JP2010225969A - Electronic component mounting apparatus and method for mounting electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus and a method for mounting electronic components, which do not need to perform focusing of a camera according to the thickness of a tray, in performing the recognition of the content of the tray by providing a notch in the tray. <P>SOLUTION: The tray 20 equipped with a notch-formed portion 20R in which a notch 20h penetrates vertically in a position according to the type of a housed electronic component P is used. Imaging is performed by adjusting a focal point Fc of a substrate camera 8 to a tray-mounting face 11a just below the notch-formed portion 20R of the tray 20 mounted to the tray-mounting face 11a, the position where the notch 20h is formed in the notch-formed portion 20R of the tray 20 is detected based on an obtained image, the recognition of the type of the electronic component P housed in the tray 20 is performed based on the position of the notch 20h in the detected notch-formed portion 20R. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for picking up an electronic component supplied while being stored in a tray and mounting the electronic component on a substrate.

Among electronic component mounting apparatuses that pick up an electronic component with a mounting head and mount the electronic component on a substrate, an electronic component that is supplied in a state of being stored in a tray is known. In such a tray supply type electronic component mounting apparatus, the tray is detachably attached to a tray mounting member provided in the electronic component mounting apparatus, but the contents (types of electronic components stored in the storage unit) differ by mistake. In order to prevent a tray mounting error that would cause the tray to be mounted, a notch is formed in a predetermined area of the tray according to the type of electronic component stored, and the position of the notch in the predetermined area Is known that can identify the contents of a tray based on the above (Patent Document 1). In addition, there is also known an apparatus in which the type of electronic component stored in the tray can be automatically identified by visually checking the position of the notch formed in the tray with a camera.
JP 2008-103533 A

  However, when trying to visually check the position of the cutout formed on the tray with the camera, the focus of the camera needs to be matched with the position of the cutout of the tray, that is, the upper surface of the tray. If the trays have different thicknesses, it is necessary to adjust the camera focus (adjust the focus position) each time a tray with a different thickness is installed, which reduces the mounting tact time due to the work process required. There was a problem of doing.

  Accordingly, the present invention provides an electronic component mounting apparatus and an electronic component mounting method that do not require the camera focus adjustment in accordance with the thickness of the tray when the tray is provided with a notch to identify the contents of the tray. With the goal.

  The electronic component mounting apparatus according to claim 1 is a tray mounting member having a tray mounting surface, and a storage unit in which the electronic component is stored and a storage unit that is detachably mounted on the tray mounting surface of the tray mounting member. The electronic component is picked up from the tray provided with a notch forming portion in which a notch penetrating vertically is formed at a position corresponding to the type of electronic component to be mounted, and the tray attached to the tray mounting surface, and is mounted on the substrate An electronic component mounting apparatus having a mounting head, which is obtained by imaging a camera that focuses on a tray mounting surface directly below a notch forming portion of a tray mounted on the tray mounting surface, and the camera imaging Based on the image, the position where the notch is formed in the notch forming portion of the tray is detected, and the notch in the detected notch forming portion is detected. And a discrimination means discriminates the type of the electronic components accommodated in the tray on the basis of the position.

  The electronic component mounting apparatus according to claim 2 is the electronic component mounting apparatus according to claim 1, wherein the electronic component type identified by the identification unit is compared with predetermined data, and is attached to the tray mounting surface. A judging means for judging whether or not the attached tray is a correct tray to be attached to the tray attaching surface, and a tray attached to the tray attaching surface by the judging means is a correct tray to be attached to the tray attaching surface. And alarm means for issuing an alarm when it is determined that there was no.

  The electronic component mounting apparatus according to claim 3 is the electronic component mounting apparatus according to claim 1 or 2, wherein the camera detects the position of the notch formed in the tray, and the camera focuses on the tray. An image of the tray mounting surface is obtained by matching with the mounting surface.

  The electronic component mounting method according to claim 4, wherein a notch forming portion in which a notch penetrating vertically is formed at a position corresponding to a storage portion in which the electronic component is stored and a type of the electronic component stored in the storage portion. An electronic component mounting method for mounting an electronic component on a tray mounting surface in a detachable manner, picking up an electronic component from the tray mounted on the tray mounting surface, and mounting the electronic component on a board. The step of performing imaging by focusing the camera on the tray mounting surface directly below the forming unit, and the step of detecting the position where the notch is formed in the notch forming unit of the tray based on the image obtained by the imaging of the camera Then, based on the detected position of the notch in the notch forming part, the type of the electronic component stored in the tray is identified.

  The electronic component mounting method according to claim 5 is the electronic component mounting method according to claim 4, wherein the type of the identified electronic component is compared with predetermined data, and the tray attached to the tray attachment surface. The process of determining whether the tray is the correct tray to be attached to the tray mounting surface, and an alarm if it is determined that the tray attached to the tray mounting surface was not the correct tray to be attached to the tray mounting surface The process of issuing is performed.

  The electronic component mounting method according to claim 6 is the electronic component mounting method according to claim 4 or 5, wherein the camera is focused on the tray mounting surface in order to detect the position of the notch formed in the tray. The images on the tray mounting surface were obtained by matching.

  In the present invention, the notch forming portion of the tray is formed with a notch penetrating vertically at a position corresponding to the type of electronic component stored in the tray, and the tray is attached to the tray mounting surface. The camera is focused on the tray mounting surface directly below the notch forming part, the image is taken, the position where the notch is formed in the notch forming part is detected based on the obtained image, and the detected notch is detected. Based on the position of the notch in the forming portion, the type of electronic component stored in the tray is identified. For this reason, when a notch is provided in the tray to identify the contents of the tray, it is not necessary to adjust the focus of the camera in accordance with the thickness of the tray, and a reduction in mounting tact can be prevented.

  Embodiments of the present invention will be described below with reference to the drawings. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view of a tray feeder provided in the electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 3 is an embodiment of the present invention. 4 is a block diagram showing a control system of the electronic component mounting apparatus in the embodiment, FIG. 4 is a (a) perspective view and (b) a plan view of a tray provided in the electronic component mounting apparatus in one embodiment of the present invention, and FIG. FIGS. 6A and 6B are partial plan views of the tray mounting member according to the embodiment of the present invention. FIGS. 6A and 6B are partial plan views of the tray mounting member with the tray mounted according to the embodiment of the present invention. FIG. 8A is a diagram showing a state in which imaging is performed by a substrate camera in one embodiment of the present invention, FIG. 8A is an enlarged view of a notch forming portion of a tray in one embodiment of the present invention, and FIG. ) Is a fact of the present invention Is a diagram illustrating an example of a cutout forming section of the image in the form.

In FIG. 1, an electronic component mounting apparatus (hereinafter referred to as a mounting apparatus) 1 according to an embodiment of the present invention is a base 2 and a board transport path 3 that is provided on the base 2 and transports and positions a board PB. And a work execution unit 4 that is provided on the base 2 and performs the work of mounting the electronic component P on the board PB.

  The board conveyance path 3 is composed of a pair of belt conveyors, and the board PB loaded from the outside of the mounting apparatus 1 (arrow A shown in FIG. 1) is carried into the mounting apparatus 1 for positioning, and an electronic component for the board PB. After the P mounting operation is completed, the board PB is carried out of the mounting apparatus 1. In the following description, the conveyance direction of the substrate PB in the mounting apparatus 1 is the X-axis direction, and the horizontal plane direction orthogonal to the X-axis direction is the Y-axis direction. Also, the vertical direction is the Z-axis direction.

  In FIG. 1, the work execution unit 4 includes a plurality of tray feeders 5 that are attached to both ends in the Y-axis direction of the base 2 in a plurality of rows in the X-axis direction, and an XY robot 6 provided on the base 2. , Two mounting heads 7 that are moved in the horizontal plane by the XY robot 6, a substrate camera 8 mounted on each mounting head 7, and both positions facing each other across the substrate transport path 3 on the base 2 The two component cameras 9 are provided.

  In FIG. 2, each tray feeder 5 includes a feeder base portion 10 that is detachably attached to the base 2 and a tray attachment member 11 attached to an upper portion of the feeder base portion 10, and an upper surface (tray attachment portion) of the tray attachment member 11. A plurality of trays 20 storing a plurality of electronic components P are detachably attached to the surface 11a) in a state of being aligned in a row in the Y-axis direction.

  In FIG. 1, an XY robot 6 includes a Y-axis table 6a provided extending in the Y-axis direction, two X-axis tables 6b provided movably in the Y-axis direction along the Y-axis table 6a, and each X-axis table 6b. It consists of two moving stages 6c provided so as to be movable in the X-axis direction along the axis table 6b. Two mounting heads 7 are attached to each moving stage 6c one by one.

  In FIG. 1, each mounting head 7 includes a plurality of suction nozzles 7a extending downward. The mounting head 7 vacuum picks up and picks up the electronic component P supplied from the tray feeder 5 by each suction nozzle 7a, and then separates the electronic component P from the suction nozzle 7a on the substrate PB positioned in the substrate transport path 3. As a result, the electronic component P is mounted on the substrate PB.

  The substrate camera 8 has an imaging field of view downward, moves in a horizontal plane together with the mounting head 7, and images a substrate mark (not shown) on the substrate PB positioned in the substrate transport path 3 from above. The component camera 9 has an imaging field of view upward, and images the electronic component P picked up by the mounting head 7 from below.

  The substrate PB is transported and positioned by the substrate transport path 3 by controlling the operation of the substrate transport path operating mechanism 31 (FIG. 3) including an actuator (not shown) by the control device 30 (FIG. 3) provided in the mounting apparatus 1. Made. The movement operation of each mounting head 7 and the substrate camera 8 by the operation of the XY robot 6 is performed by the operation control of the XY robot operation mechanism 32 (FIG. 3) including an actuator (not shown) by the control device 30. The raising and lowering of each suction nozzle 7a provided in the mounting head 7 and the rotation operation about the Z axis are performed by the control device 30 controlling the operation of a nozzle operating mechanism 33 (FIG. 3) including an actuator (not shown). The operation of sucking and releasing the electronic component P by 7a is performed by controlling the operation of the suction operation mechanism 34 (FIG. 3) including an actuator (not shown) by the control device 30.

  The imaging operations of the substrate camera 8 and the component camera 9 are controlled by the control device 30, and the image data obtained by the imaging operations of the substrate camera 8 and the component camera 9 are sent to the control device 30 (FIG. 3).

  Next, the mounting operation of the electronic component P on the board PB by the mounting apparatus 1 will be described. When the control device 30 detects that the substrate PB has been put into the substrate transport path 3 by a sensor (not shown), the control device 30 operates the substrate transport path 3 to carry the substrate PB into the mounting apparatus 1 and put it in a predetermined work position. Position.

  After positioning the substrate PB, the control device 30 positions the mounting head 7 above the substrate PB and causes the substrate camera 8 to image a substrate mark (not shown) provided on the substrate PB. Then, based on the obtained image data of the substrate mark, the positional deviation from the reference position of the substrate PB is obtained.

  When the controller 30 determines the positional deviation of the substrate PB, the mounting head 7 is moved above the tray feeder 5 and the electronic component P in the tray 20 is picked up and picked up by the suction nozzle 7a.

  After the electronic device P is picked up and picked up by the suction nozzle 7a, the control device 30 moves the mounting head 7 so that the picked-up electronic component P passes immediately above the component camera 9, and the electronic device P is moved to the component camera 9. Let's take an image. Then, image recognition (component recognition) of the electronic component P is performed based on the obtained image data of the electronic component P, and a positional deviation (suction deviation) of the electronic component P with respect to the suction nozzle 7a is obtained.

  When the controller 30 determines the suction displacement of the electronic component P, the controller 30 moves the mounting head 7 above the substrate PB, and disengages the electronic component P sucked by the suction nozzle 7a at the target mounting position on the substrate PB. The electronic component P is mounted on the substrate PB. When the electronic component P is mounted on the substrate PB, the control device 30 shifts the position of the substrate PB from the reference position obtained when positioning the substrate PB and the suction nozzle 7a of the electronic component P determined when the electronic component P is recognized. The relative position of the suction nozzle 7a with respect to the substrate PB is corrected so that the positional deviation is corrected.

  The control device 30 determines whether or not all of the electronic components P to be mounted on the substrate PB are mounted on the substrate PB, and as a result, all of the electronic components P to be mounted on the substrate PB are not mounted. The above-described process for mounting the electronic component P is repeated, and when all of the electronic components P to be mounted on the substrate PB have been mounted, the substrate transport path 3 is operated so that the substrate PB is attached to the outside of the mounting device 1. To be taken out. As a result, the mounting operation of the electronic component P on one board PB is completed, and the control device 30 waits for the insertion of the next board PB.

  By the way, in the mounting apparatus 1 that performs the mounting operation of the electronic component P on the board PB, the control device 30 is interrupted when the tray mounting member 11 to which the tray 20 is mounted is mounted on the feeder base 10 or is interrupted. In a predetermined case such as when the execution of the mounted program is resumed, the type of the electronic component P stored in each tray 20 is identified, and the tray mounting is performed based on the identified type of the electronic component P. A determination is made as to whether or not the tray 20 attached to the surface 11a is the correct tray 20 to be attached to the tray attachment surface 11a (detection of an attachment error of the tray 20).

  4A and 4B, each tray 20 is formed of a flat plate-like member as a whole, and a storage portion 21 for storing the electronic component P is formed on the upper surface thereof. The storage unit 21 includes a plurality of recesses 22 opened upward, and each of the electronic components P is stored in each recess 22 so as to be freely taken out from above.

In FIG. 2, each tray mounting member 11 is a flat plate-like member extending in the Y-axis direction as a whole, and has a width dimension (X-axis direction) larger than that of the tray 20. A plurality of support walls 11b for supporting the side of the attached tray 20 are provided extending upward. The tray mounting surface 11a, which is the upper surface of the tray mounting member 11, has a plurality of tray mounting areas defined by a support wall 11b facing in the X-axis direction and a plurality of tray positioning protrusions 11c provided on the tray mounting surface 11a. 11R (FIG. 5) is provided, and the tray 20 is attached to each tray attachment region 11R one by one.

  4A, among the four sides of the tray 20, when the tray 20 is attached to the tray attachment region 11R on the tray attachment surface 11a, the side parallel to the substrate conveyance path 3 and close to the substrate conveyance path 3 A notch forming portion 20R is set in the region on the one side 20L side, and one or a plurality of semicircular notches 20h are formed in the notch forming portion 20R. Each notch 20h is selectively removed from one or more of the seven semicircular notch candidate regions 20a (FIG. 4B) provided in the notch forming portion 20R of the tray 20. Formed by.

  Which notch candidate region 20a among the seven notch candidate regions 20a is removed, that is, at which position in the notch forming portion 20R the notch 20h is formed is determined by the storage portion of the tray 20 21 is determined according to the type of electronic component P stored in 21. Therefore, by detecting at which position in the notch forming portion 20R of the tray 20 attached to the tray attachment surface 11a the notch 20h is formed, the contents of the tray 20 (stored in the storage portion 21). Type of electronic component P).

  In FIG. 5, when the tray 20 is attached to the tray attachment area 11R on the tray attachment surface 11a, there are seven identification marks at positions corresponding to the respective positions of the seven notch candidate areas 20a of the tray 20. M (M1, M2,..., M7) is formed.

  Each of the identification marks M1, M2,..., M7 corresponds to one of the seven notch candidate areas 20a of the tray 20 attached to the tray attaching surface 11a that has been removed to become a notch 20h. Things can be visually recognized from above through the notch 20h, but those corresponding to the notch candidate region 20a that have not been removed cannot be seen from above because they are hidden by the notch candidate region 20a.

  6A shows the tray 20 from which the notch candidate region 20a corresponding to the identification mark M7 has been removed (the notch 20h is formed at a position corresponding to the identification mark M7 in the notch forming portion 20R). Is attached to the tray attachment region 11R, so that the identification mark M7 of the seven identification marks M can be viewed from above. In FIG. 6B, the notch candidate region 20a corresponding to the identification marks M2 and M7 is removed (the notch 20h is located at a position corresponding to the identification marks M2 and M7 in the notch forming portion 20R). A state in which the identification marks M2 and M7 of the seven identification marks M are visible from above is shown by attaching the formed tray 20 to the tray attachment region 11R. As can be seen from these drawings, when the notch forming portion 20R of the tray 20 is observed from the upper side, depending on which of the seven identification marks M is visually recognized, It is possible to detect at which position in the notch forming portion 20R the notch 20h is formed.

In the mounting apparatus 1 according to the present embodiment, the control device 30 controls the operation of the XY robot operating mechanism 32 before mounting the electronic component P on the board PB, so that the board camera 8 is stored in the stored electronic device. The type of the component P is moved above the tray 20 to be identified. Then, as shown in FIG. 7, the focal point Fc of the substrate camera 8 is aligned with the tray attachment surface 11a immediately below the notch forming portion 20R of the tray 20 attached to the tray attachment surface 11a (that is, the identification marks M1, M2). ,..., M7 (focus Fc is set) to perform imaging (imaging process)
.

  Here, the field of view of the substrate camera 8 is generally narrow, and it is difficult to obtain an image of an area including all of the seven identification marks M on the tray attachment surface 11a by one imaging operation by the substrate camera 8. The step of obtaining an image V1 by performing imaging with the focus Fc on the mark M1, the step of obtaining the image V2 by performing imaging with the focus Fc on the identification mark M2,..., And the focal point Fc on the identification mark M7. By sequentially performing the process of obtaining the image V7 by performing the combined imaging, an image of the tray attachment surface 11a immediately below the notch forming portion 20R of the tray 20 is obtained (FIG. 8A).

  The identification unit 30a (FIG. 3) of the control device 30 detects the position where the notch 20h in the notch forming unit 20R of the tray 20 is formed based on the image obtained by the imaging of the substrate camera 8 in the above process. (Notch position detection step). Specifically, among the seven images V1, V2,..., V7, by picking up an image that appears bright (and thus the identification mark M is reflected), the notch in the notch forming portion 20R is picked up. The position where 20h is formed is detected (FIG. 8B).

  As shown in FIGS. 8A and 8B, a notch 20h is provided at a position corresponding to the identification mark M2 and a position corresponding to the identification mark M7 in the notch forming portion 20R of the tray 20. Of the seven images V1, V2,..., V7, the images V2 and V7 are bright images, and the other images V1, V3, V4, V5, and V6 are dark images. Thus, by the identification unit 30a of the control device 30, a notch 20h is formed at a position corresponding to the image V2 (position corresponding to the identification mark M2) and a position corresponding to the image V7 (position corresponding to the identification mark M7). It is detected that it is formed.

  In the present embodiment, the focal point Fc of the substrate camera 8 is made to coincide with the upper surface of the tray 20, and the position of the notch 20h is not directly detected by obtaining an image of the notch 20h. When the focal point Fc is matched and the image of the tray mounting surface 11a (the image of the identification mark M) is obtained, the position of the notch 20h is indirectly detected. If the focus Fc of the substrate camera 8 is made to coincide with the upper surface of the tray 20, the focus adjustment of the substrate camera 8 according to the thickness of the tray 20 each time the thickness of the tray 20 is different. However, if the focus Fc is matched with the tray mounting surface 11a, the focus of the substrate camera 8 is adjusted according to the thickness of the tray 20. Necessary is because no longer needed.

  When the identification unit 30a of the control device 30 detects the position where the notch 20h is formed in the notch forming unit 20R as described above, the identification unit 30a stores the tray 20 based on the detected position of the notch 20h. The type of the electronic component P stored in the unit 21 is identified (identification process).

  The identification of the type of the electronic component P is performed based on data associated with the position of the notch 20h and the type of the electronic component P stored in advance in the storage unit 30b (FIG. 3) of the control device 30.

  Thus, the identification unit 30a of the control device 30 detects the position where the notch 20h in the notch forming unit 20R of the tray 20 is formed based on the image obtained by the imaging of the camera (substrate camera 8). Based on the detected position of the notch 20h in the notch forming portion 20R, it serves as an identifying means for identifying the type of the electronic component P stored in the tray 20.

In the present embodiment, since an image of an area including all of the seven identification marks M on the tray mounting surface 11a is obtained using the substrate camera 8 with a narrow field of view, each identification mark M is assigned to each identification mark M. The imaging operation with the focal point Fc is repeated seven times. However, by using a camera having a larger field of view than the substrate camera 8, an image (on the tray mounting surface 11a) that is required for a smaller number of imaging operations. An image of an area including all of the seven identification marks M) may be obtained.

  When the identification unit 30a of the control device 30 identifies the type (content identification) of the electronic component P stored in the tray 20 as described above, the determination unit 30c (FIG. 3) of the control device 30 Whether or not the tray 20 attached to the tray attachment surface 11a (the tray 20 whose type of electronic component P has been identified by the identification unit 30a) is the correct tray 20 to be attached to the tray attachment surface 11a. Make a decision (judgment step). This determination is made by comparing the type of the electronic component P identified by the identification unit 30a of the control device 30 with predetermined data.

  For example, according to the mounting program, the electronic device P stored in the tray 20 should be the electronic component P of the type “A” according to the mounting program. In addition to the identification mark M3, not only the position corresponding to the identification mark M6 but also the position corresponding to the identification mark M6 is recognized. It is detected that 20h has been formed, or that there is no notch at the position corresponding to the identification mark M3 and that the notch 20h has been formed at a position corresponding to the identification mark M4. In this case, it is determined that a tray 20 attachment error has occurred.

  The alarm device operating unit 30d (FIG. 3) of the control device 30 determines that the tray 20 attached to the tray attachment surface 11a is not the correct tray 20 to be attached to the tray attachment surface 11a (tray). When it is determined that 20 mounting errors have occurred), the alarm device 35 (FIG. 3) provided in the mounting apparatus 1 is operated to alert the operator (attention calling step). As the alarm device 35, for example, a buzzer that emits sound, a lamp that emits colored light, or the like can be used.

  As described above, the alarm device operating unit 30d and the alarm device 35 of the control device 30 are the correct tray 20 to which the tray 20 attached to the tray attachment surface 11a by the determination unit 30c of the control device 30 should be attached to the tray attachment surface 11a. It is an alarm means for issuing an alarm when it is determined that there is no such event.

  As described above, the mounting apparatus 1 according to the present embodiment is detachably attached to the tray attachment member 11 having the tray attachment surface 11a and the tray attachment surface 11a of the tray attachment member 11, and the electronic component P is stored therein. A tray 20 having a notch forming portion 20R in which a notch 20h penetrating vertically is formed at a position corresponding to the storage portion 21 to be stored and the type of electronic component P stored in the storage portion 21, and a tray mounting surface 11a A mounting head 7 for picking up an electronic component P from the tray 20 attached to the substrate 20 and mounting the electronic component P on the substrate PB, and mounting the tray directly below the notch forming portion 20R of the tray 20 attached to the tray attachment surface 11a. The board camera 8 as a camera for taking an image with the focal point Fc aligned with the surface 11a, Based on the obtained image, the position where the notch 20h in the notch forming part 20R of the tray 20 is formed is detected, and the tray 20 is detected based on the detected position of the notch 20h in the notch forming part 20R. It is provided with an identification unit 30a of the control device 30 as identification means for identifying the type of the electronic component P housed therein.

In the electronic component mounting method according to the present embodiment, the storage portion 21 in which the electronic component P is stored and the notch 20h penetrating vertically are formed at a position corresponding to the type of the electronic component P stored in the storage portion 21. In the electronic component mounting method, the tray 20 having the cut-out forming portion 20R is detachably mounted on the tray mounting surface 11a, and the electronic component P is picked up from the tray 20 mounted on the tray mounting surface 11a and mounted on the substrate PB. Yes, a step (imaging step) of performing imaging by aligning the focal point Fc of the substrate camera 8 with the tray attachment surface 11a immediately below the notch forming portion 20R of the tray 20 attached to the tray attachment surface 11a, and imaging by the substrate camera 8 A step of detecting a position where the notch 20h in the notch forming portion 20R of the tray 20 is formed based on the obtained image ( Notch position detection step) and a step (identification step) of identifying the type of the electronic component P stored in the tray 20 based on the detected position of the notch 20h in the notch forming portion 20R. It has become.

  In the mounting apparatus 1 (or electronic component mounting method) according to the present embodiment, the notch forming portion 20R of the tray 20 has a notch penetrating vertically at a position corresponding to the type of the electronic component P stored in the tray 20. 20h is formed, and with the tray 20 attached to the tray attachment surface 11a, imaging is performed by aligning the focal point Fc of the substrate camera 8 with the tray attachment surface 11a immediately below the notch forming portion 20R. Based on the image, the position where the notch 20h in the notch forming portion 20R is formed is detected, and the electronic accommodated in the tray 20 is detected based on the detected position of the notch 20h in the notch forming portion 20R. The type of the part P is identified. For this reason, when the notch 20h is provided in the tray 20 to identify the contents of the tray 20, it is not necessary to adjust the focus of the substrate camera 8 according to the thickness of the tray 20 and to prevent a reduction in mounting tact. Can do.

  Further, the mounting apparatus 1 according to the present embodiment compares the type of the electronic component P identified by the identification unit 30a of the control apparatus 30 with predetermined data, and the tray 20 attached to the tray attachment surface 11a is the tray. The determination unit 30c of the control device 30 as determination means for determining whether or not the tray 20 is to be attached to the attachment surface 11a, and the tray 20 attached to the tray attachment surface 11a by the determination unit 30c of the control device 30. Is provided with an alarm operating section 30d and an alarm 35 of the control device 30 as alarm means for issuing an alarm and alerting the operator when it is determined that the tray 20 is not the correct tray 20 to be mounted on the tray mounting surface 11a. It has become.

  In the electronic component mounting method according to the present embodiment, the type of the identified electronic component P is compared with predetermined data, and the tray 20 attached to the tray attachment surface 11a should be attached to the tray attachment surface 11a. A step of determining whether or not the tray 20 is correct (determination step), and an alarm when it is determined that the tray 20 attached to the tray attachment surface 11a is not the correct tray 20 to be attached to the tray attachment surface 11a Is issued to alert the operator (attention calling step).

  For this reason, the mounting operation of the electronic component P to the board PB is not performed while the tray 20 is mistakenly attached, and not only the mounting apparatus 1 but also the mounting apparatus 1 is produced by producing a defective board. The inconvenience of forcibly stopping the entire production line including can be prevented beforehand.

  In the above-described embodiment, by identifying the type of electronic component P stored in the tray 20 attached to the tray attachment member 11, the tray 20 is placed on the tray attachment member 11 (tray attachment surface 11a). Although it was designed to prevent mounting errors, it is possible to recognize what type of electronic component P is currently supplied from the tray feeder 5 by identifying the type of electronic component P stored in the tray 20. Then, the mounting operation of the electronic component P based on the recognition may be performed.

Although the embodiment of the present invention has been described so far, the present invention is not limited to the above-described embodiment. For example, in the above-described embodiment, the notch forming portion 20R of the tray 20 is provided in the region on the one side 20L side of the four sides of the tray 20, but the region in which the notch forming portion 20R is provided is as follows. There is no particular limitation. Moreover, the shape of the notch 20h is not limited and may not be semicircular. Moreover, the notch 20h should just have penetrated the tray 20 up and down (thickness direction), and is a concept also including circular, square, etc. through-holes. In the above-described embodiment, the number of identification marks M provided on the tray mounting surface 11a of the tray mounting member 11 is seven (thus, seven notch candidate regions 20a). However, this is only an example. Any number may be used as long as it is plural.

  Further, since it is the tray attachment surface 11a that the camera (the substrate camera 8 in the above-described embodiment) recognizes through the notch 20h of the tray 20, the identification mark M is not an essential requirement. However, if the identification mark M is visually recognized through the notch 20h of the tray 20 mounted on the tray mounting surface 11a, it is possible to more clearly grasp “there is no notch” by image recognition by the camera. Therefore, it is preferable that the identification mark M is provided at a position corresponding to each notch candidate region 20a of the tray 20 mounted on the tray mounting surface 11a as shown in the above-described embodiment.

  Provided are an electronic component mounting apparatus and an electronic component mounting method in which a notch is provided in a tray to identify the contents of the tray, and it is not necessary to adjust the focus of the camera according to the thickness of the tray.

The perspective view of the electronic component mounting apparatus in one embodiment of this invention The perspective view of the tray feeder with which the electronic component mounting apparatus in one embodiment of this invention is provided The block diagram which shows the control system of the electronic component mounting apparatus in one embodiment of this invention BRIEF DESCRIPTION OF THE DRAWINGS (a) Perspective view (b) Plan view of a tray provided in an electronic component mounting apparatus according to an embodiment of the present invention The fragmentary top view of the tray attachment member in one embodiment of this invention (A) (b) The fragmentary top view of the tray attachment member of the state in which the tray in one embodiment of this invention was attached The figure which shows the state which is imaging with the board | substrate camera in one embodiment of this invention (A) Enlarged view of a notch forming portion of a tray in one embodiment of the present invention (b) A view showing an example of an image of a notch forming portion in one embodiment of the present invention

1 Electronic Component Mounting Device 7 Mounting Head 8 Board Camera (Camera)
DESCRIPTION OF SYMBOLS 11 Tray attachment member 11a Tray attachment surface 20 Tray 20R Notch formation part 20h Notch 21 Storage part 30a Identification part (identification means)
30c determination unit (determination means)
30d Alarm operating part (alarm means)
35 Alarm (alarm means)
Fc focus P electronic component PB substrate

Claims (6)

A tray attachment member having a tray attachment surface, and a tray attachment member that is detachably attached to the tray attachment surface of the tray attachment member, and is vertically moved to a position corresponding to the type of electronic component stored in the storage unit and the storage unit. An electronic component mounting apparatus comprising: a tray having a notch forming portion formed with a notch penetrating into the tray; and a mounting head for picking up an electronic component from the tray attached to the tray mounting surface and mounting the electronic component on the substrate. ,
A camera that performs imaging by focusing on the tray mounting surface directly below the notch forming portion of the tray mounted on the tray mounting surface;
The position where the notch is formed in the notch forming portion of the tray is detected based on the image obtained by the imaging of the camera, and the position is stored in the tray based on the detected position of the notch in the notch forming portion. An electronic component mounting apparatus comprising: identification means for identifying the type of electronic component. A determination unit that compares the type of the electronic component identified by the identification unit with predetermined data and determines whether or not the tray attached to the tray attachment surface is a correct tray to be attached to the tray attachment surface; ,
2. The alarm unit according to claim 1, further comprising an alarm unit that issues an alarm when the determination unit determines that the tray attached to the tray attachment surface is not the correct tray to be attached to the tray attachment surface. Electronic component mounting equipment.   3. The electronic component according to claim 1, wherein the camera obtains an image of the tray mounting surface by matching a focal point of the camera with the tray mounting surface in order to detect a position of the notch formed in the tray. Mounting device. A tray with a notch forming part in which a notch penetrating vertically is formed at a position corresponding to the type of electronic part stored in the storing part and the electronic part stored in the storing part is detachable from the tray mounting surface. An electronic component mounting method for picking up an electronic component from a tray attached to a tray mounting surface and mounting the electronic component on a substrate,
A step of performing imaging by focusing the camera on the tray mounting surface directly below the notch forming portion of the tray mounted on the tray mounting surface;
Detecting a position where a notch in the notch forming portion of the tray is formed based on an image obtained by imaging of the camera;
And a step of identifying the type of the electronic component stored in the tray based on the detected position of the notch in the notch forming portion. Comparing the identified electronic component type with predetermined data and determining whether the tray attached to the tray mounting surface is the correct tray to be attached to the tray mounting surface;
5. The electronic component mounting method according to claim 4, wherein an alarm is issued when it is determined that the tray attached to the tray attachment surface is not the correct tray to be attached to the tray attachment surface.   6. The electronic component according to claim 4, wherein an image of the tray mounting surface is obtained by matching a focal point of the camera with the tray mounting surface in order to detect a position of the notch formed in the tray. Implementation method.

Images