JP2010232359A - Sucker - Google Patents

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JP2010232359A
JP2010232359A JP2009077290A JP2009077290A JP2010232359A JP 2010232359 A JP2010232359 A JP 2010232359A JP 2009077290 A JP2009077290 A JP 2009077290A JP 2009077290 A JP2009077290 A JP 2009077290A JP 2010232359 A JP2010232359 A JP 2010232359A
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metal plate
edge
suction
metal plates
hole
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JP2009077290A
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JP5459829B2 (en
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Hiroyuki Yamada
太進 山田
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ALONE CO Ltd
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ALONE CO Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a suction pad that eliminates the need for an outer frame and thus maximizes a suctionable area. <P>SOLUTION: The sucker is formed, by joining a plurality of metal plates 1-5, and all the metal plates 1-5 have no gap at the outer peripheral part thereof. In the vicinity of an edge 1a of the metal plate 1, whose surface functions as the suction face in the metal plates 1-5, slits 1c extend toward the edge 1a to the brink of the edge 1a, are formed therearound. The slits 1c are capable of vacuum-sucking a workpiece. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、シリコンウエハ、フィルム、ガラス板、金属板、セラミックシート又は紙などのワークを吸着保持し得る吸着盤に関するものである。   The present invention relates to a suction disk capable of sucking and holding a workpiece such as a silicon wafer, a film, a glass plate, a metal plate, a ceramic sheet, or paper.

従来、セラミック製の多孔質吸着部と、該吸着部の外周部に設けられる外枠とを有して構成される吸着盤が知られている(例えば、下記特許文献1及び2参照)。従来の吸着盤では、吸着部の外周部にも空隙が存在するため、その空隙を塞ぐために外枠が必須であった。しかしながら、外枠は、ワークを吸着する機能を有しないため、外枠が占める部分によって吸着可能な部分の面積が減少し、それによって、ワークの一部分を吸着できない事態が生じていた。また、吸着部と外枠との間の段差によってワークに変形が生じるため、高精度な加工面が得られなくなるという問題もあった。   2. Description of the Related Art Conventionally, there is known an adsorbing plate including a ceramic porous adsorbing portion and an outer frame provided on an outer peripheral portion of the adsorbing portion (for example, see Patent Documents 1 and 2 below). In the conventional suction disk, there is a gap in the outer peripheral portion of the suction portion, and thus an outer frame is indispensable for closing the gap. However, since the outer frame does not have a function of adsorbing a workpiece, the area of the portion that can be adsorbed is reduced by the portion occupied by the outer frame, thereby causing a situation in which a part of the workpiece cannot be adsorbed. In addition, since the workpiece is deformed by the step between the suction portion and the outer frame, there is a problem that a highly accurate processed surface cannot be obtained.

特開平11−309638号公報Japanese Patent Laid-Open No. 11-309638 特願2004−118628号公報Japanese Patent Application No. 2004-118628

本発明が解決しようとする課題は、外枠を不要として、吸着可能な面積を最大限に拡大することが可能な吸着盤を提供することである。   The problem to be solved by the present invention is to provide a suction disk capable of maximizing the suctionable area without using an outer frame.

本発明は、上記課題を解決するため、複数の金属板を接合して形成される吸着盤であって、前記金属板のいずれも外周部に空隙を有さず、前記金属板のうち、表面が吸着面として機能する金属板の縁付近には、縁の寸前まで縁に向かって延びるスリットが形成されており、該スリットはワークを真空吸着し得る吸着盤を提供する。   In order to solve the above-mentioned problems, the present invention is an adsorption plate formed by joining a plurality of metal plates, and none of the metal plates has a void in the outer peripheral portion, and the surface of the metal plates In the vicinity of the edge of the metal plate that functions as a suction surface, a slit extending toward the edge is formed just before the edge, and the slit provides a suction disk that can vacuum-suck the workpiece.

本発明は、複数の金属板を接合して形成される吸着盤であって、前記金属板のいずれも外周部に空隙を有しないため、外枠が不要である。また、本発明は、前記金属板のうち、表面が吸着面として機能する金属板の縁付近には、縁の寸前まで縁に向かって延びるスリットが形成されており、該スリットはワークを真空吸着し得るため、吸着可能な面積を最大限に拡大することが可能である。   The present invention is a suction disk formed by joining a plurality of metal plates, and none of the metal plates has a void in the outer peripheral portion, and thus no outer frame is required. Further, according to the present invention, a slit extending toward the edge is formed near the edge of the metal plate whose surface functions as an adsorption surface among the metal plates. Therefore, the area that can be adsorbed can be maximized.

図1は本発明の一実施例に係る吸着盤を示す斜視図である。FIG. 1 is a perspective view showing a suction disk according to an embodiment of the present invention. 図2は本発明の一実施例に係る吸着盤の分解斜視図である。FIG. 2 is an exploded perspective view of the suction cup according to one embodiment of the present invention. 図3は図1のA−A’部における部分拡大断面図である。FIG. 3 is a partially enlarged cross-sectional view taken along the line A-A ′ of FIG. 1. 図4は図1のB−B’部における部分拡大断面図である。FIG. 4 is a partially enlarged cross-sectional view taken along the line B-B ′ of FIG. 1. 図5は第1の金属板の部分拡大図である。FIG. 5 is a partially enlarged view of the first metal plate. 図6は第2の金属板の部分拡大図である。FIG. 6 is a partially enlarged view of the second metal plate. 図7は第1の金属板が備えるスリット及び穴と第2の金属板が備える第1の穴及び第2の穴との位置関係を示す部分拡大図である。FIG. 7 is a partially enlarged view showing the positional relationship between the slits and holes provided in the first metal plate and the first holes and second holes provided in the second metal plate.

以下、本発明の実施の形態を図面に示した実施例に従って説明するが、本発明の実施の形態はこの実施例によって限定されるものではない。   Hereinafter, embodiments of the present invention will be described with reference to examples shown in the drawings. However, the embodiments of the present invention are not limited to these examples.

図1は、本発明の一実施例に係る吸着盤を示す斜視図である。この図に示したように、本実施例に係る吸着盤は、複数の金属板1〜5を接合して形成されている。吸着盤の高さ方向に積み重ねられた複数の金属板1〜5は、拡散接合法により、互いの原子の相互拡散により固相のまま接合されることが好ましい。この接合法によれば、変形や歪みが生じ難いので、吸着面の平面度を高めることができる。   FIG. 1 is a perspective view showing a suction cup according to an embodiment of the present invention. As shown in this figure, the suction disk according to the present embodiment is formed by joining a plurality of metal plates 1 to 5. The plurality of metal plates 1 to 5 stacked in the height direction of the suction disk are preferably bonded in a solid state by mutual diffusion of atoms with each other by a diffusion bonding method. According to this joining method, since deformation and distortion are unlikely to occur, the flatness of the suction surface can be increased.

本実施例に係る吸着盤は、図2に示したように、5枚の金属板1〜5によって構成されている。第1の金属板1は、その表面が吸着面として機能する金属板である。第1の金属板1の縁1a付近を除く部分には、第1の金属板1を厚さ方向に貫通する穴1bが多数形成されている(図1〜図5参照)。第1の金属板1の縁1a付近には、縁1aの寸前まで縁1aに向かって延びるスリット1cが形成されている(図5参照)。   The suction disk according to the present embodiment is composed of five metal plates 1 to 5 as shown in FIG. The first metal plate 1 is a metal plate whose surface functions as an adsorption surface. A number of holes 1b penetrating through the first metal plate 1 in the thickness direction are formed in a portion excluding the vicinity of the edge 1a of the first metal plate 1 (see FIGS. 1 to 5). In the vicinity of the edge 1a of the first metal plate 1, a slit 1c extending toward the edge 1a is formed just before the edge 1a (see FIG. 5).

スリット1cは、第1の金属板1を厚さ方向に貫通しており(図3参照)、縁1aの全周にわたって多数形成されている(図1,図2及び図5参照)。本実施例のように、縁1a付近に円形の穴ではなく、直線状のスリット1cを設けることによって、縁1a付近において、ワークを安定支持し得る部分(吸着面)を確保しながら、ワークとの間の空気を吸引するための吸気口として機能する部分の面積(開口面積)を増大させることが可能となり、それによって、縁1a付近におけるワークの安定保持力を高めることが可能となる。スリット1cの加工方法としては、エッチングを採用することが好ましい。エッチングによれば、縁1a付近を変形させたり、歪ませたりすることなく、縁1aの寸前まで縁1aに向かって延びるスリット1cを精密かつ容易に加工することができる。本実施例では、スリット1cだけでなく、穴1bもエッチングによって加工されている。   The slit 1c penetrates the first metal plate 1 in the thickness direction (see FIG. 3), and a large number of slits 1c are formed over the entire circumference of the edge 1a (see FIGS. 1, 2, and 5). As in this embodiment, by providing a straight slit 1c instead of a circular hole in the vicinity of the edge 1a, a portion (suction surface) that can stably support the work is secured in the vicinity of the edge 1a. It is possible to increase the area (opening area) of the portion that functions as an air inlet for sucking air between the two, thereby increasing the stable holding force of the workpiece in the vicinity of the edge 1a. Etching is preferably employed as a method for processing the slit 1c. According to the etching, the slit 1c extending toward the edge 1a up to the edge of the edge 1a can be precisely and easily processed without deforming or distorting the vicinity of the edge 1a. In this embodiment, not only the slit 1c but also the hole 1b are processed by etching.

第2の金属板2は、第1の金属板1の直下に配置される金属板である。第2の金属板2の縁2a付近を除く部分には、第2の金属板2を厚さ方向に貫通する第1の穴2bが多数形成されている(図2〜図4及び図6参照)。図7に示したように、第2の金属板2に多数形成された第1の穴2bは、それぞれ第1の金属板1に形成された複数(本実施例では、7つ)の穴1bと連通している(図3,図4及び図7参照)。第2の金属板2の縁2a付近には、縁2aに沿って周方向に延びる第2の穴2cが多数形成されている(図6参照)。第2の金属板2に多数形成された第2の穴2cは、それぞれ第1の金属板1に形成された複数のスリット1cと連通している(図3,図4及び図7参照)。   The second metal plate 2 is a metal plate disposed immediately below the first metal plate 1. A number of first holes 2b penetrating through the second metal plate 2 in the thickness direction are formed in portions excluding the vicinity of the edge 2a of the second metal plate 2 (see FIGS. 2 to 4 and 6). ). As shown in FIG. 7, a plurality of first holes 2 b formed in the second metal plate 2 are a plurality (seven in this embodiment) of holes 1 b formed in the first metal plate 1. (See FIGS. 3, 4 and 7). Many second holes 2c extending in the circumferential direction along the edge 2a are formed in the vicinity of the edge 2a of the second metal plate 2 (see FIG. 6). A plurality of second holes 2c formed in the second metal plate 2 communicate with a plurality of slits 1c formed in the first metal plate 1, respectively (see FIGS. 3, 4 and 7).

第3の金属板3は、第2の金属板2の直下に配置される金属板である。第3の金属板3には、第3の金属板3を厚さ方向に貫通する細長い穴3aが多数形成されている(図2〜図4参照)。これらの穴3aは、それぞれ第2の金属板2に形成された複数の穴(第1の穴2b及び第2の穴2c)と連通している(図3及び図4参照)。   The third metal plate 3 is a metal plate disposed immediately below the second metal plate 2. The third metal plate 3 is formed with a large number of elongated holes 3a penetrating the third metal plate 3 in the thickness direction (see FIGS. 2 to 4). These holes 3a communicate with a plurality of holes (first hole 2b and second hole 2c) formed in the second metal plate 2, respectively (see FIGS. 3 and 4).

第4の金属板4は、第3の金属板3の直下に配置される金属板である。第4の金属板4には、第4の金属板4を厚さ方向に貫通する穴(通路4a)が形成されている(図2〜図4参照)。この通路4aは、第3の金属板3に形成された多数の穴3aと連通している(図3及び図4参照)。   The fourth metal plate 4 is a metal plate disposed immediately below the third metal plate 3. The fourth metal plate 4 is formed with a hole (passage 4a) penetrating the fourth metal plate 4 in the thickness direction (see FIGS. 2 to 4). The passage 4a communicates with a number of holes 3a formed in the third metal plate 3 (see FIGS. 3 and 4).

第5の金属板5は、第4の金属板4の直下に配置される金属板である。第5の金属板5には、第5の金属板5を厚さ方向に貫通する穴5aが形成されている(図2〜図4参照)。この穴5aは、第4の金属板4に形成された通路4aと連通している(図3及び図4参照)。第5の金属板5に形成された穴5aには、吸引源に接続された吸引パイプが連結される。   The fifth metal plate 5 is a metal plate arranged immediately below the fourth metal plate 4. The fifth metal plate 5 is formed with a hole 5a penetrating the fifth metal plate 5 in the thickness direction (see FIGS. 2 to 4). The hole 5a communicates with a passage 4a formed in the fourth metal plate 4 (see FIGS. 3 and 4). A suction pipe connected to a suction source is coupled to the hole 5 a formed in the fifth metal plate 5.

本実施例では、複数の金属板1〜5を接合することによって、上記のように各金属板1〜5に形成される穴の開口面積を段階的に小さくすることを可能とし、それによって、吸着面において、吸気口として機能する部分(第1の金属板1に形成された各穴1bの開口部及び各スリット1cの開口部)の密度を増大させ、空気の吸引性能を高めることを可能としている。また、第1の金属板1が備える穴1b及びスリット1c、第2の金属板2が備える穴2b、第3の金属板3が備える穴3a及び第4の金属板4が備える通路4aはすべて第5の金属板5が備える穴5aと通じているので、空気の吸引効率が非常に良いという利点もある。   In the present embodiment, by joining a plurality of metal plates 1 to 5, it is possible to reduce the opening area of the holes formed in each metal plate 1 to 5 in a stepwise manner, thereby, On the suction surface, it is possible to increase the density of the portion functioning as an air inlet (the opening of each hole 1b and the opening of each slit 1c formed in the first metal plate 1), thereby improving the air suction performance. It is said. Further, the holes 1b and slits 1c provided in the first metal plate 1, the holes 2b provided in the second metal plate 2, the holes 3a provided in the third metal plate 3, and the passages 4a provided in the fourth metal plate 4 are all provided. Since it communicates with the hole 5a provided in the fifth metal plate 5, there is also an advantage that the air suction efficiency is very good.

上記のように構成される吸着盤は、各金属板1〜5のいずれも外周部に空隙を有していない(図3〜図4参照)。したがって、外周部の空隙を塞ぐための外枠を必要としない。第1の金属板1の上にワークの載せた後、吸引源を作動させたときには、吸引パイプが連結された第5の金属板5の穴5aから吸着盤の内部の空気が吸引されるとともに、ワークと吸着面(第1の金属板1の表面)との間の空気が穴1b及びスリット1cを通じて吸引される。それによって、ワークは吸着面に真空吸着される。本実施例によれば、第1の金属板1には、縁1a付近を除く部分に形成される穴1bだけでなく、縁1a付近に、縁1aの寸前まで縁1aに向かって延びるスリット1cが形成されており、該スリット1cはワークを真空吸着し得るため、吸着可能な面積を最大限に拡大することが可能となる。   As for the suction disk comprised as mentioned above, none of each metal plates 1-5 has a space | gap in an outer peripheral part (refer FIGS. 3-4). Therefore, an outer frame for closing the gap in the outer peripheral portion is not required. When the suction source is operated after the workpiece is placed on the first metal plate 1, air inside the suction plate is sucked from the hole 5a of the fifth metal plate 5 to which the suction pipe is connected. The air between the workpiece and the suction surface (the surface of the first metal plate 1) is sucked through the hole 1b and the slit 1c. Thereby, the work is vacuum-sucked on the suction surface. According to the present embodiment, the first metal plate 1 includes not only the hole 1b formed in the portion excluding the vicinity of the edge 1a but also the slit 1c extending toward the edge 1a in the vicinity of the edge 1a until just before the edge 1a. Since the slit 1c can vacuum-suck the workpiece, the area that can be sucked can be maximized.

1 第1の金属板
1a 縁
1b 穴
1c スリット
2 第2の金属板
2a 縁
2b 第1の穴
2c 第2の穴
3 第3の金属板
3a 穴
4 第4の金属板
4a 通路
5 第5の金属板
5a 穴
DESCRIPTION OF SYMBOLS 1 1st metal plate 1a Edge 1b Hole 1c Slit 2 2nd metal plate 2a Edge 2b 1st hole 2c 2nd hole 3 3rd metal plate 3a Hole 4 4th metal plate 4a Passage 5 5th Metal plate 5a hole

Claims (1)

複数の金属板を接合して形成される吸着盤であって、前記金属板のいずれも外周部に空隙を有さず、前記金属板のうち、表面が吸着面として機能する金属板の縁付近には、縁の寸前まで縁に向かって延びるスリットが形成されており、該スリットはワークを真空吸着し得る吸着盤。   An adsorbing plate formed by joining a plurality of metal plates, none of the metal plates having a void in the outer peripheral portion, and of the metal plates, near the edge of the metal plate whose surface functions as an adsorption surface Is formed with a slit extending toward the edge just before the edge, and the slit can suck the workpiece by vacuum.
JP2009077290A 2009-03-26 2009-03-26 Suction board Expired - Fee Related JP5459829B2 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012009720A (en) * 2010-06-28 2012-01-12 Nikon Corp Wafer holder and exposure equipment
CN105033716A (en) * 2015-08-27 2015-11-11 宁波伟辉磁业有限公司 Vacuum sucker

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01293628A (en) * 1988-05-23 1989-11-27 Nec Corp Wafer stage
JPH11315837A (en) * 1998-02-13 1999-11-16 Zaino Marek Fluid bearing, vacuum chuck, and manufacture thereof
JP2003508893A (en) * 1998-07-14 2003-03-04 テンプトロニック コーポレイション Workpiece chuck
JP2004056027A (en) * 2002-07-24 2004-02-19 Hitachi Zosen Corp Vacuum chuck
JP2005505128A (en) * 2001-10-02 2005-02-17 レベオ, インコーポレイティッド Suction holding device and method for handling easily damaged objects, and method for manufacturing the same
JP2007142220A (en) * 2005-11-18 2007-06-07 Speedfam Co Ltd Chuck device for work
JP2007242655A (en) * 2006-03-06 2007-09-20 Shin Etsu Polymer Co Ltd Fixed carrier
JP2008119758A (en) * 2006-11-08 2008-05-29 Aronshiya:Kk Sucker

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01293628A (en) * 1988-05-23 1989-11-27 Nec Corp Wafer stage
JPH11315837A (en) * 1998-02-13 1999-11-16 Zaino Marek Fluid bearing, vacuum chuck, and manufacture thereof
JP2003508893A (en) * 1998-07-14 2003-03-04 テンプトロニック コーポレイション Workpiece chuck
JP2005505128A (en) * 2001-10-02 2005-02-17 レベオ, インコーポレイティッド Suction holding device and method for handling easily damaged objects, and method for manufacturing the same
JP2004056027A (en) * 2002-07-24 2004-02-19 Hitachi Zosen Corp Vacuum chuck
JP2007142220A (en) * 2005-11-18 2007-06-07 Speedfam Co Ltd Chuck device for work
JP2007242655A (en) * 2006-03-06 2007-09-20 Shin Etsu Polymer Co Ltd Fixed carrier
JP2008119758A (en) * 2006-11-08 2008-05-29 Aronshiya:Kk Sucker

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012009720A (en) * 2010-06-28 2012-01-12 Nikon Corp Wafer holder and exposure equipment
CN105033716A (en) * 2015-08-27 2015-11-11 宁波伟辉磁业有限公司 Vacuum sucker

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