JP2010258945A - Communication module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a communication module that can be made into thin shape. <P>SOLUTION: A communication module comprises: a module mounting member including a piezoelectric oscillator mounting pad provided on one principal surface so as to surround a recessed part while providing a first integrated circuit element mounting pad and the recessed part on the one principal surface; a first integrated circuit element mounted in the first integrated circuit element mounting pad; a piezoelectric oscillator mounted in the piezoelectric oscillator mounting pad, the piezoelectric oscillator including an element mounting member, a piezoelectric vibrating element mounted on one principal surface of the element mounting member, a cover member for air-tightly sealing the piezoelectric vibrating element, a second integrated circuit element mounted on another principal surface of the cover member, and a module mounting member connecting terminal provided on the other principal surface of the cover member; and a resin layer provided to cover the piezoelectric oscillator and the first integrated circuit element. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a communication module used for an electronic device or the like.

FIG. 6 is a cross-sectional view showing a conventional communication module.
As shown in FIG. 6, the conventional communication module 200 mainly includes a module mounting member 210, a piezoelectric oscillator 220, and a first integrated circuit element 230 as an example.
On one main surface of the module mounting member 210, a piezoelectric oscillator mounting pad 211 and a first integrated circuit element mounting pad 212 for mounting the piezoelectric oscillator 220 and the first integrated circuit element 230 are provided.
The module mounting member 210 has a laminated structure, and a wiring pattern (not shown) or the like is provided on the inner layer of the module mounting member 210. With this wiring pattern, the first integrated circuit element mounting pad 212 is connected to the external connection electrode terminal 214 and the piezoelectric oscillator mounting pad 211 provided on the other main surface of the module mounting member 210.
On the piezoelectric oscillator mounting pad 211 and the first integrated circuit element mounting pad 212, the piezoelectric oscillator 220 and the first integrated circuit element 230 are electrically connected through a conductive bonding material 250.
A structure is known in which a resin layer 240 is formed on the main surface of the module mounting member 210 so as to cover the mounted piezoelectric oscillator 220 and the first integrated circuit element 230 (Patent Document 1).
The piezoelectric oscillator 220 is mainly composed of an element mounting member 221, a piezoelectric vibration element 222, a lid member 223, and a second integrated circuit element 224. In the piezoelectric oscillator 220, the piezoelectric vibration element 221 is mounted in the first recessed space K1 formed in the element mounting member 221, and the second integrated circuit element 224 is mounted in the second recessed space K2. It is installed. The first recess space K1 is hermetically sealed by the lid member 223.

JP 2008-252782 A

However, in the conventional communication module 200, the piezoelectric oscillator 220 is mounted on the main surface of the module mounting member 210, and thus there is a problem that the thickness cannot be further reduced.
Further, when the piezoelectric oscillator 220 is mounted on the module mounting member 210, there is a problem that the frequency cannot be adjusted even if the oscillation frequency varies due to the influence of stray capacitance.

  This invention is made | formed in view of the said subject, and makes it a subject to provide the communication module which can be reduced in thickness.

  A communication module according to the present invention includes a piezoelectric oscillator mounting pad provided on one main surface so that a first integrated circuit element mounting pad and a recess portion are provided on one main surface so as to surround the recess portion. A mounting member, a first integrated circuit element mounted on a first integrated circuit element mounting pad, and a piezoelectric oscillator mounted on a piezoelectric oscillator mounting pad, one of the element mounting member and the element mounting member The piezoelectric vibration element mounted on the surface, the lid member for hermetically sealing the piezoelectric vibration element, the second integrated circuit element mounted on the other main surface of the lid member, and the other main surface of the lid member A piezoelectric oscillator including a module mounting member connection terminal provided, and a resin layer provided so as to cover the piezoelectric oscillator and the first integrated circuit element. Is.

  Further, the other main surface of the module mounting member is provided with a frequency adjusting write terminal for adjusting the oscillation frequency of the piezoelectric oscillator.

  According to the communication module of the present invention, the main surface of the module mounting member is provided with a recess, the piezoelectric oscillator mounting pad provided on the main surface of the module mounting member so as to surround the recess, and the piezoelectric oscillator When the module mounting member connection terminal provided on the other main surface of the lid member is joined, a part of the element mounting member of the piezoelectric oscillator is placed in the recess provided on the main surface of the module mounting member. Since it can be mounted so as to enter, the communication module can be thinned.

  In addition, since the frequency adjustment write terminal for adjusting the oscillation frequency of the piezoelectric oscillator is provided on the other main surface of the module mounting member, when the piezoelectric oscillator is mounted on the module mounting member, the stray capacitance is reduced. Even if the oscillation frequency fluctuates due to the influence, it can be adjusted.

It is a perspective view which shows an example of the communication module which concerns on embodiment of this invention. It is AA sectional drawing of FIG. It is a perspective view which shows an example in the state without the resin layer which comprises the communication module which concerns on embodiment of this invention. (A) is a perspective view which shows an example seen from one main surface of the module mounting member which comprises the communication module which concerns on embodiment of this invention, (b) is the communication module which concerns on embodiment of this invention It is a perspective view which shows an example seen from the other main surface of the module mounting member which comprises. It is sectional drawing which shows the piezoelectric oscillator which comprises the communication module which concerns on embodiment of this invention. It is sectional drawing which shows the conventional communication module.

  Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. A case where quartz is used for the piezoelectric vibration element will be described. In addition, the illustrated dimensions are partially exaggerated.

  FIG. 1 is a perspective view showing an example of a communication module according to an embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line AA of FIG. FIG. 3 is a perspective view showing an example of a state in which there is no resin layer constituting the communication module according to the embodiment of the present invention. 4A is a perspective view showing an example of the module mounting member constituting the communication module according to the embodiment of the present invention as viewed from one main surface, and FIG. 4B is an embodiment of the present invention. It is a perspective view which shows an example seen from the other main surface of the module mounting member which comprises the communication module which concerns on. FIG. 5 is a cross-sectional view showing a piezoelectric oscillator constituting the communication module according to the embodiment of the present invention.

As shown in FIGS. 1 to 3, the communication module 100 according to the first embodiment of the present invention is mainly composed of a module mounting member 110, a piezoelectric oscillator OS <b> 1, a first integrated circuit element 120, and a resin layer 130. ing.
In this communication module 100, the piezoelectric oscillator OS1 is mounted on the piezoelectric oscillator mounting pad 111 of the module mounting member 110 in which the piezoelectric oscillator mounting pad 111 and the first integrated circuit element mounting pad 112 are provided on one main surface. A first integrated circuit element 120 is mounted on the first integrated circuit element mounting pad 112. A resin layer 140 is provided so as to cover the piezoelectric oscillator OS1 and the first integrated circuit element 120.

The first integrated circuit element 120 shown in FIGS. 1 to 3 includes an RF portion, a baseband portion, and a rewritable storage medium such as a flash memory. The RF performance information is written, and the RF performance in the RF is adjusted based on the written registry information. In this way, the first integrated circuit element 120 outputs a communication signal when an oscillation frequency from a piezoelectric oscillator OS1 described later is input.
The first integrated circuit element 120 is mounted on a first integrated circuit element mounting pad 112 of the module mounting member 110 described later via a conductive bonding material 160 such as solder.

  As shown in FIG. 5, the piezoelectric oscillator OS1 is mainly configured by an element mounting member SB, a piezoelectric vibration element XT, a lid member RD, and a second integrated circuit element SS. In the piezoelectric oscillator OS1, a piezoelectric vibration element XT and a second integrated circuit element SS are mounted in a recessed space K1 formed in the element mounting member SB. The recess space K1 is hermetically sealed by the lid member RD.

As shown in FIG. 5, the piezoelectric vibration element XT is formed by adhering an excitation electrode D1 to a quartz base plate XS, and an alternating voltage from the outside is applied to the quartz base plate XS via the excitation electrode D1. Then, excitation is generated in a predetermined vibration mode and frequency.
The quartz base plate XS is a substantially flat plate shape that is cut from an artificial crystalline lens at a predetermined cut angle and is subjected to external processing, and has a planar shape of, for example, a quadrangle.
The excitation electrode D1 is formed by depositing and forming a metal in a predetermined pattern on both the front and back main surfaces of the crystal element plate XS.
Such a piezoelectric vibration element XT includes a lead electrode extending from the excitation electrode D1 attached to both main surfaces thereof, and a piezoelectric vibration element mounting pad AT (described later) formed on the inner bottom surface of the recessed space K1. It is mounted in the recess space K1 by being electrically and mechanically connected through the conductive adhesive DS.

As shown in FIG. 5, the second integrated circuit element SS is provided with an oscillation circuit or the like for generating an oscillation output from the piezoelectric vibration element XT on the circuit formation surface, and an output signal generated by this oscillation circuit. Is output to the outside of the piezoelectric oscillator OS1 via a module mounting member connection terminal MST, which will be described later, and is used as a reference signal such as a clock signal, for example.
Further, the second integrated circuit element SS is applied with a control voltage corresponding to the ambient temperature to the variable capacitance element to compensate for fluctuations in the oscillation frequency of the oscillation circuit due to temperature changes, and a cubic function generating circuit and a memory element The temperature compensation circuit unit is provided by the unit, and a temperature sensor is connected to the cubic function generation circuit.
This temperature sensor is configured to output a temperature data signal (voltage value) generated based on the detected temperature and a voltage value applied to the temperature sensor to a cubic function generation circuit.
The second integrated circuit element SS is connected to the second integrated circuit element mounting pad SP formed on the lid member RD facing the inside of the first recessed space K1 of the element mounting member SB via a conductive bonding material such as solder. It is installed.

As shown in FIG. 5, the element mounting member SB is mainly composed of a substrate part SB1 and a frame part SB2.
In the element mounting member SB, a frame portion SB2 is provided on one main surface of the substrate portion SB1, and a recessed space K1 is formed.
Two pairs of piezoelectric vibration element mounting pads AP are provided on one main surface of the substrate portion SB1 exposed in the recessed space K1.
The substrate part SB1 and the frame part SB2 constituting the element mounting member SB are formed by laminating a plurality of ceramic materials such as alumina ceramics and glass-ceramics. Further, the substrate part SB1 has a structure in which ceramic materials are laminated.
A first element connection electrode SD1 is provided on the opening side top surface of the frame portion SB2.
In addition, an annular first sealing conductor pattern HD1 is formed on the opening-side top surface of the frame portion SB2 so as to surround the outside of the position where the first element connection electrode SD1 is provided.

The lid member RD is formed by laminating a plurality of ceramic materials such as alumina ceramics and glass-ceramics.
As shown in FIG. 5, the lid member RD has a larger shape in plan view than the frame portion SB2 of the element mounting member SB.
In addition, a second integrated circuit element mounting pad SP is provided on the main surface of the lid member RD, which is a portion located in the recessed space K1 of the element mounting member 110.
A second element connection electrode SD2 is provided on the main surface of the lid member RD that faces the first element connection electrode SD1.
An annular second sealing conductor pattern HD2 is provided so as to surround the second integrated circuit element mounting pad SP and the second element connection electrode SD2.
Also, module mounting member connection terminals MTS are provided at the four corners of the main surface of the lid member RD in the outer direction of the second sealing conductor pattern HD2. This module mounting member connection terminal MTS is connected to a piezoelectric oscillator mounting pad 111 described later.
The first element connection electrode SD1 of the element mounting member SB and the element connection electrode SD2 of the lid are bonded via a conductive bonding material.
The first sealing conductor pattern HD1 of the element mounting member SB and the second sealing conductor pattern HD2 of the lid member RD are joined via the sealing member HB.
The sealing member HB is made of, for example, a brazing material such as gold tin (Au—Sn), and has a component ratio of 80% gold and 20% tin. The thickness of the sealing member HB is 10 μm to 40 μm.

  The conductive adhesive DS contains a conductive powder as a conductive filler in a binder such as a silicone resin. Examples of the conductive powder include aluminum (Al), molybdenum (Mo), tungsten ( W), platinum (Pt), palladium (Pd), silver (Ag), titanium (Ti), nickel (Ni), nickel iron (NiFe), or any combination thereof is used. Yes.

As shown in FIGS. 1 and 3, the electronic component element 130 is, for example, a chip component such as a capacitor, a resistor, or an inductor, a SAW filter, or the like.
The electronic component element 130 is mounted on an electronic component element mounting pad 113 of a module mounting member 110 described later.

The module mounting member 110 is formed of a ceramic material such as glass ceramics, alumina ceramics, mullite ceramics, and the like, and is formed in a flat plate shape.
As shown in FIG. 2 and FIG. 4A, a recess 116 is provided on one main surface of the module mounting member 110, and the element mounting member SB is accommodated in the recess 116.
A piezoelectric oscillator mounting pad 111 is provided on one main surface of the module mounting member 110 so as to surround the recess 116.
As shown in FIG. 2 and FIG. 4A, a first integrated circuit element mounting pad 112 and an electronic component element mounting pad 113 are provided on one main surface of the module mounting member 110.
As shown in FIG. 4B, an external connection electrode terminal 114 and a frequency adjustment write terminal 115 are provided on the other main surface of the module mounting member 110. In addition, a communication signal as the communication module 100 is output from one of the external connection electrode terminals 114.
A wiring pattern (not shown) or the like is provided on the inner layer of the module mounting member 110.
With this wiring pattern, the piezoelectric oscillator mounting pad 111 is provided on the first main surface of the module mounting member 110 and the other main surface of the module mounting member 110. It is connected to the frequency adjusting write terminal 115.
In addition, the first integrated circuit element mounting pad 112 is provided on one main surface of the module mounting member 110 and the other main surface of the module mounting member 110 by this wiring pattern. The external connection electrode terminal 114 is connected.

The frequency adjusting write terminal 115 is used as a terminal for adjusting the oscillation frequency of the piezoelectric oscillator OS1.
As shown in FIG. 2, the frequency adjusting terminal 115 is electrically connected to the piezoelectric oscillator mounting pad 111 via via conductors VD 1 and VD 2 and a wiring pattern M.
The piezoelectric oscillator mounting pad 111 is electrically connected to the module mounting member connection terminal MTS of the piezoelectric oscillator OS1 through a conductive bonding material 160 such as solder.
Therefore, the frequency adjusting write terminal 115 is electrically connected to the module mounting member connection terminal MTS of the piezoelectric oscillator OS1.

  When the module mounting member 110 is made of glass ceramics, the piezoelectric oscillator mounting pad 111 and the first oscillator are mounted on the surface of a ceramic green sheet obtained by adding and mixing a suitable organic solvent to a predetermined ceramic material powder. A conductive paste made of, for example, Ag or Cu, which becomes the integrated circuit element mounting pad 112, the external connection electrode terminal 114, the frequency adjusting write terminal 115, etc., is punched in advance in the ceramic green sheet. A conductor paste to be a via conductor is applied to the through-hole previously formed by well-known screen printing, and a plurality of these are laminated, press-molded, and then fired at a high temperature.

As shown in FIGS. 1 and 2, the resin layer 140 covers the entire surface of the first integrated circuit element 120, the piezoelectric oscillator OS 1, and the electronic component element 130 mounted on the module mounting member 110. It is formed as follows.
The resin layer 140 is formed, for example, by vacuum printing a mixture of an epoxy resin and a curing agent.

The conductive layer 150 is made of a radio wave shielding material, and is formed by applying a radio wave shielding material to the main surface of the resin layer 140 and then performing a heat treatment to vaporize an organic solvent.
The conductive layer 150 can prevent electromagnetic waves from entering the circuit wirings constituting the oscillation circuit and the amplifier circuit in the first integrated circuit element 110, and can stabilize the operation of the communication module 100. .
In addition, the radio wave shielding material causes a reduction reaction by, for example, throwing a metal ion solution of silver (Ag), copper (Cu), nickel (Ni), palladium (Pd) into hydrogen gas or phosphorus, After that, the reaction is promoted by heating by combustion, and a metal colloid is prepared by using a method in which the generated metal colloid is received in a liquid dispersion medium or a method in which the metal ion solution is reduced in the liquid dispersion medium. It is formed by dispersing in an epoxy together with an organic solvent.
Further, it is possible to form a shield structure suitable for the oscillation frequency band in the communication module 100 by utilizing the fact that the corresponding frequency band of the radio wave shielding material varies depending on the type of colloidal metal of the radio wave shielding material.

According to the communication module 100 according to the embodiment of the present invention, the main surface of the module mounting member 110 is provided with the recess 116, and is provided on the main surface of the module mounting member 110 so as to surround the recess 116. The piezoelectric oscillator mounting pad 111 and the module mounting member connection terminal provided on the other main surface of the lid member of the piezoelectric oscillator OS <b> 1 are joined to each other, whereby the depression provided in the main surface of the module mounting member 110. Since part of the element mounting member SB of the piezoelectric oscillator OS1 can be mounted in the portion 116, the communication module 100 can be thinned.
Further, since the frequency adjusting write terminal 115 for adjusting the oscillation frequency of the piezoelectric oscillator OS1 is provided on the other main surface of the module mounting member 110, the piezoelectric oscillator OS1 is mounted on the module mounting member 110. In addition, the oscillation frequency can be adjusted even if the oscillation frequency fluctuates due to the stray capacitance.

In addition, this invention is not limited to the said embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.
For example, in the above-described embodiment, the case where quartz is used as the piezoelectric material constituting the piezoelectric vibration element has been described. However, as other piezoelectric materials, lithium niobate, lithium tantalate, or piezoelectric ceramics is used as the piezoelectric material. The piezoelectric vibration element may be used.

DESCRIPTION OF SYMBOLS 110 ... Module mounting member 111 ... Piezo oscillator mounting pad 112 ... First integrated circuit element mounting pad 113 ... Electronic component element mounting pad 114 ... External connection electrode terminal 115 ... Frequency Write terminal for adjustment 116 ... depression 120 ... first integrated circuit element 130 ... electronic component element 140 ... resin layer 150 ... conductor layer 100 ... communication module OS1, OS2,.・ ・ Piezoelectric oscillator SB ・ ・ ・ Element mounting member SB1 ・ ・ ・ Substrate part SB2 ・ ・ ・ Frame part K1 ・ ・ ・ Recessed space AT ・ ・ ・ Piezoelectric vibration element mounting pad MTS ・ ・ ・ Connecting terminal for module mounting member ST ・.... Second integrated circuit element mounting pad XT ... Piezoelectric vibration element XS ... Crystal base plate D1 ... Excitation electrode RD ... Lid member HD1 ... First sealing conductor Turn HD2 ... second sealing conductor pattern SD1 ... first element connection electrode SD2 ... second element connection electrode HB ... sealing member SS ... second integrated circuit element DS: Conductive adhesive

Claims (2)

A module mounting member comprising a piezoelectric oscillator mounting pad provided on one main surface so as to surround the first recess while the first integrated circuit element mounting pad and the recess are provided on one main surface;
A first integrated circuit element mounted on the first integrated circuit element mounting pad;
A piezoelectric oscillator mounted on the piezoelectric oscillator mounting pad, the element mounting member, the piezoelectric vibration element mounted on one main surface of the element mounting member, and a lid member for hermetically sealing the piezoelectric vibration element A piezoelectric oscillator comprising: a second integrated circuit element mounted on the other main surface of the lid member; and a module mounting member connection terminal provided on the other main surface of the lid member;
A communication module, comprising: a resin layer provided to cover the piezoelectric oscillator and the first integrated circuit element.   The communication module according to claim 1, wherein a frequency adjusting write terminal for adjusting an oscillation frequency of the piezoelectric oscillator is provided on the other main surface of the module mounting member.

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