JP2010171354A - Multiple wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a multiple wiring board having good work efficiency in dividing a mother board at boundaries of wiring board regions, and excelling in productivity of individual wiring boards. <P>SOLUTION: The multiple wiring board 9 is formed by arranging a plurality of wiring board regions 2 in vertical and horizontal arrangements on a mother board 1 formed of a sintered ceramic body and is divided at the boundaries 2b of the wiring board regions 2 by dicing work. In the multiple wiring board 9, a plurality of through-holes 5 penetrating the mother board 1 in the thickness direction are formed, at the boundaries 2b of the wiring board regions 2 of the mother board 1, in parallel to one another and obliquely with respect to directions in which the boundaries 2b of the wiring board regions 2 extend; and the outer edge of the upper opening of one-side of the through-holes 5 adjacent to each other and that of the lower opening of the other-side of the through-holes 5 overlap with each other. Since the thickness of the mother board 1 actually cut by the dicing work is reduced, the cutting speed can be increased while suppressing the occurrence of a chip or the like, and the multiple wiring board 9 excelling in productivity of individual wiring boards can be provided. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  In the present invention, a plurality of wiring board regions, which are wiring boards for mounting electronic components such as semiconductor elements and surface acoustic wave elements, are arranged vertically and horizontally on a mother board, and dicing is performed at the boundaries of the wiring board areas. The present invention relates to a multi-piece wiring board cut by the above.

  2. Description of the Related Art Conventionally, wiring boards used for mounting electronic components such as semiconductor elements and surface acoustic wave elements are rectangular plate-shaped insulating substrates made of ceramic sintered bodies such as aluminum oxide sintered bodies and glass ceramic sintered bodies. A mounting portion for mounting an electronic component on the upper surface of the substrate, and a structure in which a plurality of wiring conductors made of a metal material such as tungsten are formed from the mounting portion or its periphery to the side surface or the lower surface of the insulating base. Yes.

  Such a wiring board is generally manufactured in the form of a so-called multi-cavity wiring board in which a plurality of wiring boards are obtained simultaneously from a single large-area mother board.

  The multi-cavity wiring board has, for example, a structure in which a plurality of wiring board regions serving as wiring boards are arranged in rows and columns on a flat mother board.

  Such a multi-piece wiring board is divided into individual wiring boards by performing a cutting process such as dicing on the mother board at the boundary of the wiring board region. The dicing process is performed by rotating a disk-shaped dicing blade formed by combining granular abrasives (abrasive grains) made of diamond, aluminum oxide, or the like with a binder such as a resin, and cutting the mother substrate. .

JP-A-2005-129912 JP-A-2005-276855 JP 2005-311231 A

  However, the multi-cavity wiring board of the above prior art is made of a glass ceramic sintered body, an aluminum oxide sintered body, or the like when the mother board is divided using a dicing blade, for example, about 1 to 3 mm in thickness. Since it is necessary to cut a relatively thick mother substrate, it is difficult to increase the cutting speed. In addition, if the dicing blade rotation speed and the mother board feed speed are forcibly increased in order to increase the cutting speed, there is a problem in that a load is applied to the mother board and chips and cracks are likely to occur. It was. When such chipping or cracking occurs, it becomes easy to cause problems such as disconnection of wiring conductors or defective dimensions due to chipping or cracking in the piece of wiring board. Therefore, there is a problem that it is difficult to improve workability when dividing the mother board, and it is difficult to increase the productivity of the individual wiring boards.

  In particular, in recent years, the number of wiring conductors that are electrically connected to electronic components tends to increase in accordance with the high functionality and high integration of mounted electronic components, so as to secure a space for forming a large number of wiring conductors. Further, the thickness of the mother substrate (individual insulating base) may be as thick as about 3 mm or more, for example. Further, as a material for forming the mother substrate, a glass ceramic sintered body that has a lower mechanical strength than the aluminum oxide sintered body and easily causes chipping or the like is increasingly used. For this reason, it has become more difficult to prevent defects such as chipping as described above and to improve workability during division.

  The present invention has been completed in view of such conventional problems, and its purpose is that the workability when dividing the mother board by dicing at the boundary of the wiring board region is good, An object of the present invention is to provide a multi-piece wiring board having excellent productivity of the wiring board.

  In the multi-piece wiring board of the present invention, a plurality of wiring board regions are arranged in a matrix on a mother substrate made of a ceramic sintered body, and the multi-piece wiring board is cut by dicing at the boundary of the wiring board region. A plurality of through-holes penetrating the mother board in the thickness direction at the boundary of the wiring board area of the mother board are parallel to each other and inclined with respect to a direction in which the boundary of the wiring board area extends The outer edge of the upper opening of one of the adjacent through holes and the outer edge of the lower opening of the other through hole overlap each other in plan view.

  In the multi-piece wiring board of the present invention, in the above configuration, a dummy area surrounding the plurality of wiring board areas is provided on an outer peripheral portion of the mother board, and a boundary of the wiring board area is provided in the dummy area. The mother board, wherein the straight line is located on the opposite side of the through-hole with respect to a straight line that passes through the outer edge of the through-hole formed on the wiring board region side and extends in parallel with the boundary of the wiring board region. A plurality of through holes in the dummy area penetrating the substrate in the thickness direction are formed in parallel to each other and inclined with respect to the direction in which the boundary of the wiring board area extends, and one of the adjacent through holes in the dummy area The outer edge of the upper opening and the outer edge of the lower opening of the other through hole in the dummy region overlap each other in plan view.

  In the multi-piece wiring board of the present invention, in the above configuration, a resin material in which hard particles made of at least one of silicon oxide, ceramic material, and diamond are dispersed is applied to at least the inner surface of the through hole. It is characterized by being.

  Further, the multi-cavity wiring board of the present invention, in the configuration having the dummy region through hole, has at least one of silicon oxide, ceramic material, and diamond on at least an inner surface of the through hole and the dummy region through hole. The resin material in which the hard particle | grains which consist of is disperse | distributed is characterized by the above-mentioned.

  According to the multi-cavity wiring board of the present invention, a plurality of through holes penetrating the mother board in the thickness direction are parallel to each other at the boundary of the wiring board area of the mother board made of a ceramic sintered body. Since the boundary is formed to be inclined with respect to the extending direction, the outer edge of the upper opening of one adjacent through hole and the outer edge of the lower opening of the other through hole overlap in plan view, The thickness of the mother board can be reduced by the amount of the through hole at the boundary of the wiring board area to be diced. That is, since the plurality of through holes are parallel to each other and are inclined with respect to the direction in which the boundary of the wiring board region extends, the thickness of the mother board to be cut is reduced to approximately the same level by each through hole. can do. In addition, since the outer edge of the upper opening of one adjacent through hole and the outer edge of the lower opening of the other through hole overlap in plan view, such a thin portion is defined as the boundary of the wiring board region. Can be formed without interruption.

  Therefore, since the thickness that is actually cut by the dicing process of the mother substrate is reduced, the dicing process can be made easier and the cutting speed can be increased. Therefore, according to the multi-piece wiring board of the present invention, the workability when dividing the mother board by the dicing process at the boundary of the wiring board region is good, and the multi-piece wiring board excellent in productivity of the individual wiring board is obtained. A wiring board can be provided.

  In the multi-piece wiring board of the present invention, in the above configuration, a dummy area surrounding a plurality of wiring board areas is provided on the outer peripheral portion of the mother board, and a through-hole formed at the boundary of the wiring board area is formed in the dummy area. A plurality of dummy areas penetrating through the mother board in the thickness direction on the opposite side of the space with respect to a straight line passing through the outer edge of the hole on the wiring board area side and extending in parallel with the boundary of the wiring board area. The inner through holes are formed in parallel to each other and inclined with respect to the direction in which the boundary of the wiring board region extends, and the outer edge of the upper opening of one adjacent dummy region inner hole and the other dummy region through hole When the outer edge of the opening on the lower side of the hole overlaps in a plan view, the effect of facilitating the cutting of the mother board can be obtained in the dummy area by the through-hole in the dummy area as in the case of the above-described through-hole Can do. Moreover, it can be set as the multi-piece wiring board which can suppress variation in the abrasion of the dicing blade used for dicing.

  That is, the width of the through hole formed at the boundary of the wiring board region is cut by the dicing blade of the mother board (the width of the dicing blade) in order to prevent the trace of the through hole from remaining on the side surface of the individual wiring board. It may be set narrower. In this case, in the portion where the through-hole is formed (the central portion in the width direction of the dicing blade), the thickness of the mother substrate that is actually cut is thin, so the dicing blade is worn and the outer through-hole is formed. There is a tendency to become smaller than a portion that is not (the outer peripheral portion in the width direction of the dicing blade).

  On the other hand, if the through hole in the dummy region is formed as described above, in the dummy region, the wear can be reduced at the outer peripheral portion in the width direction of the dicing blade by the amount of the through hole in the dummy region. For this reason, the variation in the wear of the dicing blade can be canceled by canceling out the variation in the wear of the dicing blade at the boundary of the wiring board region by the amount of the through hole in the dummy region. Note that the straight line that passes through the outer edge of the through-hole formed in the boundary of the wiring board region and extends in parallel with the boundary of the wiring board region is a center portion that may cause a difference in wear of the dicing blade. It corresponds to the boundary with the outer peripheral part.

  In the multi-piece wiring board of the present invention, in the above configuration, a resin material in which hard particles made of at least one of silicon oxide, ceramic material, and diamond are dispersed is attached to at least the inner surface of the through hole. In this case, when the dicing blade cuts the resin material, the worn abrasive grains may be dropped by contact between the abrasive grains exposed on the surface of the dicing blade and the hard particles dispersed in the resin material. it can. Therefore, it is promoted that the abrasive grains inside the binder are newly exposed on the surface of the dicing blade, and the function (cutting force) for cutting the mother substrate of the dicing blade can be maintained with high reliability. Therefore, in this case, it is possible to provide a multi-piece wiring board capable of further improving the workability of dividing the mother board by dicing.

  Further, the multi-piece wiring board of the present invention comprises at least one of silicon oxide, ceramic material, and diamond on the inner surface of the through hole and the through hole in the dummy region in the configuration provided with the through hole in the dummy region. When a resin material in which hard particles are dispersed is applied, the effect of increasing the workability of dicing processing is obtained by the resin material and hard particles applied to the inner surface of the through hole in the same manner as described above. be able to. In addition to this, when the dicing blade cuts the resin material applied to the inner surface of the through hole in the dummy area, the abrasive grains worn by the dicing blade are also applied to the outer peripheral portion in the width direction of the dicing blade in the same manner as described above. Can be removed and the exposure of new abrasive grains can be promoted.

  Therefore, in this case, the wear of the dicing blade and the variation in cutting force can be more effectively suppressed in the entire area of the dicing blade in the width direction, so that the workability of dividing the mother substrate by dicing is further improved. Can be made.

(A) is a top view of the multi-piece wiring board of this invention, (b) and (c) are sectional drawings in the BB line and CC line of (a), respectively. It is a principal part enlarged plan view which shows the principal part of the multi-piece wiring board shown in FIG. It is a principal part enlarged plan view which shows the other example of embodiment of the multi-piece wiring board of this invention. (A) is a principal part expanded sectional view which shows the other example of embodiment of the multi-cavity wiring board of this invention, (b) is a principal part expanded sectional view which expands and shows a part of (a). It is. (A) And (b) is a principal part expanded sectional view which shows the other example of embodiment of the multi-piece wiring board of this invention, respectively. It is a principal part enlarged plan view which shows the other example of embodiment of the multi-piece wiring board of this invention. It is a principal part enlarged plan view which shows the other example of embodiment of the multi-piece wiring board of this invention.

  A multi-piece wiring board of the present invention will be described with reference to the accompanying drawings.

  FIG. 1A is a plan view showing an example of an embodiment of a multi-cavity wiring board according to the present invention, and FIGS. 1B and 1C are respectively BB lines in FIG. It is sectional drawing in CC line. In FIG. 1, 1 is a mother board and 2 is a wiring board area. A plurality of wiring board regions 9 are basically formed by arranging a plurality of wiring board regions 2 vertically and horizontally on the mother board 1.

  The mother substrate 1 is a ceramic sintered body such as a glass ceramic sintered body, an aluminum oxide sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, a silicon nitride sintered body, and a mullite sintered body. It is formed with the insulating material which consists of.

  The plurality of wiring board regions 2 arranged on the mother board 1 are areas that each become an individual wiring board (not shown). By cutting the mother board 1 at the boundary 2b of the wiring board region 2, a plurality of wiring boards are manufactured simultaneously and collectively.

  When an individual wiring board is used as an electronic component mounting board, an electronic component mounting portion is provided at the center or lower surface of the upper surface of the wiring board region 2. In the example of this embodiment, an example is shown in which a recess 2a is provided at the center of the upper surface of the wiring board region 2, and the bottom surface of the recess 2a is an electronic component mounting portion (no symbol).

  Note that the mother board 1 does not need to have such a recess 2a in the wiring board region 2, but is a flat plate (not shown) and has a flat upper surface or lower surface of the wiring board region 2. A part of the mounting part may be used.

  Electronic components (not shown) mounted on the mounting unit include semiconductor integrated circuit elements such as IC and LSI, and optical semiconductor elements such as LED (light emitting diode), PD (photodiode), and CCD (charge coupled device). Various electronic devices such as semiconductor devices including surface acoustic wave devices, piezoelectric devices such as surface acoustic wave devices and crystal resonators, capacitive devices, resistors, and micromachines (so-called MEMS devices) in which a minute electromechanical mechanism is formed on the surface of a semiconductor substrate. Parts.

  The electronic component has a resin adhesive such as an epoxy resin, a polyimide resin, an acrylic resin, a silicone resin, a polyether amide resin, Au-Sn, Sn-Ag-Cu, or Sn-Cu on the mounting portion. , Sn-Pb or the like, glass or the like.

  In this example, the wiring conductor 3 is formed on the mother board 1 from the outer peripheral portion of the mounting portion to the lower surface of the wiring board region 2. The wiring conductor 3 is electrically connected to an electronic component mounted on the mounting portion, and functions as a conductive path that electrically connects the electronic component to an external electric circuit.

  The wiring conductor 3 is made of a metal material such as copper, silver, palladium, platinum, gold, tungsten, molybdenum, or manganese.

  The electrical connection between the electronic component and the wiring conductor 3 is performed, for example, by connecting an electrode (not shown) of the electronic component to a portion of the wiring conductor 3 exposed in the periphery of the mounting portion and conducting the bonding wire, solder or the like. This can be done by connecting via a sexual connecting material (not shown).

  Such a mother board 1 in which a plurality of wiring board regions 2 each having a wiring conductor 3 are arranged vertically and horizontally, for example, is made of a glass ceramic sintered body as follows. Can do.

  First, a raw material powder mainly composed of a glass component such as silicon oxide or boron oxide and a ceramic component such as aluminum oxide is kneaded with an organic solvent and a binder, and formed into a sheet by a molding method such as a doctor blade method or a lip coater method. Molding to produce a ceramic green sheet. Next, a metal paste such as copper or silver is kneaded with an organic solvent and a binder to produce a metal paste. Next, the ceramic green sheet is cut into the shape and dimensions of the mother board 1, and a metal paste is printed on the pattern of the predetermined wiring conductor 3 by a printing method such as a screen printing method in each of the regions to be the wiring board regions 2. To do. Then, after laminating a plurality of ceramic green sheets, firing is performed at a firing temperature of about 900 to 1000 ° C., whereby a plurality of wiring board regions 2 each having wiring conductors 3 are arranged vertically and horizontally. Can be produced.

  The mother board 1 can also be manufactured by molding an unfired ceramic material into a predetermined plate shape using a mold or the like and firing it.

  In the example of this embodiment, a dummy region 4 is provided on the outer periphery of the mother substrate 1 so as to surround the plurality of wiring substrate regions 2 arranged. The dummy area 4 is provided to facilitate handling of the multi-piece wiring board 9. The dummy region 4 is a conductive path (not shown) through which a plating current flows when an electrolytic plating for depositing a plating layer (not shown) such as nickel or gold on the exposed surface of the wiring conductor 3 is performed. It can also function as a space for forming the

  The multi-piece wiring substrate 9 is subjected to dicing processing at the boundary 2b of the wiring substrate region 2 (in this example, the boundary between the wiring substrate regions 2 and the boundary between the wiring substrate region 2 and the dummy region 4). By cutting every region 2, it is divided into individual wiring boards.

  The cutting of the mother board 1 by dicing is performed by rotating a dicing blade in which abrasive grains such as diamond are bonded with a binder such as glass or resin material at a high speed (about 5000 to 15000 rpm). 2 is performed by cutting the mother substrate 1 at the boundary 2b. The positioning of the dicing blade with respect to the mother board 1 is performed by, for example, forming a positioning mark (not shown) on the mother board 1 in advance and recognizing the position by an image recognition device. This positioning mark can be formed on the mother board 1 by the same method using the same material as the wiring conductor 3, for example. In addition, the positioning mark is a pattern formed by adding a colorant such as a pigment to the same material as that for forming the mother substrate 1 or a cutout part of the outer edge of the mother substrate 1. You may form by a notch part.

  In addition, as shown in FIG. 1C and FIG. 2, for example, the multi-piece wiring board 9 includes a plurality of wiring boards 9 penetrating the mother board 1 in the thickness direction at the boundary 2b of the wiring board region 2 of the mother board 1. The through holes 5 are formed in parallel with each other and inclined with respect to the direction in which the boundary 2b of the wiring board region 2 extends. The outer edge of the upper opening of one adjacent through hole 5 and the outer edge of the lower opening of the other through hole 5 overlap. FIG. 2 is an enlarged plan view of the main part showing the main part of the multi-piece wiring board 9 shown in FIG. In FIG. 2, the same parts as those in FIG.

  Since the multi-piece wiring board 9 has the above-described configuration, the thickness of the mother board 1 can be reduced by the amount of the through hole 5 at the boundary 2b of the wiring board region 2 to be diced. In other words, since the plurality of through holes 5 are parallel to each other and are inclined with respect to the direction in which the boundary 2b of the wiring board region 2 extends, the thickness of the mother substrate 1 to be cut is set in each through hole 5. It can be made as thin as about the same. In addition, the outer edge (not indicated) of the upper opening of one adjacent through hole 5 and the outer edge (not indicated) of the lower opening of the other through hole 5 are overlapped with each other in plan view. Can be provided without interruption along the boundary 2 b of the wiring board region 2.

  For this reason, since the thickness of the mother substrate 1 that is actually cut by the dicing process is reduced, the dicing process can be made easier and the cutting speed can be increased. Therefore, according to the multi-piece wiring board 9 of the present invention, the workability when dividing the mother board 1 by dicing at the boundary 2b of the wiring board region 2 is good, and the productivity of the individual wiring board is improved. An excellent multi-piece wiring board 9 can be provided.

  If the through hole 5 is not inclined (orthogonal) with respect to the direction in which the boundary 2b of the wiring board region 2 extends, a portion where the through hole 5 is formed in the boundary 2b of the wiring board region 2 is formed. Since non-exposed portions are alternately present, workability (ease of cutting) at the time of dicing varies, and the effect of facilitating cutting of the mother substrate 1 may be reduced. Therefore, the through holes 5 are formed in parallel with each other and inclined with respect to the boundary 2 b of the wiring board region 2, and the outer edge of the upper opening (not indicated) of the adjacent one of the through holes 5 and the other through hole 5. It is formed so that the outer edge of the lower opening (not shown) is in contact with each other, that is, a portion where the thickness is reduced to the same extent follows the boundary 2 b of the wiring board region 2.

  Such a through-hole 5 can be formed, for example, by subjecting the boundary 2b of the wiring board region 2 of the ceramic green sheet to be the mother board 1 to a drilling process such as a drilling process using a laser beam. In order to form the through-hole 5 by inclining it in the ceramic green sheet to be the mother substrate 1, for example, the laser beam may be irradiated with being inclined with respect to the main surface of the ceramic green sheet by bending with a mirror. .

  It should be noted that the action of reducing the thickness of the mother board 1 in each through hole 5 is an angle with respect to the boundary 2b (the boundary of the mother board 1) as long as the cross-sectional area in the direction orthogonal to the length direction of the through hole 5 is the same. In the longitudinal section along 2b, the angle between the inner surface of the through hole 5 and the main surface of the mother board 1 at the boundary 2b becomes closer to a right angle. However, the closer this angle is to a right angle, the more through-holes 5 need to be formed in the boundary 2b of the wiring board region 2, so the productivity of the multi-piece wiring board 9 may be reduced. Further, since the mechanical strength of the mother board 1 at the boundary 2b of the wiring board region 2 is lowered, there is a possibility that defects such as cracks are likely to occur near the boundary 2b. Moreover, when the angle with respect to the boundary 2b of the through-hole 5 becomes too small, the length of each through-hole 5 becomes long, and the drilling operation tends to be difficult. Therefore, the angle of the through hole 5 with respect to the upper and lower surfaces of the boundary 2b is suitably in the range of about 45 to 65 degrees.

  Further, in order to make the thickness of the mother board 1 at the boundary 2b of the wiring board region 2 as thin as the length along the boundary 2b, the through-hole 5 having a rectangular shape at the top and bottom is suitable. If the upper and lower openings of the through hole 5 are square, the outer edge of the upper opening of one adjacent through hole 5 and the outer edge of the lower opening of the other through hole 5 are overlapped in plan view. For example, it is easier to prevent a gap from being formed between the two, as compared to a case in which both openings are circular.

  The overlapping range in plan view of the outer edge of the upper opening of one adjacent through hole 5 and the outer edge of the lower opening of the other through hole 5 is, for example, in the operation of forming such a through hole 5. As long as the processing accuracy is within a range (several tens of μm), it may vary.

  In order to make the upper and lower openings of the through hole 5 have a square shape, for example, a rectangular hole (a cross section in a direction orthogonal to the thickness direction of the mother substrate 1) of the through hole 5 is a square shape ( The ceramic green sheet may be drilled by irradiating the ceramic green sheet with a laser beam having a rectangular irradiation range through a mask material provided with a portion through which the laser passes.

  Further, the size of each opening and the cross section of the through-hole 5 may be appropriately set according to the material constituting the mother board 1, the thickness of the mother board 1, and the like. For example, if the mother substrate 1 is made of a glass ceramic sintered body mainly composed of a borosilicate glass component and a ceramic component such as aluminum oxide, and the thickness is about 1 to 3 mm, the through hole 5 is The length of one side of the cross section may be a square shape of about 0.1 to 0.3 mm. In this case, if the angle of inclination of the through hole 5 with respect to the boundary 2b of the wiring board region 2 is set to about 60 degrees, the length of the through hole 5 when viewed in plan is about (1) of the thickness of the mother board 1. / √3) Since it is a multiple, it is about 0.6 to 1.7 mm. For example, in the mother board 1 having a length of the mother board 1 of about 30 to 50 mm, about 17 to 83 through holes 5 are arranged on each of the boundaries 2b of the wiring board region 2. .

  The opening of the through-hole 5 is not limited to a quadrangular shape (rectangular shape). For example, as shown in FIG. The plurality of through holes 5 may have different shapes. FIG. 3 is an enlarged plan view of a main part showing another example of the embodiment of the multi-piece wiring board 9 of the present invention. In FIG. 3, the same parts as those in FIGS. 1 and 2 are denoted by the same reference numerals.

  The through-hole 5 having a circular or elliptical opening can be easily formed, for example, by processing using laser light, as compared with the case of a quadrangular shape because it is not necessary to adjust the irradiation range using a mask material. Further, the through-hole 5 having a quadrangular opening and unevenness on the side portion is formed, for example, by using a circular laser beam narrowed down to a range smaller than the through-hole 5 to be formed at a plurality of times. It was formed by repeating the drilling process separately. Depending on the outer shape of the circular laser beam, a part of the side portion of the opening is convex in an arc shape. Also in this case, the through-hole 5 having a nearly square opening can be formed without using a mask material to make the irradiation range of the laser light square, which is effective in improving the workability. It is.

  The width of the through-hole 5 (the dimension in the direction orthogonal to the boundary 2b on the main surface of the mother board 1) is the width of the boundary 2b of the wiring board region 2 cut by dicing, that is, the dicing blade used for cutting. It is preferably a little narrower than the width. When the width of the through-hole 5 is larger than the width of the dicing blade, the trace of the through-hole 5 remains on the side surface of the cut circuit board after cutting, which may cause defects such as defective appearance and defective dimensions. is there.

  For example, if the width of the dicing blade is about 50 to 300 μm, the width of the through hole 5 may be set to a dimension narrower by about 5 to 30 μm (about 10% with respect to the width of the dicing blade).

  With regard to the multi-piece wiring board 9 in which such through-holes 5 are formed, for example, the mother board 1 is a glass ceramic sintered body mainly composed of the borosilicate glass and the aluminum oxide as described above. In the case of a square plate having a length of 37.5 mm, taking as an example the case where the thickness of the mother substrate 1 is about 3 mm, the cutting speed can be effectively increased as follows. It has been confirmed. The through-hole 5 has a rectangular shape with upper and lower openings of 0.2 × 0.23 mm, and is inclined at an angle of 60 degrees with respect to the boundary 2 b of the wiring board region 2. The through-hole 5 is formed using a mask material using a laser beam whose irradiation range is a square shape with one side of 0.2 mm, and the cross-sectional shape in the direction perpendicular to the length direction of the through-hole 5 is one side. Was a square shape having a length of about 0.2 mm.

  In this case, when the mother substrate 1 was cut by rotating a dicing blade (with diamond as the abrasive grains) having a blade thickness of about 0.05 mm at a speed of about 5000 rpm, it was cut at a speed of about 20 mm / second or more. Even in this case, the occurrence rate of defects such as chipping in the cut wiring board could be suppressed to about 0.05% or less.

  On the other hand, in the case of a conventional multi-cavity wiring board (not shown) in which such through holes 5 are not formed, the cutting speed of the mother board is about 15 mm / second under the same conditions as described above. It is confirmed that the occurrence of defects such as cracks increases to about 1% when the speed is increased further.

  Further, as shown in FIGS. 4A and 4B, for example, the multi-piece wiring board 9 has hard particles 8 made of at least one of silicon oxide, ceramic material, and diamond on at least the inner surface of the through-hole 5. When a resin material 7 in which is dispersed is applied, abrasive grains (not shown) exposed on the surface of the dicing blade when the resin material 7 is cut by a dicing blade (not shown). ) And the hard particles 8 dispersed in the resin material 7, the worn abrasive grains can be removed. Therefore, it is promoted that the abrasive grains inside the bonding material are newly exposed on the surface of the dicing blade, and the force (cutting force) for cutting the mother substrate 1 by the dicing blade can be maintained more reliably. Therefore, in this case, it is possible to provide a multi-piece wiring board 9 that can further improve the workability of dividing the mother board 1 by dicing. 4A is an enlarged cross-sectional view of a main part showing another example of the embodiment of the multi-piece wiring board 9 of the present invention, and FIG. 4B is surrounded by a broken line in FIG. 4A. It is a principal part expanded sectional view which expands and shows a part further. 4, parts similar to those in FIG. 1 are denoted by the same reference numerals.

  Since the hard particles 8 are only bonded to the resin material 7, the hard particles 8 easily fall off from the mother substrate 1 and are removed as the resin material 7 that is more easily ground than the mother substrate 1 is ground. Is done. Therefore, even if the resin material 7 and the hard particles 8 are attached to the inner surface of the through hole 5, there is a possibility that the resin material 7 and the hard particles 8 hinder the cutting of the mother substrate 1. Is small.

  As the resin material 7, for example, a thermosetting or light (ultraviolet) curable resin material such as an epoxy resin, a polyimide resin, a phenol resin, an acrylic resin, or a urethane resin is used.

  The hard particles 8 are made of a material having a small difference in hardness from abrasive grains made of diamond or an aluminum oxide sintered body. As the ceramic material as the hard particles 8, materials such as an aluminum oxide sintered body, a boron nitride sintered body, a silicon nitride sintered body, and a silicon carbide sintered body can be used. As the silicon oxide as the hard particles 8, crystalline silicon dioxide such as quartz or cristobalite can be used.

  The shape of the hard particles 8 is spherical, spherical with irregularities on the surface, irregular shaped fragments, or the like. Such hard particles 8 can be manufactured by a method such as a method of pulverizing larger raw materials such as quartz and aluminum oxide by mechanical processing.

  In the resin material 7 in which the hard particles 8 are dispersed, for example, the silicon oxide powder as the hard particles 8 is kneaded together with the uncured epoxy resin, and the silicon oxide powder is dispersed in the paste-like resin material. A mixture (not shown) is prepared, and then the mixture is applied to at least the inner surface of the through hole 5 of the mother substrate 1 by a printing method such as a screen printing method with vacuum suction. The cured product can be formed by curing with a curing means such as heating or ultraviolet irradiation. As the silicon oxide powder in this case, a spherical powder having an average particle diameter of about 10 to 30 μm can be used. Further, the amount of the hard particles 8 added is effective, for example, with respect to the resin material 7 in order to effectively promote the removal of the worn abrasive grains from the dicing blade and to make the dispersion into the resin material 7 uniform. What is necessary is just about 20-80 mass%.

  Further, in order to facilitate printing in the through-hole 5 of such a mixture of paste-like resin material and hard particles 8, an organic solvent such as ethyl cellosolve acetate, butyl acetate, toluene or xylene is used. The viscosity may be adjusted.

  In addition, the resin material 7 in which the hard particles 8 are dispersed is not limited to being layered on the inner surface of the through hole 5, but fills the through hole 5 as shown in FIG. It may be a thing. In this case, since it is easy to increase the amount of the resin material 7 in contact with the dicing blade, the exposure of new abrasive grains on the dicing blade can be more effectively promoted.

  Further, the resin material 7 in which the hard particles 8 are dispersed may be partially different in thickness as shown in FIG. 5B, for example. In this case, for example, if the thickness of the resin material 7 is reduced near the upper surface and the lower surface of the mother board 1, the resin material 7 spreads along the upper surface and the lower surface of the mother board 1, and the wiring board region 2 This is more effective in preventing accidental adhesion to the wiring conductor 3. Such resin materials 7 having partially different thicknesses can be deposited by adjusting the printing thickness by adjusting the viscosity of the paste-like mixture, the vacuum degree of vacuum suction, or the like. 5 (a) and 5 (b) are enlarged sectional views of main parts showing another example of the embodiment of the multi-piece wiring board 9 of the present invention. 5, parts similar to those in FIGS. 1 and 4 are denoted by the same reference numerals.

  Further, the resin material 7 in which the hard particles 8 are dispersed is attached only to the side orthogonal to the boundary 2b of the wiring board region 2 when the opening of the through-hole 5 is rectangular as shown in FIG. You may do it. In this case, since the resin material 7 comes in contact with the same thickness in the width direction of the dicing blade during the dicing process, it is effective in aligning the effect of removing the worn abrasive grains to the same extent in the width direction of the dicing blade. It is. FIG. 6 is an enlarged plan view of a main part showing another example of the embodiment of the multi-piece wiring board 9 of the present invention. In FIG. 6, the same parts as those in FIGS. 1 and 4 are denoted by the same reference numerals.

  In this multi-piece wiring board 9, for example, as shown in FIG. 7, a dummy area 4 surrounding a plurality of wiring board areas 2 is provided on the outer peripheral portion of the mother board 1. 2 through the outer edge on the wiring board region 2 side of the through hole 5 formed in the boundary 2b of the wiring board 2 and the straight line L on the opposite side of the through hole 5 with respect to the straight line L extending in parallel with the boundary 2b of the wiring board region 2. A plurality of in-dummy region through-holes 6 penetrating through the mother board 1 in the thickness direction are positioned parallel to each other and are inclined with respect to the direction in which the boundary 2b of the wiring board region 2 extends to be adjacent to one dummy region When the outer edge of the upper opening of the inner through hole 6 and the outer edge of the lower opening of the other dummy area inner through hole 6 are formed so as to overlap in plan view, Through the through-hole 6 and the above-described through-hole 5 It is possible to obtain the effect of facilitating the cutting of the mother substrate 1 as. Moreover, it is possible to obtain a multi-piece wiring board 9 capable of suppressing variation in wear of a dicing blade used for dicing. FIG. 7 is an enlarged plan view of a main part showing another example of the embodiment of the multi-piece wiring board 9 of the present invention. In FIG. 7, the same parts as those in FIGS. 1 and 2 are denoted by the same reference numerals.

  That is, the through-hole 5 formed in the boundary 2b of the wiring board region 2 has a width (cut by the dicing blade of the mother board 1) in order to prevent the trace of the through-hole 5 from remaining on the side surface of the individual wiring board. The width may be set narrower than the width of the dicing blade. In this case, in the portion where the through hole 5 is formed (the central portion in the width direction of the dicing blade), since the thickness of the mother substrate 1 that is actually cut is thin, the wear of the dicing blade is caused by the through hole on the outer side. It tends to be smaller than a portion where 5 is not formed (an outer peripheral portion in the width direction of the dicing blade). On the other hand, if the through-hole 6 in the dummy area is formed as described above, in the dummy area 4, the thickness of the mother substrate 1 to be cut is reduced by the amount of the through-hole 6 in the dummy area. Wear can be reduced at the outer peripheral portion in the width direction of the blade as compared with the central portion. Therefore, the wear of the dicing blade at the boundary 2b of the wiring board region 2 can be canceled by the amount of the through-hole 6 in the dummy region, and the variation in the wear of the dicing blade can be suppressed.

  In addition, since the thickness of the mother substrate 1 cut by the dicing process can be reduced by the amount of the through-hole 6 in the dummy area, the workability of the dicing process can be ensured well.

  Note that a straight line L that passes through the outer edge of the through hole 5 formed in the boundary 2b of the wiring substrate region 2 on the wiring substrate region 2 side and extends in parallel with the boundary 2b of the wiring substrate region 2 has a difference in wear of the dicing blade. This corresponds to the boundary between the center portion in the width direction of the dicing blade and the outer peripheral portion. Since the through hole 6 in the dummy area is formed with the straight line L as the position of the outer edge, the difference in wear of the dummy blade that occurs with the straight line L as a boundary is effectively canceled (the level of wear is leveled in the width direction). )be able to.

  The through-hole 6 in the dummy region may be formed so as to be parallel to the through-hole 5 formed in the boundary 2b of the wiring board region 2.

  If the through hole 6 in the dummy area is formed between the straight line L and the outer edge of the range cut by the dicing blade, it is possible to obtain an effect of leveling the wear of the dicing blade. It may be formed so as to extend outside the range cut by the blade.

  Such a through hole 6 in the dummy region has the straight line L as the position of the outer edge, so that the opening and the cross-section have a shape in which the outer edge on the straight line L side is a straight line, for example, a rectangular shape, a square shape, a parallelogram shape, etc. It is formed in a square shape.

  In the multi-piece wiring board of the present invention, in the above configuration, hard particles 8 made of at least one of silicon oxide, ceramic material, and diamond are dispersed on at least the inner surfaces of the through hole 5 and the through hole 6 in the dummy region. When the resin material 7 is adhered, the effect of increasing the workability of the dicing process by the resin material 7 and the hard particles 8 deposited on the inner surface of the through hole 5 as in the case described above. Can be obtained. In addition to this, when the dicing blade cuts the resin material (not shown) attached to the inner surface of the through hole 6 in the dummy region, the above-described through hole 6 is also formed in the outer peripheral portion in the width direction of the dicing blade. As in the case where the same resin material 7 is adhered to the inner surface of the steel sheet, it is possible to promote the removal of the worn abrasive grains and the exposure of new abrasive grains in the dicing blade. Therefore, in this case, the wear of the dicing blade and the variation in the cutting force can be more effectively suppressed in the entire area in the width direction of the dicing blade, so that the workability of dividing the mother substrate 1 by dicing is further increased. Can be improved.

  As the resin material in which the hard particles to be deposited on the inner surface of the through hole 6 in the dummy region are dispersed, the same material as the resin material 7 and the hard particle 8 to be deposited on the inner surface of the through hole 5 can be used. The resin material (7) in which the hard particles (8) are dispersed may be applied to the inner surface of the through hole 6 in the dummy region in the same manner by the same method as in the case of the through hole 5 described above. .

  Further, the multi-piece wiring board 9 may be divided into individual pieces after electronic components are mounted on the wiring board region 2. When dicing is performed after the electronic component is mounted on the wiring board region 2, especially when the electronic component has a mechanical movement mechanism such as a MEMS element or a surface acoustic wave element, cutting associated with dicing is performed. When debris adheres to an electronic component, the mechanical movement is hindered and the possibility of malfunctioning increases. Therefore, in this case, it is preferable to first perform dicing processing on the mother board 1 after sealing the electronic component with a sealing means (not shown) such as a lid or a sealing resin.

  Electronic devices in which electronic components are mounted on individual wiring boards are used as components in various electronic devices such as computers, mobile phones, digital cameras, and various sensors such as acceleration and pressure. The electrical connection between the electronic device and the electronic device (circuit board or the like constituting the electronic device) is performed by, for example, soldering or conductive bonding of a portion of the wiring conductor 3 exposed on the lower surface of the wiring substrate (wiring substrate region 2). It can be performed by bonding via a conductive bonding material such as an agent.

DESCRIPTION OF SYMBOLS 1 ... Mother board 2 ... Wiring board area | region 2a .... Recessed part 2b .... Border 3 of wiring board area | region ... Wiring conductor 4 ... Dummy area 5 ... Through-hole 6 ... In dummy area Through-hole 7 ... resin material 8 ... hard particles 9 ... multi-cavity wiring board

Claims (4)

A plurality of wiring board regions formed in a matrix substrate made of a ceramic sintered body are arranged in rows and columns and cut by dicing at the boundaries of the wiring substrate regions,
A plurality of through-holes penetrating the mother board in the thickness direction are formed at the boundary of the wiring board area of the mother board in parallel to each other and inclined with respect to the direction in which the boundary of the wiring board area extends. An outer edge of an upper opening of one of the adjacent through holes and an outer edge of an opening of the lower side of the other through hole overlap each other in plan view. A plurality of dummy areas surrounding the wiring board area are provided on the outer periphery of the mother board, and an outer edge on the wiring board area side of the through hole formed at the boundary of the wiring board area is provided in the dummy area. A plurality of through holes in the dummy region penetrating the mother board in the thickness direction, with the straight line being positioned at an outer edge on a side opposite to the through hole with respect to a straight line extending in parallel with a boundary of the wiring board region, Parallel to each other, formed to be inclined with respect to the direction in which the boundary of the wiring board region extends, the outer edge of the upper opening of one adjacent dummy region through hole and the other dummy region through hole 2. The multi-piece wiring board according to claim 1, wherein the outer edge of the lower opening overlaps with the outer edge in plan view. 2. The multi-cavity wiring board according to claim 1, wherein a resin material in which hard particles made of at least one of silicon oxide, ceramic material and diamond are dispersed is applied to at least an inner surface of the through hole. . 3. A resin material in which hard particles made of at least one of silicon oxide, ceramic material, and diamond are dispersed is attached to at least inner surfaces of the through hole and the through hole in the dummy region. Multiple printed wiring board as described.

Images