WO2018173226A1 - Mounting device and mounting method - Google Patents

Mounting device and mounting method Download PDF

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Publication number
WO2018173226A1
WO2018173226A1 PCT/JP2017/011871 JP2017011871W WO2018173226A1 WO 2018173226 A1 WO2018173226 A1 WO 2018173226A1 JP 2017011871 W JP2017011871 W JP 2017011871W WO 2018173226 A1 WO2018173226 A1 WO 2018173226A1
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WO
WIPO (PCT)
Prior art keywords
tray member
mode
correction value
frame lines
different directions
Prior art date
Application number
PCT/JP2017/011871
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French (fr)
Japanese (ja)
Inventor
遠藤 大輔
祐介 土谷
Original Assignee
株式会社Fuji
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Fuji filed Critical 株式会社Fuji
Priority to JP2019506859A priority Critical patent/JP6804741B2/en
Priority to PCT/JP2017/011871 priority patent/WO2018173226A1/en
Priority to CN201780088587.8A priority patent/CN110476496B/en
Publication of WO2018173226A1 publication Critical patent/WO2018173226A1/en

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  • the present invention relates to a mounting apparatus and a mounting method.
  • a mounting apparatus for example, an apparatus that reads a reference mark formed on a component supply pallet and calculates its fixed position error has been proposed (for example, see Patent Document 1).
  • this apparatus the positional deviation between the component holding unit and the component receiving unit can be corrected, and the receiving accuracy can be improved.
  • an apparatus for example, an apparatus has been proposed in which a positioning hole and a mark are provided in a pallet, and the suction position is corrected by recognizing the mark to stabilize the suction of components from the pallet (for example, Patent Document 2). reference).
  • the present invention has been made in view of such a problem, and a main object of the present invention is to provide a mounting apparatus and a mounting method capable of performing production without preparing a mark.
  • the present invention adopts the following means in order to achieve the main object described above.
  • the mounting apparatus of the present invention is a mounting apparatus that collects components and performs mounting processing.
  • a tray member that has at least a plurality of portions including two-direction frame lines at a plurality of positions, accommodates components, and moves between a storage position and a sampling position;
  • An imaging unit for imaging a portion including the frame line in at least two different directions;
  • the tray member moves to the sampling position, the part including at least two different direction frame lines is imaged, and the part is sampled based on the position of the part including the at least two different direction frame lines.
  • a control unit that executes a mode for obtaining a correction value for correcting the position; It is equipped with.
  • a portion including at least two different frame lines of the tray member is used to obtain a correction value for correcting the sampling position of the component when the tray member is moved, so that production is performed without preparing a mark. Can do.
  • FIG. 4 is a schematic explanatory diagram illustrating an example of a schematic configuration of the mounting apparatus 11. An explanatory view showing an example of pallet 23 and tray member 24.
  • FIG. 6 is an explanatory diagram showing a positional deviation of the tray body 25.
  • FIG. 6 is an explanatory diagram showing the inclination of the tray body 25.
  • FIG. 6 is an explanatory diagram showing distortion of the tray body 25.
  • FIG. 1 is an explanatory diagram illustrating an example of a schematic configuration of the mounting apparatus 11 of the mounting system 10.
  • FIG. 2 is an explanatory diagram illustrating an example of the pallet 23 and the tray member 24.
  • the mounting system 10 is a system that executes a mounting process for placing the component P on the substrate S as shown in FIG.
  • the mounting system 10 includes a mounting device 11 and a management computer (PC) 40.
  • PC management computer
  • the management PC 40 manages mounting job information including processing conditions in the mounting apparatus 11.
  • the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIG.
  • the mounting apparatus 11 includes a board transfer unit 12, a mounting unit 13, a parts camera 19, a component supply unit 20, and a control unit 30.
  • the substrate transport unit 12 is a unit that carries in, transports, fixes and unloads the substrate S at the mounting position.
  • the substrate transport unit 12 has a pair of conveyor belts provided in the front-rear direction of FIG. The board
  • substrate S is conveyed by this conveyor belt.
  • the mounting unit 13 collects components from the component supply unit 20 and arranges them on the substrate S fixed to the substrate transport unit 12.
  • the mounting unit 13 includes a head moving unit 15, a mounting head 16, and a suction nozzle 17.
  • the head moving unit 15 includes a slider that is guided by the guide rail and moves in the XY directions, and a motor that drives the slider.
  • the mounting head 16 is detachably mounted on the slider and is moved in the XY directions by the head moving unit 15.
  • One or more suction nozzles 17 are detachably mounted on the lower surface of the mounting head 16.
  • the suction nozzle 17 is a collection member that collects the component P using pressure.
  • the sampling member may be a mechanical chuck that holds the component P.
  • the mounting head 16 is provided with a mark camera 18 for photographing the substrate S and the like from above.
  • the mark camera 18 has a photographing area below, and reads a reference position of the substrate S and a portion 27 including at least two different frame lines of the tray member 24.
  • the mark camera 18 moves in the XY direction as the mounting head 16 moves.
  • the parts camera 19 is disposed between the substrate transport unit 12 and the component supply unit 20.
  • the imaging range of the parts camera 19 is above the parts camera 19.
  • the suction nozzle 17 that sucks the part P passes above the part camera 19
  • the parts camera 19 captures the part P sucked by the suction nozzle 17 from below and outputs the image to the control unit 30.
  • the component supply unit 20 includes a plurality of feeders provided with reels and a tray unit containing a plurality of trays.
  • the feeder feeds a tape that is wound around a reel and holds a component, and supplies the component P to the mounting unit 13.
  • the tray unit includes a magazine unit 21, a pallet 23, and a tray member 24.
  • the magazine unit 21 accommodates a plurality of pallets 23 to which the tray member 24 is fixed.
  • the pallet 23 moves between an initial position in the magazine section 21 (see the dotted line in FIG. 1) and a collection position (see the solid line in FIG. 1) for collecting the parts P by a moving mechanism (not shown).
  • the tray member 24 includes a tray main body 25 and a fixing member 26 and a portion 27 including at least two different frame lines.
  • the tray body 25 is a plate-like member in which a large number of rectangular cavities are formed, and the component P is accommodated in the cavities.
  • the fixing member 26 is a member that fixes the tray main body 25 to the pallet 23 and is connected to the tray main body 25 in a state where positional accuracy is ensured. In FIG. 2, an example in which the four portions of the tray body 25 are fixed by the fixing member 26 is shown.
  • the frame line means a section for arranging parts on the tray.
  • the control unit 30 is configured as a microprocessor centered on the CPU 31, and includes a storage unit 32 for storing a processing program.
  • the control unit 30 outputs control signals to the substrate transport unit 12, the mounting unit 13, the parts camera 19, and the component supply unit 20, and inputs signals from the mounting unit 13, the parts camera 19, and the component supply unit 20.
  • FIG. 3 is a flowchart illustrating an example of a tray component supply processing routine executed by the CPU 31 of the control unit 30. This routine is stored in the storage unit 32 and executed after the mounting process of the mounting apparatus 11 is started.
  • the CPU 31 of the control unit 30 sets a mode for correcting the position of the component P collected from the tray member 24 (step S100).
  • the correction value is obtained by imaging the portion 27 including at least two different frame lines when the tray member 24 is moved to the first collection position at least one of when starting new production and when replacing the tray.
  • the CPU 31 obtains the correction value of the sampling position of the component P only for the first time, and thereafter, the component P is sampled by repeatedly using the correction value.
  • the CPU 31 obtains a correction value each time the tray member 24 is pulled out from the magazine portion 21, and collects the component P with the correction value.
  • the mode selected in advance by the operator may be set as the execution mode, or the default mode (for example, the second mode) may be set as the execution mode.
  • imaging is performed at the time of the first movement, but it is only necessary to obtain a correction value, and the present invention is not limited to this. For example, you may image by prior preparation.
  • the CPU 31 determines whether or not the tray member 24 is pulled out based on whether or not the component P of the tray unit is collected (step S110).
  • the member 24 is moved to the collection position (step S120).
  • the CPU 31 determines whether or not the corresponding tray member 24 is pulled out for the first time (step S130).
  • the CPU 31 performs a process of imaging the portion 27 including at least two different frame lines in the three positions of the tray member 24 with the mark camera 18 (step S140).
  • a correction value for correcting the position, inclination, and distortion of the tray member 24 is obtained based on the position of the portion 27 including the frame lines in at least two different directions in the image that has been obtained (step S150).
  • the CPU 31 captures at least two portions 27 of the tray member 24 including frame lines in two directions, and performs first correction processing for correcting the position and inclination of the tray member 24, and three locations of the tray member 24.
  • the above-described second correction process for correcting the position, inclination, and distortion of the tray member 24 is performed by imaging the portion 27 including the frame lines in at least two different directions.
  • the second correction process is performed when the tray member 24 is pulled out for the first time
  • the first correction process is performed when the same tray member 24 is pulled out for the second time and thereafter. If it is an image of the portion 27 including at least two different frame lines, the position on the plane can be acquired.
  • the frame line may be a frame line length 51, a frame line width 52, and a frame line slant 53.
  • FIG. 4 is an explanatory diagram showing the positional deviation of the tray main body 25.
  • the portion 27 including at least two different frame lines is represented as a coordinate point.
  • FIG. 5 is an explanatory diagram showing the inclination of the tray body 25.
  • FIG. 6 is an explanatory diagram showing distortion (elongation) of the tray body 25.
  • the positional deviation of the tray body 25 can be obtained from the difference between the coordinates (dotted line in the figure) serving as a reference of the portion 27 including at least two different frame lines and the coordinates of the captured image. .
  • the positional deviation correction value may be a value for shifting the position of the suction nozzle 17 in the same manner as the positional deviation of the tray main body 25.
  • the inclination of the tray body 25 can be obtained from the inclination of a straight line connecting at least two portions 27 including at least two frame lines in two different directions.
  • the inclination correction value can be obtained as a positional deviation amount in accordance with the inclination of the tray body 25.
  • the distortion of the tray body 25 includes the third at least two different directional frame lines when the portion 27 including at least two at least two different directional frame lines is used as a reference.
  • the portion 27 can be determined by how the portion 27 is displaced. For example, when the distance between the two points is the same as shown in FIG. 6 and only the length of the third point is different, it can be detected that the tray body 25 is expanded and contracted at a predetermined rate. In this case, what is necessary is just to obtain
  • the third portion 27 including at least two different frame lines is shifted in the left-right direction, a ratio of the tray body 25 being distorted in the left-right direction is obtained, and the suction nozzle 17 is added with the ratio. What is necessary is just to obtain
  • step S150 the CPU 31 stores the correction value and causes the mounting unit 13 to collect a component using the correction value (step S240). Since the position, inclination, and distortion of the tray body 25 are corrected, the component P can be collected at an accurate position.
  • step S250 the CPU 31 determines whether or not there is a component P to be collected next. When there is a component P to be collected next, whether or not the component P is in another tray member 24 is determined. Determination is made (step S260). When there is no other tray member 24, that is, when the component P is collected from the tray member 24 at the current collection position, the CPU 31 executes the processing after step S240 using the current correction value.
  • the CPU 31 moves the tray member 24 currently in the collection position to the initial position (step S270), and executes the processing after step S120. To do. That is, the CPU 31 moves the corresponding tray member 24 to the collection position in step S120, and determines whether or not it is the first withdrawal in step S130.
  • the CPU 31 determines what the current setting mode is (step S160).
  • the CPU 31 obtains a correction value by the first correction process every time the tray member 24 is pulled out, and the CPU 31 determines at least two portions 27 of the portion 27 including the frame lines in two different directions.
  • An image is taken (step S170), and a correction value for the position and tilt of the tray body 25 is calculated (step S180). Note that the distortion correction value may be obtained by repeatedly using the value obtained for the first time.
  • the CPU 31 determines whether or not the obtained correction value is continued within a predetermined allowable range (step S190). This determination determines whether it is necessary to obtain a correction value every time. For example, when there is almost no variation in the correction value obtained a plurality of times, it can be said that the tray body 25 is fixed without further deviation from the state even when there is a positional deviation or an inclination. In this case, the mounting unit 13 can secure the suction position accuracy of the component P even if the correction value obtained once is repeatedly used.
  • the “predetermined allowable range” may be, for example, a range empirically obtained as a range in which the correction value can be regarded as not fluctuating, and may be a variation range of ⁇ 10%, for example.
  • “continuation” may be determined empirically, for example, three times continuously or five times continuously. Then, when the obtained correction value does not continue within the predetermined allowable range, the processing after step S240 is executed as it is. On the other hand, when the obtained correction value continues within the predetermined allowable range, the CPU 31 shifts to the first mode in which the correction value is obtained less frequently (step S200), and executes the processes after step S240.
  • the sampling position deviation information of the component P is acquired (step S210).
  • the collection position deviation information includes the amount of positional deviation between the component P and the suction nozzle 17 when the part P is collected by the suction nozzle 17.
  • the sampling position deviation can be obtained by capturing the part P with the suction nozzle 17 in step S240 and then imaging the state with the parts camera 19.
  • This misregistration information may include, for example, a plurality of sampling misregistration amounts obtained as described above after this determination is made first.
  • the CPU 31 determines whether or not the sampling position deviation amount of the component P is outside the allowable range (step S220).
  • This “allowable range” may be determined empirically as, for example, a range that can be regarded as having little influence on the mounting of the component P even if there is a sampling position deviation.
  • the CPU 31 directly executes the processes after step S240.
  • the sampling position deviation amount of the component P is out of the allowable range, the CPU 31 shifts to the second mode (step S230) to perform the processing after step S240 in order to increase the accuracy of the position correction of the tray body 25. Execute.
  • step S250 when there is no next part, that is, when all parts have been supplied, the CPU 31 ends this routine.
  • the tray member 24 of the present embodiment corresponds to a tray member
  • the portion 27 including at least two different frame lines corresponds to a portion including at least two different frame lines
  • the mark camera 18 corresponds to an imaging unit
  • the control unit 30 corresponds to the control unit
  • the mounting unit 13 corresponds to the sampling unit.
  • the control unit 30 of the present embodiment described above captures the portion 27 including at least two different frame lines when the tray member 24 is moved to at least the first sampling position, and at least two different frames of the captured image.
  • a first mode for obtaining a correction value for correcting the sampling position of the part P based on the position of the portion 27 including the line is executed.
  • the control unit 30 captures an image of the portion 27 including at least two different frame lines when the tray member 24 is moved to the collection position, and at the position of the portion 27 including at least two different frame lines of the captured image.
  • the correction value for correcting the sampling position of the component P is calculated more frequently than in the first mode.
  • the part P can be collected with higher accuracy by executing the second mode, or the part P can be collected with higher efficiency by executing the first mode.
  • the first mode is a mode for obtaining a correction value when the tray member 24 is moved to the collection position for the first time at least one of when starting new production and when replacing the tray. Since the mounting apparatus 11 can perform subsequent component collection using the correction value obtained at the start of new production or at the time of restart after tray replacement, the component P can be collected more efficiently.
  • control unit 30 shifts from the second mode to the first mode when the correction value obtained in the second mode is continued within a predetermined allowable range. If it is within the range, that is, if the positional deviation variation of the tray member 24 is small, by performing the first mode that is executed less frequently, the sampling of the component P can be further increased while maintaining the sampling of the component P with high accuracy. Can be done efficiently. Furthermore, the control unit 30 acquires positional deviation information (collecting positional deviation information) of the component P collected by the mounting unit 13 that collects the component P accommodated in the tray member 24, and the positional deviation amount is a predetermined tolerance. When it is out of range, the first mode is shifted to the second mode.
  • the mode in the first mode, when the misalignment of the collected component P is outside the allowable range, that is, when the misalignment of the component is large, the mode is changed to the second mode. be able to. And since the control part 30 calculates
  • control unit 30 images the portion 27 including at least two different frame lines in two positions of the tray member 24, and based on the position of the portion 27 including at least two different frame lines in the captured image.
  • a first correction process for obtaining a correction value for correcting the position and inclination of the member 24 is executed.
  • control unit 30 captures at least three portions 27 of the tray member 24 including at least two different frame lines, and based on the positions of the portions 27 including at least two different frame lines of the captured image.
  • a second correction process for obtaining a correction value for correcting the position, inclination, and distortion of the tray member 24 is executed.
  • parts are collected more efficiently by performing the first correction process using the portions 27 including at least two different two-direction frame lines, while at least three different two-direction frame lines are obtained.
  • the control unit 30 executes the second correction process at the first movement of the tray member 24 to the collection position at least one of the start of new production and the tray replacement, and then executes the first correction process.
  • the part P can be sampled with higher accuracy. After that, the measurement of the distortion correction value is omitted, and the part P can be collected more efficiently. Can be done.
  • the first mode and the second mode are switched based on the variation of the correction value, the sampling position deviation amount, and the like.
  • the present invention is not particularly limited thereto, and the mode is changed according to other parameters. It is good also as what switches. Moreover, it is good also as what performs either 1st mode and 2nd mode based on a worker's setting.
  • the first mode is a mode for obtaining the correction value only when the tray body 25 is moved for the first time. However, if the frequency is lower than that of the second mode, the correction value may be obtained periodically after the second mode. .
  • the correction value is obtained every time the tray member 24 is pulled out from the magazine portion 21, but if the frequency is higher than in the first mode, the correction value may not be obtained periodically. There may be. Further, the control unit 30 may shift from the first mode to the second mode when the obtained correction value is continued outside the predetermined allowable range in the first mode. In this apparatus, when the correction value is not continuously within the allowable range, that is, when the positional deviation variation of the tray member 24 is large, the second mode having a high execution frequency is performed, so that the part P is collected with higher accuracy. be able to.
  • the control unit 30 acquires information on the component P accommodated in the tray main body 25, and when the component P is a component that requires a predetermined high-precision position, for example. Two modes may be executed.
  • the part P can be collected with higher accuracy for a part that requires a high-accuracy position.
  • “parts that require a high-precision position” include, for example, parts that are placed on parts that have been placed first, parts that are narrowly adjacent, and the like.
  • control unit 30 acquires information on the component P accommodated in the tray member 24, and when the component P is a component that requires a predetermined high-precision position, Two correction processes may be executed.
  • the part P can be collected with higher accuracy for a part that requires a high-accuracy position.
  • the second correction process is performed when the tray member 24 is pulled out for the first time
  • the first correction process is performed when the same tray member 24 is pulled out for the second time or later.
  • the control unit 30 shifts from the second correction process to the continuation of the first correction process when the obtained distortion correction value is continued within a predetermined allowable range while continuing the second correction process. Also good.
  • the correction of the variation of the distortion of the tray member 24 is omitted within an allowable range, so that the part P can be collected more efficiently.
  • continuous the second correction process includes continuous continuation that is performed each time the tray member moves, and intermittent continuation that is performed every predetermined number of times or after a predetermined time has elapsed.
  • the “predetermined allowable range” may be, for example, a range empirically obtained as a range in which the correction value can be regarded as not fluctuating, and may be a variation range of ⁇ 10%, for example.
  • the control unit 30 acquires the sampling position deviation information of the component P collected by the mounting unit 13 that samples the component P accommodated in the tray member 24, and when the positional deviation amount is outside the predetermined allowable range, The process may be shifted from the first correction process to the continuation of the second correction process.
  • the second correction process for correcting the distortion of the tray member 24 is continued. Can be performed with higher accuracy.
  • the main combination is to perform the second correction process in the second mode and perform the first correction process in the first mode, but is not particularly limited thereto.
  • the second correction process may be performed in the first mode
  • the first correction process may be performed in the second mode.
  • both the switching between the first mode and the second mode and the switching between the first correction process and the second correction process are performed.
  • the present invention is not particularly limited to this, and either switching is omitted. May be. Even in this case, the part P can be collected with higher accuracy, or the part P can be collected with higher efficiency.
  • the first mode and the second mode are provided, but either one may not be provided.
  • the first correction process and the second correction process are included. However, either one may be omitted.
  • the control unit 30 captures the portion 27 including at least two different frame lines when the tray member 24 moves to at least the first sampling position, and at least two different frame frames of the captured image.
  • a mode (first mode) for obtaining a correction value for correcting the sampling position of the part P based on the position of the part 27 including the line is used.
  • the part 27 including at least three different frame lines of the tray member 24 is used.
  • the component P can be sampled with high efficiency by the first mode and with high accuracy by the second correction process.
  • the second correction process uses the portions 27 including at least three different two-direction frame lines in the second correction process, but there are no particular limitations as long as there are three or more locations.
  • the mounting apparatus 11 when the number of imaging locations increases, the imaging time and the analysis time become longer.
  • the frequency of the process for obtaining the correction value is changed.
  • the correction itself may be omitted. In this apparatus, correction can be omitted and the part P can be collected more efficiently.
  • the mounting apparatus 11 has been described.
  • the mounting apparatus 11 is not particularly limited thereto, and may be a mounting method or a program for executing the mounting method.
  • this mounting method various aspects of the mounting device described above may be adopted, and steps for realizing each function of the mounting device described above may be added.
  • the present invention can be used in the field of mounting electronic components.
  • 10 mounting system 11 mounting device, 12 substrate transport unit, 13 mounting unit, 15 head moving unit, 16 mounting head, 17 suction nozzle, 18 mark camera, 19 part camera, 20 component supply unit, 21 magazine unit, 23 pallet, 24 tray members, 25 tray body, 26 fixing members, 27 parts including at least two different frame lines, 30 control unit, 31 CPU, 32 storage unit, 40 management PC, 51 frame vertical, 52 frame horizontal, 53 Frame diagonal, P component, S substrate.

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  • Supply And Installment Of Electrical Components (AREA)

Abstract

A mounting device 11 captures an image of a part 27 that includes a frame border of at least two different directions during movement of a tray member 24 to at least the initial collection position, and executes a mode for finding a correction value to correct the collection position of a part P on the basis of the position of the part 27 that includes the frame border of at least two different directions of the captured image.

Description

実装装置及び実装方法Mounting apparatus and mounting method
 本発明は、実装装置及び実装方法に関する。 The present invention relates to a mounting apparatus and a mounting method.
 従来、実装装置としては、例えば、部品供給パレット上に形成した基準マークを読み取り、その固定位置誤差を算出するものが提案されている(例えば、特許文献1参照)。この装置では、部品保持部と部品受取部との位置ずれを修正し、受取精度を向上することができる。また、実装装置としては、例えば、パレットに位置決め穴及びマークを設け、マークを認識することで吸着位置を補正しパレットからの部品の吸着を安定させるものが提案されている(例えば、特許文献2参照)。 Conventionally, as a mounting apparatus, for example, an apparatus that reads a reference mark formed on a component supply pallet and calculates its fixed position error has been proposed (for example, see Patent Document 1). In this apparatus, the positional deviation between the component holding unit and the component receiving unit can be corrected, and the receiving accuracy can be improved. In addition, as a mounting apparatus, for example, an apparatus has been proposed in which a positioning hole and a mark are provided in a pallet, and the suction position is corrected by recognizing the mark to stabilize the suction of components from the pallet (for example, Patent Document 2). reference).
特開平6-216576号公報JP-A-6-216576 特開平10-335889号公報Japanese Patent Laid-Open No. 10-335889
 しかしながら、この特許文献1、2に記載された実装装置では何らかのマークを準備する必要があった。 However, in the mounting apparatus described in Patent Documents 1 and 2, it is necessary to prepare some marks.
 本発明は、このような課題に鑑みなされたものであり、マークを準備することなく生産を行うことができる実装装置及び実装方法を提供することを主目的とする。 The present invention has been made in view of such a problem, and a main object of the present invention is to provide a mounting apparatus and a mounting method capable of performing production without preparing a mark.
 本発明は、上述の主目的を達成するために以下の手段を採った。 The present invention adopts the following means in order to achieve the main object described above.
 即ち、本発明の実装装置は、部品を採取して実装処理する実装装置であって、
 少なくとも異なる2方向の枠線を含む部分を複数の位置に有し部品を収容して収容位置と採取位置との間で移動するトレイ部材と、
 前記少なくとも異なる2方向の枠線を含む部分を撮像する撮像部と、
 前記トレイ部材の前記採取位置への移動時に前記少なくとも異なる2方向の枠線を含む部分を撮像し撮像された画像の前記少なくとも異なる2方向の枠線を含む部分の位置に基づいて前記部品の採取位置を補正する補正値を求めるモードを実行する制御部と、
 を備えたものである。
That is, the mounting apparatus of the present invention is a mounting apparatus that collects components and performs mounting processing.
A tray member that has at least a plurality of portions including two-direction frame lines at a plurality of positions, accommodates components, and moves between a storage position and a sampling position;
An imaging unit for imaging a portion including the frame line in at least two different directions;
When the tray member moves to the sampling position, the part including at least two different direction frame lines is imaged, and the part is sampled based on the position of the part including the at least two different direction frame lines. A control unit that executes a mode for obtaining a correction value for correcting the position;
It is equipped with.
 この装置では、トレイ部材が有する少なくとも異なる2方向の枠線を含む部分を用いて、トレイ部材の移動時には部品の採取位置を補正する補正値を求めるため、マークを準備することなく生産を行うことができる。 In this apparatus, a portion including at least two different frame lines of the tray member is used to obtain a correction value for correcting the sampling position of the component when the tray member is moved, so that production is performed without preparing a mark. Can do.
実装装置11の構成の概略の一例を表す概略説明図。FIG. 4 is a schematic explanatory diagram illustrating an example of a schematic configuration of the mounting apparatus 11. パレット23及びトレイ部材24の一例を表す説明図。An explanatory view showing an example of pallet 23 and tray member 24. FIG. トレイ部品供給処理ルーチンの一例を表すフローチャート。The flowchart showing an example of a tray component supply processing routine. トレイ本体25の位置ずれを表す説明図。FIG. 6 is an explanatory diagram showing a positional deviation of the tray body 25. トレイ本体25の傾きを表す説明図。FIG. 6 is an explanatory diagram showing the inclination of the tray body 25. トレイ本体25の歪みを表す説明図。FIG. 6 is an explanatory diagram showing distortion of the tray body 25.
 本発明の好適な実施形態を図面を参照しながら以下に説明する。図1は、実装システム10の実装装置11の構成の概略の一例を表す説明図である。図2は、パレット23及びトレイ部材24の一例を表す説明図である。実装システム10は、例えば、図1に示すように、部品Pを基板S上に配置する実装処理を実行するシステムである。この実装システム10は、実装装置11と、管理コンピュータ(PC)40とを備えている。実装システム10では、複数の実装装置11が上流から下流に配置されている。図1では、説明の便宜のため実装装置11を1台のみ示している。管理PC40は、実装装置11での処理条件を含む実装ジョブ情報などを管理する。なお、本実施形態において、左右方向(X軸)、前後方向(Y軸)及び上下方向(Z軸)は図1に示した通りとする。 Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an explanatory diagram illustrating an example of a schematic configuration of the mounting apparatus 11 of the mounting system 10. FIG. 2 is an explanatory diagram illustrating an example of the pallet 23 and the tray member 24. For example, the mounting system 10 is a system that executes a mounting process for placing the component P on the substrate S as shown in FIG. The mounting system 10 includes a mounting device 11 and a management computer (PC) 40. In the mounting system 10, a plurality of mounting apparatuses 11 are arranged from upstream to downstream. In FIG. 1, only one mounting apparatus 11 is shown for convenience of explanation. The management PC 40 manages mounting job information including processing conditions in the mounting apparatus 11. In the present embodiment, the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIG.
 実装装置11は、基板搬送ユニット12と、実装ユニット13と、パーツカメラ19と、部品供給ユニット20と、制御部30とを備えている。基板搬送ユニット12は、基板Sの搬入、搬送、実装位置での固定、搬出を行うユニットである。基板搬送ユニット12は図1の前後に間隔を開けて設けられ左右方向に架け渡された1対のコンベアベルトを有している。基板Sはこのコンベアベルトにより搬送される。 The mounting apparatus 11 includes a board transfer unit 12, a mounting unit 13, a parts camera 19, a component supply unit 20, and a control unit 30. The substrate transport unit 12 is a unit that carries in, transports, fixes and unloads the substrate S at the mounting position. The substrate transport unit 12 has a pair of conveyor belts provided in the front-rear direction of FIG. The board | substrate S is conveyed by this conveyor belt.
 実装ユニット13は、部品を部品供給ユニット20から採取し、基板搬送ユニット12に固定された基板Sへ配置するものである。実装ユニット13は、ヘッド移動部15と、実装ヘッド16と、吸着ノズル17とを備えている。ヘッド移動部15は、ガイドレールに導かれてXY方向へ移動するスライダと、スライダを駆動するモータとを備えている。実装ヘッド16は、スライダに取り外し可能に装着されており、ヘッド移動部15によりXY方向へ移動する。実装ヘッド16の下面には、1以上の吸着ノズル17が取り外し可能に装着されている。吸着ノズル17は、圧力を利用して部品Pを採取する採取部材である。なお、この採取部材は、部品Pを把持するメカニカルチャックとしてもよい。また、実装ヘッド16には、基板Sなどを上方から撮影するマークカメラ18が配設されている。マークカメラ18は、下方が撮影領域であり、基板Sの基準位置やトレイ部材24の少なくとも異なる2方向の枠線を含む部分27を読み取る。マークカメラ18は、実装ヘッド16の移動に伴ってX-Y方向へ移動する。 The mounting unit 13 collects components from the component supply unit 20 and arranges them on the substrate S fixed to the substrate transport unit 12. The mounting unit 13 includes a head moving unit 15, a mounting head 16, and a suction nozzle 17. The head moving unit 15 includes a slider that is guided by the guide rail and moves in the XY directions, and a motor that drives the slider. The mounting head 16 is detachably mounted on the slider and is moved in the XY directions by the head moving unit 15. One or more suction nozzles 17 are detachably mounted on the lower surface of the mounting head 16. The suction nozzle 17 is a collection member that collects the component P using pressure. The sampling member may be a mechanical chuck that holds the component P. The mounting head 16 is provided with a mark camera 18 for photographing the substrate S and the like from above. The mark camera 18 has a photographing area below, and reads a reference position of the substrate S and a portion 27 including at least two different frame lines of the tray member 24. The mark camera 18 moves in the XY direction as the mounting head 16 moves.
 パーツカメラ19は、基板搬送ユニット12と部品供給ユニット20との間に配設されている。このパーツカメラ19の撮像範囲はパーツカメラ19の上方である。パーツカメラ19は、部品Pを吸着した吸着ノズル17がパーツカメラ19の上方を通過する際、吸着ノズル17に吸着された部品Pを下方から撮像し、その画像を制御部30へ出力する。 The parts camera 19 is disposed between the substrate transport unit 12 and the component supply unit 20. The imaging range of the parts camera 19 is above the parts camera 19. When the suction nozzle 17 that sucks the part P passes above the part camera 19, the parts camera 19 captures the part P sucked by the suction nozzle 17 from below and outputs the image to the control unit 30.
 部品供給ユニット20は、リールを備えた複数のフィーダと、複数のトレイを収容したトレイユニットとを備えている。フィーダは、リールに巻き付けられ部品を保持したテープを送り出し、部品Pを実装ユニット13へ供給するものである。トレイユニットは、マガジン部21と、パレット23と、トレイ部材24とを備えている。マガジン部21は、トレイ部材24を固定したパレット23を複数収容している。パレット23は、マガジン部21内の初期位置(図1点線参照)と、部品Pを採取する採取位置(図1実線参照)との間を図示しない移動機構により移動する。トレイ部材24は、図2に示すように、トレイ本体25と固定部材26と少なくとも異なる2方向の枠線を含む部分27とを有する。トレイ本体25は、多数の矩形のキャビティが形成された板状の部材であり、このキャビティに部品Pを収容している。固定部材26は、トレイ本体25をパレット23へ固定する部材であり、位置精度を確保した状態でトレイ本体25に接続されている。図2では、トレイ本体25の4箇所を固定部材26で固定する例を示した。ここで、枠線とはトレイに部品を並べるための区画を形成するもののことである。 The component supply unit 20 includes a plurality of feeders provided with reels and a tray unit containing a plurality of trays. The feeder feeds a tape that is wound around a reel and holds a component, and supplies the component P to the mounting unit 13. The tray unit includes a magazine unit 21, a pallet 23, and a tray member 24. The magazine unit 21 accommodates a plurality of pallets 23 to which the tray member 24 is fixed. The pallet 23 moves between an initial position in the magazine section 21 (see the dotted line in FIG. 1) and a collection position (see the solid line in FIG. 1) for collecting the parts P by a moving mechanism (not shown). As shown in FIG. 2, the tray member 24 includes a tray main body 25 and a fixing member 26 and a portion 27 including at least two different frame lines. The tray body 25 is a plate-like member in which a large number of rectangular cavities are formed, and the component P is accommodated in the cavities. The fixing member 26 is a member that fixes the tray main body 25 to the pallet 23 and is connected to the tray main body 25 in a state where positional accuracy is ensured. In FIG. 2, an example in which the four portions of the tray body 25 are fixed by the fixing member 26 is shown. Here, the frame line means a section for arranging parts on the tray.
 制御部30は、CPU31を中心とするマイクロプロセッサとして構成されており、処理プログラムを記憶する記憶部32などを備えている。この制御部30は、基板搬送ユニット12や実装ユニット13、パーツカメラ19、部品供給ユニット20へ制御信号を出力し、実装ユニット13やパーツカメラ19、部品供給ユニット20からの信号を入力する。 The control unit 30 is configured as a microprocessor centered on the CPU 31, and includes a storage unit 32 for storing a processing program. The control unit 30 outputs control signals to the substrate transport unit 12, the mounting unit 13, the parts camera 19, and the component supply unit 20, and inputs signals from the mounting unit 13, the parts camera 19, and the component supply unit 20.
 次に、こうして構成された本実施形態の実装システム10の動作、特に、トレイユニットから部品Pを採取する際に部品Pの位置を補正する処理について説明する。図3は、制御部30のCPU31が実行するトレイ部品供給処理ルーチンの一例を表すフローチャートである。このルーチンは、記憶部32に記憶され、実装装置11の実装処理が開始されたあと実行される。 Next, the operation of the mounting system 10 according to the present embodiment configured as described above, particularly the processing for correcting the position of the component P when the component P is collected from the tray unit will be described. FIG. 3 is a flowchart illustrating an example of a tray component supply processing routine executed by the CPU 31 of the control unit 30. This routine is stored in the storage unit 32 and executed after the mounting process of the mounting apparatus 11 is started.
 このルーチンが開始されると、制御部30のCPU31は、トレイ部材24から採取する部品Pの位置を補正するモードを設定する(ステップS100)。このモードとしては、新規生産開始時及びトレイ交換時のうち少なくとも一方における初回の採取位置へのトレイ部材24の移動時に少なくとも異なる2方向の枠線を含む部分27を撮像して補正値を求める第1モードと、第1モードより高い頻度で補正値を求める第2モードとがある。ここでは、第1モードでは、CPU31は、初回のみ部品Pの採取位置の補正値を求め、その後はその補正値を繰り返し用いて部品Pを採取するものとする。また、第2モードでは、CPU31は、トレイ部材24がマガジン部21から引き出されるたびに毎回補正値を求め、その補正値で部品Pを採取するものとする。ステップS100では、作業者が予め選択したモードを実行用のモードに設定してもよいし、初期設定のモード(例えば第2モード)を実行用のモードに設定してもよい。この実施例では、初回の移動時に撮像するように記載されているが、補正値が求められればよくこれに限られるものではない。例えば、事前準備によって撮像してもよい。 When this routine is started, the CPU 31 of the control unit 30 sets a mode for correcting the position of the component P collected from the tray member 24 (step S100). In this mode, the correction value is obtained by imaging the portion 27 including at least two different frame lines when the tray member 24 is moved to the first collection position at least one of when starting new production and when replacing the tray. There are a first mode and a second mode in which correction values are obtained at a frequency higher than that of the first mode. Here, in the first mode, the CPU 31 obtains the correction value of the sampling position of the component P only for the first time, and thereafter, the component P is sampled by repeatedly using the correction value. In the second mode, the CPU 31 obtains a correction value each time the tray member 24 is pulled out from the magazine portion 21, and collects the component P with the correction value. In step S100, the mode selected in advance by the operator may be set as the execution mode, or the default mode (for example, the second mode) may be set as the execution mode. In this embodiment, it is described that imaging is performed at the time of the first movement, but it is only necessary to obtain a correction value, and the present invention is not limited to this. For example, you may image by prior preparation.
 次に、CPU31は、トレイユニットの部品Pを採取するか否かに基づいてトレイ部材24の引き出しがあるか否かを判定し(ステップS110)、トレイ部材24の引き出しがあるときには、該当するトレイ部材24を採取位置へ移動させる(ステップS120)。次に、CPU31は、該当するトレイ部材24は初回に引き出されるものであるか否かを判定する(ステップS130)。該当するトレイ部材24が初回の引き出しであるときには、CPU31は、トレイ部材24の3カ所の少なくとも異なる2方向の枠線を含む部分27をマークカメラ18で撮像する処理を行い(ステップS140)、撮像された画像の少なくとも異なる2方向の枠線を含む部分27の位置に基づいてトレイ部材24の位置と傾きと歪みとを補正する補正値を求める(ステップS150)。ここで、CPU31は、トレイ部材24の2カ所の少なくとも異なる2方向の枠線を含む部分27を撮像し、トレイ部材24の位置、傾きを補正する第1補正処理と、トレイ部材24の3カ所以上の少なくとも異なる2方向の枠線を含む部分27を撮像し、トレイ部材24の位置、傾き及び歪みを補正する第2補正処理とを実行する。ここでは、初回のトレイ部材24の引き出し時に第2補正処理を行い、同一のトレイ部材24の2回目以降の引き出しでは第1補正処理を実行するよう設定されているものとする。少なくとも異なる2方向の枠線を含む部分27の画像であれば、平面上の位置を取得することができる。枠線は、仕様によって枠線縦51、枠線横52、枠線斜め53の場合がある。 Next, the CPU 31 determines whether or not the tray member 24 is pulled out based on whether or not the component P of the tray unit is collected (step S110). The member 24 is moved to the collection position (step S120). Next, the CPU 31 determines whether or not the corresponding tray member 24 is pulled out for the first time (step S130). When the corresponding tray member 24 is the first drawer, the CPU 31 performs a process of imaging the portion 27 including at least two different frame lines in the three positions of the tray member 24 with the mark camera 18 (step S140). A correction value for correcting the position, inclination, and distortion of the tray member 24 is obtained based on the position of the portion 27 including the frame lines in at least two different directions in the image that has been obtained (step S150). Here, the CPU 31 captures at least two portions 27 of the tray member 24 including frame lines in two directions, and performs first correction processing for correcting the position and inclination of the tray member 24, and three locations of the tray member 24. The above-described second correction process for correcting the position, inclination, and distortion of the tray member 24 is performed by imaging the portion 27 including the frame lines in at least two different directions. Here, it is assumed that the second correction process is performed when the tray member 24 is pulled out for the first time, and the first correction process is performed when the same tray member 24 is pulled out for the second time and thereafter. If it is an image of the portion 27 including at least two different frame lines, the position on the plane can be acquired. Depending on the specifications, the frame line may be a frame line length 51, a frame line width 52, and a frame line slant 53.
 図4は、トレイ本体25の位置ずれを表す説明図である。図4以降において少なくとも異なる2方向の枠線を含む部分27は座標のポイントとして表す。図5は、トレイ本体25の傾きを表す説明図である。図6は、トレイ本体25の歪み(伸び)を表す説明図である。図4に示すように、トレイ本体25の位置ずれは、少なくとも異なる2方向の枠線を含む部分27の基準となる座標(図中点線)と撮像した画像の座標との差により求めることができる。トレイ本体25の位置ずれと同じように部品Pもずれることから、位置ずれの補正値は、トレイ本体25の位置ずれと同じように吸着ノズル17の位置をずらす値とすればよい。また、図5に示すように、トレイ本体25の傾きは、少なくとも2つの少なくとも異なる2方向の枠線を含む部分27を結ぶ直線の傾きにより求めることができる。傾きの補正値は、このトレイ本体25の傾きに合わせた位置ずれ量として求めることができる。更に、図6に示すように、トレイ本体25の歪みは、少なくとも2つの少なくとも異なる2方向の枠線を含む部分27を基準としたときに、3つ目の少なくとも異なる2方向の枠線を含む部分27がどのようにずれているかにより求めることができる。例えば、図6のように2点の距離が同じで、3点目の長さのみ異なる場合は、トレイ本体25が所定の割合で伸縮していることが検出できる。この場合は、その所定の割合を加味して吸着ノズル17の位置をずらす値を求めればよい。また、3つ目の少なくとも異なる2方向の枠線を含む部分27が左右方向にずれている場合は、トレイ本体25が左右方向に歪んでいる割合を求め、その割合を加味して吸着ノズル17の位置をずらす値を求めればよい。 FIG. 4 is an explanatory diagram showing the positional deviation of the tray main body 25. In FIG. 4 and subsequent figures, the portion 27 including at least two different frame lines is represented as a coordinate point. FIG. 5 is an explanatory diagram showing the inclination of the tray body 25. FIG. 6 is an explanatory diagram showing distortion (elongation) of the tray body 25. As shown in FIG. 4, the positional deviation of the tray body 25 can be obtained from the difference between the coordinates (dotted line in the figure) serving as a reference of the portion 27 including at least two different frame lines and the coordinates of the captured image. . Since the component P is displaced in the same manner as the positional deviation of the tray main body 25, the positional deviation correction value may be a value for shifting the position of the suction nozzle 17 in the same manner as the positional deviation of the tray main body 25. As shown in FIG. 5, the inclination of the tray body 25 can be obtained from the inclination of a straight line connecting at least two portions 27 including at least two frame lines in two different directions. The inclination correction value can be obtained as a positional deviation amount in accordance with the inclination of the tray body 25. Further, as shown in FIG. 6, the distortion of the tray body 25 includes the third at least two different directional frame lines when the portion 27 including at least two at least two different directional frame lines is used as a reference. It can be determined by how the portion 27 is displaced. For example, when the distance between the two points is the same as shown in FIG. 6 and only the length of the third point is different, it can be detected that the tray body 25 is expanded and contracted at a predetermined rate. In this case, what is necessary is just to obtain | require the value which shifts the position of the suction nozzle 17 in consideration of the predetermined ratio. When the third portion 27 including at least two different frame lines is shifted in the left-right direction, a ratio of the tray body 25 being distorted in the left-right direction is obtained, and the suction nozzle 17 is added with the ratio. What is necessary is just to obtain | require the value which shifts the position of.
 ステップS150のあと、CPU31は、その補正値を記憶すると共に、その補正値を用いて部品を実装ユニット13に採取させる(ステップS240)。トレイ本体25の位置、傾き及び歪みを補正しているため、部品Pを的確な位置で採取することができる。次に、CPU31は、次に採取する部品Pがあるか否かを判定し(ステップS250)、次に採取する部品Pがあるときには、その部品Pが他のトレイ部材24にあるか否かを判定する(ステップS260)。他のトレイ部材24にはないとき、即ち、現在採取位置にあるトレイ部材24から部品Pを採取する場合であるときには、CPU31は、現在の補正値を用い、ステップS240以降の処理を実行する。一方、ステップS260で次に採取する部品Pが他のトレイ部材24にあるときには、CPU31は、現在採取位置にあるトレイ部材24を初期位置へ移動させ(ステップS270)、ステップS120以降の処理を実行する。即ち、CPU31は、ステップS120で、該当するトレイ部材24を採取位置へ移動させ、ステップS130で初回引き出しであるか否かを判定する。 After step S150, the CPU 31 stores the correction value and causes the mounting unit 13 to collect a component using the correction value (step S240). Since the position, inclination, and distortion of the tray body 25 are corrected, the component P can be collected at an accurate position. Next, the CPU 31 determines whether or not there is a component P to be collected next (step S250). When there is a component P to be collected next, whether or not the component P is in another tray member 24 is determined. Determination is made (step S260). When there is no other tray member 24, that is, when the component P is collected from the tray member 24 at the current collection position, the CPU 31 executes the processing after step S240 using the current correction value. On the other hand, when the part P to be collected next is in the other tray member 24 in step S260, the CPU 31 moves the tray member 24 currently in the collection position to the initial position (step S270), and executes the processing after step S120. To do. That is, the CPU 31 moves the corresponding tray member 24 to the collection position in step S120, and determines whether or not it is the first withdrawal in step S130.
 該当するトレイ部材24が初回引き出しでないとき、即ち、同一のトレイ部材24での2回目以降の引き出しであるときには、CPU31は、現在の設定モードが何であるかを判定する(ステップS160)。現在の設定が第2モードであるときには、トレイ部材24の引き出しのたびに、第1補正処理で補正値を求めるものとして、CPU31は、少なくとも異なる2方向の枠線を含む部分27の2カ所を撮像し(ステップS170)、トレイ本体25の位置、傾きの補正値を算出する(ステップS180)。なお、歪みの補正値は、初回に求めた値を繰り返し用いるものとしてもよい。 When the corresponding tray member 24 is not the first drawer, that is, when it is the second or subsequent drawer with the same tray member 24, the CPU 31 determines what the current setting mode is (step S160). When the current setting is the second mode, the CPU 31 obtains a correction value by the first correction process every time the tray member 24 is pulled out, and the CPU 31 determines at least two portions 27 of the portion 27 including the frame lines in two different directions. An image is taken (step S170), and a correction value for the position and tilt of the tray body 25 is calculated (step S180). Note that the distortion correction value may be obtained by repeatedly using the value obtained for the first time.
 次に、CPU31は、求めた補正値が所定の許容範囲内で継続しているか否かを判定する(ステップS190)。この判定は、毎回補正値を求める必要があるかを判定するものである。例えば、複数回求めた補正値の変動がほとんどない場合、トレイ本体25は、位置ずれや傾きなどがある場合であっても、その状態から更にずれることなく固定されているといえる。この場合は、一度求めた補正値を繰り返し用いても、実装ユニット13は、部品Pの吸着位置精度を確保できる。ここで、「所定の許容範囲」は、例えば、補正値が変動していないと見なせる範囲として経験的に求めた範囲としてもよく、例えば、±10%の変動範囲などとすることができる。また、「継続」とは、例えば、連続3回や、連続5回などに経験的に定めるものとしてもよい。そして、求めた補正値が所定の許容範囲内で継続していないときには、そのままステップS240以降の処理を実行する。一方、求めた補正値が所定の許容範囲内で継続しているときには、CPU31は、補正値を求める頻度の低い第1モードへ移行して(ステップS200)、ステップS240以降の処理を実行する。 Next, the CPU 31 determines whether or not the obtained correction value is continued within a predetermined allowable range (step S190). This determination determines whether it is necessary to obtain a correction value every time. For example, when there is almost no variation in the correction value obtained a plurality of times, it can be said that the tray body 25 is fixed without further deviation from the state even when there is a positional deviation or an inclination. In this case, the mounting unit 13 can secure the suction position accuracy of the component P even if the correction value obtained once is repeatedly used. Here, the “predetermined allowable range” may be, for example, a range empirically obtained as a range in which the correction value can be regarded as not fluctuating, and may be a variation range of ± 10%, for example. Further, “continuation” may be determined empirically, for example, three times continuously or five times continuously. Then, when the obtained correction value does not continue within the predetermined allowable range, the processing after step S240 is executed as it is. On the other hand, when the obtained correction value continues within the predetermined allowable range, the CPU 31 shifts to the first mode in which the correction value is obtained less frequently (step S200), and executes the processes after step S240.
 一方、ステップS160で設定モードが第1モードであるときには、部品Pの採取位置ずれ情報を取得する(ステップS210)。採取位置ずれ情報は、部品Pを吸着ノズル17で採取したときの部品Pと吸着ノズル17との位置ずれ量を含む。この採取位置ずれは、ステップS240で部品Pを吸着ノズル17で採取したのち、パーツカメラ19でその状態を撮像することにより求めることができる。この位置ずれ情報は、例えば、この判定が先に行われてからの上記のように求めた採取位置ずれ量を複数含むものとしてもよい。続いて、CPU31は、部品Pの採取位置ずれ量が許容範囲外であるか否かを判定する(ステップS220)。この「許容範囲」は、例えば、採取位置ずれがあっても部品Pの実装に影響が少ないとみなせる範囲として経験的に定めたものとしてもよい。部品Pの採取位置ずれ量が許容範囲内であるときには、CPU31は、そのままステップS240以降の処理を実行する。一方、部品Pの採取位置ずれ量が許容範囲外であるときには、CPU31は、トレイ本体25の位置補正の精度を高めるべく、第2モードへ移行して(ステップS230)、ステップS240以降の処理を実行する。そして、ステップS250で、次の部品がないとき、即ち全ての部品を供給し終えたときには、CPU31は、このルーチンを終了する。 On the other hand, when the setting mode is the first mode in step S160, the sampling position deviation information of the component P is acquired (step S210). The collection position deviation information includes the amount of positional deviation between the component P and the suction nozzle 17 when the part P is collected by the suction nozzle 17. The sampling position deviation can be obtained by capturing the part P with the suction nozzle 17 in step S240 and then imaging the state with the parts camera 19. This misregistration information may include, for example, a plurality of sampling misregistration amounts obtained as described above after this determination is made first. Subsequently, the CPU 31 determines whether or not the sampling position deviation amount of the component P is outside the allowable range (step S220). This “allowable range” may be determined empirically as, for example, a range that can be regarded as having little influence on the mounting of the component P even if there is a sampling position deviation. When the amount of deviation of the sampling position of the component P is within the allowable range, the CPU 31 directly executes the processes after step S240. On the other hand, when the sampling position deviation amount of the component P is out of the allowable range, the CPU 31 shifts to the second mode (step S230) to perform the processing after step S240 in order to increase the accuracy of the position correction of the tray body 25. Execute. In step S250, when there is no next part, that is, when all parts have been supplied, the CPU 31 ends this routine.
 ここで、本実施形態の構成要素と本発明の構成要素との対応関係を明らかにする。本実施形態のトレイ部材24がトレイ部材に相当し、少なくとも異なる2方向の枠線を含む部分27が少なくとも異なる2方向の枠線を含む部分に相当し、マークカメラ18が撮像部に相当し、制御部30が制御部に相当し、実装ユニット13が採取部に相当する。 Here, the correspondence between the components of the present embodiment and the components of the present invention will be clarified. The tray member 24 of the present embodiment corresponds to a tray member, the portion 27 including at least two different frame lines corresponds to a portion including at least two different frame lines, the mark camera 18 corresponds to an imaging unit, The control unit 30 corresponds to the control unit, and the mounting unit 13 corresponds to the sampling unit.
 以上説明した本実施形態の制御部30は、トレイ部材24の少なくとも初回の採取位置への移動時に少なくとも異なる2方向の枠線を含む部分27を撮像し撮像された画像の少なくとも異なる2方向の枠線を含む部分27の位置に基づいて部品Pの採取位置を補正する補正値を求める第1モードを実行する。また、制御部30は、トレイ部材24の採取位置への移動時に少なくとも異なる2方向の枠線を含む部分27を撮像し撮像された画像の少なくとも異なる2方向の枠線を含む部分27の位置に基づいて部品Pの採取位置を補正する補正値を第1モードより高い頻度で求める第2モードを実行する。この装置では、第2モードを実行することによって部品Pの採取をより高精度に行い、あるいは第1モードを実行することによって部品Pの採取をより高効率に行うことができる。また、第1モードは、新規生産開始時及びトレイ交換時のうち少なくとも一方におけるトレイ部材24の採取位置への初回移動時に補正値を求めるモードである。実装装置11では、新規生産開始時やトレイ交換後の再開時に求めた補正値を用いて、その後の部品採取を行うことができるため、部品Pの採取をより高効率に行うことができる。 The control unit 30 of the present embodiment described above captures the portion 27 including at least two different frame lines when the tray member 24 is moved to at least the first sampling position, and at least two different frames of the captured image. A first mode for obtaining a correction value for correcting the sampling position of the part P based on the position of the portion 27 including the line is executed. In addition, the control unit 30 captures an image of the portion 27 including at least two different frame lines when the tray member 24 is moved to the collection position, and at the position of the portion 27 including at least two different frame lines of the captured image. Based on the second mode, the correction value for correcting the sampling position of the component P is calculated more frequently than in the first mode. In this apparatus, the part P can be collected with higher accuracy by executing the second mode, or the part P can be collected with higher efficiency by executing the first mode. The first mode is a mode for obtaining a correction value when the tray member 24 is moved to the collection position for the first time at least one of when starting new production and when replacing the tray. Since the mounting apparatus 11 can perform subsequent component collection using the correction value obtained at the start of new production or at the time of restart after tray replacement, the component P can be collected more efficiently.
 更に、制御部30は、第2モードにおいて求めた補正値が所定の許容範囲内で継続されたときには、第2モードから第1モードへ移行するため、この装置では、補正値が継続的に許容範囲内にある、即ちトレイ部材24の位置ずれ変動が小さい場合には、実行頻度の低い第1モードを行うことにより、高精度な部品Pの採取を維持しつつ、部品Pの採取をより高効率に行うことができる。更にまた、制御部30は、トレイ部材24に収容された部品Pを採取する実装ユニット13が採取した部品Pの位置ずれの情報(採取位置ずれ情報)を取得し、位置ずれ量が所定の許容範囲外にあるときには、第1モードから第2モードへ移行する。この装置では、第1モードにおいて、採取した部品Pの位置ずれが許容範囲外にあるとき、即ち部品の位置ずれが大きいときに第2モードへ変更するため、部品の採取をより高精度に行うことができる。そして、制御部30は、第2モードではトレイ部材24が採取位置へ至るたびに毎回補正値を求めるため、部品Pの採取を更に高精度に行うことができる。 Further, the control unit 30 shifts from the second mode to the first mode when the correction value obtained in the second mode is continued within a predetermined allowable range. If it is within the range, that is, if the positional deviation variation of the tray member 24 is small, by performing the first mode that is executed less frequently, the sampling of the component P can be further increased while maintaining the sampling of the component P with high accuracy. Can be done efficiently. Furthermore, the control unit 30 acquires positional deviation information (collecting positional deviation information) of the component P collected by the mounting unit 13 that collects the component P accommodated in the tray member 24, and the positional deviation amount is a predetermined tolerance. When it is out of range, the first mode is shifted to the second mode. In this apparatus, in the first mode, when the misalignment of the collected component P is outside the allowable range, that is, when the misalignment of the component is large, the mode is changed to the second mode. be able to. And since the control part 30 calculates | requires a correction value every time the tray member 24 arrives at a collection position in 2nd mode, it can collect | collect the components P with still higher precision.
 また、制御部30は、トレイ部材24の2カ所の少なくとも異なる2方向の枠線を含む部分27を撮像し撮像された画像の少なくとも異なる2方向の枠線を含む部分27の位置に基づいてトレイ部材24の位置と傾きとを補正する補正値を求める第1補正処理を実行する。また、制御部30は、トレイ部材24の3カ所以上の少なくとも異なる2方向の枠線を含む部分27を撮像し撮像された画像の少なくとも異なる2方向の枠線を含む部分27の位置に基づいてトレイ部材24の位置と傾きと歪みとを補正する補正値を求める第2補正処理を実行する。この装置では、2カ所の少なくとも異なる2方向の枠線を含む部分27を用いる第1補正処理を行うことによって部品の採取をより高効率に行う一方、3カ所以上の少なくとも異なる2方向の枠線を含む部分27を用いてトレイ部材24の歪みまで補正する第2補正処理を行うことによって部品の採取をより高精度に行うことができる。更に、制御部30は、新規生産開始時及びトレイ交換時のうち少なくとも一方におけるトレイ部材24の採取位置への初回移動時に第2補正処理を実行し、その後、第1補正処理を実行する。この装置では、まずトレイ部材24の歪みまで補正するため、部品Pの採取をより高精度に行うことができ、それ以降は歪みの補正値の測定を省略するため部品Pの採取をより高効率に行うことができる。 Further, the control unit 30 images the portion 27 including at least two different frame lines in two positions of the tray member 24, and based on the position of the portion 27 including at least two different frame lines in the captured image. A first correction process for obtaining a correction value for correcting the position and inclination of the member 24 is executed. Further, the control unit 30 captures at least three portions 27 of the tray member 24 including at least two different frame lines, and based on the positions of the portions 27 including at least two different frame lines of the captured image. A second correction process for obtaining a correction value for correcting the position, inclination, and distortion of the tray member 24 is executed. In this apparatus, parts are collected more efficiently by performing the first correction process using the portions 27 including at least two different two-direction frame lines, while at least three different two-direction frame lines are obtained. By performing the second correction process for correcting even the distortion of the tray member 24 using the portion 27 including the part, it is possible to collect parts with higher accuracy. Further, the control unit 30 executes the second correction process at the first movement of the tray member 24 to the collection position at least one of the start of new production and the tray replacement, and then executes the first correction process. In this apparatus, since the distortion of the tray member 24 is first corrected, the part P can be sampled with higher accuracy. After that, the measurement of the distortion correction value is omitted, and the part P can be collected more efficiently. Can be done.
 なお、本発明は上述した実施形態に何ら限定されることはなく、本発明の技術的範囲に属する限り種々の態様で実施し得ることはいうまでもない。 It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.
 例えば上述した実施形態では、第1モードと第2モードとを補正値の変動と採取位置ずれ量などに基づいて切り替えるものとしたが、特にこれに限定されず、他のパラメータに応じてモードを切り替えるものとしてもよい。また、作業者の設定に基づいて第1モード及び第2モードのいずれかを実行するものとしてもよい。また、第1モードは、初回のトレイ本体25の移動時にのみ補正値を求めるモードとしたが、第2モードよりも頻度が低ければ、2回以降も定期的に補正値を求めるものとしてもよい。同様に、第2モードは、トレイ部材24がマガジン部21から引き出されるたびに毎回補正値を求めるものとしたが、第1モードよりも頻度が高ければ、定期的に補正値を求めない場合があってもよい。また、制御部30は、第1モードにおいて、求めた補正値が所定の許容範囲外で継続されたときには、第1モードから第2モードへ移行するものとしてもよい。この装置では、補正値が継続的に許容範囲内にない、即ちトレイ部材24の位置ずれ変動が大きい場合には実行頻度の高い第2モードを行うため、部品Pの採取をより高精度に行うことができる。 For example, in the above-described embodiment, the first mode and the second mode are switched based on the variation of the correction value, the sampling position deviation amount, and the like. However, the present invention is not particularly limited thereto, and the mode is changed according to other parameters. It is good also as what switches. Moreover, it is good also as what performs either 1st mode and 2nd mode based on a worker's setting. The first mode is a mode for obtaining the correction value only when the tray body 25 is moved for the first time. However, if the frequency is lower than that of the second mode, the correction value may be obtained periodically after the second mode. . Similarly, in the second mode, the correction value is obtained every time the tray member 24 is pulled out from the magazine portion 21, but if the frequency is higher than in the first mode, the correction value may not be obtained periodically. There may be. Further, the control unit 30 may shift from the first mode to the second mode when the obtained correction value is continued outside the predetermined allowable range in the first mode. In this apparatus, when the correction value is not continuously within the allowable range, that is, when the positional deviation variation of the tray member 24 is large, the second mode having a high execution frequency is performed, so that the part P is collected with higher accuracy. be able to.
 上述した実施形態では、特に説明しなかったが、例えば、制御部30は、トレイ本体25に収容された部品Pの情報を取得しその部品Pが所定の高精度位置を要する部品であるときには第2モードを実行するものとしてもよい。この装置では、高精度位置を要する部品に対しては、部品Pの採取をより高精度に行うことができる。ここで「高精度位置を要する部品」とは、例えば、先に配置された部品上へ配置される部品や、狭隣接した部品などが挙げられる。 Although not specifically described in the above-described embodiment, for example, the control unit 30 acquires information on the component P accommodated in the tray main body 25, and when the component P is a component that requires a predetermined high-precision position, for example. Two modes may be executed. In this apparatus, the part P can be collected with higher accuracy for a part that requires a high-accuracy position. Here, “parts that require a high-precision position” include, for example, parts that are placed on parts that have been placed first, parts that are narrowly adjacent, and the like.
 上述した実施形態では、特に説明しなかったが、例えば、制御部30は、トレイ部材24に収容された部品Pの情報を取得しこの部品Pが所定の高精度位置を要する部品であるときには第2補正処理を実行するものとしてもよい。この装置では、高精度位置を要する部品に対しては、部品Pの採取をより高精度に行うことができる。 Although not specifically described in the above-described embodiment, for example, the control unit 30 acquires information on the component P accommodated in the tray member 24, and when the component P is a component that requires a predetermined high-precision position, Two correction processes may be executed. In this apparatus, the part P can be collected with higher accuracy for a part that requires a high-accuracy position.
 上述した実施形態では、初回のトレイ部材24の引き出し時に第2補正処理を行い、同一のトレイ部材24における2回目以降の引き出し時には第1補正処理を行うものとしたが、特にこれに限定されない。例えば、制御部30は、第2補正処理を継続中に、求めた歪みの補正値が所定の許容範囲内で継続されたときには、第2補正処理から第1補正処理の継続へ移行するものとしてもよい。この装置では、トレイ部材24の歪みの変動が許容範囲内ではその補正を省略するため、部品Pの採取をより高効率に行うことができる。ここで、「第2補正処理を継続中」とは、第2補正処理をトレイ部材が移動するたびに行う連続的な継続を含むほか、所定回数おきや所定時間経過後に行う断続的な継続をも含む。また、「所定の許容範囲」は、例えば、補正値が変動していないと見なせる範囲として経験的に求めた範囲としてもよく、例えば、±10%の変動範囲などとすることができる。また、制御部30は、トレイ部材24に収容された部品Pを採取する実装ユニット13が採取した部品Pの採取位置ずれ情報を取得し、位置ずれ量が所定の許容範囲外にあるときには、第1補正処理から第2補正処理の継続へ移行するものとしてもよい。この装置では、採取した部品Pの位置ずれが許容範囲外にあるとき、即ち部品Pの位置ずれが大きいときにトレイ部材24の歪みまで補正する第2補正処理を継続するため、部品Pの採取をより高精度に行うことができる。 In the above-described embodiment, the second correction process is performed when the tray member 24 is pulled out for the first time, and the first correction process is performed when the same tray member 24 is pulled out for the second time or later. However, the present invention is not limited to this. For example, the control unit 30 shifts from the second correction process to the continuation of the first correction process when the obtained distortion correction value is continued within a predetermined allowable range while continuing the second correction process. Also good. In this apparatus, the correction of the variation of the distortion of the tray member 24 is omitted within an allowable range, so that the part P can be collected more efficiently. Here, “continuing the second correction process” includes continuous continuation that is performed each time the tray member moves, and intermittent continuation that is performed every predetermined number of times or after a predetermined time has elapsed. Including. Further, the “predetermined allowable range” may be, for example, a range empirically obtained as a range in which the correction value can be regarded as not fluctuating, and may be a variation range of ± 10%, for example. Further, the control unit 30 acquires the sampling position deviation information of the component P collected by the mounting unit 13 that samples the component P accommodated in the tray member 24, and when the positional deviation amount is outside the predetermined allowable range, The process may be shifted from the first correction process to the continuation of the second correction process. In this apparatus, when the misalignment of the collected component P is outside the allowable range, that is, when the misalignment of the component P is large, the second correction process for correcting the distortion of the tray member 24 is continued. Can be performed with higher accuracy.
 上述した実施形態では、第2モードのとき第2補正処理を行い、第1モードのとき第1補正処理を行う組み合わせをメインとしたが、特にこれに限定されない。例えば、第1モードで第2補正処理を行う、第2モードで第1補正処理を行うなど、様々に組み合わせてもよい。 In the embodiment described above, the main combination is to perform the second correction process in the second mode and perform the first correction process in the first mode, but is not particularly limited thereto. For example, the second correction process may be performed in the first mode, and the first correction process may be performed in the second mode.
 上述した実施形態では、第1モード及び第2モードの切り替え、第1補正処理及び第2補正処理の切り替えの両方を行うものとしたが特にこれに限定されず、いずれか一方の切り替えを省略してもよい。こうしても、部品Pの採取をより高精度に行い、あるいは部品Pの採取をより高効率に行うことができる。あるいは、上述した実施形態では、第1モード及び第2モードを有するものとしたが、いずれか一方を有さないものとしてもよい。また、上述した実施形態では、第1補正処理及び第2補正処理を有するものとしたが、いずれか一方を有さないものとしてもよい。具体的には、例えば、制御部30は、トレイ部材24の少なくとも初回の採取位置への移動時に少なくとも異なる2方向の枠線を含む部分27を撮像し撮像された画像の少なくとも異なる2方向の枠線を含む部分27の位置に基づいて部品Pの採取位置を補正する補正値を求めるモード(第1モード)を、トレイ部材24の3カ所以上の少なくとも異なる2方向の枠線を含む部分27を撮像し撮像された画像の少なくとも異なる2方向の枠線を含む部分27の位置に基づいてトレイ部材24の位置と傾きと歪みとを補正する補正値を求める補正処理(第2補正処理)により実行するものとしてもよい。この装置では、第1モードによって高効率に、第2補正処理によって高精度に部品Pの採取を行うことができる。 In the above-described embodiment, both the switching between the first mode and the second mode and the switching between the first correction process and the second correction process are performed. However, the present invention is not particularly limited to this, and either switching is omitted. May be. Even in this case, the part P can be collected with higher accuracy, or the part P can be collected with higher efficiency. Alternatively, in the above-described embodiment, the first mode and the second mode are provided, but either one may not be provided. In the above-described embodiment, the first correction process and the second correction process are included. However, either one may be omitted. Specifically, for example, the control unit 30 captures the portion 27 including at least two different frame lines when the tray member 24 moves to at least the first sampling position, and at least two different frame frames of the captured image. A mode (first mode) for obtaining a correction value for correcting the sampling position of the part P based on the position of the part 27 including the line is used. The part 27 including at least three different frame lines of the tray member 24 is used. Performed by a correction process (second correction process) for obtaining a correction value for correcting the position, inclination, and distortion of the tray member 24 based on the position of the portion 27 including at least two different frame lines of the captured image. It is good also as what to do. In this apparatus, the component P can be sampled with high efficiency by the first mode and with high accuracy by the second correction process.
 上述した実施形態では、第2補正処理では3カ所の少なくとも異なる2方向の枠線を含む部分27を用いるものとしたが、3カ所以上であれば、特に限定されない。なお、実装装置11では撮像箇所が増えると撮像時間や解析時間が長くなるため、高精度ではあるが時間を要する実装処理になる。 In the above-described embodiment, the second correction process uses the portions 27 including at least three different two-direction frame lines in the second correction process, but there are no particular limitations as long as there are three or more locations. In addition, in the mounting apparatus 11, when the number of imaging locations increases, the imaging time and the analysis time become longer.
 上述した実施形態では、補正値を求める処理の頻度を変更するものとしたが、例えば、補正値の変動が所定の補正不要な範囲内であるときには、補正自体を省略してもよい。この装置では、補正を省略して部品Pの採取をより高効率に行うことができる。 In the above-described embodiment, the frequency of the process for obtaining the correction value is changed. However, for example, when the fluctuation of the correction value is within a predetermined correction unnecessary range, the correction itself may be omitted. In this apparatus, correction can be omitted and the part P can be collected more efficiently.
 上述した実施形態では、実装装置11として説明したが、特にこれに限定されず、実装方法としてもよいし、それを実行するプログラムとしてもよい。なお、この実装方法において、上述した実装装置の種々の態様を採用してもよいし、また、上述した実装装置の各機能を実現するようなステップを追加してもよい。 In the above-described embodiment, the mounting apparatus 11 has been described. However, the mounting apparatus 11 is not particularly limited thereto, and may be a mounting method or a program for executing the mounting method. In this mounting method, various aspects of the mounting device described above may be adopted, and steps for realizing each function of the mounting device described above may be added.
 本発明は、電子部品の実装分野に利用可能である。 The present invention can be used in the field of mounting electronic components.
10 実装システム、11 実装装置、12 基板搬送ユニット、13 実装ユニット、15 ヘッド移動部、16 実装ヘッド、17 吸着ノズル、18 マークカメラ、19 パーツカメラ、20 部品供給ユニット、21 マガジン部、23 パレット、24 トレイ部材、25 トレイ本体、26 固定部材、27 少なくとも異なる2方向の枠線を含む部分、30 制御部、31 CPU、32 記憶部、40 管理PC、51 枠線縦、52 枠線横、53 枠線斜め、P 部品、S 基板。 10 mounting system, 11 mounting device, 12 substrate transport unit, 13 mounting unit, 15 head moving unit, 16 mounting head, 17 suction nozzle, 18 mark camera, 19 part camera, 20 component supply unit, 21 magazine unit, 23 pallet, 24 tray members, 25 tray body, 26 fixing members, 27 parts including at least two different frame lines, 30 control unit, 31 CPU, 32 storage unit, 40 management PC, 51 frame vertical, 52 frame horizontal, 53 Frame diagonal, P component, S substrate.

Claims (16)

  1.  部品を採取して実装処理する実装装置であって、
     少なくとも異なる2方向の枠線を含む部分を複数の位置に有し部品を収容して収容位置と採取位置との間で移動するトレイ部材と、
     前記少なくとも異なる2方向の枠線を含む部分を撮像する撮像部と、
     前記トレイ部材の前記採取位置への移動時に前記少なくとも異なる2方向の枠線を含む部分を撮像し撮像された画像の前記少なくとも異なる2方向の枠線を含む部分の位置に基づいて前記部品の採取位置を補正する補正値を求めるモードを実行する制御部と、
     を備えた実装装置。
    A mounting device that collects and processes parts,
    A tray member that has at least a plurality of portions including two-direction frame lines at a plurality of positions, accommodates components, and moves between a storage position and a sampling position;
    An imaging unit for imaging a portion including the frame line in at least two different directions;
    When the tray member moves to the sampling position, the part including at least two different direction frame lines is imaged, and the part is sampled based on the position of the part including the at least two different direction frame lines. A control unit that executes a mode for obtaining a correction value for correcting the position;
    Mounting device.
  2.  部品を採取して実装処理する実装装置であって、
     少なくとも異なる2方向の枠線を含む部分を複数の位置に有し部品を収容して収容位置と採取位置との間で移動するトレイ部材と、
     前記少なくとも異なる2方向の枠線を含む部分を撮像する撮像部と、
     前記トレイ部材の少なくとも初回の前記採取位置への移動時に前記少なくとも異なる2方向の枠線を含む部分を撮像し撮像された画像の前記少なくとも異なる2方向の枠線を含む部分の位置に基づいて前記部品の採取位置を補正する補正値を求める第1モードと、前記トレイ部材の採取位置への移動時に前記少なくとも異なる2方向の枠線を含む部分を撮像し撮像された画像の前記少なくとも異なる2方向の枠線を含む部分の位置に基づいて前記部品の採取位置を補正する補正値を前記第1モードより高い頻度で求める第2モードと、のいずれかを実行する制御部と、
     を備えた実装装置。
    A mounting device that collects and processes parts,
    A tray member that has at least a plurality of portions including two-direction frame lines at a plurality of positions, accommodates components, and moves between a storage position and a sampling position;
    An imaging unit for imaging a portion including the frame line in at least two different directions;
    Based on the position of the portion including the at least two different directions of the image of the imaged image of the portion including the at least two different directions of the frame when the tray member is moved to the sampling position at least for the first time. A first mode for obtaining a correction value for correcting the sampling position of the component, and at least two different directions of the image obtained by imaging a portion including the frame line in at least two different directions when the tray member is moved to the sampling position. A control unit that executes any one of the second mode for obtaining a correction value for correcting the sampling position of the part based on the position of the part including the frame line at a frequency higher than that of the first mode;
    Mounting device.
  3.  前記第1モードは、新規生産開始時及びトレイ交換時のうち少なくとも一方における前記トレイ部材の前記採取位置への初回移動時に前記補正値を求めるモードである、請求項2に記載の実装装置。 3. The mounting apparatus according to claim 2, wherein the first mode is a mode for obtaining the correction value when the tray member is first moved to the collection position at least one of when starting a new production and when replacing a tray.
  4.  前記制御部は、前記トレイ部材に収容された部品の情報を取得し該部品が高精度位置を要する部品であるときには前記第2モードを実行する、請求項2又は3に記載の実装装置。 4. The mounting apparatus according to claim 2, wherein the control unit acquires information on a component accommodated in the tray member and executes the second mode when the component is a component requiring a high-precision position.
  5.  前記制御部は、前記第2モードにおいて前記求めた前記補正値が所定の許容範囲内で継続されたときには、前記第2モードから前記第1モードへ移行する、請求項2~4のいずれか1項に記載の実装装置。 5. The control unit according to claim 2, wherein the control unit shifts from the second mode to the first mode when the obtained correction value is continued within a predetermined allowable range in the second mode. The mounting device according to the item.
  6.  前記制御部は、前記トレイ部材に収容された部品を採取する採取部が採取した該部品の位置ずれの情報を取得し、位置ずれ量が所定の許容範囲外にあるときには、前記第1モードから前記第2モードへ移行する、請求項2~5のいずれか1項に記載の実装装置。 The control unit obtains information on the positional deviation of the component collected by the sampling unit that collects the component accommodated in the tray member. When the positional deviation amount is outside a predetermined allowable range, the control unit starts from the first mode. The mounting apparatus according to any one of claims 2 to 5, which shifts to the second mode.
  7.  前記制御部は、前記第2モードでは前記トレイ部材が前記採取位置へ至るたびに前記補正値を求める、請求項2~6のいずれか1項に記載の実装装置。 The mounting device according to any one of claims 2 to 6, wherein the control unit obtains the correction value every time the tray member reaches the collection position in the second mode.
  8.  前記制御部は、前記トレイ部材の2カ所の前記少なくとも異なる2方向の枠線を含む部分を撮像し撮像された画像の前記少なくとも異なる2方向の枠線を含む部分の位置に基づいて前記トレイ部材の位置と傾きとを補正する補正値を求める第1補正処理と、前記トレイ部材の3カ所以上の前記少なくとも異なる2方向の枠線を含む部分を撮像し撮像された画像の前記少なくとも異なる2方向の枠線を含む部分の位置に基づいて前記トレイ部材の位置と傾きと歪みとを補正する補正値を求める第2補正処理と、のいずれかを実行する、請求項2~7のいずれか1項に記載の実装装置。 The control unit picks up images of the two portions of the tray member that include the at least two different frame lines, and based on the position of the portion of the captured image that includes the at least two different frame lines, the tray member A first correction process for obtaining a correction value for correcting the position and inclination of the image, and at least two different directions of the image obtained by imaging the portion including the frame lines in the at least two different directions at three or more locations on the tray member. 8. A second correction process for obtaining a correction value for correcting the position, inclination, and distortion of the tray member based on the position of the portion including the frame line. The mounting device according to the item.
  9.  部品を採取して実装処理する実装装置であって、
     少なくとも異なる2方向の枠線を含む部分を複数の位置に有し部品を収容して収容位置と採取位置との間で移動するトレイ部材と、
     前記少なくとも異なる2方向の枠線を含む部分を撮像する撮像部と、
     前記トレイ部材の2カ所の前記少なくとも異なる2方向の枠線を含む部分を撮像し撮像された画像の前記少なくとも異なる2方向の枠線を含む部分の位置に基づいて前記トレイ部材の位置と傾きとを補正する補正値を求める第1補正処理と、前記トレイ部材の3カ所以上の前記少なくとも異なる2方向の枠線を含む部分を撮像し撮像された画像の前記少なくとも異なる2方向の枠線を含む部分の位置に基づいて前記トレイ部材の位置と傾きと歪みとを補正する補正値を求める第2補正処理と、のいずれかを実行する制御部と、
     を備えた実装装置。
    A mounting device that collects and processes parts,
    A tray member that has at least a plurality of portions including two-direction frame lines at a plurality of positions, accommodates components, and moves between a storage position and a sampling position;
    An imaging unit for imaging a portion including the frame line in at least two different directions;
    The positions and inclinations of the tray member based on the positions of the portions including the frame lines in at least two different directions in the imaged image of the two portions of the tray member including the frame lines in at least two different directions. A first correction process for obtaining a correction value for correcting the image, and at least three portions of the tray member including the at least two different direction frame lines and including the at least two different direction frame lines of the captured image. A second correction process for obtaining a correction value for correcting the position, inclination, and distortion of the tray member based on the position of the part;
    Mounting device.
  10.  前記制御部は、新規生産開始時及びトレイ交換時のうち少なくとも一方における前記トレイ部材の採取位置への移動時に前記第2補正処理を実行し、その後、前記第1補正処理を実行する、請求項8又は9に記載の実装装置。 The said control part performs the said 2nd correction process at the time of the movement to the collection position of the said tray member in at least one at the time of a new production start and a tray replacement | exchange, and performs the said 1st correction process after that. The mounting apparatus according to 8 or 9.
  11.  前記制御部は、前記トレイ部材に収容された部品の情報を取得し該部品が高精度位置を要する部品であるときには前記第2補正処理を実行する、請求項8~10のいずれか1項に記載の実装装置。 The control unit according to any one of claims 8 to 10, wherein the control unit acquires information on a component accommodated in the tray member, and executes the second correction process when the component is a component requiring a high-precision position. The mounting apparatus described.
  12.  前記制御部は、前記第2補正処理を継続中に前記求めた歪みの補正値が所定の許容範囲内で継続されたときには、前記第2補正処理から前記第1補正処理の継続へ移行する、請求項8~11のいずれか1項に記載の実装装置。 The control unit shifts from the second correction process to the continuation of the first correction process when the obtained distortion correction value is continued within a predetermined allowable range while the second correction process is continued. The mounting apparatus according to any one of claims 8 to 11.
  13.  前記制御部は、前記トレイ部材に収容された部品を採取する採取部が採取した該部品の位置ずれの情報を取得し、位置ずれ量が所定の許容範囲外にあるときには、前記第1補正処理から前記第2補正処理の継続へ移行する、請求項8~12のいずれか1項に記載の実装装置。 The control unit acquires information on a positional deviation of the component collected by the sampling unit that samples the component accommodated in the tray member, and the first correction process when the positional deviation amount is outside a predetermined allowable range. The mounting apparatus according to any one of claims 8 to 12, which shifts from continuation to continuation of the second correction process.
  14.  前記制御部は、前記トレイ部材の少なくとも初回の前記採取位置への移動時に前記少なくとも異なる2方向の枠線を含む部分を撮像し撮像された画像の前記少なくとも異なる2方向の枠線を含む部分の位置に基づいて前記部品の採取位置を補正する補正値を求める第1モードを、前記トレイ部材の3カ所以上の前記少なくとも異なる2方向の枠線を含む部分を撮像し撮像された画像の前記少なくとも異なる2方向の枠線を含む部分の位置に基づいて前記トレイ部材の位置と傾きと歪みとを補正する補正値を求める補正処理により実行する、請求項2又は3に記載の実装装置。 The control unit picks up an image of a portion including the at least two different frame lines when the tray member moves to the sampling position at least for the first time, and includes a portion including the at least two different frame lines of the captured image. In a first mode for obtaining a correction value for correcting the sampling position of the part based on the position, at least the three or more portions of the tray member including the at least two different direction frame lines are captured and the captured image is at least The mounting apparatus according to claim 2, wherein the mounting apparatus is executed by a correction process for obtaining a correction value for correcting the position, inclination, and distortion of the tray member based on the position of a part including a frame line in two different directions.
  15.  少なくとも異なる2方向の枠線を含む部分を複数の位置に有し部品を収容して収容位置と採取位置との間で移動するトレイ部材を備え、部品を採取して実装処理する実装装置が実行する実装方法であって、
     前記トレイ部材の少なくとも初回の前記採取位置への移動時に前記少なくとも異なる2方向の枠線を含む部分を撮像し撮像された画像の前記少なくとも異なる2方向の枠線を含む部分の位置に基づいて前記部品の採取位置を補正する補正値を求める第1モードと、前記トレイ部材の採取位置への移動時に前記少なくとも異なる2方向の枠線を含む部分を撮像し撮像された画像の前記少なくとも異なる2方向の枠線を含む部分の位置に基づいて前記部品の採取位置を補正する補正値を前記第1モードより高い頻度で求める第2モードと、のいずれかを実行するステップ、
     を含む実装方法。
    Implemented by a mounting apparatus that includes a tray member that has at least a plurality of portions including two-direction frame lines, accommodates components, and moves between an accommodating position and a sampling position, and samples and mounts the components. Implementation method,
    Based on the position of the portion including the at least two different directions of the image of the imaged image of the portion including the at least two different directions of the frame when the tray member is moved to the sampling position at least for the first time. A first mode for obtaining a correction value for correcting the sampling position of the component, and at least two different directions of the image obtained by imaging a portion including the frame line in at least two different directions when the tray member is moved to the sampling position. Executing a second mode in which a correction value for correcting the sampling position of the part based on the position of the part including the frame line is determined more frequently than in the first mode;
    Implementation method including
  16.  少なくとも異なる2方向の枠線を含む部分を複数の位置に有し部品を収容して収容位置と採取位置との間で移動するトレイ部材を備え、部品を採取して実装処理する実装装置が実行する実装方法であって、
     前記トレイ部材の2カ所の前記少なくとも異なる2方向の枠線を含む部分を撮像し撮像された画像の前記少なくとも異なる2方向の枠線を含む部分の位置に基づいて前記トレイ部材の位置と傾きとを補正する第1補正処理と、前記トレイ部材の3カ所以上の前記少なくとも異なる2方向の枠線を含む部分を撮像し撮像された画像の前記少なくとも異なる2方向の枠線を含む部分の位置に基づいて前記トレイ部材の位置と傾きと歪みとを補正する第2補正処理と、のいずれかを実行するステップ、
     を含む実装方法。
    Implemented by a mounting apparatus that includes a tray member that has at least a plurality of portions including two-direction frame lines, accommodates components, and moves between an accommodating position and a sampling position, and samples and mounts the components. Implementation method,
    The positions and inclinations of the tray member based on the positions of the portions including the frame lines in at least two different directions in the imaged image of the two portions of the tray member including the frame lines in at least two different directions. A first correction process that corrects the image, and at least three positions of the tray member that include the at least two different direction frame lines, and at the position of the captured image that includes the at least two different direction frame lines. A step of performing any one of a second correction process for correcting the position, inclination and distortion of the tray member on the basis thereof;
    Implementation method including
PCT/JP2017/011871 2017-03-23 2017-03-23 Mounting device and mounting method WO2018173226A1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10335889A (en) * 1997-06-05 1998-12-18 Matsushita Electric Ind Co Ltd Method of positioning electronic component housing pallet and correcting position thereof
JP2003264396A (en) * 2002-01-29 2003-09-19 Tyco Electronics Corp Component setting method
JP2007324266A (en) * 2006-05-31 2007-12-13 Hitachi High-Tech Instruments Co Ltd Electronic component mounting apparatus

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1189436A (en) * 1997-01-28 1998-08-05 三星电子株式会社 Tray supplying apparatus
JP2000117592A (en) * 1998-10-12 2000-04-25 Yamagata Casio Co Ltd Part mounting device and part feeding device
DE60113152T2 (en) * 2000-12-12 2006-03-09 Matsushita Electric Industrial Co., Ltd., Kadoma MAGAZINE, COMPONENT FILING FEEDING DEVICE AND COMPONENT MOUNTING DEVICE
JP4041768B2 (en) * 2002-09-12 2008-01-30 松下電器産業株式会社 Component mounting head
JP4111160B2 (en) * 2004-03-26 2008-07-02 松下電器産業株式会社 Electronic component mounting apparatus and electronic component mounting method
JP4664752B2 (en) * 2005-06-30 2011-04-06 Juki株式会社 Component adsorption method and apparatus
JP4780047B2 (en) * 2007-06-19 2011-09-28 パナソニック株式会社 Component mounting apparatus and component collection method for component mounting apparatus
JP4750079B2 (en) * 2007-06-19 2011-08-17 パナソニック株式会社 Component mounting equipment
JP2011155052A (en) * 2010-01-26 2011-08-11 Hitachi High-Tech Instruments Co Ltd Method of indicating component pickup position and electronic component mounting apparatus
JP5573767B2 (en) * 2011-05-09 2014-08-20 パナソニック株式会社 Electronic component mounting system and mounting board manufacturing method in electronic component mounting system
KR102028743B1 (en) * 2011-10-07 2019-10-04 쥬키 가부시키가이샤 Electronic component mounting apparatus, and electronic component mounting method
JP5927497B2 (en) * 2012-06-08 2016-06-01 パナソニックIpマネジメント株式会社 Component mounting apparatus and component mounting method
EP3169146B1 (en) * 2014-07-10 2018-10-31 FUJI Corporation Method for producing component placement coordinates and device for producing component placement coordinates
JP6621991B2 (en) * 2015-01-16 2019-12-18 Juki株式会社 Electronic component supply device and electronic component mounting device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10335889A (en) * 1997-06-05 1998-12-18 Matsushita Electric Ind Co Ltd Method of positioning electronic component housing pallet and correcting position thereof
JP2003264396A (en) * 2002-01-29 2003-09-19 Tyco Electronics Corp Component setting method
JP2007324266A (en) * 2006-05-31 2007-12-13 Hitachi High-Tech Instruments Co Ltd Electronic component mounting apparatus

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