JP4911115B2 - Component mounter and image recognition method for component mounter - Google Patents

Description

  The present invention relates to a component mounter for moving a mounting head in a horizontal direction and mounting a component picked up by a component holding nozzle on a substrate positioned at a work position, and an image recognition method for the component mounter.

  The component mounting machine moves a mounting head in a horizontal direction and mounts a component picked up by a component holding nozzle on a substrate positioned at a work position. Since this nozzle is frequently replaced in accordance with the type of component to be mounted on the substrate, it can be easily attached to and detached from the mounting head.

In such a component mounting machine, when component mounting is performed by a mismounted nozzle, in addition to a decrease in mounting quality, there is a risk that the component and the board may be damaged. For this reason, there have been proposals for preventing nozzles from being mounted erroneously, and as one of them, a nozzle mark (for example, a QR mark) for individual identification is provided on the upper surface of a disk-like collar on the top of the nozzle. When mounting a nozzle on a mounting head, there is known a technique in which an image of a nozzle mark of a nozzle held on a nozzle holding base is recognized through a camera provided on the mounting head (Patent Document 1). . The camera used here is for imaging the board mark provided on the board for detecting the position of the board positioned at the work position, and the board to be positioned (that is, the board mark) is always at a constant high height. For this reason, a fixed focus type is generally used, and the board mark is attached at a position (height) where imaging can be performed within the depth of field, and the board mark image is always in focus. I am trying to do it.
JP 2006-351682 A

  However, the surface on which the nozzle mark of the nozzle held on the nozzle holding base is provided (the upper surface of the disk-shaped collar portion above the nozzle) is the surface on which the substrate mark of the substrate positioned at the working position is provided (the upper surface of the substrate). If you try to recognize the image by focusing not only on the board mark but also on the nozzle mark, you have to use an expensive focusing mechanism for the camera, There was a problem that the manufacturing cost increased accordingly.

  Therefore, the present invention can perform image recognition of both the substrate mark and the nozzle mark without using an expensive camera with a focusing mechanism, and can prevent erroneous nozzle mounting by identifying the individual nozzles. An object of the present invention is to provide a component mounter and an image recognition method for the component mounter.

The component mounter according to claim 1 is a component mounter for moving a mounting head having a component holding nozzle in a detachable manner in a horizontal direction and mounting a component picked up by the nozzle on a substrate positioned at a working position. A substrate mark for detecting the position of the substrate provided on the substrate, a nozzle mark for individual identification provided on the nozzle, a nozzle holding base for holding the nozzle mounted on the mounting head, and provided on the mounting head A fixed-focus camera that images the substrate mark of the substrate positioned at the work position and the nozzle mark of the nozzle held on the nozzle holder from above, and image recognition based on the image of the substrate mark captured by the camera In addition to detecting the position of the substrate, image recognition based on the nozzle mark image captured by the camera is performed to identify the individual nozzles. The board mark of the board positioned at the work position is located within the depth of field of the camera, and the nozzle mark of the nozzle held on the nozzle holder is outside the depth of field of the camera. The nozzle recognition unit is located in a region where a captured image of the nozzle mark that can be recognized by the image recognition unit is obtained , and the nozzle is installed above the substrate by the nozzle holding table. The nozzle mark held by the nozzle is positioned at a position relatively higher than the substrate mark of the substrate positioned at the working position, and the nozzle mark is a matrix composed of a combination of a plurality of small areas to which light and dark gradations are given. Is .

An image recognition method for a component mounting machine according to claim 2 , wherein a mounting head provided with a detachable component holding nozzle is moved in the horizontal direction, and the component picked up by the nozzle is mounted on a substrate positioned at a working position. In a component mounter, a fixed focus camera provided on the mounting head is used to hold a board mark for detecting the position of the board provided on the board positioned at the work position and a nozzle mounted on the mounting head. An image recognition method for a component mounter that images a nozzle mark for individual identification provided on a nozzle held on a table from above and recognizes the image of the board mark and the nozzle mark, and is a board positioned at a work position. The board mark is positioned within the depth of field of the camera, and the nozzle mark of the nozzle held on the nozzle holder is outside the depth of field of the camera. There are, by positioning in the area where the captured image is obtained of the nozzle mark capable of performing image recognition, have row image recognition of the board mark and the nozzle mark nozzle positions of the above the substrate by the nozzle holder The nozzle mark of the nozzle held on the nozzle holder is positioned at a position relatively higher than the substrate mark of the substrate positioned at the working position, and the nozzle mark is given light and dark gradations It is a matrix shape composed of a combination of a plurality of small regions .

  In the present invention, the substrate mark of the substrate positioned at the working position is within the depth of field of the camera and an in-focus image is obtained, while the nozzle mark of the nozzle held on the nozzle holder is Since it is outside the depth of field, an in-focus image cannot be obtained. However, although the image of the nozzle mark taken outside the depth of field of the camera is not in focus, the image recognition unit can perform image recognition based on that image. Image recognition of both marks can be performed. Therefore, according to the present invention, image recognition of both the substrate mark and the nozzle mark can be performed without using an expensive camera with a focusing mechanism (using an inexpensive fixed focus camera), and the nozzles are individually identified. By doing so, it is possible to prevent erroneous mounting of the nozzles.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of a component mounter according to an embodiment of the present invention, FIG. 2 is a front view of a mounting head provided in the component mounter according to an embodiment of the present invention, and FIG. 3 is an embodiment of the present invention. FIG. 4 is a block diagram showing a control system of the component mounter in one embodiment of the present invention, and FIG. 5 is a mount provided in the component mounter in one embodiment of the present invention. FIG. 6A and FIG. 6B are plan views of a nozzle holding table provided in a component mounting machine according to an embodiment of the present invention, and FIG. 7 is an embodiment of the present invention. It is a partial side view of the component mounting machine in.

In FIG. 1, the component mounting machine 1 is provided with a board transfer path 3 for transferring and positioning a board B on a base 2 in a certain horizontal direction (X-axis direction), and above the board transfer path 3. Is provided with a Y-axis table 4 extending in a direction (Y-axis direction) perpendicular to the transport direction (X-axis direction) of the substrate B by the substrate transport path 3. Two Y-axis sliders 5 are provided on the Y-axis table 4 so as to be movable along the Y-axis table 4 (that is, in the Y-axis direction), and each Y-axis slider 5 has an X-axis extending in the X-axis direction. One end of the table 6 is attached. Each X-axis table 6 is provided with a moving stage 7 that is movable along the X-axis table 6 (that is, in the X-axis direction), and each moving stage 7 is provided with a mounting head 8.

  In FIG. 2, each mounting head 8 is provided with a plurality of shaft members 9 extending downward in the vertical direction (Z-axis direction). A pair of locking pieces 10a is elastically held by a band 10b at the lower end portion of each shaft member 9, and the parts P (see FIG. 4) are adsorbed and held by the pair of locking pieces 10a. A holding nozzle 11 is detachably attached to the shaft member 9. The nozzle 11 may be one that holds the component P mechanically.

  In FIG. 3, each nozzle 11 includes a locked portion 11a, a disk-like flange portion 11b provided at the lower end of the locked portion 11a, and a nozzle main portion 11c provided extending downward from the lower surface of the flange portion 11b. The nozzle 11 is fixed to the shaft member 9 by fitting the lower end portions of the pair of locking pieces 10a into locking grooves 11d provided on the outer peripheral surface of the locked portion 11a.

  In FIG. 3, the nozzle mark 12 for individual identification of the nozzle 11 is provided on the upper surface of the flange portion 11 b of each nozzle 11. The nozzle mark 12 only needs to be suitable for image recognition. For example, the nozzle mark 12 is composed of a combination of a plurality of small areas to which light and dark gradations are given. In this embodiment, in order to facilitate high-speed image recognition with a simple shape, each internal region of a plurality of squares arranged in a 2 × 2 matrix is filled with black or white. For example, the cells may not be 2 × 2 and may not be a matrix. Further, not only black and white but also gray having an intermediate gradation may be added. Furthermore, the nozzle mark 12 may be formed by laser processing or the like, or may be formed by attaching a label.

  In FIG. 4, the component mounting machine 1 includes a board conveyance path driving mechanism 14 a that drives the board conveyance path 3, a Y axis slider moving mechanism 14 b that moves each Y axis slider 5 along the Y axis table 4, and each moving stage. A moving stage moving mechanism 14c for moving 7 along the X-axis table 6, a nozzle driving mechanism 14d for moving each shaft member 9 up and down individually (that is, each nozzle 11), and rotating about the vertical axis (Z-axis); A nozzle suction mechanism 14e that causes each nozzle 11 to perform the suction operation of the component P is provided.

  These substrate transport path drive mechanism 14a, Y-axis slider moving mechanism 14b, moving stage moving mechanism 14c, nozzle drive mechanism 14d, and nozzle suction mechanism 14e are controlled by a control device 15 (FIG. 3) provided in the component mounting machine 1. Thus, the substrate B is transported and positioned by the substrate transport path 3, the movement control of the mounting head 8, the raising / lowering, rotation, and suction control of each nozzle 11 is performed. The mounting head 8 is moved only in the horizontal direction by a combination of the movement of the Y-axis slider 5 in the Y-axis direction by the Y-axis slider moving mechanism 14b and the movement of the moving stage 7 in the X-axis direction by the moving stage moving mechanism 14c. The

In FIG. 1, a plurality of component supply devices 13 that supply a component P (FIG. 2) to the mounting head 8 are provided side by side in the X-axis direction in a side region in the Y-axis direction of the substrate transport path 3. The mounting head 8 is provided with a substrate camera 16 with the imaging surface facing downward (see also FIG. 2), and a component camera 17 with the imaging surface facing upward is provided on the base 2. Here, the substrate camera 16 is a fixed-focus camera that does not have a focusing mechanism, or does not function even if it has a focusing mechanism. The board camera 16 and the component camera 17 are imaged by the control device 15, and the image data obtained by the imaging of the board camera 16 and the image data obtained by the imaging of the component camera 17 are respectively an image recognition unit 15 a of the control device 15. (FIG. 4).

  1 and 5, a nozzle holding base 20 having a function of holding the replacement nozzle 11 in a standing posture and removing the nozzle 11 attached to the shaft member 9 is provided on the base 2. Yes. The nozzle holder 20 includes a base portion 22 supported in a horizontal posture by a plurality of legs 21 and a slide portion 23 provided on the upper surface side of the base portion 22. The slide part 23 is slidable in the horizontal direction with respect to the base part 22.

  The base portion 22 is provided with a plurality of nozzle insertion holes 22a (see the enlarged view shown in FIG. 5 and FIGS. 6A and 6B). The replacement nozzle 11 causes the nozzle main portion 11c to be inserted into the nozzle insertion hole 22a from above, and the collar portion 11b is held on the upper surface of the base portion 22 by the nozzle holder 20 in a standing posture. be able to.

  The slide portion 23 is a plate-like member, and is provided with a plurality of shutter grooves 23a extending in the slide direction with respect to the base portion 22 (here, the X-axis direction) (an enlarged view shown in FIG. 5 and FIG. 6). (See (a) and (b)). On the inner edge of each shutter groove 23a, there is provided a protruding portion 23b that protrudes horizontally inward (Y-axis direction) at regular intervals in the X-axis direction (intervals in which the nozzle insertion holes 22a are provided) (see FIG. 6 (a) and (b)). Each overhang portion 23b covers a part of the flange portion 11b of the nozzle 11 inserted into the nozzle insertion hole 22a from above in the state where the slide portion 23 is positioned at the “nozzle removal position” shown in FIG. In a state where the slide portion 23 is positioned at the “nozzle mounting position” shown in FIG. 6B, the slide portion 23 is positioned between the flange portions 11b of the two nozzles 11 inserted into the nozzle insertion holes 22a adjacent in the X-axis direction ( The flange 11b of the nozzle 11 is not covered from above).

  The slide unit 23 is driven to move between a “nozzle removal position” and a “nozzle mounting position” by a slide unit drive mechanism 18 (FIG. 4), the operation of which is controlled by the control device 15. It is fixed at either position at the “nozzle mounting position”. In a state where the slide portion 23 is fixed at the “nozzle removal position” by the control device 15, the nozzle 11 inserted into the nozzle insertion hole 22 a is partially covered by the protruding portion 23 b of the slide portion 23. Although it cannot be pulled upward from the insertion hole 22a, the nozzle 11 inserted into the nozzle insertion hole 22a can be pulled upward from the nozzle insertion hole 22a as it is when the slide portion 23 is fixed at the “nozzle mounting position”. it can.

  In FIG. 1, a substrate mark M for detecting the position of the substrate B is provided on the upper surface S <b> 1 (see also FIG. 7) of the substrate B, and the substrate B is conveyed into the component mounting machine 1 by the substrate conveyance path 3. Then, the image is taken from above by the substrate camera 16 whose operation is controlled by the control device 15. The image of the board mark M obtained by the imaging of the board camera 16 is sent to the image recognition unit 15a of the control device 15 for image recognition, and the difference (positional deviation) between the position where the board B is actually positioned and the reference position. ) Is required.

  On the other hand, the nozzle mark 12 is imaged from above by the substrate camera 16 with the nozzle 11 held by the nozzle holding unit 20. The image of the nozzle mark 12 obtained by the imaging of the substrate camera 16 is sent to the image recognition unit 15a of the control device 15 for image recognition, and based on the data stored in the storage unit 19 in advance, Collation with individual identification information is performed. Thereby, the control device 15 acquires the individual identification information of the nozzle 11 having the nozzle mark 12 from the nozzle mark 12 whose image has been recognized through the substrate camera 16.

In the present embodiment, as shown in FIG. 7, the nozzle 11 is installed at a position above the substrate B by the nozzle holding table 20, and therefore the nozzle mark of the nozzle 11 held on the nozzle holding table 20. 12 is provided (the upper surface S2 of the flange 11b of the nozzle 11).
It is located at a position (a position higher than the surface on which the substrate mark M is provided) at a height different from the surface (the upper surface S1 of the substrate B) on which the substrate mark M of the substrate B positioned at the work position is provided. Thereby, it is not necessary to lengthen the vertical stroke of the nozzle 11 for nozzle replacement, which is advantageous in terms of designing / manufacturing the component mounting machine 1, improving mounting accuracy, and shortening tact time during nozzle replacement.

  Since the mounting head 8 can move only in the horizontal direction as described above, the substrate camera 16 fixed to the mounting head 8 can also move only in the horizontal direction (arrow H shown in FIG. 7). Here, the substrate camera 16 has the imaging surface facing downward (the optical axis L), but since the substrate camera 16 is a fixed focus camera, all objects located directly below the substrate camera 16 are in focus. In this case, only an object within the depth of field (in the region I shown in FIG. 7) can be captured in a focused state, and the region outside the depth of field. An object located inside (in the region II or region III shown in FIG. 7) can be imaged only when it is out of focus.

  In the component mounter 1 according to the present embodiment, the board camera 16 can capture the board mark M of the board B positioned at a predetermined work position by the board transport path 3 within the depth of field (in the area I). Is provided. The substrate B positioned at the working position (that is, the substrate mark M) is always at a constant height, and the mounting head 8 moves only in the horizontal direction, so that the substrate camera 16 always focuses the substrate mark M. Images can be taken with the

  On the other hand, as described above, the surface on which the nozzle mark 12 of the nozzle 11 held on the nozzle holding base 20 is provided (the upper surface S2 of the flange portion 11b of the nozzle 11) is the substrate mark M of the substrate B positioned at the working position. (Specifically, the nozzle mark 12 of the nozzle 11 held on the nozzle holding base 20 is positioned at the working position). The nozzle mark 12 of the nozzle 11 held on the nozzle holder 20 cannot be positioned within the depth of field of the substrate camera 16, An image in which the nozzle mark 12 is in focus cannot be obtained. However, in this component mounter 1, the board camera 16 obtains an image (captured image of the nozzle mark 12) that can be recognized by the image recognition unit 15a, although the nozzle mark 12 is outside the depth of field. The nozzle mark 12 of each nozzle 11 held in the nozzle holding base 20 is located in a region (in the region II), and the nozzle mark 12 is slightly out of focus such that the image can be recognized although it is not in focus. Image recognition of the nozzle mark 12 is performed based on the image. Thereby, since it is not always necessary to adjust the focus of the nozzle mark 12, the degree of freedom in layout of the nozzle holding base 20, particularly in the vertical direction, is improved in designing the component mounter 1.

  In order to mount the component P on the board B by the component mounting machine 1, the control device 15 first drives the board transport path 3 and carries the board B transferred from the upstream apparatus into the component mounting machine 1. (The arrow A1 shown in FIG. 1), the substrate B is positioned at a predetermined work position. Then, the controller 15 moves the mounting head 8 above the substrate B, and causes the substrate camera 16 provided on the mounting head 8 to capture the substrate mark M, thereby obtaining a positional deviation from the reference position of the substrate B. . Here, as described above, since the substrate camera 16 is provided at a position where the substrate mark M of the substrate B positioned at the work position can be imaged within the depth of field (in the region I), the control device 15 Image recognition can be performed based on a clear image in which the substrate mark M is in focus, and the displacement of the substrate B from the reference position can be obtained with high accuracy.

When the positioning of the substrate B and the detection of the positional deviation are finished, the control device 15 moves the mounting head 8 above the component supply port (not shown) of the component supply device 13 and supplies the component supplied to the component supply port. P is picked up (sucked) by the nozzle 11 of the mounting head 8. When picking up the component P, the control device 15 lowers the shaft member 9 relative to the mounting head 8 so that the suction port at the lower end of the nozzle 11 contacts the component P from above.

  When the control device 15 causes the nozzle 11 to pick up the component P, the control device 15 moves the mounting head 8 so that the component P is positioned immediately above the component camera 17. Then, the component camera 17 recognizes (images) the component P, and obtains the positional deviation of the component P with respect to the nozzle 11.

  When the recognition of the picked-up component P is completed, the control device 15 moves the mounting head 8 above the substrate B, lowers the shaft member 9 (that is, the nozzle 11), and moves the component P to the target mounting position on the substrate B. (Fig. 2). When the component P is mounted on the substrate B, the control device 15 has a positional deviation from the reference position of the substrate B obtained when the substrate B is positioned, and a positional deviation of the component P with respect to the nozzle 11 obtained when the component P is recognized. The relative position of the nozzle 11 with respect to the substrate B is corrected so as to be corrected.

  When the control device 15 performs a series of processes from picking up the component P to mounting on the substrate B for all the components P, the control device 15 drives the substrate conveyance path 3 to bring the substrate B outside the component mounting machine 1. Unload (arrow A2 shown in FIG. 1).

  Next, a procedure for replacing the nozzle 11 in the component mounter 1 will be described. In order to remove the nozzle 11 attached to the shaft member 9 of the mounting head 8, the control device 15 moves the mounting head 8 above the nozzle holding base 20 and moves the slide portion 23 of the nozzle holding base 20 to the position shown in FIG. The shaft member 9 is lowered by aligning the vertical center axis of the nozzle 11 with the vertical center axis of the nozzle insertion hole 22a of the nozzle holding base 20 in a state where the nozzle mounting position is fixed. Then, after the nozzle 11 attached to the shaft member 9 is inserted into the nozzle insertion hole 22a of the base portion 22 from above, the slide portion 23 is moved to the nozzle removal position shown in FIG. Then, the shaft member 9 is pulled upward. Then, the flange portion 11b of the nozzle 11 contacts the lower surface of the slide portion 23 from below, and the nozzle 11 is prevented from moving upward integrally with the shaft member 9, so that the pair of engagements at the lower end of the shaft member 9 is prevented. The stop piece 10 a is separated from the locking groove 11 d of the nozzle 11, and the nozzle 11 is separated from the shaft member 9. As a result, the nozzle 11 remains on the nozzle holder 20 and the nozzle 11 is removed from the shaft member 9.

  On the other hand, in order to mount the replacement nozzle 11 held on the nozzle holder 20 to the mounting head 8 (shaft member 9), the shaft is made by aligning the vertical center axis of the nozzle 11 with the vertical center axis of the shaft member 9. The member 9 is lowered. As a result, the pair of locking pieces 10 a of the shaft member 9 abuts on the locked portion 11 a of the nozzle 11 from above and is spread outward, and then the lower end thereof is fitted into the locking groove 11 a of the nozzle 11. As a result, the nozzle 11 is coupled to the shaft member 9, so that the slide portion 23 is moved and fixed to the nozzle mounting position shown in FIG. 6B from this state, and the shaft member 9 may be pulled up as it is.

Here, when the control device 15 mounts the nozzle 11 held on the nozzle holding table 20 on the shaft member 9 of the mounting head 8, the image recognition of the nozzle mark 12 of the nozzle 11 held on the nozzle holding table 20 is performed. To identify the individual nozzles 11. Then, it is determined whether or not the nozzle 11 that has performed the image recognition is the correct nozzle 11 that is to be mounted. If the nozzle 11 is the correct nozzle 11, the mounting of the nozzle 11 to the mounting head 8 is executed. If the nozzle 11 is not correct, the mounting of the nozzle 11 to the mounting head 8 is not executed, and the operator is informed of it via the indicator 24 (FIG. 4) such as a display or buzzer provided in the component mounting machine 1. Inform the effect. Since the operator who has received this notification can take measures such as inspecting the nozzle 11 held on the nozzle holding base 20 and replacing it with the correct nozzle 11, the component mounter 1 is in a state where the nozzle 11 is incorrectly installed. The situation of component mounting is prevented beforehand. The component mounter 1 may be automatically replaced with the correct nozzle 11.

  As described above, in the component mounter 1 according to the present embodiment, the nozzle mark 12 of the nozzle 11 held on the nozzle holding base 20 is positioned at a different height from the board mark M of the board B positioned at the work position. In this embodiment, a substrate mark M for detecting the position of the substrate B provided on the substrate B, a nozzle mark 12 for individual identification provided on the nozzle 11, and a nozzle holder 20 for holding the nozzle 11 mounted on the mounting head 8. And a substrate camera 16 that is a fixed focus camera that images the substrate mark M of the substrate B positioned at the working position and the nozzle mark 12 of the nozzle 11 held on the nozzle holder 20 from above. Image recognition based on the image of the substrate mark M imaged by the substrate camera 16 is performed to detect the position of the substrate B, and the substrate camera 16 And an image recognition unit 15a that performs identification of the nozzle 11 by performing image recognition based on the image of the nozzle mark 12 which is the image. The substrate mark M of the substrate B positioned at the working position is located within the depth of field (in the region I) of the substrate camera 16, and the nozzle mark 12 of the nozzle 11 held on the nozzle holder 20 is Outside the depth of field of the camera 16 and within a region (in the region II) where a captured image of the nozzle mark 12 that can be recognized by the image recognition unit 15a is obtained (by imaging by the substrate camera 16). positioned.

  Further, the image recognition method of the component mounter 1 according to the present embodiment is based on the board mark M provided on the board B positioned at the working position by the board camera 16 which is a fixed focus camera provided on the mounting head 8. In addition, when the nozzle mark 12 provided on the nozzle 11 held on the nozzle holding base 20 is imaged from above and the image recognition of the substrate mark M and the nozzle mark 12 is performed, the substrate mark of the substrate B positioned at the working position M is positioned within the depth of field of the substrate camera 16 (in the region I), and the nozzle mark 12 of the nozzle 11 held on the nozzle holder 20 is outside the depth of field of the substrate camera 16 and is Image recognition of the substrate mark M and the nozzle mark 12 is performed within a region (region II) where a captured image of the nozzle mark 12 that can be recognized is obtained. .

  In the component mounting machine 1 according to the present embodiment, the board mark M of the board B positioned at the work position is within the depth of field (in the area I) of the board camera 16 and an in-focus image is obtained. Since the nozzle mark 12 of the nozzle 11 held on the nozzle holding base 20 is outside the depth of field of the substrate camera 16, a focused image cannot be obtained. However, although the image of the nozzle mark 12 taken outside the depth of field of the substrate camera 16 is not in focus, the image recognition unit 15a can perform image recognition based on the image, and as a result, Image recognition of both the substrate mark M and the nozzle mark 12 can be performed. Therefore, according to the present invention, image recognition of both the substrate mark M and the nozzle mark 12 can be performed without using an expensive camera with a focusing mechanism (using an inexpensive fixed focus camera), and the nozzle 11 It is possible to prevent erroneous mounting of the nozzle 11 by identifying the individual.

  A component mounter that can recognize both the board mark and nozzle mark image without using an expensive camera with a focusing mechanism, and can prevent erroneous nozzle mounting by identifying individual nozzles. And an image recognition method for a component mounter.

The perspective view of the component mounting machine in one embodiment of this invention The front view of the mounting head with which the component mounting machine in one embodiment of this invention is provided The perspective view of the nozzle with which the component mounting machine in one embodiment of this invention is provided The block diagram which shows the control system of the component mounting machine in one embodiment of this invention The partial front view of the mounting head with which the component mounting machine in one embodiment of this invention is equipped, and a nozzle holding stand (A) (b) The top view of the nozzle holding stand with which the component mounting machine in one embodiment of this invention is provided The partial side view of the component mounting machine in one embodiment of this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Component mounting machine 8 Mounting head 11 Nozzle 12 Nozzle mark 15a Image recognition part 16 Board | substrate camera (camera)
20 Nozzle holder P Component B Substrate M Substrate mark

Claims (2)

A component mounting machine that moves a mounting head equipped with a detachable nozzle for holding a component in the horizontal direction and mounts a component picked up by the nozzle on a substrate positioned at a work position, and the position of the substrate provided on the substrate A substrate mark for detection, a nozzle mark for individual identification provided on the nozzle, a nozzle holder for holding a nozzle mounted on the mounting head, and a substrate of the substrate provided on the mounting head and positioned at the work position A fixed-focus camera that images the mark and the nozzle mark of the nozzle held on the nozzle holder from above, and image recognition based on the image of the substrate mark imaged by the camera to detect the position of the substrate, and An image recognition unit that performs image recognition based on the captured image of the nozzle mark to identify individual nozzles, The substrate mark of the determined substrate is located within the depth of field of the camera, and the nozzle mark of the nozzle held on the nozzle holder is outside the depth of field of the camera, and the image recognition unit recognizes the image. Is located in the area where the captured image of the nozzle mark can be obtained ,
The nozzle is installed at a position above the substrate by the nozzle holder,
The nozzle mark of the nozzle held on the nozzle holder is located at a position relatively higher than the substrate mark of the substrate positioned at the working position,
The component mounting machine, wherein the nozzle mark is in a matrix shape composed of a combination of a plurality of small areas to which light and dark gradations are given . In a component mounter that moves a mounting head equipped with a detachable nozzle for holding a component in a horizontal direction and mounts a component picked up by the nozzle on a substrate positioned at a work position, a fixed-focus camera provided on the mounting head The individual identification nozzle provided on the nozzle held on the nozzle holder for holding the substrate mark for detecting the position of the substrate provided on the substrate positioned at the working position and the nozzle mounted on the mounting head An image recognition method of a component mounter that images a mark from above and recognizes an image of a board mark and a nozzle mark, and the board mark of the board positioned at the working position is positioned within the depth of field of the camera, The nozzle mark of the nozzle held on the nozzle holder is outside the depth of field of the camera and can be used for image recognition. And is positioned within the region captured image click is obtained, have the line image recognition of the board mark and the nozzle mark,
The nozzle is installed at a position above the substrate by the nozzle holder,
The nozzle mark of the nozzle held on the nozzle holder is located at a position relatively higher than the substrate mark of the substrate positioned at the working position,
An image recognition method for a component mounting machine, wherein the nozzle marks are in a matrix shape composed of a combination of a plurality of small areas to which light and dark gradations are given .

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