JP2012222010A - Pallet type determination system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To automatically determine a type of pallet drawn out from a magazine on which a wafer pallet and a tray pallet are mixedly loaded in a plurality of stages.SOLUTION: A wafer pallet 22 is configured so that a pallet height thereof detected by pallet height detection means becomes a prescribed height. If the pallet height detected by the pallet height detection means differs from the prescribed height, it is determined that: the tray pallet as specified by a production program has been drawn out when the tray pallet is specified by the production program; and an error has occurred when the wafer pallet is specified by the production program. If the pallet height detected by the pallet height detection means equals to the prescribed height, it is determined that the tray pallet as specified by the production program has been drawn out when the tray pallet is specified by the production program and a pallet discrimination part of the tray pallet can be recognized by image recognition by using tray pallet detection means.

Description

  According to the present invention, the type of pallet drawn from a magazine of a component supply apparatus in which a wafer pallet on which a wafer part (die) is placed and a tray pallet on which an electronic part (tray part) is placed are mixedly mounted in a plurality of stages in the magazine. The invention relates to a pallet type determination system for determination.

  In the tray-type component supply device, as described in Patent Document 1 (Japanese Patent Laid-Open No. 2008-288533), the height of the tray pallet inserted into the slot of the magazine (the tray stacking height on the tray pallet). There is a type in which a pallet height detecting means for detecting the pallet height) is mounted, and the number of parts on the tray pallet is managed by the pallet height detected by the pallet height detecting means.

  In recent years, as described in Patent Document 2 (Japanese Patent Laid-Open No. 2010-129949), a tray pallet and a wafer pallet on which wafer parts are placed are mixedly loaded in a multistage manner and designated by a production program. Some pallets are pulled out from a magazine onto a drawing table and the components on the pallet are supplied to a component mounting machine.

JP 2008-288533 A JP 2010-129949 A

  As in the above-mentioned Patent Document 2, in the component supply apparatus in which the wafer pallet and the tray pallet are mixedly loaded, when the operator inserts the pallet into the magazine slot, there is an operation mistake in which the wafer pallet and the tray pallet are mistakenly inserted. As a result, the pallet drawn from the magazine may be different from the pallet specified in the production program. The tray-type component supply device of Patent Document 1 is equipped with pallet height detection means for detecting the pallet height, but the height of the wafer pallet is within the range of fluctuation of the tray pallet height. The wafer pallet and the tray pallet cannot be distinguished only by the pallet height detected by the height detecting means.

  Therefore, even when the pallet height detection means of Patent Document 1 is combined with the component supply apparatus of Patent Document 2, the tray pallet and the wafer pallet cannot be distinguished. For this reason, if the pallet drawn from the magazine is different from the pallet designated by the production program, there is a possibility that the suction nozzle that picks up the parts on the pallet interferes with the pallet and breaks.

  Therefore, the problem to be solved by the present invention is to provide a pallet type determination system that can automatically determine the type of pallet drawn from a magazine in which wafer pallets and tray pallets are mixedly mounted in a plurality of stages.

  In order to solve the above-mentioned problem, according to the first aspect of the present invention, in a magazine of a component supply apparatus, a wafer pallet on which wafer components are placed and a tray pallet on which electronic components are placed are mixedly mounted in a plurality of stages, and the magazine A pallet type determination system for determining a type of a pallet drawn from the magazine, which is applied to the one that pulls out the pallet specified by the production program and supplies the parts on the pallet to the component mounter, A wafer information recording unit for recording or storing wafer information is provided at a predetermined position of the wafer pallet, and a pallet discrimination unit capable of recognizing an image is provided at a predetermined position of the tray pallet, and the heights of the wafer pallet and the tray pallet are set. Pallet height detection means for detecting, and the wafer information of the wafer pallet drawn from the magazine Wafer information reading means for reading the wafer information from the recording section, tray pallet detection means for detecting the tray pallet by recognizing the pallet discrimination section of the tray pallet drawn from the magazine, and the pallet height Based on the height of the pallet detected by the detecting means, the wafer information read by the wafer information reading means, and the presence / absence of the pallet discriminating unit recognized by the tray pallet detecting means, the pallet drawn from the magazine is The apparatus includes a pallet type determination unit that determines whether or not the pallet is specified by the production program. Here, the image recognizable pallet discriminating section provided in the tray pallet may be formed by, for example, coloring (luminance), mark (design, picture), character, symbol, or the like, or a characteristic of the tray pallet. A specific shape portion may be used as the pallet discrimination unit.

  In the present invention, the pallet height detected by the pallet height detecting means, the wafer information read by the wafer information reading means, and the presence / absence of the pallet discriminating unit recognized by the tray pallet detecting means are pulled out from the magazine. It can be determined whether or not the pallet is a pallet designated by the production program, and the type of the pallet drawn from the magazine can be automatically determined.

  In this case, as in claim 2, the pallet type determination means is provided in any of a control device for a component supply device, a control device for a component mounter, or a control device for a component mounting line including the component mounter. May be.

  The wafer information recording unit provided on the wafer pallet may be a bar code, a code such as a two-dimensional code, or an electronic tag that is stored electronically or a magnetic tape that is magnetically recorded. good. The wafer information reading means for reading the wafer information from the wafer information recording unit may be provided with a dedicated reader according to the recording method of the wafer information recording unit, but the cost increases accordingly.

  Therefore, in consideration of the fact that a camera for imaging a wafer part on the wafer pallet is provided as a standard in the component supply apparatus on which the wafer pallet is mounted, a wafer information recording unit provided on the wafer pallet as in claim 3 As described above, the wafer information reading unit uses a code in which a code representing wafer information is recorded on the upper surface, the wafer information reading unit images the code by the camera and recognizes the code, and the tray pallet detection unit It is preferable that the pallet discriminating unit is imaged with a camera so that the pallet discriminating unit recognizes the image. In this way, the camera that captures an image of the wafer part can be used as an image recognition camera for both the wafer information recording unit and the pallet discriminating unit, and the cost reduction requirement can be satisfied.

  Further, the wafer pallet is configured such that the pallet height detected by the pallet height detecting means is a predetermined height, and the pallet type determining means is the pallet detected by the pallet height detecting means. If the height is different from the predetermined height, (1) if a tray pallet is specified in the production program, it is determined that the tray pallet as specified in the production program is pulled out from the magazine, and (2) the production program If a wafer pallet is specified in step, an error may be determined. If the pallet height detected by the pallet height detection means matches the predetermined height, (3) when the tray pallet is designated by the production program, the tray pallet detection means recognizes the image by the pallet discrimination section. If possible, it is determined that the tray pallet as specified in the production program has been pulled out from the magazine. If the tray pallet detection means cannot recognize the image of the pallet determination unit, it is determined that there is an error. (4) If the wafer information can be read from the wafer information recording unit by the wafer information reading unit when specified, it is determined that the wafer pallet as specified in the production program has been drawn from the magazine, and the wafer information reading unit If the wafer information cannot be read from the information recording unit, it is judged as an error. It may be so to. In any case, the component supply device may be stopped when it is determined that an error has occurred. In this way, when the pallet pulled out from the magazine is different from the pallet specified in the production program, the suction nozzle that picks up the parts on the pallet may be damaged due to interference with the pallet. Can be reliably prevented.

FIG. 1 is an external perspective view of a component supply apparatus according to an embodiment of the present invention. FIG. 2 is an enlarged perspective view of the push-up unit portion. FIG. 3 is an external perspective view of a component mounter on which a component supply device is set. FIG. 4 is an external perspective view of the wafer pallet. FIG. 5 is a plan view of the wafer pallet. FIG. 6 is an external perspective view of the tray pallet. FIG. 7 is a flowchart (part 1) showing the flow of processing of the pallet type determination program. FIG. 8 is a flowchart (part 2) showing the flow of processing of the pallet type determination program.

An embodiment embodying a mode for carrying out the present invention will be described with reference to the drawings.
As shown in FIG. 1, the component supply apparatus 11 of this embodiment includes a magazine holding unit 12 (tray tower), a pallet drawer table 13, a pallet drawer mechanism 14, a sub robot 15, a shuttle mechanism 16, a reversing unit 17, and a push-up unit. 18 (see FIG. 2), an NG conveyor 19, a nozzle changer 20, and the like. As shown in FIG. 3, the component supply device 11 is set in a state in which the pallet drawer table 13 is inserted into the feeder setting slot of the component mounter 25.

In a magazine (not shown) housed in a magazine holder 12 of the component supply device 11 so as to be movable up and down, a wafer pallet 22 on which a die 21 (wafer component) is placed and a tray component 42 (electronic component) are placed. The tray pallet 41 (see FIG. 6) can be mixed and mounted in multiple stages. As shown in FIGS. 4 and 5, the wafer pallet 22 includes an expandable dicing sheet 36 on which a wafer (a large number of dies 21) diced in a grid pattern is attached, and a wafer mounting plate having a circular opening. The wafer mounting plate 23 is mounted in an expanded state, and the wafer mounting plate 23 is attached to the pallet body 28 by screwing or the like. The dicing sheet 36 may be expanded by any method. For example, the dicing sheet 36 may be mounted on the wafer mounting plate 23 with the circular ring pushed up from below.
On the other hand, as shown in FIG. 6, on the tray pallet 41, trays 43 containing tray components 42 are stacked in one or more stages.

  The pallet pulling mechanism 14 pulls out one of the wafer pallet 22 and the tray pallet 41 from the magazine in the magazine holding unit 12 onto the pallet pulling table 13 according to a production program (production job). 42 and the die 21 are picked up by a suction nozzle (not shown) of the component mounter 25 (see FIG. 3) (hereinafter referred to as “component mounter pull-out position”) and a drawer position close to the magazine (hereinafter referred to as “sub-robot”). The pallets 22 and 41 can be pulled out at any position (referred to as “drawing position for use”). The component mounting machine drawer position is the position of the front end of the pallet drawer table 13 (the position farthest from the magazine), and the sub robot drawer position is the suction nozzle (not shown) of the sub robot 15 on the wafer pallet 22. This is a position where the die 21 on the dicing sheet 36 can be adsorbed.

  The sub-robot 15 is provided above the pallet pull-out table 13 in the back surface of the magazine holder 12 (the surface on the sub-robot pull-out position side), and is in the XZ direction (the width direction and the vertical direction of the pallet pull-out table 13). Direction). The movement direction of the sub robot 15 is only the X direction, and the relative position of the sub robot 15 in the Y direction (pallet pulling direction) with respect to the wafer pallet 22 is gradually pulled out in the Y direction by the pallet pulling mechanism 14. It is controlled by that. The sub robot 15 is provided with one or a plurality of suction nozzles (not shown) facing downward, so that the suction nozzles can be replaced by the nozzle changer 20 according to the size of the die 21 to be picked up. . The sub robot 15 is provided with a camera 24, and based on a captured image of the camera 24, the position of the die 21 to be picked up or the suction posture of the die 21 can be confirmed.

  The shuttle mechanism 16 receives the component picked up by the suction nozzle of the sub robot 15 by the shuttle nozzle 26 and transfers it to a position where it can be picked up by the suction nozzle of the component mounting machine 25.

  The reversing unit 17 flips the die 21 received from the sub robot 15 upside down as necessary. This is because, depending on the type of the die 21, there is a die (for example, a flip chip) that is attached to the dicing sheet 36 of the wafer pallet 22 upside down.

  The push-up unit 18 (see FIG. 2) is provided on the pallet drawer table 13 and is configured to be movable in the XY direction (the width direction of the pallet drawer table 13 and the direction perpendicular thereto) in the space area below the dicing sheet of the wafer pallet 22. Has been. Even when the wafer pallet 22 is pulled out to any position of the component mounter pulling position and the sub robot pulling position, the sticking portion of the die 21 to be picked up in the dicing sheet 36 is pushed up from below. By pushing up locally at 27, the sticking part of the die 21 is partly peeled off the dicing sheet 36, and the die 21 is lifted up so that it can be easily picked up. In order for the push-up unit 18 to select the push-up pot 27 according to the size of the die 21 or the like, a plurality of types (for example, four types) of push-up pots 27 have a predetermined angular pitch (90 ° pitch in the example of FIG. 2). The push-up pot 27 that is provided radially and is pushed up is rotated to a position where it is directed upward.

  The push-up unit 18 is configured such that the push-up unit 18 as a whole moves up and down using a servo motor (not shown) as a drive source. During the die pick-up operation, when the push-up unit 18 rises and the upper end of the push-up pot 27 comes into contact with the dicing sheet 36 of the wafer pallet 22, the push-up unit 18 stops being raised by a stopper mechanism (not shown) and continues to move up. Then, the push-up pin protrudes upward from the push-up pot 27 so as to push up the sticking portion (the suction point of the suction nozzle) of the die 21 to be sucked out of the dicing sheet 36. In this case, the push-up height of the push-up pin can be adjusted by adjusting the rotation amount of the servo motor serving as the drive source.

  The NG conveyor 19 is a conveyor that discharges defective parts and dies 21 with poor suction. As shown in FIG. 3, the magazine holding unit 12 is provided with a window 31 for confirming from the operator side the state in which the die 21 on the dicing sheet 36 of the wafer pallet 22 is picked up by the suction nozzle of the sub robot 15. When the operator confirms the state in which the die 21 on the wafer pallet 22 is picked up by the suction nozzle of the sub robot 15, the operation in the confirmation mode in which the pallet in the magazine holding unit 12 is retracted below the window 31. It can be selected. Further, in the confirmation mode, the sub robot 15 can be stopped with the suction nozzle of the sub robot 15 picking up the die 21 on the wafer pallet 22.

  The control device 32 of the component supply device 11 configured as described above is configured by a computer including an input device 33 such as a keyboard and a mouse, and peripheral devices such as a display device 34 such as a liquid crystal display, and component mounting according to a production program. The pallet pull-out position and the part pick-up method are selected according to the type of parts to be supplied to the machine 25, and the pallet pull-out mechanism 14, sub robot 15 and shuttle mechanism 16, reversing unit 17, push-up unit are selected according to the selection result. The operation of 18 etc. is controlled as follows.

(1) In the case of the small die 21 In the case of the small die 21, it is difficult to hold the die 21 to the suction nozzle of the sub robot 15 → shuttle nozzle 26 → component mounting machine 25. 22 is pulled out to the component mounting machine drawing position, and the die 21 on the dicing sheet 36 of the wafer pallet 22 is directly picked up by the suction nozzle of the component mounting machine 25.

(2) In the case of the die 21 having a size other than the above In the case of the die 21 having a size that allows the die 21 to be held, the wafer pallet 22 is removed from the magazine in the magazine holding unit 12 for the purpose of shortening the mounting time. The die 21 is pulled out to the sub robot pulling position, and the die 21 on the dicing sheet 36 of the wafer pallet 22 is picked up by the suction nozzle of the sub robot 15, and the die 21 is received by the shuttle nozzle 26 of the shuttle mechanism 16 to be received at a predetermined pickup position. The die 21 is picked up by the suction nozzle of the component mounting machine 25 from the shuttle nozzle 26 of the shuttle mechanism 16 at this pickup position.

(3) In the case of a tray component In the case of a tray component, the tray pallet 41 is pulled out from the magazine in the magazine holding unit 12 to the component mounter drawing position, and the tray component 42 on the tray pallet 41 is moved to the component mounter 25. Pick up directly with suction nozzle.

  By the way, when the die 21 on the dicing sheet 36 of the wafer pallet 22 is picked up and picked up by the suction nozzle, the push-up pot 27 is located in the circular opening of the wafer pallet 22 with the dicing sheet 36 stretched, and the dicing sheet It is necessary to avoid the push-up pot 27 from interfering with the edge of the circular opening of the wafer pallet 22 because it moves in the XY direction along the lower surface of the dicing sheet 36 in a sucked state. .

  Further, there are various sizes of wafers on the dicing sheet 36 of the wafer pallet 22 such as 8 inches, 6 inches, and 4 inches, and even if they are the same size, there is no grip ring inside. Depending on the presence or absence of the grip ring, the diameter of the effective area (circular opening) of the wafer varies. Therefore, it is necessary to set the movable range of the push-up pot 27 in the XY direction according to the size of the wafer on the dicing sheet 36 of the wafer pallet 22 and the presence or absence of the grip ring.

  Therefore, in the present embodiment, the wafer pallet 22 is provided with a wafer information recording unit 35 describing wafer information on the size of the wafer on the dicing sheet 36 and / or the pickup operation range. The wafer information recording unit 35 may be one that records a code such as a bar code or a two-dimensional code, or may be an electronic tag that is stored electronically, a magnetic tape that is magnetically recorded, or the like. The information reading means for reading the wafer information from the wafer information recording unit 35 may be provided with a dedicated reader according to the recording method of the wafer information recording unit 35, but the cost increases accordingly.

  Therefore, in consideration of the fact that the die supply camera 24 is provided as a standard in the component supply device 11, in this embodiment, the wafer information recording unit 35 is a code (bar code, two-dimensional) representing wafer information on the upper surface. Code) is recorded, and a die imaging camera 24 equipped in the component supply apparatus 11 is used as a wafer information reading unit, and the camera 24 images the code of the wafer information recording unit 35. Then, the code of the wafer information recording unit 35 is read by performing image processing with the control device 32 (wafer information reading means) of the component supply device 11. In this way, the camera of the wafer information reading means for reading the wafer information from the wafer information recording unit 35 can be used as the die imaging camera 24, and cost increase can be avoided.

  The control device 32 of the component supply device 11 reads the wafer information from the code of the wafer information recording unit 35 using the die imaging camera 24 before starting the die pickup operation, and moves the push-up pot 27 in the XY directions. Set the possible range automatically. As a result, it is not necessary to perform an operation of inputting information on the movable range in the X and Y directions in which the push-up pot 27 does not interfere with the circular opening edge of the wafer pallet 22, and productivity can be improved.

  In this embodiment, the control device 32 of the component supply device 11 checks the data of the production program using the wafer information read by the camera 24 of the component supply device 11 before production. In this way, when the wafer information read by the camera 24 is different from the production program data, the production program data can be corrected based on the wafer information read by the camera 24 or the production can be stopped. It is possible to prevent the push-up pot 27 from interfering and useless movement.

  On the other hand, since the loading quantity of the tray components 42 on the tray pallet 41 varies depending on the number of trays 43 stacked on the tray pallet 41, the stacking height of the trays 43 of the tray pallet 41 (hereinafter referred to as “pallet height”). Pallet height detecting means for detecting the number of tray parts 42 on the tray pallet 41 is managed based on the pallet height (the number of stacked trays 43) detected by the pallet height detecting means. I am doing so.

  As shown in FIG. 5, the pallet height detecting means of the present embodiment is configured by using, for example, two transmissive optical sensors 44 and 45, and light emitting elements 44a and 45a constituting the optical sensors 44 and 45, respectively. The light receiving elements 44b and 45b are installed at the same height position on the front side and the rear side of the magazine holding unit 12 so that the optical axis is horizontal.

  When detecting the pallet height, the magazine in the magazine holding unit 12 is moved up and down by a feed screw mechanism (not shown), and two light beams are detected by the control device 32 (pallet height detection means) of the component supply device 11. The output signals of the sensors 44 and 45 are monitored, and the optical axis of one of the two optical sensors 44 and 45 is blocked by the detection target (tray pallet 41 or tray 43), and the optical sensors 44 and 45 detect the detection target. The control device 32 counts the output pulses of an encoder (not shown) in the section in the state, and detects the pallet height (the number of stacked trays 43) based on the count value of the output pulses of the encoder.

  When the tray pallet 41 and the wafer pallet 22 are mixedly loaded in the magazine in the magazine holding unit 12, when the pallet height of the tray pallet 41 is detected by the optical sensors 44 and 45, the pallet height of the wafer pallet 22 is similarly set. Detected.

  In this embodiment, the plurality of wafer pallets 22 inserted into the magazine are configured such that the pallet heights detected by the optical sensors 44 and 45 are always the same. More specifically, each wafer pallet 22 is provided with detection members 46 and 47 having the same height that are predetermined in an upward direction at positions that intersect the optical axes of the optical sensors 44 and 45. Since the detected members 46 and 47 fall within the variation range of the stacking height of the trays 43 of the tray pallet 41, the heights of the detected members 46 and 47 are only the pallet height detected by the pallet height detecting means. The tray pallet 41 cannot be distinguished.

  As shown in FIG. 6, a pallet discriminating unit 48 capable of recognizing an image is provided at a predetermined position of the tray pallet 41. The pallet discriminating unit 48 may be formed by, for example, coloring (luminance), a mark (design, picture), a character, a symbol, or the like. 48 may be used. In the following description, an example in which a brightly colored (brightness) sticker is attached as the pallet determination unit 48 will be described. The camera used for image recognition of the pallet discrimination unit 48 may be the die imaging camera 24.

  By the way, when an operator inserts a pallet into a magazine slot, there is a possibility that an operation error occurs in which the wafer pallet 22 and the tray pallet 41 are inserted by mistake. For this reason, the pallet drawn from the magazine onto the pallet drawer table 13 may be different from the pallet specified in the production program, so that the suction nozzle for picking up the parts on the pallet interferes with the pallet and is damaged. There is a possibility that a malfunction will occur.

  As a countermeasure against this, in this embodiment, the control device 32 of the component supply device 11 executes the pallet type determination program shown in FIGS. 7 and 8 so that the pallet drawn from the magazine onto the pallet drawing table 13 becomes the wafer pallet. 22 or tray pallet 41 is discriminated. The outline of the method for determining the pallet type by this program is as follows. When the pallet height t detected by the pallet height detecting means is different from the predetermined height a (the height of the wafer pallet 22), If 41 is specified, it is determined that the tray pallet 41 as specified in the production program is pulled out from the magazine. (2) If the wafer pallet 22 is specified in the production program, it is determined that there is an error.

  When the pallet height t detected by the pallet height detection means matches the predetermined height a (the height of the wafer pallet 22), (3) when the tray pallet 41 is designated by the production program, If the tray pallet detection unit can recognize the image of the pallet determination unit 48, it is determined that the tray pallet 41 as specified in the production program is pulled out from the magazine. If the tray pallet detection unit cannot recognize the image of the pallet determination unit 48, If it is determined that there is an error, and (4) the wafer pallet 22 is specified by the production program, the wafer information can be read from the wafer information recording unit 35 by the wafer information reading means. It is determined that the wafer pallet 22 has been pulled out, and the wafer information is read by the wafer information reading means. If you can not read the wafer information from the recording unit 35 judges that the error. In any case, when it is determined that there is an error, the component supply device 11 is stopped.

  The processing contents of the pallet type determination program shown in FIGS. 7 and 8 executed by the control device 32 will be described below. This program is executed after the operator performs an operation of inserting the wafer pallet 22 or the tray pallet 41 into each slot of the magazine, and plays a role as a pallet type determination means in the claims. At this time, the type of pallet to be inserted into each slot of the magazine is specified by the production program.

  When this program is started, first, in step 101, the height t of each pallet 22, 41 in the magazine is measured by the pallet height detecting means. Thereafter, the process proceeds to step 102, where it is determined whether or not the pallet type designated by the production program is “tray pallet”, and if it is determined that the pallet type designated by the production program is “tray pallet”. In step 103, it is determined whether or not the measured pallet height t coincides with a predetermined height a (the height of the wafer pallet 22).

  If it is determined in step 103 that the measured pallet height t is different from the predetermined height a (the height of the wafer pallet 22), the process proceeds to step 104, where it is determined that the wafer pallet 22 is as specified in the production program. In the next step 105, production is executed.

  On the other hand, if it is determined in step 103 that the measured pallet height t matches the predetermined height a (the height of the wafer pallet 22), the process proceeds to step 106, where the pallet is extracted from the magazine to the pallet drawing table 13. The predetermined part of the palette is picked up by the camera 24. Here, the part imaged by the camera 24 is the part at the same position as the pallet discrimination unit 48 of the tray pallet 41. Therefore, if the pallet to be imaged is the tray pallet 41, the pallet discrimination unit 48 is imaged. If the pallet discrimination unit 48 is the wafer pallet 22, the part without the pallet discrimination unit 48 is imaged.

  Thereafter, the process proceeds to step 107, the captured image is subjected to image processing to determine the brightness of the captured image, and then the process proceeds to step 108, where the pallet determination of the tray palette 41 is performed depending on whether the brightness of the captured image is higher than a threshold value. It is determined whether the image of the unit 48 has been recognized. As a result, if it is determined that the brightness of the captured image is brighter than the threshold value, it is determined that the pallet discriminating unit 48 of the tray pallet 41 has recognized the image, the process proceeds to step 109, and the tray pallet 41 as designated by the production program is obtained. Is determined to be drawn on the pallet drawer table 13, the process proceeds to step 105 to execute production.

  On the other hand, if it is determined in step 108 that the brightness of the captured image is darker than the threshold value, it is determined that the palette determination unit 48 cannot recognize the image (there is no palette determination unit 48), and step 110 is performed. Then, it is determined that the pallet is different from the “tray pallet” designated in the production program (that is, the wafer pallet 22) or the pallet determination unit 48 is missing. Thereafter, the process proceeds to step 111 where it is determined that an error has occurred and the component supply apparatus 11 is stopped.

  On the other hand, if it is determined in step 102 that the pallet type specified in the production program is “wafer pallet”, the process proceeds to step 112 in FIG. 8 and the measured pallet height t is set to a predetermined height a (wafer pallet). It is determined whether or not the height is equal to 22).

  If it is determined in step 112 that the measured pallet height t is different from the predetermined height a (the height of the wafer pallet 22), the process proceeds to step 113 and a pallet different from the “wafer pallet” specified in the production program. (That is, tray pallet 41). Thereafter, the process proceeds to step 114 where it is determined that an error has occurred and the component supply apparatus 11 is stopped.

  On the other hand, if it is determined in step 112 that the measured pallet height t matches the predetermined height a (the height of the wafer pallet 22), the process proceeds to step 115, where the pallet is moved from the magazine to the pallet drawing table 13. The predetermined part of the palette is picked up by the camera 24. Here, the part imaged by the camera 24 is the part at the same position as the wafer information recording unit 35 of the wafer pallet 22. Therefore, if the pallet to be imaged is the wafer pallet 22, the wafer information recording unit 35 is imaged. If the pallet 41 is the tray pallet 41, the portion without the wafer information recording unit 35 is imaged.

  Thereafter, the process proceeds to step 116, and after the captured image is processed, the process proceeds to step 117, where it is determined whether or not the wafer information can be read from the captured image, and if it is determined that the wafer information can be read. In step 118, it is determined that the wafer pallet 22 as specified in the production program is pulled out on the pallet drawing table 13, and the flow advances to step 119 to execute production using the read wafer information.

  On the other hand, if it is determined in step 117 that the wafer information could not be read from the captured image, the process proceeds to step 120 and a pallet (that is, tray pallet 41) different from the “wafer pallet” specified in the production program. It is determined that the wafer information recording unit 35 is missing. Thereafter, the process proceeds to step 121 where it is determined that an error has occurred and the component supply apparatus 11 is stopped.

  According to the present embodiment described above, the combination of the pallet height detected by the pallet height detecting means, the wafer information read by the wafer information reading means, and the presence / absence of the pallet discriminating unit 48 recognized by the tray pallet detecting means. Thus, it is possible to determine whether or not the pallet drawn from the magazine is a pallet designated by the production program, and the component supply device 11 has a function of automatically confirming the type of pallet drawn from the magazine. be able to.

  In the pallet type determination program shown in FIGS. 7 and 8, the height of all pallets 22 and 41 in the magazine is measured by the pallet height detecting means before the production is started. When pulling out on the table 13, the height of the pallet may be measured by the pallet height detecting means.

  In the above embodiment, the function as the pallet type determination unit is mounted on the control device 32 of the component supply device 11. However, the control device of the component mounter 25 or the component mounting line including the component mounter 25 is used. A function as a pallet type determination means may be mounted on the control device.

  In addition, it goes without saying that the present invention can be implemented with various modifications within a range not departing from the gist, such as appropriately changing the configuration of the component supply device 11.

  DESCRIPTION OF SYMBOLS 11 ... Parts supply apparatus, 12 ... Magazine holding part, 13 ... Pallet drawer table, 14 ... Pallet drawer mechanism, 15 ... Sub robot, 16 ... Shuttle mechanism, 17 ... Reversing unit, 18 ... Push-up unit, 19 ... NG conveyor, 20 ... Nozzle changer, 21 ... Die (wafer part), 22 ... Wafer pallet, 23 ... Wafer mounting plate, 24 ... Camera (wafer information reading means, tray pallet detecting means), 25 ... Component mounter, 26 ... Shuttle nozzle, 27 ... Push-up pot, 28 ... Pallet body, 32 ... Control device (pallet height detection means, wafer information reading means, tray pallet detection means, pallet type determination means), 33 ... input device, 34 ... display device, 35 ... wafer information Recording unit 36 ... Dicing sheet 41 ... Tray pallet 42 ... Tray unit (Electronic component), 43 ... tray, 44 ... optical sensor (pallet height detection means), 46, 47 ... detection member, 48 ... pallet determination unit

Claims (4)

A wafer pallet on which wafer parts are placed and a tray pallet on which electronic parts are placed are mixedly mounted in a plurality of stages in a magazine of the parts supply device, and the pallet designated by the production program is pulled out from the magazine and the parts on the pallet A pallet type determination system for determining a type of pallet drawn from the magazine, which is applied to a component mounting machine.
A wafer information recording unit for recording or storing wafer information is provided at a predetermined position of the wafer pallet, and a pallet discrimination unit capable of recognizing an image is provided at a predetermined position of the tray pallet, and the height of the wafer pallet and the tray pallet Pallet height detecting means for detecting the wafer information reading means for reading the wafer information from the wafer information recording unit of the wafer pallet pulled out from the magazine,
Tray pallet detection means for detecting the tray pallet by recognizing an image of the pallet discrimination unit of the tray pallet pulled out from the magazine;
Based on the pallet height detected by the pallet height detecting means, the wafer information read by the wafer information reading means, and the presence / absence of the pallet discriminating unit recognized by the tray pallet detecting means, it is pulled from the magazine. A pallet type determination system, comprising: a pallet type determination unit that determines whether or not a pallet that has exited is a pallet specified by the production program.   The pallet type determination means is provided in a control device of the component supply device, a control device of the component mounter, or a control device of a component mounting line including the component mounter. Item 2. The pallet type determination system according to Item 1. A camera for imaging wafer parts on the wafer pallet;
The wafer information recording unit has a code representing the wafer information recorded on the upper surface thereof,
The wafer information reading means images the code by the camera and recognizes the code as an image,
The pallet type determination system according to claim 1 or 2, wherein the tray pallet detection means captures an image of the pallet determination unit by imaging the pallet determination unit with the camera. The wafer pallet is configured such that the pallet height detected by the pallet height detecting means is a predetermined height,
When the pallet height detected by the pallet height detecting means is different from the predetermined height, (1) if a tray pallet is designated by the production program, the pallet type determining means may read the production program from the magazine. (2) If a wafer pallet is specified in the production program, it is determined that an error has occurred.
When the pallet height detected by the pallet height detection means matches the predetermined height, (3) when the tray pallet is specified by the production program, the tray pallet detection means causes the pallet determination unit to If the image can be recognized, it is determined that the tray pallet as specified in the production program has been pulled out from the magazine. If the tray pallet detection unit cannot recognize the pallet determination unit, an error is determined. If the wafer information is read from the wafer information recording unit by the wafer information reading means when a wafer pallet is specified in the production program, the wafer pallet as specified in the production program is pulled out from the magazine. The wafer information reading means by the wafer information reading means. If you can not read the wafer information from parts, pallet type determination system according to any one of claims 1 to 3, wherein determining that error.

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