JP2010231901A - Lighting system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lighting system having reduced cost as a whole. <P>SOLUTION: In the lighting system 10, adhesive 5 exists between a lower end 4b of a cover 4 covering a light emitting element 1 located on a supporting substrate 3 and the upper face of the supporting substrate 3. Part of a conductor pattern 6 is arranged in one area between the lower end 4b of the cover 4 and the upper face of the supporting substrate 3, one area at the lower end 4b of the cover 4 is adhered to the conductor pattern 6 with the adhesive 5, and the adhesive 5 is not arranged in an area between the bottom face of the lower end 4b of the cover 4 and the upper face of the supporting substrate 3, where the conductor pattern 6 is not located, whereby a clearance 7 is formed between the bottom face of the lower end 4b of the cover 4 and the upper face of the supporting substrate 3 to communicate the inside with the outside of the cover 4. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an illumination device in which an adhesive is interposed between a lower end portion of a cover that covers a light emitting element positioned on a support substrate and an upper surface of the support substrate.

  In particular, the present invention relates to a lighting device that can reduce the cost of the entire lighting device.

  Furthermore, the present invention relates to a lighting device that can reduce the risk that an adhesive or the like on the lower surface of a support substrate may enter the inside of the cover.

  Conventionally, a light emitting element is mounted on a light emitting element substrate (submount), a light emitting element substrate (submount) is mounted on a support substrate, and the light emitting element mounted on the support substrate and the light emitting element substrate ( There is known an illumination device in which an adhesive is interposed between an annular lower end portion of a substantially hemispherical cover and a support substrate so that the submount is covered with a substantially hemispherical cover. As an example of this type of lighting device, for example, there is one described in FIG. 2 of JP-A-2006-93372.

  In the illuminating device described in FIG. 2 of JP-A-2006-93372, a conductor pattern for supplying power to the light emitting element is formed on a support substrate. Furthermore, in the lighting device described in FIG. 2 of Japanese Patent Application Laid-Open No. 2006-93372, the portion of the support substrate where the conductor pattern is not formed and the annular lower end of the substantially hemispherical cover are adhesive. Are joined by.

  Specifically, in the lighting device described in FIG. 2 of Japanese Patent Application Laid-Open No. 2006-93372, a through hole penetrating from the upper surface to the lower surface of the support substrate is formed in the support substrate, and the inner and outer sides of the cover are formed by the through holes. An air flow path that communicates with each other is configured. Further, in the lighting device described in FIG. 2 of Japanese Patent Application Laid-Open No. 2006-93372, a gas generated during curing of the adhesive for joining the annular lower end portion of the substantially hemispherical cover and the support substrate is generated by the cover. From the inside of the cover to the outside of the cover through the through hole of the support substrate.

FIG. 2 of JP-A-2006-93372

  By the way, in the illuminating device described in FIG. 2 of Unexamined-Japanese-Patent No. 2006-93372, a support substrate is formed with a ceramic material, for example. Specifically, in the lighting device described in FIG. 2 of JP-A-2006-93372, through holes are formed in the support substrate at the green sheet stage before firing of the ceramic material forming the support substrate. That is, in the lighting device described in FIG. 2 of Japanese Patent Application Laid-Open No. 2006-93372, a through hole that functions as an air flow path that communicates the inside and the outside of the cover is formed on the support substrate. An additional process step separate from the step of forming the conductor pattern must be provided. Therefore, in the illuminating device described in FIG. 2 of Japanese Patent Application Laid-Open No. 2006-93372, the entire illuminating device is formed as compared with a case where a through hole that functions as an air flow path that communicates the inside and the outside of the cover is not formed in the support substrate. Costs increase.

  Furthermore, in the illumination device described in FIG. 2 of Japanese Patent Application Laid-Open No. 2006-93372, as described above, the air flow path that connects the inside and the outside of the cover by the through hole that penetrates from the upper surface to the lower surface of the support substrate. Is configured. Therefore, in the lighting device described in FIG. 2 of JP-A-2006-93372, for example, when a heat sink or the like is bonded to the lower surface of the support substrate via an adhesive, a paste-like heat conductive grease, a sheet, or the like, For example, during use of the lighting device, for example, an adhesive, a paste-like thermally conductive grease, a sheet, or the like may enter the inside of the cover through the through hole.

  In view of the above-mentioned problems, the present invention is more than the case where an additional processing step separate from the step of forming the conductor pattern on the support substrate is necessary in order to form the air flow path that connects the inside and the outside of the cover. An object of the present invention is to provide an illumination device that can reduce the cost of the entire illumination device.

  Furthermore, in the present invention, for example, the adhesive on the lower surface of the support substrate covers more than the case where the air flow path that connects the inside and the outside of the cover is formed by the through-hole penetrating from the upper surface to the lower surface of the support substrate. It aims at providing the illuminating device which can reduce the possibility that it may penetrate | invade inside.

According to invention of Claim 1, it adhere | attaches between the lower end part (4b) of the cover (4) which covers the light emitting element (1) located on a support substrate (3), and the upper surface of a support substrate (3). In the lighting device (10) interposing the agent (5),
A part of the conductor pattern (6) is arranged in a part between the bottom surface of the lower end (4b) of the cover (4) and the upper surface of the support substrate (3),
A part of the lower end (4b) of the cover (4) and the conductor pattern (6) are joined by an adhesive (5),
By not placing the adhesive (5) on the portion where the conductor pattern (6) is not located between the bottom surface of the lower end (4b) of the cover (4) and the upper surface of the support substrate (3), the cover (4 ) Is formed between the bottom surface of the lower end (4b) of the cover (4) and the upper surface of the support substrate (3). Is provided.

  According to the second aspect of the present invention, the adhesive (5) is disposed on a part of the conductor pattern (6) facing the bottom surface of the lower end (4b) of the cover (4). 1 is provided.

  According to the third aspect of the present invention, the conductive pattern (6) joined to the bottom surface of the lower end (4b) of the cover (4) by the adhesive (5) is used to supply power to the light emitting element (1). The light emitting element is electrically continuous with the conductor pattern (6c, 6d) for supplying, or electrically independent from the conductor pattern (6c, 6d) for supplying power to the light emitting element (1). The lighting device (10) according to claim 1 or 2, wherein the lighting device (10) is formed simultaneously with the conductor pattern (6c, 6d) for supplying electric power to (1).

  According to the fourth aspect of the present invention, a plurality of gaps communicating the inside and the outside of the cover (4) between the bottom surface of the lower end (4b) of the cover (4) and the top surface of the support substrate (3). (7) is formed, The illuminating device (10) as described in any one of Claims 1-3 characterized by the above-mentioned is provided.

  According to the invention described in claim 5, the plurality of gaps (7) are arranged in 180 ° rotational symmetry about the central axis (4 ′) of the cover (4). A lighting device (10) is provided.

  According to invention of Claim 6, the adhesive (5) for joining the lower end part (4b) of a cover (4) and a conductor pattern (6) was colored, It is characterized by the above-mentioned. A lighting device (10) according to any one of 5 is provided.

According to invention of Claim 7, a flange (4b1) is formed in the lower end part (4b) of a cover (4),
A concave portion is formed on the upper surface or the bottom surface of the flange (4b1) of the lower end portion (4b) of the cover (4) joined to the upper surface of the conductor pattern (6) of the support substrate (3) by the adhesive (5). An illumination device (10) according to any one of claims 1 to 6 is provided.

According to invention of Claim 8, a flange (4b1) is formed in the lower end part (4b) of a cover (4),
Forming a through hole (4b1c) that penetrates the top surface (4b1a) and bottom surface (4b1b) of the flange (4b1);
Adhesive (5) for joining the conductor pattern (6) of the support substrate (3) and the flange (4b1) of the lower end (4b) of the cover (4) is applied to the flange (4b) of the lower end (4b) of the cover (4). The lighting device (10) according to any one of claims 1 to 6, characterized in that the through hole (4b1c) of 4b1) is filled.

  In the illuminating device (10) according to claims 1 to 3, the lower end (4b) of the cover (4) covering the light emitting element (1) located on the support substrate (3) and the upper surface of the support substrate (3) An adhesive (5) is interposed between the two.

  Specifically, in the illumination device (10) according to claims 1 to 3, the conductor pattern (6) is formed on a portion between the bottom surface of the lower end (4b) of the cover (4) and the upper surface of the support substrate (3). A part of is arranged. Moreover, a part of bottom face of the lower end part (4b) of the cover (4) and the conductor pattern (6) are joined by the adhesive (5).

  Furthermore, in the illuminating device (10) according to claims 1 to 3, the conductor pattern (6) is located between the bottom surface of the lower end (4b) of the cover (4) and the upper surface of the support substrate (3). Since the adhesive (5) is not disposed in the portion that is not to be provided, the gap (7) that connects the inside and the outside of the cover (4) creates a bottom surface of the lower end (4b) of the cover (4) and the support substrate (3). It is formed between the upper surface.

  In the lighting device (10) according to claims 1 to 3, preferably, the adhesive (5) is applied to a part on the conductor pattern (6) facing the bottom surface of the lower end (4b) of the cover (4). Has been placed.

  Furthermore, in the illuminating device (10) according to claims 1 to 3, the conductor pattern (6) joined by the adhesive (5) to the bottom surface of the lower end (4b) of the cover (4) is a light emitting element. It is electrically connected to the conductor pattern (6c, 6d) for supplying power to (1) or electrically from the conductor pattern (6c, 6d) for supplying power to the light emitting element (1). Independently, it is formed simultaneously with the conductor patterns (6c, 6d) for supplying power to the light emitting element (1).

  In other words, in the illuminating device (10) according to claims 1 to 3, it is not necessary to separately provide an additional processing step for forming a gap (7) communicating the inside and the outside of the cover (4). . Therefore, according to the illuminating device (10) according to claims 1 to 3, a conductor pattern (on the support substrate (3) is formed in order to form a gap (7) that communicates the inside and the outside of the cover (4). The cost of the entire lighting device (10) can be reduced as compared with the case where an additional processing step separate from the step of forming 6, 6c, 6d) is required.

  Moreover, in the illuminating device (10) according to claims 1 to 3, the gap (7) that connects the inner side and the outer side of the cover (4) is formed by a through hole that passes from the upper surface to the lower surface of the support substrate (3). Rather than being configured, it is configured by a gap (7) between the bottom surface of the lower end (4b) of the cover (4) and the upper surface of the support substrate (3). Therefore, according to the illuminating device (10) according to claims 1 to 3, the gap (7) that connects the inside and the outside of the cover (4) through a through hole that penetrates from the upper surface to the lower surface of the support substrate (3). Compared with the case where is configured, for example, the adhesive or the like on the lower surface of the support substrate (3) can be reduced from entering the cover (4).

  In the illuminating device (10) according to claim 4, a plurality of the inside and outside of the cover (4) communicate between the bottom surface of the lower end (4b) of the cover (4) and the top surface of the support substrate (3). The gap (7) is formed. That is, in the illumination device (10) according to the fourth aspect, the gap (7) that connects the inside and the outside of the cover (4) is not formed at one place but at a plurality of places.

  Therefore, according to the illuminating device (10) of Claim 4, rather than the case where the clearance gap (7) which connects the inner side and the outer side of a cover (4) is formed only in one place, a support substrate (3) The possibility that the bottom surface of the lower end portion (4b) of the cover (4) is not sufficiently bonded to the upper surface of the cover can be reduced.

  In the illuminating device (10) according to claim 5, the plurality of gaps (7) are arranged 180 degrees rotationally symmetrically about the central axis (4 ') of the cover (4). Therefore, according to the illuminating device (10) of Claim 5, it flows in into the inside of a cover (4) through one clearance gap (7), passes through a light emitting element (1), and other clearance gap (7). ) Through the outside of the cover (4).

  In the illumination device (10) according to claim 6, the adhesive (5) for joining the lower end (4b) of the cover (4) and the conductor pattern (6) is colored. Therefore, according to the illuminating device (10) of Claim 6, the adhesive (5) for joining the lower end part (4b) of the cover (4) and the conductor pattern (6) is, for example, colorless and transparent. The visual confirmation that the gap (7) that connects the inner side and the outer side of the cover (4) is reliably formed can be facilitated.

  In the illumination device (10) according to claim 7, a flange (4b1) is formed at the lower end (4b) of the cover (4). Further, a concave portion is formed on the upper surface or the bottom surface of the flange (4b1) of the lower end portion (4b) of the cover (4) joined to the upper surface of the conductor pattern (6) of the support substrate (3) by the adhesive (5). Yes.

  Therefore, according to the illuminating device (10) of Claim 7, rather than the case where the upper surface and bottom surface of the flange (4b1) of the lower end part (4b) of the cover (4) are constituted by a plane, the adhesive ( The bonding strength between the upper surface of the conductor pattern (6) of the support substrate (3) and the upper surface or the bottom surface of the flange (4b1) of the lower end (4b) of the cover (4) according to 5) can be improved.

  In the illumination device (10) according to claim 8, a flange (4b1) is formed at the lower end (4b) of the cover (4). A through hole (4b1c) is formed through the upper surface (4b1a) and the bottom surface (4b1b) of the flange (4b1). Further, an adhesive (5) for joining the conductor pattern (6) of the support substrate (3) and the flange (4b1) of the lower end (4b) of the cover (4) is formed at the lower end (4b) of the cover (4). In the through hole (4b1c) of the flange (4b1).

  Therefore, according to the illuminating device (10) of Claim 8, when the upper surface (4b1a) or the bottom surface (4b1b) of the flange (4b1) of the lower end (4b) of the cover (4) is constituted by a plane. The bonding strength between the conductor pattern (6) of the support substrate (3) and the flange (4b1) of the lower end (4b) of the cover (4) by the adhesive (5) can be improved.

It is the figure which showed the illuminating device 10 of 1st Embodiment. It is a perspective view of the principal part of the illuminating device 10 of 1st Embodiment. It is a component diagram of the component of the illuminating device 10 of 1st Embodiment. It is a component diagram of the component of the illuminating device 10 of 1st Embodiment. It is a component diagram of the component of the illuminating device 10 of 1st Embodiment. 4 is an enlarged cross-sectional view of a flange 4b1 of a lower end portion 4b of a substantially hemispherical cover 4 and a conductor pattern 6 (6a) of a support substrate 3. FIG. It is the figure which showed the cover 4 etc. of the illuminating device 10 of 11th Embodiment. It is the figure which showed the cover 4 etc. of the illuminating device 10 of 12th Embodiment. It is the figure which showed the cover 4 etc. of the illuminating device 10 of 14th Embodiment. It is the figure which showed the cover 4 etc. of the illuminating device 10 of 16th Embodiment. It is the figure which showed the cover 4 etc. of the illuminating device 10 of 17th Embodiment. It is the figure which showed the cover 4 etc. of the illuminating device 10 of 19th Embodiment. It is the figure which showed the cover 4 etc. of the illuminating device 10 of 21st Embodiment. It is the figure which showed the cover 4 etc. of the illuminating device 10 of 23rd Embodiment. It is a component figure of the support substrate 3 in which the conductor pattern 6 (6a, 6c, 6d) of the illuminating device 10 of 25th Embodiment was formed. It is a component figure of the support substrate 3 in which the conductor pattern 6 (6a, 6c, 6d) of the illuminating device 10 of 26th Embodiment was formed. It is a component figure of the support substrate 3 in which the conductor pattern 6 (6a, 6c, 6d) of the illuminating device 10 of 27th Embodiment was formed. It is a component figure of the support substrate 3 in which the conductor pattern 6 (6a, 6c, 6d) of the illuminating device 10 of 28th Embodiment was formed.

  Hereinafter, a first embodiment of the illumination device of the present invention will be described. FIG. 1 is a diagram illustrating a lighting device 10 according to the first embodiment. Specifically, FIG. 1A is a plan view of the illumination device 10 according to the first embodiment, FIG. 1B is a cross-sectional view taken along the line AA in FIG. 1A, and FIG. FIG. 2 is a cross-sectional view taken along line BB in FIG. FIG. 2 is a perspective view of a main part of the illumination device 10 according to the first embodiment.

  3 to 5 are component diagrams of components of the lighting device 10 according to the first embodiment. Specifically, FIG. 3A is a plan view of a light source unit constituted by the light emitting element 1 and the light emitting element substrate 2, and FIG. 3A is constituted by the light emitting element 1 and the light emitting element substrate 2. It is a front view of a light source unit. 4A is a plan view of the support substrate 3 on which the conductor patterns 6, 6c, and 6d are formed, FIG. 4B is a cross-sectional view taken along line CC in FIG. 4A, and FIG. ) Is a cross-sectional view taken along line DD in FIG. 4A, and FIG. 4D is a cross-sectional view taken along line EE in FIG. 4A. 5A is a plan view of the substantially hemispherical cover 4, FIG. 5B is a front view of the approximately hemispherical cover 4, and FIG. 5C is along the line FF in FIG. 5A. FIG.

  At the time of manufacturing the lighting device 10 according to the first embodiment, as shown in FIGS. 3A and 3B, the light-emitting element 1 such as an LED, for example, is a phosphor (not shown). ), A bonding wire (not shown), etc., and mounted on the light emitting element substrate 2 such as a ceramic substrate to constitute a light source unit.

  Moreover, when manufacturing the lighting device 10 of the first embodiment, as shown in FIGS. 4A, 4B, 4C, and 4D, for example, a conductive material such as a copper foil. The conductor pattern 6 (6a, 6b, 6c, 6d) is formed on the upper surface of the support substrate 3 by the material. Specifically, for example, plating with Ni, Au or the like is performed on the upper surface of the conductor pattern 6 (6a, 6b, 6c, 6d). In the illuminating device 10 of the first embodiment, in order to improve the heat dissipation of the heat generated by the light emitting element 1 (see FIG. 1), the support substrate 3 is formed of a metal such as copper, aluminum, etc. An insulating layer (not shown) is disposed between the substrate 3 and the conductor pattern 6 (6a, 6b, 6c, 6d).

  In the lighting device 10 of the second embodiment, instead, the support substrate 3 is formed of an electrically insulating material such as ceramic or resin, and the conductor pattern 6 (6a, 6b, 6c, 6d) is formed on the support substrate 3. It is also possible to form directly on the upper surface of the substrate.

  At the time of manufacturing the illumination device 10 of the first embodiment, the light emitting element substrate 2 is then mounted on the support substrate 3 as shown in FIG. Specifically, a bonding material (not shown) such as an epoxy resin adhesive, a silicone resin adhesive, a eutectic solder, or the like is applied to the lower surface of the light emitting element substrate 2, and then the light emitting element substrate 2. Is placed on the support substrate 3. Next, for example, when a silicone resin adhesive is used as the bonding material, the bonding material between the light emitting element substrate 2 and the support substrate 3 is cured in an adhesive curing step of 130 ° C. to 170 ° C. Next, a visual inspection of the bonding state of the light emitting element substrate 2 and the support substrate 3 with the bonding material is performed.

  Specifically, for example, when a silicone resin-based adhesive is used as the bonding material, outgas such as low-molecular siloxane generated from the cured composition, for example, when the silicone resin-based adhesive is cured, causes gaps 7 (FIG. 1) described later. The cover 4 (see FIG. 1) is discharged from the inside to the outside.

  In the illuminating device 10 of the first embodiment, the light emitting element substrate 2 is interposed between the light emitting element 1 and the support substrate 3. However, in the illuminating device 10 of the third embodiment, instead, for the light emitting element. It is also possible to omit the substrate 2.

  In the illumination device 10 of the first embodiment, as shown in FIG. 4, the light emitting element substrate 2 (see FIG. 1) is mounted on the flat upper surface of the support substrate 3, but the illumination of the fourth embodiment is performed. In the apparatus 10, a recess for accommodating the light emitting element substrate 2 can be formed on the upper surface of the support substrate 3 instead.

  At the time of manufacturing the illumination device 10 of the first embodiment, as shown in FIG. 1, the light emitting element substrate 2 of the light source unit and the conductor pattern 6 c of the support substrate 3 are then electrically connected by, for example, bonding wires 8. Connected to. As a result, for example, a positive potential is supplied to the light emitting element 1 from the conductor pattern 6c. Further, the light emitting element substrate 2 of the light source unit and the conductor pattern 6d of the support substrate 3 are electrically connected by, for example, bonding wires 8 or the like. As a result, for example, a negative potential is supplied to the light emitting element 1 from the conductor pattern 6d. Next, a visual inspection of the bonding state between the light emitting element substrate 2 of the light source unit and the conductor patterns 6c and 6d by the bonding wire 8 is performed. Specifically, for example, through-hole electrodes (not shown) are formed in the conductor patterns 6c and 6d of the support substrate 3, and the through-hole electrodes are interposed between the lower surface of the support substrate 3 and the like on the upper surface of the support substrate 3. Electric power can be supplied to the light emitting element 1. Alternatively, for example, a conductor pattern (not shown) for feeding that is electrically continuous to the conductor patterns 6a and 6b is formed outside the conductor patterns 6a and 6b on the upper surface of the support substrate 3, and the conductor pattern ( It is also possible to supply power to the light emitting element 1 through the conductor patterns 6a and 6b and the conductor patterns 6c and 6d.

  Next, at the time of manufacturing the lighting device 10 of the first embodiment, as shown in FIG. 1, an adhesive 5 such as a silicone resin adhesive is applied to the conductor pattern 6 (6a, 6b) ( It is applied on the upper surface of FIG. Next, the flange 4b1 (see FIG. 5) of the lower end portion 4b (see FIG. 5) of the substantially hemispherical cover 4 is supported by the support substrate so that the light emitting element 1 and the light emitting element substrate 2 are covered with the substantially hemispherical cover 4. 3 conductor patterns 6 (6a, 6b). Next, for example, when a silicone resin adhesive is used as the adhesive 5, the bottom surface of the flange 4 b 1 of the lower end 4 b of the cover 4 and the conductor pattern 6 (6 a, 6 b) in the adhesive curing process at 130 ° C. to 170 ° C. The adhesive 5 between the upper surfaces of the two is hardened. That is, in the illumination device 10 of the first embodiment, as shown in FIG. 1A, the shape of the conductor pattern 6 (6a, 6b) of the support substrate 3 and the bottom surface of the flange 4b1 of the lower end portion 4b of the cover 4 are used. Are partially matched with each other.

  In detail, in the illuminating device 10 of 1st Embodiment, a substantially hemispherical cover is carried out by the rotary body obtained by rotating the cross-sectional shape shown in FIG.5 (C) centering on the central axis 4 'of the cover 4. FIG. 4 is formed. Therefore, in the illuminating device 10 of 1st Embodiment, as shown in FIG. 5, the bottom face of the flange 4b1 of the lower end part 4b of the cover 4 is cyclic | annular.

  On the other hand, in the illumination device 10 of the first embodiment, as shown in FIG. 4A, the conductor pattern 6 (6a, 6b) of the support substrate 3 is not annular, and is adjacent to the support substrate 3. A gap 7 (see FIG. 2) is formed between the two conductor patterns 6 (6a, 6b). That is, the conductor pattern 6 (6a, 6b) is not arranged between the bottom surface of the flange 4b1 of the lower end portion 4b of the cover 4 and the upper surface of the support substrate 3, but the flange 4b1 of the lower end portion 4b of the cover 4 is disposed. The conductor pattern 6 (6a, 6b) is disposed only in a portion between the bottom surface of the substrate and the top surface of the support substrate 3 facing the substrate (only in a portion of the region on the support substrate 3).

  Furthermore, when the lighting device 10 of the first embodiment is manufactured, the adhesive 5 is applied to the upper surface of the conductor pattern 6 (6a, 6b) of the support substrate 3 as shown in FIG. The adhesive 5 is not applied to the portion of the gap 7 between 6 (6a, 6b). That is, the conductor pattern 6 (6a, 6b) is not located between the bottom surface of the flange 4b1 of the lower end portion 4b of the cover 4 and the upper surface of the support substrate 3 facing the flange 4b1 (out of the region on the support substrate 3). The adhesive 5 is not disposed in the portion. That is, the adhesive 5 is disposed only on a portion between the bottom surface of the flange 4b1 of the lower end portion 4b of the cover 4 and the top surface of the support substrate 3 facing the flange 4b1 (only on a portion of the region on the support substrate 3).

  As a result, in the illumination device 10 of the first embodiment, as shown in FIGS. 1C and 2, the upper surface of the conductor pattern 6 (6 a, 6 b) of the support substrate 3 and the lower end portion 4 b of the cover 4. A part of the bottom surface of the flange 4 b 1 is joined by the adhesive 5. On the other hand, in the gap 7 (see FIG. 4A) where the conductor pattern 6 (6a, 6b) is not formed in the support substrate 3, as shown in FIG. 1B and FIG. 3 is formed between the top surface of the cover 4 and the bottom surface of the flange 4b1 of the lower end portion 4b of the cover 4. That is, the conductor pattern 6 (6a, 6b) and the adhesive 5 serve as a spacer for ensuring the air flow path (gap 7).

  The ratio of the portion bonded to the conductor pattern 6 (6a, 6b) by the adhesive 5 in the entire bottom surface of the flange 4b1 of the lower end 4b of the cover 4 is preferably 40% or more. The bottom surface of the flange 4b1 of 4b and the conductor pattern 6 (6a, 6b) are securely fixed by the adhesive 5, and a necessary and sufficient gap 7 (air flow path) for connecting the inside and the outside of the cover 4 is ensured. Then, the ratio of the portion joined to the conductor pattern 6 (6a, 6b) by the adhesive 5 in the entire bottom surface of the flange 4b1 of the lower end portion 4b of the cover 4 can be set to an arbitrary value. The adhesive 5 can be disposed at an arbitrary position on the bottom surface of the flange 4b1 of the lower end 4b (particularly with respect to the bonding location and bonding area between the flange 4b1 and the conductor pattern 6 (6a, 6b)) Not constant).

  That is, when the lighting device 10 according to the first embodiment is manufactured, the expanded air inside the cover 4 is discharged to the outside of the cover 4 through the gap 7 during the curing of the adhesive 5 as shown in FIG. Is done. Next, after the adhesive 5 is cured, whether or not the gap 7 is blocked by the adhesive 5 is confirmed by visual inspection. As a result, the illumination device 10 of the first embodiment as shown in FIG. 1 is completed. In the illumination device 10 according to the first embodiment, the light emitted from the light emitting element 1 is transmitted through the lens portion 4a of the cover 4 and irradiated in the irradiation direction of the illumination device (upper side in FIG. 1C). .

  In detail, in the illuminating device 10 of 1st Embodiment, in order to form the air flow path (gap 7) which discharges the expanded air inside the cover 4, the additional process with respect to the cover 4 is not performed. Therefore, according to the illuminating device 10 of 1st Embodiment, in order that the additional process with respect to the cover 4 may be performed in order to form the air flow path which discharges the expanded air inside the cover 4, of the cover 4 The possibility that the lens unit 4a is deformed can be eliminated.

  In the lighting device 10 of the first embodiment, as shown in FIG. 1, a silicone resin adhesive is used as the adhesive 5, and the cover 4 is formed of a silicone resin. Therefore, according to the illuminating device 10 of 1st Embodiment, the joint strength of the cover 4 and the adhesive agent 5 can be improved rather than the case where the cover 4 is formed with the material different from the adhesive agent 5. FIG. .

  In the illuminating device 10 of the first embodiment, the cover 4 is formed of silicone resin. However, in the illuminating device 10 of the fifth embodiment, for example, a resin other than silicone resin, glass or the like is transparent. It is also possible to form the cover 4 with a material. Moreover, in the illuminating device 10 of 6th Embodiment, it is also possible to make a material which forms the cover 4 contain a fluorescent substance.

  In detail, in the illuminating device 10 of 1st Embodiment, as shown to FIG. 4 (A), it is located in the upper side of FIG. 4 (A) between the two adjacent conductor patterns 6 (6a, 6b). The gap 7 and the gap 7 located on the lower side of FIG. 4A between the two adjacent conductor patterns 6 (6a, 6b) are the central axis 4 ′ of the substantially hemispherical cover 4 (FIG. 1 ( B) and FIG. 1 (C)) are arranged 180 degrees rotationally symmetrical.

  Therefore, at the time of manufacturing the lighting device 10 of the first embodiment, as shown in FIG. 1, during the curing of the adhesive 5, the expanded air inside the cover 4 causes the upper gap 7 in FIG. In addition to being discharged to the outside of the cover 4, it is discharged to the outside of the cover 4 through the lower gap 7 in FIG.

  As a result, according to the illuminating device 10 of the first embodiment, the bottom surface of the flange 4b1 of the lower end 4b of the cover 4 is formed by the expanded air inside the cover 4 while the adhesive 5 is cured. The possibility of peeling from 6 (6a, 6b) can be reduced.

  More specifically, in the illumination device 10 of the first embodiment, as shown in FIG. 1, a plurality of light emitting elements 1 are arranged in the left-right direction of FIG. 1A, and two gaps 7 are formed in FIG. A) is arranged in the vertical direction. Therefore, in the illuminating device 10 of the first embodiment, for example, while the illuminating device 10 is being used, for example, the illuminating device 10 flows into the cover 4 via the upper gap 7 in FIG. A flow of air that passes and flows out of the cover 4 through the lower gap 7 in FIG. 1A is formed. As a result, according to the illuminating device 10 of the first embodiment, for example, during use of the illuminating device 10, it is possible to reduce the possibility that condensation occurs inside the cover 4.

  In the lighting device 10 of the first embodiment, two air flow paths (gap 7) are provided as shown in FIG. 1, but in the lighting device 10 of the seventh embodiment, one or more air flow paths are provided. It is also possible to provide an arbitrary number of air flow paths (gap 7). That is, there may be only one gap 7. According to the present invention, since the number of manufacturing steps does not increase even if the number of air flow paths is changed, the cost of the entire lighting device 10 does not increase. It is sufficient that at least one gap 7 (air flow path) that connects the inside and the outside of the cover 4 is formed. By increasing the number of the gaps 7 (air flow paths) or increasing the size of the gap 7 (air flow paths), the expanded air inside the cover 4 is efficiently discharged to the outside of the cover 4. be able to. Further, by arranging a plurality of gaps 7 (air flow paths) symmetrically about the center axis 4 ′ (see FIGS. 1B and 1C) of the cover 4, the inside of the cover 4 is expanded. Air can be efficiently discharged to the outside of the cover 4.

  Moreover, in the illuminating device 10 of 1st Embodiment, as shown to FIG. 1 and FIG. 5, the flange 4b1 is formed in the lower end part 4b of the substantially hemispherical cover 4, and the bottom face of the flange 4b1 and the conductor of the support substrate 3 are formed. Although the upper surface of the pattern 6 (6a, 6b) is joined by the adhesive 5, instead of the flange 4b1 in the lighting device 10 of the eighth embodiment, the lower end of the substantially hemispherical cover 4 is omitted. It is also possible to join the bottom surface of 4b and the top surface of the conductor pattern 6 (6a, 6b) of the support substrate 3 with the adhesive 5.

  Furthermore, in the illumination device 10 of the first embodiment, as shown in FIG. 1, in order to join the flange 4b1 of the lower end 4b of the substantially hemispherical cover 4 and the plurality of conductor patterns 6 (6a, 6b). Although the colorless and transparent adhesive 5 is used, in the illumination device 10 of the ninth embodiment, instead, the flange 4b1 of the lower end portion 4b of the substantially hemispherical cover 4 and the plurality of conductor patterns 6 (6a, 6b) It is also possible to color the adhesive 5 for bonding. Specifically, in the lighting device 10 of the ninth embodiment, the adhesive 5 is colored black by, for example, containing carbon in the adhesive 5. Therefore, in the lighting device 10 of the ninth embodiment, at the time of visual inspection after the adhesive 5 is cured, the portion where the adhesive 5 is present appears black, and the air flow path (gap 7) where the adhesive 5 is not present. The part does not appear black (looks whitish). As a result, in the lighting device 10 of the ninth embodiment, the gap 5 is blocked by the expansion of the adhesive 5, and a defective product in which the air flow path (gap 7) is not properly formed is visually confirmed. Can be easily removed.

  In the illumination device 10 of the first embodiment, as shown in FIGS. 1 and 5, a substantially hemispherical cover 4 is used, but in the modification of the illumination device 10 of the first embodiment, instead. For example, a cover 4 having an arbitrary shape such as a substantially semi-cylindrical shape, a conical shape, a rectangular parallelepiped shape, or the like can be used. For example, in the cover 4 having a substantially semi-cylindrical shape or a rectangular parallelepiped shape, the shape of the bottom surface of the lower end portion 4b of the cover 4 is linear.

  FIG. 6 is an enlarged cross-sectional view of the flange 4b1 of the lower end 4b of the substantially hemispherical cover 4 and the conductor pattern 6 (6a) of the support substrate 3. Specifically, FIG. 6A is an enlarged cross-sectional view of the flange 4b1 and the conductor pattern 6 (6a) of the lower end 4b of the cover 4 of the lighting device 10 of the first embodiment, and FIG. It is an expanded sectional view of flange 4b1 and conductor pattern 6 (6a) of lower end part 4b of cover 4 of lighting installation 10 of an embodiment.

  In the illumination device 10 of the first embodiment, as shown in FIG. 6A, the width dimension W4b1 of the flange 4b1 in the direction orthogonal to the central axis 4 ′ of the cover 4 (see FIG. 1C), and the conductor The width dimension W6 of the pattern 6 (6a) is made equal. Therefore, in the lighting device 10 of the first embodiment, the fillet of the adhesive 5 is formed in a shape as shown in FIG. 6A, and the side surface of the conductor pattern 6 (6a) is reliably covered by the adhesive 5. . As a result, in the lighting device 10 of the first embodiment, the flange 4b1 and the conductor pattern 6 (6a) can be reliably bonded by the adhesive 5.

  On the other hand, in the illumination device 10 of the tenth embodiment, as shown in FIG. 6B, from the width dimension W4b1 of the flange 4b1 in the direction orthogonal to the central axis 4 ′ of the cover 4 (see FIG. 1C). Also, the width dimension W6 of the conductor pattern 6 (6a) is increased. Therefore, in the illumination device 10 of the tenth embodiment, the width dimension W4b1 of the flange 4b1 or the width dimension W6 of the conductor pattern 6 (6a) varies due to manufacturing errors, and the mounting position of the flange 4b1 with respect to the conductor pattern 6 (6a) is different. Even if there is a variation, the conductor pattern 6 (6a) is positioned directly below the flange 4b1. Further, in the lighting device 10 of the tenth embodiment, the fillet of the adhesive 5 is formed in a shape as shown in FIG. 6B, and the flange 4b1 and the conductor pattern 6 (6a) are surely formed by the adhesive 5. Be joined.

  FIG. 7 is a diagram illustrating the cover 4 and the like of the illumination device 10 according to the eleventh embodiment. Specifically, FIG. 7A is a bottom view of the cover 4 of the illumination device 10 according to the eleventh embodiment, FIG. 7B is a cross-sectional view taken along the line GG in FIG. (C) is an enlarged vertical sectional view showing a state in which the flange 4b1 of the lower end 4b of the cover 4 of the illumination device 10 of the eleventh embodiment is bonded to the conductor pattern 6 (6a) of the support substrate 3 by the adhesive 5. It is.

  In the illumination device 10 of the eleventh embodiment, as shown in FIG. 7, a flange 4 b 1 is formed on the lower end portion 4 b of the substantially hemispherical cover 4. Further, a recess 4b1b1 is formed on the bottom surface 4b1b of the flange 4b1 of the lower end 4b of the cover 4 joined to the upper surface of the conductor pattern 6 (6a) of the support substrate 3 by the adhesive 5.

  Specifically, when the lighting device 10 according to the eleventh embodiment is manufactured, the adhesive 5 is applied to the upper surface of the conductor pattern 6 (6a) of the support substrate 3 as shown in FIG. Next, the flange 4 b 1 at the lower end 4 b of the cover 4 is placed on the conductor pattern 6 (6 a) of the support substrate 3. As a result, the adhesive 5 is filled in the recesses 4b1b1 of the bottom surface 4b1b of the flange 4b1 of the lower end 4b of the cover 4.

  Therefore, according to the illuminating device 10 of the eleventh embodiment, the flange 4b1 of the lower end 4b of the cover 4 and the adhesive than the case where the bottom surface 4b1b of the flange 4b1 of the lower end 4b of the cover 4 is constituted by a flat surface. As a result, the bonding strength between the upper surface of the conductor pattern 6 (6a) of the support substrate 3 and the bottom surface 4b1b of the flange 4b1 of the lower end portion 4b of the cover 4 by the adhesive 5 is improved. Can be made.

  FIG. 8 is a diagram illustrating the cover 4 and the like of the illumination device 10 according to the twelfth embodiment. Specifically, FIG. 8A is a bottom view of the cover 4 of the illuminating device 10 of the twelfth embodiment, FIG. 8B is a cross-sectional view taken along the line H-H in FIG. 8C is a cross-sectional view taken along the line I-I in FIG. 8A, and FIG. 8D is a diagram illustrating the flange 4 b 1 of the lower end 4 b of the cover 4 of the lighting device 10 according to the twelfth embodiment. FIG. 5 is an enlarged vertical cross-sectional view showing a state in which the support substrate 3 is bonded to a conductor pattern 6 (6a).

  In the illumination device 10 of the eleventh embodiment, as shown in FIG. 7A, the recess 4b1b1 of the bottom surface 4b1b of the flange 4b1 of the lower end 4b of the cover 4 is formed over the entire circumference of the flange 4b1 so as to be annular. However, in the illuminating device 10 of the twelfth embodiment, as shown in FIG. 8A, the recess 4b1b1 of the bottom surface 4b1b of the flange 4b1 of the lower end 4b of the cover 4 is formed on the support substrate 3 (FIG. A) is provided only at a position corresponding to the conductor pattern 6 (6a, 6b) (hatched portion in FIG. 8A), and is formed to have a substantially arc shape.

  Specifically, at the time of manufacturing the lighting device 10 of the twelfth embodiment, the adhesive 5 is applied to the upper surface of the conductor pattern 6 (6a) of the support substrate 3 as shown in FIG. Next, the flange 4 b 1 at the lower end 4 b of the cover 4 is placed on the conductor pattern 6 (6 a) of the support substrate 3. As a result, the adhesive 5 is filled in the recesses 4b1b1 of the bottom surface 4b1b of the flange 4b1 of the lower end 4b of the cover 4.

  Therefore, according to the illuminating device 10 of the twelfth embodiment, the flange 4b1 of the lower end 4b of the cover 4 and the adhesive than the case where the bottom surface 4b1b of the flange 4b1 of the lower end 4b of the cover 4 is constituted by a flat surface. As a result, the bonding strength between the upper surface of the conductor pattern 6 (6a) of the support substrate 3 and the bottom surface 4b1b of the flange 4b1 of the lower end portion 4b of the cover 4 by the adhesive 5 is improved. Can be made.

  In the illumination device 10 of the eleventh and twelfth embodiments, as shown in FIGS. 7C and 8D, the vertical cross-sectional shape of the recess 4b1b1 of the bottom surface 4b1b of the flange 4b1 of the lower end 4b of the cover 4 is the same. In the lighting device 10 of the thirteenth embodiment, instead, the vertical cross-sectional shape of the recess 4b1b1 of the bottom surface 4b1b of the flange 4b1 of the lower end 4b of the cover 4 is, for example, triangular or semicircular It is also possible to set a shape other than a square.

  FIG. 9 is a diagram illustrating the cover 4 and the like of the illumination device 10 according to the fourteenth embodiment. Specifically, FIG. 9A is a bottom view of the cover 4 of the illumination device 10 of the fourteenth embodiment, FIG. 9B is a cross-sectional view taken along line JJ of FIG. 9A, and FIG. FIG. 9C is a cross-sectional view taken along the line KK in FIG. 9A, and FIG. 9D is a diagram illustrating the flange 4 b 1 of the lower end portion 4 b of the cover 4 of the illumination device 10 according to the fourteenth embodiment. FIG. 5 is an enlarged vertical cross-sectional view showing a state in which the support substrate 3 is bonded to a conductor pattern 6 (6a).

  In the illumination device 10 of the eleventh embodiment, as shown in FIG. 7A, the recess 4b1b1 of the bottom surface 4b1b of the flange 4b1 of the lower end 4b of the cover 4 is formed over the entire circumference of the flange 4b1 so as to be annular. However, in the illuminating device 10 of the fourteenth embodiment, as shown in FIG. 9A, a plurality of substantially cylindrical recesses 4b1b1 are formed on the conductive pattern of the support substrate 3 (see FIG. 1A). 6 (6a, 6b) are provided only at the positions (hatched portions in FIG. 9A), and are arranged in a generally arcuate shape.

  Specifically, when manufacturing the lighting device 10 of the fourteenth embodiment, the adhesive 5 is applied to the upper surface of the conductor pattern 6 (6a) of the support substrate 3 as shown in FIG. Next, the flange 4 b 1 at the lower end 4 b of the cover 4 is placed on the conductor pattern 6 (6 a) of the support substrate 3. As a result, the adhesive 5 is filled in the recesses 4b1b1 of the bottom surface 4b1b of the flange 4b1 of the lower end 4b of the cover 4.

  Therefore, according to the illuminating device 10 of the fourteenth embodiment, the flange 4b1 of the lower end 4b of the cover 4 and the adhesive than the case where the bottom surface 4b1b of the flange 4b1 of the lower end 4b of the cover 4 is constituted by a flat surface. As a result, the bonding strength between the upper surface of the conductor pattern 6 (6a) of the support substrate 3 and the bottom surface 4b1b of the flange 4b1 of the lower end portion 4b of the cover 4 by the adhesive 5 is improved. Can be made.

  In the illumination device 10 of the fourteenth embodiment, as shown in FIGS. 9A and 9D, the recess 4b1b1 of the bottom surface 4b1b of the flange 4b1 of the lower end 4b of the cover 4 is formed in a substantially cylindrical shape. However, in the illumination device 10 of the fifteenth embodiment, instead of the concave portion 4b1b1 of the bottom surface 4b1b of the flange 4b1 of the lower end 4b of the cover 4, for example, a columnar shape such as a polygonal column shape, a cone shape, a polygonal pyramid shape, etc. It is also possible to form in the shape.

  FIG. 10 is a diagram showing the cover 4 and the like of the illumination device 10 according to the sixteenth embodiment. Specifically, FIG. 10A is a plan view of the cover 4 of the illumination device 10 according to the sixteenth embodiment, FIG. 10B is a cross-sectional view taken along line LL in FIG. (C) is an enlarged vertical sectional view showing a state in which the flange 4b1 of the lower end 4b of the cover 4 of the illumination device 10 of the sixteenth embodiment is joined to the conductor pattern 6 (6a) of the support substrate 3 by the adhesive 5. It is.

  In the illuminating device 10 of the sixteenth embodiment, as shown in FIG. 10, a recess 4b1a1 is formed on the upper surface 4b1a of the flange 4b1 of the lower end 4b of the substantially hemispherical cover 4.

  Specifically, when manufacturing the illumination device 10 of the sixteenth embodiment, as shown in FIG. 10C, first, the flange 4b1 of the lower end portion 4b of the cover 4 is connected to the conductor pattern 6 (6a of the support substrate 3). ) Is placed on top. Next, the adhesive 5 is applied so as to spread over the upper surface 4b1a and side surfaces of the flange 4b1 and the upper surface of the conductor pattern 6 (6a). As a result, the adhesive 5 is filled into the recess 4b1a1 of the upper surface 4b1a of the flange 4b1 of the lower end 4b of the cover 4.

  Therefore, according to the illuminating device 10 of the sixteenth embodiment, the conductive pattern 6 (the conductive pattern 6 of the support substrate 3 by the adhesive 5) is formed as compared with the case where the upper surface 4b1a of the flange 4b1 of the lower end 4b of the cover 4 is configured by a plane. 6a) and the bonding strength between the flange 4b1 of the lower end 4b of the cover 4 can be improved.

  FIG. 11 is a view showing the cover 4 and the like of the lighting apparatus 10 according to the seventeenth embodiment. Specifically, FIG. 11A is a plan view of the cover 4 of the illumination device 10 according to the seventeenth embodiment, FIG. 11B is a cross-sectional view taken along line MM in FIG. FIG. 11C is a cross-sectional view taken along line NN in FIG. 11A, and FIG. 11D is an illustration in which the flange 4 b 1 of the lower end portion 4 b of the cover 4 of the lighting device 10 of the seventeenth embodiment is bonded by the adhesive 5. FIG. 5 is an enlarged vertical cross-sectional view showing a state in which the support substrate 3 is bonded to a conductor pattern 6 (6a).

  In the illumination device 10 of the sixteenth embodiment, as shown in FIG. 10A, the recess 4b1a1 of the upper surface 4b1a of the flange 4b1 of the lower end 4b of the cover 4 is formed over the entire circumference of the flange 4b1 so as to be annular. However, in the illumination device 10 of the seventeenth embodiment, as shown in FIG. 11A, the recess 4b1a1 of the upper surface 4b1a of the flange 4b1 of the lower end 4b of the cover 4 is formed on the support substrate 3 (FIG. A) is provided only at a position corresponding to the conductor pattern 6 (6a, 6b) (hatched portion in FIG. 11A), and is formed to have a substantially arc shape.

  Specifically, when manufacturing the lighting device 10 of the seventeenth embodiment, as shown in FIG. 11D, first, the flange 4b1 of the lower end portion 4b of the cover 4 is connected to the conductor pattern 6 (6a of the support substrate 3). ) Is placed on top. Next, the adhesive 5 is applied so as to spread over the upper surface 4b1a and side surfaces of the flange 4b1 and the upper surface of the conductor pattern 6 (6a). As a result, the adhesive 5 is filled into the recess 4b1a1 of the upper surface 4b1a of the flange 4b1 of the lower end 4b of the cover 4.

  Therefore, according to the illuminating device 10 of the seventeenth embodiment, the conductive pattern 6 of the support substrate 3 by the adhesive 5 (rather than the case where the upper surface 4b1a of the flange 4b1 of the lower end portion 4b of the cover 4 is configured by a plane. 6a) and the bonding strength between the flange 4b1 of the lower end 4b of the cover 4 can be improved.

  In the illumination device 10 of the sixteenth and seventeenth embodiments, as shown in FIGS. 10C and 11D, the vertical cross-sectional shape of the recess 4b1a1 of the upper surface 4b1a of the flange 4b1 of the lower end 4b of the cover 4 is the same. In the lighting device 10 of the eighteenth embodiment, instead, the vertical sectional shape of the recess 4b1a1 of the upper surface 4b1a of the flange 4b1 of the lower end 4b of the cover 4 is, for example, a triangle or a semicircle. It is also possible to set a shape other than a square.

  FIG. 12 is a view showing the cover 4 and the like of the lighting apparatus 10 according to the nineteenth embodiment. Specifically, FIG. 12A is a plan view of the cover 4 of the lighting device 10 according to the nineteenth embodiment, FIG. 12B is a cross-sectional view taken along the line P-P in FIG. 12C is a cross-sectional view taken along the line QQ in FIG. 12A, and FIG. 12D is a diagram illustrating the flange 4b1 of the lower end 4b of the cover 4 of the lighting device 10 according to the nineteenth embodiment. FIG. 5 is an enlarged vertical cross-sectional view showing a state in which the support substrate 3 is bonded to a conductor pattern 6 (6a).

  In the illumination device 10 of the sixteenth embodiment, as shown in FIG. 10A, the recess 4b1a1 of the upper surface 4b1a of the flange 4b1 of the lower end 4b of the cover 4 is formed over the entire circumference of the flange 4b1 so as to be annular. However, in the illuminating device 10 of the nineteenth embodiment, as shown in FIG. 12A, a plurality of substantially cylindrical recesses 4b1a1 are formed on the conductor pattern of the support substrate 3 (see FIG. 1A). 6 (6a, 6b) are provided only at positions (hatched portions in FIG. 12A), and are arranged in a substantially arc shape.

  Specifically, when manufacturing the lighting device 10 of the nineteenth embodiment, as shown in FIG. 12D, first, the flange 4b1 of the lower end portion 4b of the cover 4 is connected to the conductor pattern 6 (6a of the support substrate 3). ) Is placed on top. Next, the adhesive 5 is applied so as to spread over the upper surface 4b1a and side surfaces of the flange 4b1 and the upper surface of the conductor pattern 6 (6a). As a result, the adhesive 5 is filled into the recess 4b1a1 of the upper surface 4b1a of the flange 4b1 of the lower end 4b of the cover 4.

  Therefore, according to the illuminating device 10 of the nineteenth embodiment, the conductive pattern 6 of the support substrate 3 by the adhesive 5 (rather than the case where the upper surface 4b1a of the flange 4b1 of the lower end 4b of the cover 4 is configured by a flat surface. 6a) and the bonding strength between the flange 4b1 of the lower end 4b of the cover 4 can be improved.

In the illumination device 10 of the nineteenth embodiment, as shown in FIGS. 12A and 12D, the recess 4b1a1 of the upper surface 4b1a of the flange 4b1 of the lower end 4b of the cover 4 is formed in a substantially cylindrical shape. However, in the lighting device 10 of the twentieth embodiment, the recess 4b1a1 of the upper surface 4b1a of the flange 4b1 of the lower end 4b of the cover 4 is replaced with a columnar shape other than a columnar shape, a conical shape, a polygonal pyramid shape, for example. It is also possible to form in the shape.
In the example shown in FIGS. 10 to 12, the adhesive 5 is not disposed between the bottom surface of the flange 4b1 and the conductor pattern 6 (6a), but the bonding strength between the bottom surface of the flange 4b1 and the conductor pattern 6 (6a). When the flange 4b1 is placed on the conductor pattern 6 (6a), the adhesive 5 is applied on the conductor pattern 6 (6a), and the bottom surface of the flange 4b1 and the conductor pattern 6 (6a) are improved. It is also possible to interpose the adhesive 5 between the two.

  FIG. 13 is a diagram showing the cover 4 and the like of the illumination device 10 according to the twenty-first embodiment. Specifically, FIG. 13A is a plan view of the cover 4 of the lighting device 10 according to the twenty-first embodiment, FIG. 13B is a cross-sectional view taken along the line RR in FIG. 13C is a cross-sectional view taken along the line S-S in FIG. 13A, and FIG. 13D is a diagram illustrating the flange 4 b 1 of the lower end portion 4 b of the cover 4 of the illumination device 10 according to the twenty-first embodiment. FIG. 5 is an enlarged vertical cross-sectional view showing a state in which the support substrate 3 is bonded to a conductor pattern 6 (6a).

  In the illuminating device 10 of the twenty-first embodiment, as shown in FIG. 13A, the through-hole 4b1c penetrating the upper surface 4b1a and the bottom surface 4b1b of the flange 4b1 of the lower end 4b of the cover 4 is formed on the support substrate 3 (FIG. 1 (A)) is provided only at a position corresponding to the conductor pattern 6 (6a, 6b) (hatched portion in FIG. 13A), and is formed to have a substantially arc shape.

  Specifically, at the time of manufacturing the lighting device 10 of the twenty-first embodiment, the adhesive 5 is applied to the upper surface of the conductor pattern 6 (6a) of the support substrate 3 as shown in FIG. Next, the flange 4 b 1 at the lower end 4 b of the cover 4 is placed on the conductor pattern 6 (6 a) of the support substrate 3. As a result, the adhesive 5 is filled in the through hole 4b1c of the flange 4b1 of the lower end 4b of the cover 4, and a part of the adhesive 5 is above the upper surface 4b1a of the flange 4b1 of the lower end 4b of the cover 4 (FIG. 13). (D) overflows).

  Therefore, according to the illumination device 10 of the twenty-first embodiment, the flange 4b1 of the lower end 4b of the cover 4 is more than the case where the upper surface 4b1a or the bottom 4b1b of the flange 4b1 of the lower end 4b of the cover 4 is configured by a flat surface. As a result, the bonding strength between the upper surface of the conductor pattern 6 (6a) of the support substrate 3 and the flange 4b1 of the lower end 4b of the cover 4 is improved. Can be made.

  In the illuminating device 10 of the twenty-first embodiment, as shown in FIG. 13D, first, the adhesive 5 is applied to the upper surface of the conductor pattern 6 (6a) of the support substrate 3, and then the cover 4 The flange 4b1 of the lower end 4b is placed on the conductor pattern 6 (6a) of the support substrate 3. In the lighting device 10 of the twenty-second embodiment, first, instead of the lower end 4b of the cover 4, The flange 4b1 is placed on the conductor pattern 6 (6a) of the support substrate 3, and then the adhesive 5 is applied so as to spread over the upper surface 4b1a and the side surface of the flange 4b1 and the upper surface of the conductor pattern 6 (6a). It is also possible to fill the adhesive 5 into the through hole 4b1c of the flange 4b1 of the lower end 4b of the cover 4.

  FIG. 14 is a view showing the cover 4 and the like of the illumination device 10 of the twenty-third embodiment. Specifically, FIG. 14A is a plan view of the cover 4 of the illumination device 10 according to the twenty-third embodiment, FIG. 14B is a cross-sectional view taken along the line TT in FIG. 14C is a cross-sectional view taken along the line U-U in FIG. 14A, and FIG. 14D is a diagram illustrating the flange 4 b 1 of the lower end portion 4 b of the cover 4 of the illumination device 10 of the twenty-third embodiment. FIG. 5 is an enlarged vertical sectional view showing a state in which the conductive pattern 6 (6a) of the support substrate 3 is joined.

  In the illumination device 10 of the twenty-third embodiment, as shown in FIG. 14A, a plurality of substantially cylindrical through holes 4b1c are formed on the conductor pattern 6 (6a, 6a, 6) of the support substrate 3 (see FIG. 1A). 6b) is provided only at the position corresponding to 6b) (the hatched portion in FIG. 12A) and is arranged in a generally arcuate shape.

  Specifically, at the time of manufacturing the lighting device 10 of the twenty-third embodiment, the adhesive 5 is applied to the upper surface of the conductor pattern 6 (6a) of the support substrate 3 as shown in FIG. Next, the flange 4 b 1 at the lower end 4 b of the cover 4 is placed on the conductor pattern 6 (6 a) of the support substrate 3. As a result, the adhesive 5 is filled in the through hole 4b1c of the flange 4b1 of the lower end 4b of the cover 4, and a part of the adhesive 5 is above the upper surface 4b1a of the flange 4b1 of the lower end 4b of the cover 4 (FIG. 14). (D) overflows).

  Therefore, according to the illumination device 10 of the twenty-third embodiment, the flange 4b1 of the lower end 4b of the cover 4 is more than a case where the upper surface 4b1a or the bottom surface 4b1b of the flange 4b1 of the lower end 4b of the cover 4 is configured by a plane. As a result, the bonding strength between the upper surface of the conductor pattern 6 (6a) of the support substrate 3 and the flange 4b1 of the lower end 4b of the cover 4 is improved. Can be made.

  In the illumination device 10 of the twenty-third embodiment, as shown in FIG. 14D, first, the adhesive 5 is first applied to the upper surface of the conductor pattern 6 (6a) of the support substrate 3, and then the cover 4 The flange 4b1 of the lower end 4b is placed on the conductor pattern 6 (6a) of the support substrate 3. In the lighting device 10 of the twenty-fourth embodiment, first, instead of the lower end 4b of the cover 4, The flange 4b1 is placed on the conductor pattern 6 (6a) of the support substrate 3, and then the adhesive 5 is applied so as to spread over the upper surface 4b1a and the side surface of the flange 4b1 and the upper surface of the conductor pattern 6 (6a). It is also possible to fill the adhesive 5 into the through hole 4b1c of the flange 4b1 of the lower end 4b of the cover 4.

  FIG. 15 is a component diagram of the support substrate 3 on which the conductor pattern 6 (6a, 6c, 6d) of the illumination device 10 according to the twenty-fifth embodiment is formed. Specifically, FIG. 15A is a plan view of the support substrate 3 on which the conductor pattern 6 (6a, 6c, 6d) is formed, and FIG. 15B is along the VV line of FIG. 15A. 15C is a cross-sectional view taken along line WW in FIG. 15A, and FIG. 15D is a cross-sectional view taken along line XX in FIG.

  At the time of manufacturing the illumination device 10 of the twenty-fifth embodiment, as shown in FIG. 15, the adhesive 5 (see FIG. 1) is applied on the upper surface of the conductor pattern 6 (6 a) of the support substrate 3. Next, the lower end portion 4b of the substantially hemispherical cover 4 (see FIG. 3) so that the light emitting element 1 (see FIG. 3) and the light emitting element substrate 2 (see FIG. 3) are covered by the substantially hemispherical cover 4 (see FIG. 5). The flange 4b1 (see FIG. 5) of FIG. 5 is placed on the conductor pattern 6 (6a) of the support substrate 3, and then the bottom surface of the flange 4b1 of the lower end 4b of the cover 4 and the conductor pattern 6 (6a). The adhesive 5 between the upper surface is cured. That is, in the illumination device 10 of the twenty-fifth embodiment, the shape of the conductor pattern 6 (6a) of the support substrate 3 and the shape of a part of the bottom surface of the flange 4b1 of the lower end portion 4b of the cover 4 are substantially matched. ing.

  Specifically, in the illumination device 10 of the twenty-fifth embodiment, the lower end 4b of the cover 4 is annular as shown in FIG. 5, whereas the support substrate is shown in FIG. 15A. The three conductor patterns 6 (6a) are not annular, and a plurality of gaps 7 are formed between the adjacent conductor patterns 6 (6a) of the support substrate 3. Furthermore, at the time of manufacturing the illumination device 10 of the twenty-fifth embodiment, the adhesive 5 (see FIG. 1) is applied to the upper surface of the conductor pattern 6 (6a) of the support substrate 3, and the conductor patterns 6c and 6d of the support substrate 3 are applied. The adhesive 5 (see FIG. 1) is not applied to the upper surface. Further, the adhesive 5 is not applied to the portions of the plurality of gaps 7 between the adjacent conductor patterns 6 (6a).

  As a result, in the illumination device 10 according to the twenty-fifth embodiment, as shown in FIG. 15, the cover 4 (FIG. 15) is formed on the support substrate 3 in a plurality of gaps 7 where the conductor pattern 6 (6 a) is not formed. 5), an air flow path is formed which communicates the inside and the outside.

  FIG. 16 is a component diagram of the support substrate 3 on which the conductor pattern 6 (6a, 6c, 6d) of the illumination device 10 according to the twenty-sixth embodiment is formed. Specifically, FIG. 16A is a plan view of the support substrate 3 on which the conductor pattern 6 (6a, 6c, 6d) is formed, and FIG. 16B is a line A′-A ′ in FIG. 16C is a cross-sectional view taken along the line B′-B ′ of FIG. 16A, and FIG. 16D is taken along the line C′-C ′ of FIG. It is sectional drawing.

  At the time of manufacturing the lighting device 10 of the twenty-sixth embodiment, as shown in FIG. 16, the adhesive 5 (see FIG. 1) is applied to the upper surface of the conductor pattern 6 (6a) of the support substrate 3 and one of the conductor patterns 6c, 6d. It is applied to the upper surface of the part. Next, the lower end portion 4b of the substantially hemispherical cover 4 (see FIG. 3) so that the light emitting element 1 (see FIG. 3) and the light emitting element substrate 2 (see FIG. 3) are covered by the substantially hemispherical cover 4 (see FIG. 5). The flange 4b1 (see FIG. 5) of FIG. 5 is placed on the conductor pattern 6 (6a) of the support substrate 3 and part of the conductor patterns 6c and 6d, and then the flange of the lower end 4b of the cover 4 The adhesive 5 between the bottom surface of 4b1 and the upper surface of the conductor pattern 6 (6a) and the upper surfaces of the conductor patterns 6c and 6d is cured. That is, in the illumination device 10 of the twenty-sixth embodiment, the shape of the conductor pattern 6 (6a) of the support substrate 3 and part of the conductor patterns 6c and 6d and the part of the bottom surface of the flange 4b1 of the lower end 4b of the cover 4 Are substantially matched with each other.

  Specifically, in the illumination device 10 of the twenty-sixth embodiment, the lower end 4b of the cover 4 is annular as shown in FIG. 5, whereas the support substrate is shown in FIG. The three conductor patterns 6 (6a, 6c, 6d) are not annular, and a plurality of gaps 7 are formed between the adjacent conductor patterns 6 (6a, 6c, 6d) of the support substrate 3. Furthermore, during the manufacture of the illumination device 10 of the twenty-sixth embodiment, the adhesive 5 is not applied to the portions of the plurality of gaps 7 between the adjacent conductor patterns 6 (6a, 6c, 6d).

  As a result, in the illumination device 10 of the twenty-sixth embodiment, as shown in FIG. 16, in the support substrate 3, the plurality of gaps 7 where the conductor pattern 6 (6 a, 6 c, 6 d) is not formed, An air flow path that connects the inside and the outside of the cover 4 (see FIG. 5) is formed.

  FIG. 17 is a component diagram of the support substrate 3 on which the conductor pattern 6 (6a, 6c, 6d) of the illumination device 10 of the twenty-seventh embodiment is formed. Specifically, FIG. 17A is a plan view of the support substrate 3 on which the conductor pattern 6 (6a, 6c, 6d) is formed, and FIG. 17B is a D′-D ′ line in FIG. 17C is a cross-sectional view taken along line E′-E ′ in FIG. 17A, and FIG. 17D is taken along line F′-F ′ in FIG. It is sectional drawing.

  At the time of manufacturing the illumination device 10 of the twenty-seventh embodiment, as shown in FIG. 17, the adhesive 5 (see FIG. 1) is applied to the upper surface of the conductor pattern 6 (6a) of the support substrate 3 and one of the conductor patterns 6c and 6d. It is applied to the upper surface of the part. Next, the lower end portion 4b of the substantially hemispherical cover 4 (see FIG. 3) so that the light emitting element 1 (see FIG. 3) and the light emitting element substrate 2 (see FIG. 3) are covered by the substantially hemispherical cover 4 (see FIG. 5). The flange 4b1 (see FIG. 5) of FIG. 5 is placed on the conductor pattern 6 (6a) of the support substrate 3 and part of the conductor patterns 6c and 6d, and then the flange of the lower end 4b of the cover 4 The adhesive 5 between the bottom surface of 4b1 and the upper surface of the conductor pattern 6 (6a) and the upper surfaces of the conductor patterns 6c and 6d is cured. That is, in the illumination device 10 according to the twenty-seventh embodiment, part of the shape of the conductor pattern 6 (6a) and the conductor patterns 6c and 6d of the support substrate 3 and part of the bottom surface of the flange 4b1 of the lower end 4b of the cover 4 are used. Are substantially matched with each other.

  Specifically, in the illumination device 10 of the twenty-seventh embodiment, the lower end 4b of the cover 4 is annular as shown in FIG. 5, whereas the support substrate is shown in FIG. The three conductor patterns 6 (6a, 6c, 6d) are not annular, and a plurality of gaps 7 are formed between the adjacent conductor patterns 6 (6a, 6c, 6d) of the support substrate 3. Furthermore, at the time of manufacturing the lighting device 10 of the twenty-seventh embodiment, the adhesive 5 is not applied to the portions of the plurality of gaps 7 between the adjacent conductor patterns 6 (6a, 6c, 6d).

  As a result, in the illuminating device 10 of the twenty-seventh embodiment, as shown in FIG. 17, in the support substrate 3, the plurality of gaps 7 where the conductor pattern 6 (6 a, 6 c, 6 d) is not formed, An air flow path that connects the inside and the outside of the cover 4 (see FIG. 5) is formed.

  FIG. 18 is a component diagram of the support substrate 3 on which the conductor pattern 6 (6a, 6c, 6d) of the lighting apparatus 10 according to the twenty-eighth embodiment is formed. Specifically, FIG. 18A is a plan view of the support substrate 3 on which the conductor pattern 6 (6a, 6c, 6d) is formed, and FIG. 18B is a G′-G ′ line in FIG. 18C is a cross-sectional view taken along the line H′-H ′ of FIG.

  At the time of manufacturing the lighting device 10 of the twenty-eighth embodiment, as shown in FIG. 18, the adhesive 5 (see FIG. 1) is applied to the upper surface of the conductor pattern 6 (6a) of the support substrate 3 and one of the conductor patterns 6c and 6d. It is applied to the upper surface of the part. Next, the lower end portion 4b of the substantially hemispherical cover 4 (see FIG. 3) so that the light emitting element 1 (see FIG. 3) and the light emitting element substrate 2 (see FIG. 3) are covered by the substantially hemispherical cover 4 (see FIG. 5). The flange 4b1 (see FIG. 5) of FIG. 5 is placed on the conductor pattern 6 (6a) of the support substrate 3 and part of the conductor patterns 6c and 6d, and then the flange of the lower end 4b of the cover 4 The adhesive 5 between the bottom surface of 4b1 and the upper surface of the conductor pattern 6 (6a) and the upper surfaces of the conductor patterns 6c and 6d is cured. That is, in the lighting device 10 according to the twenty-eighth embodiment, the shape of a part of the conductor pattern 6 (6a) and the conductor patterns 6c and 6d of the support substrate 3 and the part of the bottom surface of the flange 4b1 of the lower end 4b of the cover 4 Are substantially matched with each other.

  Specifically, in the illumination device 10 according to the twenty-eighth embodiment, the lower end 4b of the cover 4 is annular as shown in FIG. 5, whereas the support substrate is shown in FIG. The three conductor patterns 6 (6a, 6c, 6d) are not annular, and a plurality of gaps 7 are formed between the adjacent conductor patterns 6 (6a, 6c, 6d) of the support substrate 3. Furthermore, at the time of manufacturing the lighting device 10 of the twenty-eighth embodiment, the adhesive 5 is not applied to the portions of the plurality of gaps 7 between the adjacent conductor patterns 6 (6a, 6c, 6d).

  As a result, in the illuminating device 10 of the twenty-eighth embodiment, as shown in FIG. 18, in the support substrate 3, in the portions of the plurality of gaps 7 where the conductor pattern 6 (6 a, 6 c, 6 d) is not formed, An air flow path that connects the inside and the outside of the cover 4 (see FIG. 5) is formed.

  In the twenty-ninth embodiment, the first to twenty-eighth embodiments described above can be combined as appropriate.

DESCRIPTION OF SYMBOLS 1 Light emitting element 2 Light emitting element substrate 3 Support substrate 4 Cover 4b Lower end part 4b1 Flange 5 Adhesive 6 (6a, 6b, 6c, 6d) Conductive pattern 7 Gap 10 Illumination device

Claims (8)

Lighting device (5) interposed between the lower end (4b) of the cover (4) covering the light emitting element (1) located on the support substrate (3) and the upper surface of the support substrate (3) ( 10)
A part of the conductor pattern (6) is arranged in a part between the bottom surface of the lower end (4b) of the cover (4) and the upper surface of the support substrate (3),
A part of the lower end (4b) of the cover (4) and the conductor pattern (6) are joined by an adhesive (5),
By not placing the adhesive (5) on the portion where the conductor pattern (6) is not located between the bottom surface of the lower end (4b) of the cover (4) and the upper surface of the support substrate (3), the cover (4 ) Is formed between the bottom surface of the lower end (4b) of the cover (4) and the upper surface of the support substrate (3). .   The lighting device (10) according to claim 1, wherein an adhesive (5) is arranged on a part of the conductor pattern (6) facing the bottom surface of the lower end (4b) of the cover (4).   Conductor patterns (6c, 6d) for supplying electric power to the light emitting element (1) with the conductor pattern (6) joined to the bottom surface of the lower end (4b) of the cover (4) by the adhesive (5) A conductor for supplying electric power to the light emitting element (1) in an electrically continuous manner or electrically independent from the conductor pattern (6c, 6d) for supplying electric power to the light emitting element (1). The lighting device (10) according to claim 1 or 2, wherein the lighting device (10) is formed simultaneously with the pattern (6c, 6d).   A plurality of gaps (7) are formed between the bottom surface of the lower end (4b) of the cover (4) and the upper surface of the support substrate (3) to communicate the inside and outside of the cover (4). The lighting device (10) according to any one of claims 1 to 3.   5. A lighting device (10) according to claim 4, characterized in that the plurality of gaps (7) are arranged 180 [deg.] Rotationally symmetrical about the central axis (4 ') of the cover (4).   The lighting device according to any one of claims 1 to 5, characterized in that an adhesive (5) for joining the lower end (4b) of the cover (4) and the conductor pattern (6) is colored. (10). A flange (4b1) is formed on the lower end (4b) of the cover (4),
A concave portion is formed on the upper surface or the bottom surface of the flange (4b1) of the lower end portion (4b) of the cover (4) joined to the upper surface of the conductor pattern (6) of the support substrate (3) by the adhesive (5). The illumination device (10) according to any one of claims 1 to 6. A flange (4b1) is formed on the lower end (4b) of the cover (4),
Forming a through hole (4b1c) that penetrates the top surface (4b1a) and bottom surface (4b1b) of the flange (4b1);
Adhesive (5) for joining the conductor pattern (6) of the support substrate (3) and the flange (4b1) of the lower end (4b) of the cover (4) is applied to the flange (4b) of the lower end (4b) of the cover (4). The lighting device (10) according to any one of claims 1 to 6, characterized in that the through hole (4b1c) of 4b1) is filled.

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