arranged in the open portion of the bottomed hole 56 to converge the light from the 52B.

  The light emitting elements 52R, 52G, and 52B are LEDs that generate red, green, and blue light, respectively, and the amount of light emitted by each light emitting element is controlled by the above-described electric circuit, so that an appropriate composite color can be obtained. Generate light.

  As shown in FIG. 4, most of each light source 26 as described above is located in the first through hole 40, and light from the light emitting elements 52 </ b> R, 52 </ b> G, 52 </ b> B is transmitted from the first through hole 40. It is supported on the lower surface of the first substrate 20 so as to face the opening 50.

  The plurality of light sources 26 as described above are arranged in a plurality of rows, preferably in the same state as the arrangement of the light receiving elements 16 on the sensor substrate 14, similarly to the light receiving elements 16 on the sensor substrate 14.

  As shown in FIG. 6, each contact 28 is disposed in the upper member 28 a, the lower member 28 c, and the hole 42 b of the housing 46, and compresses the members 28 a and 28 c in a direction in which they are separated from each other. The pogo pin includes a coil spring 28b.

  The upper member 28 a has a flange portion positioned in the hole portion 42 b of the housing 46 and a terminal portion that extends upward from the flange portion and is inserted into the hole portion 42 a of the upper plate 44 from below. The lower member 28 c has a flange portion positioned in the hole portion 42 b of the housing 46 and a needle tip portion that extends downward from the flange portion and is inserted into the hole portion 42 c of the lower plate 48.

  The flange portions of both the members 28a and 28c are pressed against the upper plate 44 or the lower plate 48 by the spring 28b, and are prevented from falling off from the second through hole 42. The terminal portion of the upper member 28 a is pressed by a connection land (not shown) provided on the lower surface of the first substrate 20 and electrically connected to the internal wiring 32. The needle tip portion of the lower member 28c protrudes downward from the opening 50 of the third substrate 24, and the lower end is pressed against the electrode 14a (see FIG. 6) on the upper surface of the sensor substrate 14 during the test.

  [Test method using light emitting device]

  The sensor substrate 14 is arranged on the inspection stage 18, and in order to test the first plurality (the same number as the light sources 26) of the light receiving elements 16, the inspection stage 18 is moved in the XY direction and the θ axis extending in the vertical direction. Is rotated angularly around.

  Accordingly, the arrangement direction of the light receiving elements 16 is set as the arrangement direction of the light sources 26, the light receiving elements 16 are opposed to the light sources 26, and the electrode 14a of the sensor board 14 is in contact with the needle tip of the contact 28. 14 is maintained in the test apparatus. As a result, each light receiving element 16 is positioned at the lower end of the opening 50.

  Next, the inspection stage 18 is raised, whereby the third substrate 48 is pressed against the upper surface of the sensor substrate 14, and the needle tips of the respective contacts 38 are pressed against the electrodes 14 a of the sensor substrate 14.

  Next, each light source 26 is turned on by a lighting command signal from the electric circuit described above. Thereby, the light from the light source 26 is irradiated to the corresponding light receiving element 16 from the corresponding first through hole 40 and the opening 50, and each light receiving element 16 outputs an electrical signal corresponding to the amount of received light.

  However, when each sensor substrate 14 is for color, each light receiving element 16 generally has an R pixel area (R light receiving element), a G pixel area (G light receiving element), and a B pixel area (B Light receiving element) for each color.

  If each sensor substrate 14 is for color, each light receiving element 16 generates an electrical signal corresponding to the hue and intensity of the incident light, and outputs the electrical signal to the electrical circuit described above. The electric signal from each light receiving element 16 is based on the input electric signal in the electric circuit, and whether or not the corresponding light receiving element 16 generates an electric signal indicating the correct hue and intensity (whether the light receiving element 16 is correct or not). That is, it is used to determine whether the optical sensor 12 is good or bad.

  When testing of all the light receiving elements 16 is completed in one test, testing of one sensor substrate 14 is completed. However, when there is an untested light receiving element 16, the light emitting device 10 and the sensor substrate 14 are relatively moved so that they are in a predetermined positional relationship until all the light receiving elements 16 are tested. The above test process is repeated in the state.

  Instead of moving the sensor substrate 14 with respect to the light emitting device 10 in the XYZ directions with respect to the light emitting device 10 as described above, the light emitting device 10 may be moved with respect to the sensor substrate 14 in the XYZ directions with another moving mechanism.

  As described above, when the lower surface of the third substrate 24 is in contact with the upper surface of the sensor substrate 14, the first, second and third substrates 20, 22 and 24, the upper plate 44, the housing 46 and Since the lower plate 48 is laminated, it is possible to reliably prevent external light and light from the adjacent light source 26 from entering the first through hole 40 and the opening 50. Can be confirmed more accurately.

  According to the light emitting device 10, although the structure is simple, the manufacturing is easy, and the cost is low, a large number of light sources 26 can be arranged at a minute pitch and in a plurality of rows. As a result, since a large number of optical sensors 12 can be tested simultaneously at one time, the time and labor required for the test are significantly reduced.

  [Other Examples of Light-Emitting Device]

  In the light emitting device 60 shown in FIG. 7, the first substrate 20 is provided with a heat conduction path 62 that transmits heat generated by each light source 26 to the heat radiating plate 36. Each heat conduction path 62 is made of a material having high thermal conductivity, penetrates the first substrate 20 in the thickness direction, and has its upper end and lower end in contact with the heat radiating plate 36 and the light source 26, respectively. Yes. For this reason, even if the thermal conductivity of the first substrate 20 is low, the heat from each light source 26 is efficiently and effectively radiated to the outside.

  A light emitting device 70 shown in FIG. 8 includes a temperature sensor 72 that detects the temperature of the first substrate 20, a thermo module 74 that absorbs heat on the light source 26 side, and releases the absorbed heat to the heat radiating plate 36 side. Is disposed on the first substrate 20.

  The detection signal of the temperature sensor 72 is supplied to the electric circuit described above, and when the first substrate 20 exceeds the allowable temperature, it is used to blow air from the external blower to the heat radiating plate 26 and cool the heat radiating plate 26. It is done. However, the thermo module 74 may be connected to the electric circuit described above, and the thermo module 74 may be controlled by the electric circuit using the detection signal of the temperature sensor 72.

  In any case, according to the light emitting device 70, even if the thermal conductivity of the first substrate 20 is low, the heat from each light source 26 is efficiently and effectively dissipated to the outside.

  The present invention is not only for testing the optical sensor 12 disposed on the sensor substrate 14 but also for a light emitting device for testing other optical sensors such as a plurality of optical sensors disposed on another substrate such as a wiring substrate. It can also be applied.

  Further, the present invention can be applied not only to the optical sensor 14 provided with the contact 28 for each light receiving element 16 but also to the optical sensor provided with the common contact 28 for each of the plurality of light receiving elements 16.

  As described above, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit described in the claims.

10, 60, 70 Light emitting device 12 Optical sensor 14 Sensor substrate 14a Electrode of sensor substrate 16 Light receiving element 18 Inspection stage 20, 22, 24 First, second and third substrates 26 Light source 28 Contact 28b Spring 30, 32 Inside Wiring 34 Connector 36 Heat sink 40, 42 First and second through holes 44 Upper plate 46 Housing 48 Lower plate 50 Opening 52R, 52G, 52B Light emitting element 62 Thermal conduction path 72 Temperature sensor 74 Thermo module

Claims (12)

A first substrate having a plurality of internal wirings, the first substrate having a vertical direction in the thickness direction;
A second substrate disposed below the first substrate in a state where the thickness direction coincides with the first substrate, and a plurality of second substrates penetrating through the second substrate in the vertical direction A second substrate having one through hole;
A third substrate disposed below the second substrate in a state in which the thickness direction coincides with the second substrate, and penetrates the third substrate in the thickness direction; A third substrate having a plurality of openings communicated with the first through hole;
A plurality of light sources supported by the first substrate so as to generate light from the first through hole toward the opening, and a plurality of light sources electrically connected to the internal wiring,
The light emitting device used for testing the optical sensor, wherein the plurality of light sources are arranged in a plurality of rows.   Further, a plurality of contacts disposed on the wiring board, each of which is electrically connected to the internal wiring and has a needle tip that contacts the electrode of the photosensor. The light emitting device according to claim 1, comprising: The second substrate further includes a plurality of second through holes penetrating the second substrate in the vertical direction and communicating with the opening,
3. The light-emitting device according to claim 2, wherein each contact passes through the second through hole and the opening, and the needle tip protrudes below the third substrate.   Each contact includes an upper member, a lower member, and a spring that biases the upper member and the lower member in a direction in which they are separated from each other, and the upper member is pressed against the lower surface of the first substrate, The light emitting device according to claim 3, wherein the lower member protrudes below the third substrate.   The second substrate includes an upper plate disposed on the lower surface of the first substrate, a plate-shaped housing disposed on the lower surface of the upper plate, and a lower plate disposed on the lower surface of the housing. 5. The light emitting device according to claim 1, wherein each of the first through holes penetrates the upper plate housing and the lower plate.   6. The first substrate according to claim 1, further comprising a plurality of connection terminals each connected to the internal wiring and connecting the internal wiring to an external electric circuit. Light-emitting device.   The light-emitting device according to claim 1, wherein each light source includes a plurality of light-emitting elements.   Furthermore, the light-emitting device of any one of Claim 1 to 7 containing the heat sink arrange | positioned above the said 1st board | substrate.   The light emitting device according to claim 8, wherein the first substrate further includes a heat conduction path that transmits heat of the light source to the heat radiating plate.   The light emitting device according to claim 8, wherein the first substrate further includes a thermo module that absorbs heat on the light source side and releases the absorbed heat to the heat radiating plate side.   The light emitting device according to claim 1, wherein the first substrate closes the first through hole.   Furthermore, the light-emitting device of any one of Claim 1 to 11 containing the temperature sensor arrange | positioned at the said 1st board | substrate.

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