JP2010254789A5 - - Google Patents

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Publication number
JP2010254789A5
JP2010254789A5 JP2009105762A JP2009105762A JP2010254789A5 JP 2010254789 A5 JP2010254789 A5 JP 2010254789A5 JP 2009105762 A JP2009105762 A JP 2009105762A JP 2009105762 A JP2009105762 A JP 2009105762A JP 2010254789 A5 JP2010254789 A5 JP 2010254789A5
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JP
Japan
Prior art keywords
thickness
film
toyobo
adhesive layer
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009105762A
Other languages
English (en)
Japanese (ja)
Other versions
JP5599157B2 (ja
JP2010254789A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009105762A priority Critical patent/JP5599157B2/ja
Priority claimed from JP2009105762A external-priority patent/JP5599157B2/ja
Publication of JP2010254789A publication Critical patent/JP2010254789A/ja
Publication of JP2010254789A5 publication Critical patent/JP2010254789A5/ja
Application granted granted Critical
Publication of JP5599157B2 publication Critical patent/JP5599157B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009105762A 2009-04-24 2009-04-24 粘着シート Expired - Fee Related JP5599157B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009105762A JP5599157B2 (ja) 2009-04-24 2009-04-24 粘着シート

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009105762A JP5599157B2 (ja) 2009-04-24 2009-04-24 粘着シート

Publications (3)

Publication Number Publication Date
JP2010254789A JP2010254789A (ja) 2010-11-11
JP2010254789A5 true JP2010254789A5 (ko) 2012-05-31
JP5599157B2 JP5599157B2 (ja) 2014-10-01

Family

ID=43316083

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009105762A Expired - Fee Related JP5599157B2 (ja) 2009-04-24 2009-04-24 粘着シート

Country Status (1)

Country Link
JP (1) JP5599157B2 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI547534B (zh) * 2011-05-24 2016-09-01 Denka Company Ltd Two-dose temporary fixation agent composition
WO2012165201A1 (ja) * 2011-06-02 2012-12-06 株式会社きもと 易剥離性粘着フィルム
JP2013047321A (ja) 2011-07-28 2013-03-07 Nitto Denko Corp 粘着シート
JP5117629B1 (ja) * 2012-06-28 2013-01-16 古河電気工業株式会社 ウェハ加工用粘着テープ
EP2877883B1 (en) 2012-07-26 2017-08-23 3M Innovative Properties Company Heat de-bondable optical articles
CN111886309B (zh) * 2018-03-30 2022-06-10 琳得科株式会社 固化密封体的防翘曲用层叠体、以及固化密封体的制造方法
CN109449080B (zh) * 2018-11-12 2021-01-26 京东方科技集团股份有限公司 胶膜及其制备方法、显示装置及胶膜的去除方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4005218B2 (ja) * 1998-06-02 2007-11-07 三井化学株式会社 半導体ウエハ表面保護用粘着テープの使用方法
JP2000129227A (ja) * 1998-10-29 2000-05-09 Lintec Corp 半導体ウエハ保護用粘着シートおよびその使用方法
JP4849993B2 (ja) * 2006-08-14 2012-01-11 日東電工株式会社 粘着シート、その製造方法および積層セラミックシートの切断方法
JP2008297412A (ja) * 2007-05-30 2008-12-11 Nitto Denko Corp 熱剥離型粘着シート
JP5047724B2 (ja) * 2007-07-31 2012-10-10 日東電工株式会社 熱剥離型粘着シートを使用する被着体の加工方法。

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