JP2010267785A5 - - Google Patents

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Publication number
JP2010267785A5
JP2010267785A5 JP2009117666A JP2009117666A JP2010267785A5 JP 2010267785 A5 JP2010267785 A5 JP 2010267785A5 JP 2009117666 A JP2009117666 A JP 2009117666A JP 2009117666 A JP2009117666 A JP 2009117666A JP 2010267785 A5 JP2010267785 A5 JP 2010267785A5
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JP
Japan
Prior art keywords
solder
opening
side wall
jetted
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009117666A
Other languages
English (en)
Japanese (ja)
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JP2010267785A (ja
JP5410835B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009117666A priority Critical patent/JP5410835B2/ja
Priority claimed from JP2009117666A external-priority patent/JP5410835B2/ja
Priority to CN201010174193.4A priority patent/CN101888746B/zh
Publication of JP2010267785A publication Critical patent/JP2010267785A/ja
Publication of JP2010267785A5 publication Critical patent/JP2010267785A5/ja
Application granted granted Critical
Publication of JP5410835B2 publication Critical patent/JP5410835B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009117666A 2009-05-14 2009-05-14 噴流はんだ槽 Active JP5410835B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009117666A JP5410835B2 (ja) 2009-05-14 2009-05-14 噴流はんだ槽
CN201010174193.4A CN101888746B (zh) 2009-05-14 2010-05-13 喷流焊锡槽

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009117666A JP5410835B2 (ja) 2009-05-14 2009-05-14 噴流はんだ槽

Publications (3)

Publication Number Publication Date
JP2010267785A JP2010267785A (ja) 2010-11-25
JP2010267785A5 true JP2010267785A5 (enExample) 2012-05-24
JP5410835B2 JP5410835B2 (ja) 2014-02-05

Family

ID=43074396

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009117666A Active JP5410835B2 (ja) 2009-05-14 2009-05-14 噴流はんだ槽

Country Status (2)

Country Link
JP (1) JP5410835B2 (enExample)
CN (1) CN101888746B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104801809B (zh) * 2014-01-29 2018-09-14 气体产品与化学公司 用于在焊接期间提供惰性气体的设备和方法
CN108817588A (zh) * 2018-05-30 2018-11-16 苏州精美科光电材料有限公司 一种管靶贴合方法
JP7249215B2 (ja) * 2019-06-19 2023-03-30 株式会社デンソーテン はんだ付け装置およびはんだ付け装置の制御方法
CN114850714B (zh) * 2022-04-12 2023-08-08 深圳市林鑫达智能装备有限公司 一种焊接设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3705457A (en) * 1970-11-02 1972-12-12 Electrovert Mfg Co Ltd Wave soldering using inert gas to protect pretinned and soldered surfaces of relatively flat workpieces
JP3420283B2 (ja) * 1993-06-07 2003-06-23 株式会社タムラ製作所 不活性雰囲気はんだ付け装置における酸素濃度制御方法およびその装置
US5409159A (en) * 1994-02-28 1995-04-25 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Apparatus and methods for inerting solder during wave soldering operations
JP2000071066A (ja) * 1998-08-28 2000-03-07 Tokyo Seisan Giken Kk 窒素パッケージ一体型半田槽
JP2001119134A (ja) * 1999-10-22 2001-04-27 Nihon Dennetsu Keiki Co Ltd はんだ付け装置
JP2002057449A (ja) * 2000-08-11 2002-02-22 Air Liquide Japan Ltd ガス供給装置およびハンダ付け装置
JP3867511B2 (ja) * 2001-04-05 2007-01-10 スズキ株式会社 部分半田付け装置

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