JP2007324266A - Electronic component mounting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus which can distinguish an accommodation recess from an electronic component accommodated therein and reliably recognize it. <P>SOLUTION: A substrate recognition camera images a tape accommodation section, and a recognition device performs recognizing operation. In the recognizing operation, the electronic component mounting apparatus performs template matching operation and binarizing operation over the accommodation section, finds edge candidates from a plurality of changed lightness locations at the accommodation section and an electronic component, selects an outer edge from the edge candidates, and recognize the accommodation section. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electronic component mounting apparatus in which a component supply unit that supplies electronic components in a storage tape to a component extraction position is provided, and an electronic nozzle supplied from the component supply unit is extracted by a suction nozzle and mounted on a printed circuit board. .

  In this type of electronic component mounting device, particularly a high-speed gantry-type mounting device, the component supply unit is fixed and does not move, so the storage tapes are connected and replenished during automatic operation.

  However, when the component supply unit is attached to the feeder base after the component supply unit is removed from the feeder base and the storage tapes are connected to each other by the connection tape to cut the electronic component, the connection tape or the component supply unit Due to the removal / attachment, the suction nozzle for taking out the electronic component of the part supply unit is lowered and the take-out position is shifted, so that the component pick-up mistake may occur and the suction rate may deteriorate.

In order to prevent such a decrease in the adsorption rate, an electronic component mounting apparatus that captures an image of the electronic component in the storage recess of the storage tape with a recognition camera and corrects the feed stop position of the storage tape based on the imaging result is For example, disclosed in Patent Document 1 and the like, a technique for simplifying the work has been proposed.
JP 2004-119681 A

  However, when the electronic component in the storage recess of the storage tape is imaged by the recognition camera, it is difficult to reliably recognize the electronic component stored in the storage recess from the peripheral edge (edge) of the storage recess. It becomes even more difficult when the size becomes extremely small.

  For this reason, there is a case where a storage recess having a size larger than the electronic component is recognized instead of an electronic component. Even at this time, the storage recess and the electronic component cannot be reliably distinguished, and the storage recess is reliably recognized. The problem of being unable to occur occurs.

  Accordingly, an object of the present invention is to reliably recognize the storage recess of the storage tape in distinction from the stored electronic component.

  Therefore, according to a first aspect of the present invention, in the electronic component mounting apparatus in which the suction nozzle takes out the electronic component supplied from the component supply unit that supplies the electronic component in the storage tape to the component extraction position and mounts the electronic component on the printed circuit board. A recognition camera that images a storage recess for storing the electronic component of the storage tape processed by the supply unit, the storage recess of the image captured by the recognition camera, the periphery of the storage recess, and the electronic component stored in the storage And a recognition processing device for recognizing the position of the storage recess from the binarized image of the storage recess obtained on the basis of the difference in lightness.

  According to a second aspect of the present invention, in the electronic component mounting apparatus in which the suction nozzle takes out the electronic component supplied from the component supply unit that supplies the electronic component in the storage tape to the component extraction position and mounts the electronic component on the printed circuit board. A recognition camera that images a storage recess for storing the electronic components of the storage tape processed by the image forming apparatus, a template that is created from dimensional data of the storage recess and represents an edge around the storage recess, and an image that is captured by the recognition camera. And a recognition processing device for recognizing the position of the template at the position where the overlap between the edge of the image and the edge of the template is the largest as the position of the storage recess.

  According to a third aspect of the present invention, there is provided an electronic component mounting apparatus in which a suction nozzle extracts an electronic component supplied from a component supply unit that supplies an electronic component in a storage tape to a component extraction position and mounts the electronic component on a printed circuit board. A recognition camera that images a storage recess for storing the electronic component of the storage tape processed by the camera, and a recognition processing device that recognizes and processes an image captured by the recognition camera, the recognition processing device including the storage recess A template that is created from the dimension data and that represents an edge around the storage recess is matched with an image captured by the recognition camera, and a template at a position where the overlap between the edge in the image and the edge of the template is the largest Temporary position recognition means for recognizing the position of the storage recess as a temporary position of the storage recess, and within a predetermined area centered on the temporary position Binarization processing is performed based on a difference in brightness between the storage recess, the periphery of the storage recess, and the electronic component stored in the storage recess, and the storage from the binarized image of the storage recess obtained. It has the position recognition means which recognizes the position of a recessed part, It is characterized by the above-mentioned.

  According to a fourth aspect of the present invention, there is provided the electronic component mounting apparatus in which the suction nozzle takes out the electronic component supplied from the component supply unit that supplies the electronic component in the storage tape to the component extraction position and mounts the electronic component on the printed circuit board. A recognition camera that captures a storage recess for storing the electronic component of the storage tape to be processed, and a recognition processing device that recognizes and processes an image captured by the recognition camera. The image is binarized on the basis of the difference in brightness between the periphery of the storage recess and the electronic component stored in the storage recess, and a temporary image of the storage recess is obtained from the obtained binarized image of the storage recess. Temporary position recognizing means for recognizing a position, change in brightness of an image captured by the recognition camera within an area set based on the temporary position, and the storage recess set in advance Of on the basis of the change in brightness at the edge to determine the position of the edge, characterized in that and a position recognition means recognizes the position of the housing recess on the basis of the position of the determined the edge.

  According to a fifth aspect of the present invention, there is provided an electronic component mounting apparatus in which a suction nozzle takes out an electronic component supplied from a component supply unit that supplies an electronic component in a storage tape to a component extraction position and mounts the electronic component on a printed circuit board. A recognition camera that images a storage recess for storing the electronic component of the storage tape processed by the camera, and a recognition processing device that recognizes and processes an image captured by the recognition camera, the recognition processing device including the storage recess A template that is created from the dimension data and that represents an edge around the storage recess is matched with an image captured by the recognition camera, and a template at a position where the overlap between the edge in the image and the edge of the template is the largest Temporary position recognition means for recognizing the position of the storage recess as a temporary position of the storage recess, and a region set based on the temporary position The position of the edge is determined based on a change in brightness of an image captured by the recognition camera and a change in brightness at a predetermined edge of the storage recess, and the determined position of the edge And a position recognizing means for recognizing the position of the storage recess.

  According to a sixth aspect of the present invention, in the electronic component mounting apparatus in which the suction nozzle takes out the electronic component supplied from the component supply unit that supplies the electronic component in the storage tape to the component extraction position and mounts the electronic component on the printed circuit board. A recognition camera that captures a storage recess for storing the electronic component of the storage tape to be processed, and a recognition processing device that recognizes and processes an image captured by the recognition camera. A binarization process is performed based on a difference in brightness between the periphery of the storage recess and the electronic component stored in the storage recess, and the temporary position of the storage recess is determined from the obtained binarized image of the storage recess. A temporary position recognition means for recognizing and detecting a plurality of edge candidates of the storage recess by a change in brightness of an image captured by the recognition camera in an area set based on the temporary position Among the light / dark change locations in the edge candidate that coincide with a change in brightness at the edge of the storage recess, which is set in advance, a pair of outer edge candidates are determined as opposed edges of the storage recess, and are determined. And position recognition means for recognizing the position of the storage recess based on the position of the edge.

  According to a seventh aspect of the present invention, there is provided an electronic component mounting apparatus in which a suction nozzle extracts an electronic component supplied from a component supply unit that supplies an electronic component in a storage tape to a component extraction position and mounts the electronic component on a printed circuit board. A recognition camera that images a storage recess for storing the electronic component of the storage tape processed by the camera, and a recognition processing device that recognizes and processes an image captured by the recognition camera, the recognition processing device including the storage recess A template that is created from the dimension data and that represents an edge around the storage recess is matched with an image captured by the recognition camera, and a template at a position where the overlap between the edge in the image and the edge of the template is the largest First temporary position recognition means for recognizing the position as the first temporary position of the storage recess, and the temporary position as a center. The binarized image obtained by performing binarization processing based on the difference in brightness between the storage recess in the predetermined area, the periphery of the storage recess, and the electronic components stored in the storage recess. A second temporary position recognition means for recognizing the second temporary position of the storage recess, and a change in brightness of an image captured by the recognition camera in an area set based on the second temporary position. A plurality of edge candidates of the storage recess are detected, and a pair of outer edge candidates are selected from the light-dark change locations at the edge candidate that match a preset change in brightness at the edge of the storage recess. And a position recognizing unit that recognizes the position of the storage recess based on the determined position of the edge.

  According to an eighth aspect of the present invention, there is provided an electronic component mounting apparatus in which a suction nozzle extracts an electronic component supplied from a component supply unit that supplies an electronic component in a storage tape to a component extraction position and mounts the electronic component on a printed circuit board. A recognition camera that images a rectangular storage recess that stores the electronic component of the storage tape to be processed, and a recognition processing device that recognizes and processes an image captured by the recognition camera. A binarization process is performed on the basis of the brightness difference between the recess, the periphery of the storage recess, and the electronic component stored in the storage recess, and a temporary image of the storage recess is obtained from the obtained binarized image of the storage recess. A temporary position recognizing means for recognizing the position, and scanning the region set based on the temporary position in a direction perpendicular to the feeding direction of the storage tape, and the recognition obtained by this scanning A plurality of edge candidates of the storage recess are detected based on a change in brightness in an image captured by the camera, and light and dark change locations at the edge candidates that coincide with a change in brightness at the edge of the storage recess set in advance A pair of outer edge candidates are determined as one opposing edge of the storage recess, and the storage recess, the periphery of the storage recess, and the electronic components stored in the storage recess in the feeding direction of the storage tape A plurality of edge candidates of the storage recess are detected by a change in brightness in an image captured by the recognition camera obtained by the scanning, and a change in brightness at the preset edge of the storage recess is detected. Edge determination means for determining a pair of outer edge candidates as the other opposing edges of the storage recesses among the light / dark change locations in the edge candidates that match Characterized by comprising the position recognition means recognizes the position of the housing recess on the basis of the position of the edge in the position of the other edge.

  According to the present invention, when the storage recess in which the electronic component of the storage tape is stored is imaged by a recognition camera and recognized, the storage recess is reliably distinguished from the electronic component stored therein. Can do.

  Hereinafter, an electronic component mounting apparatus including a component supply apparatus and an electronic component mounting apparatus main body will be described with reference to the accompanying drawings. This electronic component mounting apparatus is a so-called multifunctional chip mounter, and various electronic components can be mounted on the printed circuit board P.

  FIG. 1 is a plan view of an electronic component mounting apparatus. An electronic component mounting apparatus main body 1 includes a machine base 2, a conveyor unit 3 extending in the left-right direction at the center of the machine base 2, and a front of the machine base 2. Two sets of component mounting portions 4 and 4 and two sets of component supply portions 5 and 5 are provided respectively at a portion (lower side in the drawing) and a rear portion (upper side in the drawing). Then, a plurality of component supply units 6 that are electronic component supply devices are detachably incorporated in the component supply unit 5 to constitute an electronic component mounting device.

  The conveyor unit 3 includes a central set table 8, a left supply conveyor 9, and a right discharge conveyor 10. The printed circuit board P is supplied from the supply conveyor 9 to the set table 8, and is set stationary and at a predetermined height in order to receive mounting of electronic components by the set table 8. Then, the printed circuit board P on which the mounting of the electronic components is completed is discharged from the set table 8 to the downstream device via the discharge conveyor 10.

  Each component mounting portion 4 is provided with an XY stage 12 on which a head unit 13 is movably mounted, as well as a component recognition camera 14 and a nozzle stocker 15. The head unit 13 is equipped with two mounting heads 16 and 16 for sucking and mounting electronic components, and one substrate recognition camera 17 for recognizing the position of the printed circuit board P. Normally, the XY stages 12 and 12 of both the component mounting parts 4 and 4 are alternately operated.

  In each XY stage 12, the beam 12A is moved in the Y direction by the Y axis drive motor 12Y, and the head unit 13 is moved in the X direction by the X axis drive motor 12X. As a result, the head unit 13 is moved in the XY direction. It becomes.

  As will be described later, each component supply unit 5 includes a number of component supply units 6 on a feeder base 19 that are detachable side by side. Each component supply unit 6 is provided with a storage tape C (described later) in which a large number of electronic components are stored in respective storage recesses (hereinafter referred to as storage units) Cc at regular intervals, and the storage tape C is intermittently fed. Thus, one electronic component is supplied from the tip of the component supply unit 6 to the component mounting unit 4 one by one.

  The operation based on the mounting data stored in the storage unit of the electronic component mounting apparatus main body 1 is performed by first driving the XY stage 12 so that the head unit 13 faces the component supply unit 6 and then the suction nozzle provided on the mounting head 16. A desired electronic component is picked up (taken out) by lowering 18. Subsequently, after the mounting head 16 is raised, the XY stage 12 is driven to move the electronic component to a position directly above the component recognition camera 14 to recognize the suction posture and the positional deviation with respect to the suction nozzle 18. Next, after the mounting head 16 is moved to the position of the board P on the set table 8 and the position of the board P is recognized by the board recognition camera 17, based on the recognition results by the component recognition camera 14 and the board recognition camera 17. The X-axis drive motor 12X, the Y-axis motor 12Y of the XY stage 12 and the θ-axis drive motor 18A of the suction nozzle 18 are corrected and moved to mount electronic components on the printed circuit board P.

  Next, the component supply unit 6 will be described with reference to FIGS. The component supply unit 6 includes a unit frame 21, a storage tape reel (not shown) that is rotatably mounted on the unit frame 21, and a storage tape C that is sequentially wound in a state of being wound around the storage tape reel. The tape feeding mechanism (tape feeding device) 22 intermittently feeds to the pickup position (suction take-out position), and a cover tape peeling mechanism 20 to be described later for peeling the cover tape Ca of the storage tape C before the pickup position. The

  The storage tape C fed out from the storage tape reel is fed to the pickup position so as to dive under the suppressor 23 disposed in the tape path before the pickup position. The suppressor 23 has an opening for pickup. A slit is formed in the suppressor 23, and the cover tape Ca of the storage tape C is peeled off from the slit and stored in the storage unit 26. That is, the electronic component mounted on the storage tape C is sent to the pickup opening in a state where the cover tape Ca is peeled off, and is picked up by the suction nozzle 18.

  Next, the tape feeding mechanism 22 will be described with reference to FIG. The tape feeding mechanism 22 includes a servomotor 28 that is a drive source capable of forward and reverse rotation having a gear 27 on its output shaft, and a gear 30 in which a timing belt 29 is stretched between the gear 27 at one end. A feed shaft formed on the storage tape C and having a rotating shaft 33 rotatably supported by a support 31 via a bearing 32 and a worm wheel 35 meshing with a worm gear 34 provided at an intermediate portion of the rotating shaft 33. The sprocket 36 is configured to mesh with the hole Cb and send it. The worm wheel 35 and the support shaft 37 of the sprocket 36 pass through the intermediate partition of the unit frame 21.

  Therefore, when the servo motor 28 is driven to rotate in order to supply the electronic components in the storage tape C by the component supply unit 6, the gear 27 and the gear 30 rotate via the timing belt 29, thereby rotating the rotating shaft. Only 33 is rotated, and the sprocket 36 is intermittently rotated by a predetermined angle in the feed direction via the worm gear 34 and the worm wheel 35, whereby the storage tape C is intermittently fed via the feed hole Cb.

  Next, the cover tape peeling mechanism 20 will be described. The cover tape peeling mechanism 20 includes a drive motor 42 provided with a worm gear 41 on its output shaft, a gear 45 surrounding the gear 45 and a gear 43 that meshes with the gear 41, and a support shaft fixed to a support body 44 fixed to the unit frame 21. A first rotating body 46 rotatably supported through 46A, and a support body that includes a gear 47 that meshes with the contact portion 51 and the gear 45 around the first rotating body 46, and is fixed to the unit frame 21 via the mounting body 48. The unit frame 21 is provided with a second rotating body 50 rotatably supported by a support shaft 49A on a support shaft 49 and an abutting portion 52 that is urged by and abutted by the abutting portion 51 and a spring 55 around the second rotating body 50. A third rotating body 56 rotatably supported via a support shaft 56A by a mounting body 54 that can swing via the support shaft 53, a roller 57 that guides the cover tape Ca, and a unit frame 21 is provided with a roller 60 for guiding the cover tape Ca guided by the roller 57 at the end of a mounting body 59 that can swing through a support shaft 58 and is urged by a spring 61 to be tensioned to the cover tape Ca. It is comprised from the tension application body 62 for adding. Reference numeral 63 denotes a stopper for restricting the swing of the mounting body 59.

  Therefore, when the cover tape Ca is peeled off, when the drive motor 42 is driven, the first rotating body 46 rotates via the gear 41 and the gear 43, and when the first rotating body 46 rotates, the gear 45 is rotated. And the second rotating body 50 rotates via the gear 47, and when the second rotating body 50 rotates, the contact portion 52 and the contact portion 51 urged by the spring 55 sandwich the cover tape Ca. In this state, the third rotating body 56 rotates, and the cover tape Ca of the storage tape C is peeled off by one pitch from the slit of the suppressor 23, and is provided at the end of the component supply unit 6 without being loosened. Stored in the storage unit 26.

  The suppressor 23 has a substantially L-shaped cross section from a vertical piece serving as a support portion and a horizontal piece that holds the storage tape C engaged with the teeth of the sprocket 36 so that the feed hole Cb is not removed. 21, a vertical piece is supported on the inside so as to be rotatable about a support shaft at the rear end portion, and a locking body (not shown) urged by a spring in a locking direction to the front end portion of the horizontal piece. ) Is provided with a vertical locking piece having a locking hole that can be locked.

  In addition, in a state where the suppressor 23 serving as a peeling fulcrum of the cover tape Ca of the storage tape C is rotated upward, the loading that communicates with the tape passage 64 formed in the unit frame 21 from the side of the component supply unit 6. The storage tape C can be loaded into the component supply unit 6 through the opening 65 for use. Reference numeral 66 denotes a prevention member for preventing the storage tape C loaded in the component supply unit 6 from being detached from the loading opening 65, and is provided in the vicinity of the rear end portion of the horizontal passage of the tape passage 64, in the middle portion, or in an oblique passage. In the vicinity of the upper end portion of the tube or at the boundary between the horizontal passage and the oblique passage (see FIG. 2).

  Reference numeral 68 denotes a label attached to the rear surface of the handle 77 of the component supply unit 6, and a bar code indicating the serial number of the component supply unit 6 is written on the label 68. Accordingly, the barcode can be read by a barcode scanner (not shown) even when the plurality of component supply units 6 are attached to the electronic component mounting apparatus main body 1 in close proximity to each other.

  Next, a large number of component supply units 6 are detachably arranged in parallel on the feeder base 19, and the configuration thereof will be described. First, as shown in FIGS. 1, 4, and 5, a pair of guide members 70 having parallel side surfaces 70 </ b> A for guiding each component supply unit 6 are provided on the upper surface of the feeder base 19 via a plurality of mounting pins 101. Provided on the bottom surface of the component supply unit 6 is a guided member 71 having a U-shaped cross section in which a concave portion 71A is formed on each outer surface to which the pair of guide members 70 are fitted and guided. Yes. Further, the front side end portions of the pair of guide members 70 are inclined upward, and opposite side surfaces 70B are formed so that the distance between them becomes farther toward the front.

  A pair of guide members 70 are provided corresponding to the component supply unit 6. However, since a plurality of component supply units 6 are arranged side by side, the guide member 70 is a guide member 70 of the adjacent component supply unit 6. Also used as

  Then, when the guided member 71 is guided by the pair of guide members 70 and moved to attach the component supply unit 6 while sliding the guided member 71 on the feeder base 19. A front-rear restricting member 72 is provided at the end of the feeder base 19 on the depth side to restrict the position of the component supply unit 6 in the front-rear direction by contacting the guided member 71.

  Further, on the feeder base 19 between the side surfaces 70A of the front portion of the guide member 70, a cylindrical shape that fits in the restriction groove 71B of the guided member 71 and restricts the position of the component supply unit 6 in the left-right direction. Rear left and right restricting pins 73 are provided. Further, a cylindrical front left / right restriction pin 74 that fits in a restriction groove 71B of the guided member 71 in the vicinity of the front / rear restriction member 72 where the guide member 70 is not provided and restricts the position in the left / right direction. Is formed.

  However, the regulation groove 71B of the guided member 71 is engaged with the front left / right regulation pin 74 having a larger diameter than the rear left / right regulation pin 73 and regulates the position of the component supply unit 6 in the left / right direction. When the component supply unit 6 is mounted and fixed on the feeder base 19, the width of the restriction groove 71 </ b> B is restricted in order to restrict the position in the left-right direction. It is formed substantially the same as the diameter of the pin 74, and is formed substantially the same as the diameter of the rear left / right regulating pin 73 at a position where the rear left / right regulating pin 73 is fitted.

  Further, a handle 77 is formed at the rear part of the component supply unit 6, and a lock release lever 79 that is rotatable about the support shaft 78 is provided. The lock release member 81 provided with the abutting portion 81A and rotatably supported with the support shaft 80 as a fulcrum, and the lock release lever 79 are connected to the connection plate 84 rotatably supported by the support shafts 82 and 83. Are connected through. The lock release member 81 is urged to rotate counterclockwise by a spring 85, but counterclockwise rotation is restricted by a restriction pin 86.

  A coil spring 90 is stretched between the attachment member 87 of the feeder base 19 and a locking member 89 that can be rotated with the support shaft 88 as a fulcrum, and is locked with the first lock member 92 provided in the component supply unit 6. A locking member 89 having a possible first locking portion 89A is urged to rotate clockwise. The first lock member 92 includes a roller 92A and a support member 92B on which the roller 92A is provided. A release device that releases the lock between the first lock portion 89A of the lock member 89 and the roller 92A of the first lock member 92 is configured from the lock release lever 79, the lock release member 81, the connecting plate 84, and the like. Is done.

  When the component supply unit 6 is attached to the feeder base 19, the operator holds the handle 77 and moves the component supply unit 6 in the depth direction while the guided member 71 is guided by the guide member 70. While the roller 92A is in contact with the guide portion 89C of the locking member 89 provided in the electronic component mounting apparatus main body 1, the roller 92A is rotated counterclockwise while the roller 92A is rotated in the first locking portion 89A. Will be locked.

  Reference numeral 93 denotes a lock cylinder that constitutes an operating member provided in the electronic component mounting apparatus main body 1. One end of a second lock member 95 that can be rotated about a support shaft 94 is biased by a spring 96 to the rod 93 </ b> A. Has been pressed. When the lock cylinder 93 is actuated and the rod 93A is extended, the second lock member 95 provided in the electronic component mounting apparatus body 1 is rotated counterclockwise, and the other end of the second lock member 95 is rotated. The lock lever 95 </ b> A is in contact with the second locking portion 89 </ b> B of the locking member 89 and restricts the rotation of the locking member 89 in the counterclockwise direction.

  The locking member 89 is provided corresponding to each component supply unit 6, but the locking cylinder 93 and the second lock member 95 are provided corresponding to a plurality of component supply units 6. Therefore, the lock lever 95 </ b> A extends in the direction in which the component supply units 6 are arranged.

  6 and 7, reference numeral 102 denotes a seam detection device for the storage tape C, which is provided on the attachment member 103 attached to the rear end portion of the component supply unit 6. The seam detection device 102 is a device main body 104 in which the light emitting element 102A and the light receiving element 102B are provided at a distance of 8 millimeters, a prism 105 is provided at the upper end, and the cross section has a U-shaped cross section. The section is composed of a passage forming body 107 provided with a tape passage opening 106 so that the storage tape C can pass therethrough.

  That is, as the storage tape C is fed, in the case of the seamless storage tape C, the light from the light emitting element 102A is recursively reflected by the prism 105 via the feed holes (opened at intervals of 4 millimeters) Cb. Since the light is received by the light receiving element 102B, the joint detection device 102 can detect the absence of a joint, and in the case of the storage tape C having a joint, the light from the light emitting element 102A covers the feed hole Cb in accordance with the feeding operation. And is not received by the light receiving element 102B, and the presence of a seam is detected (see FIGS. 8 and 9).

  The connecting tape 108A is for connecting the old storage tape C and the new storage tape C whose number of electronic components is reduced together with the connection tapes 108B and 108C.

  Next, a control block diagram of the electronic component mounting apparatus shown in FIG. 10 will be described. 110 is a CPU as a control unit that performs overall control of operations related to electronic component mounting of the electronic component mounting apparatus, 111 is a RAM (random access memory) as a storage device, and 112 is a ROM (read-only memory). ).

  The RAM 111 is mounted for each type of printed circuit board P such as X direction, Y direction and angle information in the printed circuit board P, and arrangement number information of each component supply unit 6 for each mounting order (for each step number). Data is stored, and component placement information, which is information on the type (component ID) of each electronic component corresponding to the placement number (lane number) of each component supply unit 6, and the storage portion Cc in the storage tape C Size data (lengths of vertical and horizontal edges) are stored. Furthermore, component library data composed of items representing the characteristics of the electronic component for each component ID is also stored.

  Based on the data stored in the RAM 111, the CPU 110 controls the operation related to the component mounting operation of the electronic component mounting apparatus according to the program stored in the ROM 112. That is, the CPU 110 rotates the X-axis drive motor 12X through the drive circuit 113, drives the Y-axis drive motor 12Y through the drive circuit 114, and rotates the suction nozzle 18 by θ through the drive circuit 115. The driving of the θ-axis motor 18A is controlled, and the driving of the vertical-axis motor 16A for moving the mounting head 16 up and down is further controlled via the drive circuit 116.

  A recognition processing device 117 is connected to the CPU 110 via the interface 118, and includes a CPU 117A that executes recognition processing, a RAM 117B that stores data for recognition processing, and a ROM (not shown) that stores a program for recognition processing. ing. The recognition processing device 117 performs recognition processing of an image captured by the component recognition camera 14 or the board recognition camera 17 and sends the processing result to the CPU 110. That is, the CPU 110 outputs an instruction to the recognition processing device 117 so as to perform recognition processing (calculation of misalignment amount, etc.) on the image captured by the component recognition camera 14 or the board recognition camera 17 and recognizes the recognition processing result. It is received from the device 117.

  That is, when the amount of positional deviation is grasped by the recognition processing of the recognition processing device 117, the result is sent to the CPU 110, and the CPU 110 detects the X axis drive motor 12X, the Y axis motor 12Y and the suction nozzle 18 of the XY stage 12. The θ-axis motor 18A is corrected and moved so that the electronic component is mounted on the printed circuit board P.

  The monitor 119A as a display device is provided with various touch panel switches 119B as input means for data setting. The operator can perform various settings by operating the touch panel switch 119B. Stored in 109A is a counter provided for each component supply unit 6, and counts the number of times the storage tape C is fed (the number of feed commands by the CPU 110) after the joint detection device 102 detects the connecting tape 108A. It should be noted that when the seam detection device 102 detects the seam, the number of times of feeding until the electronic component at the seam reaches the suction / extraction position of the electronic part is required N times. A counter 109B is provided for each component supply unit 6 and counts the number of suction mistakes. The presence or absence of electronic components sucked and held by the suction nozzle 18 is detected by the line sensor 109C provided on the mounting head 16 or by component recognition processing. Then, the number of consecutive absence states or poor adsorption states is counted. Although the counters 109A and 109B are provided for each component supply unit 6, only one is shown in FIG. 10 for convenience.

  A connector 130 is connected to the CPU 110 via an interface 118, and includes an electronic component mounting device side connector 130A and a component supply unit side connector 130B that can be attached to and detached from the electronic component mounting device side connector 130B. The servo motor 28 and the drive motor 42 are connected via 131. The connector 130, the drive circuit 131, the servo motor 28, and the drive motor 42 are provided for each component supply unit 6, but only one is shown in FIG. 10 for convenience.

  Next, electronic component suction and mounting operations will be described. First, the CPU 110 sends a command to the component supply unit 6 that supplies the electronic component having the first step number in the mounting order of the mounting data (data on which position on the printed circuit board, in which direction and which electronic component is mounted). The CPU 110 drives the servo motor 28 and the drive motor 42 of the component supply unit 6 to perform the component feeding operation and the cover tape Ca peeling operation.

  In this way, the electronic component 145 in the storage portion Cc is supplied to the suction / extraction position by the feeding operation of the storage tape C.

  Thereafter, the CPU 110 determines whether the component supply unit 6 has been inserted or removed from the feeder base 19 regardless of the reason.

  That is, when an operator first operates an operation unit (not shown) of the electronic component mounting apparatus, the CPU 110 operates the lock cylinder 93 to pull in the rod 93A, and the second lock member 95 is used as the fulcrum 94 as a fulcrum. The lock lever 95A at the other end of the second lock member 95 is separated from the second lock portion 89B of the lock member 89, and the lock member 89 is rotated counterclockwise. Ready for Therefore, for example, when the operator puts the thumb on the rotatable unlocking lever 79 and puts another finger in the handle 77 and pulls the thumb, the unlocking lever 79 rotates clockwise with the support shaft 78 as a fulcrum. Then, the unlocking member 81 rotates clockwise, and the contact portion 81A pushes up the guide portion 89C of the locking member 89 against the urging force of the coil spring 90, and rotates the locking member 89 counterclockwise. Since the roller 92A is released from the first locking portion 89A (the locking is released), the operator pulls the component supply unit 6 in the forward direction with the handle 77, so that the guide member 70 is covered. The guide member 71 can move forward while being guided, and the component supply unit 6 can be removed from the feeder base 19. Then, the operator can attach the component supply unit 6 to the feeder base 19 by holding the handle 77 and moving the component supply unit 6 in the depth direction while the guided member 71 is guided by the guide member 70.

  At this time, when removing the component supply unit 6 from the feeder base 19, the electronic component mounting device side connector 130A and the component supply unit side connector 130B are disconnected, and when mounting the component supply unit 6 to the feeder base 19, the electronic component mounting is performed. The device-side connector 130A and the component supply unit-side connector 130B need to be coupled. However, since the CPU 110 constantly monitors the component supply unit 6, depending on the state of signals input from the component supply unit 6 via the interface 118 The CPU 110 can determine whether the component supply unit 6 has been inserted or removed from the feeder base 19.

  Therefore, when it is determined whether the component has been inserted or removed, the substrate recognition camera 14 is moved by storing the X-axis drive motor 12X and the Y-axis drive motor 12Y to the suction extraction position (component extraction position) of the component supply unit 6 that has been inserted or removed. The storage unit Cc of the tape C is imaged, and the recognition processing device 117 performs recognition processing.

  When this recognition process is performed, the size data (dimension data) of the storage unit Cc that is rectangular in plan view, that is, the size of the four sides of the periphery of the storage unit Cc, and the interval between the two opposing sides are stored in the RAM 117B. Then, the distance between the sides of the storage unit Cc subjected to the recognition processing, the interval between the peripheral edge of the storage unit Cc and the electronic component stored in the storage unit Cc, and the edge of the electronic component are stored in the RAM 117B. The size of the storage portion Cc is compared, and the periphery of the storage portion Cc is distinguished from the outer edge of the electronic component based on the result.

  Hereinafter, a method for determining the four sides that are the periphery of the storage unit Cc will be described based on the flowchart of the method A among the recognition flowcharts of the methods A to C shown in FIG. In the RAM 117B, the horizontal and vertical dimensions (for example, 0.6 mm and 0.3 mm) of the electronic component and the horizontal and vertical dimensions (for example, 0.7 mm and 0.4 mm) of the storage unit Cc are stored in advance. Is remembered.

  When the board recognition camera 14 images the storage portion Cc of the storage tape C, an imaging result as shown in FIG. 12 is obtained. Then, the CPU 117A in the recognition processing device 117 operates as first temporary position recognition means (temporary position recognition means) based on the imaging result, and executes recognition processing. At this time, matching between the obtained real image 135 in the recognition area 134 and the template T (see FIG. 13) of the storage unit obtained from the size data of the storage unit Cc stored in the RAM 111 is confirmed. More specifically, the edge of the real image (the peripheral edge of the storage unit) 136, the edge (the peripheral edge of the electronic component) 137, and the like, and the overlapping state of the rectangular template T, that is, the edge 138 representing the peripheral edge of the storage unit, that is, the edge 136 In addition, confirmation of the degree of coincidence between each of the edges 137 and the edge 138 (template T) (edge template matching as rough detection, and method A (1) in the recognition flowchart of FIG. 11) is performed within the recognition region. . In this matching, as shown in FIG. 14, the edge overlap was the largest, that is, the position of the edge 138 having the highest matching degree among the matching degrees with the edge 136 and the edge 137, that is, at this time The center position 139 of the edge 138 is recognized as the center position of the temporary storage unit Cc and stored in the RAM 111.

  As described above, the coordinates of the center position 139 recognized by the template matching of the edge are regarded as the coordinates of the position of the storage section Cc, and the center position can be easily determined as the position of the storage section Cc. Then, based on the coordinates of the center position, the CPU 110 corrects the suction position of the suction nozzle 18, that is, calculates a correction value of the position of the storage portion Cc, stores this correction value in the RAM 111, and considers this correction value. Then, after the X-axis drive motor 12X and the Y-axis drive motor 12Y are driven and then the vertical axis drive motor 16A is driven, the suction nozzle 18 descends and the electronic component is more reliably taken out. Can do.

  FIG. 15 shows a state of coincidence between the edge 136 of the storage portion Cc represented by a thick black line and the edge 138 indicated by a white dotted line of the template. FIG. 15 shows the edge 136 of the storage portion Cc and the template. The edge 138 of FIG.

  Next, the CPU 117A operates as second temporary position recognition means (temporary position recognition means), and performs binarization processing as rough detection based on the actual image (method A (2) in the recognition flowchart of FIG. 11). )I do.

  In the binarization process, the edge position of the edge 138 determined by the above-described edge matching (temporary center position) 139 is an area having a size equal to, for example, the aspect ratio of the template edge size stored in advance in the RAM 117B. The gradation value and frequency (number of pixels) in the specific area 144 indicated by a broken line in the recognition area 143 in FIG. 16 including the edge 136 of the storage section Cc centering on the center and the periphery (background) of the storage section Cc. The real image is binarized based on the histogram shown in FIG. At this time, as shown in FIG. 17, based on the gradation value, the position of the valley between the two peaks of the gradation value serves as the threshold 150 for classifying the actual image into the recognition target (container) and the background. It is determined and stored in the RAM 117B.

  The right image in FIG. 18 represents an image image obtained by binarizing the actual image 143A including the edge 136 in the recognition area 143 shown on the left based on the histogram. The actual image is recognized as the background 140. It is separated into a target 141 (including a hatched storage portion 142S and an electronic component mold portion 142M, and an electronic component electrode 142 not hatched) 141.

  As described above, the CPU 117 </ b> A is based on the histogram in the specific area 144 centered on the edge center position 139 determined by edge matching and including the storage portion Cc and the periphery (background) of the storage portion Cc. Since the binarization process is performed, for example, when the binarization process is performed, for example, when the connecting sheet of the seam of the storage tape is imaged together with the storage unit Cc at a location apart from the storage unit Cc. And it can avoid making a connection sheet | seat into the object of a binarization process accidentally, and can improve the precision of a binarization treatment.

  Further, the CPU 117A can obtain the center position, which is an approximate position of the storage unit Cc, from the positions of the four corners of the image of the storage unit Cc in FIG. 18 that is the result of binarizing the actual image. The center position of the storage portion Cc can be recognized and determined. Further, since the approximate position of the storage portion Cc is obtained from the positions of the four corners of the image image of the storage portion Cc, the edges of the electrodes of the electronic component recognized as white are almost the same as the periphery of the storage portion Cc. Even when it is in contact with the edge, the positions of at least three corners can be determined, and the center position, which is the approximate position of the storage portion Cc, can be obtained from the positions of these corners.

  The CPU 117A does not operate as the second temporary position recognizing unit as described above, but operates as the position recognizing unit. The CPU 110A is based on the coordinates of the position of the storage unit Cc that is the recognized center position. Corrects the suction position of the suction nozzle 18, that is, calculates a correction value of the position of the storage portion Cc, stores this correction value in the RAM 111, and drives the X-axis drive motor 12X and Y-axis in consideration of this correction value. When the vertical axis drive motor 16A is driven after the motor 12Y is driven, the suction nozzle 18 can more reliably perform the suction and extraction of the electronic components.

  The CPU 117A obtains the approximate center position of the storage unit Cc from the result of binarizing the actual image and determines the edge of the storage unit Cc. Based on this result, the CPU 110 determines the approximate size of the storage unit Cc, etc. Get the information.

  In addition, when the template matching described above is performed, when the edge 138 of the template overlaps at the boundary between the electrode and the mold instead of the storage portion Cc, the boundary is not the edge of the storage portion Cc but the boundary is overlapped. Since the center position is obtained from the edge 138 in the above state, the obtained center position may be largely deviated from the actual center position of the storage portion Cc. Even when such a deviation occurs, the CPU 117A compares with the center position of the storage unit Cc obtained from the binarization processing result, and both are shifted, and the binarization is performed with the edge that has been subjected to template matching. If the edge obtained by the process is not greatly deviated, the center position and edge obtained by the binarization process are determined as the center position and edge of the storage unit Cc. For this reason, even when the center position obtained by template matching largely deviates from the actual center position, the center position obtained by the binarization process is used as the center position of the storage unit Cc obtained by the recognition process. The deviation of the center position from the actual center position can be minimized. Then, the determined center position and size are stored in the RAM 111.

  Next, the CPU 117A performs edge candidate detection ((3) of method A in the recognition flowchart of FIG. 11) at both the left and right ends of the storage unit Cc. This edge candidate detection will be described with reference to the bottom surface of the image pickup in FIG. In FIG. 19, the electrode 142 of the electronic component is hatched so that other portions can be easily distinguished.

  That is, a specific position (for example, the center position) of search areas 201 and 202 for searching for an edge to be positioned with respect to the position of the edge based on the determined size of the storage unit Cc and search The size of the area is set in advance and stored in the RAM 117B, and the size (edge position) of the storage unit Cc obtained by the template matching or binarization processing, or the template matching and binarization processing, which is the above-described rough detection. Based on the data, the positions of the search areas (shown by dotted lines in FIG. 19) 201 and 202 for searching for the edges stored in the RAM 117B are determined.

  In determining the position, a specific position (for example, the center position) of the search areas 201 and 202 for searching for an edge to be positioned based on the center position of the storage unit Cc is set and stored in the RAM 117B. Based on the center position of the storage unit Cc obtained by template matching or binarization processing, or template matching and binarization processing, the coordinates of a specific position of the search region are determined, and the search region 201, The position on the image 202 may be determined.

  Further, a search area (indicated by a dotted line in FIG. 19) 201 for searching for an edge stored in the RAM 117B based on the size (edge position) data of the storage unit Cc obtained by the template matching and binarization processing. By determining the position on the image 202, the accuracy of the determined position can be further increased, and the size (edge position) data of the storage unit Cc obtained by template matching or binarization processing can be obtained. Based on this, the positions of the search areas (indicated by dotted lines in FIG. 19) for searching for the edges stored in the RAM 117B 201 and 202 are fixed on the image, thereby simplifying the position determination operation, and processing by the CPU 117A Can be simplified.

  Then, edge candidates of the storage unit Cc in the search areas 201 and 202 are detected.

  When detecting an edge candidate, the position of the storage unit Cc, which is a preset position stored in the RAM 117B as data, for example, in a direction orthogonal to the tape feeding direction indicated by the arrow A in FIG. In FIG. 19, scanning is performed from the left to the right so as to pass through the center position (there may be a deviation from the center of the imaged storage unit Cc), and the change in brightness is detected. At this time, the CPU 117A first starts from a portion where the lightness of the surface around the storage portion Cc on the storage tape C is high (for example, a bright portion imaged white) to a portion where the lightness of the storage portion Cc is low (the left edge of the storage portion Cc and the electronic component). The intersection circle 1 between the leftmost line 151 and the scanning line in FIG. 19 is detected as a brightness change point to the left edge of 145, for example, a dark portion such as gray. Next, the CPU 117A changes the lightness from the storage portion Cc on the right line 152 of the line 151 to the surface of the electrode (shaded portion) 142 on the side of the electronic component 145 (for example, a bright portion imaged whitish). As a location, an intersection point 2 between the line 152 and the scanning line is detected. Similarly, the CPU 117A scans the line 153 and the scanning line as a brightness change point on the center surface 147 (for example, a dark part imaged in gray) corresponding to the mold part 142M of the electronic component 145 on the line 153 on the right of the line 152. And the intersection point 3 is detected.

  Next, the CPU 117A changes the brightness from the storage portion Cc on the right line 154 of the line 153 to the surface (for example, a bright portion imaged whitishly) of the electrode (shaded portion) 142 on the right side of the electronic component 145. The intersection point 4 between the line 154 and the scanning line is detected as a location. Further, the CPU 117A detects the intersection 5 of the line 155 and the scanning line as a brightness change point on the central surface 147 (for example, a dark part imaged in gray) of the electronic component 145 on the line 155 on the right of the line 154. To do. Next, the CPU 117A detects the intersection 6 of the line 156 and the scanning line as a brightness change point from the storage portion Cc on the right line 156 of the line 155 to the high brightness portion on the surface of the storage tape around it. .

  FIG. 20 is a diagram showing the brightness change at the brightness change location detected as described above. Next, the CPU 117A is in a direction orthogonal to the tape feeding direction in the storage unit Cc stored in advance in the RAM 117B. The brightness change data is compared with the brightness change at each intersection detected as described above.

  That is, the CPU 117A detects brightness change (bright → dark) at the leftmost intersection point 1 and brightness change data at the left end in the X direction in the storage portion Cc stored in the RAM 117B (in the left search area 201). (Brightness change data) (bright → dark) and the two match, the detected intersection point 1 is determined as a candidate for the left edge of the X direction of the storage unit Cc, and the line 151 is stored. It determines with the 1st candidate A of the left edge of the part Cc. Similarly, the CPU 117A detects the brightness change detected at the intersection point 2, the intersection point 3, the intersection point 4, the intersection point 5, and the intersection point 6, and the X direction in the storage portion Cc stored in the RAM 117B. Are sequentially compared with the brightness change data at the left end and the right end. That is, at intersection point 2, the change in brightness is dark → light, whereas the brightness change data at the left end stored in the RAM 117B is bright → dark, and the change in brightness does not match. As described above, when the change in brightness does not match, the CPU 117A does not determine the intersection point 2 as a candidate for the left edge of the X direction of the storage unit Cc, and determines that the line 152 is a candidate for the left edge of the storage unit Cc. do not do. Next, the CPU 117A compares light → dark which is a change in brightness at the intersection 3 and light → dark which is data of a change in brightness at the left end stored in the RAM 117B. Therefore, the intersection circle 3 is determined as a candidate for the left edge of the X direction of the storage portion Cc, and the line 153 is determined as the second candidate B for the left edge of the storage portion Cc.

  Next, in the right search area 202, the CPU 117 </ b> A has data on the change in brightness at the intersections 4, 5, and 6 and the change in brightness at the right end stored in the RAM 117 </ b> B (the brightness in the search area 202 on the right side). Change data) is compared with dark → light. First, since the change in brightness at the intersection 4 is dark → bright and the change in brightness at the right end stored in the RAM 117B is dark → bright, the change in the brightness of both coincides. The detected intersection point 4 is determined as a candidate for an edge at the right end of the storage unit Cc in the X direction, and the line 154 is determined as a first candidate a for the right edge of the storage unit Cc.

  At intersection point 5 on the right of intersection point 4, the change in lightness is light → dark, whereas the lightness change data stored in the RAM 117 </ b> B is dark → light, and the lightness change state matches. Therefore, the CPU 117A does not determine the intersection point 5 as a candidate for an edge at the right end in the X direction of the storage portion Cc, and does not determine the line 155 as a candidate for the right edge of the storage portion Cc. Next, the CPU 117A compares darkness → lightness, which is a change in lightness at the intersection 6 on the right side, and dark → light, which is data on the change in lightness at the right end stored in the RAM 117B. Since the changes coincide with each other, the intersection 6 is determined as a candidate for an edge at the right end of the X direction of the storage unit Cc, and the line 156 is determined as a second candidate b for the right edge of the storage unit Cc.

  That is, in the left area 201, the line 151 is determined as the first edge candidate A and the line 153 is determined as the second edge candidate B. In the right area 202, the line 154 is determined as the first edge candidate a. The line 156 is determined as the second edge candidate b.

  Next, the CPU 117A acquires an outer edge candidate pair among the determined edge candidates (method A (4) in the recognition flowchart of FIG. 11).

  That is, as shown in FIG. 21, a line 151 that is the outermost first edge candidate A that is the leftmost edge and a line 156 that is the outermost second edge candidate b that is the rightmost edge. It is acquired as an outer edge candidate pair and stored in the RAM 117B as the left and right edges of the storage unit Cc.

  In this way, after performing the template matching and binarization processing, the edge detection range set in advance and the edge detection at the end of the storage unit (pocket) Cc are performed, so the center position of the storage unit Cc is next. The positions of the search areas (shown by dotted lines in FIG. 19) 201 and 202 for searching for edges that have been pre-set in size and stored in the RAM 111 based on the edge position data and the edge position data are reliably determined. Can do.

  In addition, since the CPU 117A acquires an outer edge candidate pair among the determined edge candidates, the left and right edges of the storage unit Cc are stored even when the electronic component is stored in the storage unit Cc. It can be reliably distinguished from the electronic components that are present. More specifically, even when the actual size of the storage unit Cc is larger than the size stored in the RAM 117B in advance, and the size of the electronic component approximates the size of the storage unit Cc stored in the RAM 117B, The left and right edges of the storage portion Cc can be reliably distinguished from the stored electronic components and recognized.

  Next, the CPU 117A performs template matching and binarization processing in the tape feeding direction (hereinafter referred to as Y direction) indicated by an arrow A in FIG. 19 as well as the recognition processing in the X direction described above. Edge detection and determination are performed within a preset edge search range.

  For example, the central portion of the storage portion Cc (which may be displaced from the center of the imaged storage portion Cc), which is set in advance and stored as data in the RAM 117B, is scanned from top to bottom in FIG. , Detect brightness change points.

  At this time, the CPU 117A first sets the brightness change point from the portion with high lightness around the storage portion Cc on the storage tape C to the portion with low lightness of the storage portion Cc (for example, a dark portion such as dark gray) as shown in FIG. The intersection point 7 between the upper line 157 and the scanning line is detected. Next, the CPU 117A displays a line as a brightness change point from the storage portion Cc on the line 158 below the line 157 to the center surface 147 of the electronic component 145 (for example, a portion captured in light gray and brighter than the storage portion Cc). An intersection point 8 between 158 and the scanning line is detected. Similarly, the CPU 117A displays a line 159, a scanning line, and the like as a brightness change point from the central surface 147 of the electronic component 145 to the storage part Cc (for example, a dark part imaged in gray) on the line 159 below the line 158. The intersection point 9 is detected.

  Next, the CPU 117A detects the intersection 10 of the line 160 and the scanning line as a brightness change point from the storage portion Cc on the line 160 below the line 159 to the high brightness portion on the surface of the storage tape around it. .

  FIG. 22 shows the brightness change at the brightness change location detected as described above. Next, the CPU 117A displays the brightness change data in the Y direction in the storage unit Cc stored in the RAM 117B in advance and as described above. The brightness change at each detected intersection is sequentially compared. That is, first, the CPU 117A detects brightness change (bright → dark) detected at the uppermost intersection point 7 and brightness change data (bright → dark) of the upper area in the Y direction in the storage unit Cc stored in the RAM 117B. And the detected intersection point 7 is determined as the upper end in the Y direction of the storage unit Cc, and the line 157 is determined as a candidate for the upper edge of the storage unit Cc.

  Next, in order to determine the lower end portion in the Y direction of the storage unit Cc, the CPU 117A uses the storage unit Cc stored in the RAM 117B and the brightness change detected at the lower intersection point 8, the intersection point 9, and the intersection point 10. The brightness change data of the upper region in the Y direction is sequentially compared. That is, at the intersection 8, the change in brightness is dark → light, whereas the brightness change data in the upper region stored in the RAM 117 </ b> B is bright → dark, and the change in brightness does not match. Therefore, it is determined that the intersection point 8 is not an upper edge candidate.

  Next, the CPU 117A compares light → dark, which is a change in lightness at the intersection point 9, and dark → light, which is data of a change in lightness of the lower area stored in the RAM 117B. Since they are different, it is determined that the intersection point 9 is not the lower edge of the storage portion Cc.

  Next, the CPU 117A compares the change in lightness at the intersection circle 10 with dark → light and the change in lightness of the lower area stored in the RAM 117B with dark → light. Since they match, the detected intersection 10 is determined as the lower end in the Y direction of the storage unit Cc, and the line 160 is determined as a candidate for the lower edge of the storage unit Cc. Then, since there is no edge candidate other than the line 157 and the line 160, the CPU 117A determines the line 157 as the upper edge of the storage unit Cc, and determines the line 160 as the lower edge of the storage unit Cc. As a result, four sides on the top, bottom, left and right of the storage portion Cc, that is, the periphery are determined.

  As described above, based on the result of imaging the storage unit Cc in which the electronic component 145 is stored, the change in brightness in the X direction and the Y direction and the change in brightness of the storage unit Cc stored in the RAM 117B in advance. If the two match, the CPU 117A further acquires an outer edge candidate pair among the determined edge candidates, so that even when the electronic component is stored in the storage unit Cc, the CPU 117A stores it. The peripheral edge, which is the edge of the portion Cc, can be reliably distinguished from the electronic component stored in the storage portion Cc, and the edge of the storage portion Cc can be reliably determined and recognized.

  In addition, as described in each claim in the column of the claims, even if the steps for determining the storage portion Cc are arbitrarily combined, the position of the storage portion is recognized. The accuracy in determining and recognizing can be improved.

  Hereinafter, when the left and right edge lines 151 and 156 and the upper and lower edge lines 157 and 160, which are the peripheral parts of the storage unit Cc, are determined, the CPU 117A then determines the expression on the recognition screen of each line and will be described later. Find the center line formula.

  That is, first, in the line 151 which is the left edge, a position separated by a predetermined dimension, for example, 0.1 mm apart from the intersection point 1 in the Y-axis direction is scanned in the X-axis direction to obtain the coordinates of the two intersection points. . Then, these three points are obtained from the intersection point 1 and the coordinates of the two intersection points, and a linear expression of the obtained straight line is defined as an approximate expression A of the line 151. Similarly, on the line 156 that is the right edge, a position that is a predetermined distance up and down from the intersection point 6 in the Y-axis direction is scanned in the X-axis direction, and the coordinates of the two intersection points with the line 156 are obtained. Then, the intersection straight line 6 is obtained from the coordinates of the intersection point 6 and the two intersection points, and a linear expression of the obtained straight line is defined as an approximate expression B of the line 156. Furthermore, from the obtained approximate expression A and approximate expression B, an expression of the first center line (center straight line) 162 of the lines 151 and 152 (hereinafter referred to as the first center line expression) is determined.

  Next, in the line 157 that is the upper edge, a position that is a predetermined dimension, for example, 0.2 mm apart in the X-axis direction from the intersection point 7 is scanned in the Y-axis direction, and two intersection points with the line 157 are detected. Find the coordinates. Then, the intersection straight line 7 is obtained from the coordinates of the intersection point 7 and the two intersection points, and a linear expression of the obtained straight line is defined as an approximate expression C of the line 157. Similarly, in the line 160 as the lower edge, a position that is a predetermined distance up and down in the X-axis direction from the intersection point 10 is scanned in the Y-axis direction, and the coordinates of two intersection points with the line 160 are obtained. Then, the intersection straight line 10 is obtained from the coordinates of the intersection point 10 and the two intersection points, and a linear expression of the obtained straight line is defined as an approximate expression D of the line 160. Further, an expression of a second center line (center straight line) 163 of the line 157 and the line 160 (hereinafter referred to as a second center line expression) is obtained from the obtained approximate expression C and approximate expression D.

  Then, an intersection 168 between the first center line 162 and the second center line 163 is obtained from the first center line formula and the second center line formula, and the X coordinate and Y coordinate of the intersection 168 are determined in the storage unit Cc. The center position is set and stored in the RAM 117B. The center position of the storage part Cc is recognized as the position of the storage part Cc with respect to the electronic component mounting apparatus, and the storage part Cc is recognized.

  Then, a deviation from the center coordinate of the substrate recognition camera 17 that images the storage portion Cc of the storage portion Cc of each coordinate of the center position of the storage portion Cc is obtained, and based on the positional relationship between the substrate recognition camera 17 and the suction nozzle 18. Then, the correction value of the suction position of the suction nozzle 18 is calculated, and this correction value is stored in the RAM 111. Then, after considering the correction value, the X-axis drive motor 12X and the Y-axis drive motor 12Y are driven, and then the vertical axis drive motor 16A is driven, and the suction nozzle 18 descends to take out the electronic components. . Thereby, by inserting / removing the component supply unit 6 from the feeder base 19, even if the position of the storage part Cc moves a little, an electronic component can be taken out reliably. Also in the next and subsequent extraction operations, the lowering position of the suction nozzle 18 is corrected by adding this correction value to the previous suction extraction position.

  In addition, it is determined whether or not the corresponding component supply unit 6 has been inserted / removed from / from the feeder base 19, and if it is determined that the component supply unit 6 has not been inserted / removed, a counter indicating the number of feed commands after the joint of the storage tape C is detected. The CPU 110 determines whether the count value of 109A has reached N times. That is, when the seam detection device 102 detects the seam, the number of times of feeding until the electronic component upstream of the seam reaches the suction / removal position of the electronic part is required N times. It is preferable to set the number of times slightly enough with a margin so that the storage portion Cc of the storage tape C that has passed through the extraction position and is added is surely positioned at the suction extraction position. If the count value has reached N times, as described above, the substrate recognition camera 17 images the storage portion Cc of the storage tape C, performs recognition processing, corrects the suction nozzle 18, and then moves the electronic component. Perform the suction extraction operation.

  However, if the count value of the counter 109A has not reached N times, the counter 109B counts the number of times that suction mistakes have occurred continuously, and when the CPU 110 determines that the count number has reached M times, As described above, the substrate recognition camera 17 images the storage portion Cc of the storage tape C, performs recognition processing, corrects and moves the suction nozzle 18, and then performs an electronic component suction / extraction operation. This suction error corresponds to a case where the line sensor 109C or the component recognition camera 14 detects that the electronic component is not suction-held on the suction nozzle 18, or a suction-hold state in an abnormal posture is detected.

  However, if the counter 109B does not reach the number of consecutive suction mistakes M, the CPU 110 next determines whether or not the suction rate has become a predetermined value or less. That is, when the value obtained by dividing the number of times of suction by the number of times of picking up the component is less than a predetermined value and the suction rate decreases, the board recognition camera 17 images and recognizes the storage portion Cc of the storage tape C as described above. After processing, the suction nozzle 18 is corrected and moved, and then the electronic component is picked up and taken out.

  The operation as described above is performed for each mounting order indicated by the mounting data until there is no mounting data of the next step number, and the determination and suction operation of the electronic component by the suction nozzle 18 are performed.

  Instead of detecting the seam by the seam detection device 102, the CPU 110 divides the length of the storage tape C loaded in the component supply unit 6 stored in the RAM 111 by the feed pitch of the storage tape, so that the electronic component The remaining number may be grasped and stored in the RAM 111, and the counter may be decremented by 1 for each feeding operation to always manage the remaining number. That is, the management apparatus is configured by the CPU 110, the RAM 111, the counter, and the like. As a result, when the remaining number reaches a predetermined number, it is notified that splicing is required to connect the new storage tape to the old storage tape, and then splicing is performed, and the predetermined number of electronic components are supplied. Later (preferably after a slightly larger number than the predetermined number is supplied in order to ensure that a new storage tape reaches the suction / removal position), as described above, the substrate recognition camera 17 is stored in the storage tape. After the C storage portion Cc is imaged and recognized, the suction nozzle 18 may be corrected and moved, and then the electronic component suction extraction operation may be performed.

  The electronic component mounting apparatus has been described by taking a so-called multi-function chip mounter as an example. However, the present invention is not limited to this and may be applied to a high-speed chip mounter such as a rotary table type.

  The component supply unit may be mounted on a cart removably connected to the main body, and the feeder base may be provided in the cart.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

It is a top view of an electronic component mounting apparatus. It is a side view of the component supply unit of the state fixed on the feeder base. It is a longitudinal cross-sectional view of the cover tape peeling mechanism of FIG. FIG. 3 is a diagram illustrating a relationship between a component supply unit and a feeder base, as viewed from an arrow X direction in FIG. 2. FIG. 3 is a cross-sectional view illustrating a relationship between a component supply unit and a feeder base at a position of a front left / right regulating pin in FIG. 2. It is a side view of a seam detection device. It is the figure which looked at the joint detection apparatus in FIG. 6 from the arrow direction. It is a top view of the storage tape connected with the connection tape. It is a side view of the storage tape connected with the connection tape. It is a control block diagram. It is a flowchart figure at the time of recognizing a storage part. It is a figure of the imaging screen of the storage part which accommodated the electronic component. It is a figure showing the template of the storage part which stores an electronic component. It is a figure showing the state of the template matching of the storage part which accommodated the electronic component. It is the figure showing the state of other template matching of the storage part which accommodated the electronic component. It is a figure of the screen showing the specific area | region in a recognition area. It is a figure showing the histogram of the gradation value and frequency in a specific area. It is the figure showing the real image and the image image which binarized this real image based on the histogram. It is a figure of the imaging screen of the storage part which accommodated the electronic component. It is a figure showing the brightness change in an imaging screen and a brightness change location. It is explanatory drawing of edge candidate pair acquisition of a accommodating part. It is a figure showing the brightness change of the storage part which accommodated the electronic component.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus main body 6 Component supply unit 17 Board | substrate recognition camera 28 Servo motor 110 CPU
110 CPU
111 RAM
117 recognition processing device 117A CPU (position recognition means, temporary position recognition means, first temporary position recognition means, second temporary position recognition means)
136 Edge of storage part (periphery)
145 Electronic component C Storage tape Cc Storage part (storage recess)

Claims (8)

  The storage tape processed by the component supply unit in an electronic component mounting apparatus in which the suction nozzle extracts and mounts the electronic component supplied from the component supply unit that supplies the electronic component in the storage tape to the component extraction position. Based on the difference in brightness between the recognition camera that captures the storage recess for storing the electronic component, the storage recess of the image captured by the recognition camera, the periphery of the storage recess, and the electronic component stored in the storage portion An electronic component mounting apparatus comprising: a recognition processing device that performs binarization processing and recognizes the position of the storage recess from the binarized image of the storage recess obtained.   The storage tape processed by the component supply unit in an electronic component mounting apparatus in which the suction nozzle extracts and mounts the electronic component supplied from the component supply unit that supplies the electronic component in the storage tape to the component extraction position. A recognition camera that captures an image of a storage recess for storing the electronic component, a template that is created from the dimension data of the storage recess and represents an edge around the storage recess, and an image captured by the recognition camera is matched, An electronic component mounting apparatus comprising: a recognition processing device that recognizes a position of a template at a position where an overlap between an edge in an image and an edge of the template is the largest as a position of the storage recess.   The storage tape processed by the component supply unit in an electronic component mounting apparatus in which the suction nozzle extracts and mounts the electronic component supplied from the component supply unit that supplies the electronic component in the storage tape to the component extraction position. A recognition camera that captures a storage recess for storing the electronic component, and a recognition processing device that recognizes and processes an image captured by the recognition camera. The recognition processing device is created from the dimension data of the storage recess. The template representing the edge around the storage recess is matched with the image captured by the recognition camera, and the position of the template where the overlap between the edge in the image and the edge of the template is the largest is the storage recess. Temporary position recognizing means for recognizing the temporary position, and A binarization process is performed based on the difference in brightness between the recess, the periphery of the storage recess, and the electronic component stored in the storage recess, and the position of the storage recess is obtained from the binarized image of the storage recess obtained. An electronic component mounting apparatus comprising position recognition means for recognizing   The storage tape processed by the component supply unit in an electronic component mounting apparatus in which the suction nozzle extracts and mounts the electronic component supplied from the component supply unit that supplies the electronic component in the storage tape to the component extraction position. A recognition camera that images the storage recess for storing the electronic component, and a recognition processing device that recognizes and processes an image captured by the recognition camera. The recognition processing device includes a storage recess, a periphery of the storage recess, Temporary position for binarizing the image based on the difference in brightness between the electronic components stored in the storage recess, and recognizing the temporary position of the storage recess from the obtained binarized image of the storage recess A change in brightness of an image taken by the recognition camera in a region set based on the recognition means and the temporary position, and a predetermined edge of the storage recess Based on the darkness of the change and to confirm the position of the edge, the electronic component mounting apparatus characterized by having a position recognition means recognizes the position of the housing recess on the basis of the position of the determined the edge.   The storage tape processed by the component supply unit in an electronic component mounting apparatus in which the suction nozzle extracts and mounts the electronic component supplied from the component supply unit that supplies the electronic component in the storage tape to the component extraction position. A recognition camera that captures a storage recess for storing the electronic component, and a recognition processing device that recognizes and processes an image captured by the recognition camera. The recognition processing device is created from the dimension data of the storage recess. The template representing the edge around the storage recess is matched with the image captured by the recognition camera, and the position of the template where the overlap between the edge in the image and the edge of the template is the largest is the storage recess. Temporary position recognizing means for recognizing as a temporary position, and the recognition in an area set based on the temporary position. The position of the edge is determined based on a change in brightness of an image captured by the camera and a change in brightness at the edge of the storage recess that is set in advance, and the storage is performed based on the determined position of the edge. An electronic component mounting apparatus comprising position recognition means for recognizing the position of the recess.   The storage tape processed by the component supply unit in an electronic component mounting apparatus in which the suction nozzle extracts and mounts the electronic component supplied from the component supply unit that supplies the electronic component in the storage tape to the component extraction position. A recognition camera that images the storage recess for storing the electronic component, and a recognition processing device that recognizes and processes an image captured by the recognition camera. The recognition processing device includes a storage recess, a periphery of the storage recess, Temporary position recognition means for performing binarization processing based on the difference in brightness between the electronic components stored in the storage recesses and recognizing the temporary position of the storage recesses from the obtained binarized image of the storage recesses And detecting a plurality of edge candidates of the storage recesses based on a change in brightness of an image captured by the recognition camera within an area set based on the temporary position, A pair of outer edge candidates are determined as opposing edges of the storage recesses, and the lightness change portion of the edge candidate that matches the change in brightness at the edge of the storage recess is determined, An electronic component mounting apparatus comprising: position recognition means for recognizing the position of the storage recess based on the position.   The storage tape processed by the component supply unit in an electronic component mounting apparatus in which the suction nozzle extracts and mounts the electronic component supplied from the component supply unit that supplies the electronic component in the storage tape to the component extraction position. A recognition camera that captures a storage recess for storing the electronic component, and a recognition processing device that recognizes and processes an image captured by the recognition camera. The recognition processing device is created from the dimension data of the storage recess. The template representing the edge around the storage recess is matched with the image captured by the recognition camera, and the position of the template where the overlap between the edge in the image and the edge of the template is the largest is the storage recess. First temporary position recognizing means for recognizing the first temporary position and a predetermined area centered on the temporary position. Binarization processing is performed based on a difference in brightness between the storage recess, the periphery of the storage recess, and the electronic component stored in the storage recess, and the storage from the binarized image of the storage recess obtained. Second temporary position recognition means for recognizing a second temporary position of the recess, and a change in brightness of the image captured by the recognition camera in an area set based on the second temporary position. A plurality of edge candidates are detected, and a pair of outer edge candidates are opposed to the storage recesses out of the light / dark change locations at the edge candidates that match a preset change in brightness at the edges of the storage recesses. An electronic component mounting apparatus comprising: a position recognizing unit that determines an edge and recognizes the position of the storage recess based on the determined position of the edge. The storage tape processed by the component supply unit in an electronic component mounting apparatus in which the suction nozzle extracts and mounts the electronic component supplied from the component supply unit that supplies the electronic component in the storage tape to the component extraction position. A recognition camera that images a rectangular storage recess for storing the electronic component, and a recognition processing device that recognizes and processes an image captured by the recognition camera. The recognition processing device includes a storage recess and a storage recess. Temporary position for performing binarization processing based on the difference in brightness between the surroundings and the electronic components stored in the storage recess, and recognizing the temporary position of the storage recess from the obtained binarized image of the storage recess The region set based on the recognition means and the temporary position is scanned in a direction perpendicular to the feeding direction of the storage tape, and the recognition camera obtained by this scanning takes an image. A plurality of edge candidates of the storage recess are detected by a change in brightness in the image, and a pair of outer sides of the light / dark change locations at the edge candidate that match a preset change in brightness at the edge of the storage recess The edge candidate is determined as one opposite edge of the storage recess, and the storage recess, the periphery of the storage recess, and the electronic component stored in the storage recess are scanned in a direction along the feeding direction of the storage tape. Then, a plurality of edge candidates of the storage recess are detected based on a change in brightness in an image captured by the recognition camera obtained by this scanning, and coincide with a preset change in brightness at the edge of the storage recess. Edge determination means for determining a pair of outer edge candidates as the other opposing edges of the storage recess among the brightness change portions in the edge candidates, and the position of the one edge An electronic component mounting apparatus characterized said that a other position recognition means recognizes the position of the housing recess on the basis of the position of the edge with.

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