JP4957929B2 - Method for manufacturing donor substrate and display device - Google Patents

Abstract

The present invention provides a donor substrate used in forming a light emitting layer by forming a transfer layer containing light emission material, irradiating a radiation ray to the transfer layer while the transfer layer and a substrate to be transferred face each other, and sublimating or vaporizing the transfer layer so that the transfer layer is transferred to the substrate to be transferred. The donor substrate includes: a base; a photothermal conversion layer arranged on the base; and a heat interfering layer arranged between the base and the photothermal conversion layer, and including two or more layers with refraction index different from each other. The donor substrate can improve absorption rate within the wavelength range by regulating refraction index (material) and thickness of the heat interfering layer.

Description

  The present invention relates to a donor substrate for forming a light emitting layer of an organic light emitting element by a transfer method and a method for manufacturing a display device using the donor substrate.

  2. Description of the Related Art In recent years, next-generation display devices have been actively developed, and an organic light-emitting element (organic EL (Electroluminescence) element) in which a first electrode, a plurality of organic layers including a light-emitting layer, and a second electrode are sequentially stacked on a driving substrate. An organic light emitting display device using the above has attracted attention. Since the organic light emitting display device is a self-luminous type, it has a wide viewing angle and does not require a backlight, so that it can be expected to save power, has high responsiveness, and can reduce the thickness of the device. Therefore, application to a large screen display device such as a television is strongly desired.

  In order to increase the size and productivity of such an organic light emitting display device, the use of a larger mother glass is being studied. At that time, in a method for forming a light emitting layer using a general metal mask, a light emitting material is deposited or applied through a metal mask having an opening pattern on a metal sheet, thereby patterning the R, G, and B light emitting layers. Therefore, it is necessary to enlarge the metal mask corresponding to the large substrate.

  However, due to the increase in size of the metal mask, the deflection due to the weight of the mask and the complexity of conveyance become remarkable, and alignment becomes difficult. For this reason, the aperture ratio cannot be sufficiently increased, and as a result, the device characteristics also deteriorate.

  Therefore, as a patterning technique that does not require a metal mask, there is a transfer method using radiation such as a laser. In the transfer method, a donor element in which a transfer layer containing a luminescent material is formed on a support material is formed, and this donor element is placed opposite to a transfer substrate for forming an organic light emitting element, and radiation is emitted in a reduced pressure environment. In this method, the transfer layer is transferred to the transfer substrate by irradiation. As radiation, in addition to a laser, light from a xenon flash lamp may be condensed by a lens and used (see, for example, Patent Document 1).

  A conventional donor substrate is obtained by patterning a photothermal conversion layer made of chromium (Cr) or the like only in a desired range (range to be transferred) of a base material made of glass or film. In the transfer process, a transfer layer made of an organic material is formed on the donor substrate, and laser light is partially irradiated corresponding to the photothermal conversion layer so that only a desired range of the transfer layer is transferred to the transfer substrate. ing.

JP 1997-167684 A (paragraphs 0017, 0028)

  However, in the case of thermal transfer using a laser, there is a problem that if the substrate size is increased, the processing time becomes enormous and the apparatus cost increases. Therefore, a xenon flash lamp, a halogen infrared lamp, or the like can process a large area with a single stroke or a single stroke, and is considered promising as a radiation source instead of a laser. However, conventionally, a donor substrate that can efficiently absorb radiation having a wide wavelength, such as a flash lamp and a halogen infrared lamp, has not been developed, and if a conventional donor substrate is used, a large amount of power is required. Loss of has occurred.

In the conventional donor substrate, the surface of the base material and the photothermal conversion layer is covered with a heat insulating layer made of SiO ₂ or the like, and a contamination prevention layer made of molybdenum (Mo) or the like is formed on the heat insulating layer. It had been. Therefore, the heat of the light absorption layer diffuses radiatively in the surface of the contamination prevention layer, the organic material of the transfer layer melts, and the outline of the transfer layer is distorted. It was transferred to the range of (I do not want to transfer). For this reason, transfer accuracy is lowered, color mixing is performed on adjacent pixels, and the productivity is significantly reduced.

The present invention has been made in view of the above problems, purpose of that is to provide a method of manufacturing a display device using precisely that the donor substrate and which capable of transferring a desired range of the transfer layer There is.

The donor substrate according to the present invention is formed by forming a transfer layer containing a light emitting material, irradiating the transfer layer with the transfer layer facing the transfer substrate, sublimating or vaporizing the transfer layer, and transferring the transfer layer to the transfer substrate. It is for forming a light emitting layer, Comprising: The structural requirements of the following (A)-(E) are provided.
(A) Substrate (B) Photothermal conversion layer (C) provided on the substrate corresponding to the region where the light emitting layer is to be formed on the substrate to be transferred (C) Thermal insulation layer (D) formed on the photothermal conversion layer and on the substrate ) Consisting of a convex structure (E) metal material provided in a region between the light-to-heat conversion layers on the heat insulating layer, and formed on the upper surface of the first portion and the heat insulating layer formed on the upper surface of the convex structure Contamination prevention layer which has 2nd part and 1st part and 2nd part are parted

Method for producing Viewing device that by the present invention, the drive substrate, a first electrode, an insulating layer having an opening corresponding to the light emitting region of the first electrode, a plurality of organic layers including a light emitting layer, and the Forming an organic light-emitting device having two electrodes in order, forming a first electrode, an insulating layer, and a part of a plurality of organic layers on a driving substrate, and forming a transfer substrate; and a donor A light-emitting layer is formed by forming a transfer layer containing a light-emitting material on a substrate, placing the transfer layer opposite to the substrate to be transferred, irradiating radiation, and sublimating or vaporizing the transfer layer to transfer it to the substrate to be transferred. It includes a step, and forming the remainder and a second electrode of the plurality of organic layers, as the donor substrate, in which to use a donor substrate of the present invention.

In the donor substrate of the present invention, the contamination prevention layer is made of a metal material , and has a first portion formed on the upper surface of the convex structure and a second portion formed on the upper surface of the heat insulating layer. Since the first part and the second part are separated, the thermal diffusion through the contamination prevention layer is greatly reduced. Therefore, the possibility that an undesired range of the transfer layer is transferred is reduced, and the desired range is transferred with high accuracy.

According to the donor substrate of the present invention, the contamination prevention layer is made of a metal material , and has a first portion formed on the upper surface of the convex structure and a second portion formed on the upper surface of the heat insulating layer. At the same time, since the first portion and the second portion are divided, the thermal diffusion through the contamination prevention layer can be greatly reduced, and the desired range of the transfer layer can be accurately transferred. . Therefore, when an organic light emitting display device is manufactured using this donor substrate, a light emitting layer can be formed with high accuracy without using a mask.

It is a figure showing the structure of the display apparatus which concerns on the 1st Embodiment of this invention. It is a figure showing an example of the pixel drive circuit shown in FIG. It is sectional drawing showing the structure of the display area shown in FIG. It is a top view showing the structure of the 1st electrode and insulating layer which were shown in FIG. It is sectional drawing and the top view showing the structure of the donor substrate used for the manufacturing method of the display apparatus shown in FIG. It is sectional drawing showing the manufacturing method of a donor substrate in order of a process. FIG. 3 is a cross-sectional view illustrating a method of manufacturing the display device illustrated in FIG. 1 in order of steps. It is sectional drawing for demonstrating the effect | action of the rib shown in FIG. It is sectional drawing for demonstrating an example and the problem of the conventional donor substrate. It is sectional drawing showing the modification of the process shown to FIG. 7 (B). FIG. 6 is a cross-sectional view illustrating a modified example of the donor substrate illustrated in FIG. 5. It is sectional drawing showing the manufacturing method of the display apparatus using the donor substrate shown in FIG. It is sectional drawing showing the modification of the process shown in FIG. It is sectional drawing showing the structure of the donor substrate which concerns on the 2nd Embodiment of this invention. It is sectional drawing showing the structure of the donor substrate which concerns on the 3rd Embodiment of this invention. It is a figure showing the absorption spectrum of a heat interference layer. It is a figure showing the absorption spectrum of a heat interference layer. It is a figure showing the absorption spectrum of a heat interference layer. FIG. 16 is a cross-sectional view illustrating a transfer process using the donor substrate illustrated in FIG. 15. It is a top view showing an example of the irradiation method of a radiation ray. It is a top view showing the other example of the irradiation method of a radiation ray. FIG. 16 is a cross-sectional view illustrating a modified example of the donor substrate illustrated in FIG. 15. It is sectional drawing for demonstrating the structure of the donor substrate of the comparative example 1, and its problem. It is a top view showing schematic structure of the module containing the display apparatus of the said embodiment. It is a perspective view showing the external appearance of the application example 1 of the display apparatus of the said embodiment. (A) is a perspective view showing the external appearance seen from the front side of the application example 2, (B) is a perspective view showing the external appearance seen from the back side. 12 is a perspective view illustrating an appearance of application example 3. FIG. 14 is a perspective view illustrating an appearance of application example 4. FIG. (A) is a front view of the application example 5 in an open state, (B) is a side view thereof, (C) is a front view in a closed state, (D) is a left side view, and (E) is a right side view, (F) is a top view and (G) is a bottom view. FIG. 4 is a cross-sectional view illustrating another configuration of the display area illustrated in FIG. 3.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The description will be given in the following order.
1. 1. First embodiment (example in which laser beam is used as radiation and a donor substrate is provided with a convex structure) Modification 1 (Example in which a transfer layer having a different color is provided for each region divided by the convex structure)
3. Second embodiment (example in which a thermal interference layer having a single-layer structure is provided between a substrate and a photothermal conversion layer)
4). Third embodiment (example in which a radiation source with a wide wavelength is used and a thermal interference layer is a laminated structure)

(First embodiment)
(Display device)
FIG. 1 shows a configuration of a display device according to the first embodiment of the present invention. This display device is used as an ultra-thin organic light emitting color display device or the like. For example, a plurality of organic light emitting elements 10R, 10G, and 10B described later are arranged in a matrix on a driving substrate 11 made of glass. A display area 110 is formed, and a signal line driving circuit 120 and a scanning line driving circuit 130 which are drivers for displaying images are formed around the display area 110.

  A pixel drive circuit 140 is formed in the display area 110. FIG. 2 illustrates an example of the pixel driving circuit 140. The pixel driving circuit 140 is formed below the first electrode 13 to be described later, and includes a driving transistor Tr1 and a writing transistor Tr2, a capacitor (holding capacitor) Cs therebetween, a first power supply line (Vcc), and a second power source line (Vcc). This is an active drive circuit having an organic light emitting element 10R (or 10G, 10B) connected in series to the drive transistor Tr1 between power supply lines (GND). The driving transistor Tr1 and the writing transistor Tr2 are configured by a general thin film transistor (TFT (Thin Film Transistor)), and the configuration may be, for example, an inverted staggered structure (so-called bottom gate type) or a staggered structure (top gate type). There is no particular limitation.

In the pixel driving circuit 140, a plurality of signal lines 120A are arranged in the column direction, and a plurality of scanning lines 130A are arranged in the row direction. An intersection between each signal line 120A and each scanning line 130A corresponds to one of the organic light emitting elements 10R, 10G, and 10B (sub pixel). Each signal line 120A is connected to the signal line drive circuit 120, and an image signal is supplied from the signal line drive circuit 120 to the source electrode of the write transistor Tr2 via the signal line 120A. Each scanning line 130A is connected to the scanning line driving circuit 130, and a scanning signal is sequentially supplied from the scanning line driving circuit 130 to the gate electrode of the writing transistor Tr2 via the scanning line 130A.

  FIG. 3 illustrates an example of a cross-sectional configuration of the display area 110. In the display area 110, an organic light emitting element 10R that generates red light, an organic light emitting element 10G that generates green light, and an organic light emitting element 10B that generates blue light are sequentially formed in a matrix. Has been. The organic light emitting elements 10R, 10G, and 10B have a rectangular planar shape, and are arranged in the longitudinal direction (column direction) for each color. Note that a combination of adjacent organic light emitting elements 10R, 10G, and 10B constitutes one pixel. The pixel pitch is, for example, 300 μm.

  The organic light emitting devices 10R, 10G, and 10B are respectively anodes from the side of the driving substrate 11 with the driving transistor (not shown) and the planarization insulating film (not shown) of the pixel driving circuit 140 described above in between. The first electrode 13 as an insulating layer, the insulating layer 14, an organic layer 15 including a red light emitting layer 15CR, a green light emitting layer 15CG, or a blue light emitting layer 15CB, which will be described later, and a second electrode 16 as a cathode are stacked in this order. is doing.

  Such organic light-emitting elements 10R, 10G, and 10B are covered with a protective film 17 such as silicon nitride (SiNx), and further, a sealing substrate 30 made of glass or the like with an adhesive layer 20 in between the protective film 17. Is sealed by being bonded over the entire surface.

  The first electrode 13 is made of, for example, ITO (indium / tin composite oxide) or IZO (indium / zinc composite oxide). Moreover, you may comprise the 1st electrode 13 with a reflective electrode. In that case, the first electrode 13 has a thickness of, for example, 100 nm or more and 1000 nm or less, and it is desirable that the first electrode 13 has a reflectance as high as possible in order to increase the light emission efficiency. For example, the material constituting the first electrode 13 is a metal such as chromium (Cr), gold (Au), platinum (Pt), nickel (Ni), copper (Cu), tungsten (W), or silver (Ag). An elemental element or an alloy is mentioned.

  The insulating layer 14 is used to ensure insulation between the first electrode 13 and the second electrode 16 and to accurately form the light emitting region in a desired shape. For example, the insulating layer 14 has a thickness of about 1 μm and is made of silicon oxide or polyimide. It is comprised with photosensitive resin. The insulating layer 14 is provided with an opening corresponding to the light emitting region 13A of the first electrode 13, and corresponds to a convex structure 44 of the donor substrate 40 described later as a convex structure on the driving substrate 11 side. It also has a function. The organic layer 15 and the second electrode 16 may be continuously provided not only on the light emitting region 13A but also on the insulating layer 14, but light emission occurs only in the opening of the insulating layer 14. .

  FIG. 4 illustrates an example of a planar configuration of the first electrode 13 and the insulating layer 14. The insulating layer 14 is provided, for example, in a lattice shape. On the insulating layer 14, ribs 14 </ b> A are provided at positions away from the light emitting region 13 </ b> A of the first electrode 13 (for example, intersections of lattices of the insulating layer 14). The ribs 14A are for avoiding contact between the convex structure 44 of the donor substrate 40 and the insulating layer 14 in a transfer process described later. Therefore, the height H of the rib 14A is desirably higher than that of the convex structure 44, and can be, for example, about 5 μm. The rib 14A is made of the same material as the insulating film 14, for example. Note that the driving substrate 11 is provided with an alignment mark M for alignment with the donor substrate 40 in a transfer step described later.

The organic layer 15 shown in FIG. 3 includes a hole injection layer and a hole transport layer 15AB, a red light emitting layer 15CR, a green light emitting layer 15CG, or a blue light emitting layer 15CB, and an electron transport layer and Although the electron injection layer 15DE is laminated, a layer other than the red light emitting layer 15CR, the green light emitting layer 15CG, or the blue light emitting layer 15CB may be provided as necessary. The organic layer 15 may have a different configuration depending on the emission color of the organic light emitting elements 10R, 10G, and 10B. The hole injection layer is a buffer layer for improving hole injection efficiency and preventing leakage. The hole transport layer is for increasing the efficiency of hole transport to the red light emitting layer 15CR, the green light emitting layer 15CG, or the blue light emitting layer 15CB. The red light emitting layer 15CR, the green light emitting layer 15CG, or the blue light emitting layer 15CB generates light by recombination of electrons and holes by applying an electric field. The electron transport layer is for increasing the efficiency of electron transport to the red light emitting layer 15CR, the green light emitting layer 15CG, or the blue light emitting layer 15CB. The electron injection layer has a thickness of about 0.3 nm, for example, and is made of LiF, Li ₂ O, or the like. In FIG. 3 , the hole injection layer and the hole transport layer are one layer (hole injection layer and hole transport layer 15AB), and the electron transport layer and the electron injection layer are one layer (electron transport layer and electron injection layer 15DE). Represents.

The hole injection layer of the organic light emitting device 10R has, for example, a thickness of 5 nm to 300 nm, and 4,4 ′, 4 ″ -tris (3-methylphenylphenylamino) triphenylamine (m-MTDATA) or 4, It is composed of 4 ′, 4 ″ -tris (2-naphthylphenylamino) triphenylamine (2-TNATA). The hole transport layer of the organic light emitting element 10R has, for example, a thickness of 5 nm to 300 nm and is made of bis [(N-naphthyl) -N-phenyl] benzidine (α-NPD). The red light emitting layer 15CR of the organic light emitting element 10R has, for example, a thickness of 10 nm or more and 100 nm or less, and 2,6 - bis [4′ - methoxydiphenylamino] is added to 9,10-di- (2-naphthyl) anthracene (ADN). ) styryl] - 1,5 - is constituted by those dicyano naphthalene (BSN) were mixed 30% by weight. Electron-transporting layer of the organic light emitting element 10R has a thickness of, for example, 5nm or more 300nm or less, 8 - is constituted by hydroxyquinoline aluminum (Alq _3).

The hole injection layer of the organic light emitting element 10G has a thickness of 5 nm to 300 nm, for example, and is made of m-MTDATA or 2-TNATA. The hole transport layer of the organic light emitting element 10G has, for example, a thickness of 5 nm or more and 300 nm or less, and is configured by α-NPD. The green light emitting layer 15CG of the organic light emitting element 10G has a thickness of 10 nm to 100 nm, for example, and is configured by mixing 5% by volume of coumarin 6 with ADN. The electron transport layer of the organic light emitting element 10G has a thickness of, for example, 5 nm to 300 nm and is made of Alq ₃ .

The hole injection layer of the organic light emitting element 10B has, for example, a thickness of 5 nm to 300 nm and is made of m-MTDATA or 2-TNATA. The hole transport layer of the organic light emitting device 10B has, for example, a thickness of 5 nm to 300 nm and is made of α-NPD. The blue light emitting layer 15CB of the organic light emitting element 10B has a thickness of, for example, 10nm or more 100nm or less, 4,4' the ADN - bis [2 - {4 - (N , N - diphenylamino) phenyl} vinyl] biphenyl ( DPAVBi) is mixed with 2.5% by weight. The electron transport layer of the organic light emitting element 10B has a thickness of 5 nm to 300 nm, for example, and is made of Alq ₃ .

  The second electrode 16 shown in FIG. 3 has, for example, a thickness of 5 nm to 50 nm and is made of a simple substance or an alloy of a metal element such as aluminum (Al), magnesium (Mg), calcium (Ca), sodium (Na). It is configured. Among these, an alloy of magnesium and silver (MgAg alloy) or an alloy of aluminum (Al) and lithium (Li) (AlLi alloy) is preferable.

The protective film 17 shown in FIG. 3 is for preventing moisture and the like from entering the organic layer 15 and is made of a material having low permeability and water absorption and has a sufficient thickness. . Further, the protective film 17 is made of a material having a high transmittance with respect to the light generated in the light emitting layer 15C and having a transmittance of, for example, 80% or more. For example, the protective film 17 has a thickness of about 2 μm to 3 μm and is made of an inorganic amorphous insulating material. Specifically, amorphous silicon (α-Si), amorphous silicon carbide (α-SiC), amorphous silicon nitride (α-Si _1-x N _x ), and amorphous carbon (α-C) are preferable. Since these inorganic amorphous insulating materials do not constitute grains, the water permeability is low and a good protective film 17 is obtained. The protective film 17 may be made of a transparent conductive material such as ITO.

  The adhesive layer 20 shown in FIG. 3 is made of, for example, a thermosetting resin or an ultraviolet curable resin.

  The sealing substrate 30 shown in FIG. 3 is located on the second electrode 16 side of the organic light emitting elements 10R, 10G, and 10B, and seals the organic light emitting elements 10R, 10G, and 10B together with the adhesive layer 20. It is made of a material such as glass that is transparent to the light generated by the organic light emitting devices 10R, 10G, and 10B. The sealing substrate 30 is provided with, for example, a color filter (not shown), and extracts light generated in the organic light emitting elements 10R, 10G, and 10B, and the organic light emitting elements 10R, 10G, and 10B, and a portion therebetween. The external light reflected by the wiring may be absorbed to improve the contrast.

(Donor substrate)
Next, a donor substrate used in the method for manufacturing the display device will be described.

  FIG. 5 shows the configuration of the donor substrate. The donor substrate 40 is used in a process of forming the red light emitting layer 15CR, the green light emitting layer 15CG, or the blue light emitting layer 15CB by a transfer method. On the substrate 41, the photothermal conversion layer 42, the heat insulating layer 43, and the convex structure 44 are used. And a contamination prevention layer 45 in order.

  As will be described later, the base 41 is for forming a transfer layer containing a light emitting material constituting the red light emitting layer 15CR, the green light emitting layer 15CG, or the blue light emitting layer 15CB, and is aligned with a transfer substrate described later. However, it is made of a material such as glass or a film that has high rigidity and can transmit laser light.

  The photothermal conversion layer 42 absorbs laser light and converts it into heat. For example, molybdenum (Mo), chromium (Cr), titanium (Ti), tin (Sn), or an alloy containing these has an absorptance. It is composed of a high metal material. The photothermal conversion layer 42 is formed in a stripe shape having a width of 100 μm, for example, corresponding to a region (light emitting region 13A) where the red light emitting layer 15CR, the green light emitting layer 15CG, or the blue light emitting layer 15CB is to be formed on the driving substrate 11. Yes.

The heat insulating layer 43 is for suppressing thermal diffusion from the photothermal conversion layer 42, and is formed on the entire surface of the photothermal conversion layer 42 and the base body 41. For example, the heat insulating layer 43 has a thickness of about 300 nm and is made of SiO ₂ , SiN, SiON, or Al ₂ O ₃ .

  The convex structure 44 is provided in a stripe shape in the region between the photothermal conversion layers 42 on the heat insulating layer 43 and is made of, for example, polyimide or acrylic resin.

The contamination prevention layer 45 protects the already formed organic layer 15 and the pixel driving circuit 140 on the transfer target substrate by reflecting the laser beam irradiated to a region other than the desired range of the transfer layer. For example, it is desirable to have a reflectance of 85% or more in a wavelength region of 450 nm to 1500 nm. This is because if the reflectance is low, the contamination prevention layer 45 may absorb light and have heat. Examples of the constituent material of the contamination prevention layer 45 include metal materials such as molybdenum (Mo), chromium (Cr), titanium (Ti), tin (Sn), and alloys containing these.

  The contamination prevention layer 45 has a first portion 45A formed on the upper surface of the convex structure 44 and a second portion 45B formed on the upper surface of the heat insulating layer 43, and the first portion 45A and the second portion 45B. It is divided. Thereby, in this donor substrate 40, the desired range of the transfer layer can be accurately transferred.

  That is, the convex structure 44 has a function as a thermal diffusion preventing unit that reduces thermal diffusion through the contamination preventing layer 45 by dividing the first portion 45A and the second portion 45B of the contamination preventing layer 45. Yes. Therefore, it is preferable that the convex structure 44 has a reverse tapered cross-sectional shape in which the lower surface width W2 is smaller than the upper surface width W1. This is because the first portion 45 </ b> A and the second portion 45 </ b> B can be reliably separated without forming the contamination prevention layer 45 without a lithography process. In addition, when the transfer layer is formed by an ink jet method, it is possible to prevent the liquid droplet from leaking out of the convex structure 44. Specifically, the inclination angle α formed by the side surface of the convex structure 44 with respect to the flat surface of the base body 41 is preferably 75 degrees or more and 140 degrees or less.

  Moreover, it is preferable that the convex structure 44 has a height of 0.3 μm or more and 10 μm or less. This is because by increasing the distance between the photothermal conversion layer 42 and the first portion 45A of the contamination prevention layer 45, the thermal diffusion through the heat insulating layer 43 and the convex structure 44 itself can be reduced.

  Furthermore, the thickness of the contamination prevention layer 45 is preferably 25 nm or more and 500 nm or less. If the thickness is less than 25 nm, the laser beam is transmitted, and a sufficient effect cannot be obtained. If the thickness is greater than 500 nm, the first portion 45A and the second portion 45B are surely divided when the contamination prevention layer 45 is formed. Because it becomes difficult.

  The donor substrate 40 can be manufactured, for example, as follows.

  First, as shown in FIG. 6A, a photothermal conversion layer 42 made of the above-described material is formed on the base 41 made of the above-described material by, for example, sputtering, and formed into a predetermined shape by photolithography and etching. Mold. Next, as shown in FIG. 6B, the heat insulating layer 43 made of the above-described material is formed by, for example, a CVD (Chemical Vapor Deposition) method.

  Subsequently, similarly as shown in FIG. 6B, a photosensitive resin is applied over the entire surface of the base 41, formed into a predetermined shape by, for example, a photolithography method, and baked to form a convex structure 44. . At this time, the height of the convex structure 44 is set to 3 μm, for example, so as to have a reverse tapered cross-sectional shape.

  After that, the contamination prevention layer 45 made of the above-mentioned material is formed with a thickness of 150 nm, for example, by sputtering, for example. At this time, the contamination prevention layer 45 is interrupted at the side surface of the convex structure 44, and the first portion 45A formed on the upper surface of the convex structure 44 and the second portion 45B formed on the upper surface of the heat insulating layer 43 are divided. . Therefore, a patterning process such as photolithography is not necessary. Thus, the donor substrate 40 shown in FIG. 5 is formed.

(Manufacturing method of display device)
This display device can be manufactured, for example, as follows.

  First, the first electrode 13, the insulating layer 14, the hole injection layer, and the hole transport layer 15AB are formed on the driving substrate 11, and the transfer substrate 11A is formed.

  That is, a driving substrate 11 made of the above-described material is prepared, a pixel driving circuit 140 is formed on the driving substrate 11, and then a photosensitive resin is applied to the entire surface to apply a planarization insulating film (not shown). ) And patterned into a predetermined shape by exposure and development, and a connection hole (not shown) between the drive transistor Tr1 and the first electrode 13 is formed and baked.

  Next, the first electrode 13 made of the above-described material is formed by, for example, sputtering, and is formed into a predetermined shape by, for example, dry etching. An alignment mark used for alignment with the donor substrate in a transfer step described later may be formed at a predetermined position of the driving substrate 11.

  Subsequently, the insulating layer 14 is formed over the entire surface of the driving substrate 11, and an opening is provided corresponding to the light emitting region 13A of the first electrode 13, for example, by photolithography.

  After that, on the insulating layer 14, the rib 14 </ b> A made of the above-described height and material is provided at a position away from the light emitting region 13 </ b> A of the first electrode 13 (for example, the intersection of the lattice of the insulating layer 14).

  After that, the hole injection layer and the hole transport layer 15AB made of the above-described thickness and material are sequentially formed by, for example, an evaporation method using an area mask. Thereby, the transfer substrate 11A is formed.

  After the transfer substrate 11A is formed, a plurality of the donor substrates 40 described above are prepared, and each donor substrate 40 is provided with one of red, green, and blue as shown in FIG. A transfer layer 50 is formed.

  Next, the red light emitting layer 15CR, the green light emitting layer 15CG, or the blue light emitting layer 15CB is formed by a transfer method using the donor substrate 40. That is, as shown in FIG. 7B, for example, the transfer layer 50 of the donor substrate 40 is disposed opposite to the transfer substrate 11A in order to form the red light emitting layer 15CR. At this time, since the rib 14A (see FIG. 4) is provided on the insulating film 14 of the transfer substrate 11A, a space G is formed between the convex structure 44 of the donor substrate 40 and the insulating layer 14. As shown in FIG. 8, they do not contact each other. Therefore, it is possible to suppress the occurrence of a step in the organic layer 15 after film formation due to the contact between the two, and to prevent deterioration in image quality such as light emission streaks.

Then, as also shown in FIG. 7 (B), the laser beam LB is irradiated from the back side of the donor substrate 40, a red light-emitting layer by transferring to a transfer substrate 11A by sublimation or vaporization of the transfer layer 50 15CR is formed. Here, the contamination prevention layer 45 has a first portion 45A formed on the upper surface of the convex structure 44 and a second portion 45B formed on the upper surface of the heat insulating layer 43, and the first portion 45A and the first portion 45A. Since the two portions 45B are divided, the thermal diffusion through the contamination prevention layer 45 is greatly reduced. Therefore, the possibility that an undesired range of the transfer layer 50 is transferred is reduced, and the desired range is transferred with high accuracy.

On the other hand, in the conventional donor substrate, as shown in FIG. 9A, the contamination prevention layer 845 is continuously formed on the entire surface of the heat insulating layer 844. Therefore, the arrow A1 in FIG. As shown in FIG. 6, the heat from the light-to-heat conversion layer 842 was diffused radially within the surface of the contamination prevention layer 845. For this reason, the organic material of the transfer layer 850 is melted and the outline is sagged, and not only the desired range 852 of the transfer layer 850 but also the undesired range (the range that is not desired to be transferred) 851 is transferred, and transfer accuracy is increased. As a result, there was a decrease in color, color mixing with adjacent pixels, etc., and productivity was significantly reduced. In FIG. 9, the same components as those in FIGS. 5 and 7 are denoted by the reference numerals in the 800s.

  As shown in FIG. 10, the entire back side of the donor substrate 40 may be irradiated with the laser beam LB. In this case, in the region where the photothermal conversion layer 42 is not formed, the laser beam LB is reflected by the contamination prevention layer 45 as indicated by the arrow A4, and therefore the undesired range 51 of the transfer layer 50 is not transferred. On the other hand, in the region where the photothermal conversion layer 42 is formed, the laser beam LB is absorbed by the photothermal conversion layer 42 and only a desired range 52 of the transfer layer 50 is transferred to the transfer substrate 11A.

  After that, the green light emitting layer 15CG or the blue light emitting layer 15CB is formed in the same manner as the red light emitting layer 15CR.

  After forming the red light emitting layer 15CR, the green light emitting layer 15CG, or the blue light emitting layer 15CB, the donor substrate 40 and the transferred substrate 11A are separated. On the transfer substrate 11A, the electron transport layer and the electron injection layer 15DE and the second electrode 16 are formed, for example, by vapor deposition. In this way, the organic light emitting elements 10R, 10G, and 10B are formed. On the other hand, the used donor substrate 40 can be used repeatedly after the remaining transfer layer 50 is washed and removed and the contamination prevention layer 45 is peeled off by a dry process or a wet process.

  After the organic light emitting elements 10R, 10G, and 10B are formed, the protective film 17 made of the above-described material is formed thereon. As a method for forming the protective film 17, a film forming method in which the energy of the film forming particles is small to such an extent that the protective film 17 is not affected, for example, a vapor deposition method or a CVD method is preferable. Further, it is desirable that the protective film 17 be performed continuously with the formation of the second electrode 16 without exposing the second electrode 16 to the atmosphere. It is because it can suppress that the organic layer 15 deteriorates with the water | moisture content or oxygen in air | atmosphere. Further, in order to prevent a decrease in luminance due to deterioration of the organic layer 15, the film forming temperature of the protective film 17 is set to room temperature, and in order to prevent the protective film 17 from being peeled off, the film stress is minimized. It is desirable to film.

  After that, an adhesive layer 20 is formed on the protective film 17, and a sealing substrate 30 provided with a color filter is bonded to the adhesive layer 20 with the adhesive layer 20 in between. In that case, it is preferable to arrange | position the surface in which the color filter of the sealing substrate 30 was formed in the organic light emitting element 10R, 10G, 10B side. Thus, the display device shown in FIG. 1 is completed.

  In the display device thus obtained, a scanning signal is supplied to each pixel from the scanning line driving circuit 130 via the gate electrode of the writing transistor Tr2, and an image signal is supplied from the signal line driving circuit 120 to the writing transistor. It is held in the holding capacitor Cs via Tr2. That is, the driving transistor Tr1 is controlled to be turned on / off in accordance with the signal held in the holding capacitor Cs, whereby the driving current Id is injected into each of the organic light emitting elements 10R, 10G, and 10B, so that holes, electrons, Recombine to emit light. This light passes through the second electrode 16, the color filter, and the sealing substrate 30 and is extracted.

  As described above, in the present embodiment, the contamination prevention layer 45 includes the first portion 45A formed on the upper surface of the convex structure 44 and the second portion 45B formed on the upper surface of the heat insulating layer 43. Since the first portion 45A and the second portion 45B are divided, the thermal diffusion through the contamination prevention layer 45 can be greatly reduced, and the desired range of the transfer layer 50 can be accurately transferred. It becomes possible. Therefore, when an organic light emitting display device is manufactured using the donor substrate 40, the red light emitting layer 15CR, the green light emitting layer 15CG, or the blue light emitting layer 15CB can be formed with high accuracy without using a mask.

(Modification 1)
FIG. 11 shows the configuration of a donor substrate 40A according to the first modification of the present invention. The donor substrate 40A of this modification is provided with the photothermal conversion layer 42 for each region divided by the convex structure 44, thereby forming a transfer layer containing a light emitting material of a different color in each region. The number of times can be reduced. Except for this, it has the same configuration as the above embodiment.

  The donor substrate 40A of the present modification can be manufactured in the same manner as in the above embodiment except that the photothermal conversion layer 42 is provided for each region divided by the convex structure 44.

  Next, a method for manufacturing a display device using the donor substrate 40A of this modification will be described.

  First, in the same manner as in the above embodiment, the first electrode 13, the insulating layer 14, the hole injection layer, and the hole transport layer 15AB are formed on the driving substrate 11, and the transfer substrate 11A is formed.

Next, as shown in FIG. 12, a red transfer layer 50R, a green transfer layer 50G, and a blue transfer layer 50B containing light emitting materials of different colors for each region divided by the convex structure 44 are formed by, for example, an inkjet method.

  Subsequently, as shown in FIG. 12, the red light emitting layer 15CR, the green light emitting layer 15CG, and the blue light emitting layer 15CB are all formed on the transferred substrate 11A by one transfer by irradiating the laser beam LB. Can do. Therefore, the usage efficiency of the light emitting material can be improved, and the running cost can be reduced. Further, the number of times of transfer can be reduced, and the cost of the manufacturing apparatus can be reduced and the production capacity can be increased.

  As shown in FIG. 13, the entire back surface of the donor substrate 40A may be irradiated with the laser beam LB.

After forming the red light emitting layer 15CR, the green light emitting layer 15CG, and the blue light emitting layer 15CB, the donor substrate 40A and the transferred substrate 11A are separated. In the same manner as in the above embodiment, the electron transport layer and the electron injection layer 15DE and the second electrode 16 are formed on the transfer substrate 11A by, for example, vapor deposition. In this way, the organic light emitting elements 10R, 10G, and 10B are formed.

  After the organic light emitting elements 10R, 10G, and 10B are formed, the protective film 17 made of the above-described material is formed thereon as in the above embodiment. After that, the adhesive layer 20 is formed on the protective film 17, and the sealing substrate 30 on which the color filter is formed is bonded with the adhesive layer 20 in between. Thus, the display device shown in FIG. 1 is completed.

(Second Embodiment)
FIG. 14 shows the configuration of a donor substrate 40B according to the second embodiment of the present invention. The donor substrate 40B has the same configuration as that of the first embodiment except that the thermal interference layer 46 is provided between the base body 41 and the photothermal conversion layer 42. Accordingly, corresponding components are denoted by the same reference numerals, and description thereof is omitted.

  The base body 41, the photothermal conversion layer 42, the heat insulating layer 43, the convex structure 44, and the contamination prevention layer 45 are configured in the same manner as in the first embodiment.

The heat interference layer 46 is for increasing the absorption rate of the laser light LB by the light-to-heat conversion layer 42. For example, the heat interference layer 46 has a thickness of 15 nm to 80 nm and is made of a-Si.
The light-to-heat conversion layer 42 and the heat interference layer 46 are provided corresponding to a region (light emitting region 13A) on which the red light emitting layer 15CR, the green light emitting layer 15CG, or the blue light emitting layer 15CB is to be formed on the transferred substrate 11A.

  The donor substrate 40B is the same as the above except that the thermal interference layer 46 and the photothermal conversion layer 42 made of the above-described thickness and material are continuously formed on the base body 41 and then formed into a predetermined shape. It can be manufactured in the same manner as in the first embodiment.

  This donor substrate 40B can be used for manufacturing a display device in the same manner as in the first embodiment. At this time, since the thermal interference layer 46 is provided between the base body 41 and the photothermal conversion layer 42 in the donor substrate 40B, the laser beam LB generated by the photothermal conversion layer 42 in the transfer step shown in FIG. As a result, the absorption rate is increased, and the loss can be suppressed. Further, it becomes possible to use a low-power laser beam LB.

  As described above, in this embodiment, since the thermal interference layer 46 is provided between the base body 41 and the photothermal conversion layer 42, the absorption rate of the laser light LB by the photothermal conversion layer 42 is increased, loss is suppressed, and low The power laser beam LB can be used.

(Third embodiment)
FIG. 15 shows the configuration of a donor substrate 40C according to the third embodiment of the present invention. In the donor substrate 40C, the first and second embodiments are the same except that the thermal interference layer 46 has a laminated structure of two or more layers having different refractive indexes and the convex structure 44 is not provided. It has the same composition as. Accordingly, the corresponding components will be described with the same reference numerals.

  The base 41, the photothermal conversion layer 42, and the heat insulating layer 43 are configured in the same manner as in the first and second embodiments.

The thermal interference layer 46 has two or more layers having different refractive indexes as described above. Specifically, the thermal interference layer 46 is composed of, for example, SiO ₂ , SiN, SiON, or Al ₂ O ₃ sequentially from the base 41 side, and a first interference layer 46A having a thickness of 50 nm to 200 nm, and a-Si And a second interference layer 46B having a thickness of 15 nm to 80 nm. As a result, the donor substrate 40C can efficiently absorb radiation having a wide wavelength, such as a flash lamp such as xenon or krypton, and a beam-like halogen lamp.

The refractive index and thickness of two or more layers (for example, the first interference layer 46A and the second interference layer 46B) of the thermal interference layer 46 have a reflectance of 0 in a continuous wavelength region of 100 nm or more in the emission band of radiation. Adjusted to be 1 or less. FIG. 16 shows the absorption spectrum when the thermal interference layer 46 has a first interference layer 46A made of SiO ₂ with a thickness of 100 nm and a second interference layer 46B made of a-Si with a thickness of 15 nm. This is a comparison with the case where the layer 46A is not provided (a single-layer structure of the second interference layer 46B). The reflectance is obtained by a reflectance calculation method for a general optical multilayer thin film (see, for example, Principles of Optics, Max Born and Emil Wolf, 1974 (PERGAMON PRESS)). From FIG. 16, when the thermal interference layer 46 has a laminated structure of the first interference layer 46A and the second interference layer 46B, the absorptance is in a wider wavelength range than when the first interference layer 46A is not provided. You can see that it is getting higher.

FIG. 17 shows an absorption spectrum when the thickness of the second interference layer 46B is different from 15 nm and 35 nm. FIG. 18 shows an absorption spectrum when the thickness of the first interference layer 46A is different from 200 nm and 100 nm. 16 to 18, it can be seen that the absorption spectrum can be changed by changing the thickness of the first interference layer 46A and the second interference layer 46B.

In this way, the configuration of the thermal interference layer 46 can be optimized so as to achieve maximum absorption in accordance with the emission spectrum of the radiation used. For example, radiation rays such as a xenon lamp and a xenon flash lamp have a light emission band mainly in the vicinity of 400 nm to 1000 nm. Therefore, from FIG. 17, if the thermal interference layer 46 has a laminated structure of a first interference layer 46A made of SiO ₂ with a thickness of 100 nm and a second interference layer 46B made of a-Si with a thickness of 15 nm, It can be seen that the transmittance can be 0.1 or less in a continuous wavelength region of 100 nm or more in the emission band. In this case, if the thickness of the first interference layer 46A is not less than 50 nm and not more than 100 nm, and the thickness of the second interference layer 46B is not less than 15 nm and not more than 22 nm, the same effect as FIG. 17 can be obtained.

For example, infrared radiant heat from a halogen lamp or the like has a light emission peak mainly in the vicinity of 900 nm to 1600 nm depending on the color temperature. Therefore, from FIG. 18, if the thermal interference layer 46 has a laminated structure of the first interference layer 46A made of SiO _{2 having} a thickness of 200 nm and the second interference layer 46B made of a-Si having a thickness of 35 nm, It can be seen that the transmittance can be 0.1 or less in a continuous wavelength region of 100 nm or more in the emission band. In this case, if the thickness of the first interference layer 46A is 150 nm or more and 250 nm or less and the thickness of the second interference layer 46B is 35 nm or more and 80 nm or less, the same effect as FIG. 18 can be obtained.

Further, the donor substrate 40C has a laminated structure of the thermal interference layer 46, so that it is not necessary to provide the convex structure 44. The contamination prevention layer 45 is continuously formed on the surface of the heat insulating layer 43. Yes. Therefore, the configuration and manufacturing method of the donor substrate 40C can be further simplified.

  In the donor substrate 40C, the first interference layer 46A, the second interference layer 46B, and the photothermal conversion layer 42 made of the above-described thickness and material are continuously formed on the base body 41, and then formed into a predetermined shape. Except for this, it can be manufactured in the same manner as in the first embodiment.

  The donor substrate 40C can be used in a method for manufacturing a display device as follows, for example.

  First, similarly to the first embodiment, the first electrode 13, the insulating layer 14, the hole injection layer, and the hole transport layer 15AB are formed on the driving substrate 11 to form the transfer substrate 11A.

  Next, a plurality of donor substrates 40C are prepared, and one of red, green, and blue transfer layers 50 is formed on each donor substrate 40C by, for example, vacuum deposition.

  Subsequently, the red light emitting layer 15CR, the green light emitting layer 15CG, or the blue light emitting layer 15CB is formed by a transfer method using the donor substrate 40C. That is, as shown in FIG. 19, in order to form, for example, a red light emitting layer 15CR, the transfer layer 50 of the donor substrate 40C is disposed to face the transfer substrate 11A. At this time, as in the first embodiment, since the rib 14A (see FIG. 4) is provided on the insulating film 14 of the transfer substrate 11A, a space is formed between the donor substrate 40C and the insulating layer 14. G is formed, and the two do not come into contact with each other as shown in FIG. Therefore, it is possible to suppress the occurrence of a step in the organic layer 15 after film formation due to the contact between the two, and to prevent deterioration in image quality such as light emission streaks.

Subsequently, similarly as shown in FIG. 19, the red light emitting layer 15CR is formed by irradiating the radiation R from the back side of the donor substrate 40C , sublimating or vaporizing the transfer layer 50 and transferring it to the transfer substrate 11A. To do. At that time, as shown in FIG. 20, a xenon flash lamp may be used as the radiation R and the surface may be depicted. As shown in FIG. 21, a halogen lamp is condensed as the radiation R by the optical system. The line beam RB may be used, and the line beam RB may be moved in the direction of the arrow A5 to draw a line.

  Here, since the thermal interference layer 46 includes the first interference layer 46A and the second interference layer 46B having different refractive indexes, the reflectance of the thermal interference layer 46 is set according to the emission band of the radiation R. By adjusting, it becomes possible to increase the absorption rate when the radiation R irradiated to the donor substrate 40C is absorbed by the photothermal conversion layer 42 and converted into heat. Therefore, radiation R having a wide wavelength is efficiently absorbed, and loss is suppressed. Further, the power used for transfer is greatly reduced.

  At this time, since the radiation R is efficiently absorbed by the thermal interference layer 46, even if the contamination prevention layer 45 is not divided by the convex structure 44, the thermal diffusion in the contamination prevention layer 45 is reduced, High-precision transfer is possible.

  As described above, in the present embodiment, the thermal interference layer 46 has a laminated structure of the first interference layer 46A and the second interference layer 46B having different refractive indexes, so that the absorption rate of the radiation R having a wide wavelength is obtained. And the loss can be suppressed, and the power used for transfer can be greatly reduced.

  In the above-described embodiment, the case where the contamination prevention layer 45 is continuously formed on the surface of the heat insulating layer 43 without providing the convex structure 44 has been described, but as shown in FIG. A convex structure 44 may be formed on the heat insulating layer 43, and the first portion 45 </ b> A and the second portion 45 </ b> B of the contamination prevention layer 45 may be divided by the convex structure 44.

  Furthermore, specific examples of the present invention will be described.

Example 1
A display device was manufactured in the same manner as in the first embodiment. First, a driving electrode 11 made of glass, a first electrode 13 made of ITO, an insulating layer 14 made of polyimide having a thickness of 1 μm, a rib 14A made of polyimide having a height of 5 μm, and a hole injection layer and a hole transporting layer 15AB. Then, a transfer substrate 11A was formed. The hole injection layer and the hole transport layer 15AB were formed by an evaporation method, the hole injection layer was m-MTDATA having a thickness of 25 nm, and the hole transport layer was α-NPD having a thickness of 30 nm.

Next, a donor substrate 40 was manufactured (see FIG. 5). A light-to-heat conversion layer 42 made of chromium (Cr) was formed to a thickness of 200 nm on a base 41 made of glass by sputtering, and formed into a stripe shape having a width of 100 μm, for example, by photolithography. Next, a heat insulating layer 43 made of SiO ₂ was formed to a thickness of 300 nm by a CVD method. Subsequently, a convex structure 44 made of the above-described material was formed to a thickness of 3 μm, and formed into a stripe shape and a cross-sectional shape with an inverse taper shape by photolithography.

  After that, a contamination prevention layer 45 made of molybdenum (Mo) was formed with a thickness of 150 nm.

  A transfer layer 50 having a thickness of 25 nm was formed on the donor substrate 40 by vapor deposition (see FIG. 7A).

Subsequently, the donor substrate 40 was disposed on the transfer substrate 11A (see FIG. 7B). Between both the substrates, a space G of about 2 μm corresponding to the difference between the height of the rib 14A of 5 μm and the height of the convex structure 44 of 3 μm was maintained. In this state, a laser beam LB having a wavelength of 800 nm was irradiated from the back side of the donor substrate 40 to transfer the transfer layer 50 to the transfer substrate 11A (see FIG. 7B). The spot size of the laser beam LB was fixed to 100 μm × 20 μm, and the laser beam LB was scanned in a direction orthogonal to the longitudinal direction of the spot size (cutting width 100 μm).

The red light emitting layer 15C, the green light emitting layer 15G, and the blue light emitting layer 15B were formed by repeating the above, and then the electron transport layer and the electron injection layer 15DE and the second electrode 16 were formed by vapor deposition. The electron transport layer, Al q ₃ of thickness 20 nm, the electron injection layer was in a thickness 0.3 nm LiF (deposition rate 0.01 nm / sec). The second electrode 16 was MgAg having a thickness of 10 nm. After that, the protective film 17 and the adhesive layer 20 were formed, and the sealing substrate 30 was bonded to form a display device.

As Comparative Example 1, a donor substrate 840 provided with a reflective layer 846 made of aluminum (Al) between the photothermal conversion layer 842 and the heat insulating layer 843 as shown in FIG. Using this, a display device was produced in the same manner as in Example 1 above. At that time, the reflective layer 846 was made of aluminum (Al) and had a thickness of 100 nm.

  Regarding the display devices of Example 1 and Comparative Example 1 obtained, the light emission state was visually confirmed. As a result, in Example 1, no color mixture with adjacent pixels was observed, but in Comparative Example 1, color mixture with adjacent pixels was observed. Was recognized. For each of Example 1 and Comparative Example 1, the width of the transferred light emitting layer was examined. The results are shown in Table 1.

  As can be seen from Table 1, the long side (cutting width) of the spot size of the laser beam was irradiated to 100 μm, and the width of the transferred light emitting layer was 105 μm in Example 1, whereas Comparative Example 1 In Example 1, the transfer accuracy was significantly improved in Example 1 compared to Comparative Example 1.

The reason is considered as follows. In the donor substrate 840 of Comparative Example 1 shown in FIG. 23A, when the entire surface is irradiated with the laser beam LB, the region where the photothermal conversion layer 842 is not formed is indicated by the arrow A2 in FIG. Further, the laser beam LB is reflected by the reflective layer 846. On the other hand, in the region where the photothermal conversion layer 842 is formed, the laser beam LB is absorbed by the photothermal conversion layer 842, and only the desired range 852 of the transfer layer 850 is transferred to the transfer substrate. However, in the donor substrate 840 of Comparative Example 1, heat conduction occurred in the reflective layer 846 as indicated by the arrow A3. For this reason, the organic material of the transfer layer 850 is melted and the outline is sagged, and not only the desired range 852 of the transfer layer 850 but also the undesired range (the range that is not desired to be transferred) 851 is transferred, and transfer accuracy is increased. Decrease, color mixture to adjacent pixels, etc. occurred.

  That is, the contamination prevention layer 45 includes the first portion 45A formed on the upper surface of the convex structure 44 and the second portion 45B formed on the upper surface of the heat insulating layer 43, and the first portion 45A and the first portion 45A. It was found that if the two portions 45B are divided, thermal diffusion through the contamination prevention layer 45 can be greatly reduced, and the desired range of the transfer layer 50 can be transferred with high accuracy. .

(Examples 2 and 3)
A display device was manufactured in the same manner as in the third embodiment. At that time, in Example 2, a xenon flash lamp was used as the radiation R, and the transfer process was performed by surface drawing as shown in FIG. The configuration of the donor substrate 40C was as follows.
Substrate 41: Glass thermal interference layer 46: Laminated structure photothermal conversion layer 42: first interference layer 46A made of SiO ₂ with a thickness of 100 nm and second interference layer 46B made of a-Si with a thickness of 15 nm: Titanium (Ti) , Thickness 200nm
Thermal insulation layer 43: SiO ₂ , thickness 300 nm
Contamination prevention layer 45: Aluminum (Al), thickness 50 nm

In Example 3, a halogen lamp as the radiation-R use the condensed by the line beam R B in the optical system, performed transfer step by the line depiction shown in Figure 21. The configuration of the donor substrate 40C was as follows.
Substrate 41: Glass thermal interference layer 46: Laminated structure photothermal conversion layer 42: first interference layer 46A made of SiO _{2 having} a thickness of 200 nm and second interference layer 46B made of a-Si having a thickness of 35 nm: titanium (Ti) , Thickness 200nm
Thermal insulation layer 43: SiO ₂ , thickness 300 nm
Contamination prevention layer 45: Aluminum (Al), thickness 50 nm

  As Comparative Examples 2 and 3, display devices were produced in the same manner as in Examples 2 and 3, except that the first interference layer was not provided on the donor substrate (single-layer structure having only the second interference layer).

  The irradiation power of the radiation R used in Examples 2 and 3 and Comparative Examples 2 and 3 was examined. The results are shown in Table 2 and Table 3.

  As can be seen from Tables 2 and 3, in Examples 2 and 3 in which the thermal interference layer 46 has a laminated structure of the first interference layer 46A and the second interference layer 46B having different refractive indexes, the first interference layer is not provided. Compared with Comparative Examples 2 and 3, the irradiation power was significantly reduced. That is, it has been found that if the thermal interference layer 46 has a laminated structure of the first interference layer 46A and the second interference layer 46B having different refractive indexes, the power required for transfer can be greatly reduced.

(Modules and application examples)
Hereinafter, application examples of the display device described in each of the above-described embodiments will be described. The display device in each of the above embodiments is a television device, a digital camera, a notebook personal computer, a mobile terminal device such as a mobile phone, or a video camera, such as an externally input video signal or an internally generated video signal. The present invention can be applied to display devices for electronic devices in various fields that display images or videos.

(module)
The display device of each of the above embodiments is incorporated into various electronic devices such as application examples 1 to 5 described later, for example, as a module shown in FIG. In this module, for example, a region 210 exposed from the sealing substrate 30 and the adhesive layer 20 is provided on one side of the transfer substrate 11, and the signal line driving circuit 120 and the scanning line driving circuit 130 are provided in the exposed region 210. The wiring is extended to form an external connection terminal (not shown). The external connection terminal may be provided with a flexible printed circuit (FPC) 220 for signal input / output.

(Application example 1)
FIG. 25 illustrates an appearance of a television device to which the display device of each of the above embodiments is applied. The television apparatus has, for example, a video display screen unit 300 including a front panel 310 and a filter glass 320, and the video display screen unit 300 is configured by the display device according to each of the above embodiments. .

(Application example 2)
FIG. 26 shows the appearance of a digital camera to which the display device of each of the above embodiments is applied. The digital camera includes, for example, a flash light emitting unit 410, a display unit 420, a menu switch 430, and a shutter button 440. The display unit 420 is configured by the display device according to each of the above embodiments. Yes.

(Application example 3)
FIG. 27 shows the appearance of a notebook personal computer to which the display device of each of the above embodiments is applied. For example, the notebook personal computer includes a main body 51.
A keyboard 520 for input operation of 0, characters, and the like, and a display unit 530 for displaying an image are included, and the display unit 530 is configured by the display device according to each of the above embodiments.

(Application example 4)
FIG. 28 shows the appearance of a video camera to which the display device of each of the above embodiments is applied. This video camera has, for example, a main body 610, a subject photographing lens 620 provided on the front side surface of the main body 610, a start / stop switch 630 at the time of photographing, and a display 640. Reference numeral 640 denotes the display device according to each of the above embodiments.

(Application example 5)
FIG. 29 shows an appearance of a mobile phone to which the display device of each of the above embodiments is applied. For example, the mobile phone is obtained by connecting an upper housing 710 and a lower housing 720 with a connecting portion (hinge portion) 730, and includes a display 740, a sub-display 750, a picture light 760, and a camera 770. Yes. The display 740 or the sub-display 750 is configured by the display device according to each of the above embodiments.

  The present invention has been described with reference to the embodiments and examples. However, the present invention is not limited to the above embodiments and examples, and various modifications can be made. For example, in the above-described embodiments and examples, the case of irradiating laser light or radiation such as a flash lamp in the transfer process has been described. However, for example, radiation is emitted using another light source such as a heat bar or a thermal head. You may do it.

  In the above embodiment, the case where all the R, G, and B light emitting layers 15C are formed by the transfer method has been described. However, as shown in FIG. 30, only the red light emitting layer 15CR and the green light emitting layer 15CG are transferred. After forming by the method, the blue light emitting layer 15CB may be formed over the entire surface by the vapor deposition method. At this time, in the organic light emitting element 10R, the red light emitting layer 15CR and the blue light emitting layer 15CB are formed, but energy transfer occurs in red having the lowest energy level, and red light emission becomes dominant. In the organic light emitting device 10G, the green light emitting layer 15CG and the blue light emitting layer 15CB are formed, but energy transfer occurs in green having a lower energy level, and green light emission becomes dominant. Since the organic light emitting element 10B has only the blue light emitting layer 15CB, blue light emission occurs.

  Further, for example, the materials and thicknesses of the respective layers described in the above embodiments and examples, or the film forming method, film forming conditions, and laser light irradiation conditions are not limited, and other materials and thicknesses may be used. Alternatively, other film forming methods, film forming conditions, and irradiation conditions may be used. For example, the first electrode 13 may have a dielectric multilayer film.

  In addition, for example, in the above embodiment, the first electrode 13, the organic layer 15, and the second electrode 16 are sequentially stacked on the driving substrate 11 from the driving substrate 11 side, and the sealing substrate 30. In the above description, the light is extracted from the side of the substrate 11. However, the second electrode 16, the organic layer 15, and the first electrode 13 are disposed on the side of the driving substrate 11 on the driving substrate 11 by reversing the stacking order. Alternatively, the light can be extracted from the side of the driving substrate 11.

Furthermore, for example, in the above embodiment, the case where the first electrode 13 is the anode and the second electrode 16 is the cathode has been described. However, the anode and the cathode are reversed, and the first electrode 13 is the cathode and the second electrode. 16 may be an anode. Further, the first electrode 13 is a cathode, the second electrode 16 is an anode, and the second electrode 16, the organic layer 15, and the first electrode 13 are stacked on the driving substrate 11 in order from the transfer substrate 11 side. In addition, light can be extracted from the driving substrate 11 side.

In addition, in the above-described embodiment, the configuration of the organic light emitting elements 10R, 10G, and 10B has been specifically described. However, it is not necessary to include all layers, and other layers may be further included. Good. For example, between the first electrode 13 and the organic layer 15, chromium oxide (III) (Cr ₂ O ₃ ), ITO (Indium-Tin Oxide: mixed oxide film of indium (In) and tin (Sn)), etc. A hole injecting thin film layer may be provided.

  Furthermore, in the above-described embodiment, the case where the second electrode 16 is configured by a semi-transmissive electrode and the light generated in the light emitting layer 15C is extracted from the second electrode 16 side has been described. You may make it take out from the electrode 13 side. In this case, it is desirable to increase the luminous efficiency so that the second electrode 16 has as high a reflectance as possible.

  In addition, in each of the above embodiments, the case of an active matrix display device has been described. However, the present invention can also be applied to a passive matrix display device. Furthermore, the configuration of the pixel driving circuit for active matrix driving is not limited to that described in each of the above embodiments, and a capacitor or a transistor may be added as necessary. In that case, a necessary driving circuit may be added in addition to the signal line driving circuit 120 and the scanning line driving circuit 130 described above in accordance with the change of the pixel driving circuit.

  DESCRIPTION OF SYMBOLS 10 ... Pixel, 10R, 10G, 10B ... Organic light emitting element, 11 ... Driving substrate, 11A ... Transfer substrate, 13 ... First electrode, 14 ... Insulating layer, 15 ... Organic layer, 15AB ... Hole injection layer and positive Hole transport layer, 15C ... light emitting layer, 15DE ... electron transport layer and electron injection layer, 16 ... second electrode, 17 ... protective film, 20 ... adhesive layer, 30 ... substrate for sealing, 40 ... donor substrate, 41 ... substrate 42 ... Photothermal conversion layer, 43 ... Heat insulation layer, 44 ... Convex structure, 45 ... Contamination prevention layer, 46 ... Thermal interference layer, 46A ... First interference layer, 46B ... Second interference layer, 50 ... Transfer layer, 50R ... Red transfer layer, 50G ... green transfer layer, 50B ... blue transfer layer

Claims (11)

A transfer layer containing a light emitting material is formed, the transfer layer is disposed opposite to the transfer substrate, irradiated with radiation, and the transfer layer is sublimated or vaporized to transfer to the transfer substrate to form a light emitting layer. A donor substrate for
A substrate;
A photothermal conversion layer provided on the substrate in correspondence with a region where the light emitting layer on the substrate to be transferred is to be formed;
A heat insulating layer formed on the light-to-heat conversion layer and on the substrate;
On the heat insulation layer, a convex structure provided in a region between the photothermal conversion layers,
A first part formed on the upper surface of the convex structure and a second part formed on the upper surface of the heat insulating layer, the first part and the second part being separated from each other. A donor substrate comprising a contamination prevention layer. The donor substrate according to claim 1, wherein the convex structure has a reverse tapered cross-sectional shape in which a lower surface width is narrower than an upper surface width. The donor substrate according to claim 2, wherein the convex structure has a height of 0.3 μm to 10 μm. The donor substrate according to claim 3, wherein the contamination prevention layer has a thickness of 25 nm to 500 nm. The donor substrate according to claim 4, further comprising a thermal interference layer between the base and the photothermal conversion layer. Display for forming a first electrode, an insulating layer having an opening corresponding to a light emitting region of the first electrode, a plurality of organic layers including a light emitting layer, and an organic light emitting element having a second electrode in order on a driving substrate A device manufacturing method comprising:
Forming a part of the first electrode, the insulating layer, and the plurality of organic layers on the driving substrate to form a transferred substrate;
A transfer layer containing a light emitting material is formed on a donor substrate, the transfer layer is disposed opposite to the transfer target substrate, irradiated with radiation, and the transfer layer is sublimated or vaporized to be transferred to the transfer substrate to emit light. Forming a layer;
Forming the remainder of the plurality of organic layers and the second electrode,
As the donor substrate,
A substrate;
A photothermal conversion layer provided on the substrate in correspondence with a region where the light emitting layer on the substrate to be transferred is to be formed;
A heat insulating layer formed on the light-to-heat conversion layer and on the substrate;
On the heat insulation layer, a convex structure provided in a region between the photothermal conversion layers,
A first part formed on the upper surface of the convex structure and a second part formed on the upper surface of the heat insulating layer, the first part and the second part being separated from each other. A manufacturing method of a display device using a device provided with a contamination prevention layer. The method for manufacturing a display device according to claim 6, wherein the convex structure has a reverse-tapered cross-sectional shape in which the width of the lower surface is narrower than the width of the upper surface. The method for manufacturing a display device according to claim 7, wherein the convex structure has a height of 0.3 μm or more and 10 μm or less. The method for manufacturing a display device according to claim 8, wherein the contamination prevention layer has a thickness of 25 nm to 500 nm. The method for manufacturing a display device according to claim 9, further comprising a thermal interference layer between the base and the photothermal conversion layer. 7. A transfer layer containing a light emitting material of a different color is formed for each region divided by the convex structure on the substrate, and the light emitting layers of two or more colors are formed on the substrate to be transferred by one transfer. The manufacturing method of the display apparatus of any one of thru | or 10.

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