JP2010183015A5 - - Google Patents

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Publication number
JP2010183015A5
JP2010183015A5 JP2009027528A JP2009027528A JP2010183015A5 JP 2010183015 A5 JP2010183015 A5 JP 2010183015A5 JP 2009027528 A JP2009027528 A JP 2009027528A JP 2009027528 A JP2009027528 A JP 2009027528A JP 2010183015 A5 JP2010183015 A5 JP 2010183015A5
Authority
JP
Japan
Prior art keywords
end regions
power supply
supply wiring
semiconductor substrate
plan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009027528A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010183015A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009027528A priority Critical patent/JP2010183015A/ja
Priority claimed from JP2009027528A external-priority patent/JP2010183015A/ja
Publication of JP2010183015A publication Critical patent/JP2010183015A/ja
Publication of JP2010183015A5 publication Critical patent/JP2010183015A5/ja
Pending legal-status Critical Current

Links

JP2009027528A 2009-02-09 2009-02-09 半導体装置 Pending JP2010183015A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009027528A JP2010183015A (ja) 2009-02-09 2009-02-09 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009027528A JP2010183015A (ja) 2009-02-09 2009-02-09 半導体装置

Publications (2)

Publication Number Publication Date
JP2010183015A JP2010183015A (ja) 2010-08-19
JP2010183015A5 true JP2010183015A5 (enrdf_load_stackoverflow) 2012-03-08

Family

ID=42764314

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009027528A Pending JP2010183015A (ja) 2009-02-09 2009-02-09 半導体装置

Country Status (1)

Country Link
JP (1) JP2010183015A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012053125A1 (ja) 2010-10-21 2012-04-26 パナソニック株式会社 半導体装置
JP6342165B2 (ja) * 2014-01-24 2018-06-13 ルネサスエレクトロニクス株式会社 半導体装置及びｉｏセル
CN117690909A (zh) * 2022-09-01 2024-03-12 长鑫存储技术有限公司 半导体结构以及存储器

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002016016A (ja) * 2000-06-30 2002-01-18 Mitsubishi Electric Corp 半導体装置およびその製造方法
JP2006228954A (ja) * 2005-02-17 2006-08-31 Matsushita Electric Ind Co Ltd 半導体装置とそのレイアウト設計方法

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