JP2010230938A - Imaging apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve space efficiency and heat radiation with respect to an imaging apparatus. <P>SOLUTION: The imaging apparatus 100 includes: a case body having a front panel assembly 10, a back panel assembly 20, a side surface case part 30 and a bottom part assembly 40 inside which electronic parts are mounted; a main frame 1 arranged to extend in a predetermined direction in the case body, supporting respective component members and composed of material excellent in heat radiation; and a power supply part 2 arranged proximately to the main frame 1 and supplying power to the electronic parts. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an imaging apparatus.

  2. Description of the Related Art Conventionally, a digital camera that guides heat from an electronic component to a battery through a substrate and releases the heat to a space provided on the opposite side of the substrate across the battery (for example, see Patent Document 1).

JP 2006-98506 A

  However, in high-speed moving image shooting (for example, about 210 fps), the circuit current further increases, so the battery itself becomes a heat generation source, and the method of the above-mentioned patent document cannot catch up with heat and hinders operation. Furthermore, there is a risk that the product size may be reduced or the design may be restricted.

  Accordingly, an object of the present invention is to provide an imaging device capable of improving space efficiency and heat dissipation.

In order to solve the above problem, an imaging apparatus according to claim 1 is provided.
A case body with electronic components mounted inside, a main frame made of a material that is arranged so as to extend in a predetermined direction within the case body, supports each component, and has heat dissipation properties; and And a power supply unit that is disposed adjacently and supplies power to the electronic component.

The invention according to claim 2 is the imaging apparatus according to claim 1,
The case body has a front panel provided on the front surface side of the imaging device main body, and a central control device disposed on the rear surface side of the front panel so as to be separated from the power supply unit, and the central control device And a heat diffusion sheet interposed between the front panel and the back surface of the front panel.

The invention according to claim 3 is the imaging apparatus according to claim 2,
The electronic imaging unit further includes an electronic imaging unit that is spaced apart from the power supply unit and the central control unit.

  According to the present invention, space efficiency and heat dissipation can be improved.

It is a perspective view showing an imaging device of one embodiment to which the present invention is applied. It is a figure which shows the external appearance of the imaging device of FIG. It is a figure which shows the external appearance of the imaging device of FIG. It is a figure which shows the external appearance of the imaging device of FIG. It is a figure which shows typically the cross section of the imaging device in the VV line | wire of FIG. It is a disassembled perspective view which shows the imaging device of FIG. FIG. 7 is an exploded perspective view showing the imaging device of FIG. 1 as viewed from a direction different from FIG. 6 by 180 °. It is a disassembled perspective view which shows the imaging device of FIG. It is a disassembled perspective view which shows the imaging device of FIG. It is a figure which shows the correspondence of the operation time of the imaging device of FIG. 1, and the temperature of each part. It is a figure which shows the correspondence of the operation time of the imaging device of FIG. 1, and the temperature of each part.

Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. However, the scope of the invention is not limited to the illustrated examples.
FIG. 1 is a perspective view showing an imaging apparatus 100 according to an embodiment to which the present invention is applied. 2A is a front view of the imaging apparatus 100, and FIG. 2B is a rear view of the imaging apparatus 100. 3A is a left side view of the imaging apparatus 100, and FIG. 3B is a right side view of the imaging apparatus 100. 4A is a plan view of the imaging apparatus 100, and FIG. 4B is a bottom view of the imaging apparatus 100. FIG. 5 is a diagram schematically showing a cross section of the imaging apparatus taken along line V-V in FIG. 6 is an exploded perspective view showing the imaging apparatus 100, and FIG. 7 is an exploded perspective view showing the imaging apparatus 100 as viewed from a direction 180 degrees different from FIG. FIG. 8 is an exploded perspective view showing the bottom assembly 40, the main frame assembly 50, the liquid crystal display unit 80, and the strobe unit 90 of the imaging apparatus 100. FIG. 9 is an exploded perspective view showing the front panel assembly 10 of the imaging apparatus 100.
In FIG. 5, an image of heat transfer (heat radiation) is schematically represented by arrows.

The imaging device 100 according to the present embodiment is disposed so as to extend in the left-right direction in the case body, and supports the respective constituent members, and is close to the main frame 1 made of a material excellent in heat dissipation. And a power supply unit 2 that supplies power to each unit.
Specifically, as illustrated in FIGS. 1 to 9, the imaging apparatus 100 includes a front panel assembly 10 provided on the front side of the main body of the imaging apparatus 100 and a back panel assembly 2020 provided on the back side. The side case portion 30 and the bottom portion assembly 40 provided between the front panel assembly 10 and the rear panel assembly 20 are assembled to the main frame assembly 50 by screws (not shown). In the imaging apparatus 100, an imaging unit 60, a main board 70, a power supply unit 2, a main frame assembly 50, a liquid crystal display unit 80, a strobe unit 90, and the like are provided.

As shown in FIG. 6, the front panel assembly 10 includes a front panel 11, and a lens opening 12 for exposing the lens 61 a of the imaging unit 60 is formed on the upper right side of the front panel 11. . A strobe opening 13 for exposing the strobe is provided on the left side of the lens opening 12.
Further, as shown in FIG. 9, a heat diffusion sheet 15 is bonded to the back surface of the front panel 11 with a double-sided tape via a buffer member 14. The thermal diffusion sheet 15 is made of, for example, graphite having a thermal conductivity of about 1600 W / m · k.

As shown in FIG. 2B, the back panel assembly 20 includes a back panel 21, and a rectangular display opening 22 is provided from the center of the back panel 21 toward the left side. The display screen of the liquid crystal display device 81 is exposed through the display opening 22.
Further, on the right side of the display opening 22, an operation button 23 such as a mode button relating to an instruction to select an imaging mode or a function is disposed.
Further, a shutter button 24 related to an instruction to shoot a subject is disposed between the rear panel 21 and the front panel 11 and above the imaging device 100.

The side case portion 30 is disposed so as to cover the upper side surface and the right side surface of the imaging apparatus 100.
The bottom assembly 40 is disposed so as to cover the bottom surface of the imaging device 100. Further, as shown in FIG. 4B, the bottom assembly 40 is provided with a bottom cover portion 41 for attaching and detaching the rechargeable battery, the memory card M, and the like of the power supply unit 2.

The front panel assembly 10, the back panel assembly 20, the side case part 30, and the bottom part assembly 40 thus configured constitute a case body.
Further, the front panel assembly 10, the back panel assembly 20, and the side case portion 30 are made of a material that emphasizes rigidity and design, for example, SUS.

  The main frame assembly 50 is disposed so as to extend in the left-right direction inside the front panel assembly 10, the back panel assembly 20, the side case part 30, and the bottom part assembly 40. It has the main frame 1 which supports a structural member.

On the front side of the main frame 1, as shown in FIGS. Here, the proximity means a state in which the main frame 1 and the power supply unit 2 are in contact with each other, or a degree in which heat generated from the power supply unit 2 is efficiently transmitted to the main frame 1 by conduction, convection, radiation, or the like. The state of being slightly separated.
The main frame 1 is made of a material having high heat conductivity (heat dissipation) and rigidity, for example, copper having a thermal conductivity of about 400 W / m · k. That is, the main frame 1 is made of a material having excellent heat dissipation.

A liquid crystal display unit 80 having a liquid crystal display device 81 is provided on the back side of the main frame 1. A strobe unit 90 is provided on the upper side and the back side of the main frame 1.
In this way, the components are assembled with the main frame 1 as the center, so that high rigidity can be ensured and the assembly is good.

As shown in FIG. 6, the imaging unit 60 is provided on the front side of the main frame assembly 50 and on the right side. The imaging unit 60 includes a lens assembly 61 on which a plurality of lenses 61a are mounted, and an electronic imaging unit 62 that converts an optical image that has passed through the plurality of lenses 61a into a two-dimensional image signal.
The electronic imaging unit 62 is configured by an image sensor such as a charge coupled device (CCD) or a complementary metal-oxide semiconductor (CMOS), for example.
A reinforcing metal frame is disposed around the electronic imaging unit 62, and the metal frame also serves as a heat sink.

  Although not shown, the imaging unit 60 includes an imaging control unit including a timing generator, a driver, and the like. Then, the imaging control unit scans and drives the electronic imaging unit 62 with a timing generator and a driver, and converts the optical image into a two-dimensional image signal with the electronic imaging unit 62 every predetermined period. Image frames are read from the imaging area for each screen and output to the LSI 71.

  The lens 61a and the electronic imaging unit 62 of the lens assembly 61 configured as described above are configured to continuously capture a subject at a predetermined frame rate (for example, 300 fps) as an imaging unit under the control of an imaging control unit (not shown). Then, a plurality of image frames are sequentially generated and acquired.

  As shown in FIG. 6, the main board 70 is provided on the front side of the main frame assembly 50 and on the left side of the imaging unit 60. An LSI (Large Scale Integration) 71 constituting the central control device is mounted on the front side of the main board 70.

  The LSI 71, for example, appropriately adjusts the gain for each RGB color component with respect to the analog value signal of each image frame transferred from the electronic imaging unit 62, and then samples and holds it by a sample hold circuit (not shown). It is converted into digital data by a D converter (not shown). In addition, the LSI performs color process processing including pixel interpolation processing and γ correction processing on digital data in a color process circuit (not shown), and then the digital luminance signal Y and color difference signals Cb, Cr (YUV). Data).

The LSI 71 is disposed on the main substrate 70 via an insulating sheet 72. Further, the heat diffusion sheet 15 disposed on the front panel 11 is in contact with the front surface side of the LSI 71. That is, since the thermal diffusion sheet 15 is conductive, the insulating sheet 72 is affixed to the main substrate 70 to prevent contact with the electronic components.
As a result, the heat of the LSI 71 can be widely diffused to suppress the temperature rise, and the temperature is uniform so as not to become a heat spot.
Further, the LSI 71 is arranged away from the imaging unit 60 in the left-right direction.

Further, as shown in FIG. 7, a memory card M is detachably disposed on the back side of the main board 70 via a connector. On the back side of the memory card M, a rechargeable battery as the power supply unit 2 is detachably disposed (see FIG. 5).
The main board 70 is attached to the bottom assembly 40 and screwed (not shown) to the strobe assembly with the main frame 1 interposed therebetween.

  The memory card M is composed of, for example, a non-volatile memory (flash memory) or the like, and stores and saves image data for recording captured images encoded by a JPEG compression unit (not shown).

Next, temperature management and operation time during moving image shooting of the imaging apparatus 100 will be described with reference to FIGS.
FIG. 10 is a diagram illustrating a correspondence relationship between the operation time of the imaging apparatus and the temperature of each unit in a high temperature environment (45 ° C.). FIG. 11 is a diagram illustrating a correspondence relationship between the operation time of the imaging apparatus and the temperature of each unit in a normal temperature environment (25 ° C.).

The imaging apparatus 100 is NG that exceeds the temperature standard, and temperature management is performed by a thermistor. When the power supply unit (rechargeable battery) reaches 59 ° C., ALERT is displayed and the process is forcibly terminated.
It is necessary to limit the operation time so that forced termination does not occur in normal use, and the time to reach the temperature standard is about 21 minutes. HS_Movie) was recorded for 10 minutes.

As shown in FIG. 10, in a high temperature environment (45 ° C.), the temperature once decreases when the operation is limited for 10 minutes, but the temperature increases by repeated use. Approximately 22 minutes later, thermistor temperature control (59 ° C.) displays ALERT and ends. When restarting is repeated and continuously used, ALERT is repeated and the power supply unit temperature becomes 58 ° C to 59 ° C. After about 65 minutes, the battery runs out and the operation ends.
In this way, 10 minutes of imaging can be used twice in succession (total 20 minutes) in a 45 ° C. environment.

In a normal temperature environment (25 ° C.), the temperature rise is highest when the operation is continued for 10 minutes due to the operation restriction.
As shown in FIG. 11, ALERT is not displayed in a 25 ° C. environment, and 10-minute shooting can be used continuously (60 minutes in total) until the battery runs out.
In 65 minutes until the battery runs out, the temperature rise (ΔT) of the power supply section is 20.3 ° C., and the temperature rise (ΔT) of the front panel is 19.4 ° C. Thereby, the temperature rise (ΔT) 20 ° C. which is the temperature standard of the front panel (exterior panel) is also satisfied.
Moreover, it can be used for a longer time by replacing the battery. At this time, since the temperature is lowered when the battery is replaced, it is considered that there is no problem in continuous use for a long time.

As described above, according to the imaging apparatus 100 of the present embodiment, the main frame 1 made of a material having excellent heat dissipation is provided with the front panel assembly 10, the back panel assembly 20, the side case portion 30, and the bottom assembly 40. Since it is arranged so as to extend in the left-right direction within the case body, the heat inside the imaging device 100 can be diffused in the left-right direction to disperse the heat to the rear side of the device, and a heat dissipation structure is provided. Even space efficiency can be improved.
Further, since the power supply unit 2 is disposed close to the main frame 1, the main frame 1 having good heat dissipation (thermal conductivity) is placed close to the power supply unit 2 that is a heat generating component, and the main frame 1 and the case By connecting the front panel assembly 10, the back panel assembly 20, the side case part 30, and the bottom part assembly 40 constituting the body, heat generated from the power supply part 2 can be widely dispersed, and the power supply part 2 Was able to suppress the temperature rise.

Further, since the thermal diffusion sheet 15 is interposed between the LSI 71 that is spaced apart from the power supply unit 2 and the back surface of the front panel 11 on the back surface side of the front panel 11, the LSI 71 and the front panel 11 are connected to each other. They can be brought into close contact with each other, can secure a large heat radiation area, and can dissipate heat by dispersing heat on the front side of the imaging device 100. As a result, the temperature rise of the LSI 71 can be suppressed, and the influence of heat generated by the LSI 71 on other components can be suppressed.
Furthermore, since the electronic imaging unit 62 is disposed inside the imaging apparatus 100 and separated from the power supply unit 2 and the LSI 71, the location of the components that generate heat can be dispersed.

As described above, the imaging apparatus 100 has the main frame 1 and the heat diffusion sheet 15 having high thermal conductivity close to the power source unit 2 and the LSI 71 that generate heat, and each has a heat dissipation path to reduce the heat dissipation area. By increasing the heat, heat can be dispersed throughout the imaging apparatus 100.
Therefore, even the imaging apparatus 100 having a high-speed moving image shooting function can provide a new heat distribution structure that can suppress a temperature rise in a small space, and can perform high-performance shooting for a long time in a compact size. The imaging device 100 that can be provided can be provided.

  The present invention is not limited to the above-described embodiment, and various improvements and design changes may be made without departing from the spirit of the present invention.

DESCRIPTION OF SYMBOLS 100 Imaging device 1 Main frame 2 Power supply part 10 Front panel assembly 15 Thermal diffusion sheet 20 Rear panel assembly 30 Side case part 40 Bottom part assembly 62 Electronic imaging part 71 LSI

Claims (3)

A case body with electronic components on the inside,
A main frame made of a material that is arranged so as to extend in a predetermined direction in the case body, supports each component member, and has heat dissipation,
A power supply unit disposed near the main frame and supplying power to the electronic component;
An imaging apparatus comprising: The case body has a front panel provided on the front side of the imaging device body,
On the back side of the front panel, a central control device disposed away from the power supply unit,
The imaging apparatus according to claim 1, further comprising a heat diffusion sheet interposed between the central control device and a back surface of the front panel.   The imaging apparatus according to claim 2, further comprising an electronic imaging unit that is disposed apart from the power supply unit and the central control device.

Images