JP2010153645A - 積層半導体装置の製造方法 - Google Patents

積層半導体装置の製造方法 Download PDF

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Publication number
JP2010153645A
JP2010153645A JP2008331100A JP2008331100A JP2010153645A JP 2010153645 A JP2010153645 A JP 2010153645A JP 2008331100 A JP2008331100 A JP 2008331100A JP 2008331100 A JP2008331100 A JP 2008331100A JP 2010153645 A JP2010153645 A JP 2010153645A
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JP
Japan
Prior art keywords
substrate
soi substrate
support member
soi
semiconductor device
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Pending
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JP2008331100A
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English (en)
Japanese (ja)
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JP2010153645A5 (https=
Inventor
Kazuya Okamoto
和也 岡本
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Nikon Corp
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Nikon Corp
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Priority to JP2008331100A priority Critical patent/JP2010153645A/ja
Publication of JP2010153645A publication Critical patent/JP2010153645A/ja
Publication of JP2010153645A5 publication Critical patent/JP2010153645A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor

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  • Mechanical Treatment Of Semiconductor (AREA)
JP2008331100A 2008-12-25 2008-12-25 積層半導体装置の製造方法 Pending JP2010153645A (ja)

Priority Applications (1)

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JP2008331100A JP2010153645A (ja) 2008-12-25 2008-12-25 積層半導体装置の製造方法

Applications Claiming Priority (1)

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JP2008331100A JP2010153645A (ja) 2008-12-25 2008-12-25 積層半導体装置の製造方法

Publications (2)

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JP2010153645A true JP2010153645A (ja) 2010-07-08
JP2010153645A5 JP2010153645A5 (https=) 2012-08-16

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JP2008331100A Pending JP2010153645A (ja) 2008-12-25 2008-12-25 積層半導体装置の製造方法

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012089537A (ja) * 2010-10-15 2012-05-10 Nikon Corp ステージ装置、基板貼り合せ装置、積層半導体装置の製造方法及び積層半導体装置
JP2012134231A (ja) * 2010-12-20 2012-07-12 Disco Abrasive Syst Ltd 積層デバイスの製造方法及び積層デバイス
WO2014046052A1 (ja) * 2012-09-23 2014-03-27 国立大学法人東北大学 チップ支持基板、チップ支持方法、三次元集積回路、アセンブリ装置及び三次元集積回路の製造方法
CN112424908A (zh) * 2018-07-25 2021-02-26 株式会社尼康 接合方法以及接合装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61288456A (ja) * 1985-06-17 1986-12-18 Fujitsu Ltd 多層半導体装置の製造方法
JP2006339191A (ja) * 2005-05-31 2006-12-14 Nikon Corp ウェハホルダ、ウェハ積層方法及び積層型半導体装置製造方法
JP2007073775A (ja) * 2005-09-07 2007-03-22 Mitsumasa Koyanagi 三次元積層構造を持つ集積回路装置の製造方法
JP2007158199A (ja) * 2005-12-08 2007-06-21 Nikon Corp ウェハの接合方法、接合装置及び積層型半導体装置の製造方法
JP2007208031A (ja) * 2006-02-02 2007-08-16 Nikon Corp ウェハホルダ及び半導体装置の製造方法
JP2007273782A (ja) * 2006-03-31 2007-10-18 Oki Electric Ind Co Ltd 半導体装置の製造方法
JP2008187061A (ja) * 2007-01-31 2008-08-14 Elpida Memory Inc 積層メモリ

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61288456A (ja) * 1985-06-17 1986-12-18 Fujitsu Ltd 多層半導体装置の製造方法
JP2006339191A (ja) * 2005-05-31 2006-12-14 Nikon Corp ウェハホルダ、ウェハ積層方法及び積層型半導体装置製造方法
JP2007073775A (ja) * 2005-09-07 2007-03-22 Mitsumasa Koyanagi 三次元積層構造を持つ集積回路装置の製造方法
JP2007158199A (ja) * 2005-12-08 2007-06-21 Nikon Corp ウェハの接合方法、接合装置及び積層型半導体装置の製造方法
JP2007208031A (ja) * 2006-02-02 2007-08-16 Nikon Corp ウェハホルダ及び半導体装置の製造方法
JP2007273782A (ja) * 2006-03-31 2007-10-18 Oki Electric Ind Co Ltd 半導体装置の製造方法
JP2008187061A (ja) * 2007-01-31 2008-08-14 Elpida Memory Inc 積層メモリ

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012089537A (ja) * 2010-10-15 2012-05-10 Nikon Corp ステージ装置、基板貼り合せ装置、積層半導体装置の製造方法及び積層半導体装置
JP2012134231A (ja) * 2010-12-20 2012-07-12 Disco Abrasive Syst Ltd 積層デバイスの製造方法及び積層デバイス
WO2014046052A1 (ja) * 2012-09-23 2014-03-27 国立大学法人東北大学 チップ支持基板、チップ支持方法、三次元集積回路、アセンブリ装置及び三次元集積回路の製造方法
US9449948B2 (en) 2012-09-23 2016-09-20 Tohoku University Chip support substrate, chip support method, three-dimensional integrated circuit, assembly device, and fabrication method of three-dimensional integrated circuit
CN112424908A (zh) * 2018-07-25 2021-02-26 株式会社尼康 接合方法以及接合装置

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