JP2010254919A - Thermosetting resin composition for light reflection, substrate for mounting optical semiconductor element using the same and manufacturing method thereof, and optical semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition for light reflection having sufficient light reflectance and moldability and also excellent in heat-resistant colorability, a substrate for mounting an optical semiconductor element using the same and a manufacturing method thereof, and an optical semiconductor device. <P>SOLUTION: The thermosetting resin composition for light reflection includes an epoxy resin, a curing agent, and a white pigment. As the epoxy resin, a compound mutually compatible with the curing agent and having a polyorganosiloxane skeleton and two or more epoxy groups is at least included. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a light-reflective thermosetting resin composition used in an optical semiconductor device in which an optical semiconductor element and wavelength conversion means such as a phosphor are combined, an optical semiconductor element mounting substrate using the same, and a method for manufacturing the same And an optical semiconductor device.

  In recent years, an optical semiconductor device in which an optical semiconductor element such as an LED (Light Emitting Diode) and a phosphor are combined has advantages of high energy efficiency, long life, and the like. It is applied to various uses such as uses, and its demand is expanding.

  Along with this, the brightness of LED devices has been increasing, and the rise in junction temperature due to an increase in the amount of heat generated by the element, or the deterioration of element materials due to a direct increase in light energy, has been regarded as a problem. Development of a device material having resistance to the problem has been an issue.

  Under such circumstances, as a technique for preventing the problem of luminance reduction caused by heat and light, the following Patent Document 1 discloses an optical semiconductor element mounting in which a reflector having a high light reflectance is provided at a site where the optical semiconductor element is mounted. A substrate has been proposed. Patent Document 1 discloses that a reflector or the like is formed by transfer molding. The material includes an epoxy resin, a curing agent, a curing catalyst, a white pigment, and the like. Things have been proposed.

JP 2006-140207 A

  By the way, in the manufacture of the LED package, a high-temperature process such as connection between the optical semiconductor element mounting substrate and the optical semiconductor element, resin sealing of the optical semiconductor element, and solder reflow during mounting on the substrate is performed. Since the resin is easily discolored when it is oxidized and deteriorated, in the case of an optical semiconductor element mounting substrate produced using a thermosetting resin composition for light reflection, it tends to be difficult to ensure the initial optical characteristics in the LED package. .

  On the other hand, the light-reflective thermosetting resin composition used for transfer molding is required to have moldability that enables uniform filling into the mold.

  The present invention has been made in view of the above circumstances, has a sufficient light reflectivity and molding processability, and has excellent heat-resistant colorability, and a light-curable thermosetting resin composition and light using the same It is an object of the present invention to provide a semiconductor element mounting substrate, a method for manufacturing the same, and an optical semiconductor device.

  As a result of intensive studies by the present inventors in order to solve the above problems, by blending a specific epoxy compound as an epoxy resin component in a thermosetting resin composition containing an epoxy resin, a curing agent, and a white pigment. The present invention is completed by finding that a molded article having a high light reflectance can be formed by transfer molding, and that the decrease in the light reflectance of the molded article after heat treatment at a high temperature can be made smaller than before. It came to.

  That is, the light-reflective thermosetting resin composition of the present invention includes an epoxy resin, a curing agent, and a white pigment, and is compatible with the curing agent as an epoxy resin, and has a polyorganosiloxane skeleton and two or more. It contains at least a compound having an epoxy group.

  By having the said structure, the thermosetting resin composition for light reflections of this invention can become the thing excellent in light reflectivity, moldability, and heat-resistant coloring property.

  In the thermosetting resin composition for light reflection of the present invention, the epoxy equivalent of the compound having the polyorganosiloxane skeleton and two or more epoxy groups from the viewpoint of achieving both high heat-resistant colorability and molding processability at a high level. Is preferably 150 to 350 g / eq.

  In addition, from the viewpoint of achieving both heat resistant colorability and molding processability at a high level, the compound having a polyorganosiloxane skeleton and two or more epoxy groups preferably has a number average molecular weight of 700 to 5,000.

  Furthermore, the softening point or the melting point of the compound having the polyorganosiloxane skeleton and two or more epoxy groups is preferably 0 to 150 ° C. from the viewpoint of achieving both heat resistant colorability and molding processability at a high level. .

  In addition, from the viewpoint of achieving both heat resistant colorability and molding processability at a high level, the compound having a polyorganosiloxane skeleton and two or more epoxy groups has a melt viscosity at 150 ° C. of 1 to 1000 mPa · s. It is preferable.

  In the thermosetting resin composition for light reflection of the present invention, the white pigment is preferably at least one selected from the group consisting of titanium oxide, alumina, magnesium oxide, antimony oxide, zirconium oxide and inorganic hollow particles. .

  Further, from the viewpoint of improving the ease of mixing and kneading with the thermosetting resin and the molding processability of the thermosetting resin composition for light reflection after kneading, the center particle size of the white pigment is 0.1. It is preferable to be in the range of ˜50 μm.

  Moreover, it is preferable that content of the said white pigment in the thermosetting resin composition for light reflections of this invention exists in the range of 10-85 volume% on the basis of the resin composition whole quantity.

  The present invention also provides an optical semiconductor element mounting substrate provided with a cured product of the light reflecting thermosetting resin composition of the present invention.

  The present invention also has a recess composed of a bottom surface and a wall surface, the bottom surface of the recess is a mounting portion for an optical semiconductor element, and at least a part of the wall surface of the recess is the thermosetting resin for light reflection of the present invention. An optical semiconductor element mounting substrate comprising a cured product of the composition is provided.

  The present invention also includes a substrate and a first connection terminal and a second connection terminal provided on the substrate, and the light of the present invention is provided between the first connection terminal and the second connection terminal. An optical semiconductor element mounting substrate having a cured product of a reflective thermosetting resin composition is provided.

  The present invention also provides an optical semiconductor device having the optical semiconductor element mounting substrate of the present invention and an optical semiconductor element mounted on the optical semiconductor element mounting substrate.

  The present invention is also a method for producing a substrate for mounting an optical semiconductor element having a recess composed of a bottom surface and a wall surface, wherein at least a part of the wall surface of the recess is formed from the thermosetting resin composition for light reflection of the present invention. Provided is a method for manufacturing an optical semiconductor element mounting substrate comprising a step of forming by transfer molding.

  According to the method for manufacturing a substrate for mounting a semiconductor element of the present invention, by providing the above-described process using the thermosetting resin composition for light reflection of the present invention, the light reflectance that can function as a reflector is sufficiently high and light is generated by heat. Recesses in which the reflectance is difficult to decrease can be provided with good moldability. Therefore, according to the semiconductor element mounting substrate obtained by the method of the present invention, it becomes easy to manufacture an optical semiconductor device having desired optical characteristics.

  ADVANTAGE OF THE INVENTION According to this invention, it can provide the thermosetting resin composition for light reflections which has sufficient light reflectivity and moldability, and was excellent in heat-resistant coloring property. That is, according to the present invention, a cured product having a high light reflectance in the wavelength region from visible light to near-ultraviolet light is obtained, and discoloration occurs when an optical semiconductor device such as an LED package is used or used in a high temperature environment. The thermosetting resin composition for light reflection which can obtain few hardened | cured materials can be provided. In addition, by using such a resin composition, it is possible to manufacture an optical semiconductor element mounting substrate and an optical semiconductor device having excellent optical characteristics and high reliability.

It is a perspective view which shows suitable one Embodiment of the board | substrate for optical semiconductor element mounting of this invention. It is the schematic which shows one Embodiment of the process of manufacturing the board | substrate for optical semiconductor element mounting of this invention. It is a perspective view which shows one Embodiment of the state which mounted the optical semiconductor element in the board | substrate for optical semiconductor element mounting of this invention. 1 is a schematic cross-sectional view showing an embodiment of an optical semiconductor device of the present invention. It is a schematic cross section which shows other embodiment of the optical semiconductor device of this invention. It is a schematic cross section which shows other embodiment of the optical semiconductor device of this invention. 1 is a schematic cross-sectional view showing a preferred embodiment of a copper-clad laminate according to the present invention. It is a schematic cross section which shows an example of the optical semiconductor device produced using the copper clad laminated board which concerns on this invention. It is a schematic cross section which shows other embodiment of the optical semiconductor device which concerns on this invention.

(Thermosetting resin composition for light reflection)
The light-reflective thermosetting resin composition of the present embodiment includes (A) an epoxy resin, (B) a curing agent, (C) a curing catalyst, and (D) a white pigment. And a compound (component (A1)) that is compatible with the curing agent and has a polyorganosiloxane skeleton and two or more epoxy groups. Hereinafter, each component will be described.

  First, “compatible with the curing agent” for the epoxy resin means that the epoxy resin has an affinity with other curing agents and exists as a uniform solution or mixture. More specifically, for example, about a mixed solution obtained by mixing an epoxy resin and a curing agent at a weight ratio of 1/1, completely dissolving these components at 120 ° C., and subsequently stirring, When a part of the mixed liquid is taken out and visually observed after standing for a minute, it means a state that can be confirmed as a transparent liquid with no separation between components. In this specification, such a state is referred to as “compatible with each other”, and the case where the components are separated to become an opaque liquid is referred to as “insoluble with each other”. The combination of epoxy resin and curing agent, which are compatible with each other but require a long time to dissolve, requires heating over a long period of time, that is, more heat energy. It is disadvantageous in terms of sex and cost. Therefore, a combination that is compatible in a short time is preferable.

  Further, in the above mixing operation, a gel or the like, which is a cured reaction product of an epoxy resin and a curing agent, may be precipitated, and mixing such as temperature and stirring method is appropriately performed so as to obtain a mixture free of white turbidity due to such a precipitate. It is preferable to select conditions. In addition, if a material having a high viscosity is selected, bubbles are involved by stirring, and the resulting mixture may be observed to be cloudy in appearance due to minute bubbles. In that case, it is preferable to determine the transparency of the mixture after removing bubbles by a known vacuum degassing method. Note that “white turbidity” indicates that there is no scattering of electromagnetic waves in the visible light region. More specifically, it indicates that there are no fine particles or tiny bubbles having scattering centers that cause Rayleigh scattering, Mie scattering, or diffraction scattering of light.

  The epoxy compound having a polyorganosiloxane skeleton used in the present invention has a bond with high binding energy, and the organosiloxane skeleton exhibits hydrophobicity, and the surface of the cured molded product surface of the thermosetting resin composition for light reflection It has the property of reducing free energy. Due to such properties, it is possible to suppress sticking to the molding die during transfer molding. And, by combining such a compound and the above components (B) to (D), sufficient light can be obtained by performing molding using a mold at a high temperature while suppressing coloring due to oxidative deterioration in a high temperature environment. Even when producing molded articles having reflectivity, it is possible to ensure sufficient releasability from the molding dies at the time of molding the mold, and all of the high light reflectance, heat resistant colorability and molding processability are achieved. Highly satisfied.

  The compound having a polyorganosiloxane skeleton and two or more epoxy groups preferably has an epoxy equivalent of 150 to 350 g / eq, more preferably 200 to 300 g / eq. When the epoxy equivalent is less than 150 g / eq, the weight ratio of siloxane contained in the compound is lowered, and heat resistance and coloring resistance tend not to be sufficiently obtained. On the other hand, when the epoxy equivalent exceeds 350 g / eq, for example, compatibility when preparing a light-reflective curable resin composition by heating and mixing with other epoxy resin, curing agent, additive and other components decreases. As a result, the thermosetting reactivity of the curable resin composition may decrease, or the processing characteristics when melted and molded into a fluidized state may decrease.

  Moreover, it is preferable that the number average molecular weights of the said compound are 700-5000. When the number average molecular weight is less than 700, the weight ratio of the siloxane unit in the compound is lowered, and heat resistance and coloration resistance tend not to be sufficiently obtained. On the other hand, when the number average molecular weight exceeds 5000, the melt viscosity of the curable resin composition increases, and the processing characteristics when melted and molded into a fluidized state may deteriorate.

  Moreover, it is preferable that the said compound is 0-150 degreeC of melting | fusing point or a softening point. When the melting point or softening point of the compound is less than 0 ° C., the dispersibility of the white pigment in the light-reflective curable resin composition tends to decrease, and when molding using a mold such as transfer molding Resin burrs are likely to occur. When such resin burrs are generated, they remain as contaminants on the substrate for mounting an optical semiconductor, and when the optical semiconductor element is mounted in a subsequent process, sufficient connection strength may not be obtained, which may cause defects. There is. On the other hand, when the melting point or softening point of the compound is higher than 150 ° C., the melt viscosity of the curable resin composition increases, and the processing characteristics when melted and molded into a fluid state tend to be lowered.

  In addition, the compound preferably has a melt viscosity at 150 ° C. of 1.0 to 1000 mPa · s. When the melt viscosity is smaller than 1.0 mPa · s, the dispersibility of the white pigment in the light-reflective curable resin composition tends to decrease, and molding is performed using a mold such as transfer molding. In this case, resin burrs are likely to occur. When such resin burrs are generated, they remain as contaminants on the substrate for mounting an optical semiconductor, and when the optical semiconductor element is mounted in a subsequent process, sufficient connection strength may not be obtained, which may cause defects. There is. On the other hand, when the melt viscosity is greater than 1000 mPa · s, the melt viscosity of the curable resin composition increases, and the processing characteristics when melted and molded into a fluid state tend to be lowered.

  In the present specification, “melt viscosity at 150 ° C.”, “softening point (melting point)” and “number average molecular weight (Mn)” of a compound having a polyorganosiloxane skeleton and two or more epoxy groups are measured as follows. Determined by the method. “Melt viscosity at 150 ° C.” is reported in Research Equipment (London) LTD. It is measured using a manufactured ICI cone plate viscometer. The “softening point (melting point)” is obtained by heating the compound on a hot plate and visually confirming the change in properties. “Number average molecular weight (Mn)” refers to a value measured using a standard polystyrene calibration curve in accordance with a gel permeation chromatography (GPC) method. More specifically, a pump (Hitachi, Ltd.) is used as a GPC measuring device. Manufactured by L-6200 type), column (TSKgel-G5000HXL and TSKgel-G2000HXL, both manufactured by Tosoh Corporation, trade name) and detector (manufactured by Hitachi, Ltd., L-3300RI type) as an eluent. Tetrahydrofuran is used, and measurement is performed under the conditions of a temperature of 30 ° C. and a flow rate of 1.0 ml / min.

  The compound having a polyorganosiloxane skeleton and two or more epoxy groups according to this embodiment uses, for example, a compound containing a platinum metal atom such as a platinum-vinylsiloxane complex as a catalyst, and an organohydrogensiloxane compound and And a hydrocarbon compound having an unsaturated carbon-carbon bond and at least one epoxy group can be obtained by hydrosilylation reaction by appropriately setting the charging ratio.

  As another method, a compound containing a platinum-based metal atom is used as a catalyst, and an organohydrogensiloxane compound and a hydrocarbon compound having an unsaturated carbon-carbon bond and at least one hydroxyl group are charged in a charging ratio. Is appropriately set and hydrosilylation reaction is performed to synthesize a polyorganosiloxane compound, and then a hydroxy group of the polyorganosiloxane compound and a known compound used for inducing an epoxy group such as epichlorohydrin are combined. A compound having a polyorganosiloxane skeleton and two or more epoxy groups can be obtained by reacting to produce an epoxy group.

  As yet another method, an epoxy group-containing silane compound such as 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane and an alicyclic dialcohol typified by 1,4-cyclohexanedimethanol are mixed with dibutyltin. A compound having a polyorganosiloxane skeleton and two or more epoxy groups can also be obtained by a dealcoholization condensation reaction in the presence of a Lewis acid catalyst such as dilaurate.

  As the compound having a polyorganosiloxane skeleton and two or more epoxy groups according to the present embodiment, a commercially available polyorganosiloxane resin can be used. For example, KD001 (manufactured by Nippon Steel Chemical Co., Ltd.) , KD401 (manufactured by Nippon Steel Chemical Co., Ltd.), KD801 (manufactured by Nippon Steel Chemical Co., Ltd.), and CD401 (manufactured by Nippon Steel Chemical Co., Ltd.).

  The content of the compound having the polyorganosiloxane skeleton and two or more epoxy groups in the light-reflective thermosetting resin composition of the present invention is based on the total amount of components that are solid after the thermosetting resin composition is cured. It is preferable that it is 0.1-20 mass%, and it is more preferable that it is 3-20 mass%.

  The thermosetting resin composition for light reflection of the present invention further contains an epoxy resin (A2) other than the compound (A1) having the polyorganosiloxane skeleton and two or more epoxy groups as the (A) epoxy resin. can do. In this case, from the viewpoint of suppressing the decrease in optical reflectance under a high temperature environment, the content of the epoxy resin (A2) is 100 parts by mass of the compound (A1) having a polyorganosiloxane skeleton and two or more epoxy groups. On the other hand, it is preferable that it is 1-200 mass parts. When using more than 200 mass parts of epoxy resins (A2), there exists a possibility that the heat resistance of the polyorganosiloxane frame | skeleton of (A1) may not fully be exhibited.

  As the epoxy resin (A2), generally known epoxy resin molding materials can be used. For example, novolaks of phenols and aldehydes including phenol novolac type epoxy resins, orthocresol novolac type epoxy resins and the like. Epoxidized resin; diglycidyl ether such as bisphenol A, bisphenol F, bisphenol S, alkyl-substituted bisphenol; glycidylamine type epoxy resin obtained by reaction of polyamine such as diaminodiphenylmethane and isocyanuric acid with epichlorohydrin; And linear aliphatic epoxy resins obtained by oxidation with a peracid such as peracetic acid; and alicyclic epoxy resins. These can be used alone or in combination of two or more.

  Further, the epoxy resin (A2) is preferably colorless or, for example, light yellow and relatively uncolored. Specific examples of such an epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, diglycidyl isocyanurate, and triglycidyl isocyanurate.

  As the curing agent (component (B)) used in the present invention, any curing agent can be used as long as it reacts with the compound (A1) having the polyorganosiloxane skeleton and two or more epoxy groups, Specific examples include acid anhydride curing agents, isocyanuric acid derivatives, phenolic curing agents, and the like. From the viewpoint of moldability and mechanical properties of the cured product, the curing agent preferably has a molecular weight of about 100 to 400. The curing agent is preferably colorless or, for example, light yellow and relatively uncolored.

  Examples of the acid anhydride curing agent include phthalic anhydride, maleic anhydride, trimellitic anhydride, pyromellitic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, methyl nadic anhydride, nadic anhydride, and glutaric anhydride. Dimethyl glutaric anhydride, diethyl glutaric anhydride, succinic anhydride, methyl hexahydrophthalic anhydride, methyl tetrahydrophthalic anhydride and the like. These may be used alone or in combination of two or more.

  Examples of the isocyanuric acid derivatives include 1,3,5-tris (1-carboxymethyl) isocyanurate, 1,3,5-tris (2-carboxyethyl) isocyanurate, 1,3,5-tris (3- Carboxypropyl) isocyanurate, 1,3-bis (2-carboxyethyl) isocyanurate and the like. These may be used alone or in combination of two or more.

  Examples of phenolic curing agents include phenols such as phenol, cresol, resorcin, catechol, bisphenol A, bisphenol F, phenylphenol, and aminophenol and / or naphthols such as α-naphthol, β-naphthol, and dihydroxynaphthalene. , Formaldehyde, benzaldehyde, salicylaldehyde, and other compounds having an aldehyde group, which are obtained by condensation or cocondensation in the presence of an acidic catalyst; novolak-type phenol resins; phenols and / or naphthols and dimethoxyparaxylene or bis (methoxy) Phenolic aralkyl resins synthesized from (methyl) biphenyl; Aralkyl-type phenolic resins such as biphenylene-type phenol-aralkyl resins and naphthol-aralkyl resins; Dicyclopentadiene-type phenolic resins such as dicyclopentadiene-type phenol novolak resins and dicyclopentadiene-type naphthol novolak resins synthesized by copolymerization of alcohols and / or naphthols with dicyclopentadiene; triphenylmethane type Examples thereof include phenol resins; terpene-modified phenol resins; paraxylylene and / or metaxylylene-modified phenol resins; melamine-modified phenol resins; cyclopentadiene-modified phenol resins; and phenol resins obtained by copolymerizing two or more of these.

  The above curing agents may be used alone or in combination of two or more.

  Among the above curing agents, phthalic anhydride, trimellitic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, glutaric anhydride, dimethylglutaric anhydride , Diethyl glutaric anhydride, or 1,3,5-tris (3-carboxypropyl) isocyanurate is preferably used. These may be used alone or in combination of two or more.

  The content of the curing agent in the light-reflective thermosetting resin composition of the present invention is (A) an activity in the curing agent that can react with the epoxy group with respect to 1 equivalent of the epoxy group in the epoxy resin. The ratio is preferably such that the group (acid anhydride group or hydroxyl group) is 0.5 to 1.2 equivalent, and more preferably 0.6 to 1.0 equivalent. When the active group is less than 0.5 equivalents, the curing rate of the light-reflective thermosetting resin composition is slowed, and the glass transition temperature of the resulting cured product is lowered, so that a sufficient elastic modulus is obtained. There may not be. On the other hand, when the active group exceeds 1.2 equivalents, the strength after curing may decrease.

  Examples of the curing catalyst (component (C)) used in the present invention include 1,8-diaza-bicyclo (5,4,0) undecene-7, triethylenediamine, tri-2,4,6-dimethylaminomethyl. Tertiary amines such as phenol; imidazoles such as 2-ethyl-4methylimidazole and 2-methylimidazole; triphenylphosphine, tetraphenylphosphonium tetraphenylborate, tetra-n-butylphosphonium-o, o-diethylphosphoro Phosphorus compounds such as dithioate, tetra-n-butylphosphonium-tetrafluoroborate, tetra-n-butylphosphonium-tetraphenylborate; quaternary ammonium salts; organometallic salts and derivatives thereof. These may be used alone or in combination of two or more. Among these curing catalysts, it is preferable to use tertiary amines, imidazoles, or phosphorus compounds.

  The content of the curing catalyst in the light-reflective thermosetting resin composition of the present invention is preferably 0.01 to 8.0% by mass based on the total amount of (A) the epoxy resin, It is more preferable that it is 3.0 mass%. If the content of the curing catalyst is less than 0.01% by mass, a sufficient curing accelerating effect may not be obtained. If the content of the curing catalyst exceeds 8.0% by mass, the resulting cured product (molded product) Etc.) may be discolored.

  Examples of the white pigment (component (D)) used in the present invention include alumina, magnesium oxide, antimony oxide, titanium oxide, zirconium oxide, and inorganic hollow particles. These may be used alone or in combination of two or more. From the viewpoint of thermal conductivity and light reflection characteristics, it is preferable to use alumina.

  Examples of the inorganic hollow particles include sodium silicate glass, aluminum silicate glass, borosilicate soda glass, and shirasu.

  The center particle diameter of the white pigment is preferably in the range of 0.1 μm to 50 μm. If the center particle size is less than 0.1 μm, the particles tend to aggregate and the dispersibility tends to deteriorate, and if it exceeds 50 μm, the light reflection characteristics of the cured product are hardly obtained.

  The content of the white pigment in the thermosetting resin composition for light reflection of the present invention is preferably in the range of 10 to 85% by volume based on the total amount of the resin composition. When the content of the white pigment is less than 10% by volume, it becomes difficult to obtain the light reflection characteristics of the cured product. When the content exceeds 85% by volume, the moldability of the thermosetting resin composition is deteriorated, and the optical semiconductor. There is a possibility that it is difficult to manufacture a device mounting substrate.

  The thermosetting resin composition for light reflection of the present invention can further contain various additives such as an inorganic filler, an antioxidant, a mold release agent, a dispersant, and an ion scavenger in addition to the components described above. .

  Examples of the inorganic filler include fused spherical silica, crushed silica, silica, antimony oxide, titanium oxide, aluminum hydroxide, magnesium hydroxide, barium sulfate, magnesium carbonate, and barium carbonate. The center particle diameter of the inorganic filler is preferably in the range of 1 to 100 μm from the viewpoint of improving the packing efficiency with the white pigment. The content of the inorganic filler in the light-reflective thermosetting resin composition of the present invention is in the range of 5 to 75% by volume based on the total amount of components that become solid after the thermosetting resin composition is cured. Is preferred.

  Moreover, a coupling agent etc. may be added to the thermosetting resin composition for light reflection of this invention as needed. In this case, the interfacial adhesion between the resin component such as the component (A1) and the inorganic component such as the white pigment and the inorganic filler can be improved. Examples of the coupling agent include silane coupling agents and titanate coupling agents. As the silane coupling agent, generally known compounds such as epoxy silane, amino silane, cationic silane, vinyl silane, acryl silane, mercapto silane, and composites thereof can be used. The amount of the coupling agent used is preferably adjusted as appropriate in consideration of the surface coating amount on the white pigment, but from the viewpoint of improving curability, the amount used is 5% by mass or less based on the total amount of the thermosetting resin composition. It is preferable. In the present invention, a white pigment, an inorganic filler, or the like may be previously treated with the above coupling agent.

  From the use of the thermosetting resin composition for light reflection of the present invention, the light reflectance at a wavelength of 350 to 800 nm after curing is preferably 80% or more. When this light reflectance is less than 80%, there is a tendency that it cannot sufficiently contribute to the improvement of the luminance of the optical semiconductor device. The light-reflective thermosetting resin composition of the present invention preferably has a light reflectance of 90% or more. Further, in terms of improving the luminance of the optical semiconductor device, the light reflectance after curing at a wavelength of 460 nm is preferably 80% or more, and more preferably 90% or more.

  In addition, from the viewpoint of improving heat resistance colorability, the cured molded product retains a light reflectance of 80% or more at a wavelength of 350 to 800 nm even after a heat resistance test in which the molded product is exposed to an environment of 150 ° C. for 500 hours. It is preferable. More preferably, the light reflectance at a wavelength of 460 nm is more preferably 85% or more, and still more preferably 90% or more during measurement after the heat resistance test described above. The light reflection characteristics of such a thermosetting resin composition can be realized by appropriately adjusting the blending amounts of various components constituting the resin composition, more specifically, a colorless thermosetting resin. This can be achieved by high loading of the components and the high refractive index white pigment.

  The thermosetting resin composition for light reflection of the present invention can be prepared by uniformly dispersing and mixing the various components exemplified above, and the mixing means and conditions are not particularly limited. As a preparation method, for example, various components are kneaded using an apparatus such as a mixing roll, an extruder, a kneader, a roll, an extruder, a raking machine, a stirring mixer that combines rotation and revolution, and then obtained kneading. The method of cooling and grinding | pulverizing a thing is mentioned. The kneading type is not particularly limited, but melt kneading is preferable. The conditions at the time of melt kneading may be appropriately determined depending on the type and blending amount of various components to be used, and are not particularly limited. For example, it is preferably carried out at a temperature range of 15 to 100 ° C. for 5 to 40 minutes, More preferably, it is carried out in a temperature range of 20 to 100 ° C. for 10 to 30 minutes. When the temperature of the melt kneading is less than 15 ° C., it is difficult to sufficiently melt and knead various components, and the dispersibility tends to decrease. On the other hand, when the melt-kneading is performed at a temperature higher than 100 ° C., the resin composition increases in molecular weight, and the resin composition may be cured before molding a molded article such as a substrate. Also, if the melt-kneading time is less than 1 minute, the resin tends to ooze out from the mold during molding of the substrate and the like, and burrs tend to occur. If it is longer than 40 minutes, the resin composition becomes polymerized. May progress and the resin composition may be cured before molding.

  When preparing the thermosetting resin composition for light reflection of the present invention, it is preferable to premix (B) a compound used as a curing agent with a part or all of the (A) epoxy resin. By carrying out such premixing, the dispersibility of the curing agent with respect to the base resin can be further enhanced. As a result, it is possible to more effectively suppress the occurrence of mold and package contamination due to the dispersion failure of the curing agent.

  In addition, although it may be premixed between the total amount of (A) epoxy resin and the compound used as (B) curing agent, (A) Even if it is premixed with a part of epoxy resin A sufficient effect can be obtained. In that case, the amount of the (A) epoxy resin used for the preliminary mixing is preferably 10 to 50% by mass of the total amount of the components.

  The premixing method is not particularly limited as long as (B) the compound used as the curing agent can be dispersed in (A) the epoxy resin. For example, a method in which both components are stirred for 0.5 to 20 hours under a temperature condition of room temperature to 220 ° C. From the viewpoint of dispersibility and efficiency, the stirring time is preferably 1 to 10 hours, more preferably 3 to 6 hours under a temperature condition of 100 to 200 ° C, more preferably 150 to 170 ° C. In the preheating mixing performed here, for example, (A) 100 parts by mass of an epoxy resin and (B) 120 parts by mass of a curing agent are weighed in a container made of heat-resistant glass, and a fluid such as silicone oil or water is added to the mixing container. The method of heating in the temperature range of 35 degreeC-180 degreeC using the heater used as a medium is mentioned. The heating method is not limited to the above method, and a known method such as thermocouple or electromagnetic wave irradiation can be used, and ultrasonic waves or the like may be irradiated to promote dissolution.

(Optical semiconductor device mounting substrate)
The substrate for mounting an optical semiconductor element according to the present invention has a recess composed of a bottom surface and a wall surface, and the bottom surface of the recess is an optical semiconductor element mounting portion (optical semiconductor element mounting region). At least a part of the peripheral side surface is made of a cured product of the thermosetting resin composition for light reflection of the present invention. FIG. 1 is a perspective view showing an embodiment of a substrate for mounting an optical semiconductor element of the present invention. The substrate for mounting an optical semiconductor element 110 includes a metal wiring 105 (first connection terminal and second connection terminal) on which Ni / Ag plating 104 is formed, and a metal wiring 105 (first connection terminal and second connection terminal). Insulating resin molded body 103 ′ provided between the terminals) and the reflector 103, the metal wiring 105 on which the Ni / Ag plating 104 is formed, and the recess 200 formed from the resin molded body 103 ′ and the reflector 103. have. The bottom surface of the recess 200 is composed of the metal wiring 105 on which the Ni / Ag plating 104 is formed and the insulating resin molded body 103 ′, and the wall surface of the recess 200 is composed of the reflector 103. And reflector 103 and insulating resin molding 103 'are the moldings which consist of a hardened | cured material of the thermosetting resin composition for light reflections of the said invention.

  Although the manufacturing method of the board | substrate for optical semiconductor element mounting of this invention is not specifically limited, For example, it can manufacture by transfer molding using the thermosetting resin composition for light reflections of this invention. FIG. 2 is a schematic view showing an embodiment of a process for producing an optical semiconductor element mounting substrate of the present invention. The optical semiconductor element mounting substrate is formed by, for example, forming a metal wiring 105 from a metal foil by a known method such as punching or etching, and applying Ni / Ag plating 104 by electroplating (FIG. 2A), A step of placing the metal wiring 105 in a mold 151 having a predetermined shape, injecting the thermosetting resin composition for light reflection of the present invention from a resin injection port 150 of the mold 151, and performing transfer molding under predetermined conditions (FIG. 2 (b)) and a step of removing the mold 151 (FIG. 2C). In this manner, the optical semiconductor element mounting region (concave portion) 200 is formed on the optical semiconductor element mounting substrate. The optical semiconductor element mounting region (concave portion) 200 is surrounded by the reflector 103 made of a cured product of the light-reflective thermosetting resin composition. . The bottom surface of the recess is made of a metal wiring 105 serving as a first connection terminal and a metal wiring 105 serving as a second connection terminal, and a cured product of a light-reflective thermosetting resin composition provided therebetween. Insulating resin molded body 103 ′. In addition, as the conditions for the transfer molding, the mold temperature is 170 to 200 ° C., more preferably 170 to 190 ° C., the molding pressure is 0.5 to 20 MPa, more preferably 2 to 8 MPa, and the after cure temperature is 60 to 120 seconds. 1 to 3 hours are preferable at 120 ° C to 180 ° C.

(Optical semiconductor device)
An optical semiconductor device of the present invention includes the optical semiconductor element mounting substrate and an optical semiconductor element mounted on the optical semiconductor element mounting substrate. As a more specific example, the optical semiconductor element mounting substrate, the optical semiconductor element provided in the recess of the optical semiconductor element mounting substrate, and the phosphor-containing envelope that fills the recess and seals the optical semiconductor element An optical semiconductor device provided with a stop resin part is mentioned.

  FIG. 3 is a perspective view showing an embodiment in which the optical semiconductor element 100 is mounted on the optical semiconductor element mounting substrate 110 of the present invention. As shown in FIG. 3, the optical semiconductor element 100 is mounted at a predetermined position in the optical semiconductor element mounting region (concave portion) 200 of the optical semiconductor element mounting substrate 110 and is electrically connected by the metal wiring 105 and the bonding wire 102. The 4 and 5 are schematic cross-sectional views showing an embodiment of the optical semiconductor device of the present invention. As shown in FIGS. 4 and 5, the optical semiconductor device includes an optical semiconductor element mounting substrate 110, an optical semiconductor element 100 provided at a predetermined position in the concave portion 200 of the optical semiconductor element mounting substrate 110, and the concave portion 200. A sealing resin portion made of a transparent sealing resin 101 including a phosphor 106 that fills and seals the optical semiconductor element, and the optical semiconductor element 100 and the metal wiring 105 on which the Ni / Ag plating 104 is formed; Are electrically connected by bonding wires 102 or solder bumps 107.

  FIG. 6 is also a schematic cross-sectional view showing an embodiment of the optical semiconductor device of the present invention. In the optical semiconductor device shown in FIG. 6, the LED element 300 is disposed via a die bonding material 306 at a predetermined position on the lead 304 on which the reflector 303 is formed, and the LED element 300 and the lead 304 are electrically connected by the bonding wire 301. The LED body element 300 is sealed with a transparent sealing resin 302 that is connected and includes a phosphor 305.

  As mentioned above, although preferred embodiment of this invention was described, this invention is not restrict | limited to this. For example, the thermosetting resin composition for light reflection of the present invention can be used as a light reflection coating agent. As this embodiment, a copper-clad laminate, an optical semiconductor element mounting substrate, and an optical semiconductor element will be described.

  The copper-clad laminate according to the present invention is a light-reflecting resin layer formed using the above-described thermosetting resin composition for light reflection of the present invention, a copper foil laminated on the light-reflecting resin layer, Is provided.

  FIG. 7 is a schematic cross-sectional view showing a preferred embodiment of a copper clad laminate according to the present invention. As shown in FIG. 7, a copper clad laminate 400 includes a base material 401, a light reflecting resin layer 402 laminated on the base material 401, and a copper foil 403 laminated on the light reflecting resin layer 402. It is equipped with. Here, the light reflecting resin layer 402 is formed using the above-described thermosetting resin composition for light reflection of the present invention.

  As the base material 401, a base material used for a copper-clad laminate can be used without particular limitation, and examples thereof include a resin laminate such as an epoxy resin laminate and an optical semiconductor mounting substrate.

  For example, the copper clad laminate 400 is formed by applying the resin composition of the present invention to the surface of the base material 401, stacking the copper foil 403, and curing by heating and pressing to form the light reflecting resin layer 402 made of the resin composition. Can be produced.

  As a method for applying the resin composition of the present invention to the substrate 401, for example, a printing method, a die coating method, a curtain coating method, a spray coating method, a roll coating method, or the like can be used. At this time, the light-reflective thermosetting resin composition of the present invention can contain a solvent so as to facilitate application. In addition, when using a solvent, about the thing based on the resin composition whole quantity by the mixture ratio of each component mentioned above, it is preferable to set what remove | excluded the solvent as a whole quantity.

  The heating and pressing conditions are not particularly limited, but for example, it is preferable to perform heating and pressing under conditions of 130 to 180 ° C., 0.5 to 4 MPa, and 30 to 600 minutes.

  Using the copper-clad laminate according to the present invention, a printed wiring board for an optical member such as for LED mounting can be produced. 7 is obtained by laminating a light reflecting resin layer 402 and a copper foil 403 on one surface of a base material 401. The copper clad laminate according to the present invention is a base material 401. The light-reflecting resin layer 402 and the copper foil 403 may be laminated on both sides. In addition, the copper clad laminate 400 shown in FIG. 7 is obtained by laminating the light reflecting resin layer 402 and the copper foil 403 on the base material 401. However, the copper clad laminate according to the present invention includes the base material 401. You may comprise only the light reflection resin layer 402 and the copper foil 403, without using. In this case, the light reflecting resin layer 402 plays a role as a base material. In this case, for example, a light-reflecting resin layer 402 can be obtained by impregnating a glass cloth or the like with the resin composition of the present invention and curing.

  FIG. 8 is a schematic cross-sectional view showing an example of an optical semiconductor device manufactured using the copper-clad laminate according to the present invention. As shown in FIG. 8, the optical semiconductor device 500 is a surface-mount type light emitting diode including an optical semiconductor element 410 and a transparent sealing resin 404 provided so as to seal the optical semiconductor element 410. is there. In the optical semiconductor device 500, the semiconductor element 410 is bonded to the copper foil 403 through the adhesive layer 408, and is electrically connected to the copper foil 403 by a wire 409.

  Furthermore, as another embodiment of the substrate for mounting an optical semiconductor element according to the present invention, using the above-described thermosetting resin composition for light reflection of the present invention, a plurality of conductor members (connection terminals) on the base material are used. An optical semiconductor element mounting substrate provided with the light-reflecting resin layer formed in the above. In another embodiment of the optical semiconductor device according to the present invention, the optical semiconductor element is mounted on the optical semiconductor element mounting substrate.

  FIG. 9 is a schematic cross-sectional view showing a preferred embodiment of the optical semiconductor device according to the present invention. As shown in FIG. 9, the optical semiconductor device 600 is formed between a substrate 601, a plurality of conductor members 602 formed on the surface of the substrate 601, and a plurality of conductor members (connection terminals) 602. An optical semiconductor element 610 is mounted on an optical semiconductor element mounting substrate including the light reflecting resin layer 603 made of the thermosetting resin composition for light reflection of the present invention, and the optical semiconductor element 610 is sealed. Thus, a surface-mount type light emitting diode provided with a transparent sealing resin 604 is provided. In the optical semiconductor device 600, the optical semiconductor element 610 is bonded to the conductor member 602 through the adhesive layer 608, and is electrically connected to the conductor member 602 through a wire 609.

  As the substrate 601, a substrate used for an optical semiconductor element mounting substrate can be used without particular limitation, and examples thereof include a resin laminate such as an epoxy resin laminate.

  The conductor member 602 functions as a connection terminal, and can be formed by a known method such as a method of photoetching a copper foil.

  For the substrate for mounting an optical semiconductor element, the thermosetting resin composition for light reflection of the present invention is applied between the plurality of conductor members 602 on the substrate 601 and cured by heating to form the thermosetting resin composition for light reflection. It can be manufactured by forming a light reflecting resin layer 603 made of

  As a method for applying the light-reflective thermosetting resin composition of the present invention to the substrate 601, for example, a coating method such as a printing method, a die coating method, a curtain coating method, a spray coating method, or a roll coating method can be used. . At this time, the light-reflective thermosetting resin composition of the present invention can contain a solvent so as to facilitate application. In addition, when using a solvent, about the thing based on the resin composition whole quantity by the mixture ratio of each component mentioned above, it is preferable to set what remove | excluded the solvent as a whole quantity.

  Although it does not specifically limit as heating conditions at the time of heat-hardening the coating film of the thermosetting resin composition for light reflections, For example, it is preferable to heat on 130-180 degreeC and the conditions for 30 to 600 minutes.

  Thereafter, the resin component adhering excessively to the surface of the conductor member 602 is removed by buffing or the like to expose the circuit formed of the conductor member 602, thereby forming an optical semiconductor element mounting substrate.

  In order to ensure the adhesion between the light reflecting resin layer 603 and the conductor member 602, it is also preferable to perform a roughening treatment such as an oxidation-reduction treatment or a CZ treatment (manufactured by MEC Co., Ltd.) on the conductor member 602.

  Hereinafter, the present invention will be described more specifically with reference to examples and comparative examples. However, the present invention is not limited to these examples.

<Preparation of thermosetting resin composition for light reflection>
(Examples 1-5 and Comparative Examples 1-6)
About Examples 1-4 and Comparative Examples 1-2, after mix | blending each component according to the mixture ratio (mass part) shown in Table 1 and Table 2, fully knead | mixing and dispersing with a mixer, it is 35 degreeC with a mixing roll. A kneaded product was obtained by melt-kneading for 15 minutes. Next, the obtained kneaded material was cooled and pulverized, thereby preparing a white solid light-reflective thermosetting resin composition.

  About Example 5 and Comparative Examples 3-6, according to the mixing | blending ratio (mass part) shown in Table 1 and Table 2, each component is mix | blended and it mixes for 2 minutes at the rotation speed 2000rpm using a rotation revolution type stirring mixer. By doing so, a paste-like thermosetting resin composition for light reflection was prepared.

  In addition, the unit of the compounding quantity of each raw material shown to each table | surface is all mass parts, and the description part of "-" means that there is no mixing | blending of a corresponding raw material.

  The details of * 1 to 15 in Tables 1 and 2 are as follows. * Poxy equivalent, melt viscosity, softening point (melting point), and number average molecular weight of 1 to 9 are shown in Tables 1 and 2.

* 1: Epoxy silicone (manufactured by Nippon Steel Chemical Co., Ltd., trade name: KD001)
* 2: Epoxy silicone (trade name: KD401, manufactured by Nippon Steel Chemical Co., Ltd.)
* 3: Epoxy silicone (manufactured by Nippon Steel Chemical Co., Ltd., trade name: KD801)
* 4: Epoxy silicone (trade name: CD401, manufactured by Nippon Steel Chemical Co., Ltd.)
* 5: Trisglycidyl isocyanurate (Nissan Chemical Co., Ltd., trade name: TEPIC-S)
* 6: 3,4-epoxycyclohexenylmethyl-3 ′, 4′-epoxycyclohexene carboxylate (manufactured by Daicel Chemical Industries, trade name: Celoxide 2021P)
* 7: Hexahydrophthalic acid diglycidyl ester (manufactured by Sakamoto Pharmaceutical Co., Ltd., trade name: SR-HHPA)
* 8: Epoxy silicone (trade name: KF101, manufactured by Shin-Etsu Chemical Co., Ltd.)
* 9: Epoxy silicone (trade name: KF105, manufactured by Shin-Etsu Chemical Co., Ltd.)
* 10: Methylhexahydrophthalic anhydride (manufactured by Hitachi Chemical Co., Ltd.)
* 11: Hexahydrophthalic anhydride (manufactured by Wako Pure Chemical Industries, Ltd.)
* 12: Tetra-n-butylphosphonium-o, o-diethyl phosphorodithioate (manufactured by Nippon Chemical Industry Co., Ltd., trade name: PX-4ET)
* 13: Fused silica (manufactured by Denki Kagaku Kogyo, trade name: FB-950)
* 14: Fused silica (manufactured by Admatechs, trade name: SO-25R)
* 15: Titanium oxide (manufactured by Sakai Chemical Industry Co., Ltd., trade name: FTR-700)

<Evaluation of thermosetting resin composition for light reflection>
About the thermosetting resin composition for light reflections obtained in Examples 1 to 4 and Comparative Examples 1 and 2, the resin composition was molded at a molding die temperature of 180 ° C., a molding pressure of 6.9 MPa, and a curing time of 90 seconds. After the transfer molding under the conditions, post-curing was performed at 150 ° C. for 2 hours to prepare a test piece having a thickness of 1.0 mm, and the light reflectance after initial and heat treatment was measured according to the following method. Moreover, about the thermosetting resin composition for light reflections obtained in Example 5 and Comparative Examples 3 to 6, the resin composition was poured into an aluminum cup so that the thickness of the cured product was 1.0 mm, and 150 ° C. A test piece having a thickness of 1.0 mm was prepared by thermosetting for 5 hours, and the light reflectance after the initial and heat treatment was measured according to the following method. The results are shown in Tables 1 and 2.

(Measurement of light reflectance)
[initial]
About the test piece obtained above, the light reflectance in wavelength 460nm was measured using the integrating sphere type spectrophotometer V-750 type (made by JASCO Corporation).

[After heat treatment]
The test piece obtained above was put in an oven at a constant temperature and subjected to heat treatment under the following conditions. About the test piece after each heat processing, the light reflectivity was measured like the above.
Condition 1: 150 ° C., 500 hours Condition 2: 200 ° C., 24 hours Condition 3: 200 ° C., 100 hours

  As shown in Table 1, according to the resin compositions of Examples 1 to 5, a molded product having a sufficiently high light reflectance can be obtained by transfer molding, and the reflectance after the heat treatment of the molded product is reduced. It was confirmed that it can be suppressed. In addition, the polyorganosiloxane resin used in Comparative Examples 5 and 6 was not compatible with the acid anhydride curing agent used. For this reason, a phenomenon in which the epoxy resin component was separated and exuded at the stage of kneading the resin composition was observed, and a uniform cured product could not be obtained even after heat curing.

  Moreover, about the thermosetting resin composition for light reflections obtained by the Example and the comparative example, the thermosetting characteristic was evaluated based on the following method.

  Using a JSR type curast meter, the gel time (seconds) when the thermosetting resin composition for light reflection was heated at 180 ° C. was measured. The gel time was defined as the time when the torque of the curast meter was detected and the torque rises (the time when the curing reaction proceeds and the fluidity of the resin composition is not observed). The results are shown in Table 2.

  It was confirmed that the light-reflective thermosetting resin compositions of Examples 1 to 5 showed excellent torqueability within 30 seconds. On the other hand, the light-reflective thermosetting resin compositions of Comparative Examples 2 to 4 have a torque rising after a lapse of time longer than 30 seconds, and are inferior in thermosetting properties to those of Examples 1 to 5. there were. The light-reflective thermosetting resin compositions of Comparative Examples 5 and 6 were uncured with no torque rising within 300 seconds.

DESCRIPTION OF SYMBOLS 100 ... Optical semiconductor element, 101 ... Transparent sealing resin, 102 ... Bonding wire, 103 ... Hardened | cured material (reflector) of the thermosetting resin composition for light reflection, 103 '... Curing of the thermosetting resin composition for light reflection Article (insulating resin molding) 104 ... Ni / Ag plating, 105 ... metal wiring, 106 ... phosphor, 107 ... solder bump, 110 ... substrate for mounting optical semiconductor element, 150 ... resin injection port, 151 ... mold, DESCRIPTION OF SYMBOLS 200 ... Optical semiconductor element mounting area, 300 ... LED element, 301 ... Wire bond, 302 ... Transparent sealing resin, 303 ... Reflector, 304 ... Lead, 305 ... Phosphor, 306 ... Die bond material, 400 ... Copper-clad laminate, 401 ... base material, 402 ... light reflecting resin layer, 403 ... copper foil, 404 ... sealing resin, 408 ... adhesive layer, 409 ... wire, 410 ... optical semiconductor element, 500, 6 DESCRIPTION OF SYMBOLS 00 ... Optical semiconductor device, 601 ... Base material, 602 ... Conductive member, 603 ... Light reflection resin layer, 604 ... Sealing resin, 608 ... Adhesion layer, 609 ... Wire, 610 ... Optical semiconductor element.

Claims (13)

Including an epoxy resin, a curing agent, and a white pigment;
A thermosetting resin composition for light reflection, comprising at least a compound which is compatible with the curing agent and has a polyorganosiloxane skeleton and two or more epoxy groups as the epoxy resin.   The thermosetting resin composition for light reflection according to claim 1, wherein an epoxy equivalent of a compound having the polyorganosiloxane skeleton and two or more epoxy groups is 150 to 350 g / eq.   The light-reflective thermosetting resin composition according to claim 1 or 2, wherein the compound having a polyorganosiloxane skeleton and two or more epoxy groups has a number average molecular weight of 700 to 5,000.   The thermosetting resin composition for light reflection according to any one of claims 1 to 3, wherein a softening point or a melting point of the compound having a polyorganosiloxane skeleton and two or more epoxy groups is 0 to 150 ° C. object.   The compound having a polyorganosiloxane skeleton and two or more epoxy groups has a melt viscosity at 150 ° C of 1 to 1000 mPa · s, and the thermosetting for light reflection according to any one of claims 1 to 4. Resin composition.   The said white pigment is at least 1 sort (s) chosen from the group which consists of a titanium oxide, an alumina, a magnesium oxide, an antimony oxide, a zirconium oxide, and an inorganic hollow particle, For light reflection as described in any one of Claims 1-5. Thermosetting resin composition.   The light-reflective thermosetting resin composition according to any one of claims 1 to 6, wherein the white pigment has a center particle diameter in the range of 0.1 to 50 µm.   The thermosetting resin composition for light reflection according to any one of claims 1 to 7, wherein the content of the white pigment is in the range of 10 to 85% by volume based on the total amount of the resin composition.   A substrate for mounting an optical semiconductor element, comprising a cured product of the thermosetting resin composition for light reflection according to claim 1. It has a recess composed of a bottom surface and a wall surface, and the bottom surface of the recess is a mounting portion for an optical semiconductor element,
A substrate for mounting an optical semiconductor element, wherein at least a part of the wall surface of the concave portion is made of a cured product of the thermosetting resin composition for light reflection according to any one of claims 1 to 8. A board, and a first connection terminal and a second connection terminal provided on the board,
The optical semiconductor element mounting which has the hardened | cured material of the thermosetting resin composition for light reflections as described in any one of Claims 1-8 between the said 1st connection terminal and the said 2nd connection terminal. Substrate.   An optical semiconductor device comprising: the optical semiconductor element mounting substrate according to claim 9; and an optical semiconductor element mounted on the optical semiconductor element mounting substrate. A method of manufacturing a substrate for mounting an optical semiconductor element having a recess composed of a bottom surface and a wall surface,
Forming at least a part of the wall surface of the recess by transfer molding the thermosetting resin composition for light reflection according to any one of claims 1 to 8,
A method for manufacturing a substrate for mounting an optical semiconductor element.

Images