JP2006261387A - Module and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a module which is reduced both in size and in height and capable of performing a stable circuit operation. <P>SOLUTION: The module is composed of a first wiring board 107 formed with, at least, a single wiring pattern 102, a shield layer 103, and an electrical insulating layer 101; a second wiring board 108 formed with, at least, a single wiring pattern layer and an electric insulating layer; a support 105 which fixes the first wiring board 107 and the second wiring board 108; a through-hole electrode 106 which is provided to the first wiring board 107, the second wiring board 108, and the support 105 and electrically connects the first wiring board 107 and the second wiring board 108; and two or more electronic parts 104 mounted to the opposed wiring patterns 102 of the first wiring board 107 and the second wiring board 108. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a module mounted on an electronic device such as a mobile phone and a method for manufacturing the module.

  In recent years, with the trend toward higher performance and smaller size of electronic devices, there is a further demand for higher density and higher functionality of circuit components. Modules with circuit components are also required to support high density and high functionality. As a high-density mounting method, a method of stacking components as in LTCC, and a three-dimensional mounting in which passive components are arranged inside a substrate have been developed.

  In LTCC multilayer modules, capacitors and inductors are built in a ceramic multilayer substrate as a built-in circuit pattern, and electronic components that cannot be built in the substrate are mounted on the surface of the multilayer substrate. A cover is attached (see Non-Patent Document 1).

In addition, LTCC is expensive and there is a limit to the parts that can be formed inside the pattern, and large capacitors and semiconductors cannot be built in. As a part built-in module, it isolates electronic parts that could not be built on the board by LTCC. The efforts to reduce the size by incorporating them in the layer are also being made (see Patent Document 1 and Patent Document 2).
JP 2004-128413 A Japanese Patent Laid-Open No. 11-220262 “Nikkei Electronics” July 26, 1999 (No. 748) p. 140-152

  However, in response to the demand for thinning a mobile phone or the like, a structure in which a plurality of electronic components on the multilayer substrate are covered with a metal cover is employed. There is a problem that a large space is formed, which increases the size of the entire module.

  In Patent Document 1, a recess is formed in the LTCC substrate, chip components are mounted, and the upper and lower LTCC substrates are connected by a bonding pattern. However, the height of the chip component that can be disposed in the recess is the depth of the recess. It is limited by the height of the bonding pattern and the like, and it is difficult to mount components such as semiconductors and filters. In addition, since the mounting area is not increased, there is a problem that does not lead to significant downsizing.

  On the other hand, in the component built-in module (Patent Document 2), since the thickness of the built-in layer is determined by the height of the built-in component, the number of components that can be built in is limited depending on the height of the back. As the area was reduced in size, the thickness tended to increase.

  Therefore, an object of the present invention is to provide a module that can be reduced in size and height.

  In order to solve the conventional problem, a module according to claim 1 of the present invention includes at least one wiring pattern 102, a shield layer 103, a first wiring board 107 having an electrical insulating layer 101, and at least one layer. A wiring pattern of layers, a second wiring board 108 having an electrical insulating layer, the first wiring board 107, a support 105 for fixing the second wiring board 108, the first wiring board 107, The second wiring board 108, the through-hole electrode 106 formed on the support 105 and electrically connecting the first wiring board 107 and the second wiring board 108, and the first wiring board 107. Two or more electronic components 104 are mounted on the wiring pattern 102 facing the second wiring board 108.

  With this configuration, the first wiring board 107 and the second wiring board 108 on which the electronic component 104 is mounted are arranged facing each other and fixed by the support body 105, so that the conventional metal cover can be eliminated and a small and low profile can be obtained. And the number of parts can be reduced at the same time.

  In addition, the shield layer 103 disposed outside the first wiring board 107 can realize stable circuit operation even in a high frequency range.

  Further, in the formation of the through-hole electrode 106, it can be used as a power supply pattern, and a highly reliable electrical connection can be obtained regardless of the height of the electronic component 104.

  In order to solve the conventional problem, a module according to claim 2 of the present invention includes at least one wiring pattern, a first wiring board having a shield layer and an electrical insulating layer, and at least one wiring pattern. A second wiring board having an electrical insulating layer, a built-in layer for fixing the first and second wiring boards, the first and second wiring boards, and the built-in layer. A through-hole electrode that electrically connects between one wiring board and the second wiring board; and two or more electronic components built in the built-in layer and arranged in the wiring pattern facing the first and second wiring boards Is implemented.

  With this configuration, the mounting area is increased by using two wiring boards, and the electronic component mounting surfaces of the first wiring board and the second wiring board are arranged facing each other and fixed by the built-in layer. Compared to a conventional configuration in which chip components are mounted on an LTCC substrate, a small and low profile can be realized.

  Further, the first and second wiring boards can be fixed over the entire surface of the wiring board, and the reliability is improved.

  In order to solve the conventional problem, a module according to claim 3 of the present invention includes at least one wiring pattern, a first wiring board having a shield layer and an electrical insulating layer, and at least one wiring pattern. A second wiring board having an electrically insulating layer, a built-in layer and a support for fixing the first and second wiring boards, and at least one of the support and the built-in layer, the first and second A through-hole electrode that is electrically connected between the first wiring board and the second wiring board, and is built in the built-in layer, and the first and second wiring boards are opposed to each other. Two or more electronic components are mounted on a wiring pattern.

  With this configuration, the mounting area is increased by using two wiring boards, and the electronic component mounting surfaces of the first wiring board and the second wiring board are arranged facing each other and fixed by the built-in layer and the support. This eliminates the need for multiple stages as in the case of a conventional module with a built-in component, thereby realizing a small and low profile.

  Furthermore, the support and the built-in layer can be easily handled, and the first and second wiring boards can be fixed over the entire surface of the wiring board, thereby improving the reliability.

  In order to solve the conventional problems, the module according to claim 4 of the present invention is the module according to claim 1 or 3, wherein the resin component of the support and the electrical insulating layer is the same.

  With this configuration, the thermal expansion coefficients of the support and the electrical insulating layer are equalized, and the reliability in a situation where there is a temperature change such as reflow is improved.

  In order to solve the conventional problem, the module according to claim 5 of the present invention is the module according to claim 3, wherein the resin component of the support and the built-in layer is the same.

  With this configuration, the thermal expansion coefficients of the support and the electrical insulating layer are equalized, and the reliability in a situation where there is a temperature change such as reflow is improved.

  In order to solve the conventional problem, the module according to claim 6 of the present invention is the module according to claim 2 or 3, wherein the resin component of the electrical insulating layer and the built-in layer is the same.

  With this configuration, the thermal expansion coefficients of the support and the electrical insulating layer are equalized, and the reliability in a situation where there is a temperature change such as reflow is improved.

  In order to solve the conventional problem, a module according to a seventh aspect of the present invention is the module according to any one of the first to sixth aspects, wherein the electronic component having the highest height among the electronic components is face-to-face. No other electronic component is mounted at the position to be mounted, and the height of the support is made higher than the height of the tallest electronic component, or the backmost so as to face the tallest electronic component. The height of the support is higher than the total height of the tallest electronic component and the shortest electronic component, and the total height of other electronic components facing each other is mounted. Is lower than the height of the support.

  With this configuration, electronic components are mounted face-to-face on each of the two wiring boards, so that the difference in height of the electronic components can be used effectively, and the space above the small electronic components can also be used effectively. Small, low-profile modules can be provided.

  In order to solve the conventional problem, a module according to an eighth aspect of the present invention is the module according to any one of the first to sixth aspects, wherein at least one of the first wiring board and the second wiring board. Has an opening, and an electronic component having a mounting height higher than the distance between the first and second wiring boards is arranged in the opening.

  With this configuration, a reduction in height can be realized even when an electronic component having a high mounting height is disposed.

  In order to solve the conventional problem, the module according to claim 9 of the present invention is the module according to claim 8, wherein the opening is filled with a built-in layer, and the built-in layer of the opening is shielded. Is formed.

  With this configuration, a shield layer can be formed also in the opening of the wiring board, and stable operation at high frequencies is facilitated.

  In order to solve the conventional problem, a module according to claim 10 of the present invention is the module according to any one of claims 1 to 9, wherein the wiring board is a multilayer wiring board.

  With this configuration, it is possible to cope with a complicated wiring pattern and to manufacture a module with higher functionality.

  In order to solve the above-described conventional problem, the module manufacturing method according to claim 11 of the present invention includes a step of mounting electronic components on the wiring patterns of the first and second wiring boards and the wiring boards facing each other. And the process of fixing with a support body and the process of forming a through-hole electrode in the said wiring board and a support body are included.

  By this method, a module having a structure in which the first wiring board and the second wiring board are arranged so that the electronic components mounted on both of them are face-to-face and fixed by a support can be manufactured. Can provide.

  In order to solve the conventional problem, the module manufacturing method according to claim 12 of the present invention includes a step of mounting electronic components on the wiring patterns of the first and second wiring boards and the wiring boards facing each other. Then, the method includes a step of stacking and fixing in the built-in layer and a step of forming a through-hole electrode in the wiring board and the built-in layer.

  This method makes it possible to produce a module having a structure in which the first wiring board and the second wiring board are arranged so that the electronic components mounted on both are opposed to each other and fixed by a built-in layer. Can provide.

  In order to solve the above-mentioned conventional problems, a method for manufacturing a module according to claim 13 of the present invention includes a step of mounting electronic components on the wiring patterns of the first and second wiring boards and the wiring boards facing each other. Then, the method includes a step of fixing with the support and the built-in layer, and a step of forming a through-hole electrode on at least one of the support and the built-in layer and the wiring board.

  With this configuration, it is possible to manufacture a module having a structure in which the first wiring board and the second wiring board are arranged so that the electronic components mounted on both of them face each other and fixed by the support and the built-in layer. Can provide back module.

  In order to solve the conventional problem, the module manufacturing method according to claim 14 of the present invention is the module manufacturing method according to any one of claims 11 to 13, wherein at least one of the support and the built-in layer is provided. And a step of patterning at least one of the shield layer and the wiring pattern after forming the through-hole electrode on the wiring board.

  With this configuration, after forming the through-hole electrode, at least one of the shield layer and the wiring pattern can be easily processed into an arbitrary shape.

  In order to solve the conventional problem, the module manufacturing method according to claim 15 of the present invention is the module manufacturing method according to any one of claims 11 to 13, wherein at least one of the support and the built-in layer is provided. And a step of forming a through-hole electrode on the wiring board and then cutting it into modules.

  With this configuration, the modules can be formed in a lump and the end face through-hole electrodes can be easily formed.

  According to the configuration of the present invention, it is possible to provide a module that eliminates a metal shield, can be reduced in size and height, and can realize a stable circuit operation.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

(Embodiment 1)
FIG. 1 is a cross-sectional view of a module according to Embodiment 1 of the present invention.

  In FIG. 1, the module has an electrical insulating layer 101, a wiring pattern 102, a shield layer 103, an electronic component 104, a support 105, and a through-hole electrode 106. , An electric insulating layer 101, a wiring pattern 102, and an electromagnetic shield layer 103. The second wiring board 108 has an electrical insulating layer 101 and a wiring pattern 102.

  The support 105 fixes the first wiring board 107 and the second wiring board 108.

  The through-hole electrode 106 is formed so as to penetrate the first wiring board 107, the support body 105, and the second wiring board 108.

  As the first wiring board 107 and the second wiring board 108, a glass epoxy substrate, a build-up substrate, a ceramic substrate, a flexible substrate, or the like can be used. When the first wiring board 107 and the second wiring board 108 are multi-layer substrates, a complicated circuit can be formed. A resist may be formed on the surface. The first wiring board 107 and the second wiring board 108 may be made of the same material.

  As the electrical insulating layer 101, a mixture of a reinforcing material and a resin (for example, a glass epoxy material or an aramid epoxy material), an insulating resin, a mixture of a filler and an insulating resin, and the like, which are used for a normal wiring board, can be used. .

  As the insulating resin, a thermosetting resin, a thermoplastic resin, a photocurable resin, or the like can be used. For example, an epoxy resin, a phenol resin, a cyanate resin, a fluorine resin, a PTFE resin, a PPO resin, a PPE resin, Liquid crystal polymer and the like.

  The heat resistance, dielectric constant, and dielectric loss tangent of the first wiring board 107 and the second wiring board 108 can be adjusted by selecting an appropriate resin.

  Examples of the filler that can be used include alumina, magnesia, boron nitride, aluminum nitride, silicon nitride, Teflon (registered trademark), and silica. By selecting an appropriate filler, the linear expansion coefficient, thermal conductivity, dielectric constant, density, strength, etc. of the first wiring board 107 and the second wiring board 108 can be easily controlled. Further, a dispersant, a colorant, a coupling agent or a release agent may be included.

  The wiring pattern 102 is made of a material having electrical conductivity. For example, a metal foil, a conductive resin composition, or a lead frame processed from a metal plate can be used. A wiring pattern can be produced by etching, printing, plating, punching, or the like.

  Further, the wiring pattern 102 may have a plating process, a roughening process, or a resist formed on the surface. In addition, functions such as a coupler and a filter can be formed by the wiring pattern 102. Further, the wiring pattern 102 may be formed in the layer where the electromagnetic shield 103 is formed.

  The shield layer 103 can be formed using the same conductive material or magnetic absorber as the wiring pattern 102 and can be formed in the same process as the wiring pattern 102.

  By forming the shield layer 103, interference of electromagnetic waves with the electronic component 104 or emission of electromagnetic waves from the electronic component 104 can be reduced.

  By setting the shield layer 103 to the ground potential, a stable operation of the module can be achieved, a metal cover is not necessary, and costs, processes, and height can be reduced. The ground potential is obtained by connecting to the ground potential of the first wiring board 107, the second wiring board 108, or the substrate on which the module is mounted, by a through-hole electrode 106, a via in the substrate, or the like.

  The shield layer 103 is not limited to one layer. By making the shield layer 103 a smooth structure, it becomes easy to perform adsorption by the mounter.

  As the electronic component 104, for example, a package or bare chip semiconductor, a chip component such as a capacitor, an inductor, or a resistor, a diode, a thermistor, a switch, or the like can be used.

  For mounting the electronic component 104, for example, solder or a conductive adhesive can be used. Various electronic components 104 are used for the module, but the mounting height of the electronic components is considerably different, and there is a difference of about 1 mm between the chip component such as 0603 and the SAW filter or semiconductor contained in the package. .

  Therefore, by arranging electronic components with a low mounting height so as to face each other, a space above the electronic components with a low mounting height that is not normally used can be used, and the module can be downsized. .

  Specifically, no other electronic component is mounted at the position facing the tallest electronic component among the electronic components 104, or the shortest so as to face the tallest electronic component. Mount electronic components.

  At this time, the height of the support 105 is set higher than the total height of the tallest electronic component and the shortest electronic component.

  In addition, the total height of the electronic components 104 other than the above that face each other is made lower than the height of the support 105.

  With such a structure, the module can be reduced in size and height.

  The material of the support 105 has an electrical insulating property, and the same material as the electrical insulating layer 101 can be used.

  The through-hole electrode 106 has a function of electrically connecting the wiring patterns 102 of the first wiring board 107 and the second wiring board 108 by forming an electrode by plating after forming a drill or laser processed through-hole. have.

  When the through-hole electrode 106 is formed on the end face, it is possible to check the mounting state by solder or the like when the module is mounted on the substrate.

  The plating can be performed in a plurality of ways, such as forming Au plating after Ni plating. Moreover, a desmear process etc. may be given before plating.

  The plating may be formed on the wiring pattern 102 other than the through-hole electrode 106 portion, for example.

  Note that the shape of the through-hole electrode 106 is not limited.

  With this structure, it is possible to provide a module having no metal cover, a reduced thickness, and electronic components mounted at high density.

(Embodiment 2)
FIG. 2 is a cross-sectional view of the module according to Embodiment 2 of the present invention.

  The module according to the second embodiment is the same as that of the above-described first embodiment except for the point relating to the built-in layer 209. Therefore, the materials used in the second embodiment are those described in the first embodiment unless otherwise specified.

  In FIG. 2, the module includes an electrical insulating layer 201, a wiring pattern 202, a shield layer 203, an electronic component 204, a built-in layer 209, a through-hole electrode 206, and a via 210, and the first wiring The plate 207 has an electrical insulating layer 201, a wiring pattern 202, an electromagnetic shield layer 203, and a via 210.

  The second wiring board 208 has an electrical insulating layer 201, a wiring pattern 202, and a via 210.

  The built-in layer 209 contains the electronic component 204 and bonds and fixes the first wiring board 207 and the second wiring board 208.

  The through-hole electrode 206 is formed through the first wiring board 207, the built-in layer 209, and the second wiring board 208.

  The first wiring board 207 and the second wiring board 208 may be multilayer boards that connect the wiring patterns 202 between the layers by vias 210.

  For the built-in layer 209, an insulating resin, a filler, a mixture of insulating resins, or the like can be used. As the insulating resin, a material similar to that of the electrical insulating layer 201 can be used. Further, in the case of the same material as the electrical insulating layer 201, reliability is improved because thermal expansion and the like are the same.

  As the filler, the internal layer 209 having a low dielectric constant can be formed even by using a material having high thermal conductivity such as alumina, silica, silicon nitride, or Teflon (registered trademark). By using the built-in layer 209, the first wiring board 207 and the second wiring board 208 can be fixed on the surface, so that the reliability can be improved and the area can be reduced.

  The via 210 has a function of connecting the wiring patterns 202, and can be formed of, for example, a conductive material in which metal powder and resin are mixed, plating, or solder.

  In the second embodiment, the wiring pattern of the second wiring board 208 is four layers, but the number of layers is not limited.

  With this structure, the substrate on which the electronic component 204 is mounted is integrated with the built-in layer 209, so that the thinnest module incorporating the electronic component can be provided.

(Embodiment 3)
FIG. 3 is a cross-sectional view of the module according to Embodiment 3 of the present invention.

  The module according to the third embodiment is the same as the first and second embodiments except for the support 305 and the built-in layer 309. Therefore, the materials used in the third embodiment are those described in the first and second embodiments unless otherwise specified.

  In FIG. 3, the module includes an electrical insulating layer 301, a wiring pattern 302, a shield layer 303, an electronic component 304, a support 305, a through-hole electrode 306, a built-in layer 309, and a via 310. The first wiring board 307 includes an electrical insulating layer 301, a wiring pattern 302, an electromagnetic shield layer 303, and a via 310.

  The second wiring board 308 has an electrical insulating layer 301, a wiring pattern 302, and a via 310.

  The support body 305 and the built-in layer 309 fix the first wiring board 307 and the second wiring board 308.

  The through-hole electrode 306 is formed so as to penetrate at least one of the support 305 and the built-in layer 309, the first wiring board 307, and the second wiring board 308.

  The material of the support 305 and the built-in layer 309 may be the same material, and the resin component contained in the support 305 may form the built-in layer 309.

  With this structure, a module with a reduced thickness can be provided, and a through-hole electrode 306 can be formed in a portion filled with the built-in layer 309, which facilitates circuit design of the module.

(Embodiment 4)
FIG. 4 is a cross-sectional view of a module according to Embodiment 4 of the present invention.

  The module according to the fourth embodiment is the same as the first to third embodiments except for the point related to the first wiring board 407. Therefore, the materials used in the fourth embodiment are those described in the first to third embodiments unless otherwise specified.

  In FIG. 4, the module includes an electrical insulating layer 401, a wiring pattern 402, a shield layer 403, electronic components 404a and 404b, a support body 405, and a through-hole electrode 406, and the first wiring board. Reference numeral 407 includes an electrical insulating layer 401, a wiring pattern 402, and an electromagnetic shield layer 403.

  The second wiring board 408 has an electrical insulating layer 401 and a wiring pattern 402.

  The support body 405 fixes the first wiring board 407 and the second wiring board 408.

  The through-hole electrode 406 is formed so as to penetrate the first wiring board 407, the support body 405, and the second wiring board 408.

  The electronic component 404 a is a component whose mounting height is higher than the distance between the first wiring board 407 and the second wiring board 408.

  The electronic component 404 b is a component having a mounting height lower than the distance between the first wiring board 407 and the second wiring board 408.

  The first wiring board 407 has an opening 411. The opening 411 can be formed by a method such as laser processing or a router. By disposing the electronic component 404a having a high mounting height in the opening 411, an increase in the height of the module by the thickness of the first wiring board 407 can be prevented.

(Embodiment 5)
FIG. 5 is a cross-sectional view of a module according to Embodiment 5 of the present invention.

  The module in the fifth embodiment is the same as that in the first to fourth embodiments described above except for the points related to the first wiring board 507 and the shield layer 503. Therefore, the materials used in the fifth embodiment are those described in the first to fourth embodiments unless otherwise specified.

  In FIG. 5, the module includes an electrical insulating layer 501, a wiring pattern 502, shield layers 503a and 503b, electronic components 504a and 504b, a built-in layer 509, and a through-hole electrode 506. The wiring board 507 has an electrical insulating layer 501, a wiring pattern 502, and a shield layer 503a.

  The second wiring board 508 has an electrical insulating layer 501 and a wiring pattern 502.

  The built-in layer 509 fixes the first wiring board 507 and the second wiring board 508.

  The through-hole electrode 506 is formed so as to penetrate the first wiring board 507, the built-in layer 509, and the second wiring board 508.

  The first wiring board 507 has an opening 511. An electronic component 504 a having a high mounting height is disposed in the opening 511 and filled with a built-in layer 509. A shield layer 503b is formed. The shield layer 503b can be formed using a metal foil or a conductive resin in the same manner as the shield layer 503a.

  With this structure, an increase in the height of the module by the thickness of the first wiring board 507 is prevented, and the shield layer 503b is formed also in the opening 511, so that electromagnetic waves interfere with the electronic component 504a or the electronic component 504a. The emission of electromagnetic waves from can be reduced.

(Embodiment 6)
FIG. 6 is a cross-sectional view of a module according to Embodiment 6 of the present invention.

  The module in the sixth embodiment is the same as in the first to fifth embodiments described above except for the points related to the first wiring board 607, the second wiring board 608, and the shield layer 603. Therefore, the materials used in Embodiment 6 are those described in Embodiments 1 to 5 unless otherwise specified.

  In FIG. 6, the module has an electrical insulating layer 601, a wiring pattern 602, shield layers 603 a and 603 b, electronic components 604 a and 604 b, a support 605, a built-in layer 609, and a through-hole electrode 606. The first wiring board 607 includes an electrical insulating layer 601, a wiring pattern 602, and a shield layer 603a.

  The second wiring board 608 has an electrical insulating layer 601 and a wiring pattern 602.

  The support body 605 and the built-in layer 609 fix the first wiring board 607 and the second wiring board 608.

  The through-hole electrode 606 is formed through the first wiring board 607, the support body 605, and the second wiring board 608.

  The first wiring board 607 and the second wiring board 608 have an opening 611. An electronic component 604 a having a high mounting height is disposed in the opening 611 and filled with a built-in layer 609. A shield layer 603b is formed. With this structure, an increase in the height of the module by the thickness of the first wiring board 607 is prevented, and the shield layer 603b is formed also in the opening 611, whereby interference of electromagnetic waves on the electronic component 604a or the electronic component 604a is achieved. The emission of electromagnetic waves from can be reduced.

(Embodiment 7)
FIGS. 7A to 7C are cross-sectional views of the module manufacturing process according to the first embodiment of the present invention. The materials used in the seventh embodiment are those described in the first embodiment.

  As shown in FIG. 7A, the electronic component 104 is mounted on the wiring pattern 102 on the first wiring board 107 and the second wiring board 108, aligned, and the support 105 is laminated.

  As a method of mounting the electronic component 104 on the wiring pattern 102 on the first wiring board 107 and the second wiring board 108, in addition to solder mounting (printing of cream solder or reflow after solder balls), a conductive adhesive, For example, what knead | mixed gold | metal | money, silver, copper, silver-palladium alloy etc. with the thermosetting resin can also be used.

  After mounting, the cause of the repair or failure can be analyzed by checking the mounting state.

  The support 105 can be in the shape of a bar or a cross beam, and a desired space in which the electronic component 104 can be placed can be formed by performing laser processing or router processing.

  The laminated body is heated and pressurized to cure the support 105, and then a through hole 112 is formed as shown in FIG.

  The through hole 112 can be formed by, for example, laser processing, drilling, or punching. Laser processing is desirable because vias can be formed at a fine pitch and no shavings are generated. In the case of laser processing, a carbon dioxide laser, YAG laser, excimer laser, or the like can be used. In addition, in the case of drilling and punching, it is easy to form a through hole with existing versatile equipment.

  Next, the through-hole electrode 106 can be formed by plating the through-hole 112 in the step of FIG.

  In these steps, not only the module itself but also a plurality of samples may be arranged on the wiring board, and the through-hole electrode 106 may be formed and then cut into individual pieces by dicing, laser processing, or the like. By setting the cutting position to the through-hole electrode position, the through-hole electrode 106 can be disposed on the end face of the module, and the mounting state when the module is mounted on the board can be easily grasped.

(Embodiment 8)
8A to 8D are cross-sectional views of the module manufacturing process according to the fifth embodiment of the present invention. The materials used in the eighth embodiment are those described in the fifth embodiment.

  As shown in FIG. 8A, the electronic component 504 is mounted on the wiring pattern 502 on the first wiring board 507 and the second wiring board 508 in which the opening 511 is formed, and the built-in layer 509 is formed by positioning. Laminate. The built-in layer 509 can be a sheet. The built-in layer 509 can use a mixture of insulating resin and filler.

  After lamination in FIG. 8A, the electronic component 504 can be embedded in the built-in layer 509 by applying pressure as shown in FIG. 8B.

  When a thermosetting resin is used for the insulating resin of the built-in layer 509, the thermosetting resin in the electrical insulating layer 509 is cured by heating after pressurization. The heating is performed at a temperature equal to or higher than the temperature at which the thermosetting resin is cured.

  Through this process, the built-in layer 509, the first wiring board 507, the second wiring board 508, and the electronic component 504 are mechanically firmly bonded.

  The laminated body is heated and pressurized to cure the built-in layer 509, and then a through hole 512 is formed as shown in FIG.

  Next, the through-hole electrode 506 can be formed by plating the through-hole 512 in the step of FIG. The plating process of the through-hole electrode 506 includes a process of desmear treatment, electroless copper plating, and electrolytic copper plating after the formation of the through-hole 512. The electric field at the time of electrolytic copper plating can be applied by the shield layer 503. .

  Next, in the step of FIG. 8D, the shield layer 503 and the wiring pattern 502 are patterned. The shield layer 503 and the wiring pattern 502 can form a shield layer patterning portion 513 and a wiring pattern patterning portion 514 by etching, respectively, and a fine wiring pattern forming method such as a photolithography method can be used.

  Since the module and the manufacturing method thereof according to the present invention can be reduced in size and height, it is useful as a module or the like equipped in an electronic device such as a mobile phone.

Sectional drawing of the module in Embodiment 1 of this invention Sectional drawing of the module in Embodiment 2 of this invention Sectional drawing of the module in Embodiment 3 of this invention Sectional drawing of the module in Embodiment 4 of this invention Sectional drawing of the module in Embodiment 5 of this invention Sectional drawing of the module in Embodiment 6 of this invention Sectional drawing of the manufacturing process of the module in Embodiment 7 of this invention Sectional drawing of the manufacturing process of the module in Embodiment 8 of this invention

Explanation of symbols

101, 201, 301, 401, 501, 601 Electrical insulation layer 102, 202, 302, 402, 502, 602 Wiring pattern 103, 203, 303, 403, 503a, 503b, 603a, 603b Shield layer 104, 204, 304, 404a, 404b, 504a, 504b, 604a, 604b Electronic component 105, 305, 405, 605 Support 106, 206, 306, 406, 506, 606 Through-hole electrode 107, 207, 307, 407, 507, 607 First Wiring board 108, 208, 308, 408, 508, 608 Second wiring board 209, 309, 509, 609 Built-in layer 210, 310 Via 411, 511, 611 Opening 513 Patterning part of shield layer 514 Patterning part of wiring pattern

Claims (15)

A first wiring board having at least one wiring pattern, a shield layer, and an electrical insulating layer;
A second wiring board having at least one wiring pattern and an electrically insulating layer;
A support for fixing the first and second wiring boards;
The first and second wiring boards, and a through-hole electrode formed on the support and electrically connecting the first wiring board and the second wiring board;
A module in which two or more electronic components are mounted on the wiring patterns facing each other of the first and second wiring boards. A first wiring board having at least one wiring pattern, a shield layer, and an electrical insulating layer;
A second wiring board having at least one wiring pattern and an electrically insulating layer;
A built-in layer for fixing the first and second wiring boards;
The first and second wiring boards, and a through-hole electrode formed in the built-in layer and electrically connecting the first wiring board and the second wiring board;
A module in which two or more electronic components are mounted in the wiring patterns that are built in the built-in layer and face each other of the first and second wiring boards. A first wiring board having at least one wiring pattern, a shield layer, and an electrical insulating layer;
A second wiring board having at least one wiring pattern and an electrically insulating layer;
A built-in layer and a support for fixing the first and second wiring boards;
A through-hole electrode formed on at least one of the support and the built-in layer, the first and second wiring boards, and electrically connecting the first wiring board and the second wiring board;
A module in which two or more electronic components are mounted on the wiring patterns that are built in the built-in layer and face each other of the first and second wiring boards. The module according to claim 1 or 3, wherein the resin component of the support and the electrically insulating layer is the same. The module according to claim 3, wherein the resin component of the support and the built-in layer is the same. The module according to claim 2 or 3, wherein the resin component of the electrically insulating layer and the built-in layer is the same. Of the electronic components, no other electronic component is mounted at a position facing the tallest electronic component, and the height of the support is made higher than the height of the tallest electronic component, or The shortest electronic component is mounted so as to face the tallest electronic component, and the height of the support is higher than the total height of the tallest electronic component and the shortest electronic component. With
The module according to claim 1, wherein the total height of other electronic components facing each other is lower than the height of the support. At least one of the first wiring board and the second wiring board has an opening;
The module according to any one of claims 1 to 6, wherein an electronic component having a mounting height higher than a distance between the first and second wiring boards is disposed in the opening. The module according to claim 8, wherein the opening is filled with a built-in layer, and a shield layer is formed in the built-in layer of the opening. The module according to claim 1, wherein the wiring board is a multilayer wiring board. Mounting electronic components on the wiring patterns of the first and second wiring boards;
Facing the wiring boards and fixing them with a support;
A module manufacturing method including a step of forming a through-hole electrode on the wiring board and the support. Mounting electronic components on the wiring patterns of the first and second wiring boards;
Facing the wiring boards and stacking and fixing them with a built-in layer;
A module manufacturing method including a step of forming a through-hole electrode in the wiring board and the built-in layer. Mounting electronic components on the wiring patterns of the first and second wiring boards;
Facing the wiring boards and fixing them with the support and the built-in layer;
A module manufacturing method including a step of forming a through-hole electrode on at least one of the support and the built-in layer and the wiring board. The method for manufacturing a module according to claim 11, comprising a step of patterning at least one of the shield layer and the wiring pattern after forming a through-hole electrode on at least one of the support and the built-in layer and the wiring board. . The method for manufacturing a module according to any one of claims 11 to 13, further comprising a step of cutting a module unit after forming a through-hole electrode on at least one of the support and the built-in layer and the wiring board.

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