JP2010149495A - Substrate cutter - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate cutter capable of preventing a reception member from being inclined and capable of cutting vertically a substrate, while constituted compactly. <P>SOLUTION: The first frontward advancing portion 202 of one side support member 53 is projected toward the second retracting portion 303 of the other side support member 54 over a cutting line 101, and the second frontward advancing portion 304 of the other side support member 54 is projected toward the first retracting portion 201 of the one side support member 53 over the cutting line 101, in a left area L. The second frontward advancing portion 204 of the one side support member 53 is projected toward the first retracting portion 301 of the other side support member 54 over the cutting line 101, and the first frontward advancing portion 302 of the other side support member 54 is projected toward an inside of the second retracting portion 203 of the one side support member 53 over the cutting line 101, in a right area R. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a substrate cleaving apparatus for cleaving a substrate.

  A semiconductor chip is manufactured by cleaving an element region formed on a semiconductor wafer at a boundary position of the region. Thus, when cleaving a substrate such as a semiconductor wafer, a substrate cleaving apparatus is used. The cleaving is a concept including a case of cleaving the substrate in a specific direction with respect to the crystal and a case of dividing the substrate regardless of the direction of the crystal.

  Such a substrate cleaving device is a scribe groove in which the substrate surface is cut into a linear shape by a cutting tool such as a diamond cutter, or an ablation processing line in which the substrate surface is ablated and removed in a linear shape by a laser beam, or a laser beam. A substrate on which a processing line or the like in which the structure of the substrate is linearly changed by locally melting the substrate surface by the above (in the present invention, these are collectively referred to as a scribe line) is used as the scribe line. By pressing in the Z direction from the back surface of the surface on which the substrate is formed, the substrate is cleaved at a cutting line facing the X direction on the scribe line. When the substrate is cleaved, the substrate is abutted and supported by a pair of receiving members, which are called receiving blades or the like and are spaced apart from each other by a small distance in the Y direction (see, for example, Patent Document 1). The receiving member is supported by a pair of support members.

JP 2004-39931 A

  The distance between the pair of receiving members that contact the substrate when the substrate is cleaved and the receiving member must be changed according to the thickness and hardness of the substrate to be cleaved and the chip size of the semiconductor device. For this reason, the supporting member that supports the pair of receiving members is attached to the base via a moving mechanism that moves the supporting members in the Y direction so that the distance between the front edges of the pair of receiving members facing each other can be changed. is set up.

  In the substrate cleaving apparatus having such a configuration, when the substrate is pressed by the blade at the time of cleaving the substrate, the substrate is slightly bent but the pressing force is applied to the front edge of the receiving member and the support member via the substrate. Concentrate on the part. When stress concentrates on the front edge portions of the receiving member and the support member in this way, the front edge is inclined on the surface of the receiving member. When the surface of the receiving member is tilted in this way, there arises a problem that the split section of the substrate is not tilted perpendicularly to the surface of the substrate and is tilted unstable. As described above, when the split section is inclined, the quality of the semiconductor chip is hindered.

  Of course, when the support member has sufficient rigidity, the inclination of the surface of the receiving member can be reduced. However, the support member may be installed on the base via the moving mechanism, In order to obtain rigidity, there arises a problem that the apparatus becomes large.

  The present invention has been made to solve the above problems, and provides a substrate cleaving apparatus capable of cleaving a substrate accurately while preventing the inclination of the receiving member while having a compact configuration. Objective.

  The invention according to claim 1 is a substrate cutting apparatus that applies a force to a substrate on which a scribe line is formed, and cuts the substrate at a cutting line facing the X direction on the scribe line, the cutting line A pair of receiving members that are in contact with the surface of the substrate on which the scribe line is formed, and the pair of receiving members that are in contact with the substrate. Is a pair of supporting members that are supported from opposite surfaces, an approaching position where opposing front edges of the pair of receiving members approach each other at a position corresponding to the breaking line, and a separation position separated from the approaching position. A moving mechanism that moves the pair of support members in the Y direction so that the pair of supporting members can be moved between the substrate and the back surface of the substrate on which the scribe line is formed. A pair of support members, a pair of support members, a pair of receiving members, and a cleaving force generating means for applying a force to the substrate by moving the blades relative to each other in the Z direction so as to approach each other. The member includes a retracted portion in which each of the front edges is retracted in the Y direction from the breaking line, and a protruding portion that protrudes in the Y direction from the breaking line, and the protruding portion of one support member supports the other It protrudes toward the retreat part of a member, and it has opposedly arranged so that the protrusion part of the other support member may protrude toward the retreat part of one support member.

  The invention according to claim 2 is the invention according to claim 1, wherein the support region of the pair of receiving members by the pair of support members is divided into a left region and a right region by a straight line facing the Y direction. One support member of the pair of support members includes a first retracted portion and a first forward portion in the left region, and a second retracted portion and a second forward portion in the right region. And the other support member of the pair of support members includes a first retracted portion and a first forward portion in the right region, and a second retracted portion in the left region. A first forward portion of the one support member protrudes toward a second retracted portion of the other support member, and the other region of the left region. The second forward portion of the support member is Projecting toward the first retracted portion of the holding member, and in the right region, the second forward portion of the one support member projects toward the first retracted portion of the other support member, and The first leading portion of the other support member protrudes toward the second retracted portion of the one support member.

  The invention according to claim 3 is the invention according to claim 2, wherein the one support member and the other support member have the same shape.

  According to a fourth aspect of the present invention, in the invention according to any one of the first to third aspects, the pair of support members are each formed with an evacuation portion for observation that is evacuated in the Y direction from the breaking line. Both observation retreat portions are opposed to each other.

  According to the first aspect of the present invention, it is possible to cut the substrate vertically while preventing the receiving member from being inclined while having a compact configuration.

  According to the second aspect of the present invention, the support member is prevented from being inclined by the two front projecting parts, the first front projecting part and the second front projecting part arranged in the left region and the right region. It becomes possible to reliably prevent the inclination of the member in the entire X direction.

  According to the third aspect of the present invention, the deformation force received by both of the pair of support members is similar, and there is no instability such that one of the support members is biased and deformed, and is perpendicular to the surface of the substrate. It can be expected that cleaving can be performed stably.

  According to the fourth aspect of the present invention, since the front edge portions of the receiving member facing each other can be observed through the observation retracting portion, the front edge of the receiving member can be suitably positioned.

1 is a perspective view of a substrate cleaving apparatus according to the present invention. 1 is a perspective view of a substrate cleaving apparatus according to the present invention. It is a top view which shows the ring member 43 for setting the board | substrate W to the board | substrate cleaving apparatus mentioned above. 2 is a plan view of a support mechanism 10. FIG. 3 is a side sectional view of the support mechanism 10. FIG. It is a top view of a pair of supporting members 53 and 54. 2 is a schematic diagram showing the support mechanism 10 together with a blade 14 and a CCD camera 35. FIG. It is explanatory drawing for demonstrating the structure of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 and 2 are perspective views of a substrate cleaving apparatus according to the present invention.

  The substrate cleaving apparatus includes a support mechanism 10 (see FIG. 1) that is a characteristic part of the present invention, and a ring that aligns the scribe line formed on the substrate W with a desired direction with respect to the support mechanism 10. A rotary table 11 that supports and rotates the member 43, a Y table 12 that supports the rotary table 11, a support table 13 that supports the Y table 12, and a lift table 16 that moves up and down relative to the rotary table 11 are provided. The support table 13 is installed on the ground via four shafts 18, a table 17, and leg portions 19.

  On the upper surface of the support table 13, four columnar elevating guides 24 are erected outside the rotary table 11, and a gantry 21 is fixed so as to bridge the upper ends of these columnar elevating guides 24.

  Further, between the support table 13 and the gantry 21 is provided a lifting table 16 which is guided to be lifted and lowered by a columnar lifting guide 24 so as to be freely movable only in the vertical direction.

  A stepping motor 23 is installed on the gantry 21 via a support member 22. The rotating shaft of the stepping motor 23 is connected to a ball screw 25 that passes through the pedestal 21 so as to freely rotate. The ball screw 25 is screwed to the lifting table 16.

  For this reason, the lifting table 16 moves up and down in the Z direction by driving the stepping motor 23. As shown in FIG. 2, a blade 14 is attached to the lower surface of the elevating table 16 via a fishing support member 15 to apply a force to cleave the substrate by pressing the substrate when the substrate is cleaved. It has been.

  As shown in FIG. 1, the Y table 12 is driven by a ball screw 32 that rotates by driving a stepping motor 31, and reciprocates on the support table 13 in the Y direction. The rotation angle position of the rotary table 11 can be adjusted by operating the knob 34 and rotating the fine adjustment screw 33.

  As shown in FIG. 2, a CCD camera 35 is installed below the support table 13. The CCD camera 35 is movable in the X direction along a pair of guide rails 37 supported by a support plate 39 installed on the table 17. The support portion 41 of the CCD camera 35 is screwed with a ball screw 38 that is rotated by driving of the stepping motor 36. For this reason, the CCD camera 35 is driven by the stepping motor 36 to reciprocate in the X direction. The CCD camera 35 is for observing the front edge portion of the receiving blade through an opening formed in the support table 13 and an observation retracting portion described later.

  FIG. 3 is a plan view showing a ring member 43 for setting the substrate W in the substrate cleaving apparatus described above.

  An adhesive film 42 called a dicing tape is attached to the circular opening formed at the center of the ring member 43 with the adhesive surface thereof facing down. Then, the substrate W to be cleaved is attached to the adhesive surface of the adhesive film 42. The ring member 43 to which the substrate W is attached via the adhesive film 42 is set on the turntable 11 shown in FIG.

  In addition, as a substrate to be cleaved by this substrate cleaving apparatus, a substrate such as a silicon single crystal substrate, a silicon carbide (SiC) substrate, an aluminum nitride (AlN) substrate, as well as a high hardness substrate such as a sapphire substrate or a diamond substrate. It is.

  Next, the configuration of the support mechanism 10 that is a characteristic part of the present invention will be described. 4 is a plan view of the support mechanism 10, and FIG. 5 is a side sectional view thereof. FIG. 6 is a plan view of the pair of support members 53 and 54. Further, FIG. 7 is a schematic view showing the support mechanism 10 together with the blade 14 and the CCD camera 35. In these drawings, a one-dot chain line 101 indicates a breaking line that is a position where the substrate W is broken.

  The support mechanism 10 is connected to a pair of receiving blades 51 and 52 that contact the surface of the substrate W on which the scribe line is formed, and these receiving blades 51 and 52, respectively. A pair of support members 53 and 54 that are supported from a surface opposite to the contact surface with the substrate W, and a base 55 that supports the pair of support members 53 and 54 are provided. The pair of support members 53 and 54 have the same shape.

  As shown in FIG. 4, the pair of support members 53 and 54 are urged in the directions approaching each other by the action of the spring 61. The pair of support members 53 and 54 are each urged toward the surface of the base 55 by the action of the two springs 62. A plurality of rollers 63 are disposed between the pair of support members 53 and 54 and the base 55. For this reason, the pair of support members 53 and 54 are movable in the Y direction shown in FIGS.

  Contact members 56 and 57 are attached to the side surfaces of the pair of receiving blades 51 and 52, respectively. A pair of pins 58 are disposed between the contact members 56 and 57. Due to the action of the pin 58, the distance between the contact members 56 and 57 is regulated, whereby the pair of receiving blades 51 and 52 are located at positions where the opposing front lines are separated from the breaking line 101 by an equal distance from each other in the Y direction. Placed in. The distance between the pair of receiving blades 51 and 52 can be set to an arbitrary value by changing the diameter of the pin 58. The position of the pair of support members 53 and 54 in the Y direction is also regulated by the action of the pin 58.

  As shown in FIG. 6, when the support region of the receiving blades 51, 52 by the pair of support members 53, 54 is divided into a left region L and a right region R by a straight line 102 facing the Y direction, the pair of support members 53, One of the support members 53 of 54 includes a first retracted portion 201 that is retracted in the Y direction from the breaking line 101 in the left region L, and a first forward portion 202 that protrudes in the Y direction from the breaking line 101. In addition, in the right region R, a second receding portion 203 retracted in the Y direction from the breaking line 101 and a second leading portion 204 protruding in the Y direction from the breaking line 101 are provided. Similarly, the other support member 54 of the pair of support members 53, 54 has a first retracted portion 301 that is retracted in the Y direction from the breaking line 101 in the right region R, and a first protrusion that protrudes in the Y direction from the breaking line 101. 1 in the left region L, and a second retracted portion 303 retracted from the breaking line 101 in the Y direction and a second leading portion 304 protruding from the breaking line 101 in the Y direction. .

  In the left region L, the first forward portion 202 of one support member 53 protrudes toward the second retracted portion 303 of the other support member 54 and the second portion of the other support member 54 The forward protruding portion 304 protrudes toward the first retracted portion 201 of one support member 53. Further, in the right region R, the second forward protruding portion 204 of the one supporting member 53 protrudes into the first retracted portion 301 of the other supporting member 54, and the first supporting member 54 has the first protruding portion 301. The protruding portion 302 protrudes toward the second retracted portion 203 of the one support member 53.

  The pair of support members 53 and 54 are formed with observation evacuation portions 205 and 206 evacuated in the Y direction from the breaking line 101 in regions facing each other. A space for observing the front edges of the pair of receiving blades 51 and 52 by the CCD camera 35 can be formed between the pair of support members 53 and 54 by the evacuation portions 205 and 206 for observation. Accordingly, the front edges of the pair of receiving blades 51 and 52 can be suitably positioned in a state where the tip 71 of the blade 14 is stored in the field of view behind the pair of receiving blades 51 and 52. As described above, the support table 13 is formed with an opening for observation of the pair of receiving blades 51 and 52 by the CCD camera 35. Similarly, the base 55 is provided with an opening for observation of the pair of receiving blades 51 and 52.

  Next, the cutting operation of the substrate W by the substrate cutting apparatus described above will be described.

  When cleaving the substrate W, first, a distance between the pair of receiving blades 51 and 52 is set. This distance is changed according to the thickness and hardness of the substrate W to be cleaved and the chip size of the semiconductor device. This distance can be changed by changing the outer shape of the pair of pins 58. That is, when the outer shape of the pair of pins 58 is increased, the distance between the pair of receiving blades 51 and 52 is increased, and when the outer shape of the pair of pins is decreased, the distance between the pair of receiving blades 51 and 52 is increased. The distance becomes smaller.

  In this embodiment, by replacing the pair of pins 58 interposed between the contact members 56 and 57 attached to the pair of receiving blades 51 and 52 with ones having different outer shapes, the pair of receiving blades 51 and 52 Although the distance between 52 is changed, you may make it change the distance between a pair of receiving blades 51 and 52 using the pin from which the outer diameter changes with the effect | actions of an actuator.

  After the distance between the pair of receiving blades 51 and 52 is in accordance with the substrate W to be cleaved, as shown schematically in FIG. Measure the position and angle of the leading edge. In this case, the front edges of the pair of receiving blades 51 and 52 are measured by the CCD camera 35 through the openings formed by the observation retracting portions 205 and 206 formed in the pair of support members 53 and 54. To do. In this measurement, the CCD camera 35 is moved in the X direction by the action of the stepping motor 36 shown in FIG. 2, so that the front edges of the pair of receiving blades 51 and 52 can be measured over a wide range.

  Next, as shown in FIG. 3, the substrate W is mounted on the ring member 43 using the adhesive film 42. And this ring member 43 is set to the turntable 11 shown in FIG. Thereafter, the knob 34 is operated to rotate the fine adjustment screw 33 to adjust the rotational angle position of the rotary table 11 so that the position of the scribe line of the substrate W matches the breaking line of the substrate breaking device. The angle of the substrate W is positioned.

  After that, the cleaving is executed. In this case, as shown in FIG. 7, the substrate W supported by the pair of receiving blades 51, 52 with the surface on which the scribe line 100 is formed facing down is taken from the opposite side of the receiving blades 51, 52. The blade 14 is pressed at the breaking line 101 corresponding to the scribe line 100. The movement of the blade in the Z direction at this time is executed by lowering the lifting table 16 by the stepping motor 23.

  When the blade 14 presses the substrate W, the substrate W is placed so that the scribe line coincides with the breaking line 101. Therefore, the blade 14 is placed on the back surface of the substrate W on the side where the scribe line is formed. The part on the back side of the substrate, that is, the back side of the scribe line is pressed by the substrate W. The pressed substrate W comes into contact with the pair of receiving blades 51 and 52 and presses the receiving blades 51 and 52.

  Both surfaces of the pair of receiving blades 51 and 52 that are in contact with the substrate W are processed to be flat, and are located on a plane perpendicular to the Z direction at the same height in the Z direction. Accordingly, the receiving blades 51 and 52 receive the pressing force from the substrate W in a region having a wide area with respect to the substrate W. However, this is a case where the substrate W does not bend at all. Actually, the substrate is necessarily slightly bent.

  Therefore, when the blade 14 presses the substrate W, the substrate W is intensively pressed from the blade 14 to a narrow linear portion along the back of the scribe line located at the breaking line, and a pair of Since the receiving blades 51 and 52 are separated from each other in the Y direction by the pair of pins 58, the receiving blades 51 and 52 cannot receive the pressing force in this gap, and the substrate W bends. . That is, the substrate W is bent so as to be warped by being pressed apart by pressing the back surface of the scribe line.

  Thus, since the substrate W bends, the surface of the substrate W on which the scribe line is formed cannot be in surface contact with the receiving blades 51 and 52 and is separated from the breaking line 101 in the Y direction. Only the leading edge is in contact with the substrate W. That is, when viewed at an arbitrary point on the cutting line 101, the substrate W is sandwiched between the tip portion 71 of the blade 14 and the front edges of the pair of receiving blades 51 and 52 facing each other. As such, the substrate is subjected to a force.

  The receiving blades 51 and 52 receive a pressing force intensively only at the front edges facing each other, and the pair of support members 53 and 54 that support the pair of receiving blades 51 and 52 are positioned close to the front edges of the receiving blades 51 and 52. Concentrate on and receive pressure.

  At this time, in the substrate cleaving apparatus according to the present invention, as shown in FIG. 6, in the left region L, the first protruding portion 202 of one support member 53 exceeds the cleaving line 101 and the other support member. 54 protrudes toward the second retracted portion 303 of the second support member 54, and the second protruding portion 304 of the other support member 54 extends beyond the breaking line 101 toward the first retracted portion 201 of the one support member 53. In the right region R, the second leading portion 204 of one support member 53 protrudes beyond the breaking line 101 toward the first retracted portion 301 of the other support member 54. The first forward portion 302 of the other support member 54 protrudes toward the second retracted portion 203 of the one support member 53 beyond the breaking line 101.

  Therefore, the pressing force that the support member 53 receives from the receiving blade 51 does not reach the end of the support member 53 in the Y direction, and the pressing force that the support member 54 receives from the receiving blade 51 is the Y direction of the support member 54. Therefore, the support members 53 and 54 can avoid problems such as deformation force and rotational force due to concentrated force applied to the end portions, and the support members 53 and 54 are inclined. Never happen.

  Therefore, the pair of receiving blades 51 and 52 is prevented from being inclined, and this effectively prevents the problem that the split surface of the substrate W is inclined without being perpendicular to the surface of the substrate. It becomes possible.

  Further, when the blade 14 presses the substrate W and the front edges of the pair of receiving blades 51 and 52 are pressed via the substrate W, the pair of receiving blades 51 and 52 are attached to the spring 61 shown in FIG. Move in the direction away from each other against the forces. That is, the pressing force in the vertical direction of the blade 14 applied to the breaking line 101 existing between the front edges of the pair of receiving blades 51, 52 generates a component force in the direction separating the front edges of the receiving blades 51, 52. This makes it possible to reliably cleave the substrate W.

  In this embodiment, the tip portion 71 of the blade 14 is rounded to about 120 μm. The tip portion 71 of the blade 14 has been rounded by about 10 μm to 60 μm in order to prevent the adhesive film 42 from being cut when the substrate W is cleaved. In this embodiment, by setting this to about 120 μm, deformation of the adhesive film 42 due to the pressing force of the blade 14 is suppressed, and the pressing force can be reliably transmitted to the substrate W.

  That is, in this embodiment, as described above, when the blade 14 presses the substrate W, the pair of receiving blades 51 and 52 adopts a configuration in which the tips move in a direction away from each other. By applying a round process of about 120 μm to the front end portion 71, the pressing force of the blade 14 can be effectively applied to the substrate W without being consumed by the deformation of the adhesive film 42. In addition, it is preferable that the radius process of the front-end | tip of this blade 14 shall be 100 micrometers-150 micrometers.

  In this embodiment, a pair of pins 58 is employed as a restricting means for restricting the position of the pair of receiving blades 51 and 52 in the Y direction. In addition, a moving mechanism including a plurality of rollers 63 and springs 61 is employed as a moving unit that allows the pair of receiving blades 51 and 52 to move in a direction away from each other in the Y direction from the position restricted by the pin 58. is doing. In other words, in this embodiment, the pair of receiving blades 51 and 52 are allowed to move away from the restricting position, but are prohibited from moving in directions close to each other. However, it is not always necessary to prohibit the movement of the pair of receiving blades 51 and 52 in directions close to each other.

  That is, when the substrate W is cleaved, as described above, the pair of receiving blades 51 and 52 moves in a direction away from each other, so that the substrate W can be easily moved even when the pressing force of the blade 14 is relatively small. Can be cleaved. For this reason, it is sufficient that the resistance force for moving the pair of receiving blades 51 and 52 in the direction of approaching each other is stronger than the resistance force for moving in the direction of separating from each other. In the embodiment described above, the resistance force for moving the pair of receiving blades 51, 52 in the direction approaching each other is maximized, and the resistance force for moving in the direction away from each other is the biasing force of the spring 61. Is.

  However, when the movement of the pair of receiving blades 51 and 52 is prohibited by the holding force of a motor or the like, the pair of receiving blades 51 and 52 are separated from the resistance force for moving in the direction in which they are close to each other. Since the resistance force for moving in the direction is almost the same, the action of cleaving the substrate W with a relatively small pressing force as in this embodiment cannot be expected, and the cleaving of the substrate W with high accuracy is not possible. It becomes difficult.

  After cleaving the substrate W by the above operation, the stepping motor 31 is used to move the Y table 12 by a distance corresponding to the width of the semiconductor chip, and then the same cleaving operation is continued.

  In the above-described embodiment, as shown in FIG. 6, in the left region L, the first leading portion 202 of one support member 53 exceeds the breaking line 101 and the second support member 54 is the second. Projecting toward the retreating portion 303 of the second supporting member 54, and the second leading portion 304 of the other supporting member 54 projects beyond the breaking line 101 toward the first retreating portion 201 of the one supporting member 53, Further, in the right region R, the second leading portion 204 of one supporting member 53 protrudes toward the first retreating portion 301 of the other supporting member 54 beyond the breaking line 101 and supports the other. The first protruding portion 302 of the member 54 protrudes toward the second retracted portion 203 of the one supporting member 53 beyond the breaking line 101. That is, in both the left region L and the right region R, each of the pair of support members 53 and 54 has a forward portion and a retracted portion. By adopting such a configuration, the inclination of the pair of receiving blades 51 and 52 can be reliably prevented in the entire X direction, and the substrate W can be cleaved accurately. However, the present invention is not limited to such a configuration.

  FIG. 8 is an explanatory diagram for explaining the configuration of another embodiment for carrying out the present invention. In this figure, reference numerals 153, 154, 253, 254 denote support members, respectively.

  In the configuration according to the embodiment for carrying out the present invention shown in FIG. 8A, the support member 153 includes a forward portion 401 in the left region L and a forward portion 402 in the right region R. . The support member 154 includes a forward portion 403 in the left region L and a forward portion 404 in the right region R. And the front part of one support member protrudes toward the retreat part of the other support member. If it is such a structure, it will become possible to prevent the inclination of a receiving member and to cleave the board | substrate W correctly.

  On the other hand, in a configuration different from the present invention shown in FIG. 8B, the support member 253 has a single forward portion 501 in the right region R, and the support member 254 has a left region L. Only a single forward portion 502 is provided. When such a configuration is adopted, the pair of receiving blades 51 and 52 are inclined so as to be twisted, and it is difficult to cleave the substrate W accurately.

  In the above-described embodiment, a configuration in which the substrate W is cut by applying a pressing force to the substrate W by moving the blade 14 up and down is employed, but instead of moving the blade 14 up and down, a pair of receiving blades You may employ | adopt the structure which raises / lowers 51 and 52 and cleaves the board | substrate W. FIG.

DESCRIPTION OF SYMBOLS 10 Support mechanism 11 Rotary table 12 Y table 14 Blade 16 Elevating table 35 CCD camera 42 Adhesive film 43 Ring member 51 Receiving blade 52 Receiving blade 53 Support member 54 Support member 55 Base 56 Per contact member 57 Per contact member 58 Pin 61 Spring 62 Spring 63 Roller 101 Break line 201 First retracted part 202 First forward part 203 Second retracted part 204 Second forward part 205 Observation retracting part 206 Observation retracting part 301 First retracting part 302 First 1 front part 303 second retraction part 304 second front part 401 front part 402 front part 403 front part 404 front part W substrate

Claims (4)

A substrate cleaving apparatus that cleaves the substrate at a cleaving line facing the X direction on the scribe line by applying a force to the substrate on which the scribe line is formed,
A pair of receiving members disposed so as to face each other across the breaking line, each contacting a surface of the substrate on which the scribe line is formed;
A pair of support members for supporting the pair of receiving members from a surface opposite to the contact surface with the substrate;
The pair of support members so that the front edges of the pair of receiving members facing each other can move between an approach position approaching each other at a position corresponding to the breaking line and a separation position separated from the approach position. A moving mechanism for moving in the Y direction;
On the back surface of the substrate on which the scribe line is formed, a blade that linearly contacts along the back surface of the scribe line;
A pair of receiving members, and a cleaving force generating means for applying a force to the substrate by moving the blades relative to each other in the Z direction so as to approach each other,
Each of the pair of support members includes a receding portion in which each of the front edges is retracted in the Y direction from the breaking line, and a leading portion protruding in the Y direction from the breaking line, and the leading edge of one supporting member The substrate cleaving is characterized in that the portion protrudes toward the retracted portion of the other support member, and the protruding portion of the other support member protrudes toward the retracted portion of the one support member. apparatus. The substrate cleaving apparatus according to claim 1,
When the support region of the pair of receiving members by the pair of support members is divided into a left region and a right region by a straight line facing the Y direction,
One support member of the pair of support members includes a first retracted portion and a first forward portion in the left region, and a second retracted portion and a second forward portion in the right region. With parts,
The other support member of the pair of support members includes a first retracted portion and a first forward portion in the right region, and a second retracted portion and a second forward portion in the left region. In the left region, the first forward portion of the one support member protrudes toward the second retracted portion of the other support member, and the second of the other support member. Projecting toward the first retracted portion of the one support member,
In the right region, the second leading portion of the one supporting member protrudes toward the first retracted portion of the other supporting member, and the first leading portion of the other supporting member is A substrate cleaving device projecting toward a second retracted portion of the one support member. The substrate cleaving apparatus according to claim 2,
The one support member and the other support member are substrate cleaving apparatuses having the same shape. In the board | substrate cleaving apparatus in any one of Claims 1 thru | or 3,
A substrate cleaving apparatus in which the pair of supporting members are each formed with an evacuation portion for observation that is evacuated in the Y direction from the cleaving line, and both the evacuation portions for observation face each other.