WO2016132765A1

WO2016132765A1 - Piezoelectric vibration device and production method therefor

Info

Publication number: WO2016132765A1
Application number: PCT/JP2016/050557
Authority: WO
Inventors: 開田　弘明; 上　慶一
Original assignee: 株式会社村田製作所
Priority date: 2015-02-18
Filing date: 2016-01-08
Publication date: 2016-08-25

Abstract

A piezoelectric vibration device (1) comprising: a piezoelectric vibrator (100) including a piezoelectric vibration piece (110) and a frame (120), said piezoelectric vibration piece (110) having vibration electrodes (130, 140) formed therein and said frame (120) being connected to a connection section of the piezoelectric vibration piece (110), enclosing the outer perimeter of the piezoelectric vibration piece (110), and having connection electrodes electrically connected to the vibration electrodes (130, 140); a lid member (200) joined to a first surface (122) of the frame (120); a base member (300) joined to a second surface (124) of the frame (120); and external electrodes (330, 332, 334, 336) electrically connected to the connection electrodes (134, 144, 154, 164) via a through-hole formed in the base member (300). The base member (300) is formed using an insulating resin material.

Description

Piezoelectric vibration device and manufacturing method thereof

The present invention relates to a piezoelectric vibration device and a manufacturing method thereof.

As an aspect of a piezoelectric vibration device used for an oscillation device, a band filter, etc., for example, a frame including a piezoelectric vibrating piece, an upper case disposed on the upper surface of the frame, and a lower case disposed on the lower surface of the frame There is known a configuration in which the upper and lower cases are joined by a sealing portion such as low-melting glass. In this configuration, for example, from the viewpoint of approximating the thermal expansion coefficient of the low melting point glass contained in the sealing portion, improving the internal airtightness, or ensuring the strength of the device, the upper case and The lower case is generally formed of a glass substrate, a ceramic substrate, or a quartz substrate (see Patent Document 1).

However, according to such a configuration, for example, a stress is applied to the joint due to a difference in thermal expansion between the frame and the upper case or the lower case, and the joint reliability may be lowered. In addition, since each case is formed of a glass substrate or the like, the processing is complicated, and it cannot always be said that it is suitable for downsizing.

JP 2004-222053 A

The present invention has been made in view of such circumstances, and an object of the present invention is to reduce the stress applied to the joint, improve the joint reliability, and easily reduce the size.

A piezoelectric vibrating device according to one aspect of the present invention is a piezoelectric vibrating piece on which an excitation electrode is formed, and a frame body that is connected to a connection portion of the piezoelectric vibrating piece and surrounds the outer periphery of the piezoelectric vibrating piece. A piezoelectric vibrator including a frame having electrically connected connection electrodes; a lid member joined to the first surface of the frame; and a second surface opposite to the first surface of the frame. A base member and an external electrode electrically connected to the connection electrode through a through hole formed in the base member, and the base member is made of an insulating resin material.

According to the above configuration, since the base member is formed of an insulating resin material, the stress applied to the joint between the frame and the base member can be reduced, and the joint reliability of the joint can be improved. it can. In addition, since the base member that is a part of the package that accommodates the piezoelectric vibrator is formed of an insulating resin material, the thickness of the piezoelectric vibration device can be easily reduced, and the size can be reduced.

In the above piezoelectric vibrating device, the piezoelectric vibrating piece may be made of quartz.

In the above piezoelectric vibrating device, the piezoelectric vibrating piece may be made of quartz crystal formed by AT cut.

In the piezoelectric vibration device, the base member may be formed of a polyimide resin or a glass epoxy resin.

In the piezoelectric vibration device, the base member may be joined to the frame body through an adhesive made of a resin material.

In the piezoelectric vibration device, the lid member may be formed of any material of insulating ceramic, silicon, and quartz.

In the above-described piezoelectric vibration device, the piezoelectric vibrator may be a MEMS (Micro Electro Mechanical Systems).

A method of manufacturing a piezoelectric vibrating device according to an aspect of the present invention includes: (a) a piezoelectric vibrating piece on which an excitation electrode is formed; and a frame body that is connected to a connecting portion of the piezoelectric vibrating piece and surrounds the outer periphery of the piezoelectric vibrating piece. Forming a piezoelectric vibrator including a frame having a connection electrode electrically connected to the excitation electrode, (b) bonding a lid member to the first surface of the frame, (c) Joining a base member to a second surface opposite to the first surface of the frame, (d) forming a through hole in the base member, and (e) electrically connecting to the connection electrode through the through hole. The base member is formed of an insulating resin material.

According to the above configuration, since the base member is formed of an insulating resin material, a piezoelectric vibration device that can reduce the stress applied to the joint between the frame and the base member can be manufactured. Further, since the base member that is a part of the package is formed of an insulating resin material, the thickness of the piezoelectric vibration device 1 can be easily reduced, and the size can be reduced. Furthermore, since the base member is formed of a resin material, the piezoelectric vibrator can be packaged by a simple method.

In the above method for manufacturing a piezoelectric vibrating device, a first aggregate substrate that is an aggregate of a plurality of piezoelectric vibrators, a second aggregate substrate that is an aggregate of a plurality of lid members, and a first aggregate that is an aggregate of a plurality of base members. Further comprising preparing each of the three aggregate substrates, and after performing (a) to (e) on any of the first to third aggregate substrates, cutting the first to third aggregate substrates (for example, dicing or It may further include dividing each of the plurality of piezoelectric vibrating devices into pieces by irradiating and cutting a light beam such as a laser beam.

In the method for manufacturing a piezoelectric vibration device, in (e), solder balls as external electrodes may be formed by providing solder paste in through holes and reflow melting the solder paste.

According to the present invention, the stress applied to the joint between the frame and the base member can be reduced, and the size can be easily reduced.

FIG. 1 is a schematic perspective view for explaining the piezoelectric vibration device according to the present embodiment. FIG. 2 is an exploded perspective view for explaining the piezoelectric vibrating device according to the present embodiment. 3 is a cross-sectional view taken along line III-III in FIG. FIG. 4 is a view for explaining the method of manufacturing the piezoelectric vibrating device according to this embodiment. FIG. 5 is a flowchart showing a method for manufacturing the piezoelectric vibrating device according to this embodiment. FIG. 6 is a schematic perspective view for explaining a piezoelectric vibrator according to a modification of the present embodiment. FIG. 7 is a schematic perspective view for explaining a piezoelectric vibrator according to a modification of the present embodiment.

Embodiments of the present invention will be described below. In the following description of the drawings, the same or similar components are denoted by the same or similar reference numerals. The drawings are exemplary, the dimensions and shapes of each part are schematic, and the technical scope of the present invention should not be construed as being limited to the embodiments.

(Piezoelectric vibration device)
The piezoelectric vibration device according to this embodiment will be described with reference to FIGS. Here, FIG. 1 is a schematic perspective view for explaining the piezoelectric vibration device according to the present embodiment, FIG. 2 is an exploded perspective view of the piezoelectric vibration device according to the present embodiment, and FIG. Fig. 3 is a sectional view taken along line III-III.

As shown in FIG. 1, the piezoelectric vibration device 1 according to this embodiment includes a piezoelectric vibrator 100, a lid member 200, and a base member 300. The lid member 200 and the base member 300 are cases or packages for housing a part of the piezoelectric vibrator 100 (piezoelectric vibrating piece). The piezoelectric vibrator 100, the lid member 200, and the base member 300 have substantially the same size and shape in an XY plan view, for example, a substantially rectangular shape having a longitudinal direction parallel to the X direction and a short direction parallel to the Y direction. It has the outer shape. In FIG. 1, external electrodes are omitted.

As shown in FIG. 2, the piezoelectric vibrator 100 includes a piezoelectric vibrating piece 110 and a frame body 120 that surrounds the outer periphery of the piezoelectric vibrating piece 110. The piezoelectric vibrating piece 110 has a connecting portion 111 with the frame body 120, and the connecting portion 111 is disposed at one end in the longitudinal direction of the piezoelectric vibrating piece 110. That is, the piezoelectric vibrating piece 110 is provided apart from the frame body 120 except for the connection portion 111. The piezoelectric vibrating piece 110 may have, for example, a substantially rectangular outer shape.

The piezoelectric vibrating piece 110 and the frame body 120 may be integrally formed from a given piezoelectric material. The piezoelectric material used for the piezoelectric vibrating piece 110 and the frame body 120 is not limited, but may be, for example, quartz or quartz formed by AT cut. The piezoelectric vibrator 100 using an AT-cut quartz has extremely high frequency stability in a wide temperature range, is excellent in aging characteristics, and can be manufactured at low cost. In addition, the piezoelectric vibrator 100 made of AT-cut quartz often uses a thickness shear vibration mode as a main vibration. The piezoelectric vibrating piece 110 and the frame body 120 are not limited to being formed of the same material, and may be formed of different materials. In this case, at least the piezoelectric vibrating piece 110 may be formed of a piezoelectric material.

The piezoelectric vibrating piece 110 and the frame body 120 may be integrally formed from a silicon single crystal material. In this case, it may be a silicon MEMS (Micro Electro-Mechanical Systems), a so-called Si-MEMS, in which a device is fabricated on a wafer-like silicon material by a semiconductor manufacturing technique (mask exposure and etching, etc.). A so-called piezoelectric MEMS such as AlN, LT, PZT, or the like may be used. In this case, the lid member is preferably made of a silicon material having a close thermal expansion coefficient, which reduces the stress at the joint.

The first excitation electrode 130 is formed on the first surface 112 of the piezoelectric vibrating piece 110, while the second excitation electrode 140 is formed on the second surface 114 of the piezoelectric vibrating piece 110. The first and

second excitation electrodes

130 and 140 are arranged as a pair of electrodes so as to substantially overlap each other in the XY plan view. An extension electrode 132 that is electrically connected to the first excitation electrode 130 is formed on the first surface 122 of the frame body 120. The extension electrode 132 extends from the first excitation electrode 130 through the connection portion 111 toward one end in the longitudinal direction of the piezoelectric vibrator 100 (end in the negative X-axis direction), and the piezoelectric vibrator 100. Extending toward one end in the short direction (end in the negative Y-axis direction), and further extending to the second surface 124 of the frame body 120 through the side surface of the frame body 120 on the piezoelectric vibrating piece side. The electrode is electrically connected to the connection electrode 134 formed on this surface. On the other hand, an extended electrode 142 that is electrically connected to the second excitation electrode 140 is formed on the second surface 124 of the frame body 120. The extension electrode 142 extends from the second excitation electrode 140 through the connection portion 111 toward one end in the longitudinal direction of the piezoelectric vibrator 100 (end in the negative direction of the X axis), and the piezoelectric vibrator 100. Is extended toward the other end in the short direction (end in the positive Y-axis direction), and is electrically connected to the connection electrode 144 formed on the second surface 124 of the frame body 120. In addition,

other connection electrodes

154 and 164 may be formed on the second surface 124 of the frame body 120. In the example shown in FIG. 2, on the second surface 124 of the frame body 120, the other end in the longitudinal direction of the piezoelectric vibrator 100 (the end portion in the positive X-axis direction) and the other end in the short direction of the piezoelectric vibrator 100. A connection electrode 154 is formed on the (Y-axis positive end), the other end in the longitudinal direction of the piezoelectric vibrator 100 (X-axis positive end), and the short side of the piezoelectric vibrator 100. A connection electrode 164 is formed at one end (end in the negative Y-axis direction). As described above, in the example shown in FIG. 2, the

connection electrodes

134 and 144 electrically connected to the first and

second excitation electrodes

130 and 140 are connected to one end side in the longitudinal direction of the frame body 120 (that is, the X-axis negative electrode). The

connection electrodes

154 and 164 are arranged at the other end in the longitudinal direction of the frame body 120 (that is, the short side in the positive direction of the X axis).

In the example shown in FIG. 2, the

connection electrodes

134 and 144 are arranged at two corners on the same short side of the frame 120, and the

connection electrodes

154 and 164 are 2 on the other short side of the frame 120. However, the arrangement of the

connection electrodes

134, 144, 154, 164 is not limited to this, and for example, the

connection electrodes

134, 144 are two on the same long side of the frame 120. The

connection electrodes

154 and 164 may be disposed at the two corners on the other long side of the frame body 120, or the

connection electrodes

134 and 144 may be disposed at the corner portion in the XY plan view. The

connection electrodes

154 and 164 may be arranged at two corners on the other diagonal. In this case, the extension electrode may be appropriately extended between the excitation electrode and the connection electrode.

Each of the electrodes including the first and

second excitation electrodes

130 and 140 may be formed, for example, by forming a base with a chromium (Cr) layer and forming a gold (Au) layer on the surface of the chromium layer. It is not limited.

The lid member 200 is bonded to the first surface 122 of the frame body 120 via the bonding material 210. The lid member 200 may be formed of, for example, any material of insulating ceramic, silicon, and quartz. For example, the lid member 200 may be formed of the same material (for example, quartz) as the piezoelectric vibrator 100.

The bonding material 210 is integrally provided along the outer periphery of the frame body 120 and hermetically seals the gap between the lid member 200 and the frame body 120 without a gap. Although the material of the bonding material 210 is not limited, for example, low melting point glass (for example, lead boric acid type or tin phosphoric acid type), glass that is dried at a low temperature (for example, alumina, silica, etc.), resin material, etc. (For example, an epoxy adhesive) can be used.

The base member 300 is joined to the second surface 124 of the frame body 120 via the adhesive 310. The base member 300 is formed of a material different from that of the lid member 200, and specifically is formed of an insulating resin material. As such an insulating resin material, a material having heat resistance to a solder reflow temperature (for example, a temperature of 270 ° C. to 300 ° C. or more) in the manufacturing process of the piezoelectric vibration device is selected. A polyimide resin may be used as such a material having heat resistance. Alternatively, the base member 300 is not particularly limited as long as it is formed of an insulating resin material. Other organic materials (for example, epoxy resins) or inorganic and organic composite materials (for example, glass) Epoxy resin) or the like. Note that the base member 300 may be formed of a material having higher flexibility than the piezoelectric vibrator 100 and / or the lid member 200.

The adhesive 310 is integrally provided along the outer periphery of the frame body 120 and hermetically seals the gap between the base member 300 and the frame body 120 without any gap. Although the material of the adhesive 310 is not limited, it is preferable that it is a resin material (for example, epoxy adhesive) similarly to the material of the base member 300.

As shown in FIG. 3, the lid member 200 and the base member 300 are bonded to both surfaces of the frame 120 of the piezoelectric vibrator 100, whereby the piezoelectric vibrating piece 110 is hermetically sealed in the internal space (cavity) 150. . The piezoelectric vibrator 100 is supported by the lid member 200 and the base member 300 so that one end where the

connection electrodes

134 and 144 are disposed is a fixed end, and the other end of the piezoelectric vibrator 100 is a free end. .

As shown in FIG. 2, the base member 300 is provided with a plurality of

external electrodes

330, 332, 334, and 336 on a second surface 304 opposite to the first surface 302 on which the piezoelectric vibrator 100 is mounted. . The plurality of

connection electrodes

134, 144, 154, 164 provided on the second surface 124 of the frame body 120 are arranged corresponding to the plurality of external electrodes 330 to 336. For example, as shown in FIG. 2, the plurality of connection electrodes 134 to 164 and the plurality of external electrodes 330 to 336 are arranged at corresponding corner portions of the base member 300, respectively. May be. Each connection electrode and the corresponding external electrode are electrically connected through a through hole (see FIG. 3). The through hole is formed through both the base member 300 and the adhesive 310, but the through hole is omitted in FIG.

In the example shown in FIG. 2, the connection electrode 134 is electrically connected to the first excitation electrode 130, and the other one connection electrode 144 is electrically connected to the second excitation electrode 140. The remaining

connection electrodes

154 and 164 are not electrically connected to the first and

second excitation electrodes

130 and 140. That is, the

connection electrodes

154 and 164 and the corresponding

external electrodes

334 and 336 may be dummy electrodes. The dummy electrode may be grounded.

In the example shown in FIG. 2, among the plurality of external electrodes 330 to 336, the

external electrodes

330 and 332 that are electrically connected to the first and

second excitation electrodes

130 and 140 are arranged on the short side of the base member 300. However, the present invention is not limited to this, and may be arranged at two corners on the diagonal in the XY plan view. In addition, about a connection electrode and an external electrode, the number of those electrodes, arrangement | positioning of an electrode, and a pattern shape are not specifically limited.

As shown in FIG. 3, the

external electrodes

332 and 334 are electrically connected to the

connection electrodes

144 and 154 through the through

holes

342 and 344. The through

holes

342 and 344 are filled with a conductive material, whereby electrical conduction between the second surface 124 of the frame 120 and the second surface 304 of the base member 300 can be achieved. Similarly, the

external electrodes

330 and 336 are electrically connected to the

corresponding connection electrodes

134 and 164 via through holes (not shown).

In such a piezoelectric vibration device 1, by applying an AC voltage between the pair of first and

second excitation electrodes

130 and 140 in the piezoelectric vibrator 100 via the

external electrodes

330 and 332, the thickness shear mode is applied. As a result, the piezoelectric vibrating piece 110 vibrates, and resonance characteristics associated with the vibration are obtained.

According to the piezoelectric vibration device 1 according to the present embodiment, since the base member 300 is formed of an insulating resin material, stress applied to the joint portion (including the adhesive 310) between the frame body 120 and the base member 300 is reduced. Can be made. Thereby, it can prevent that the joint reliability of the frame 120 and the base member 300 falls by the stress added to a junction part, and also prevents that the sealing reliability by a junction part falls. be able to. In addition, since the base member 300 that is a part of the package that accommodates the piezoelectric vibrator 100 is formed of an insulating resin material, the thickness of the piezoelectric vibration device 1 can be easily reduced and the size can be reduced. it can.

(Method for manufacturing piezoelectric vibration device)
Next, a manufacturing method of the piezoelectric vibrating device according to the present embodiment will be described with reference to FIGS. In the following, as an example of a manufacturing method, a mode called so-called wafer level CSP (Chip Size Package), which performs packaging up to a wafer state, will be described.

First, as shown in FIG. 4, a first aggregate substrate 1000 that is an aggregate of a plurality of piezoelectric vibrators 100a, a second aggregate substrate 2000 that is an aggregate of a plurality of lid members 200a, and a plurality of base members 300a. A third aggregate substrate 3000, which is an aggregate, is prepared (S10 in FIG. 5). The plurality of piezoelectric vibrators 100a of the first collective substrate 1000 are areas corresponding to the piezoelectric vibrators 100, and the plurality of lid members 200a of the second collective board 2000 are areas corresponding to the lid members 200, respectively. Each of the plurality of base members 300a of the third collective substrate 3000 is a region corresponding to the base member 300, and each of them has a state before being cut into pieces by dicing or laser light. The first to third

collective substrates

1000, 2000, and 3000 have substantially the same planar dimensions and external shape.

For example, the first collective substrate 1000 forms the outer shape of the piezoelectric vibrating piece 110 and the frame body 120 on each piezoelectric vibrator 100a by etching a quartz substrate, and then first and Various electrodes including the

second excitation electrodes

130 and 140 are formed (see FIG. 2).

Next, the first collective substrate 1000 and the second collective substrate 2000 are bonded through the bonding material 210 (S12 in FIG. 5). Thereafter, the frequency of each piezoelectric vibrator 100a of the first collective substrate 1000 is adjusted as necessary. For example, the frequency adjustment may be performed by irradiating the surface of the piezoelectric vibrator 100a with a light beam such as a laser beam on a metal cover for frequency adjustment (for example, the second excitation electrode 140). The frequency adjustment may be performed on the first collective substrate 1000 before bonding.

Next, the first collective substrate 1000 and the third collective substrate 3000 are joined via the adhesive 310 (S14 in FIG. 5). Specifically, the adhesive 310 is applied to the second surface 124 of the frame body 120 of the first collective substrate 1000, and then the third collective substrate 3000 is bonded to the first collective substrate 1000 for bonding. At that time, the insulating resin material is thermally cured by heating the third aggregate substrate 3000. Thus, a laminated body of the first to third

aggregate substrates

1000, 2000, and 3000 is formed.

Next, in each of the plurality of base members 300a of the third collective substrate 3000, a plurality of through holes (see FIG. 5) corresponding to the

connection electrodes

134, 144, 154, 164 formed on the second surface 124 of the frame body 120 are formed. 3 through holes 342 and 344) (S16 in FIG. 5). Specifically, a through-hole penetrating the third collective substrate 3000 and the adhesive 310 is formed by laser light, and then the through-hole is filled with a metal material by a plating method or the like to connect the connection electrode 134 of the piezoelectric vibrator 100a. , 144, 154, 164 are electrically and mechanically connected.

Next, solder paste is provided in the through holes of the third aggregate substrate 3000, and the solder paste is reflow-melted (S18 in FIG. 5). The solder paste can be provided at a position corresponding to each through hole (filled with a metal material by plating) using a printing method such as screen printing. Then, solder balls as the external electrodes 330 to 336 can be formed by reflow melting the solder.

Finally, the laminated body of the first to third

collective substrates

1000, 2000, and 3000 is cut by irradiating a light beam such as dicing or laser light, thereby having the piezoelectric vibrator 100, the lid member 200, and the base member 300. The piezoelectric vibrator 1 can be cut into individual pieces (S20 in FIG. 5).

According to the method for manufacturing the piezoelectric vibration device 1 according to the present embodiment, the third aggregate substrate 3000 (base member 300) is formed of an insulating resin material, and therefore, the joint portion (adhesive 310) between the frame body 120 and the base member 300. The piezoelectric vibration device 1 that can reduce the stress applied to the Thereby, it can prevent that the joint reliability of the frame 120 and the base member 300 falls by the stress added to a junction part, and also prevents that the sealing reliability by a junction part falls. be able to. In addition, since the base member 300 which is a part of the package is formed of an insulating resin material, the thickness of the piezoelectric vibration device 1 can be easily reduced and the size can be reduced. Furthermore, since the third aggregate substrate 3000 is a resin material, the piezoelectric vibrator 100 can be packaged by a simple method.

The present invention is not limited to the above embodiment and can be applied in various modifications. For example, in the above-described embodiment, the configuration in which only the base member 300 is formed of the insulating resin material among the lid member 200 and the base member 300 has been described, but the present invention is not limited to this, and the lid member 200 may also be formed of an insulating resin material such as an organic material (for example, polyimide resin or epoxy resin) or an inorganic and organic composite material (for example, glass epoxy resin). Thereby, further miniaturization of the piezoelectric vibration device can be achieved.

In the above-described embodiment, the configuration in which one connecting portion 111 with the frame body 120 in the piezoelectric vibrating piece 110 is provided at one end in the longitudinal direction of the piezoelectric vibrating piece 110 is shown. The location and the number thereof are not limited, and the electrical connection between the excitation electrode and the connection electrode can be performed by appropriately changing the pattern shape of the extension electrode. Hereinafter, a modification of the piezoelectric vibrator will be described in this regard.

FIG. 6 is a perspective view of a piezoelectric vibrator 400 according to a modification of the present embodiment. The piezoelectric vibrator 400 includes a piezoelectric vibrating piece 410 and a frame 420, and two connecting

portions

411a and 411b are provided at one end in the longitudinal direction of the piezoelectric vibrating piece 410 (end portion in the negative direction of the X axis). ing. A first excitation electrode 430 is formed on the first surface 412 of the piezoelectric vibrating piece 410, while a second excitation electrode 440 is formed on the second surface 414 of the piezoelectric vibrating piece 410. An extension electrode 432 that is electrically connected to the first excitation electrode 430 is formed on the first surface 422 of the frame body 420. The extension electrode 432 extends from the first excitation electrode 430 through the connecting portion 411a toward one end in the longitudinal direction of the piezoelectric vibrator 400 (end in the negative X-axis direction), and the piezoelectric vibrator 400. Extending toward one end in the short direction (end in the negative Y-axis direction), and further extending to the second surface 424 of the frame body 420 through the side surface of the frame body 420 on the piezoelectric vibrating piece side. , And electrically connected to the connection electrode 434 formed on this surface. On the other hand, an extended electrode 442 that is electrically connected to the second excitation electrode 440 is formed on the second surface 424 of the frame body 420. The extension electrode 442 extends from the second excitation electrode 440 through the connection portion 411b toward one end in the longitudinal direction of the piezoelectric vibrator 400 (end in the negative X-axis direction), and the piezoelectric vibrator 400. Is extended toward the other end in the lateral direction (end in the positive Y-axis direction), and is electrically connected to the connection electrode 444 formed on the second surface 424 of the frame body 420. Further,

other connection electrodes

454 and 464 may be formed on the second surface 424 of the frame body 420. In the example shown in FIG. 6, on the second surface 424 of the frame body 420, the other end in the longitudinal direction of the piezoelectric vibrator 400 (the end portion in the X-axis positive direction) and the other end in the short direction of the piezoelectric vibrator 400. A connection electrode 454 is formed on the (end portion in the positive direction of the Y axis), and is connected to the other end in the longitudinal direction (end portion in the positive direction of the X axis) of the piezoelectric vibrator 400 and in the short direction of the piezoelectric vibrator 400. A connection electrode 464 is formed at one end (end in the negative Y-axis direction). As described above, in the example shown in FIG. 6, the

connection electrodes

434 and 444 electrically connected to the first and

second excitation electrodes

430 and 440 are connected to one end side in the longitudinal direction of the frame body 420 (that is, the X-axis negative electrode). The

connection electrodes

454 and 464 are disposed on the other end in the longitudinal direction of the frame body 420 (that is, on the short side in the X-axis positive direction).

FIG. 7 is a perspective view of a piezoelectric vibrator 500 according to another modification of the present embodiment. The piezoelectric vibrator 500 includes a piezoelectric vibrating piece 510 and a frame body 520, and a connecting portion 511 a is provided at the other end in the longitudinal direction of the piezoelectric vibrating piece 510 (end in the positive X-axis direction). A connecting portion 511b is provided at one end in the longitudinal direction (end in the negative X-axis direction). A first excitation electrode 530 is formed on the first surface 512 of the piezoelectric vibrating piece 510, while a second excitation electrode 540 is formed on the second surface 514 of the piezoelectric vibrating piece 510. In addition, an extended electrode 532 that is electrically connected to the first excitation electrode 530 is formed on the first surface 522 of the frame 520. The extension electrode 532 extends from the first excitation electrode 530 through the connection portion 511a toward the other end in the longitudinal direction of the piezoelectric vibrator 500 (end in the positive X-axis direction), and the piezoelectric vibrator 500. Extending toward one end in the short direction (end in the negative Y-axis direction), and further extending to the second surface 524 of the frame 520 through the side surface of the frame 520 on the piezoelectric vibrating piece side. , And electrically connected to the connection electrode 564 formed on this surface. On the other hand, an extended electrode 542 that is electrically connected to the second excitation electrode 540 is formed on the second surface 524 of the frame 520. The extension electrode 542 extends from the second excitation electrode 540 through the connection portion 511b toward one end in the longitudinal direction of the piezoelectric vibrator 500 (end part in the negative X-axis direction), and the piezoelectric vibrator 500. Is extended toward the other end in the lateral direction (end in the positive Y-axis direction), and is electrically connected to a connection electrode 544 formed on the second surface 524 of the frame 520. In addition,

other connection electrodes

534 and 554 may be formed on the second surface 524 of the frame 520. In the example shown in FIG. 7, on the second surface 524 of the frame body 520, one end in the longitudinal direction of the piezoelectric vibrator 500 (end in the negative X-axis direction) and one end in the short direction of the piezoelectric vibrator 500. A connection electrode 534 is formed on the (Y-axis negative direction end), and is connected to the other end in the longitudinal direction of the piezoelectric vibrator 500 (X-axis positive direction end) and in the short direction of the piezoelectric vibrator 500. A connection electrode 554 is formed on the other end (end in the Y-axis positive direction). As described above, in the example illustrated in FIG. 7, the

connection electrodes

544 and 564 electrically connected to the first and

second excitation electrodes

530 and 540 have two corners on the diagonal of the frame 520 in the XY plan view. The

connection electrodes

534 and 554 are arranged at two corners on the other diagonal of the frame 520.

Each embodiment described above is for facilitating understanding of the present invention, and is not intended to limit the present invention. The present invention can be changed / improved without departing from the spirit thereof, and the present invention includes equivalents thereof. In other words, those obtained by appropriately modifying the design of each embodiment by those skilled in the art are also included in the scope of the present invention as long as they include the features of the present invention. For example, each element included in each embodiment and its arrangement, material, condition, shape, size, and the like are not limited to those illustrated, and can be changed as appropriate. In addition, each element included in each embodiment can be combined as much as technically possible, and combinations thereof are included in the scope of the present invention as long as they include the features of the present invention.

DESCRIPTION OF SYMBOLS 100 Piezoelectric vibrator 110 Piezoelectric vibration piece 111 Connection part 112 1st surface 114 2nd surface 120 Frame 122 1st surface 124 2nd surface 130 1st excitation electrode 134 Connection electrode 140 2nd excitation electrode 144,154,164 Connection electrode 200 Lid member 210 Bonding material 300 Base member 310

Adhesive

330, 332, 334, 336

External electrode

342, 344 Through hole 1000 First collective substrate (100a piezoelectric vibrator)
2000 Second collective substrate (200a lid member)
3000 Third collective substrate (300a base member)

Claims

A piezoelectric vibrating piece on which an excitation electrode is formed, and a frame body that is connected to a connection portion of the piezoelectric vibrating piece and surrounds the outer periphery of the piezoelectric vibrating piece, the connection electrode being electrically connected to the excitation electrode; A piezoelectric vibrator including a frame body having
A lid member joined to the first surface of the frame;
A base member joined to a second surface opposite to the first surface of the frame;
An external electrode electrically connected to the connection electrode through a through hole formed in the base member;
With
The base member is a piezoelectric vibration device formed of an insulating resin material.
The piezoelectric vibrating device according to claim 1, wherein the piezoelectric vibrating piece is made of quartz.
The piezoelectric vibrating device according to claim 2, wherein the piezoelectric vibrating piece is made of quartz formed by AT cut.
The piezoelectric vibration device according to any one of claims 1 to 3, wherein the base member is formed of a polyimide resin or a glass epoxy resin.
The piezoelectric vibration device according to any one of claims 1 to 4, wherein the base member is bonded to the frame body through an adhesive made of a resin material.
The piezoelectric vibrating device according to any one of claims 1 to 5, wherein the lid member is formed of any one of insulating ceramic, silicon, and quartz.
The piezoelectric vibration device according to any one of claims 1 to 6, wherein the piezoelectric vibrator is a MEMS (Micro-Electro-Mechanical-System).
(A) A piezoelectric vibrating piece on which an excitation electrode is formed, and a frame that is connected to a connection portion of the piezoelectric vibrating piece and surrounds the outer periphery of the piezoelectric vibrating piece, and is electrically connected to the excitation electrode Forming a piezoelectric vibrator including a frame having connection electrodes;
(B) joining a lid member to the first surface of the frame;
(C) joining a base member to a second surface opposite to the first surface of the frame;
(D) forming a through hole in the base member; and
(E) forming an external electrode electrically connected to the connection electrode through the through hole;
Including
The base member is a method of manufacturing a piezoelectric vibration device formed of an insulating resin material.
A first aggregate substrate that is an aggregate of the plurality of piezoelectric vibrators, a second aggregate substrate that is an aggregate of the plurality of lid members, and a third aggregate substrate that is an aggregate of the base members are prepared. Further comprising:
After the steps (a) to (e) are performed on any of the first to third collective substrates, the first to third collective substrates are cut, so that each of the plurality of piezoelectric vibration devices is individually separated. The method for manufacturing a piezoelectric vibration device according to claim 8, further comprising making a piece.
10. The method of manufacturing a piezoelectric vibration device according to claim 8, wherein in (e), a solder ball is formed as the external electrode by providing a solder paste in the through hole and reflow melting the solder paste.