JP2010219367A - Method for manufacturing organic printed substrate, organic printed substrate, and high-frequency module device using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an organic printed substrate capable of fabricating a cavity with high accuracy, and improving production yield and production efficiency. <P>SOLUTION: The method for manufacturing an organic printed substrate 50 comprises a laminating step for laminating prepregs 123a on a core base 21, and a cavity forming step for forming a recessed cavity 10 by removing a predetermined part of the prepreg 123a. The laminating step comprises a step for arranging a heat-resistant film 110 between the core base 21 and the prepreg 123a, and the cavity forming step comprises a step for forming a side wall part 11 of the cavity 10 on the prepreg 123a by cutting a part corresponding to the heat-resistant film 110 on the prepreg 123a by using laser, and a step for forming a bottom part 12 of the cavity 10 on a part where the heat-resistant film 110 on the core base 21 was present. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an organic printed circuit board manufacturing method, an organic printed circuit board, and a high-frequency module using the organic printed circuit board, and more particularly to a method for manufacturing an organic printed circuit board having a cavity structure, an organic printed circuit board, and the organic printed circuit board. The present invention relates to a high-frequency module using

  In the field of electronic devices such as mobile phones, portable information terminals, and portable game machines, substrates for mounting electronic components are widely used. Further, in order to increase the mounting density of electronic components, and to reduce the size and height, a printed circuit board having a cavity structure is used as the substrate. In this printed circuit board, a recess called a cavity is formed in an insulating layer (resin layer) constituting the printed circuit board, and an electronic component is accommodated in the cavity.

  Conventionally, as a method of forming a cavity in a printed circuit board, a hot press using a prepreg (an adhesive sheet in which a glass cloth or the like is impregnated with a semi-cured thermosetting resin) is provided with a through hole at a position where the cavity is formed. There is known a method in which the through-hole portion is formed into a cavity by heat and pressure molding. In this method, in order to suppress the resin of the prepreg softened during the heat and pressure molding from flowing into the cavity, a prepreg having a small resin flow in which a resin component or the like is adjusted is used.

  However, in this method, since the resin flow of the prepreg is small, voids (voids) are easily generated on the side surface of the copper foil pattern (wiring layer) of the inner layer circuit. That is, the embedding property of the circuit (wiring layer) is lowered. For this reason, there is a disadvantage that the insulation reliability is lowered. In addition, the above-described conventional method has a disadvantage that it is difficult to form a cavity with high accuracy.

  Therefore, conventionally, even when a prepreg having a sufficient resin flow for securing circuit embedding is used, it is possible to suppress the resin of the prepreg from flowing into the cavity, and the cavity can be accurately formed. A method of forming a cavity that can be processed has been proposed (see, for example, Patent Document 1).

  Patent Document 1 describes a method in which a metal protective layer is formed in a through-hole of a prepreg, and this metal protective layer is removed by etching after hot press molding by hot pressing. In this method, the metal protective layer formed in the through hole of the prepreg suppresses the resin of the prepreg from flowing into the cavity (in the through hole). For this reason, since it becomes possible to use a prepreg having a sufficient resin flow, a decrease in circuit embedding is suppressed. Moreover, in this method, since the metal protective layer is formed in the through hole of the prepreg, deformation of the cavity due to hot pressing is suppressed. Therefore, the cavity can be processed with high accuracy.

JP 2005-236194 A

  However, in the method described in Patent Document 1, since the metal protective layer formed in the through hole of the prepreg has different physical properties from the prepreg, the pressure due to the hot press is not evenly applied, and the inconvenience that the stacking failure is likely to occur. is there. For this reason, when the printed circuit board which has a cavity structure using the method of patent document 1 is manufactured, while the reliability of the manufactured printed circuit board falls, the manufacturing yield falls.

  Moreover, since both the method of patent document 1 and the above-mentioned conventional method provide many through-holes for forming a cavity in a prepreg, the handleability of a prepreg worsens. For this reason, there is an inconvenience that when the prepreg is laminated, the workability is lowered. Thereby, there also exists a problem that the manufacturing efficiency of a printed circuit board falls.

  In addition, as a board | substrate which has a cavity structure, the ceramic substrate is also used besides a printed circuit board (organic printed circuit board). Although this ceramic substrate has an advantage that it is easy to form a cavity structure as compared with a printed circuit board, since it is brittle in material, there is a concern about generation of cracks and chips due to external load. In particular, in recent years, with the thinning of electronic devices, since the substrate is also in the direction of thinning, there is a greater concern. For this reason, the request | requirement of the printed circuit board (organic printed circuit board) which has a cavity structure is increasing.

  The present invention has been made to solve the above-described problems, and one object of the present invention is to be able to process a cavity with high accuracy, and to improve manufacturing yield and manufacturing efficiency. It is providing the manufacturing method of the organic printed circuit board which can be made to do.

  Another object of the present invention is to provide a highly reliable organic printed circuit board in which a cavity is accurately formed.

  Yet another object of the present invention is to provide a high-frequency module with high reliability.

  In order to achieve the above object, an organic printed circuit board manufacturing method according to a first aspect of the present invention includes a laminating step of laminating an insulating second resin layer on a main surface of an insulating first resin layer; A cavity forming step of forming a concave cavity by removing a predetermined portion of the second resin layer. The laminating step includes a step of arranging a release member between the first resin layer and the second resin layer, and the cavity forming step removes a portion corresponding to the release member in the second resin layer. Forming the cavity side wall in the second resin layer, and removing the release member to form the bottom surface of the cavity in the portion of the first resin layer where the release member was disposed. Including the step of. The first resin layer of the present invention includes a resin substrate.

  In the method for manufacturing an organic printed circuit board according to the first aspect, as described above, after the second resin layer is laminated on the main surface of the first resin layer, a portion corresponding to the release member in the second resin layer is formed. By forming the concave cavity by removing the cavity, the cavity is formed after the stacking process, so that deformation of the cavity after the cavity formation can be suppressed. Further, by removing the portion corresponding to the release member in the second resin layer, the side wall portion of the cavity is formed in the second resin layer, so that the resin flow is controlled so that the side wall portion of the cavity becomes flat. There is no need. Furthermore, by arranging the release member between the first resin layer and the second resin layer, the first resin layer and the second resin layer are not bonded in the portion where the release member is arranged. The part corresponding to the release member in the second resin layer can be easily removed. Thereby, the bottom face part of a cavity can be formed easily. Therefore, by configuring as described above, the cavity can be processed (formed) with high accuracy.

  Further, in the first aspect, by forming a concave cavity after laminating the second resin layer on the main surface of the first resin layer, a resin layer having a sufficient resin flow (second resin layer) is formed. It can laminate | stack on the main surface of 1 resin layer. For this reason, while being able to suppress the fall of the adhesiveness of a 1st resin layer and a 2nd resin layer, the embedding property of a circuit (wiring layer) can be improved. Thereby, reliability, such as insulation reliability, can be improved.

  Further, in the first aspect, since the second resin layer is laminated on the main surface of the first resin layer so as to cover the release member, even when the lamination is performed by heat and pressure molding by hot press, Pressure can be applied evenly to the second resin layer. For this reason, since generation | occurrence | production of a stacking fault can be suppressed, the manufacture yield of an organic printed circuit board can be improved. Moreover, the reliability of the manufactured organic printed circuit board can also be improved.

  Furthermore, in the first aspect, when the second resin layer is laminated, the second resin layer is not provided with a through hole for forming a cavity, so that there is no inconvenience that handling properties are deteriorated. For this reason, since workability | operativity can be improved in operations, such as lamination | stacking, the manufacturing efficiency of an organic printed circuit board can be improved.

  In addition, the organic printed circuit board by which the cavity was formed in both surfaces is producible by using the method by the said 1st aspect.

  In the method for manufacturing an organic printed circuit board according to the first aspect, it is preferable that the release member is formed in the same outer size as the cavity.

  In the method of manufacturing an organic printed circuit board according to the first aspect, preferably, the step of forming the side wall portion of the cavity includes a step of cutting a portion corresponding to the release member in the second resin layer using a laser. In addition, prior to the stacking step, the method further includes a step of forming a metal layer on a portion of the main surface of the first resin layer that is irradiated with the laser light. If comprised in this way, since the 2nd resin layer can be cut | disconnected flat by a laser, the side wall part of the cavity formed in a 2nd resin layer can be formed flat. Moreover, by using a laser, the part corresponding to the release member in the second resin layer can be cut with high accuracy. Further, by forming a metal layer on the main surface of the first resin layer where the laser beam is irradiated, if the laser conditions are set so as not to process the metal layer, the laser will be the metal layer. Therefore, control in the depth direction (thickness direction) in laser processing can be easily performed. Thereby, the processing precision of the depth direction (thickness direction) at the time of the process of a cavity can be improved. Therefore, by configuring as described above, the processing accuracy of the cavity can be easily improved.

  In the method for manufacturing an organic printed circuit board according to the first aspect, the second resin layer is made of an insulating adhesive sheet, and becomes an outer shape of a cavity in the adhesive sheet before the adhesive sheet is laminated on the first resin layer. The step of cutting out a part of the portion is further provided, and the step of forming the side wall portion of the cavity includes a step of cutting an uncut portion of the portion that becomes the outer shape of the cavity in the adhesive sheet using a laser. Is preferred.

  In this case, it is preferable that the step of cutting out a part of the adhesive sheet includes a step of cutting out portions other than the four corners of the portion that is the outer shape of the cavity in the adhesive sheet.

  In the case where the second resin layer is made of an insulating adhesive sheet, preferably, prior to the step of laminating the adhesive sheet, a metal layer is formed on a portion irradiated with laser light on the main surface of the first resin layer. The process to do is provided. If comprised in this way, since it will be in the state in which a part of metal layer interrupted, when forming a circuit (wiring layer) in the main surface of the 1st resin layer, via this interrupted part, A circuit (wiring layer) can be routed from the inner region to the outer region of the metal layer. For this reason, the freedom degree of routing of a circuit (wiring layer) can be improved. The metal layer is formed at the four corners of the cavity, if it cuts through the corners other than the four corners of the cavity in the adhesive sheet. ) Can be routed. In this case, the degree of freedom for routing the circuit (wiring layer) can be further improved.

  In the method of manufacturing an organic printed circuit board according to the first aspect, preferably, a step of forming a through hole that continuously penetrates the first resin layer and the second resin layer, and a cavity in the first resin layer are formed. And a step of forming a build-up layer on the main surface on the opposite side to the first side. If comprised in this way, since the whole surface (surface on the opposite side to the side in which a cavity is formed) in which the buildup layer was formed in an organic printed circuit board can be used as a mounting surface of an electronic component, an electronic component The mounting density can be increased. For this reason, if a high frequency module is formed using the organic printed circuit board obtained by such a manufacturing method, size reduction of a high frequency module can be achieved.

  Further, in this case, preferably, the laminate in which the second resin layer is laminated on the first resin layer is a workpiece, and the two workpieces are arranged on the surface side where the cavity is formed via the frame-shaped sheet member. A step of bonding so as to face each other, a step of forming a build-up layer on the outer surface of the bonded workpieces, and a step of separating the bonded workpieces by cutting the bonded portion of the bonded workpieces And further. If comprised in this way, since a buildup layer can be formed efficiently, the manufacturing efficiency of an organic printed circuit board can be improved easily.

  An organic printed circuit board according to a second aspect of the present invention includes an insulating first resin layer in which a metal layer is formed on a main surface, and an insulating second resin formed on the main surface of the first resin layer. And a concave cavity formed by removing a predetermined portion of the second resin layer. The cavity includes a bottom surface portion formed in the first resin layer and a side wall portion formed in the second resin layer, and the metal layer is positioned at a root portion of the side wall portion of the cavity. It is patterned. The first resin layer of the present invention includes a resin substrate.

  In the organic printed circuit board according to the second aspect, by configuring as described above, after laminating the second resin layer on the main surface of the first resin layer, using the laser, the cavity is formed in the second resin layer. Sidewall portions can be formed. Further, by patterning the metal layer so as to be located at the root portion of the side wall portion of the cavity, the laser depth direction (thickness direction) can be easily controlled. Thereby, the organic printed circuit board in which the cavity was accurately formed can be obtained.

  Further, in the second aspect, by configuring as described above, a concave cavity can be formed after laminating the second resin layer on the main surface of the first resin layer. Can be suppressed. Thereby, the reliability of an organic printed circuit board can be improved. In addition, since the resin layer (second resin layer) having a sufficient resin flow can be laminated on the main surface of the first resin layer, the first resin layer and the second resin layer can be laminated. It is possible to suppress a decrease in adhesiveness. For this reason, while being able to suppress the fall of the adhesiveness of a 1st resin layer and a 2nd resin layer, the embedding property of a circuit (wiring layer) can be improved. Thereby, insulation reliability can be improved. Therefore, a highly reliable organic printed circuit board can be obtained by comprising as mentioned above.

  In addition, the organic printed circuit board by the 2nd aspect comprised as mentioned above can be produced using the manufacturing method by the said 1st aspect.

  In the organic printed circuit board according to the second aspect, preferably, the metal layer is formed on a part of the root portion of the side wall portion. With this configuration, when forming a circuit (wiring layer) on the main surface of the first resin layer, a circuit (wiring) is formed from the inner region of the metal layer (the bottom surface of the cavity) to the outer region of the metal layer. Layer) can be routed, the degree of freedom of routing of the circuit (wiring layer) can be improved.

  In the organic printed circuit board according to the second aspect, preferably, the metal layer is a part of the base portion of the side wall portion and is formed at the four corner positions of the cavity. If comprised in this way, the routing freedom degree of a circuit (wiring layer) can be improved more.

  In the organic printed circuit board according to the second aspect, a buildup layer is preferably formed on the surface of the first resin layer opposite to the surface on which the second resin layer is formed. If comprised in this way, since the whole surface (surface on the opposite side to the side in which a cavity is formed) in which the buildup layer was formed in an organic printed circuit board can be used as a mounting surface of an electronic component, an electronic component The mounting density can be increased.

  A high-frequency module according to a third aspect of the present invention includes an organic printed circuit board manufactured using the manufacturing method according to the first aspect, a digital circuit portion formed in a cavity of the organic printed circuit board, and an organic printed circuit board. And an analog circuit portion formed on the main surface side opposite to the cavity.

  In the high-frequency module according to the third aspect, a high-reliability high-frequency module can be obtained by using the organic printed circuit board manufactured using the manufacturing method according to the first aspect. In addition, by forming a high-frequency module using the organic printed circuit board having a cavity structure, it is possible to effectively suppress the occurrence of chipping and cracking compared to the case of using a ceramic substrate.

  A high-frequency module according to a fourth aspect of the present invention includes an organic printed circuit board produced using the manufacturing method according to the first aspect, a digital circuit section and an analog circuit section formed on the organic printed circuit board, and an organic printed circuit board. And a metal plate having a shielding effect attached to the substrate. The organic printed circuit board has cavities formed on both sides thereof, the digital circuit unit is formed in the cavity on one side of the organic printed circuit board, and the analog circuit unit is not only the organic printed circuit board. The metal plate is attached to cover the cavity in which the analog circuit portion is formed.

  In the high-frequency module according to the fourth aspect, a high-reliability high-frequency module can be obtained by using the organic printed circuit board manufactured using the manufacturing method according to the first aspect. Moreover, the high frequency module which has a shield effect can be easily formed by attaching the metal plate which has a shield effect so that the cavity in which the analog circuit part was formed may be covered. In addition, by forming a high-frequency module using the organic printed circuit board having a cavity structure, it is possible to effectively suppress the occurrence of chipping and cracking compared to the case of using a ceramic substrate.

  In the high-frequency module according to the third and fourth aspects, the organic printed board preferably has a ground layer formed between the digital circuit portion and the analog circuit portion. If comprised in this way, since the noise countermeasure of a high frequency module can be performed easily, reliability can be improved also by this.

  As described above, according to the present invention, it is possible to easily obtain a method for manufacturing an organic printed circuit board capable of accurately processing a cavity and improving manufacturing yield and manufacturing efficiency. it can.

  In addition, according to the present invention, a highly reliable organic printed circuit board in which cavities are accurately formed can be easily obtained.

  Furthermore, according to the present invention, a highly reliable high frequency module can be easily obtained.

It is sectional drawing which showed typically the structure of the organic printed circuit board by 1st Embodiment of this invention. It is the top view which looked at the organic printed circuit board by 1st Embodiment of this invention from the cavity side. It is a perspective view of the high frequency module using the organic printed circuit board by a 1st embodiment of the present invention. It is sectional drawing of the high frequency module using the organic printed circuit board by 1st Embodiment of this invention. It is the top view (figure of the state where the shield case was removed) which looked at the high frequency module using the organic printed circuit board by a 1st embodiment of the present invention from the opposite side of a cavity. It is a figure for demonstrating operation | movement of the high frequency module using the organic printed circuit board by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the organic printed circuit board by 1st Embodiment of this invention. It is a top view for demonstrating the manufacturing method of the organic printed circuit board by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the organic printed circuit board by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the organic printed circuit board by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the organic printed circuit board by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the organic printed circuit board by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the organic printed circuit board by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the organic printed circuit board by 1st Embodiment of this invention. It is a perspective view for demonstrating the manufacturing method of the organic printed circuit board by 1st Embodiment of this invention. It is a top view for demonstrating the manufacturing method of the organic printed circuit board by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the organic printed circuit board by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the organic printed circuit board by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the organic printed circuit board by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the organic printed circuit board by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the organic printed circuit board by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the organic printed circuit board by 1st Embodiment of this invention. It is a top view (figure which looked at the cavity from the upper part) for demonstrating the structure of the organic printed circuit board by the modification of 1st Embodiment. It is a top view for demonstrating the manufacturing method of the organic printed circuit board by the modification of 1st Embodiment. It is a top view for demonstrating the manufacturing method of the organic printed circuit board by the modification of 1st Embodiment. It is sectional drawing which showed typically the structure of the organic printed circuit board by 2nd Embodiment of this invention. It is a perspective view of the high frequency module using the organic printed circuit board by a 2nd embodiment of the present invention. It is sectional drawing of the high frequency module using the organic printed circuit board by 2nd Embodiment of this invention. It is a top view (figure which looked at the cavity in which the analog circuit is formed from the upper side) of the high frequency module using the organic printed circuit board by a 2nd embodiment of the present invention. It is sectional drawing for demonstrating the manufacturing method of the organic printed circuit board by 2nd Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the organic printed circuit board by 2nd Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the organic printed circuit board by 2nd Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the organic printed circuit board by 2nd Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the organic printed circuit board by 2nd Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the organic printed circuit board by 2nd Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the organic printed circuit board by 2nd Embodiment of this invention.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments embodying the present invention will be described in detail with reference to the drawings.

(First embodiment)
First, with reference to FIGS. 1-5, the organic printed circuit board 50 by 1st Embodiment of this invention and the high frequency module 100 using the same are demonstrated.

  As shown in FIG. 1, the organic printed circuit board 50 according to the first embodiment has a concave cavity 10 for housing an electronic component (not shown) on one main surface side. That is, the organic printed circuit board 50 of the first embodiment is composed of a multilayer wiring board having a cavity structure on one side.

  The organic printed circuit board 50 includes a cavity member 20 in which the cavity 10 is formed. A specific structure of the cavity member 20 is that the wiring layers 22 (22a and 22b) made of copper (Cu) formed in a predetermined pattern are formed on both main surfaces of the insulating core base material 21, respectively. Is formed. Insulating resin layers 23 (23a and 23b) having a predetermined thickness (for example, about 0.3 mm) are formed on both main surfaces of the core base material 21 so as to cover the wiring layer 22, respectively. Has been. On the main surface of the resin layer 23, wiring layers 24 (24a and 24b) made of copper (Cu) are formed. The core base material 21 is an example of the “first resin layer” in the present invention, and the resin layer 23a (23) is an example of the “second resin layer” in the present invention.

  Further, a through through hole 25 penetrating in the thickness direction is formed in a predetermined portion of the cavity member 20. This through-hole 25 has a through-hole plating layer 25a formed by copper plating on the inner surface thereof. The through-hole 25 is preferably formed with a hole diameter of 0.2 mm and a through-hole land minimum of 0.35 mm. Further, in the through through hole 25, a conductive or insulating resin 26 is embedded in order to maintain the uniformity of the layer. Further, a copper plating layer 27 is formed on the wiring layer 24 (24a and 24b). The wiring layers in each layer are electrically connected (interlayer connection) to each other through the through-through hole 25 and the like.

  Further, the concave cavity 10 described above is formed on one main surface side of the cavity member 20. The cavity 10 includes a side wall portion 11 and a bottom surface portion 12, and is formed in a substantially rectangular shape as seen in a plan view as shown in FIG.

  Here, in the first embodiment, the cavity 10 is formed by laminating a resin layer 23 (23a) on the main surface of the core base material 21, and then removing a predetermined portion of the resin layer 23a by a laser. Is formed. Therefore, as shown in FIG. 1, the bottom surface portion 12 of the cavity 10 is formed on the main surface of the core base material 21, and the side wall portion 11 of the cavity 10 is formed on the resin layer 23 a formed on the core base material 21. Is formed.

  Moreover, in 1st Embodiment, as shown in FIG.1 and FIG.2, on the one main surface of the core base material 21, the root part (part irradiated with a laser beam) of the side wall part 11 of the cavity 10 is provided. The copper layer 22c is patterned linearly so as to be positioned. As shown in FIG. 2, the copper layer 22 c is formed in an annular shape (the entire circumference of the edge of the cavity 10) along the side wall portion 11 of the cavity 10 as viewed in a plan view. It is comprised by the substantially same magnitude | size. The line width of the copper layer 22c is about 0.2 mm. The copper layer 22c is an example of the “metal layer” in the present invention.

  The cavity 10 is formed to have such a size and depth that a resin can be filled after a desired electronic component is mounted in a desired direction. The depth of the cavity 10 can be adjusted by the thickness of the resin layer 23 (23a). A mounting terminal 22d (wiring layer) that is electrically connected to an electronic component mounted inside the cavity is formed on the bottom surface 12 of the cavity 10 (on the main surface of the core substrate 21).

  A buildup layer 30 is formed on the other main surface (surface opposite to the cavity 10) of the cavity member 20. The outermost surface of the buildup layer 30 is a mounting surface 31 on which electronic components are mounted. Since the mounting surface 31 is formed by the build-up layer 30, it is not necessary to form a through-through hole or a through-hole land on the mounting surface 31. Therefore, the entire mounting surface 31 can be used for component mounting. Thereby, the mounting density of an electronic component is raised. Moreover, if a high frequency module is produced using such an organic printed circuit board 50, it becomes possible to reduce the size of the module.

  A ground layer 40 is formed on the inner layer of the organic printed circuit board 50. Moreover, the number of laminated layers of the organic printed circuit board 50 can be changed to the number of layers other than the above as needed.

  As shown in FIGS. 3 and 4, the high-frequency module 100 according to the first embodiment is configured by mounting an electronic component 60 on the organic printed circuit board 50 described above. Function as a broadcast receiving module).

  Specifically, a digital IC 61 (60) is mounted inside the cavity 10 of the organic printed circuit board 50. The digital IC 61 is composed of an OFDM demodulating IC and is electrically connected to the mounting terminal 22d (see FIG. 2) via a bonding wire 70. In order to protect the digital IC 61 and the bonding wire 70, the cavity 10 is filled with a sealing resin. Therefore, the digital IC 61 and the bonding wire 70 are resin-sealed by the sealing resin layer 71. Further, on the mounting surface 31 of the organic printed circuit board 50, an analog IC 62 (60) made of RF-IC (tuner IC), a bandpass filter 63 (60), a crystal oscillator 64 (60), and a passive component 65 (60). (Resistance element, capacitor element, inductor element, etc.) are surface-mounted.

  In addition, by mounting the digital IC 61 inside the cavity 10, a digital circuit 80 (digital circuit portion) is formed on one main surface side (surface side where the cavity 10 is formed) of the organic printed circuit board 50. Yes. On the other hand, by mounting the analog IC 62, the bandpass filter 63, the crystal oscillator 64, and the passive component 65 on the mounting surface 31, the other main surface side of the organic printed circuit board 50 (opposite to the surface on which the cavity 10 is formed). An analog circuit 85 (analog circuit portion) is formed on the surface side of the substrate. The ground layer 40 is disposed between the digital circuit 80 and the analog circuit 85, and both the circuits (the digital circuit 80 and the analog circuit 85) are electrically connected to the ground layer 40. .

  As described above, the high-frequency module 100 according to the first embodiment includes the main components (RF-IC 62 (analog IC 62), OFDM demodulator IC 61 (digital IC 61), bandpass filter 63, crystal oscillator 64 ( 60) etc. are all built-in.

  In addition, a metal shield case 90 for shielding (shielding) high-frequency noise and the like is mounted on the mounting surface 31 of the organic printed circuit board 50. The shield case 90 has three solder terminals 91 bent in an L shape. The mounting surface 31 of the organic printed circuit board 50 is provided with lands (soldering pads) 32 corresponding to the soldering terminals 91 of the shield case 90 at three locations. The shield case 90 is attached to the organic printed circuit board 50 so as to cover the electronic component 60 by soldering the solder terminals 91 of the shield case 90 to the lands 32.

  As shown in FIG. 5, the high-frequency module 100 according to the first embodiment is formed in a square shape having a side length “a” of about 6 mm in plan view.

  Next, the operation of the high-frequency module 100 according to the first embodiment will be described with reference to FIG.

  First, the reception signal input to the reception input terminal 86 is input to the RF-IC 62 after passing through the band-pass filter 63 that selects a signal within the reception band. The RF-IC 62 includes a high frequency amplifier (not shown), a mixer (not shown), a filter (not shown), and an intermediate frequency amplifier (not shown), and is input to the RF-IC 62. The predetermined signal is amplified by the high frequency amplification unit, and the high frequency signal from the amplification unit is converted into an intermediate frequency signal (IF signal) by the mixer. From the converted IF signal, an image interference signal in the IF frequency band is removed by a filter. Then, the signal is amplified to a necessary signal level by the intermediate frequency amplifier and output as an IF signal. The output IF signal is input to the OFDM demodulating IC 61, subjected to analog-digital (A / D) conversion, and then subjected to digital signal processing to be output to the digital output terminal 87 as an MPEG2-TS (transport stream) signal. Is output.

  Next, with reference to FIG. 1 and FIGS. 7-22, the manufacturing method of the organic printed circuit board 50 by 1st Embodiment of this invention is demonstrated.

  First, as shown in FIG. 7, the wiring layers 22 (22a and 22b) are formed on both main surfaces of the core substrate 21 by patterning copper foil (not shown) formed on both surfaces of the core substrate 21. ). At this time, as shown in FIG. 8, on one main surface of the core base material 21, the copper layer is formed at the position where the cavity is formed, along the outer imaginary line m (the outer portion) of the cavity to be formed. 22c is patterned into a line shape (line width of about 0.2 mm). In addition, a mounting terminal 22d is formed in a region inside the copper layer 22c. The core base material 21 may be formed with a through hole (not shown) for interlayer connection.

  Next, as shown in FIG. 7, prepregs 123 (123 a and 123 b) having a predetermined thickness and copper foil 124 are sequentially arranged on both main surfaces of the core substrate 21. As this prepreg 123 (123a), one having a desired thickness can be used depending on the depth of the cavity to be formed. The prepreg 123a is an example of the “second resin layer” and the “adhesive sheet” in the present invention.

  Here, in the first embodiment, the heat-resistant film 110 having the same outer size as the cavity to be formed is arranged between the prepreg 123a arranged on one main surface of the core substrate 21 and the core substrate 21. Keep it. Specifically, first, the heat-resistant film 110 made of polyimide is attached to the surface of the prepreg 123a facing the core substrate 21. Next, the prepreg 123 a is disposed on one main surface of the core base material 21 so that the heat resistant film 110 and the copper layer 22 c of the core base material 21 correspond to each other. The heat-resistant film 110 is an example of the “release member” in the present invention. In addition, the heat resistant film 110 having a predetermined thickness (for example, about 20 μm to about 50 μm) can be used.

  Subsequently, the prepreg 123 and the copper foil 124 arranged on both main surfaces of the core base material 21 are laminated on the core base material 21 by heat and pressure molding by hot pressing. As a result, as shown in FIG. 9, resin layers 23a and 23b made of prepregs 123a and 123b are formed on both main surfaces of the core base material 21, respectively. At this time, the part where the cavity of the prepreg 123a (resin layer 23a) is formed is not bonded to the core base material 21 by the heat-resistant film 110. Depending on the number of layers required, the lamination of the prepreg and the copper foil and the patterning of the copper foil may be repeated. Thereby, the laminated body 20a in which the prepreg 123 is laminated on the main surface of the core base material 21 is formed.

  Next, as shown in FIG. 10, a through-through hole 25 penetrating in the thickness direction is formed in a predetermined region (region other than the region where the cavity is formed) of the stacked body 20a. Next, as shown in FIG. 11, a through-hole plating layer 25 a is formed on the inner surface of the through-through hole 25 by performing copper plating. Then, as shown in FIG. 12, the main surface of the stacked body 20 a is flattened by embedding a conductive or insulating resin 26 in the through through hole 25. Subsequently, as shown in FIG. 13, copper plating layers 27 are formed on both main surfaces of the stacked body 20a. Thereafter, as shown in FIG. 14, the copper foil 124 and the plating layers 25a and 27 are patterned into a predetermined pattern. Thereby, the cavity member 20 is formed.

  Next, as shown in FIGS. 15 to 17, the cavity member 20 (laminated body 20 a) is used as a workpiece 120, and two workpieces 120 are stacked and stacked. Specifically, a frame-shaped prepreg (sheet member) 111 corresponding to the edge (discarding portion) 120 a (see FIG. 16) of the workpiece 120 is sandwiched between the two workpieces 120. Then, the two workpieces 120 are stacked (bonded) so that the surfaces of the workpiece 120 (cavity member 20) where the cavities are formed face each other (with the cavity forming surface on the inside).

  Next, as shown in FIGS. 18 and 19, the build-up layers 30 are formed in the required number of layers on the outer surfaces of the two stacked workpieces 120.

  After that, as shown in FIG. 20, the discarded portion (the portion bonded by the frame-shaped prepreg 111) of the stacked workpieces 120 is cut with a router or the like and separated into two workpieces 120.

  Subsequently, as shown in FIG. 21, in the separated work 120, the surface opposite to the surface on which the buildup layer 30 is formed is irradiated with laser light, whereby a predetermined prepreg 123a (resin layer 23a) is formed. Cut the part. At this time, the laser beam is irradiated onto the copper layer 22 c formed on one main surface of the core base material 21. For example, a carbon dioxide laser or a UV-YAG laser can be used as the laser. The laser is set to a condition that does not process the copper layer 22c. Thereby, as shown in FIG. 22, the part corresponding to the heat-resistant film 110 in the prepreg 123a (resin layer 23a) is removed by the laser, and the concave surface is formed on the surface opposite to the surface on which the buildup layer 30 is formed. The cavity 10 is formed.

  Here, as described above, the portion where the cavity of the prepreg 123a is formed is not bonded to the core base material 21 by the heat-resistant film 110, so that the laser in the prepreg 123a (resin layer 23a) is used. The cut part is easily removed. The portion of the core base material 21 where the heat-resistant film 110 is disposed becomes the bottom surface portion 12 of the cavity 10, and the portion of the prepreg 123 a (resin layer 23 a) cut by the laser becomes the side wall portion 11 of the cavity 10. .

  Finally, formation of solder resist (not shown), surface treatment of electrode terminals, and the like are performed. In this way, the organic printed circuit board 50 according to the first embodiment shown in FIG. 1 is manufactured.

  Moreover, the high frequency module 100 by 1st Embodiment shown in FIG. 3 is manufactured by mounting the electronic component 60 (refer FIG. 3 and FIG. 4) on the organic printed circuit board 50 manufactured by the manufacturing method mentioned above. .

  In the first embodiment, as described above, after the prepreg 123 (123a) is laminated on the main surface of the core substrate 21, the portion corresponding to the heat-resistant film 110 in the prepreg 123a (resin layer 23a) is removed. By forming the concave cavity 10, the cavity 10 is formed after the stacking step, so that deformation of the cavity 10 after the cavity formation can be suppressed. Further, by removing the portion corresponding to the heat-resistant film 110 in the prepreg 123a (resin layer 23a), the sidewall portion 11 of the cavity 10 is formed in the prepreg 123a (resin layer 23a). There is no need to control the resin flow to be flat. Furthermore, by disposing the heat resistant film 110 between the core base material 21 and the prepreg 123a (resin layer 23a), the core base material 21 and the prepreg 123a (resin layer 23a) are provided in the portion where the heat resistant film 110 is disposed. Therefore, the portion corresponding to the heat-resistant film 110 in the prepreg 123a (resin layer 23a) can be easily removed. Thereby, the bottom face part 12 of the cavity 10 can be formed easily. Therefore, by configuring as described above, the cavity 10 can be processed (formed) with high accuracy.

  Further, in the first embodiment, the prepreg 123 having the sufficient resin flow is formed on the main surface of the core substrate 21 by forming the concave cavity 10 after laminating the prepreg 123 on the main surface of the core substrate 21. Can be stacked. For this reason, while being able to suppress the adhesive fall of the core base material 21 and the prepreg 123 (resin layer 23), the embedding property of a circuit (wiring layer 22 (22a)) can be improved. Thereby, reliability, such as insulation reliability, can be improved.

  Moreover, in 1st Embodiment, since the prepreg 123a (resin layer 23a) is laminated | stacked on one main surface of the core base material 21 so that the heat-resistant film 110 may be covered, lamination | stacking is carried out by the heat press molding by hot press. Even when it is performed, it is possible to apply pressure evenly to the prepreg 123a. For this reason, since generation | occurrence | production of a stacking fault can be suppressed, the manufacture yield of an organic printed circuit board can be improved. Moreover, the reliability of the manufactured organic printed circuit board can also be improved.

  Furthermore, in the first embodiment, when the prepreg 123 is stacked, the prepreg 123 (123a) is not provided with a through hole for forming the cavity 10, so that there is no inconvenience that handling properties are deteriorated. For this reason, since workability | operativity can be improved in operations, such as lamination | stacking, the manufacturing efficiency of an organic printed circuit board can be improved.

  In the first embodiment, as described above, the laser is used to cut the portion corresponding to the heat-resistant film 110 in the prepreg 123a (resin layer 23a), thereby cutting the prepreg 123a (resin layer 23a) into a flat shape. Therefore, the side wall part 11 of the cavity 10 formed in the prepreg 123a (resin layer 23a) can be formed flat. Moreover, the part corresponding to the heat-resistant film 110 in the prepreg 123a (resin layer 23a) can be cut | disconnected accurately by using a laser. In addition, by forming a copper layer 22c in a linear shape on the portion of one core surface of the core substrate 21 that is irradiated with laser light, laser conditions are set so as not to process the copper layer 22c. In this case, since the laser does not cut through the copper layer 22c, it is possible to easily control the depth direction (thickness direction) in laser processing. Thereby, the processing precision of the depth direction (thickness direction) at the time of processing of the cavity 10 can be improved. Therefore, by configuring as described above, the processing accuracy of the cavity 10 can be easily improved.

  In the first embodiment, the build-up layer 30 is formed on the main surface of the cavity member 20 (laminated body 20a) opposite to the side where the cavity 10 is formed, so that the build-up in the organic printed circuit board 50 is performed. Since the entire surface on which the layer 30 is formed (the surface opposite to the side on which the cavity 10 is formed) can be used as the mounting surface 31 of the electronic component 60, the mounting density of the electronic components 60 can be increased. . For this reason, if the high frequency module 100 is formed using the organic printed circuit board 50 obtained by such a manufacturing method, the high frequency module can be reduced in size.

  In the first embodiment, the cavity member 20 (laminated body 20a) is the workpiece 120, and the two workpieces 120 are laminated via the frame-shaped prepreg 111 so that the surface sides on which the cavities 10 are formed face each other. In addition, since the buildup layer 30 can be efficiently formed by forming the buildup layer 30 on the outer surface of the stacked workpieces 120, the manufacturing efficiency of the organic printed circuit board can be easily improved. it can.

  Moreover, since the high frequency module 100 according to the first embodiment uses the organic printed circuit board 50 manufactured by using the above-described manufacturing method, a highly reliable high frequency module can be obtained. Note that by forming the high-frequency module using the organic printed circuit board 50 having a cavity structure, it is possible to effectively suppress the occurrence of chipping and cracking compared to the case of using a ceramic substrate. For this reason, this also improves the reliability. Further, even when the organic printed circuit board 50 is thinned, there is no fear of chipping or cracking, so that the high-frequency module can be thinned.

  In the high frequency module 100 according to the first embodiment, since the ground layer 40 is formed between the analog circuit 85 and the digital circuit 80, noise countermeasures of the high frequency module can be easily performed. , Can increase the reliability.

  Next, an organic printed circuit board 150 according to a modification of the first embodiment will be described with reference to FIGS. 21 and 23 to 25.

  In the modification of the first embodiment, as shown in FIG. 23, in the configuration of the first embodiment, the copper layer 22 c formed on one main surface of the core substrate 21 is formed on the side wall portion of the cavity 10. It is patterned in a line shape (line width of about 0.2 mm) so as to be located at a part of the 12 root portions. Specifically, the copper layer 22 c is patterned so as to be positioned at the four corners of the cavity 10. For this reason, in the modification of 1st Embodiment, it is in the state which a part of copper layer 22c interrupted. The mounting terminals 22d (wiring layers) formed on the bottom surface 11 of the cavity 10 (on the main surface of the core base material 21) are connected to the region outside the copper layer 22c (cavity 10) through the interrupted portion. The outer region of the

  Other configurations of the modified example of the first embodiment are the same as those of the first embodiment.

  Further, the organic printed circuit board 150 according to the modification of the first embodiment is partly patterned when a copper foil (not shown) formed on the core base material 21 is patterned in the manufacturing method of the first embodiment. Is patterned into a shape as shown in FIG. Specifically, the copper layer 22c is linearly formed on one main surface of the core base material 21 so as to follow a part (four corners) of the external imaginary line m of the cavity to be formed at a position where the cavity is formed. Patterning is performed (line width is about 0.2 mm). Also, the mounting terminal 22d is formed so as to extend from the inner region to the outer region of the copper layer 22c.

  Further, before the prepreg 123a is laminated, a part of the prepreg 123a to be laminated on one main surface of the core base material 21 is cut out into a shape as shown in FIG. Specifically, a part of the outer imaginary line m (a part other than the four corners) of the cavity to be formed is formed as a perforated portion 1231a with a mold or the like.

  Then, using the method similar to the said 1st Embodiment, it carries out to the process before removing the predetermined part of the prepreg 123a.

  Then, the part corresponding to the heat-resistant film 110 (refer FIG. 21) of the laminated | stacked prepreg 123a is removed using a laser. At this time, by irradiating a laser beam onto the copper layer 22c formed on one main surface of the core substrate 21, uncut portions in the prepreg 123a (four corner portions of the imaginary virtual line m of the cavity) are cut. To do. Thereby, the part corresponding to the heat-resistant film 110 (refer FIG. 21) in the prepreg 123a is removed with a laser, and the concave cavity 10 is formed in the single side | surface of an organic printed circuit board.

  In the modification of the first embodiment, when the circuit (wiring layer) is formed on the main surface of the first resin layer with the above-described configuration, the inside of the copper layer 22c is interposed through the disconnected portion. The mounting terminal 22d can be routed from the region (region inside the cavity 10) to the region outside the copper layer 22c (region outside the cavity 10). For this reason, the freedom degree of routing of the mounting terminal 22d can be improved.

  Note that if the copper layer 22c is formed at the four corners of the outer imaginary line m of the cavity 10 by cutting through the corners other than the four outer imaginary lines m of the cavity 10 in the prepreg 123a, the copper layer 22c is mounted via the portions other than the four corners. The terminal 22d can be routed. In this case, the degree of freedom in routing the mounting terminal 22d can be further improved.

(Second Embodiment)
With reference to FIGS. 26-29, the organic printed circuit board 250 by the 2nd Embodiment of this invention and the high frequency module 300 using the same are demonstrated.

  As shown in FIG. 26, the organic printed circuit board 250 according to the second embodiment has concave cavities 210 (210a and 210b) for accommodating electronic components (not shown) on both main surface sides. Yes. That is, the organic printed circuit board 250 according to the second embodiment is composed of a multilayer wiring board having a cavity structure on both sides.

  The organic printed circuit board 250 has an insulating core base material 221, and a wiring layer 222 and a resin layer 223 are laminated on both surfaces of the core base material 221. In addition, wiring layers 224 (224a and 224b) made of copper (Cu) are formed on the main surfaces of the resin layers 223a and 223b, respectively. Furthermore, resin layers 225 (225a and 225b) having a predetermined thickness (for example, about 0.3 mm) are provided on the main surfaces of resin layers 223a and 223b so as to cover wiring layers 224 (224a and 224b), respectively. Is formed. On the main surfaces of the resin layers 225a and 225b, wiring layers 226a and 226b are formed, respectively. The resin layers 223a and 223b are examples of the “first resin layer” in the present invention, and the resin layer 225 is an example of the “second resin layer” in the present invention.

  Further, a through through hole (not shown) penetrating in the thickness direction is formed in a predetermined portion of the organic printed circuit board 250.

  The cavity 210 of the organic printed circuit board 250 includes a side wall portion 211 and a bottom surface portion 212, and is formed in a substantially rectangular shape when seen in a plan view as in the first embodiment. In the cavity 210, the bottom surface portion 212 of the cavity 210 is formed on the main surface of the resin layer 223, and the side wall portion 211 of the cavity 210 is formed in the resin layer 225.

  Further, on one main surface of the resin layer 223 (on the main surface opposite to the core base material 221), the copper layer 224c is linearly patterned so as to be located at the root portion of the side wall portion 211 of the cavity 210. Has been. The line width of the copper layer 224c is about 0.2 mm. A mounting terminal (not shown) that is electrically connected to an electronic component mounted inside the cavity is formed on the bottom surface portion 212 of the cavity 210. A ground layer 240 is formed on the inner layer of the organic printed circuit board 250. The copper layer 224c is an example of the “metal layer” in the present invention.

  Further, the number of laminated layers of the organic printed circuit board 250 can be changed to a number other than the above as necessary.

  Other configurations of the organic printed circuit board 250 according to the second embodiment are the same as those of the first embodiment.

  As shown in FIGS. 27 and 28, the high-frequency module 300 according to the second embodiment is configured by mounting the electronic component 60 on the organic printed circuit board 250 having the above-described double-sided cavity structure, and functions as a 1-segment module. To do.

  Specifically, the digital IC 61 is mounted inside one cavity 210 a of the organic printed circuit board 250. The digital IC 61 (60) is composed of an OFDM demodulating IC and is electrically connected to a mounting terminal (not shown) via a bonding wire 70. In order to protect the digital IC 61 and the bonding wire 70, the cavity 210a is filled with a sealing resin. Therefore, the digital IC 61 and the bonding wire 70 are resin-sealed by the sealing resin layer 71. Further, an analog IC 62 (60) made of an RF-IC (tuner IC), a bandpass filter 63 (60), a crystal oscillator 64 (60), and a passive component 65 (inside the other cavity 210b of the organic printed circuit board 250). 60) (resistive element, capacitor element, inductor element, etc.) is surface mounted.

  Further, the digital IC 61 is mounted inside the cavity 210 a, thereby forming a digital circuit 80 (digital circuit portion) on one main surface side of the organic printed circuit board 250. On the other hand, the analog IC 62, the bandpass filter 63, the crystal oscillator 64, and the passive component 65 are mounted inside the cavity 210b, whereby an analog circuit 85 (analog circuit portion) is formed on the other main surface side of the organic printed circuit board 250. Is formed. In addition, the ground layer 240 is disposed between the digital circuit 80 and the analog circuit 85, and both the circuits (the digital circuit 80 and the analog circuit 85) are electrically connected to the ground layer 240. .

  As described above, the high-frequency module 300 according to the second embodiment includes the main components (RF-IC 62 (analog IC 62), OFDM demodulator IC 61 (digital IC 61), bandpass filter 63, crystal oscillator 64, etc.) that operate as a tuner. ) Are all built-in.

  Further, a standing wall portion 245 is formed on the other main surface side of the organic printed circuit board 250 by forming the cavity 210b. The standing wall portion 245 has a width b (see FIG. 29) of about 0.4 mm, and a terminal 246 that is electrically connected to the ground layer 240 is formed on the upper surface thereof. And the shield board 260 which consists of metal flat plates is attached to the upper surface of the standing wall part 245 so that the opening of the cavity 210b may be covered (the electronic component 60 is covered). Further, the shield plate 260 is connected to the terminal 246 by soldering, and is thereby configured to have a ground shield effect. The shield plate 260 is an example of the “metal plate having a shielding effect” in the present invention.

  In addition, as shown in FIG. 29, the high-frequency module 300 according to the second embodiment is formed in a square shape with a side length a of about 6 mm as viewed in a plan view.

  The operation of the high-frequency module 300 according to the second embodiment is the same as that of the first embodiment, and a description thereof will be omitted.

  In the high-frequency module 300 according to the second embodiment, as described above, the cavity in which the electronic component 60 (the analog IC 62, the bandpass filter 63, the crystal oscillator 64, the passive component 65, etc.) for forming the analog circuit 85 is accommodated. By attaching the shield plate 260 to the upper surface of the standing wall 245 so as to cover 210b, a high-frequency module having a ground shield effect can be easily obtained.

  In the high frequency module 300 according to the second embodiment, the analog circuit 85 can be covered with the flat shield plate 260 by using the organic printed circuit board 250 having a double-sided cavity structure. For this reason, since it is not necessary to process a metal plate into a case shape, the process of the shield board 260 becomes easy and the processing cost can be reduced.

  Next, with reference to FIG. 26, FIG. 29 and FIGS. 30 to 36, a method for manufacturing the organic printed circuit board 250 according to the second embodiment of the present invention will be described.

  First, as shown in FIG. 30, a wiring layer 222 is formed on both main surfaces of the core substrate 221 by patterning copper foil (not shown) formed on both surfaces of the core substrate 221. Next, after the prepreg 323 and the copper foil are laminated on both surfaces, the copper foil is patterned. Repeat these steps until the required number of layers.

  At this time, as shown in FIG. 31, on the main surface of the prepreg 323 (resin layer 223), the copper layer is formed at the position where the cavity is formed, along the outer imaginary line of the cavity to be formed (the portion that becomes the outer shape). The 224c is patterned into a line (line width of about 0.2 mm). In addition, a mounting terminal (not shown) is formed in a region inside the copper layer 224c.

  Next, as shown in FIG. 32, a prepreg 325 having a predetermined thickness and a copper foil 326 are sequentially formed on the main surfaces of the prepregs 323a and 323b (on the main surface opposite to the core base material 221). Deploy. As the prepreg 325, a material having a desired thickness can be used depending on the depth of the cavity to be formed. The prepregs 323a and 323b are examples of the “first resin layer” of the present invention, and the prepreg 325 is an example of the “second resin layer” and the “adhesive sheet” of the present invention.

  Here, in the second embodiment, the heat-resistant film 110 having the same outer size as the cavity to be formed is disposed between the prepreg 325 (resin layer 225) and the prepreg 323 (323a and 323b) serving as the inner layer. Specifically, first, the heat-resistant film 110 made of polyimide is attached to the surface of the prepreg 325 on the core base material 221 side. Next, the prepreg 325 is disposed on the inner prepreg 323 (323a and 323b) so that the heat-resistant film 110 and the copper layer 224c correspond to each other.

  Subsequently, as shown in FIG. 33, the prepreg 325 and the copper foil 326 arranged on the prepreg 323 (323a and 323b) are laminated by hot pressing with hot press. Thereby, the resin layer 225 which consists of prepreg 325 is formed on the main surface of prepreg 323 (323a and 323b), respectively. At this time, the portion of the prepreg 325 (resin layer 225) where the cavity is formed is not bonded to the prepreg 323 (323a and 323b) by the heat-resistant film 110. Depending on the number of layers required, the lamination of the prepreg and the copper foil and the patterning of the copper foil may be repeated.

  Next, after making interlayer connection by forming a through-through hole (not shown), the copper foil 326 laminated on the prepreg 325 is patterned to form a wiring layer 226 (226a, 226a, 226b) and terminals 246 (see FIG. 29).

  Subsequently, as shown in FIG. 35, the prepreg 325 (resin layer 225) is irradiated with laser light to cut a predetermined portion of the prepreg 325 (resin layer 225). At this time, the laser beam is irradiated onto the copper layer 224c formed on the prepreg 323 (323a and 323b). The laser is set to a condition that does not process the copper layer 224c. As a result, as shown in FIG. 36, portions corresponding to the heat-resistant film 110 in the prepreg 325 (resin layer 225) are removed by the laser, and concave cavities 210 (210a and 210b) are formed on both surfaces of the organic printed circuit board 250. Is done.

  Here, as described above, the portion where the cavity of the prepreg 325 is formed is not bonded to the inner layer prepreg 323 (323a and 323b) by the heat-resistant film 110, so that the prepreg 325 (resin layer) The part cut by the laser in 225) is easily removed. The portion of the core base material 221 where the heat resistant film 110 is disposed becomes the bottom surface portion 212 of the cavity 210, and the portion of the prepreg 325 (resin layer 225) cut by the laser becomes the side wall portion 211 of the cavity 210. .

  Finally, formation of solder resist (not shown), surface treatment of electrode terminals, and the like are performed. In this way, the organic printed circuit board 250 according to the first embodiment shown in FIG. 26 is manufactured.

  Further, by mounting the electronic component 60 (see FIG. 27) on the organic printed circuit board 250 manufactured by the above-described manufacturing method, the high-frequency module 300 according to the first embodiment shown in FIG. 27 is manufactured.

  The effect of the manufacturing method of the organic printed circuit board 250 according to the second embodiment is the same as that of the first embodiment.

  Moreover, since the high frequency module 300 according to the second embodiment uses the organic printed circuit board 250 manufactured by using the above-described manufacturing method, a highly reliable high frequency module can be obtained as in the first embodiment. it can. Note that by forming a high-frequency module using the organic printed circuit board 250 having a cavity structure, it is possible to effectively suppress the occurrence of chips and cracks compared to the case of using a ceramic substrate.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and further includes all modifications within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the first and second embodiments, an example in which a heat-resistant film made of polyimide is used as the heat-resistant film disposed between the core base material and the prepreg and between the prepreg and the prepreg has been described. However, the heat-resistant film may be a heat-resistant film made of a material other than polyimide. Examples of materials other than polyimide include aramid resin.

  Moreover, although the example which formed the resin layer (insulating layer) using the prepreg was shown in the said 1st and 2nd embodiment, this invention is not restricted to this, Resin using members (materials) other than a prepreg A layer (insulating layer) may be formed. For example, the resin layer (insulating layer) may be formed using a copper foil with resin or a film-like or liquid thermosetting insulating material.

  In the first and second embodiments, an example in which a cavity is formed by cutting one layer of a prepreg (resin layer) with a laser is shown. However, the present invention is not limited to this, and a plurality of stacked layers are used. The cavity may be formed by cutting the prepreg (resin layer) with a laser.

  In the first and second embodiments, the example in which the high-frequency module is configured to function as a 1-segment module has been described. However, the present invention is not limited thereto, and the high-frequency module functions as a module other than the 1-segment module. You may comprise. The high-frequency module includes electronic components such as transistors, memories, and diodes (including LEDs) in addition to integrated circuit elements such as bare chip ICs and WL-CSPs, LPFs (Low Pass Filters), crystal oscillators, and passive components. Can be implemented.

  In the first and second embodiments, the shape and dimensions of the high-frequency module, the circuit configuration, and the like can be changed as appropriate.

  Further, in the modification of the first embodiment, the copper is formed on one main surface of the core base material so that the cavity is formed at a position along the part of the virtual imaginary line (four corners) of the cavity to be formed. Although the example in which the layer is linearly patterned has been shown, the present invention is not limited to this, and the copper layer may be patterned so as to be along a part other than the four corners of the external imaginary line of the cavity to be formed. . In this case, the cut-out portion of the prepreg is formed in a portion other than the portion where the copper layer is formed in the outline virtual line of the cavity to be formed.

  Moreover, in the said 2nd Embodiment, you may comprise the copper layer formed in the position irradiated with a laser like the modification of 1st Embodiment. In this case, a cutout portion is formed in a part of the prepreg as in the modification of the first embodiment.

  In the second embodiment, the opening of the cavity in which the analog circuit is formed may be completely blocked by the shield plate or may not be completely blocked.

10, 210, 210a, 210b Cavity 11, 211 Side wall part 12, 212 Bottom part 20 Cavity member 20a Laminate 21 Core substrate (first resin layer)
22, 22a, 22b Wiring layer 22c, 224c Copper layer (metal layer)
22d Mounting terminal 23, 23a Resin layer (second resin layer)
30 Build-up layer 31 Mounting surface 40, 240 Ground layer 50, 250 Organic printed circuit board 60 Electronic component 61 Digital IC, OFDM demodulation IC
62 Analog IC, RF-IC
63 Band pass filter 64 Crystal oscillator 65 Passive component 71 Sealing resin layer 80 Digital circuit (digital circuit part)
85 Analog circuit (Analog circuit part)
90 Shield case 100, 300 High-frequency module 110 Heat-resistant film (release member)
111 prepreg (sheet member)
120 work 123a prepreg (second resin layer, adhesive sheet)
1231a Cutout part 223a, 223b Resin layer (first resin layer)
225, 225a, 225b Resin layer (second resin layer)
245 Standing wall 260 Shield plate (metal plate with shielding effect)
323a, 323b Prepreg (first resin layer)
325 prepreg (second resin layer, adhesive sheet)

Claims (15)

A laminating step of laminating an insulating second resin layer on the main surface of the insulating first resin layer;
A cavity forming step of forming a concave cavity by removing a predetermined portion of the second resin layer,
The laminating step includes a step of arranging a release member between the first resin layer and the second resin layer,
The cavity forming step includes
Forming a side wall portion of the cavity in the second resin layer by removing a portion corresponding to the release member in the second resin layer;
A step of forming a bottom surface portion of the cavity in a portion of the first resin layer where the release member is disposed by removing the release member. Production method.   The method of manufacturing an organic printed circuit board according to claim 1, wherein the release member is formed to have the same outer size as the cavity. The step of forming the side wall portion of the cavity includes a step of cutting a portion corresponding to the release member in the second resin layer using a laser,
3. The organic material according to claim 1, further comprising a step of forming a metal layer on a portion of the first surface of the first resin layer irradiated with laser light prior to the laminating step. A method for manufacturing a printed circuit board. The second resin layer is made of an insulating adhesive sheet,
Before laminating the adhesive sheet on the first resin layer, further comprising a step of cutting out a part of the outer shape of the cavity in the adhesive sheet,
The step of forming the side wall portion of the cavity includes a step of cutting a portion of the adhesive sheet that is an outer shape of the cavity that is not cut out using a laser. The manufacturing method of the organic printed circuit board of any one of these.   5. The method of manufacturing an organic printed circuit board according to claim 4, wherein the step of cutting out a part of the adhesive sheet includes a step of cutting out portions other than the four corners of the portion of the adhesive sheet that forms the outer shape of the cavity.   Prior to the step of laminating the adhesive sheet, the method further comprises a step of forming a metal layer on a portion irradiated with laser light on the main surface of the first resin layer. The manufacturing method of the organic printed circuit board of description. Forming a through-hole that continuously penetrates the first resin layer and the second resin layer;
7. The method according to claim 1, further comprising a step of forming a buildup layer on a main surface opposite to the side where the cavity is formed in the first resin layer. Manufacturing method of organic printed circuit board. A laminate in which the second resin layer is laminated on the first resin layer is used as a workpiece, and the two workpieces are bonded to each other through a frame-shaped sheet member so that the surfaces on which the cavities are formed face each other. Process,
Forming the build-up layer on the outer surface of the bonded workpiece;
The method for manufacturing an organic printed circuit board according to claim 7, further comprising a step of cutting the bonded portion of the bonded workpieces into two workpieces. An insulating first resin layer having a metal layer formed on the main surface;
An insulating second resin layer formed on the main surface of the first resin layer;
A concave cavity formed by removing a predetermined portion of the second resin layer,
The cavity includes a bottom surface portion formed in the first resin layer and a side wall portion formed in the second resin layer,
The organic printed circuit board, wherein the metal layer is patterned so as to be located at a root portion of a side wall portion of the cavity.   The organic printed circuit board according to claim 9, wherein the metal layer is formed on a part of a base portion of the side wall portion.   11. The organic printed circuit board according to claim 9, wherein the metal layer is a part of a base portion of the side wall portion and is formed at positions of four corners of the cavity.   The buildup layer is formed on the surface of the first resin layer opposite to the surface on which the second resin layer is formed. Organic printed circuit board as described in 2. An organic printed circuit board produced using the production method according to any one of claims 1 to 8,
A digital circuit formed in the cavity of the organic printed circuit board;
A high-frequency module, comprising: an analog circuit portion formed on a main surface side opposite to the cavity of the organic printed circuit board. An organic printed circuit board produced using the production method according to any one of claims 1 to 6,
A digital circuit portion and an analog circuit portion formed on the organic printed circuit board;
A metal plate having a shielding effect attached to the organic printed circuit board,
The organic printed circuit board has cavities formed on both sides thereof,
The digital circuit part is formed in the cavity on one side of the organic printed circuit board, and the analog circuit part is formed in the cavity on the other side of the organic printed circuit board,
The high-frequency module, wherein the metal plate is attached so as to cover the cavity in which the analog circuit portion is formed.   The high frequency module according to claim 13 or 14, wherein the organic printed circuit board includes a ground layer formed between the digital circuit portion and the analog circuit portion.

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