JP2010258112A - 導電性成形品及びその製造方法 - Google Patents
導電性成形品及びその製造方法 Download PDFInfo
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Abstract
【解決手段】導電性成形品60は、立体形状を有する成形樹脂部62と、成形樹脂部62上に形成され、導電性ナノファイバー3を含み、その導電性ナノファイバー3を介して導通可能である導電パターン層6と、成形樹脂部62上の導電パターン層6が形成されていない部分に形成され、導電性ナノファイバー3を含み、導電パターン層6から絶縁された絶縁パターン層5とを備えている。
【選択図】図1
Description
3 導電性ナノファイバー
5 絶縁パターン層
6 導電パターン層
7 微小ピンホール
9 狭小溝
10 基体シート
11 エッチングレジスト層
20 フォトマスク
25 位置検知マーク
33 バインダー樹脂
50 レーザー照射機の先端
51 レーザー照射光
60 導電性成形品
61 剥離層
62 成形樹脂部
Claims (5)
- 立体形状を有する成形樹脂部と、
前記成形樹脂部上に形成され、導電性ナノファイバーを含み、その導電性ナノファイバーを介して導通可能である導電パターン層と、
前記成形樹脂部上の前記導電パターン層が形成されていない部分に形成され、前記導電性ナノファイバーを含み、前記導電パターン層から絶縁された絶縁パターン層とを備えた、導電性成形品。 - 前記絶縁パターン層は、前記導電性ナノファイバーシートが断線することにより前記導電パターン層から絶縁されている、請求項1記載の導電性成形品。
- 前記絶縁パターン層は、目視により認識することができない幅の狭小溝を有し、その狭小溝により、前記導電パターン層から絶縁されると共に、複数の島状に形成された、請求項1記載の導電性成形品。
- 前記導電パターン層は、目視により認識することができない大きさの複数の微小ピンホールを有する、請求項1から請求項3のいずれかに記載の導電性成形品。
- 基体シート上に導電パターン層と絶縁パターン層とを形成して導電性ナノファイバーシートを得る工程と、
前記得られた導電性ナノファイバーシートを、立体形状を有する成形樹脂部に固着させる工程とを備えた、導電性成形品の製造方法。
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JP2009104563A JP5335534B2 (ja) | 2009-04-22 | 2009-04-22 | 導電性成形品及びその製造方法 |
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JP5335534B2 JP5335534B2 (ja) | 2013-11-06 |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012164553A (ja) * | 2011-02-08 | 2012-08-30 | Shin Etsu Polymer Co Ltd | 導電パターン形成基板の製造方法及び導電パターン形成基板 |
JP2012164552A (ja) * | 2011-02-08 | 2012-08-30 | Shin Etsu Polymer Co Ltd | 導電パターン形成基板の製造方法 |
JP2012169082A (ja) * | 2011-02-10 | 2012-09-06 | Shin Etsu Polymer Co Ltd | 導電パターン形成基板およびその製造方法 |
JP2014194943A (ja) * | 2014-04-28 | 2014-10-09 | Shin Etsu Polymer Co Ltd | 導電パターン形成基板の製造方法および導電パターン形成基板 |
WO2015030952A1 (en) * | 2013-08-28 | 2015-03-05 | Eaton Corporation | Heat sink composition for electrically resistive and thermally conductive circuit breaker and load center and method of preparation therefor |
WO2015030953A1 (en) * | 2013-08-28 | 2015-03-05 | Eaton Corporation | Functionalizing injection molded parts using nanofibers |
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JP2004172282A (ja) * | 2002-11-19 | 2004-06-17 | Sumitomo Rubber Ind Ltd | 回路の製造方法および該回路を備えた回路板 |
JP2007297501A (ja) * | 2006-04-28 | 2007-11-15 | Takiron Co Ltd | 導電性成形体及びその製造方法 |
WO2008046058A2 (en) * | 2006-10-12 | 2008-04-17 | Cambrios Technologies Corporation | Nanowire-based transparent conductors and applications thereof |
JP2008098169A (ja) * | 2005-05-26 | 2008-04-24 | Gunze Ltd | 透明面状体及び透明タッチスイッチ |
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2009
- 2009-04-22 JP JP2009104563A patent/JP5335534B2/ja not_active Expired - Fee Related
Patent Citations (5)
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JP2004172282A (ja) * | 2002-11-19 | 2004-06-17 | Sumitomo Rubber Ind Ltd | 回路の製造方法および該回路を備えた回路板 |
JP2008098169A (ja) * | 2005-05-26 | 2008-04-24 | Gunze Ltd | 透明面状体及び透明タッチスイッチ |
JP2007297501A (ja) * | 2006-04-28 | 2007-11-15 | Takiron Co Ltd | 導電性成形体及びその製造方法 |
WO2008046058A2 (en) * | 2006-10-12 | 2008-04-17 | Cambrios Technologies Corporation | Nanowire-based transparent conductors and applications thereof |
JP2010507199A (ja) * | 2006-10-12 | 2010-03-04 | カンブリオス テクノロジーズ コーポレイション | ナノワイヤベースの透明導電体およびその適用 |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2012164553A (ja) * | 2011-02-08 | 2012-08-30 | Shin Etsu Polymer Co Ltd | 導電パターン形成基板の製造方法及び導電パターン形成基板 |
JP2012164552A (ja) * | 2011-02-08 | 2012-08-30 | Shin Etsu Polymer Co Ltd | 導電パターン形成基板の製造方法 |
JP2012169082A (ja) * | 2011-02-10 | 2012-09-06 | Shin Etsu Polymer Co Ltd | 導電パターン形成基板およびその製造方法 |
WO2015030952A1 (en) * | 2013-08-28 | 2015-03-05 | Eaton Corporation | Heat sink composition for electrically resistive and thermally conductive circuit breaker and load center and method of preparation therefor |
WO2015030953A1 (en) * | 2013-08-28 | 2015-03-05 | Eaton Corporation | Functionalizing injection molded parts using nanofibers |
CN105378877A (zh) * | 2013-08-28 | 2016-03-02 | 伊顿公司 | 用于电阻性和导热的断路器和负载中心的散热器合成物及其制备方法 |
CN105378877B (zh) * | 2013-08-28 | 2019-05-03 | 伊顿公司 | 用于电阻性和导热的断路器和负载中心的散热器合成物及其制备方法 |
US11286372B2 (en) | 2013-08-28 | 2022-03-29 | Eaton Intelligent Power Limited | Heat sink composition for electrically resistive and thermally conductive circuit breaker and load center and method of preparation therefor |
US20220169831A1 (en) * | 2013-08-28 | 2022-06-02 | Eaton Intelligent Power Limited | Heat sink composition for electrically resistive and thermally conductive circuit breaker and load center and method of preparation therefor |
US11879053B2 (en) * | 2013-08-28 | 2024-01-23 | Eaton Intelligent Power Limited | Heat sink composition for electrically resistive and thermally conductive circuit breaker and load center and method of preparation therefor |
JP2014194943A (ja) * | 2014-04-28 | 2014-10-09 | Shin Etsu Polymer Co Ltd | 導電パターン形成基板の製造方法および導電パターン形成基板 |
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