JP2010177034A - Method and apparatus for manufacturing display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a display device capable of easily separating a donor substrate from a substrate to be transcribed in a vacuum, and to provide method of manufacturing the same. <P>SOLUTION: One end of a curved surface 51A in a body 51 is brought into contact with a position close to a side 40A in the backside of a donor substrate 40, in the stacked condition of the donor substrate 40 onto the substrate 11A to be transcribed. The backside of the donor substrate 40 is wound around the curved surface 51A by rotating the body 51 in the direction of an arrow R1 on the backside of the donor substrate 40, and at the same time adheres tightly to the curved surface 51A by an electrostatic chuck 52. Accordingly, the donor substrate 40 is deformed from the side 40A to the curved surface, and synchronously detached from the substrate 11A to be transcribed. The detached position 40C of the donor substrate 40 from the substrate 11A to be transcribed moves towards an opposite side 40D from the side 40A where the deformation is initiated. When the detached position 40C reaches the opposite side 40D, the donor substrate 40 is completely detached from the substrate 11A to be transcribed. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a display device including an organic light emitting element (organic EL (Electroluminescence) element) and a manufacturing apparatus used therefor.

  In recent years, a transfer method has been studied as one method for forming a light emitting layer of an organic light emitting element (see, for example, Patent Document 1). In the transfer method, for example, a transfer substrate for forming a light emitting layer and a donor on which the transfer layer is formed are superposed, and the transfer layer is sublimated or vaporized by irradiation of radiation and transferred to the transfer substrate. The donor is peeled from the transfer substrate.

JP 2002-110350 A

  In order to improve the characteristics of the light emitting layer, it is desirable to perform consistently in the vacuum apparatus from the stacking of the donor and the transfer substrate to the peeling. However, it has been difficult to peel the donor from the substrate to be transferred in vacuum due to the influence of peeling charging and the like. In particular, when a glass substrate is used as a donor base material, the substrate itself has high rigidity and is difficult to grip in a vacuum, so that peeling has become increasingly difficult.

  The present invention has been made in view of such problems, and an object of the present invention is to provide a display device manufacturing method and a manufacturing apparatus capable of easily separating a donor substrate and a transferred substrate in a vacuum. is there.

The method for manufacturing a display device according to the present invention includes the following steps (A) to (D).
(A) A substrate to be transferred having a first electrode and a part of a plurality of organic layers on the surface of a substrate made of glass, and a donor substrate having a transfer layer made of an organic light emitting material on the surface of a substrate made of glass are vacuumed. (B) A step of forming a light emitting layer on a transfer substrate in a vacuum by a transfer method in a vacuum (C) At least one of a donor substrate and a transfer substrate in a vacuum by a bending means. A step of peeling the donor substrate from the transferred substrate while moving the peeling position between the donor substrate and the transferred substrate by deforming the curved surface from one or more sides or one or more corners (D) on the light emitting layer Forming the remainder of the plurality of organic layers and the second electrode;

  The display device manufacturing apparatus according to the present invention includes a donor substrate having a transfer layer made of an organic light emitting material on the surface of a substrate made of glass, and a first electrode and a part of the plurality of organic layers formed on the surface of the substrate made of glass. The transfer substrate is used in a process of separating the transferred substrate from a state in which the surfaces are opposed to each other, and at least one of the donor substrate and the transfer substrate is set to one or more sides or one or more corners. It is provided with a bending means that can be deformed into a curved surface.

  In the display device manufacturing apparatus according to the present invention, at least one of the donor substrate and the substrate to be transferred is deformed from one or more sides or one or more corners into a curved surface by the bending means, and thus the donor from the sides or corners. The peeling of the substrate proceeds. The peeling position between the donor substrate and the transferred substrate moves from the side or corner where deformation started toward the opposite side or the opposite side. When the peeling position reaches the opposite side or the opposite side, the donor substrate is completely peeled from the transferred substrate. Is done.

  According to the method for manufacturing a display device of the present invention, at least one of the donor substrate and the transfer substrate is deformed into a curved surface from one or more sides or one or more corners by a bending means, thereby forming the donor substrate and the transfer substrate. Since the donor substrate is peeled from the transfer substrate while moving the peeling position, the donor substrate and the transfer substrate can be easily separated in a vacuum.

  According to the display device manufacturing apparatus of the present invention, since it comprises a bending means capable of deforming at least one of the donor substrate and the transfer substrate from one or more sides or one or more corners into a curved surface, It is possible to easily separate the donor substrate and the transfer substrate in a vacuum.

It is a figure showing the structure of the display apparatus manufactured by the manufacturing method of the display apparatus which concerns on the 1st Embodiment of this invention. It is a figure showing an example of the pixel drive circuit shown in FIG. It is sectional drawing showing the structure of the display area shown in FIG. It is a figure showing the manufacturing method of the display apparatus shown in FIG. 1 in order of a process. FIG. 5 is a diagram illustrating a process following FIG. 4. It is a figure showing the process of following FIG. It is a figure showing the process of following FIG. It is a perspective view showing the structure of the main body shown in FIG. It is a figure showing the process of following FIG. FIG. 10 is a diagram illustrating a process following FIG. 9. It is a figure showing the modification of FIG. It is a figure for demonstrating the manufacturing method of the display apparatus which concerns on the 2nd Embodiment of this invention. It is a perspective view showing the structure of the main body shown in FIG. It is a figure showing the whole adhesive sheet structure shown in FIG. It is a figure showing the whole structure of the manufacturing apparatus of the display apparatus which concerns on the 3rd Embodiment of this invention. It is a figure showing the manufacturing method of the display apparatus using the manufacturing apparatus shown in FIG. It is a figure showing the process of following FIG. FIG. 18 is a diagram illustrating a process following FIG. 17. FIG. 19 is a diagram illustrating a process following the process in FIG. 18. It is a top view showing schematic structure of the module containing the display apparatus of the said embodiment. It is a perspective view showing the external appearance of the application example 1 of the display apparatus of the said embodiment. (A) is a perspective view showing the external appearance seen from the front side of the application example 2, (B) is a perspective view showing the external appearance seen from the back side. 12 is a perspective view illustrating an appearance of application example 3. FIG. 14 is a perspective view illustrating an appearance of application example 4. FIG. (A) is a front view of the application example 5 in an open state, (B) is a side view thereof, (C) is a front view in a closed state, (D) is a left side view, and (E) is a right side view, (F) is a top view and (G) is a bottom view. FIG. 4 is a cross-sectional view illustrating another configuration of the display area illustrated in FIG. 3.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The description will be given in the following order.
1. First embodiment (an example in which a donor substrate is wound around a curved surface of a main body and adhered by an electrostatic chuck)
2. Second embodiment (an example in which an adhesive sheet is attached to the back surface of a donor substrate and the end of the adhesive sheet is fixed to the main body with a clamp, and the adhesive sheet is wound around the curved surface of the main body together with the donor substrate)
3. Third embodiment (example using an adhesive pad)

<First Embodiment>
FIG. 1 shows the configuration of a display device manufactured by the method for manufacturing a display device according to the first embodiment of the present invention. This display device is used as an organic EL television or the like. For example, a display in which a plurality of organic light emitting elements 10R, 10G, and 10B described later are arranged in a matrix on a driving substrate 11 made of glass. Region 110 is formed. Around the display area 110, a signal line driver circuit 120 and a scanning line driver circuit 130, which are drivers for displaying images, are formed.

  A pixel drive circuit 140 is formed in the display area 110. FIG. 2 illustrates an example of the pixel driving circuit 140. The pixel driving circuit 140 is formed below the first electrode 13 to be described later, and includes a driving transistor Tr1 and a writing transistor Tr2, a capacitor (holding capacitor) Cs therebetween, a first power supply line (Vcc), and a second power source line (Vcc). This is an active drive circuit having an organic light emitting element 10R (or 10G, 10B) connected in series to the drive transistor Tr1 between power supply lines (GND). In the case of a large-screen television, the drive transistor Tr1 and the write transistor Tr2 are preferably composed of, for example, an amorphous silicon TFT having an inverted stagger structure (so-called bottom gate type), but are not particularly limited thereto.

  In the pixel driving circuit 140, a plurality of signal lines 120A are arranged in the column direction, and a plurality of scanning lines 130A are arranged in the row direction. An intersection between each signal line 120A and each scanning line 130A corresponds to one of the organic light emitting elements 10R, 10G, and 10B (sub pixel). Each signal line 120A is connected to the signal line drive circuit 120, and an image signal is supplied from the signal line drive circuit 120 to the source electrode of the write transistor Tr2 via the signal line 120A. Each scanning line 130A is connected to the scanning line driving circuit 130, and a scanning signal is sequentially supplied from the scanning line driving circuit 130 to the gate electrode of the writing transistor Tr2 via the scanning line 130A.

  FIG. 3 shows a cross-sectional configuration of the display area 110. In the display area 110, an organic light emitting element 10R that generates red light, an organic light emitting element 10G that generates green light, and an organic light emitting element 10B that generates blue light are sequentially formed in a matrix. Has been. The organic light emitting elements 10R, 10G, and 10B have a rectangular planar shape, and a combination of adjacent organic light emitting elements 10R, 10G, and 10B constitutes one pixel.

  The organic light emitting devices 10R, 10G, and 10B are respectively anodes from the side of the driving substrate 11 with the driving transistor (not shown) and the planarization insulating film (not shown) of the pixel driving circuit 140 described above in between. The first electrode 13 as an insulating layer, the insulating layer 14, an organic layer 15 including a red light emitting layer 15CR, a green light emitting layer 15CG, or a blue light emitting layer 15CB, which will be described later, and a second electrode 16 as a cathode are stacked in this order. is doing.

  Such organic light-emitting elements 10R, 10G, and 10B are covered with a protective film 17 such as silicon nitride (SiNx), and further, a sealing substrate 30 made of glass or the like with an adhesive layer 20 in between the protective film 17. Is sealed by being bonded over the entire surface.

  The first electrode 13 is formed corresponding to each of the organic light emitting elements 10R, 10G, and 10B. The first electrode 13 is made of, for example, ITO (indium / tin composite oxide) or IZO (indium / zinc composite oxide). Moreover, you may comprise the 1st electrode 13 with a reflective electrode. In that case, the first electrode 13 has a thickness of, for example, 100 nm or more and 1000 nm or less, and it is desirable that the first electrode 13 has a reflectivity as high as possible in order to increase luminous efficiency. For example, the material constituting the first electrode 13 is a metal such as chromium (Cr), gold (Au), platinum (Pt), nickel (Ni), copper (Cu), tungsten (W), or silver (Ag). An elemental element or an alloy is mentioned.

  The insulating layer 14 is used to ensure insulation between the first electrode 13 and the second electrode 16 and to accurately form the light emitting region in a desired shape. For example, the insulating layer 14 has a thickness of about 1 μm and is made of silicon oxide or polyimide. It is comprised with photosensitive resin. The insulating layer 14 is provided with an opening 14A corresponding to the first electrode 13, and a region in the opening 14A of the first electrode 13 is a light emitting region. The organic layer 15 and the second electrode 16 may be continuously provided not only on the opening 14A but also on the insulating layer 14, but light emission occurs only in the opening 14A of the insulating layer 14. is there.

The organic layer 15 includes a hole injection layer and a hole transport layer 15AB, a red light emission layer 15CR, a green light emission layer 15CG or a blue light emission layer 15CB, and an electron transport layer and an electron injection layer 15DE in this order from the first electrode 13 side. Of these, a layer other than the red light emitting layer 15CR, the green light emitting layer 15CG, or the blue light emitting layer 15CB may be provided as necessary. The organic layer 15 may have a different configuration depending on the emission color of the organic light emitting elements 10R, 10G, and 10B. The hole injection layer is a buffer layer for improving hole injection efficiency and preventing leakage. The hole transport layer is for increasing the efficiency of hole transport to the red light emitting layer 15CR, the green light emitting layer 15CG, or the blue light emitting layer 15CB. The red light emitting layer 15CR, the green light emitting layer 15CG, or the blue light emitting layer 15CB generates light by recombination of electrons and holes by applying an electric field. The electron transport layer is for increasing the efficiency of electron transport to the red light emitting layer 15CR, the green light emitting layer 15CG, or the blue light emitting layer 15CB. The electron injection layer has a thickness of about 0.3 nm, for example, and is made of LiF, Li ₂ O, or the like. In FIG. 3, the hole injection layer and the hole transport layer are one layer (hole injection layer and hole transport layer 15AB), and the electron transport layer and the electron injection layer are one layer (electron transport layer and electron injection layer 15DE). Represents.

The hole injection layer 15A of the organic light emitting device 10R has, for example, a thickness of 5 nm to 300 nm and is 4,4 ′, 4 ″ -tris (3-methylphenylphenylamino) triphenylamine (m-MTDATA) or 4 , 4 ′, 4 ″ -tris (2-naphthylphenylamino) triphenylamine (2-TNATA). The hole transport layer 15B of the organic light emitting device 10R has, for example, a thickness of 5 nm or more and 300 nm or less, and is composed of bis [(N-naphthyl) -N-phenyl] benzidine (α-NPD). The light emitting layer 15C of the organic light emitting element 10R has, for example, a thickness of 10 nm or more and 100 nm or less, and 2,6-bis [4- [N- (4-methoxyphenyl) -N] added to 8-quinolinol aluminum complex (Alq ₃ ). -Phenyl] aminostyryl] naphthalene-1,5-dicarbonitrile (BSN-BCN) mixed with 40% by volume. The electron transport layer 15D of the organic light emitting element 10R has, for example, a thickness of 5 nm to 300 nm and is made of Alq ₃ .

The hole injection layer of the organic light emitting element 10G has a thickness of 5 nm to 300 nm, for example, and is made of m-MTDATA or 2-TNATA. The hole transport layer of the organic light emitting element 10G has, for example, a thickness of 5 nm or more and 300 nm or less, and is configured by α-NPD. The green light emitting layer 15CG of the organic light emitting element 10G has a thickness of 10 nm to 100 nm, for example, and is configured by mixing 5% by volume of coumarin 6 with ADN. The electron transport layer of the organic light emitting element 10G has, for example, a thickness of 5 nm to 300 nm and is made of Alq ₃ .

The hole injection layer of the organic light emitting element 10B has, for example, a thickness of 5 nm to 300 nm and is made of m-MTDATA or 2-TNATA. The hole transport layer of the organic light emitting device 10B has, for example, a thickness of 5 nm to 300 nm and is made of α-NPD. The blue light emitting layer 15CB of the organic light emitting element 10B has a thickness of 10 nm or more and 100 nm or less, and is 4,4′≡bis [2≡ {4≡ (N, N≡diphenylamino) phenyl} vinyl] biphenyl (ADN). DPAVBi) is mixed with 2.5% by weight. The electron transport layer of the organic light emitting element 10B has, for example, a thickness of 5 nm to 300 nm and is made of Alq ₃ .

  For example, the second electrode 16 has a thickness of 5 nm or more and 50 nm or less, and is made of a single element or alloy of a metal element such as aluminum (Al), magnesium (Mg), calcium (Ca), or sodium (Na). Among these, an alloy of magnesium and silver (MgAg alloy) or an alloy of aluminum (Al) and lithium (Li) (AlLi alloy) is preferable. The second electrode 16 may be made of ITO (indium / tin composite oxide) or IZO (indium / zinc composite oxide).

The protective film 17 is for preventing moisture and the like from entering the organic layer 15 and is made of a material having low permeability and water absorption and has a sufficient thickness. Further, the protective film 17 is made of a material having a high transmittance with respect to the light generated in the light emitting layer 15C and having a transmittance of 80% or more, for example. For example, the protective film 17 has a thickness of about 2 μm to 3 μm and is made of an inorganic amorphous insulating material. Specifically, amorphous silicon (α-Si), amorphous silicon carbide (α-SiC), amorphous silicon nitride (α-Si _1-x N _x ), and amorphous carbon (α-C) are preferable. Since these inorganic amorphous insulating materials do not constitute grains, the water permeability is low and a good protective film 17 is obtained. The protective film 17 may be made of a transparent conductive material such as ITO.

  The adhesive layer 20 is made of, for example, a thermosetting resin or an ultraviolet curable resin.

  The sealing substrate 30 is positioned on the second electrode 16 side of the organic light emitting elements 10R, 10G, and 10B, and seals the organic light emitting elements 10R, 10G, and 10B together with the adhesive layer 20, and emits organic light. It is made of a material such as glass that is transparent to the light generated by the elements 10R, 10G, and 10B. The sealing substrate 30 is provided with, for example, a color filter (not shown), and extracts light generated in the organic light emitting elements 10R, 10G, and 10B, and the organic light emitting elements 10R, 10G, and 10B, and a portion therebetween. The external light reflected by the wiring may be absorbed to improve the contrast.

  This display device can be manufactured, for example, as follows.

(Process for forming a transfer substrate)
First, the driving substrate 11 made of the above-described material is prepared, and the pixel driving circuit 140 is formed on the surface of the driving substrate 11. Next, a planarizing insulating film (not shown) is formed by applying a photosensitive resin on the entire surface, patterned into a predetermined shape by exposure and development, and a connection hole (the connection hole between the driving transistor Tr1 and the first electrode 13 ( (Not shown) is formed and fired.

  Subsequently, the first electrode 13 made of the above-described material is formed by, for example, sputtering, and is formed into a predetermined shape by, for example, dry etching. At this time, an alignment mark used for alignment with the donor substrate may be formed at a predetermined position of the driving substrate 11 in a transfer step described later.

  After that, the insulating layer 14 is formed over the entire surface of the driving substrate 11, and the opening 14A is provided corresponding to the first electrode 13 by, for example, photolithography.

  After forming the insulating layer 14, the hole injection layer and the hole transport layer 15AB made of the above-described thickness and material are sequentially formed by, for example, vapor deposition using an area mask. As a result, as shown in FIG. 4, the transfer substrate 11A is formed.

  On the other hand, as shown in FIG. 5, a base 41 made of, for example, a glass substrate is prepared, and a photothermal conversion layer 42 made of chromium (Cr) or the like is formed on the surface of the base 41 by, for example, sputtering. Then, it is formed into a predetermined shape by etching. Thereby, the donor substrate 40 is formed.

  A plurality of donor substrates 40 are prepared, and a red, green or blue transfer layer 43 is formed on each donor substrate 40 by, for example, a vacuum deposition method or a printing method such as inkjet, as shown in FIG. .

  After forming the transfer substrate 11A and the donor substrate 40, as shown in FIG. 5, the donor substrate 40 having the red transfer layer 43 and the transfer substrate 11A are placed on the surface in a vacuum apparatus (not shown). The first electrode 13 side and the transfer layer 42 side are overlapped with each other facing each other.

  After superimposing the transfer substrate 11A and the donor substrate 40, as shown in FIG. 6, the red light emitting layer 15CR is formed by, for example, thermal transfer in a vacuum apparatus (not shown).

After the red light emitting layer 15CR is formed, the donor substrate 40 is peeled from the transfer substrate 11A in a vacuum device (not shown). At this time, requirements for successful peeling without damaging the donor substrate 40 or the transferred substrate 11A are the following (1) to (5).
(1) Distributing the peeling force over the entire surface of the donor substrate 40 (2) Applying the peeling force from the back surface of the donor substrate 40 (3) The means for generating the peeling force holds the donor substrate 40 in a planar state. After that, the donor substrate 40 can be bent and held in a curved state. (4) The peeling is not performed on the entire surface while keeping the donor substrate 40 in a flat state, but starts from one side or one corner of the donor substrate 40. (5) Reliably hold the donor substrate 40 from the start to the end of peeling.

  Regarding requirement (1), as a method of peeling two substrates, it is generally known to peel the substrate by pushing the end of one substrate with a lift pin. However, since the donor substrate 40 and the transfer substrate 11A are in close contact with each other in a vacuum, there is a possibility of cracking due to the influence of peeling electrification when an attempt is made to peel off with a lift pin at once.

  Regarding requirement (2), in the conventional peeling method using the conventional lift pins, when the donor substrate 40 and the transferred substrate 11A are enlarged, the lift pins need to be arranged near the center of the donor substrate 40 or the transferred substrate 11A. is there. However, since the donor substrate 40 or the transferred substrate 11A is in close contact with the transfer layer 42 or the light emitting layer 15C, a lift pin cannot be disposed at the center of the donor substrate 40.

  FIG. 7A illustrates an example of a display device manufacturing apparatus (substrate separation apparatus) that can satisfy these requirements. The manufacturing apparatus 50 includes, for example, a main body 51 having a curved surface 51A, an electrostatic chuck 52 made of, for example, a resin film, and clamps 53 and 54. Here, the main body 51 corresponds to a specific example of the “curving means” in the present invention, the electrostatic chuck 52 corresponds to a specific example of the “contact means” in the present invention, and the clamps 53 and 54 in the present invention. This corresponds to a specific example of “gripping means”.

  FIG. 8 shows the overall configuration of the main body 51. The main body 51 is for distributing the peeling force over the entire surface of the donor substrate 40 (requirement (1)) and for causing the peeling force to act from the back surface of the donor substrate 40 (requirement (2)). The curved surface 51A does not perform peeling in a batch while maintaining the donor substrate 40 in a flat state, but starts from one side or corner of the donor substrate 40 and proceeds while moving the peeling position (requirement (4)). belongs to. The shape of the curved surface 51A is not particularly limited, but can be simply a cylindrical surface, for example.

  The electrostatic chuck 52 shown in FIG. 7A has a function of generating the peeling force referred to in the requirement (3), and is attached to the curved surface 51 </ b> A of the main body 51. The electrostatic chuck 52 chucks the donor substrate 40 in a planar state, and then holds the donor substrate 40 in close contact with the curved surface 51 </ b> A (requirement (3)). Further, the electrostatic chuck 52 can reliably hold the donor substrate 40 from the start to the end of peeling (requirement (5)), and can prevent the donor substrate 40 from dropping from the main body 51.

  The clamps 53 and 54 shown in FIG. 7A secure the donor substrate 40 from the start to the end of peeling together with the electrostatic chuck 52 by fixing the end portions of the donor substrate 40 and the transfer substrate 11A. It is for holding (requirement (5)). Instead of the clamps 53 and 54, other gripping means such as an adhesive tape may be used.

  Separation of the donor substrate 40 using the manufacturing apparatus 50 can be performed, for example, as follows.

  First, as shown in FIG. 7A, the donor substrate 40 and the transferred substrate 11A are placed on a stage (not shown) in a state of being overlaid. At this time, both the donor substrate 40 and the transferred substrate 11A are in a planar state. The end portion of the donor substrate 40 and the end portion of the transferred substrate 11A are continuously fixed by the clamps 53 and 54 from the start to the end of the peeling.

  Next, as shown in FIG. 7A, one end of the curved surface 51A of the main body 51 is brought into contact with the vicinity of the side 40A on the back surface of the donor substrate 40.

  Subsequently, as shown in FIG. 7B, the back surface of the donor substrate 40 is wound around the curved surface 51A by rotating the main body 51 in the direction of arrow R1 on the back surface of the donor substrate 40, and the electrostatic chuck. 52, the back surface of the donor substrate 40 is brought into close contact with the curved surface 51A. As a result, the donor substrate 40 is deformed from the side 40A into a curved surface and is peeled off from the transfer substrate 11A.

  The peeling position 40C between the donor substrate 40 and the transferred substrate 11A moves from the side 40A where the deformation starts to the opposite side 40D. As shown in FIG. 7C, when the peeling position 40C reaches the opposite side 40D, the donor substrate 40 is completely peeled from the transfer substrate 11A. On the other hand, the transferred substrate 11A is maintained in a flat state by the clamp 54 from the start to the end of the peeling. By using the manufacturing apparatus 50, the donor substrate 40 and the transfer target substrate 11A can be easily separated in a vacuum.

  After peeling the donor substrate 40, as shown in FIG. 9, the green light emitting layer 15CG is formed by, for example, a thermal transfer method in the same manner as the red light emitting layer 15CR.

  After forming the green light emitting layer 15CG, as shown in FIG. 10, the blue light emitting layer 15CB is formed by the thermal transfer method, for example, in the same manner as the red light emitting layer 15CR.

  After forming the red light emitting layer 15CR, the green light emitting layer 15CG, and the blue light emitting layer 15CB, the electron transport layer 15D and the second electrode 16 made of the above-described thickness and material are sequentially formed by, for example, vapor deposition. Thus, the organic light emitting devices 10R, 10G, and 10B as shown in FIG. 3 are formed.

  After forming the organic light emitting elements 10R, 10G, and 10B, the protective film 17 made of the above-described material is formed by, for example, the CVD method, and the organic light emitting elements 10R, 10G, and 10B are covered with the protective film 17.

  After that, the adhesive layer 20 made of the above-described material is formed on the protective film 17. After that, a color filter or the like is provided, a sealing substrate 30 made of the above-described material is prepared, and the driving substrate 11 and the sealing substrate 30 are bonded together with the adhesive layer 20 therebetween. Thus, the display device shown in FIG. 3 is completed.

  In this display device, a scanning signal is supplied to each pixel from the scanning line driving circuit 130 via the gate electrode of the writing transistor Tr2, and an image signal is supplied from the signal line driving circuit 120 via the writing transistor Tr2. Held in Cs. That is, the driving transistor Tr1 is controlled to be turned on / off in accordance with the signal held in the holding capacitor Cs, whereby the driving current Id is injected into each of the organic light emitting elements 10R, 10G, and 10B, so that holes, electrons, Recombination causes light emission. This light is transmitted through the second electrode 16, the protective film 17 and the sealing substrate 21 and extracted. Here, in the manufacturing process, since the donor substrate 40 and the substrate to be transferred 11A are overlapped, and the donor substrate 40 is peeled off after the transfer, the process is performed in a vacuum. High characteristics are maintained.

  As described above, in this embodiment, the donor substrate 40 is detached from the transfer substrate 11A while moving the separation position 40C between the donor substrate 40 and the transfer substrate 11A by deforming the donor substrate 40 from one side 40A to a curved surface. Thus, the donor substrate 40 and the transferred substrate 11A can be easily separated in a vacuum.

  In the above embodiment, the case where the donor substrate 40 is deformed into a curved surface has been described. However, the transfer substrate 11A may be deformed into a curved surface. Further, as indicated by arrows R1 and R2 in FIG. 11, both the donor substrate 40 and the transferred substrate 11A can be deformed into curved surfaces. In this manner, the separation can be further promoted by curving the transfer target substrate 11A in a phase opposite to that of the donor substrate 40.

  Furthermore, in the above-described embodiment, the case where the side of the donor substrate 40 is deformed from the one side 40A to the curved surface has been described, but two sides facing each other toward the center, or from one corner to the opposite, or facing each other. The donor substrate 40 may be deformed into a curved surface from two corners toward the center or from all angles toward the center.

  In addition, in the above embodiment, the case where the donor substrate 40 is peeled after the red light emitting layer 15CR, the green light emitting layer 15CG, or the blue light emitting layer 15CB is formed has been described. However, the red light emitting layer 15CR, the green light emitting layer 15CG, or It is also possible to simultaneously perform the formation of the blue light emitting layer 15CB and the peeling of the donor substrate 40 in parallel. In that case, for example, the transfer is performed by irradiating laser light from the back side of the donor substrate 40, and the transferred portion of the donor substrate 40 is peeled off.

<Second Embodiment>
12 to 14 show a method of manufacturing a display device according to the second embodiment of the present invention in the order of steps. This manufacturing method is different from the manufacturing method described in the first embodiment in that an adhesive sheet 62 and a clamp 63 are used in place of the electrostatic chuck 52 as the contact means. In addition, the part which 1st Embodiment and a manufacturing process overlap is demonstrated with reference to FIG. 4 thru | or FIG.

  First, similarly to the first embodiment, the transferred substrate 11A and the donor substrate 40 are formed by the steps shown in FIGS.

  Next, in the same manner as in the first embodiment, the donor substrate 40 and the transferred substrate 11A are formed on the surface (on the first electrode 13 side, and in the vacuum apparatus (not shown)) by the process shown in FIG. The transfer layer 42 side) is overlapped with each other facing each other.

  Subsequently, in the same manner as in the first embodiment, the red light emitting layer 15CR is formed by, for example, a thermal transfer method in a vacuum apparatus (not shown) by the process shown in FIG.

  After the red light emitting layer 15CR is formed, the donor substrate 40 is peeled from the transfer substrate 11A in a vacuum device (not shown). FIG. 12A shows an example of a display device manufacturing apparatus (substrate separation apparatus) used in this process. The manufacturing apparatus 60 includes, for example, a main body 61 having a curved surface 61A, an adhesive sheet 62, and a clamp 63. Here, the main body 61 corresponds to a specific example of “curving means” in the present invention, and the clamp 63 corresponds to a specific example of “fixing means” in the present invention.

  FIG. 13 shows the overall configuration of the main body 61. The main body 61 is for distributing the peeling force over the entire surface of the donor substrate 40 (requirement (1)) and for causing the peeling force to act from the back surface of the donor substrate 40 (requirement (2)). The curved surface 61A does not perform peeling in a batch while maintaining the donor substrate 40 in a flat state, but starts from one side or corner of the donor substrate 40 and proceeds while moving the peeling position (requirement (4)). belongs to. The shape of the curved surface 61A is not particularly limited, but can be simply a cylindrical surface, for example.

  The adhesive sheet 62 and the clamp 63 shown in FIG. 12A have a function of generating a peeling force as described in the requirement (3). After holding the donor substrate 40 in a flat state, the donor substrate 40 is curved. It is wound around 61A and held in a curved state (requirement (3)). Moreover, the adhesive sheet 62 and the clamp 63 can reliably hold the donor substrate 40 from the start to the end of peeling (requirement (5)), and can prevent the donor substrate 40 from falling off the main body 61. Yes.

  The pressure-sensitive adhesive sheet 62 may be a single-sided pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer on one side of the base material as long as the entire back surface of the donor substrate 40 can be pasted on one side, or a pressure-sensitive adhesive layer on both sides of the base material. It may be a double-sided PSA sheet. The clamp 63 fixes the end of the adhesive sheet 62 to the side surface of the main body 61. Instead of the clamp 63, other fixing means such as an adhesive tape may be used.

  Separation of the donor substrate 40 using the manufacturing apparatus 60 can be performed, for example, as follows.

  First, the donor substrate 40 and the transfer substrate 11A are placed on a stage (not shown) in a state where the donor substrate 40 and the transfer substrate 11A are overlapped, and the donor substrate 40 and the transfer substrate 11A are placed as shown in FIGS. In a planar state, the adhesive sheet 62 is attached to the entire back surface of the donor substrate 40.

  Next, as shown in FIG. 12A, one end of the curved surface 61A of the main body 61 is brought into contact with the side 40A on the back surface of the donor substrate 40 with the adhesive sheet 62 therebetween, and corresponds to the side 40A. An end portion (a portion protruding from the donor substrate 40) of the adhesive sheet 62 is fixed to the side surface of the main body 61 by a clamp 63. The end portion of the adhesive sheet 62 corresponding to the side 40A continues to be fixed to the side surface of the main body 61 by, for example, the clamp 63 from the start to the end of peeling.

  Subsequently, as shown in FIG. 12B, the main body 61 is rotated in the direction of the arrow R1 on the back surface of the donor substrate 40, whereby the adhesive sheet 62 with the donor substrate 40 attached on one side thereof is bonded to the donor. The substrate 40 is wound around the curved surface 61A. As a result, the donor substrate 40 is deformed from the side 40A into a curved surface and is peeled off from the transfer substrate 11A. In addition, when the adhesive sheet 62 is a double-sided adhesive sheet, you may stick the back surface of the donor substrate 40 to the curved surface 61A using the other adhesive surface of the adhesive sheet 62.

  The peeling position 40C between the donor substrate 40 and the transferred substrate 11A moves from the side 40A where the deformation starts to the opposite side 40D. As shown in FIG. 12C, when the peeling position 40C reaches the opposite side 40D and the adhesive sheet 62 is wound around the curved surface 61A together with the donor substrate 40, the end of the adhesive sheet 62 corresponding to the opposite side 40D is clamped 63 To fix to the main body 61. Thereby, the donor substrate 40 is completely peeled from the transfer substrate 11A. On the other hand, the substrate 11A to be transferred is maintained in a flat state from the start to the end of peeling by a clamp (not shown). By using the manufacturing apparatus 60, the donor substrate 40 and the transfer substrate 11A can be easily separated in a vacuum.

  After the donor substrate 40 is peeled from the transfer substrate 11A in this way, when the adhesive sheet 62 is a single-sided adhesive sheet, the donor substrate 40 can be transported with the adhesive sheet 62 attached. When the adhesive sheet 62 is a double-sided adhesive sheet, the adhesive sheet 62 is peeled from the main body 61 or the donor substrate 40 by heating or ultraviolet irradiation.

  After that, the green light emitting layer 15CG is formed by the thermal transfer method, for example, in the same manner as the red light emitting layer 15CR by the process shown in FIG.

  After forming the green light emitting layer 15CG, the blue light emitting layer 15CB is formed by, for example, a thermal transfer method in the same manner as the red light emitting layer 15CR by the process shown in FIG.

  After forming the red light emitting layer 15CR, the green light emitting layer 15CG, and the blue light emitting layer 15CB, the electron transport layer 15D and the second electrode 16 made of the above-described thickness and material are sequentially formed by, for example, vapor deposition. Thus, the organic light emitting devices 10R, 10G, and 10B as shown in FIG. 3 are formed.

  After forming the organic light emitting elements 10R, 10G, and 10B, the protective film 17 made of the above-described material is formed by, for example, the CVD method, and the organic light emitting elements 10R, 10G, and 10B are covered with the protective film 17.

  After that, the adhesive layer 20 made of the above-described material is formed on the protective film 17. After that, a color filter or the like is provided, a sealing substrate 30 made of the above-described material is prepared, and the driving substrate 11 and the sealing substrate 30 are bonded together with the adhesive layer 20 in between. Thus, the display device shown in FIG. 3 is completed.

  The effect of this embodiment is the same as that of the first embodiment.

  In the above embodiment, the case where the donor substrate 40 is deformed into a curved surface has been described. However, the transfer substrate 11A may be deformed into a curved surface. Further, as indicated by arrows R1 and R2 in FIG. 11, both the donor substrate 40 and the transferred substrate 11A can be deformed into curved surfaces. In this manner, the separation can be further promoted by curving the transfer target substrate 11A in a phase opposite to that of the donor substrate 40.

<Third Embodiment>
15 to 19 show a manufacturing method of a display device according to the third embodiment of the present invention in the order of steps. This manufacturing method is different from the manufacturing method described in the first embodiment in that an adhesive unit including a plurality of adhesive pads and a drive unit is used as the bending means. In addition, the part which 1st Embodiment and a manufacturing process overlap is demonstrated with reference to FIG. 4 thru | or FIG.

  First, similarly to the first embodiment, the transferred substrate 11A and the donor substrate 40 are formed by the steps shown in FIGS.

  Next, in the same manner as in the first embodiment, the donor substrate 40 and the transferred substrate 11A are formed on the surface (on the first electrode 13 side, and in the vacuum apparatus (not shown)) by the process shown in FIG. The transfer layer 42 side) is overlapped with each other facing each other.

  Subsequently, in the same manner as in the first embodiment, the red light emitting layer 15CR is formed by, for example, a thermal transfer method in a vacuum apparatus (not shown) by the process shown in FIG.

  After the red light emitting layer 15CR is formed, the donor substrate 40 is peeled from the transfer substrate 11A in a vacuum device (not shown). FIG. 15 shows an example of a display device manufacturing apparatus (substrate separation apparatus) used in this process. The manufacturing apparatus 70 includes a rectangular main body frame 71, a substrate holding part 72, an adhesive unit 73, and a substrate storage cassette 74.

  The substrate holding portion 72 is for holding the transfer substrate 11A and is fixed to one side of the main body frame 71 in the longitudinal direction. The substrate holding part 72 has a plurality of pad support members 72A and a plurality of adhesive pads 72B. Two adhesive pads 72B are disposed on each of the pad support members 72A.

  The adhesive unit 73 has a configuration in which multiple rows (for example, five rows) of adhesive heads 80 (No. 1, No. 2, No. 3, No. 4, No. 5) are attached to a common base 80A. Yes. The gantry 80A can reciprocate between the substrate holder 72 and the substrate storage cassette 74 in the longitudinal direction of the main body frame 71 by a wheel 80B provided at the lower end. Here, the adhesive unit 73 corresponds to a specific example of “curving means” in the present invention.

  The plurality of adhesive heads 80 distribute the peeling force over the entire surface of the donor substrate 40 (requirement (1)) and allow the peeling force to act from the back surface of the donor substrate 40 (requirement (2)). In addition, the plurality of adhesive heads 80 does not perform the separation in a batch while maintaining the donor substrate 40 in a flat state, but starts from one side or one corner of the donor substrate 40 and proceeds while moving the separation position (requirement) (4)). Each of the plurality of adhesive heads 80 includes a plurality of (for example, six) adhesive pads 81 and one drive unit 82.

  The plurality of adhesive pads 81 have a function of generating the peeling force referred to in the requirement (3), and are attached to a common attachment base 83. The plurality of adhesive pads 81 are adhered to the donor substrate 40 in a flat state, and then peeled and held while deforming the donor substrate 40 into a curved surface (requirement (3)). The plurality of adhesive pads 81 can reliably hold the donor substrate 40 from the start to the end of peeling (requirement (5)), and can prevent the donor substrate 40 from falling off. The adhesive system of the adhesive pad 81 is preferably an adhesive pad, but may be an electrostatic chuck type, a magnetic type, an adsorption type, or the like.

  The drive part 82 is comprised by the cylinder for raising / lowering, for example. The drive unit 82 is attached to the support plate 85 together with a pair of guide pushes 84. By moving the attachment base 83 up and down by the drive unit 82 and the pair of guide pushes 84, the plurality of adhesive pads 81 are moved up and down for each row. It is supposed to let you. The support plate 84 is fixed in the short direction of the gantry 80A.

  Separation of the donor substrate 40 using the manufacturing apparatus 70 can be performed, for example, as follows.

  First, as shown in FIG. 16, in a state where the adhesive unit 73 is retracted to the substrate storage cassette 74 side, the donor substrate 40 and the transfer substrate 11A are set on the substrate holding unit 72 in a state of being overlapped, and the transfer target is transferred. An adhesive pad 72B is adhered to the back surface of the substrate 11A.

  Next, as illustrated in FIG. 17, the adhesive unit 73 is moved to the substrate holding unit 72 side, and the plurality of adhesive pads 81 are lowered by the driving unit 82 to adhere the adhesive pads 81 to the back surface of the donor substrate 40. At this time, both the donor substrate 40 and the transferred substrate 11A are in a planar state.

  Subsequently, as shown in FIG. 18A and FIG. 18B, a plurality of driving units 82 sequentially drive the plurality of driving units 82 from the rightmost adhesive head 80 (No. 1) located on the side 40 </ b> A of the donor substrate 40. The adhesive pads 81 are raised for each row and moved in a direction away from the transfer substrate 11A held by the substrate holding part 72. As a result, the donor substrate 40 is deformed from the side 40A into a curved surface and is peeled off from the transfer substrate 11A.

  The peeling position 40C between the donor substrate 40 and the transferred substrate 11A moves from the side 40A where the deformation starts to the opposite side 40D. As shown in FIG. 18C, when the peeling position 40C reaches the opposite side 40D, the donor substrate 40 is completely peeled from the transfer substrate 11A. On the other hand, the transferred substrate 11A is maintained in a planar state by the substrate holding portion 72 from the start to the end of the peeling. Finally, as shown in FIG. 19, the adhesive unit 73 is retracted to the substrate storage cassette 74 side, and the donor substrate 40 is stored in the substrate storage cassette 74. By using this manufacturing apparatus 70, the donor substrate 40 and the transfer substrate 11A can be easily separated in a vacuum.

  After that, the green light emitting layer 15CG is formed by the thermal transfer method, for example, in the same manner as the red light emitting layer 15CR by the process shown in FIG.

  After forming the green light emitting layer 15CG, the blue light emitting layer 15CB is formed by, for example, a thermal transfer method in the same manner as the red light emitting layer 15CR by the process shown in FIG.

  After forming the red light emitting layer 15CR, the green light emitting layer 15CG, and the blue light emitting layer 15CB, the electron transport layer 15D and the second electrode 16 made of the above-described thickness and material are sequentially formed by, for example, vapor deposition. Thus, the organic light emitting devices 10R, 10G, and 10B as shown in FIGS. 3 and 4 are formed.

  After forming the organic light emitting elements 10R, 10G, and 10B, the protective film 17 made of the above-described material is formed by, for example, the CVD method by the process shown in FIG. Cover with.

  After that, the adhesive layer 20 made of the above-described material is formed on the protective film 17. After that, a color filter or the like is provided, a sealing substrate 30 made of the above-described material is prepared, and the driving substrate 11 and the sealing substrate 30 are bonded together with the adhesive layer 20 therebetween. Thus, the display device shown in FIG. 3 is completed.

  The effect of this embodiment is the same as that of the first embodiment.

  In the above embodiment, the case where the adhesive pad 81 is deformed from one side 40A of the donor substrate 40 to a curved surface by raising the adhesive pad 81 for each column of the adhesive heads 80 has been described. The donor substrate 40 may be deformed into a curved surface. Further, by raising the adhesive pad 81 one by one, it is deformed into a curved surface from one corner of the donor substrate 40 toward the diagonal, from two opposite corners toward the center, or from all angles toward the center. You may make it make it.

  Further, the plurality of adhesive pads 81 are not limited to each row, and can be raised independently one by one or independently for each section composed of the plurality of adhesive pads 81.

  Furthermore, although the case where the donor substrate 40 is deformed into a curved surface has been described in the above embodiment, the transfer substrate 11A can be deformed into a curved surface. Further, as indicated by arrows R1 and R2 in FIG. 11, both the donor substrate 40 and the transferred substrate 11A can be deformed into curved surfaces. In this manner, the separation can be further promoted by curving the transfer target substrate 11A in a phase opposite to that of the donor substrate 40.

(Modules and application examples)
Hereinafter, application examples of the display device described in the above embodiment will be described. The display device according to the above embodiment is an image signal that is input from the outside or is generated internally, such as a television device, a digital camera, a notebook personal computer, a mobile terminal device such as a mobile phone, or a video camera. Alternatively, the present invention can be applied to display devices for electronic devices in various fields that display images.

(module)
The display device according to the above-described embodiment is incorporated into various electronic devices such as application examples 1 to 5 described later, for example, as a module as illustrated in FIG. In this module, for example, a region 210 exposed from the sealing substrate 30 and the adhesive layer 20 is provided on one side of the drive substrate 11, and wiring of the signal line drive circuit 120 and the scanning line drive circuit 130 is provided in the exposed region 210. And an external connection terminal (not shown) is formed. The external connection terminal may be provided with a flexible printed circuit (FPC) 220 for signal input / output.

(Application example 1)
FIG. 21 illustrates an appearance of a television device to which the display device of the above embodiment is applied. The television apparatus has, for example, a video display screen unit 300 including a front panel 310 and a filter glass 320, and the video display screen unit 300 is configured by the display device according to each of the above embodiments. .

(Application example 2)
FIG. 22 shows the appearance of a digital camera to which the display device of the above embodiment is applied. The digital camera includes, for example, a flash light emitting unit 410, a display unit 420, a menu switch 430, and a shutter button 440. The display unit 420 is configured by the display device according to each of the above embodiments. Yes.

(Application example 3)
FIG. 23 shows the appearance of a notebook personal computer to which the display device of the above embodiment is applied. The notebook personal computer has, for example, a main body 510, a keyboard 520 for inputting characters and the like, and a display unit 530 for displaying an image. The display unit 530 is a display according to each of the above embodiments. It is comprised by the apparatus.

(Application example 4)
FIG. 24 shows the appearance of a video camera to which the display device of the above embodiment is applied. This video camera has, for example, a main body 610, a subject photographing lens 620 provided on the front side surface of the main body 610, a start / stop switch 630 at the time of photographing, and a display 640. Reference numeral 640 denotes the display device according to each of the above embodiments.

(Application example 5)
FIG. 25 illustrates an appearance of a mobile phone to which the display device of the above embodiment is applied. For example, the mobile phone is obtained by connecting an upper housing 710 and a lower housing 720 with a connecting portion (hinge portion) 730, and includes a display 740, a sub-display 750, a picture light 760, and a camera 770. Yes. The display 740 or the sub-display 750 is configured by the display device according to each of the above embodiments.

  While the present invention has been described with reference to the embodiment, the present invention is not limited to the above embodiment, and various modifications can be made. For example, in the above-described embodiment, the case where the donor substrate 40 using the glass substrate 41 is peeled from the transfer substrate 11A has been described. However, the present invention peels the entire contact patterning mask such as an evaporation mask. The present invention can also be applied to the case of laminating using a film or the case of peeling a donor substrate using a substrate made of a film.

  Further, in the above embodiment, the case where all the R, G, and B light emitting layers 15C are formed by the transfer method has been described. However, as shown in FIG. 26, only the red light emitting layer 15CR and the green light emitting layer 15CG are transferred. After forming by the method, the blue light emitting layer 15CB may be formed over the entire surface by the vapor deposition method. At this time, in the organic light emitting element 10R, the red light emitting layer 15CR and the blue light emitting layer 15CB are formed, but energy transfer occurs in red having the lowest energy level, and red light emission becomes dominant. In the organic light emitting device 10G, the green light emitting layer 15CG and the blue light emitting layer 15CB are formed, but energy transfer occurs in green having a lower energy level, and green light emission becomes dominant. Since the organic light emitting element 10B has only the blue light emitting layer 15CB, blue light emission occurs.

  Furthermore, for example, the material and thickness of each layer described in the above embodiment and examples, or the film formation method, film formation conditions, and transfer conditions are not limited, and may be other materials and thicknesses, or Other film forming methods, film forming conditions, and transfer conditions may be used.

In addition, in the above-described embodiment, the configuration of the organic light emitting elements 10R, 10G, and 10B has been specifically described. However, it is not necessary to include all layers, and other layers may be further included. . For example, between the first electrode 13 and the organic layer 15, chromium oxide (III) (Cr ₂ O ₃ ), ITO (Indium-Tin Oxide: mixed oxide film of indium (In) and tin (Sn)), etc. A hole injecting thin film layer may be provided. For example, the first electrode 13 may be a dielectric multilayer film.

  Furthermore, although the case of the active matrix driving method has been described in the above embodiment, the present invention can also be applied to a simple matrix driving method. In addition, the configuration of the pixel driving circuit for active matrix driving is not limited to that described in the above embodiment, and a capacitor or a transistor may be added as necessary. In that case, a necessary driving circuit may be added in addition to the signal line driving circuit 120 and the scanning line driving circuit 130 described above in accordance with the change of the pixel driving circuit.

  10R, 10G, 10B ... organic light emitting element, 11 ... driving substrate, 11A ... transferred substrate, 13 ... first electrode, 14 ... insulating layer, 15 ... organic layer, 15AB ... hole injection layer and hole transport layer, 15C ... Light emitting layer, 15DE ... Electron transport layer and electron injection layer, 16 ... Second electrode, 17 ... Protective film, 20 ... Adhesive layer, 30 ... Substrate for sealing, 40 ... Donor substrate, 41 ... Base, 42 ... Transfer Layer, 43... Photothermal conversion layer, 50, 60, 70... Display device manufacturing apparatus

Claims (7)

A substrate to be transferred having a first electrode and part of a plurality of organic layers on the surface of a substrate made of glass, and a donor substrate having a transfer layer made of an organic light emitting material on the surface of a substrate made of glass, in vacuum A process of superimposing the surfaces facing each other;
Forming a light emitting layer on the substrate to be transferred by a transfer method in vacuum;
By deforming at least one of the donor substrate and the transferred substrate into a curved surface from one or more sides or one or more corners by a bending means in a vacuum, the peeling position between the donor substrate and the transferred substrate is changed. Peeling the donor substrate from the transferred substrate while moving;
Forming a remaining portion of the plurality of organic layers and a second electrode on the light emitting layer. The bending means includes a main body having a curved surface,
The display device manufacturing method according to claim 1, wherein the back surface is wound around the curved surface by rotating the main body on at least one back surface of the donor substrate and the transfer substrate. The method for manufacturing a display device according to claim 2, wherein a close contact unit is provided on the curved surface, and the back surface is closely contacted with the curved surface by the close contact unit. The method for manufacturing a display device according to claim 3, wherein an end portion of the donor substrate or the transfer substrate is pressed by a gripping unit. Affixing an adhesive sheet to the entire back surface and fixing the end of the adhesive sheet to the main body by a fixing means,
The display device according to claim 2, wherein the adhesive sheet is wound around the curved surface together with the donor substrate or the transfer target substrate by rotating the main body on the back surface, and fixed to the main body by the fixing means. Production method. As the bending means, using a suction unit comprising a plurality of adhesive pads and a plurality of drive units capable of independently raising and lowering the plurality of adhesive pads one by one or a plurality of each,
The plurality of adhesive pads are raised one by one or a plurality in order by the plurality of driving units in a state where the plurality of adhesive pads are adhered to one back surface of the donor substrate and the transfer target substrate. A manufacturing method of the display device according to 1. A donor substrate having a transfer layer made of an organic light emitting material on the surface of a substrate made of glass, and a transfer substrate having a first electrode and a part of a plurality of organic layers formed on the surface of the substrate made of glass, Is used in the process of separating from the state of facing and overlapping,
An apparatus for manufacturing a display device, comprising: bending means capable of deforming at least one of the donor substrate and the transfer substrate from one or more sides or one or more corners into a curved surface.

Images