WO2015045906A1 - Crystal oscillator - Google Patents

Crystal oscillator Download PDF

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Publication number
WO2015045906A1
WO2015045906A1 PCT/JP2014/074223 JP2014074223W WO2015045906A1 WO 2015045906 A1 WO2015045906 A1 WO 2015045906A1 JP 2014074223 W JP2014074223 W JP 2014074223W WO 2015045906 A1 WO2015045906 A1 WO 2015045906A1
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Prior art keywords
packaging material
crystal
crystal oscillator
mounting
oscillator according
Prior art date
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PCT/JP2014/074223
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French (fr)
Japanese (ja)
Inventor
道保 串田
雄一郎 長峰
賢司 高山
博文 粟林
開田　弘明
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株式会社村田製作所
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Publication of WO2015045906A1 publication Critical patent/WO2015045906A1/en

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H03H9/0552—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement the device and the other elements being mounted on opposite sides of a common substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type

Definitions

  • the present invention relates to a crystal oscillator in which a crystal resonator is sealed with first and second packaging materials.
  • Patent Document 1 discloses a crystal resonator, a ceramic substrate on which the crystal resonator is mounted, a resin substrate connected to the bottom surface of the ceramic substrate, and a mounting provided on the bottom surface of the resin substrate.
  • a crystal oscillation module comprising an electrode for use is disclosed.
  • connection electrode is provided, and the connection electrode of the ceramic substrate and the connection electrode of the resin substrate are connected via solder.
  • a reflow method is generally used. Due to the heat at the time of reflow, in the crystal oscillation module as in Patent Document 1, the solder that connects the connection electrode of the ceramic substrate and the connection electrode of the resin substrate tends to be remelted. In some cases, the connecting electrodes to be short-circuited.
  • the solder may be remelted to cause a positional shift in the surface direction between the ceramic substrate and the resin substrate. Due to this displacement, the planar shape becomes large, and it is difficult to reduce the size of the crystal oscillation module.
  • An object of the present invention is to provide a crystal oscillator that can suppress a short circuit between adjacent electrodes and can be miniaturized.
  • the crystal oscillator according to the present invention includes a first packaging material having a crystal resonator mounting surface, a crystal resonator mounted on the crystal resonator mounting surface of the first packaging material, and the first A second packaging material which is bonded to the packaging material and forms a sealed space with the first packaging material so that the crystal unit is sealed; and the first package A plurality of terminal electrodes provided on a surface of the packaging material opposite to the crystal resonator mounting surface and a surface of the first packaging material opposite to the crystal resonator mounting surface.
  • a mounting member provided to be electrically connected to the terminal electrode, and a plurality of solders provided to electrically connect and mechanically connect the plurality of terminal electrodes and the mounting member.
  • a space for placing electronic components is provided on the surface of the first packaging material opposite to the crystal resonator mounting surface.
  • an insulating resin is provided in a region between the plurality of solders between the mounting member and the second packaging material.
  • a plurality of the mounting members are arranged.
  • the plurality of mounting members are arranged so that the space for arranging electronic components is provided between the plurality of mounting members.
  • the mounting members are located at both ends in the length direction of the first packaging material.
  • the mounting member is provided with an opening for arranging the electronic component.
  • the insulating resin is an insulating adhesive.
  • a groove extending in the width direction of the mounting member is provided between the solder and the insulating resin in the mounting member.
  • the crystal oscillator according to the present invention even when the solder is remelted by heat during reflow, the insulating resin is provided in the region between the plurality of solders, so that short-circuiting between adjacent electrodes can be suppressed. . Moreover, since the said insulating resin layer is hard to fuse
  • FIGS. 2A and 2B are a schematic plan view showing the electrode shape on the upper surface of the crystal resonator used in the crystal oscillator according to the first embodiment of the present invention, and the electrode shape on the lower surface. It is a schematic plan view to show.
  • FIG. 3 is a schematic cross-sectional view of a crystal oscillator according to a second embodiment of the present invention.
  • FIG. 4 is a plan view seen from the bottom surface of the crystal oscillator according to the third embodiment of the present invention.
  • FIG. 5 is a schematic cross-sectional view showing a modification of the crystal oscillator according to the second embodiment.
  • FIG. 1A is a schematic plan view of a crystal oscillator according to an embodiment of the present invention.
  • 1B is a cross-sectional view taken along the line AA in FIG. 1A
  • FIG. 1C is a cross-sectional view taken along the line BB in FIG. 1A.
  • the crystal oscillator 1 includes a first packaging material 2 having a crystal resonator mounting surface 2a.
  • the first packaging material 2 has a rectangular plate shape.
  • an appropriate material is used for the first packaging material 2
  • the first packaging material 2 is made of an appropriate insulating material such as an insulating ceramic such as alumina or a synthetic resin.
  • a crystal resonator 5 is supported by a cantilever on the first packaging material 2.
  • the crystal unit 5 is supported by the first and second conductive adhesive layers 3 and 4.
  • the crystal unit 5 is surrounded by a second packaging material 6. That is, the crystal unit 5 is accommodated in a package made of the first and second packaging materials 2 and 6.
  • the second packaging material 6 is made of metal. But you may comprise the 2nd packaging material 6 with appropriate materials other than a metal.
  • the second packaging material 6 has an opening that opens downward. The edge of this opening is bonded to the crystal resonator mounting surface 2 a of the first packaging material 2 by the conductive bonding agent 7. As a result, a package having a hollow structure is formed.
  • the conductive bonding agent 7 Au, Sn, an alloy of Au and Sn, or the like can be used. But you may connect the 1st packaging material 2 and the 2nd packaging material 6 with another joining method.
  • the crystal unit 5 has a crystal substrate 5a.
  • the quartz substrate 5a has a rectangular plate shape.
  • the upper surface of the quartz substrate 5a has a pair of long sides and a pair of short sides.
  • the direction in which the long side extends is the length direction, and the direction in which the short side extends is the width direction.
  • the crystal unit 5 is supported by the first and second conductive adhesive layers 3 and 4 in a cantilever manner as shown in FIG. That is, the crystal unit 5 is supported by one of the short side portions, and the short side on the opposite side is a free end.
  • the first and second conductive adhesive layers 3 and 4 can be formed using a conductive adhesive obtained by dispersing an appropriate conductive material in an appropriate synthetic resin.
  • a conductive adhesive it is desirable to use a silicon-based conductive adhesive.
  • a first vibrating electrode 8 shown in FIG. 2A is formed on the upper surface of the quartz substrate 5a.
  • a second vibrating electrode 9 shown in FIG. 2B is formed on the lower surface of the quartz substrate 5a.
  • the first and second vibrating electrodes 8 and 9 are provided so as to overlap with each other through the quartz substrate 5a.
  • the first and second vibrating electrodes 8 and 9 are partially formed on the upper and lower surfaces of the quartz crystal substrate 5a.
  • the first extraction electrode 10 is connected to the first vibration electrode 8.
  • the first extraction electrode 10 extends from the upper surface of the quartz substrate 5a to the lower surface through one short side surface. That is, the extraction electrode portion 10a shown in FIG. 2 is located on the lower surface of the crystal substrate 5a.
  • a second extraction electrode 11 is connected to the second vibration electrode 9.
  • the second lead electrode 11 has a lead electrode portion 11a on one short side of the quartz substrate 5a.
  • the extraction electrode portion 10a and the extraction electrode portion 11a are located on both sides in the width direction on the lower surface of the crystal substrate 5a.
  • the lead electrode portions 10a and 11a correspond to portions joined by the conductive adhesive layers 3 and 4, respectively.
  • the crystal unit 5 is mounted on the crystal unit mounting surface 2 a of the first packaging material 2.
  • the first packaging material 2 also has a rectangular planar shape. Then, the crystal unit 5 is mounted on the first packaging material 2 so that the width direction of the crystal substrate 5 a is also the width direction of the first packaging material 2.
  • the length direction of the quartz substrate 5 a is the length direction of the first packaging material 2.
  • the first packaging material 2 is provided with a via-hole electrode that penetrates in the thickness direction of the first packaging material 2 (not shown).
  • the via-hole electrodes are provided on the first and second conductive adhesive layers 3 and 4 and the first packaging material 2 on the surface opposite to the crystal resonator mounting surface 2a. It is provided to electrically connect the second terminal electrodes 12 and 13.
  • First and second mounting members 14 and 15 for connecting to the terminal electrodes 12 and 13 are provided on the surface of the first packaging material 2 opposite to the crystal resonator mounting surface 2a.
  • the first and second mounting members 14 and 15 are made of glass epoxy. But the 1st, 2nd mounting members 14 and 15 may be constituted by other materials, such as insulating ceramics, such as alumina.
  • the first and second mounting members 14 and 15 have a rectangular plate shape.
  • the top surfaces of the first and second mounting members 14 and 15 also have a pair of long sides and a pair of short sides.
  • the direction in which the long side extends is the length direction, and the direction in which the short side extends is the width direction.
  • the first and second mounting members 14 and 15 are arranged below the first packaging material 2 so that the length direction is the width direction of the first packaging material 2.
  • the 1st, 2nd mounting members 14 and 15 are provided so that it may be located in the both ends of the length direction of the 1st packaging material.
  • an electronic component 22 such as a thermistor or an IC can be arranged. Further, it is possible to promote air convection and improve the thermal followability of the first package material 2 and further the crystal oscillator 1. Further, when the IC is housed, the heat dissipation effect can be enhanced.
  • the space 16 is a part where the electronic component 22 is arranged.
  • the first mounting member 14 and the second mounting member 15 are provided so as to protrude from the surface of the first packaging material 2 on the side opposite to the crystal resonator element mounting surface 2a. Therefore, the space 16 is a space sandwiched between the first and second mounting members 14 and 15, and the electronic component 22 is disposed in the space 16 so as to be accommodated in this space.
  • the first and second mounting members 14 and 15 which are two mounting members are used.
  • three or more mounting members may be provided.
  • two mounting members can be provided not only in the length direction of the first packaging material 2 but also in the width direction.
  • the first and second connection electrodes 17 extending from the upper surface of the first and second mounting members 14 and 15 to the lower surface through the side surfaces at both ends in the width direction of the first and second mounting members 14 and 15. , 18 are provided.
  • the connection electrodes 17a and 18a located on the upper surface are connected to the first and second terminal electrodes 12 and 13 attached to the first packaging material 2 via the first and second solders 19 and 20, respectively. Electrically connected and mechanically joined. Accordingly, the first and second mounting members 14 and 15 are electrically connected to the first packaging material 2.
  • the connection electrodes 17c and 18c that are connected to the lower surface from the connection electrodes 17a and 18a located on the upper surface through the side surfaces 17b and 18b of the first and second mounting members 14 and 15 are provided so as to be connected to the outside. It has been.
  • an insulating resin layer 23 is provided in a region between the first and second solders 19 and 20 in the length direction of the first and second mounting members 14 and 15.
  • the insulating resin layer 23 is provided so as to contact the first packaging material 2 and the first and second mounting members 14 and 15.
  • An appropriate material is used for the insulating resin layer 23, but an insulating adhesive is preferably used.
  • An epoxy adhesive can be used as the insulating adhesive.
  • the insulating resin layer 23 is provided in a part of the region between the first and second solders 19 and 20, but the region between the first and second solders 19 and 20.
  • An insulating resin layer 23 may be provided so as to fill the gap.
  • the insulating resin layer 23 is provided in a region between the first and second solders 19 and 20. Accordingly, even when the first and second solders 19 and 20 are remelted by heat during reflow, the insulating resin layer 23 can suppress a short circuit between adjacent electrodes. Further, even when the first and second solders 19 and 20 are remelted, the insulating resin layer 23 is not melted, so that the first packaging material 2 and the first and second mounting members 14 and 15 are also melted. It is possible to suppress the positional deviation between the two.
  • a rectangular plate-like substrate is used for the first packaging material 2. Further, as the second packaging material 6, a packaging material opened downward is used. On the other hand, in the crystal oscillator according to the second embodiment of the present invention shown in FIG. 3, a packaging material having an opening opened upward is used as the first packaging material 2. A flat lid material is used as the packaging material 6.
  • the inner bottom surface of the first packaging material 2 is a crystal resonator mounting surface 2a.
  • the crystal resonator 5 is mounted on the crystal resonator mounting surface 2 a of the first packaging material 2, and the opening of the first packaging material 2 is closed by the second packaging material 6.
  • a package having a hollow structure is formed.
  • the first packaging material 2 and the second packaging material 6 can be joined with an insulating adhesive or the like. As described above, various structures can be used as the structures of the first packaging material 2 and the second packaging material 6.
  • the insulating resin layer 23 is provided so as to fill the region between the first and second solders 19 and 20.
  • the insulating resin layer 23 is provided so as to fill the space between the first and second solders 19 and 20.
  • the short circuit between the electrodes can be more reliably suppressed.
  • the insulating resin layer 23 is provided so as to fill the region between the first and second solders 19 and 20.
  • the second embodiment is the same as the first embodiment except that the configuration of the packaging material and the structure of the insulating resin layer are different as described above.
  • the insulating resin layer 23 is provided so as to fill the region between the first and second solders 19 and 20, but the first and second solders as in the modification shown in FIG. It may be provided in a part of the region between 19 and 20.
  • FIG. 4 is a plan view when viewed from the bottom surface of the crystal oscillator according to the third embodiment.
  • the mounting member 24 has a rectangular plate shape, and an opening 26 is provided inside the mounting member 24.
  • the opening 26 is a space for arranging electronic components.
  • the space in the opening 26 is the above-described space, and therefore, the electronic component is disposed in the opening 26.
  • the configuration in which the electronic component is arranged in the space for providing the electronic component is not limited to a structure that is housed in the opening, and the first, first embodiment, as in the first embodiment. It also includes a configuration arranged in a space formed between the second mounting members 14 and 15.
  • connection electrodes 25 for connecting to the outside are provided at four ends of the mounting member 24 having the opening 26. Other points are the same as in the first embodiment.
  • the mounting member is provided so as to form a space, a space for arranging electronic components can be obtained.
  • the insulating resin layer is provided in the region between the solders that joins the first packaging material and the mounting member, it is possible to suppress a short circuit between the electrodes.
  • the crystal oscillator of the present invention by providing the insulating resin layer, it is possible to suppress the positional deviation between the first packaging material and the mounting member. Therefore, it is possible to reduce the size of the crystal oscillator.

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

The purpose of the present invention is to provide a crystal oscillator which is capable of suppressing short circuit between adjacent electrodes, and which is able to be reduced in size. A crystal oscillator (1) which is provided with: a crystal oscillation element (5) that is sealed in first and second packaging materials (2, 6); mounting members (14, 15); and a plurality of solders (19, 20) for electrically connecting and mechanically bonding the first packaging material (2) and the mounting members (14, 15) with each other. A space (16), in which an electronic component is arranged, is provided between the mounting members (14, 15), and an insulating resin (23) is provided in the region between the solders (19, 20).

Description

水晶発振器Crystal oscillator
　本発明は、第１，第２のパッケージング材により水晶振動子が封止されている、水晶発振器に関する。 The present invention relates to a crystal oscillator in which a crystal resonator is sealed with first and second packaging materials.
　従来、携帯型電子機器に、水晶発振器が広く用いられている。例えば、下記の特許文献１には、水晶振動子と、該水晶振動子が搭載されたセラミック基板と、上記セラミック基板の底面に接続された樹脂基板と、上記樹脂基板の底面に設けられた実装用電極とを備える、水晶発振モジュールが開示されている。 Conventionally, crystal oscillators have been widely used in portable electronic devices. For example, the following Patent Document 1 discloses a crystal resonator, a ceramic substrate on which the crystal resonator is mounted, a resin substrate connected to the bottom surface of the ceramic substrate, and a mounting provided on the bottom surface of the resin substrate. A crystal oscillation module comprising an electrode for use is disclosed.
　特許文献１の上記セラミック基板及び樹脂基板には、接続用電極が設けられており、上記セラミック基板の接続用電極と、上記樹脂基板の接続用電極とは、半田を介して接続されている。 In the above-mentioned ceramic substrate and resin substrate of Patent Document 1, a connection electrode is provided, and the connection electrode of the ceramic substrate and the connection electrode of the resin substrate are connected via solder.
特開２００６－３０４１１０号公報JP 2006-304110 A
　水晶発振モジュールをセット基板に実装するに際しては、リフロー法が一般的に用いられている。このリフロー時の熱により、特許文献１のような水晶発振モジュールでは、上記セラミック基板の接続用電極と、上記樹脂基板の接続用電極とを接続している半田が再溶融しがちであり、隣接する接続用電極同士がショートすることがあった。 When mounting a crystal oscillation module on a set substrate, a reflow method is generally used. Due to the heat at the time of reflow, in the crystal oscillation module as in Patent Document 1, the solder that connects the connection electrode of the ceramic substrate and the connection electrode of the resin substrate tends to be remelted. In some cases, the connecting electrodes to be short-circuited.
　また、ショートまではいかなくとも、上記半田が再溶融することにより、セラミック基板と、樹脂基板との間で、面方向に位置ずれが生じることがあった。この位置ずれにより、平面形状が大きくなり、水晶発振モジュールの小型化を図ることが困難であった。 In addition, even if the short circuit is not reached, the solder may be remelted to cause a positional shift in the surface direction between the ceramic substrate and the resin substrate. Due to this displacement, the planar shape becomes large, and it is difficult to reduce the size of the crystal oscillation module.
　本発明の目的は、隣接する電極間におけるショートを抑制することができ、かつ小型化を図ることができる、水晶発振器を提供することにある。 An object of the present invention is to provide a crystal oscillator that can suppress a short circuit between adjacent electrodes and can be miniaturized.
　本発明に係る水晶発振器は、水晶振動子搭載面を有する第１のパッケージング材と、上記第１のパッケージング材の水晶振動子搭載面に搭載されている水晶振動子と、上記第１のパッケージング材に接合されており、上記水晶振動子が封止されるように、上記第１のパッケージング材と共に封止空間を形成している第２のパッケージング材と、上記第１のパッケージング材の上記水晶振動子搭載面とは反対側の面に設けられている複数の端子電極と、上記第１のパッケージング材の上記水晶振動子搭載面とは反対側の面に配置されており、端子電極と電気的に接続するように設けられている実装部材と、上記複数の端子電極と上記実装部材とを電気的に接続かつ機械的に接合するように設けられている複数の半田とを備える。上記第１のパッケージング材の前記水晶振動子搭載面とは反対側の面には、電子部品を配置するスペースが設けられている。また、上記実装部材と上記第２のパッケージング材の間で、上記複数の半田間の領域に、絶縁樹脂が設けられている。 The crystal oscillator according to the present invention includes a first packaging material having a crystal resonator mounting surface, a crystal resonator mounted on the crystal resonator mounting surface of the first packaging material, and the first A second packaging material which is bonded to the packaging material and forms a sealed space with the first packaging material so that the crystal unit is sealed; and the first package A plurality of terminal electrodes provided on a surface of the packaging material opposite to the crystal resonator mounting surface and a surface of the first packaging material opposite to the crystal resonator mounting surface. A mounting member provided to be electrically connected to the terminal electrode, and a plurality of solders provided to electrically connect and mechanically connect the plurality of terminal electrodes and the mounting member. With. A space for placing electronic components is provided on the surface of the first packaging material opposite to the crystal resonator mounting surface. In addition, an insulating resin is provided in a region between the plurality of solders between the mounting member and the second packaging material.
　本発明に係る水晶発振器のある特定の局面では、上記実装部材が複数配置されている。 In a specific aspect of the crystal oscillator according to the present invention, a plurality of the mounting members are arranged.
　本発明に係る水晶発振器の他の特定の局面では、上記複数の実装部材間において、電子部品を配置するための上記スペースが設けられるように、前記複数の実装部材が配置されている。 In another specific aspect of the crystal oscillator according to the present invention, the plurality of mounting members are arranged so that the space for arranging electronic components is provided between the plurality of mounting members.
　本発明に係る水晶発振器の別の特定の局面では、上記実装部材が、上記第１のパッケージング材の長さ方向の両端に位置している。 In another specific aspect of the crystal oscillator according to the present invention, the mounting members are located at both ends in the length direction of the first packaging material.
　本発明に係る水晶発振器の他の特定の局面では、上記実装部材に、上記電子部品を配置するための、開口部が設けられている。 In another specific aspect of the crystal oscillator according to the present invention, the mounting member is provided with an opening for arranging the electronic component.
　本発明に係る水晶発振器のさらに他の特定の局面では、上記絶縁樹脂が、絶縁性接着剤である。 In still another specific aspect of the crystal oscillator according to the present invention, the insulating resin is an insulating adhesive.
　本発明に係る水晶発振器のさらに別の特定の局面では、上記実装部材において、上記半田と上記絶縁樹脂間に、上記実装部材の幅方向に延びる溝が設けられている。 In another specific aspect of the crystal oscillator according to the present invention, a groove extending in the width direction of the mounting member is provided between the solder and the insulating resin in the mounting member.
　本発明に係る水晶発振器では、リフロー時の熱により半田が再溶融した場合においても、複数の半田間の領域に絶縁樹脂が設けられているため、隣接する電極同士のショートを抑制することができる。また、上記絶縁樹脂層はリフロー時の熱により溶融し難いため、パッケージング材と、実装部材との間における位置ずれを抑制することができる。よって、本発明の水晶発振器では、小型化を図ることが可能となる。 In the crystal oscillator according to the present invention, even when the solder is remelted by heat during reflow, the insulating resin is provided in the region between the plurality of solders, so that short-circuiting between adjacent electrodes can be suppressed. . Moreover, since the said insulating resin layer is hard to fuse | melt with the heat | fever at the time of reflow, the position shift between a packaging material and a mounting member can be suppressed. Therefore, the crystal oscillator of the present invention can be downsized.
図１（ａ）、図１（ｂ）及び図１（ｃ）は、本発明の第１の実施形態に係る水晶発振器の模式的平面図、図１（ａ）中のＡ－Ａ線に沿う断面図及び図１（ａ）中のＢ－Ｂ線に沿う断面図である。1A, 1B, and 1C are schematic plan views of the crystal oscillator according to the first embodiment of the present invention, taken along the line AA in FIG. It is sectional drawing which follows a BB line in a sectional view and Drawing 1 (a). 図２（ａ）及び図２（ｂ）は、本発明の第１の実施形態に係る水晶発振器において用いられている水晶振動子の上面の電極形状を示す模式的平面図及び下面の電極形状を示す模式的平面図である。FIGS. 2A and 2B are a schematic plan view showing the electrode shape on the upper surface of the crystal resonator used in the crystal oscillator according to the first embodiment of the present invention, and the electrode shape on the lower surface. It is a schematic plan view to show. 図３は、本発明の第２の実施形態に係る水晶発振器の模式的断面図である。FIG. 3 is a schematic cross-sectional view of a crystal oscillator according to a second embodiment of the present invention. 図４は、本発明の第３の実施形態の水晶発振器の底面から見た際の平面図である。FIG. 4 is a plan view seen from the bottom surface of the crystal oscillator according to the third embodiment of the present invention. 図５は、第２の実施形態に係る水晶発振器の変形例を示す模式的断面図である。FIG. 5 is a schematic cross-sectional view showing a modification of the crystal oscillator according to the second embodiment.
　以下、図面を参照しつつ、本発明の具体的な実施形態を説明することにより、本発明を明らかにする。 Hereinafter, the present invention will be clarified by describing specific embodiments of the present invention with reference to the drawings.
　図１（ａ）は、本発明の一の実施形態に係る水晶発振器の模式的平面図である。図１（ｂ）は図１（ａ）中のＡ－Ａ線に沿う断面図であり、図１（ｃ）は図１（ａ）中のＢ－Ｂ線に沿う断面図である。 FIG. 1A is a schematic plan view of a crystal oscillator according to an embodiment of the present invention. 1B is a cross-sectional view taken along the line AA in FIG. 1A, and FIG. 1C is a cross-sectional view taken along the line BB in FIG. 1A.
　水晶発振器１は、水晶振動子搭載面２ａを有する第１のパッケージング材２を備える。本実施形態において、第１のパッケージング材２は、矩形板状の形状である。第１のパッケージング材２には、適宜の材料が用いられるが、本実施形態では、アルミナなどの絶縁性セラミックスあるいは合成樹脂などの適宜の絶縁性材料からなる。 The crystal oscillator 1 includes a first packaging material 2 having a crystal resonator mounting surface 2a. In the present embodiment, the first packaging material 2 has a rectangular plate shape. Although an appropriate material is used for the first packaging material 2, in the present embodiment, the first packaging material 2 is made of an appropriate insulating material such as an insulating ceramic such as alumina or a synthetic resin.
　第１のパッケージング材２上に、水晶振動子５が片持ち梁で支持されている。水晶振動子５は、第１，第２の導電性接着剤層３，４により支持されている。水晶振動子５は、第２のパッケージング材６により囲繞されている。すなわち、水晶振動子５は、第１，第２のパッケージング材２，６からなるパッケージに収納されている。 A crystal resonator 5 is supported by a cantilever on the first packaging material 2. The crystal unit 5 is supported by the first and second conductive adhesive layers 3 and 4. The crystal unit 5 is surrounded by a second packaging material 6. That is, the crystal unit 5 is accommodated in a package made of the first and second packaging materials 2 and 6.
　第２のパッケージング材６は、金属からなる。もっとも、金属以外の適宜の材料により第２のパッケージング材６を構成してもよい。第２のパッケージング材６は下方に開いた開口を有する。この開口の端縁が、第１のパッケージング材２の水晶振動子搭載面２ａに導電性接合剤７により接合されている。それによって、内部が中空構造とされているパッケージが構成される。導電性接合剤７としては、Ａｕ、Ｓｎ、ＡｕとＳｎの合金等を用いることができる。もっとも、第１のパッケージング材２と、第２のパッケージング材６とは、他の接合方法により接続してもよい。 The second packaging material 6 is made of metal. But you may comprise the 2nd packaging material 6 with appropriate materials other than a metal. The second packaging material 6 has an opening that opens downward. The edge of this opening is bonded to the crystal resonator mounting surface 2 a of the first packaging material 2 by the conductive bonding agent 7. As a result, a package having a hollow structure is formed. As the conductive bonding agent 7, Au, Sn, an alloy of Au and Sn, or the like can be used. But you may connect the 1st packaging material 2 and the 2nd packaging material 6 with another joining method.
　上記水晶振動子５は、水晶基板５ａを有する。水晶基板５ａは、矩形板状の形状を有する。水晶基板５ａの上面は、一対の長辺と一対の短辺とを有する。この長辺の延びる方向を長さ方向、短辺の伸びる方向を幅方向とする。水晶振動子５は、一方の短辺近傍において、図１（ｂ）に示すように、第１，第２の導電性接着剤層３，４により片持ち梁で支持されている。すなわち、水晶振動子５は、一方の上記短辺側部分で支持されており、反対側の短辺が自由端とされている。 The crystal unit 5 has a crystal substrate 5a. The quartz substrate 5a has a rectangular plate shape. The upper surface of the quartz substrate 5a has a pair of long sides and a pair of short sides. The direction in which the long side extends is the length direction, and the direction in which the short side extends is the width direction. In the vicinity of one short side, the crystal unit 5 is supported by the first and second conductive adhesive layers 3 and 4 in a cantilever manner as shown in FIG. That is, the crystal unit 5 is supported by one of the short side portions, and the short side on the opposite side is a free end.
　第１，第２の導電性接着剤層３，４は、適宜の合成樹脂に適宜の導電性材料を分散させてなる導電性接着剤を用いて形成することができる。導電性接着剤としては、シリコン系導電性接着剤を用いることが望ましい。 The first and second conductive adhesive layers 3 and 4 can be formed using a conductive adhesive obtained by dispersing an appropriate conductive material in an appropriate synthetic resin. As the conductive adhesive, it is desirable to use a silicon-based conductive adhesive.
　水晶基板５ａの上面には、図２（ａ）に示す第１の振動電極８が形成されている。水晶基板５ａの下面には、図２（ｂ）に示す第２の振動電極９が形成されている。第１，第２の振動電極８，９は水晶基板５ａを介して重なり合うように設けられている。また、第１，第２の振動電極８，９は、水晶基板５ａの上面及び下面において部分的に形成されている。 A first vibrating electrode 8 shown in FIG. 2A is formed on the upper surface of the quartz substrate 5a. A second vibrating electrode 9 shown in FIG. 2B is formed on the lower surface of the quartz substrate 5a. The first and second vibrating electrodes 8 and 9 are provided so as to overlap with each other through the quartz substrate 5a. The first and second vibrating electrodes 8 and 9 are partially formed on the upper and lower surfaces of the quartz crystal substrate 5a.
　第１の振動電極８には、第１の引き出し電極１０が連ねられている。第１の引き出し電極１０は、水晶基板５ａの上面から一方の短辺側の側面を経て下面に至っている。すなわち、図２に示す引き出し電極部分１０ａが水晶基板５ａの下面に位置している。 The first extraction electrode 10 is connected to the first vibration electrode 8. The first extraction electrode 10 extends from the upper surface of the quartz substrate 5a to the lower surface through one short side surface. That is, the extraction electrode portion 10a shown in FIG. 2 is located on the lower surface of the crystal substrate 5a.
　他方、第２の振動電極９には、第２の引き出し電極１１が連ねられている。第２の引き出し電極１１は、水晶基板５ａの一方の上記短辺側に引き出し電極部分１１ａを有する。引き出し電極部分１０ａと引き出し電極部分１１ａとは、水晶基板５ａの下面において、上記幅方向両側に位置している。この引き出し電極部分１０ａ，１１ａが、導電性接着剤層３，４によりそれぞれ接合される部分に相当する。 On the other hand, a second extraction electrode 11 is connected to the second vibration electrode 9. The second lead electrode 11 has a lead electrode portion 11a on one short side of the quartz substrate 5a. The extraction electrode portion 10a and the extraction electrode portion 11a are located on both sides in the width direction on the lower surface of the crystal substrate 5a. The lead electrode portions 10a and 11a correspond to portions joined by the conductive adhesive layers 3 and 4, respectively.
　図１（ｂ）に示すように、水晶振動子５は、第１のパッケージング材２の水晶振動子搭載面２ａ上に実装される。第１のパッケージング材２もまた、矩形の平面形状を有する。そして、水晶基板５ａにおける上記幅方向が、第１のパッケージング材２においても幅方向となるように水晶振動子５が第１のパッケージング材２上に実装される。水晶基板５ａにおける上記長さ方向が、第１のパッケージング材２の長さ方向となる。 As shown in FIG. 1B, the crystal unit 5 is mounted on the crystal unit mounting surface 2 a of the first packaging material 2. The first packaging material 2 also has a rectangular planar shape. Then, the crystal unit 5 is mounted on the first packaging material 2 so that the width direction of the crystal substrate 5 a is also the width direction of the first packaging material 2. The length direction of the quartz substrate 5 a is the length direction of the first packaging material 2.
　第１のパッケージング材２には、図示しない第１のパッケージング材２の厚み方向に貫通するビアホール電極が設けられている。このビアホール電極は、上記第１，第２の導電性接着剤層３，４と、第１のパッケージング材２の水晶振動子搭載面２aとは反対側の面に設けられている第１，第２の端子電極１２，１３とを電気的に接続するために設けられている。 The first packaging material 2 is provided with a via-hole electrode that penetrates in the thickness direction of the first packaging material 2 (not shown). The via-hole electrodes are provided on the first and second conductive adhesive layers 3 and 4 and the first packaging material 2 on the surface opposite to the crystal resonator mounting surface 2a. It is provided to electrically connect the second terminal electrodes 12 and 13.
　第１のパッケージング材２の水晶振動子搭載面２ａの反対側の面には、端子電極１２，１３と接続するための第１，第２の実装部材１４，１５が設けられている。第１，第２の実装部材１４，１５は、ガラスエポキシにより構成される。もっとも、第１，第２の実装部材１４，１５は、アルミナなどの絶縁性セラミックスなどの他の材料により構成されてもよい。 First and second mounting members 14 and 15 for connecting to the terminal electrodes 12 and 13 are provided on the surface of the first packaging material 2 opposite to the crystal resonator mounting surface 2a. The first and second mounting members 14 and 15 are made of glass epoxy. But the 1st, 2nd mounting members 14 and 15 may be constituted by other materials, such as insulating ceramics, such as alumina.
　本実施形態において、第１，第２の実装部材１４，１５は、矩形板状の形状である。第１，第２の実装部材１４，１５も、上面が一対の長辺と一対の短辺とを有する。この長辺の延びる方向を長さ方向、短辺の伸びる方向を幅方向とする。第１，第２の実装部材１４，１５は、長さ方向が、第１のパッケージング材２の幅方向となるように第１のパッケージング材２の下方に配置されている。そして、第１，第２の実装部材１４，１５は、第１のパッケージング材の長さ方向の両端に位置するように設けられている。第１のパッケージング材２の下方であり、かつ第１のパッケージング材２の長さ方向における、第１の実装部材１４と第２の実装部材１５との間の領域には、スペース１６が設けられている。このスペース１６には、サーミスタやＩＣなどの電子部品２２を配置することができる。また、空気の対流を促し、第１のパッケージ材２、さらには水晶発振器１の熱追従性を改善することができる。さらに、ＩＣを収納した場合は放熱効果を高め得る。 In the present embodiment, the first and second mounting members 14 and 15 have a rectangular plate shape. The top surfaces of the first and second mounting members 14 and 15 also have a pair of long sides and a pair of short sides. The direction in which the long side extends is the length direction, and the direction in which the short side extends is the width direction. The first and second mounting members 14 and 15 are arranged below the first packaging material 2 so that the length direction is the width direction of the first packaging material 2. And the 1st, 2nd mounting members 14 and 15 are provided so that it may be located in the both ends of the length direction of the 1st packaging material. There is a space 16 in a region between the first mounting member 14 and the second mounting member 15 below the first packaging material 2 and in the length direction of the first packaging material 2. Is provided. In this space 16, an electronic component 22 such as a thermistor or an IC can be arranged. Further, it is possible to promote air convection and improve the thermal followability of the first package material 2 and further the crystal oscillator 1. Further, when the IC is housed, the heat dissipation effect can be enhanced.
　なお、上記スペース１６は、電子部品２２を配置する部分である。この場合、第１の実装部材１４と、第２の実装部材１５とが、第１のパッケージング材２の水晶振動素子搭載面２ａと反対側の面から、突出するように設けられている。従って、上記スペース１６は、第１，第２の実装部材１４，１５間で挟まれた空間であり、この空間に収納されるように、スペース１６内に電子部品２２が配置されている。 The space 16 is a part where the electronic component 22 is arranged. In this case, the first mounting member 14 and the second mounting member 15 are provided so as to protrude from the surface of the first packaging material 2 on the side opposite to the crystal resonator element mounting surface 2a. Therefore, the space 16 is a space sandwiched between the first and second mounting members 14 and 15, and the electronic component 22 is disposed in the space 16 so as to be accommodated in this space.
　なお、本実施形態としては、２個の実装部材である第１，第２の実装部材１４，１５を使用したが、スペース１６を設けることができれば、実装部材を３個以上設けてもよい。例えば、第１のパッケージング材２の長さ方向だけでなく、幅方向にも２個の実装部材を設けることができる。 In the present embodiment, the first and second mounting members 14 and 15 which are two mounting members are used. However, if the space 16 can be provided, three or more mounting members may be provided. For example, two mounting members can be provided not only in the length direction of the first packaging material 2 but also in the width direction.
　第１，第２の実装部材１４，１５の幅方向の両端には、第１，第２の実装部材１４，１５の上面から、側面を経て下面に至っている第１，第２の接続電極１７，１８が設けられている。上面に位置する接続電極１７ａ，１８ａは、第１，第２の半田１９，２０を介して、第１のパッケージング材２に取り付けられている上記第１，第２の端子電極１２，１３に電気的に接続かつ機械的に接合されている。従って、第１，第２の実装部材１４，１５は、第１のパーケージング材２に電気的に接続されている。なお、上面に位置する接続電極１７ａ，１８ａから、第１，第２の実装部材１４，１５の側面１７ｂ，１８ｂを経て下面に連なっている接続電極１７ｃ，１８ｃは、外部と接続するように設けられている。 The first and second connection electrodes 17 extending from the upper surface of the first and second mounting members 14 and 15 to the lower surface through the side surfaces at both ends in the width direction of the first and second mounting members 14 and 15. , 18 are provided. The connection electrodes 17a and 18a located on the upper surface are connected to the first and second terminal electrodes 12 and 13 attached to the first packaging material 2 via the first and second solders 19 and 20, respectively. Electrically connected and mechanically joined. Accordingly, the first and second mounting members 14 and 15 are electrically connected to the first packaging material 2. The connection electrodes 17c and 18c that are connected to the lower surface from the connection electrodes 17a and 18a located on the upper surface through the side surfaces 17b and 18b of the first and second mounting members 14 and 15 are provided so as to be connected to the outside. It has been.
　本発明において、上記第１，第２の実装部材１４，１５の長さ方向における、上記第１，第２の半田１９，２０間の領域には、絶縁樹脂層２３が設けられている。絶縁樹脂層２３は、第１のパッケージング材２と、第１，第２の実装部材１４，１５に接するように設けられている。絶縁樹脂層２３としては、適宜の材料が用いられるが、絶縁性接着剤を用いることが好ましい。絶縁性接着剤としては、エポキシ系接着剤を用いることができる。本実施形態において、上記絶縁樹脂層２３は、上記第１，第２の半田１９，２０間の領域の一部に設けられているが、上記第１,第２の半田１９，２０間の領域を埋め尽くすように絶縁樹脂層２３を設けてもよい。 In the present invention, an insulating resin layer 23 is provided in a region between the first and second solders 19 and 20 in the length direction of the first and second mounting members 14 and 15. The insulating resin layer 23 is provided so as to contact the first packaging material 2 and the first and second mounting members 14 and 15. An appropriate material is used for the insulating resin layer 23, but an insulating adhesive is preferably used. An epoxy adhesive can be used as the insulating adhesive. In this embodiment, the insulating resin layer 23 is provided in a part of the region between the first and second solders 19 and 20, but the region between the first and second solders 19 and 20. An insulating resin layer 23 may be provided so as to fill the gap.
　本発明においては、上記第１，第２の半田１９，２０間の領域に上記絶縁樹脂層２３が設けられている。従って、上記第１，第２の半田１９，２０がリフロー時の熱により再溶融した場合も、上記絶縁樹脂層２３により、隣接する電極間におけるショートを抑止することができる。また、上記第１，第２の半田１９，２０が再溶融した場合も、上記絶縁樹脂層２３は溶融しないため、第１のパッケージング材２と、第１，第２の実装部材１４，１５との間の位置ずれを抑制することが可能となる。 In the present invention, the insulating resin layer 23 is provided in a region between the first and second solders 19 and 20. Accordingly, even when the first and second solders 19 and 20 are remelted by heat during reflow, the insulating resin layer 23 can suppress a short circuit between adjacent electrodes. Further, even when the first and second solders 19 and 20 are remelted, the insulating resin layer 23 is not melted, so that the first packaging material 2 and the first and second mounting members 14 and 15 are also melted. It is possible to suppress the positional deviation between the two.
　上記のように、第１の実施形態においては、第１のパッケージング材２に矩形板状の基板が用いられている。また、第２のパッケージング材６としては、下方に開口したパッケージング材が用いられている。これに対して、図３に示す本発明の第２の実施形態に係る水晶発振器では、第１のパッケージング材２として、上方に開いた開口を有するパッケージ材が用いられており、第２のパッケージング材６としては、平板状の蓋材が用いられている。 As described above, in the first embodiment, a rectangular plate-like substrate is used for the first packaging material 2. Further, as the second packaging material 6, a packaging material opened downward is used. On the other hand, in the crystal oscillator according to the second embodiment of the present invention shown in FIG. 3, a packaging material having an opening opened upward is used as the first packaging material 2. A flat lid material is used as the packaging material 6.
　第１のパッケージング材２の内底面が、水晶振動子搭載面２ａとされている。この場合、第１のパッケージング材２の水晶振動子搭載面２ａに水晶振動子５を搭載し、第２のパッケージング材６によって、第１のパッケージング材２の開口を閉成することにより、内部が中空構造となったパッケージが構成される。なお、第１のパッケージング材２と第２のパッケージング材６とは、絶縁性接着剤などにより接合することができる。このように、上記第１のパッケージング材２及び第２のパッケージング材６の構造としては、様々な構造を用いることができる。 The inner bottom surface of the first packaging material 2 is a crystal resonator mounting surface 2a. In this case, the crystal resonator 5 is mounted on the crystal resonator mounting surface 2 a of the first packaging material 2, and the opening of the first packaging material 2 is closed by the second packaging material 6. A package having a hollow structure is formed. The first packaging material 2 and the second packaging material 6 can be joined with an insulating adhesive or the like. As described above, various structures can be used as the structures of the first packaging material 2 and the second packaging material 6.
　また、第２の実施形態では、第１，第２の半田１９，２０間の領域を埋め尽くすように、絶縁樹脂層２３が設けられている。このように、第１，第２の半田１９，２０間を埋め尽くすように、絶縁樹脂層２３が設けられている場合、電極同士のショートをより一層確実に抑制することができる。さらに、第１のパッケージング材２と第１，第２の実装部材１４，１５との位置ずれを、より一層確実に抑制することが可能となる。よって、第１，第２の半田１９，２０間の領域を埋め尽くすように、絶縁樹脂層２３が設けられていることが好ましい。なお、第２の実施形態では、このように、パッケージング材の構成と、絶縁樹脂層の構造が異なることを除いては、第１の実施形態と同様である。 In the second embodiment, the insulating resin layer 23 is provided so as to fill the region between the first and second solders 19 and 20. As described above, when the insulating resin layer 23 is provided so as to fill the space between the first and second solders 19 and 20, the short circuit between the electrodes can be more reliably suppressed. Furthermore, it is possible to more reliably suppress the displacement between the first packaging material 2 and the first and second mounting members 14 and 15. Therefore, it is preferable that the insulating resin layer 23 is provided so as to fill the region between the first and second solders 19 and 20. Note that the second embodiment is the same as the first embodiment except that the configuration of the packaging material and the structure of the insulating resin layer are different as described above.
　なお、上記絶縁樹脂層２３は、第１，第２の半田１９，２０間の領域を埋め尽くすように設けられているが、図５に示す変形例のように、第１，第２の半田１９，２０間の領域の一部に設けられていてもよい。 The insulating resin layer 23 is provided so as to fill the region between the first and second solders 19 and 20, but the first and second solders as in the modification shown in FIG. It may be provided in a part of the region between 19 and 20.
　図４は、第３の実施形態の水晶発振器の底面から見た際の平面図である。第３の実施形態では、実装部材２４が矩形板状であり、実装部材２４の内部に開口部２６が設けられている。第３の実施形態では、この開口部２６が、電子部品を配置するためのスペースとなる。本実施形態においては、開口部２６内の空間が上記スペースであり、従って、この開口部２６内に電子部品が収納されるように配置される。 FIG. 4 is a plan view when viewed from the bottom surface of the crystal oscillator according to the third embodiment. In the third embodiment, the mounting member 24 has a rectangular plate shape, and an opening 26 is provided inside the mounting member 24. In the third embodiment, the opening 26 is a space for arranging electronic components. In the present embodiment, the space in the opening 26 is the above-described space, and therefore, the electronic component is disposed in the opening 26.
　なお、本発明においては、電子部品を設けるためのスペースに電子部品が配置される構成は、開口部に収納されるような構造に限定されず、第１の実施形態のように、第１，第２の実装部材１４，１５間によって形成されるスペースに配置される構成等をも含むものとする。 In the present invention, the configuration in which the electronic component is arranged in the space for providing the electronic component is not limited to a structure that is housed in the opening, and the first, first embodiment, as in the first embodiment. It also includes a configuration arranged in a space formed between the second mounting members 14 and 15.
　また、図４に示すように、開口部２６を有する実装部材２４の４つの端部には、外部と接続するための接続電極２５が設けられている。その他の点については、第１の実施形態と同じである。 Further, as shown in FIG. 4, connection electrodes 25 for connecting to the outside are provided at four ends of the mounting member 24 having the opening 26. Other points are the same as in the first embodiment.
　第１～第３の実施形態に示すように、本発明の水晶発振器では、実装部材がスペースを形成するように設けられているため、電子部品を配置するためのスペースを得ることができる。また、第１のパッケージング材と実装部材を接合する半田間の領域に、絶縁樹脂層が設けられているため、電極同士のショートを抑制することができる。加えて、本発明の水晶発振器では、絶縁樹脂層が設けられることにより、第１のパッケージング材と実装部材間の位置ずれを抑制することができる。よって、水晶発振器の小型化を図ることもできる。 As shown in the first to third embodiments, in the crystal oscillator according to the present invention, since the mounting member is provided so as to form a space, a space for arranging electronic components can be obtained. Moreover, since the insulating resin layer is provided in the region between the solders that joins the first packaging material and the mounting member, it is possible to suppress a short circuit between the electrodes. In addition, in the crystal oscillator of the present invention, by providing the insulating resin layer, it is possible to suppress the positional deviation between the first packaging material and the mounting member. Therefore, it is possible to reduce the size of the crystal oscillator.
１…水晶発振器
２…第１のパッケージング材
２ａ…水晶振動子搭載面
３，４…第１，第２の導電性接着剤層
５…水晶振動子
５ａ…水晶基板
６…第２のパッケージング材
７…導電性接合剤
８，９…第１，第２の振動電極
１０，１１…第１，第２の引き出し電極
１０ａ，１１ａ…引き出し電極部分
１２，１３…第１，第２の端子電極
１４，１５…第１，第２の実装部材
１６…スペース
１７，１８…第１，第２の接続電極
１７ａ，１８ａ…第１，第２の接続電極の上面部分
１７ｂ，１８ｂ…第１，第２の接続電極の側面部分
１７ｃ，１８ｃ…第１，第２の接続電極の下面部分
１９，２０…第１，第２の半田
２２…電子部品
２３…絶縁樹脂層
２４…実装部材
２５…接続電極
２６…開口部 DESCRIPTION OF SYMBOLS 1 ... Crystal oscillator 2 ... 1st packaging material 2a ... Crystal oscillator mounting surface 3, 4 ... 1st, 2nd conductive adhesive layer 5 ... Crystal oscillator 5a ... Crystal substrate 6 ... 2nd packaging Material 7 ... conductive bonding agent 8,9 ... first and second vibrating electrodes 10,11 ... first and second lead electrodes 10a, 11a ... lead electrode portions 12, 13 ... first and second terminal electrodes 14, 15 ... first and second mounting members 16 ... spaces 17, 18 ... first and second connection electrodes 17a, 18a ... upper surface portions 17b, 18b of the first and second connection electrodes ... first and first Side surface portions 17c and 18c of the two connection electrodes... Lower surface portions 19 and 20 of the first and second connection electrodes... First and second solders 22. 26 ... opening

Claims (7)

  1. 　水晶振動子搭載面を有する第１のパッケージング材と、
    　前記第１のパッケージング材の水晶振動子搭載面に搭載されている水晶振動子と、
    　前記第１のパッケージング材に接合されており、前記水晶振動子が封止されるように、前記第１のパッケージング材と共に封止空間を形成している第２のパッケージング材と、
    　前記第１のパッケージング材の前記水晶振動子搭載面とは反対側の面に設けられている複数の端子電極と、
    　前記第１のパッケージング材の前記水晶振動子搭載面とは反対側の面に配置されており、前記端子電極と電気的に接続するように設けられている実装部材と、
    　前記複数の端子電極と前記実装部材とを電気的に接続かつ機械的に接合するように設けられている複数の半田とを備え、
    　前記第１のパッケージング材の前記水晶振動子搭載面とは反対側の面に、電子部品を配置するスペースが設けられており、
    　前記実装部材と前記第２のパッケージング材の間で、前記複数の半田間の領域に、絶縁樹脂が設けられている、水晶発振器。     A first packaging material having a crystal resonator mounting surface;
    A crystal resonator mounted on a crystal resonator mounting surface of the first packaging material;
    A second packaging material that is bonded to the first packaging material and forms a sealed space with the first packaging material so that the crystal unit is sealed;
    A plurality of terminal electrodes provided on a surface of the first packaging material opposite to the crystal resonator mounting surface;
    A mounting member that is disposed on a surface of the first packaging material opposite to the crystal resonator mounting surface and is provided so as to be electrically connected to the terminal electrode;
    A plurality of solder provided so as to electrically connect and mechanically join the plurality of terminal electrodes and the mounting member;
    A space for arranging electronic components is provided on the surface of the first packaging material opposite to the crystal resonator mounting surface,
    A crystal oscillator in which an insulating resin is provided in a region between the plurality of solders between the mounting member and the second packaging material.
  2. 　前記実装部材が複数配置されている、請求項１に記載の水晶発振器。 The crystal oscillator according to claim 1, wherein a plurality of the mounting members are arranged.
  3. 　前記複数の実装部材間において、電子部品を配置するための前記スペースが設けられるように、前記複数の実装部材が配置されている、請求項２に記載の水晶発振器。 3. The crystal oscillator according to claim 2, wherein the plurality of mounting members are arranged so that the space for arranging an electronic component is provided between the plurality of mounting members.
  4. 　前記実装部材が、前記第１のパッケージング材の長さ方向の両端に位置している、請求項２または３に記載の水晶発振器。 4. The crystal oscillator according to claim 2, wherein the mounting members are located at both ends in the length direction of the first packaging material.
  5. 　前記実装部材に、前記電子部品を配置するための、開口部が設けられている、請求項１または２に記載の水晶発振器。 3. The crystal oscillator according to claim 1, wherein an opening for arranging the electronic component is provided in the mounting member.
  6. 　前記絶縁樹脂が、絶縁性接着剤である、請求項１～５のいずれか１項に記載の水晶発振器。 The crystal oscillator according to any one of claims 1 to 5, wherein the insulating resin is an insulating adhesive.
  7. 　前記実装部材において、前記半田と前記絶縁樹脂間に、前記実装部材の幅方向に延びる溝が設けられている、請求項１～６のいずれか１項に記載の水晶発振器。 7. The crystal oscillator according to claim 1, wherein a groove extending in a width direction of the mounting member is provided between the solder and the insulating resin in the mounting member.
PCT/JP2014/074223 2013-09-24 2014-09-12 Crystal oscillator WO2015045906A1 (en)

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WO2017077756A1 (en) * 2015-11-05 2017-05-11 株式会社村田製作所 Piezoelectric oscillator and piezoelectric oscillation device
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