JP2010225726A - Multi-pattern wiring board, wiring board, package for housing electronic components, and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a multi-pattern wiring board that is divided along the dividing groove with high accuracy, and to provide a wiring board, a package for housing electronic components, and an electronic apparatus. <P>SOLUTION: In a multi-pattern wiring board 1, a plurality of insulating layers 11-15 are laminated, and a plurality of board areas E<SB>11</SB>-E<SB>55</SB>to be divided as a wiring board is formed in a matrix. Dividing grooves S<SB>odd</SB>and S<SB>even</SB>are formed in a boarder part between the board areas E<SB>11</SB>-E<SB>55</SB>to each of the insulating layers 11-15. The dividing grooves S<SB>odd</SB>and S<SB>even</SB>have a first diving groove S<SB>odd</SB>formed in odd-numbered insulating layers 11, 13 and 15, and a second dividing groove S<SB>even</SB>formed in even-numbered insulating layers 12 and 14 and formed not to be overlapped with the first dividing groove S<SB>odd</SB>in a planar view. In the planar view, the first dividing groove S<SB>odd</SB>and the second dividing groove S<SB>even</SB>are adjacent to each other along a dividing direction. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a multi-piece wiring board, a wiring board, an electronic component storage package, and an electronic device in which a plurality of board regions to be divided as wiring boards are formed in a vertical and horizontal arrangement.

  A wiring board for mounting electronic parts such as a piezoelectric vibrator, a semiconductor element, and a crystal vibrator is generally manufactured by separating a multi-piece wiring board. That is, this multi-cavity wiring board has a plurality of insulating layers laminated, and a plurality of substrate regions to be divided as a wiring board are formed in a vertical and horizontal arrangement (see, for example, Patent Document 1). In addition, the multi-cavity wiring substrate is formed with a dividing groove at a boundary portion between adjacent substrate regions. That is, a plurality of wiring boards can be taken out by dividing the substrate region along the dividing grooves. Conventionally, in consideration of easiness of division and the like, dividing grooves are formed not only on the surface of the multi-layer wiring substrate but also on some of the inner insulating layers. (For example, see Patent Document 2).

JP 2006-41269 A JP 2007-294797 A

  However, since the conventional multi-cavity wiring board has split grooves formed on the surface and some of the inner insulating layers, the following problems may occur. . That is, since there is an insulating layer in which the dividing groove is not formed among the insulating layers of the inner layer, when dividing the substrate region, it is impossible to accurately (straightly) divide along the dividing groove. It is. Since it cannot be accurately divided along the dividing groove, the divided wiring boards may have different shapes and sizes.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a multi-piece wiring board, a wiring board, an electronic component storage package, and an electronic device that can be accurately divided along the dividing groove. Relates to the device.

  In order to achieve the above object, the multi-cavity wiring board according to the present invention is a multi-cavity wiring board in which a plurality of insulating layers are laminated and a substrate region to be divided as a wiring board is formed in a plurality of arrays. In each of the plurality of insulating layers, a dividing groove is formed at a boundary portion between the substrate regions, and the dividing groove includes an even-numbered first dividing groove formed in an odd-numbered insulating layer. And a second divided groove formed so as not to overlap the first divided groove in a plan view, and the first divided groove and the second divided groove in a plan view. The grooves are adjacent to each other along the dividing direction.

  In order to achieve the above object, the wiring board according to the present invention is obtained by dividing the substrate region in the multi-cavity wiring board according to the present invention.

  In order to achieve the above object, a wiring board according to the present invention is used in an electronic component storage package according to the present invention.

  In order to achieve the above object, an electronic device according to the present invention includes an electronic component storage package according to the present invention and an electronic component stored in the electronic component storage package.

  The multi-cavity wiring board, the wiring board, the electronic component storage package, and the electronic device according to the present invention have an effect that they can be accurately divided along the dividing groove.

FIG. 1 is a plan view showing an example of a multi-piece wiring board according to an embodiment of the present invention. 2 is a cross-sectional view taken along the cutting line AA ′ shown in FIG. FIG. 3 is an enlarged plan view showing another example of the multi-piece wiring board according to the embodiment of the present invention. FIG. 4 is a cross-sectional view showing still another example of the multi-piece wiring board according to the embodiment of the present invention. FIG. 5 is a cross-sectional view showing an example of an electronic device according to an embodiment of the present invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  However, in the drawings referred to below, for the convenience of explanation, among the constituent members of one embodiment of the present invention, only the main members necessary for explaining the present invention are shown in a simplified manner. Therefore, the multi-cavity wiring board, the wiring board, the electronic component storage package, and the electronic device according to the present invention can include arbitrary components not shown in the drawings referred to in this specification. Moreover, the dimension of the member in each figure does not represent the dimension of an actual structural member, the dimension ratio of each member, etc. faithfully.

  FIG. 1 is a plan view showing an example of a multi-piece wiring board 1 according to an embodiment of the present invention. 2 is a cross-sectional view taken along the cutting line AA ′ shown in FIG.

As shown in FIG. 1, in the multi-piece wiring board 1 according to the present embodiment, a plurality of board regions E _{11 to} E ₅₅ to be divided as wiring boards are arranged in a vertical and horizontal arrangement. Specifically, the board regions E _{11 to} E ₅₅ are formed in a substantially central portion P of the multi-piece wiring board 1 in plan view. Each of the board regions E _{11 to} E ₅₅ is provided with a mounting portion (not shown) for mounting electronic components. Furthermore, a wiring conductor (not shown) made of metal metallization such as tungsten, molybdenum, copper, silver or the like is formed on the mounting portion.

Although FIG. 1 illustrates an example in which 25 substrate regions E _{11 to} E ₅₅ are formed on the multi-cavity wiring substrate 1, the present invention is not limited to this. That is, the number of substrate regions to be formed on the multi-piece wiring board 1 is arbitrary.

  As shown in FIG. 2, the multi-piece wiring board 1 according to the present embodiment is configured by laminating a plurality of insulating layers 11 to 15. Here, the insulating layers 11 to 15 are made of an insulating material such as ceramics, silicon, or glass, but are particularly preferably made of ceramics. Examples of the ceramic include an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, a silicon carbide sintered body, a silicon nitride sintered body, and a glass ceramic sintered body.

  In FIG. 2, an example in which the multi-piece wiring board 1 is configured by five insulating layers 11 to 15 is illustrated, but the invention is not limited thereto. That is, the multi-cavity wiring board 1 may be composed of an arbitrary number of insulating layers.

  Here, when the insulating layers 11-15 consist of ceramics, the said insulating layers 11-15 are manufactured by the following methods, for example. That is, a binder and a solvent are added to and mixed with raw material powders such as alumina, silica, magnesia, and calcia to form a slurry. Then, this is formed into a sheet shape by using a conventionally known doctor blade method, and a plurality of ceramic green sheets are generated by punching using a punching die. Then, a paste for wiring conductor is printed and applied to the generated ceramic green sheet in a predetermined pattern by using a conventionally known screen printing method. Then, a plurality of ceramic green sheets are laminated on top and bottom to form a ceramic green sheet laminate, and the ceramic green sheet laminate is fired at a temperature of about 1600 ° C. in a reducing atmosphere. The insulating layers 11 to 15 are manufactured through such steps.

Further, in the boundary portion between the substrate regions E _{11 to} E ₅₅ , the odd-numbered insulating layers _{11, 13, 15} are formed with _odd- numbered dividing grooves (first dividing grooves) S _odd . Further, in the boundary portion between the substrate regions E _{11 to} E ₅₅ , the even-numbered insulating layers 12 and 14 are not _evenly divided with the odd-numbered dividing grooves S _odd in plan view (second grooves) Dividing grooves) S _even are formed. That is, in the plan view, the odd-numbered dividing grooves S _odd and the even-numbered dividing grooves S _even are adjacent to each other along the dividing direction.

In the present embodiment, 25 wiring boards can be taken out by dividing the substrate regions E _{11 to} E ₅₅ along the dividing grooves S _odd and S _even . The dividing grooves S _odd , S _even are formed in the ceramic green sheet before firing using, for example, a mold, a cutter blade, a laser, etc., and the opening width is the thickness, material, etc. of the multi-piece wiring board 1. Depending on the case, it is preferably approximately 0.01 to 0.3 mm.

That is, since the dividing grooves S _odd and S _even are formed in both the odd-numbered insulating layers 11, 13 and 15 and the even-numbered insulating layers 12 and 14, the dividing is performed when the substrate regions E _{11 to} E ₅₅ are divided. It is possible to accurately divide along the grooves S _odd and S _even . For this reason, each of the divided wiring boards has substantially the same shape and size.

Here, as shown in FIG. 1, in the multi-piece wiring board 1, the odd-numbered divided grooves S _odd and the even-numbered divided grooves S _even are alternately arranged for each of the substrate regions E _{11 to} E ₅₅ in plan view. It is preferable to be formed. That is, in other words, it is preferable that the odd-numbered dividing grooves S _odd and the even-numbered dividing grooves S _even are formed in a so-called staggered pattern for each of the substrate regions E _{11 to} E ₅₅ in plan view. Accordingly, when dividing a substrate region _E 11 _{to E 55,} the dividing groove _{S odd,} can be accurately divided along the _{S the even.} Further, when the wiring board is taken out by dividing the substrate regions E _{11 to} E ₅₅ , the side surface of the wiring board becomes the division grooves S _odd , S _even , so that unnecessary projections are not formed on the side surface of the wiring board by the division. It can suppress that a shape is formed and an unnecessary crack arises. That is, a high-quality wiring board can be obtained.

Further, as shown in FIG. 3, it is preferable that the _odd- numbered dividing grooves S _odd and the even-numbered dividing grooves S _even are continuously formed in a plan view. FIG. 3 is an enlarged plan view showing another example of the multi-piece wiring board 1 according to an embodiment of the present invention.

That is, in the plan view, each of the odd-numbered dividing grooves S _odd and the even-numbered dividing grooves S _even has continuous portions C. Therefore, when dividing the substrate regions E _{11 to} E ₅₅ , It is possible to more accurately divide along the dividing grooves S _odd and S _even .

Further, as shown in FIG. 4, it is preferable that an embedded member 2 is provided in the _odd- numbered dividing groove S _odd and the even-numbered dividing groove S _even . FIG. 4 is a cross-sectional view showing still another example of the multi-piece wiring board 1 according to an embodiment of the present invention.

Here, after mounting the electronic component on the mounting portion of the substrate region _E 11 _{to E 55,} it is common to divide the substrate region _E 11 _{to E 55.} When electronic components are mounted on the mounting portions of the board regions E _{11 to} E ₅₅ , the multi-cavity wiring board 1 may be cracked along the divided grooves S _odd , S _{even due} to the pressure at the time of mounting. However, as shown in FIG. 4, if the embedded member 2 is provided in the _odd- numbered dividing groove S _odd and the even-numbered dividing groove S _even , electronic components are mounted on the mounting portions of the board regions E _{11 to} E _55. Even in this case, the multi-cavity wiring board 1 can be prevented from cracking along the divided grooves S _odd and S _{even due} to the pressure at the time of mounting.

In addition, since the embedded members 2 are provided in the _odd- numbered dividing grooves S _odd and the even-numbered dividing grooves S _even , the following effects are also obtained. That is, when the insulating layers 11 to 15 are made of ceramics, if the embedded member 2 is provided in the dividing grooves S _odd and _Seven of the ceramic green sheet laminate, the insulating layer at the time of firing the ceramic green sheet laminate The delamination (delamination) of 11 to 15 can be suppressed.

Incidentally, embedded member 2, dividing grooves _{S odd,} after dividing the substrate region _E 11 _{to E 55} along the _{S the even,} the dividing groove _{S odd,} is removed from _{S the even.} For this reason, when the insulating layers 11 to 15 are made of ceramics, the embedded member 2 is preferably made of the following material. That is, the ceramic includes a binder having a mass larger than that of the binder contained in the ceramic green sheet laminate and a filler having a mass larger than that of the filler contained in the ceramic green sheet laminate. When such ceramics are used for the embedded member 2, the embedded member 2 can be easily removed from the dividing grooves S _odd and S _even .

As described above, according to the multi-cavity wiring board 1 according to the present embodiment, it is possible to accurately divide along the dividing grooves S _odd and S _even .

In the present embodiment, 25 wiring boards can be taken out by dividing the substrate regions E _{11 to} E ₅₅ along the dividing grooves S _odd and S _even . Here, the wiring board thus taken out can be used, for example, in an electronic component storage package or an electronic device. FIG. 5 is a cross-sectional view showing an example of an electronic device 50 according to an embodiment of the present invention. As shown in FIG. 5, the electronic device 50 according to the present embodiment includes a base 51, an electronic component 52, a frame 53, and a lid 54. Here, the base | substrate 51 and the frame 53 become one Embodiment of the electronic component storage package which concerns on this invention.

The base 51 has a mounting portion 51a for mounting the electronic component 52 on the upper surface. That is, the electronic component 52 is mounted on the mounting portion 51a. Here, in the present embodiment, any one wiring substrate obtained by dividing the substrate regions E _{11 to} E ₅₅ along the dividing grooves S _odd and S _even becomes the base 51.

  The frame 53 is provided on the upper surface of the base 51 so as to surround the electronic component 52. Note that the frame 53 may be formed integrally with the base body 51 or may be formed separately from the base body 51. When the base body 51 and the frame body 53 are formed separately and independently, the base body 51 and the frame body 53 are joined via a connecting member such as solder or brazing material, for example.

  The lid body 54 is a member that is provided on the upper surface of the frame body 53 and plays a role for sealing the electronic component 52 mounted on the mounting portion 51a. That is, the lid body 54 is formed on the upper surface of the frame body 53 such as solder or brazing material so that the housing space in which the electronic component 52 formed by the frame body 53 is housed is sealed in a vacuum state, for example. It joins via a connection member.

  As described above, the present invention is useful as a multi-piece wiring board, a wiring board, an electronic component storage package, or an electronic device that can be accurately divided along the dividing groove.

DESCRIPTION OF SYMBOLS 1 Multiple wiring board 2 Embedded member 11-15 Insulation layer 50 Electronic device 52 Electronic component S _odd Divided groove (first divided groove)
_{Seven even-} numbered dividing groove (second dividing groove)
E ₁₁ to E ₅₅ substrate region (wiring substrate)

Claims (8)

A plurality of insulating layers are stacked, and a substrate area to be divided as a wiring board is a multi-cavity wiring board in which a plurality of arrays are formed,
Each of the plurality of insulating layers is formed with a dividing groove at a boundary portion between the substrate regions,
The dividing groove is formed in the first dividing groove formed in the odd-numbered insulating layer and in the even-numbered insulating layer, and is formed so as not to overlap the first dividing groove in plan view. Having two split grooves,
A multi-piece wiring board in which the first dividing groove and the second dividing groove are adjacent to each other along a dividing direction in a plan view.   The multi-piece wiring board according to claim 1, wherein the first divided grooves and the second divided grooves are alternately formed for each of the substrate regions in a plan view.   The multi-piece wiring board according to claim 1 or 2, wherein the first divided groove and the second divided groove are formed continuously in a plan view.   The multi-piece wiring board according to any one of claims 1 to 3, wherein an embedded member is provided in the first divided groove and the second divided groove.   The multi-piece wiring board according to claim 1, wherein the insulating layer is made of ceramics.   The wiring board obtained by dividing | segmenting the said board | substrate area | region in the multi-cavity wiring board as described in any one of Claims 1-5.   An electronic component storage package using the wiring board according to claim 6. The electronic component storage package according to claim 7;
An electronic device comprising: an electronic component housed in the electronic component housing package.

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