JP2006098506A - Imaging apparatus - Google Patents

Imaging apparatus Download PDF

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JP2006098506A
JP2006098506A JP2004281873A JP2004281873A JP2006098506A JP 2006098506 A JP2006098506 A JP 2006098506A JP 2004281873 A JP2004281873 A JP 2004281873A JP 2004281873 A JP2004281873 A JP 2004281873A JP 2006098506 A JP2006098506 A JP 2006098506A
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battery
hole
heat
housing
battery storage
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Toshiki Miyagawa
俊樹 宮川
Naoto Saruwatari
直人 猿渡
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Kyocera Corp
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Kyocera Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an imaging apparatus in which heat can be efficiently discharged from an electronic component via a battery in the inside of the casing. <P>SOLUTION: The imaging apparatus is provided with an imaging unit 3 for picking up an image of a subject from the one-surface side of the casing 2; a main substrate 25 on which an electronic apparatus 27 capable of generating heat when voltage is applied is mounted; and a display part 4 for displaying an image on the other surface of the casing 2; and a battery storage part 41 for storing a battery 23. The main substrate 25 and the battery storage part 41 are successively laminated, from the other surface side to the one-surface side in the order of the main substrate 25 and the battery storage part 41, the electronic component 27 is mounted on the battery storage part 41 side of the main substrate 25 and a heat discharging space 42 is formed on the one-surface side of the battery storage part 41. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、デジタルカメラ等の撮像装置に関するものである。   The present invention relates to an imaging apparatus such as a digital camera.

バッテリが装置外部に広い面積で露出しており、バッテリを放熱部として利用可能であること、バッテリは低温化では機能が低下すること、バッテリへ放熱することにより、熱の影響を受けやすい部品への放熱を抑制できること等の理由から、比較的発熱量の多い電子部品(発熱部品)からバッテリに放熱する撮像装置が知られている。当該撮像装置は、バッテリが筐体外側に着脱され、又は、バッテリ収納部が筐体の一部を構成し、バッテリ又はバッテリ収納部が筐体外部に設けられるものと、バッテリ収納部が筐体内部に設けられるものとに大別できる。   The battery is exposed outside the device over a wide area, and the battery can be used as a heat dissipation part. An imaging device that radiates heat from an electronic component (heat generating component) that generates a relatively large amount of heat to a battery is known. In the imaging apparatus, a battery is attached to or detached from the outside of the housing, or a battery housing portion forms a part of the housing, and the battery or the battery housing portion is provided outside the housing. It can be broadly divided into those provided inside.

バッテリ又はバッテリ収納部が筐体外側に取り付けられる撮像装置としては、例えば、回路基板と、放熱板と、筐体のバッテリ取り付け面と、バッテリとを積層的に配置したもの(特許文献2)、カメラ部、デッキ部、バッテリを光軸に直交する方向に配置したもの(特許文献3)がある。   As an imaging device in which a battery or a battery storage unit is attached to the outside of the housing, for example, a circuit board, a heat sink, a battery mounting surface of the housing, and a battery are stacked (Patent Document 2). There is one in which a camera unit, a deck unit, and a battery are arranged in a direction orthogonal to the optical axis (Patent Document 3).

バッテリ収納部が筐体内部に設けられている撮像装置としては、例えば、発熱源が設けられた基板と電池収納部とを基板の面に沿う方向に並列に配置し、発熱源近傍からバッテリ収納部にかけて放熱部材を配置したもの(特許文献1)、バッテリ収納部が筐体内側に密着するように配置されているもの、回路基板とテープローディング機構との間にバッテリを配置したもの(特許文献4)がある。
特開平9−163197号公報 特開平8−23467号公報 特開平7−143428号公報 特開平9−18759号公報
As an imaging device in which the battery storage unit is provided inside the housing, for example, the substrate on which the heat generation source is provided and the battery storage unit are arranged in parallel in the direction along the surface of the substrate, and the battery is stored from the vicinity of the heat generation source. A heat dissipating member is disposed over the part (Patent Document 1), a battery housing part is disposed so as to be in close contact with the inside of the housing, and a battery is disposed between the circuit board and the tape loading mechanism (Patent Document) 4).
JP-A-9-163197 JP-A-8-23467 JP 7-143428 A Japanese Patent Laid-Open No. 9-18759

撮像装置において、装置の小型化や基板レイアウト等の種々の観点から、バッテリを装置の内部側に配置したい場合がある。一方、上述のバッテリ又はバッテリ収納部が筐体外部へ設けられる技術では、バッテリ又はバッテリ収納部から直接に装置外部へ放熱されることを前提として、バッテリへの放熱を行っている。また、バッテリ収納部が装置内部に設けられている先行文献では、バッテリの放熱や過熱防止については開示されていない。   In an imaging apparatus, there are cases where it is desired to arrange a battery on the inner side of the apparatus from various viewpoints such as downsizing of the apparatus and board layout. On the other hand, in the technique in which the battery or the battery storage unit is provided outside the housing, heat is radiated to the battery on the assumption that heat is radiated directly from the battery or the battery storage unit to the outside of the apparatus. In addition, in the prior literature in which the battery storage unit is provided inside the apparatus, the heat dissipation of the battery and the prevention of overheating are not disclosed.

本発明の目的は、電子部品から筐体内部のバッテリを介した放熱が効率的に行われる撮像装置を提供することにある。   An object of the present invention is to provide an imaging apparatus that efficiently dissipates heat from an electronic component through a battery inside a housing.

本発明の撮像装置は、筐体の一方の面側から被写体を撮像する撮像ユニットと、前記筐体の他方の面に画像を表示する表示部と、発熱する電子部品が設けられた回路基板と、バッテリを収納可能なバッテリ収納部と、を備え、前記回路基板及び前記バッテリ収納部は、前記他方の面側から前記一方の面側へ、前記回路基板、前記バッテリ収納部の順で積層的に設けられ、前記電子部品は前記回路基板の前記バッテリ収納部側に設けられ、前記バッテリ収納部の前記一方の面側には放熱空間が形成されている。   An image pickup apparatus according to the present invention includes an image pickup unit that picks up an image of a subject from one side of a housing, a display unit that displays an image on the other surface of the housing, and a circuit board provided with electronic components that generate heat. A battery storage section capable of storing a battery, wherein the circuit board and the battery storage section are stacked in the order of the circuit board and the battery storage section from the other surface side to the one surface side. The electronic component is provided on the battery housing part side of the circuit board, and a heat radiation space is formed on the one surface side of the battery housing part.

好適には、前記積層的に設けられた前記回路基板及び前記バッテリ収納部は、前記積層の方向に対して前記撮像ユニットと隣接して配置されている。   Preferably, the circuit board and the battery storage unit provided in a stacked manner are disposed adjacent to the imaging unit in the stacking direction.

好適には、前記バッテリ収納部の前記一方の面側には孔部が設けられ、前記放熱空間は、前記孔部を含んで形成されている。   Preferably, a hole is provided on the one surface side of the battery storage portion, and the heat dissipation space is formed including the hole.

好適には、前記孔部は、該孔部の少なくとも一端面により前記バッテリの少なくとも一部を支持可能な形状に形成されている。   Preferably, the hole is formed in a shape capable of supporting at least a part of the battery by at least one end surface of the hole.

好適には、前記電子部品と、前記バッテリ収納部または前記バッテリとの間に設けた伝熱部材を更に備え、前記伝熱部材は電子部品と当接すると共に、前記バッテリ収納部または前記バッテリと当接可能である。   Preferably, the apparatus further includes a heat transfer member provided between the electronic component and the battery storage unit or the battery, and the heat transfer member contacts the electronic component and contacts the battery storage unit or the battery. It is possible to contact.

本発明の撮像装置によれば、電子部品から筐体内部のバッテリを介した放熱を効率的に行うことができる。   According to the imaging apparatus of the present invention, it is possible to efficiently dissipate heat from an electronic component via a battery inside the housing.

図1(a)及び図1(b)は、それぞれ本発明を適用したデジタルカメラ1の概観斜視図である。デジタルカメラ1は、横長薄型の直方体状の筐体2と、筐体2の前面側から被写体を撮像するための撮像ユニット3と、筐体2の背面に画像を表示する表示部4と、筐体2の右側側面からバッテリ(電池)を挿入又は取り出しするためのバッテリ挿入部5とを備えている。表示部4は例えば液晶表示装置(LCD)により構成される。バッテリ挿入部5は蓋体5aを開閉可能に構成されている。なお、デジタルカメラ1は、上面側のカバー7に設けられるレリーズボタン6等の各種の操作部も備えている。   1A and 1B are schematic perspective views of a digital camera 1 to which the present invention is applied. The digital camera 1 includes a horizontally long and thin rectangular parallelepiped casing 2, an imaging unit 3 for imaging a subject from the front side of the casing 2, a display unit 4 for displaying an image on the back of the casing 2, a casing A battery insertion portion 5 for inserting or removing a battery (battery) from the right side surface of the body 2 is provided. The display unit 4 is configured by a liquid crystal display (LCD), for example. The battery insertion portion 5 is configured to be able to open and close the lid 5a. The digital camera 1 also includes various operation units such as a release button 6 provided on the cover 7 on the upper surface side.

図2及び図3は、それぞれデジタルカメラ1を前面側、背面側から見た分解斜視図、図4は図1のIV−IV線における断面図である。ただし、レリーズボタン6が設けられる上面側のカバー7や撮像ユニット3等の一部の要素を省略して示している。デジタルカメラ1は、前面側から背面側へ、前面カバー(外装カバー)21、前面側基体22、バッテリ23、背面側基体24、メイン基板25及び背面カバー26(外装カバー)を積層して備えている。なお、前面側基体22と前面カバー21との間には、メモリーカードのスロット等が設けられる前面側基板71も設けられる(図7参照)。   2 and 3 are exploded perspective views of the digital camera 1 viewed from the front side and the back side, respectively, and FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. However, some elements such as the cover 7 on the upper surface side where the release button 6 is provided and the imaging unit 3 are omitted. The digital camera 1 includes a front cover (exterior cover) 21, a front side base 22, a battery 23, a back side base 24, a main board 25, and a back cover 26 (exterior cover) stacked from the front side to the back side. Yes. Note that a front side substrate 71 provided with a memory card slot and the like is also provided between the front side base 22 and the front cover 21 (see FIG. 7).

前面側基体22及び背面側基体24は、例えば樹脂により形成される。前面側基体22は筐体2と略同様の広さに形成され、バッテリ非挿入部側には撮像ユニット3を配置するための開口部22aが、バッテリ挿入部側にはバッテリ23を収納するための凹部22bが形成されている。背面側基体24は、筐体2の略半分の広さに形成され、バッテリ23を収納するための凹部24bが設けられている。前面側基体22と背面側基体24とが重ね合わされると、凹部22b及び凹部24bにより、バッテリ収納部41が形成される(図5参照)。なお、前面側基体22及び背面側基体24は、それぞれに設けられた突部、孔部などを嵌合させて位置決めされ、ねじにより固定される。   The front side base 22 and the back side base 24 are made of, for example, resin. The front-side base 22 is formed to have substantially the same size as the housing 2, and an opening 22 a for arranging the imaging unit 3 is disposed on the battery non-insertion portion side, and a battery 23 is accommodated on the battery insertion portion side. The recess 22b is formed. The back-side base 24 is formed to be approximately half as wide as the housing 2, and is provided with a recess 24 b for storing the battery 23. When the front-side base 22 and the back-side base 24 are overlapped, the battery housing portion 41 is formed by the recess 22b and the recess 24b (see FIG. 5). The front-side base 22 and the back-side base 24 are positioned by fitting protrusions, holes, etc. provided on the front-side base 22 and the back-side base 24, and are fixed by screws.

凹部22bには、縁部を残して孔部22cが形成されている。従って、バッテリ23は凹部22bの縁部により枠支持される。バッテリ23又はバッテリ収納部41の前面側には、部材が配置されない放熱空間42が孔部22cを含んで形成される(図4参照)。なお、バッテリ23の全周に亘ってバッテリ23を枠支持する必要はなく、孔部22cの一端面によりバッテリ23の少なくとも一部を支持可能であればよい。例えば、孔部22cの上縁部及び下縁部のみで支持してもよい。   A hole 22c is formed in the recess 22b leaving an edge. Therefore, the battery 23 is frame-supported by the edge of the recess 22b. On the front side of the battery 23 or the battery storage part 41, a heat radiation space 42 in which no member is arranged is formed including the hole 22c (see FIG. 4). The battery 23 need not be frame-supported over the entire circumference of the battery 23 as long as at least a part of the battery 23 can be supported by one end surface of the hole 22c. For example, you may support only by the upper edge part and lower edge part of the hole 22c.

メイン基板25は、例えばパターン層、絶縁層、グランド層、電源層を積層した多層式のプリント基板として構成されている。メイン基板25は筐体2の左右に亘って延びているが、撮像ユニット3を配置するためにバッテリ非挿入部側の大部分は切り欠かれて空所となっている。メイン基板25の両面には主として表示部4を駆動制御するためのIC等の各種電子部品27が配置されている。ただし、比較的発熱量の多い電子部品27が前面側のバッテリ挿入部側へ、比較的発熱量の少ない電子部品27が背面側へ配置されている。比較的発熱量の多い電子部品には、例えば、AFE(Analog Front End)、DSP(Digital Signal Processor)が含まれる。メイン基板25は背面側基体24に設けられた複数の突部24cに支持され、また、背面側基体24の背面側に各電子部品27に対応して凹部24dがそれぞれ設けられることにより、電子部品27と背面側基体24との間にはクリアランスが設けられている。メイン基板25は例えばねじにより背面側基体24及び前面側基体22に固定される。   The main substrate 25 is configured as, for example, a multilayer printed board in which a pattern layer, an insulating layer, a ground layer, and a power supply layer are stacked. Although the main board 25 extends over the left and right sides of the housing 2, most of the battery non-insertion portion side is notched to be empty in order to place the imaging unit 3. Various electronic components 27 such as an IC for driving and controlling the display unit 4 are mainly arranged on both surfaces of the main substrate 25. However, the electronic component 27 having a relatively large amount of heat generation is disposed on the battery insertion portion side on the front side, and the electronic component 27 having a relatively small amount of heat generation is disposed on the back side. Examples of electronic components that generate a relatively large amount of heat include AFE (Analog Front End) and DSP (Digital Signal Processor). The main substrate 25 is supported by a plurality of protrusions 24c provided on the back side base 24, and a concave portion 24d is provided on the back side of the back side base 24 corresponding to each electronic component 27. A clearance is provided between 27 and the back side base 24. The main board 25 is fixed to the back side base 24 and the front side base 22 by screws, for example.

図6は、図1(a)のVI−VI線における断面図であり、撮像ユニット3の構成及び配置を概念的に示している。図の左側がデジタルカメラ1の前面側である。撮像ユニット3と、バッテリ収納部41及びメイン基板25を含む制御ユニット61とは、デジタルカメラ1の左右方向において並列になるように配置されている。撮像ユニット3は、例えば複数のレンズ62と、シャッター63と、CCD等の撮像素子64とを含んで構成されている。   FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. 1A, and conceptually shows the configuration and arrangement of the imaging unit 3. The left side of the figure is the front side of the digital camera 1. The imaging unit 3 and the control unit 61 including the battery storage unit 41 and the main board 25 are arranged in parallel in the left-right direction of the digital camera 1. The imaging unit 3 includes, for example, a plurality of lenses 62, a shutter 63, and an imaging element 64 such as a CCD.

図7は、前面カバー21、前面側基板71、メイン基板25及び背面カバー26の接続状態を示す分解斜視図である。前面カバー21は、例えば金属で形成され、筐体2の前面を構成する前面部21aと、前面部21aからメイン基板25等の積層方向へ延び、筐体2の下面を構成する下面部21bとを備えている。前面部21aの左側には撮像ユニット3を配置するための開口窓21cが設けられ、下面部21bには前面カバー21を前面側基体22にねじ止めするための孔部21dが設けられている。また、背面カバー26は、例えば金属で形成され、筐体2の背面を構成する背面部26aと、背面部26aからメイン基板25等の積層方向へ延び、筐体2の下面を構成する下面部26bとを備えている。背面部26aには表示部4を配置するための開口窓26cが設けられ、下面部26bには背面カバー26を前面側基体22にねじ止めするための孔部26dが設けられている。前面側基板71はメイン基板21と同様に多層式のプリント基板として構成されている。カバー21、26、基板25、71の下方側には、当該要素を電気的に接続するために、当該要素に略直交する方向に延びるミッドブリッジ72(連結部材)が設けられている。   FIG. 7 is an exploded perspective view showing a connection state of the front cover 21, the front side substrate 71, the main substrate 25, and the back cover 26. The front cover 21 is formed of, for example, metal, and includes a front surface portion 21a that configures the front surface of the housing 2, and a lower surface portion 21b that extends from the front surface portion 21a in the stacking direction of the main substrate 25 and the like and configures the lower surface of the housing 2. It has. An opening window 21c for arranging the imaging unit 3 is provided on the left side of the front surface portion 21a, and a hole portion 21d for screwing the front cover 21 to the front surface base 22 is provided on the lower surface portion 21b. The back cover 26 is made of, for example, metal, and includes a back surface portion 26 a that forms the back surface of the housing 2, and a bottom surface portion that extends from the back surface portion 26 a in the stacking direction of the main substrate 25 and the like and forms the bottom surface of the housing 2. 26b. An opening window 26c for disposing the display unit 4 is provided in the back surface part 26a, and a hole part 26d for screwing the back cover 26 to the front side base 22 is provided in the bottom surface part 26b. The front substrate 71 is configured as a multilayer printed circuit board in the same manner as the main substrate 21. On the lower side of the covers 21 and 26 and the substrates 25 and 71, a mid-bridge 72 (connecting member) extending in a direction substantially orthogonal to the elements is provided in order to electrically connect the elements.

図8は、ミッドブリッジ72の斜視図である。なお、図8〜図10の説明において、前面カバー21と背面カバー26とを特に区別する必要がない場合、及び、前面側基板71とメイン基板25とを特に区別する必要がない場合は、一方のみを説明し、他方については符号のみ括弧書きで示す。ミッドブリッジ72は例えば一枚の板金から形成され、本体部73と、端部74とを備えている。本体部73の両端側には孔部75が、中央には切り欠き部78が設けられている。孔部75の縁部からは環状の壁部79が上方へ延びている。また、本体部73の両端側は中央側よりも幅が広く形成されている。端部74は、一部を下面へ折り曲げて形成した緩衝部77と、残りの部分により形成され、本体部73の両端側よりも幅の狭い挿通部76とを備えている。挿通部76は本体部73よりも上方へ位置するように、上方へ折り曲げてからメイン基板25(71)側へ再度折り曲げて形成されている。   FIG. 8 is a perspective view of the midbridge 72. In the description of FIGS. 8 to 10, when there is no need to particularly distinguish the front cover 21 and the back cover 26 and when there is no need to particularly distinguish the front side substrate 71 and the main substrate 25, Only the reference numeral is shown in parentheses for the other. The mid bridge 72 is formed of, for example, a single sheet metal, and includes a main body portion 73 and an end portion 74. A hole 75 is provided at both ends of the main body 73, and a notch 78 is provided at the center. An annular wall 79 extends upward from the edge of the hole 75. Further, both end sides of the main body 73 are formed wider than the center side. The end portion 74 includes a buffer portion 77 formed by bending a part thereof to the lower surface, and an insertion portion 76 that is formed by the remaining portion and narrower than both end sides of the main body portion 73. The insertion portion 76 is formed by bending upward so as to be positioned above the main body portion 73 and then bending again to the main substrate 25 (71) side.

図9は、ミッドブリッジ72が前面側基体22等に取り付けられた状態を示す断面図である。なお、図10(b)のIX−IX線における断面図に相当する。前面側基体22の下方位置には、前後方向(紙面では左右方向)に貫通する開口部91と、前面側基体22の下面部92から開口部91内部へ突出する突部93とが設けられている(図12も参照)。ミッドブリッジ72を開口部91に挿通して突部93に切り欠き部78を嵌合させることにより、ミッドブリッジ72は前面側基体22に対して位置決めされる。   FIG. 9 is a cross-sectional view showing a state where the mid bridge 72 is attached to the front side base body 22 and the like. Note that this corresponds to a cross-sectional view taken along line IX-IX in FIG. An opening 91 that penetrates in the front-rear direction (left-right direction in the drawing) and a protrusion 93 that protrudes from the lower surface 92 of the front-side base 22 into the opening 91 are provided below the front-side base 22. (See also FIG. 12). The mid bridge 72 is positioned with respect to the front base 22 by inserting the mid bridge 72 into the opening 91 and fitting the notch 78 into the protrusion 93.

メイン基板25(71)の下方には切り欠き部81が設けられており(図8参照)、切り欠きによって形成された空所に挿通部76が挿通され、ミッドブリッジ72とメイン基板25(71)のグランド層82とが電気的に接続される。そして、メイン基板25(71)とミッドブリッジ72とは半田付けにより固定される。   A notch 81 is provided below the main board 25 (71) (see FIG. 8), and an insertion part 76 is inserted into a space formed by the notch, so that the midbridge 72 and the main board 25 (71 ) Ground layer 82 is electrically connected. The main board 25 (71) and the mid bridge 72 are fixed by soldering.

図10(a)は、前面カバー21(26)の孔部21d(26d)付近を示す上面図であり、図10(b)は、図10(a)の状態から更にミッドブリッジ72を載置して示す上面図である。下面部92の下面側には、前面カバー21(26)の孔部21d(26d)の縁部において上方に突出する環状の当接部101が当接する(図9も参照)。下面部92は、孔部21d(26d)と略一致するアーチ状の空所95と、当該アーチ状の空所より幅の広い長方形の空所96とが形成されるように切り欠かれている(図12も参照)。この上にミッドブリッジ72が上述したように位置決めして載置されると、図10(b)に示すように、緩衝部77が空所96に嵌合する。そして、図9に示すように、下方から金属製のねじ102が前面カバー21(26)の孔部21d(26d)、前面側基体22の空所95を貫通し、ミッドブリッジ72の孔部75へ螺合され、前面カバー21(26)、前面側基体22、ミッドブリッジ72は固定される。なお、孔部75(壁部79)は雌ねじ部として機能している。また、ミッドブリッジ72は、実装機により自動的にメイン基板25、背面側基板71に実装可能である。   FIG. 10A is a top view showing the vicinity of the hole 21d (26d) of the front cover 21 (26), and FIG. 10B is a state where the mid bridge 72 is further placed from the state of FIG. FIG. An annular contact portion 101 protruding upward at the edge of the hole 21d (26d) of the front cover 21 (26) contacts the lower surface side of the lower surface portion 92 (see also FIG. 9). The lower surface portion 92 is cut out so as to form an arch-shaped space 95 that substantially coincides with the hole 21d (26d) and a rectangular space 96 that is wider than the arch-shaped space. (See also FIG. 12). When the mid bridge 72 is positioned and placed thereon as described above, the buffer portion 77 is fitted into the space 96 as shown in FIG. Then, as shown in FIG. 9, the metal screw 102 penetrates the hole 21 d (26 d) of the front cover 21 (26) and the space 95 of the front base 22 from below, and the hole 75 of the mid bridge 72. The front cover 21 (26), the front side base body 22, and the mid bridge 72 are fixed. The hole 75 (wall portion 79) functions as a female screw portion. The mid bridge 72 can be automatically mounted on the main board 25 and the back side board 71 by a mounting machine.

図11及び図12は、バッテリ23とメイン基板25とを接続するための導電部材111を、メイン基板25に取り付けた状態及び取り付ける前の状態でそれぞれ示す斜視図である。導電部材111は、例えば金属により形成され、バッテリ23と接続される第1端子112と、メイン基板25と接続される第2端子113とを備えている。導電部材111は、第1端子112及び第2端子113の接続部分にて略直角に折り曲げられてL字状に形成されている。   11 and 12 are perspective views showing the conductive member 111 for connecting the battery 23 and the main board 25 in a state of being attached to the main board 25 and a state before being attached. The conductive member 111 is made of, for example, metal, and includes a first terminal 112 connected to the battery 23 and a second terminal 113 connected to the main board 25. The conductive member 111 is bent at a substantially right angle at the connection portion between the first terminal 112 and the second terminal 113 and is formed in an L shape.

第2端子113は、導電部材111をメイン基板25に固定するための締結部として、ねじ孔114と、第1端子112とは反対側の縁部から突出する半田付け部115とを有している。また、第2端子113は、ねじ孔114の両側に配置された位置決め用の孔部116と、第1端子側へ延びる縁部に沿って設けられ、メイン基板25に対して垂直に延びる壁部117とを有している。   The second terminal 113 has a screw hole 114 and a soldering portion 115 projecting from the edge opposite to the first terminal 112 as a fastening portion for fixing the conductive member 111 to the main board 25. Yes. Further, the second terminal 113 is provided along the positioning hole portions 116 disposed on both sides of the screw hole 114 and the edge portion extending to the first terminal side, and extends vertically with respect to the main substrate 25. 117.

メイン基板25は、第2端子113と接続するための接続部121を左側縁部に備えている。接続部121は、第2端子113よりやや広い面積に亘ってメイン基板25の背面側に設けられる金属箔122と、金属箔122を貫通するように設けられたねじ孔123と、ねじ孔123の両側に配置された位置決め用の孔部124とを有している。上方の接続部121の左側には、第1端子112及び第2端子113の接続部分と同程度の幅を有する切り欠き部125が、下方の接続部121の左側端部には、第1端子112及び第2端子113の接続部分と同程度の幅を有する孔部126がそれぞれ設けられている。   The main board 25 includes a connection portion 121 for connecting to the second terminal 113 at the left edge. The connecting portion 121 includes a metal foil 122 provided on the back side of the main substrate 25 over a slightly larger area than the second terminal 113, a screw hole 123 provided so as to penetrate the metal foil 122, and a screw hole 123 And positioning holes 124 disposed on both sides. On the left side of the upper connection portion 121, a notch 125 having a width comparable to that of the connection portion of the first terminal 112 and the second terminal 113 is provided, and on the left end portion of the lower connection portion 121, the first terminal is provided. A hole 126 having a width comparable to that of the connecting portion of 112 and the second terminal 113 is provided.

背面側基体24は、背面側に突出し、メイン基板25を支持する支持部131を備えている。支持部131は、ねじ孔132と、ねじ孔132の両側に設けられた位置決め用の突部133とを有している。突部133の高さはメイン基板25の厚さよりも大きく設定されている。また、背面側基体24は、第1端子112を挿入可能な孔部134を支持部131の左側に備えている。当該孔部134は、バッテリ23が収容される空間の左側端部(バッテリ挿入部5から見て最奥部)に貫通する。   The back-side base 24 includes a support portion 131 that protrudes toward the back side and supports the main substrate 25. The support part 131 has a screw hole 132 and positioning protrusions 133 provided on both sides of the screw hole 132. The height of the protrusion 133 is set larger than the thickness of the main board 25. In addition, the back-side base 24 includes a hole portion 134 into which the first terminal 112 can be inserted on the left side of the support portion 131. The hole 134 passes through the left end of the space in which the battery 23 is accommodated (the deepest portion when viewed from the battery insertion portion 5).

メイン基板25は、孔部124を突部133に嵌合させて位置決めされる。導電部材111は、孔部124を介してメイン基板25上に突出する突部133に孔部116を嵌合させるとともに、切り欠き部125又は孔部126に第1端子112を挿入して位置決めされる。このとき、第1端子112はメイン基板25に対して略垂直に挿入されメイン基板25の前面側に配置され、第2端子113はメイン基板25の背面側に沿って載置される。換言すれば、第2端子113がメイン基板25に対し第1端子111と反対側に配置されている。また、第1端子112は孔部134へ挿入され、バッテリ挿入部5から見てバッテリ収納部41の最奥部に位置する。そして、ねじ135をねじ孔114、123へ貫通させて、ねじ孔132に螺合させることにより、背面側基体25、メイン基板25及び導電部材111は互いに固定される。また、半田付け部115を金属箔122に半田付けすることにより、導電部材111はメイン基板25に更に固定される。組み立て後、バッテリ23が端子側を最奥部に向けてバッテリ挿入部5から挿入されることにより、バッテリ23は第1端子112と接続される。なお、ねじ135は例えば金属で形成され、導電性を有している。   The main board 25 is positioned by fitting the hole 124 to the protrusion 133. The conductive member 111 is positioned by fitting the hole 116 to the protrusion 133 protruding on the main board 25 through the hole 124 and inserting the first terminal 112 into the notch 125 or the hole 126. The At this time, the first terminal 112 is inserted substantially perpendicular to the main board 25 and disposed on the front side of the main board 25, and the second terminal 113 is placed along the back side of the main board 25. In other words, the second terminal 113 is disposed on the side opposite to the first terminal 111 with respect to the main board 25. The first terminal 112 is inserted into the hole 134 and is located at the innermost part of the battery storage unit 41 when viewed from the battery insertion unit 5. Then, the back side base 25, the main substrate 25, and the conductive member 111 are fixed to each other by passing the screw 135 through the screw holes 114 and 123 and screwing them into the screw holes 132. Further, the conductive member 111 is further fixed to the main board 25 by soldering the soldering portion 115 to the metal foil 122. After the assembly, the battery 23 is connected to the first terminal 112 by being inserted from the battery insertion portion 5 with the terminal side facing the innermost portion. The screw 135 is made of metal, for example, and has conductivity.

図13は、上述の組み立てを一度行った後、メイン基板25を背面側基体24から取り外した状態を示している。導電部材111は、半田付け部115においてメイン基板25に対して半田付けされているため、メイン基板25と一体的に背面側基体24から取り外される。   FIG. 13 shows a state in which the main board 25 is removed from the back base 24 after the above-described assembly is performed once. Since the conductive member 111 is soldered to the main substrate 25 at the soldering portion 115, the conductive member 111 is removed from the back-side base 24 integrally with the main substrate 25.

以上の実施形態によれば、メイン基板25とバッテリ収納部41とが積層的に配置され、比較的発熱量の多い電子部品27がバッテリ収納部41側に設けられているので、電子部品27からバッテリ23への放熱が効率的に行われる。また、筐体2内部に設けられたバッテリ23及びバッテリ収納部41へ放熱するので、筐体2からの放熱に起因してユーザが感じる不快感も緩和される。そして、バッテリ収納部41のメイン基板25とは反対側には、放熱空間42が設けられているので、バッテリ23又はバッテリ収納部41から放熱空間への放熱によりバッテリの過熱が防止され、また、装置本体が局所的に過熱されることなく均一に加熱される。特に、前面側基体22の比較的広い範囲(例えばバッテリの面積の半分以上から略全面)に亘って抜け穴を設け、放熱空間を形成しているため、効率的かつ均一にバッテリから放熱される。   According to the above embodiment, the main board 25 and the battery storage unit 41 are arranged in a stacked manner, and the electronic component 27 having a relatively large amount of heat generation is provided on the battery storage unit 41 side. Heat dissipation to the battery 23 is efficiently performed. Further, since heat is radiated to the battery 23 and the battery storage unit 41 provided in the housing 2, discomfort felt by the user due to heat radiation from the housing 2 is alleviated. And since the heat dissipation space 42 is provided on the opposite side to the main board 25 of the battery storage part 41, overheating of the battery is prevented by heat dissipation from the battery 23 or the battery storage part 41 to the heat dissipation space. The apparatus main body is heated uniformly without being overheated locally. In particular, since a through hole is provided over a relatively wide range of the front side base 22 (for example, approximately half of the area of the battery to substantially the entire surface) to form a heat dissipation space, heat is radiated from the battery efficiently and uniformly.

本発明は上述の実施形態に限られず、種々の態様で実施してよい。   The present invention is not limited to the above-described embodiment, and may be implemented in various aspects.

電子部品と、バッテリ又はバッテリ収納部とは、電子部品が設けられる回路基板とバッテリ収納部とが積層的に配置されていれば、互いに当接していてもよいし、クリアランスが設けられていてもよい。互いに当接する場合には、電子部品とバッテリ又はバッテリ収納部とを直接に当接させてもよいし、比較的熱伝導率の高い、例えば空気よりも熱伝導率が高い部材を介して間接的に当接させてもよい。   The electronic component and the battery or the battery storage portion may be in contact with each other or provided with a clearance as long as the circuit board on which the electronic component is provided and the battery storage portion are arranged in a stacked manner. Good. In the case of contact with each other, the electronic component and the battery or the battery housing may be directly contacted, or indirectly through a member having a relatively high thermal conductivity, for example, higher thermal conductivity than air. You may make it contact | abut.

図14に、メイン基板25上の電子部品27と、バッテリ収納部41(背面側基体24)とを伝熱部材を介して当接させた変形例を示す。メイン基板25及び背面側基体24は、互いに当接するための伝熱部材141、142をそれぞれ備えている。伝熱部材141及び伝熱部材142は、例えば金属により形成される。伝熱部材141はメイン基板25上の電子部品27に当接するように設けられている。メイン基板25及び背面側基体24が互いに位置決めして固定されると、伝熱部材141は背面側基体24に、伝熱部材142はメイン基板25上の電子部品27に、板バネとして機能しつつ当接する。空気よりも熱伝導率の高い部材141、142を介して当接することにより、メイン基板25から背面側基体24への放熱が効率的に行われる。また、回路基板又は背面側基体に、互いに対抗する面の全面に亘って又は比較的発熱量の多い電子部品の配置位置において、比較的熱伝導率の高い伝熱シートを設けて、電子部品とバッテリ又はバッテリ収納部とを当接させてもよい。   FIG. 14 shows a modified example in which the electronic component 27 on the main board 25 and the battery storage part 41 (back side base 24) are brought into contact with each other via a heat transfer member. The main substrate 25 and the back-side base 24 are provided with heat transfer members 141 and 142 for contacting each other. The heat transfer member 141 and the heat transfer member 142 are made of metal, for example. The heat transfer member 141 is provided in contact with the electronic component 27 on the main board 25. When the main board 25 and the back side base 24 are positioned and fixed to each other, the heat transfer member 141 functions as a leaf spring while the heat transfer member 141 functions as a leaf spring and the heat transfer member 142 functions as an electronic component 27 on the main board 25. Abut. By abutting through the members 141 and 142 having a higher thermal conductivity than air, heat radiation from the main board 25 to the back-side base 24 is efficiently performed. In addition, a heat transfer sheet having a relatively high thermal conductivity is provided on the circuit board or the back side substrate over the entire surface facing each other or at a position where the electronic component having a relatively large amount of heat generation is provided. A battery or a battery storage unit may be brought into contact.

図15に、電子部品27と、バッテリ23とを伝熱部材151を介して当接させた変形例を示す。伝熱部材151は、例えば金属製の板バネとして構成され、背面側基体24(図15では不図示)に取り付けられて電子部品27に当接している。バッテリ23が図中の矢印の方向に挿入されると、伝熱部材151がバッテリ23に当接する。電子部品27からバッテリ23へは伝熱部材151を介して効率的に放熱が行われる。なお、背面側基体24に前面側基体22のように比較的広い範囲で抜け穴部を設け、バッテリ23と電子部品27とを直接的に又は間接的に当接させてもよい。   FIG. 15 shows a modification in which the electronic component 27 and the battery 23 are brought into contact with each other via the heat transfer member 151. The heat transfer member 151 is configured, for example, as a metal leaf spring, and is attached to the back-side base 24 (not shown in FIG. 15) and is in contact with the electronic component 27. When the battery 23 is inserted in the direction of the arrow in the figure, the heat transfer member 151 contacts the battery 23. Heat is efficiently radiated from the electronic component 27 to the battery 23 via the heat transfer member 151. It should be noted that the rear side base 24 may be provided with a through hole in a relatively wide range as in the front side base 22, and the battery 23 and the electronic component 27 may be brought into direct or indirect contact.

放熱空間は、バッテリ収納部の電圧が印加されると発熱する電子部品とは反対側に設けられれば、大きさ、形状は問わない。また、凹部や孔部によりバッテリ収納部に設けられた空所を含んでもよいし、バッテリ収納部の外側の空間を含んでもよい。なお、バッテリ収納部と放熱空間との間に他の部材を配置したとしても、例えばバッテリ収納部が樹脂製であるのに対し、当該部材が板金又はバッテリ収納部と同じ樹脂である等、当該部材がバッテリ収納部と同程度以上の熱伝導率を有するものであれば、バッテリ収納部から放熱空間へ放熱することに関して支障はないから、当該部材はバッテリ収納部の一部としてみなすことができる。また、バッテリ収納部に孔部等の空所を設け、当該空所に他の部材を配置した場合にも、当該部材はバッテリ収納部が本来占有すべきスペースに設けられているのであるから、当該部材はバッテリ収納部の一部としてみなせる。従って、例えば、上述した実施形態において、前面側基体22の孔部22cに、記録媒体を挿入するためのスロットであって、孔部22cの深さよりも薄いものを設けた撮像装置も本発明に含まれる。   The heat radiating space is not limited in size and shape as long as it is provided on the side opposite to the electronic component that generates heat when the voltage of the battery housing is applied. Moreover, the space provided in the battery storage part by the recessed part and the hole part may be included, and the space outside the battery storage part may be included. Even if another member is arranged between the battery housing part and the heat dissipation space, for example, the battery housing part is made of resin, whereas the member is made of the same resin as the sheet metal or the battery housing part, etc. If the member has a thermal conductivity equal to or higher than that of the battery housing portion, there is no problem with heat dissipation from the battery housing portion to the heat radiating space. Therefore, the member can be regarded as a part of the battery housing portion. . In addition, when a space such as a hole is provided in the battery storage portion and another member is disposed in the space, the member is provided in a space that should be originally occupied by the battery storage portion. The member can be regarded as a part of the battery storage unit. Therefore, for example, in the above-described embodiment, an imaging apparatus in which a slot for inserting a recording medium into the hole 22c of the front surface base 22 and thinner than the depth of the hole 22c is provided in the present invention. included.

なお、電子部品は電圧が印加されれば少なからず発熱するが、バッテリ収納部側に設けられる電子部品としては、例えば、発熱により他の電子部品の動作に影響を及ぼすもの、発熱による温度上昇をユーザが感じ取れるものが挙げられる。   Electronic components generate a lot of heat when a voltage is applied, but examples of electronic components provided on the battery housing side include those that affect the operation of other electronic components due to heat generation, and temperature increases due to heat generation. What can be felt by the user.

本発明を適用したデジタルカメラの概観を示す斜視図である。It is a perspective view which shows the external appearance of the digital camera to which this invention is applied. 図1のデジタルカメラを分解して示す斜視図である。It is a perspective view which decomposes | disassembles and shows the digital camera of FIG. 図1のデジタルカメラを分解して示す斜視図である。It is a perspective view which decomposes | disassembles and shows the digital camera of FIG. 図1のIV−IV線における断面図である。It is sectional drawing in the IV-IV line of FIG. 図1のデジタルカメラの基体を示す斜視図である。It is a perspective view which shows the base | substrate of the digital camera of FIG. 図1のデジタルカメラの撮像ユニットを示す概念図である。It is a conceptual diagram which shows the imaging unit of the digital camera of FIG. 図1のデジタルカメラの外装カバー等の接続状態を示す分解斜視図である。It is a disassembled perspective view which shows the connection state of the exterior cover etc. of the digital camera of FIG. 図1のデジタルカメラのミッドブリッジを示す斜視図である。It is a perspective view which shows the mid bridge of the digital camera of FIG. 図8のミッドブリッジの取り付け状態を示す断面図である。It is sectional drawing which shows the attachment state of the midbridge of FIG. 図8のミッドブリッジの取り付け状態を示す上面図である。It is a top view which shows the attachment state of the mid bridge of FIG. 図1のデジタルカメラの導電体を基板に取り付けられた状態で示す斜視図である。It is a perspective view which shows the conductor of the digital camera of FIG. 1 in the state attached to the board | substrate. 図1のデジタルカメラの導電体を取り付け前の状態で示す斜視図である。It is a perspective view shown in the state before attachment of the conductor of the digital camera of FIG. 図1のデジタルカメラを組み立てた後に分解した場合の導電体を示す斜視図である。It is a perspective view which shows the conductor at the time of disassembling after the digital camera of FIG. 1 is assembled. 図1のデジタルカメラの変形例を示す図である。It is a figure which shows the modification of the digital camera of FIG. 図1のデジタルカメラの変形例を示す図である。It is a figure which shows the modification of the digital camera of FIG.

符号の説明Explanation of symbols

2…筐体、3…撮像ユニット、4…表示部、27…発熱部材、27…回路基板、23…バッテリ、41…バッテリ収納部、42…放熱空間。
DESCRIPTION OF SYMBOLS 2 ... Housing, 3 ... Imaging unit, 4 ... Display part, 27 ... Heat-generating member, 27 ... Circuit board, 23 ... Battery, 41 ... Battery storage part, 42 ... Radiation space.

Claims (5)

筐体の一方の面側から被写体を撮像する撮像ユニットと、
前記筐体の他方の面に画像を表示する表示部と、
発熱する電子部品が設けられた回路基板と、
バッテリを収納可能なバッテリ収納部と、
を備え、
前記回路基板及び前記バッテリ収納部は、前記他方の面側から前記一方の面側へ、前記回路基板、前記バッテリ収納部の順で積層的に設けられ、
前記電子部品は前記回路基板の前記バッテリ収納部側に設けられ、
前記バッテリ収納部の前記一方の面側には放熱空間が形成されている
撮像装置。
An imaging unit for imaging a subject from one side of the housing;
A display unit for displaying an image on the other surface of the housing;
A circuit board provided with electronic components that generate heat;
A battery compartment capable of accommodating a battery;
With
The circuit board and the battery housing part are provided in a stacked manner in the order of the circuit board and the battery housing part from the other surface side to the one surface side,
The electronic component is provided on the circuit board side of the circuit board,
A heat radiation space is formed on the one surface side of the battery storage unit.
前記積層的に設けられた前記回路基板及び前記バッテリ収納部は、前記積層の方向に対して前記撮像ユニットと隣接して配置されている請求項1に記載の撮像装置。   The imaging device according to claim 1, wherein the circuit board and the battery storage unit provided in a stacked manner are disposed adjacent to the imaging unit in the stacking direction. 前記バッテリ収納部の前記一方の面側には孔部が設けられ、前記放熱空間は、前記孔部を含んで形成されている請求項1又は2に記載の撮像装置。   The imaging device according to claim 1, wherein a hole is provided on the one surface side of the battery storage unit, and the heat dissipation space is formed including the hole. 前記孔部は、該孔部の少なくとも一端面により前記バッテリの少なくとも一部を支持可能な形状に形成されている請求項1乃至3の何れかに記載の撮像装置。   The imaging device according to claim 1, wherein the hole is formed in a shape capable of supporting at least a part of the battery by at least one end surface of the hole. 前記電子部品と、前記バッテリ収納部または前記バッテリとの間に設けた伝熱部材を更に備え、
前記伝熱部材は電子部品と当接すると共に、前記バッテリ収納部または前記バッテリと当接可能である請求項1乃至4の何れかに記載の撮像装置。
A heat transfer member provided between the electronic component and the battery housing or the battery;
The imaging apparatus according to claim 1, wherein the heat transfer member is in contact with an electronic component and is capable of contacting the battery storage unit or the battery.
JP2004281873A 2004-09-28 2004-09-28 Imaging apparatus Pending JP2006098506A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010230938A (en) * 2009-03-26 2010-10-14 Casio Computer Co Ltd Imaging apparatus
CN112739154A (en) * 2020-12-09 2021-04-30 维沃移动通信有限公司 Wearable device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010230938A (en) * 2009-03-26 2010-10-14 Casio Computer Co Ltd Imaging apparatus
CN112739154A (en) * 2020-12-09 2021-04-30 维沃移动通信有限公司 Wearable device

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