JP2010252051A5 - Electronic device and manufacturing method thereof - Google Patents

Description

In particular, the present invention has high reliability against thermal shock such as external stress and heat cycle caused by solder reflow, and in electrical connection via a through electrode between the terminal electrode of the intermediate layer and the external terminal of the holding member. The present invention relates to an electronic device that improves connection reliability and a method for manufacturing the same.

Accordingly, the present invention has been made in view of the above-described problems of the prior art, and has high reliability against external stress caused by solder reflow, thermal shock such as heat cycle, and the like, and terminal electrodes and holding members of the intermediate layer It is an object of the present invention to provide an electronic device having improved connection reliability in electrical connection between the external terminal and a through electrode, and a method for manufacturing the same.

SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.
Application Example 1 An electronic element layer provided with a connection electrode , an external electrode , and a bonding surface of the electronic element layer and a metal brazing material are fixed in a state of overlapping with the connection electrode. comprising a bonded member, wherein the electronic element layer has a recess on a surface of the bonded member side to the connection electrode, wherein the workpieces are fitted into the recess at a position overlapping with the connecting electrode electronic device engaged, and characterized in that it comprises an electrode that electrically connects the connection electrode and the external electrode.

According to this, when the bonding of the electronic element layer and the workpieces, by mating the tip of the recess and the electrodes, since the connection electrodes and the external electrodes can be electrically connected, Ya external stress by solder reflow It has high reliability against thermal shock such as heat cycle, and can improve the reliability of electrical connection.

Application Example 2 The electronic device according to Application Example 1, wherein the electrode fitted in the recess is formed by melting a metal ball.
According to this, when the metal ball is dropped into the sealing hole, the metal ball can be fixed by the recess located on the bottom surface of the sealing hole. Therefore, the metal ball does not roll inside the sealing hole, and the irradiation positioning of the metal ball by laser irradiation can be easily performed.

Application Example 3] The electrode that is fitted in the recess, through the bonded members facing the recess, Application Example 1, which is a convex electrode that protrudes into the concave side The electronic device according to.
When the electronic element layer and the member to be bonded are bonded, the connection electrode and the external electrode can be electrically connected by fitting the tip of the electrode into the recess. Thereby, the reliability of electrical connection can be improved.

Application Example 4 The member to be joined has a wiring pattern electrically connected to the external electrode at a position overlapping the connection electrode, and the electrode fitted in the recess is electronic device according to application example 1, which is a bump disposed on Sharing, ABS line pattern.
When the electronic element layer and the member to be bonded are bonded, the connection electrode and the external electrode can be electrically connected by fitting the tip of the bump into the recess. Further, it is possible to prevent the electrode from falling off from the bonded member when the bump and the recess are fitted.

Application Example 5] The electrode that is fitted in the recess, applications wherein the a Te over path shape toward the rear surface of the members to be bonded from the bonding surface of the electronic element layer The electronic device according to any one of 1 to 4.
According to this, it is possible to prevent the electrode from dropping from the member to be joined when the electrode and the recess are fitted.

Application Example 6 The electronic device according to any one of Application Examples 3 to 5, wherein the concave portion has a tapered shape with a diameter decreasing from the opening toward the bottom surface.
According to this, since the contact area between the recess and the electrode can be increased, the electrical resistivity is lowered. Therefore, the CI value can be improved.

Application Example 7 An electronic element layer including a connection electrode having a recess, and an external electrode and a member to be bonded that is bonded to a bonding surface of the electronic element layer . a method of manufacturing an electronic device, wherein the forming the electrode protruding to the bonding surface side of the material to be joined, the said recess of the electronic element layer, by fitting the electrodes the projecting, the said electronic device layer to be A method for manufacturing an electronic device, wherein the bonding member includes a step of forming a laminate.

According to this, when the electronic element layer and the member to be joined are joined, the connection electrode and the external electrode can be electrically connected by fitting the tip of the electrode into the recess, so that the reliability of electrical connection It is possible to manufacture an electronic device with improved resistance.

It is the disassembled perspective view which looked at the piezoelectric vibrator of Example 1 which is one example of the electronic device concerning the present invention from the slanting upper part of the 1st substrate. It is the disassembled perspective view seen from the slanting lower part of the 2nd board | substrate of the piezoelectric vibrator of Example 1 which is one Example of the electronic device which concerns on this invention. 2 is a cross-sectional view of the piezoelectric vibrator of Example 1. FIG. It is a manufacturing-process figure of a 1st board | substrate. It is a manufacturing-process figure of a 2nd board | substrate. It is a manufacturing process figure of a vibrating body board. 6 is a manufacturing process diagram of a through electrode of the piezoelectric vibrator of Example 1. FIG. 6 is a cross-sectional view of a piezoelectric vibrator of Example 2. FIG. 6 is a manufacturing process diagram of a second substrate of Example 2. FIG. It is the elements on larger scale of the joining process of a penetration electrode and a recessed part. 6 is a cross-sectional view of a piezoelectric vibrator of Example 3. FIG. FIG. 12 is a manufacturing process diagram for the second substrate of Example 3. It is explanatory drawing of the conventional piezoelectric oscillator. It is explanatory drawing of the conventional thin crystal oscillator. It is explanatory drawing of the conventional crystal oscillator.

Embodiments of an electronic device and a manufacturing method thereof according to the present invention will be described below in detail with reference to the accompanying drawings.
FIG. 1 is an exploded perspective view of a piezoelectric vibrator according to a first embodiment, which is an embodiment of an electronic device according to the present invention, viewed obliquely from above a first substrate. FIG. 2 is an exploded perspective view of the piezoelectric vibrator as viewed from obliquely below the second substrate. FIG. 3 is a cross-sectional view of the piezoelectric vibrator of the first embodiment. 1 to 3 all show a piezoelectric vibrator excluding a through electrode.

Claims (7)

An electronic element layer comprising a connection electrode ;
An external electrode , and a member to be bonded that is fixed via a metal brazing material and a bonding surface of the electronic element layer in a state of overlapping with the connection electrode ,
The electronic element layer has a recess on a surface of the bonded member side to the connecting electrode,
The members to be joined is an electronic, characterized in that it comprises an electrode that is electrically connected to the fitted to the recessed portion at a position overlapping with the connection electrode and said outer electrode and the connection electrode device. The electronic device according to claim 1, wherein the electrode fitted in the recess is formed by melting a metal ball. 2. The electronic device according to claim 1, wherein the electrode fitted in the concave portion is a convex electrode that penetrates the member to be joined facing the concave portion and protrudes toward the concave portion. . The member to be joined has a wiring pattern electrically connected to the external electrode at a position overlapping the connection electrode,
The electronic device according to claim 1, wherein the electrodes are fitted into the recess is a bump that is disposed in front Sharing, ABS line pattern. The electrodes fitted in the recess, one of claims 1 to 4, characterized in that said a tape over path shape toward the rear surface of the members to be bonded from the bonding surface of the electronic element layer The electronic device according to claim 1. The electronic device according to claim 3, wherein the concave portion has a tapered shape having a diameter that decreases from the opening toward the bottom surface. A method of manufacturing an electronic device , comprising: an electronic element layer including a connection electrode having a recess; and a member to be bonded that includes an external electrode and is bonded to a bonding surface of the electronic element layer. Because
Forming an electrode protruding on the joining surface side of the material to be joined;
Wherein said recess electronic element layer, by fitting the electrodes the projecting, a method for fabricating an electronic device in which the bonded members and the electronic element layer is characterized by having a step of forming a laminate.