JP2010205995A5 - - Google Patents

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Publication number
JP2010205995A5
JP2010205995A5 JP2009050786A JP2009050786A JP2010205995A5 JP 2010205995 A5 JP2010205995 A5 JP 2010205995A5 JP 2009050786 A JP2009050786 A JP 2009050786A JP 2009050786 A JP2009050786 A JP 2009050786A JP 2010205995 A5 JP2010205995 A5 JP 2010205995A5
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JP
Japan
Prior art keywords
circuit board
printed circuit
metal piece
printed
hole
Prior art date
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Application number
JP2009050786A
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English (en)
Japanese (ja)
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JP2010205995A (ja
JP5351563B2 (ja
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Priority to JP2009050786A priority Critical patent/JP5351563B2/ja
Priority claimed from JP2009050786A external-priority patent/JP5351563B2/ja
Publication of JP2010205995A publication Critical patent/JP2010205995A/ja
Publication of JP2010205995A5 publication Critical patent/JP2010205995A5/ja
Application granted granted Critical
Publication of JP5351563B2 publication Critical patent/JP5351563B2/ja
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JP2009050786A 2009-03-04 2009-03-04 プリント基板およびプリント基板の製造方法 Active JP5351563B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009050786A JP5351563B2 (ja) 2009-03-04 2009-03-04 プリント基板およびプリント基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009050786A JP5351563B2 (ja) 2009-03-04 2009-03-04 プリント基板およびプリント基板の製造方法

Publications (3)

Publication Number Publication Date
JP2010205995A JP2010205995A (ja) 2010-09-16
JP2010205995A5 true JP2010205995A5 (da) 2012-05-31
JP5351563B2 JP5351563B2 (ja) 2013-11-27

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ID=42967191

Family Applications (1)

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JP2009050786A Active JP5351563B2 (ja) 2009-03-04 2009-03-04 プリント基板およびプリント基板の製造方法

Country Status (1)

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JP (1) JP5351563B2 (da)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102781158A (zh) * 2011-05-09 2012-11-14 代芳 一种可提高散热效果的印制线路板技术
CN103096638B (zh) * 2011-10-27 2016-01-13 北大方正集团有限公司 一种压入式高导热pcb板及其制作方法
JPWO2013179527A1 (ja) * 2012-06-01 2016-01-18 日本電気株式会社 シールドケースを有する電子部品
JP6252000B2 (ja) * 2013-07-09 2017-12-27 三菱電機株式会社 基板
JP2016195192A (ja) * 2015-04-01 2016-11-17 オムロンオートモーティブエレクトロニクス株式会社 プリント基板、電子装置
JP6333215B2 (ja) 2015-05-19 2018-05-30 オムロンオートモーティブエレクトロニクス株式会社 プリント基板、電子装置
US10504813B2 (en) * 2016-09-30 2019-12-10 Astec International Limited Heat sink assemblies for surface mounted devices
JP2019009153A (ja) * 2017-06-20 2019-01-17 大陽工業株式会社 配線基板、電子デバイス及び電子デバイスの製造方法
JP7041535B2 (ja) * 2018-01-31 2022-03-24 日本シイエムケイ株式会社 プリント配線板とその製造方法
WO2021039849A1 (ja) 2019-08-30 2021-03-04 パナソニックＩｐマネジメント株式会社 座板付きコンデンサ
JP7560915B1 (ja) 2024-05-30 2024-10-03 株式会社日本フューテック インレイ基板の製造方法、インレイ基板、及び、部品実装基板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5544747A (en) * 1978-09-26 1980-03-29 Fujitsu Ltd Manufacture of dielectric substrate
US5285352A (en) * 1992-07-15 1994-02-08 Motorola, Inc. Pad array semiconductor device with thermal conductor and process for making the same

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