JP2010147184A - Method and apparatus for forming multilayer substrate - Google Patents
Method and apparatus for forming multilayer substrate Download PDFInfo
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本発明は、基板を積層してなる積層型半導体装置の製造に関し、特に、積層された基板間に絶縁接着剤の樹脂を注入する際に、基板の外周や表面に付着する接着剤を除去する洗浄処理を行う積層基板の形成方法、および形成装置に関する。 The present invention relates to the manufacture of a stacked semiconductor device in which substrates are stacked, and in particular, when an insulating adhesive resin is injected between stacked substrates, the adhesive that adheres to the outer periphery or surface of the substrate is removed. The present invention relates to a method for forming a laminated substrate and a forming apparatus for performing a cleaning process.
半導体製造において、半導体装置あるいは半導体集積回路が予め作製された基板（ウェハ）を複数枚積層し、これら積層基板間を垂直配線で電気的に接続して３次元半導体積層回路装置を構成することが知られている。この３次元半導体積層回路装置の製造では、半導体装置あるいは半導体集積回路が予め作製された上層基板（ウェハ）と下層基板（ウェハ）と貼り合わせて積層化し、上下２層の基板（ウェハ）間に絶縁接着剤の樹脂を注入して３次元半導体積層回路装置を製造している。 In semiconductor manufacturing, a plurality of substrates (wafers) on which a semiconductor device or a semiconductor integrated circuit is fabricated in advance are stacked, and these stacked substrates are electrically connected by vertical wiring to form a three-dimensional semiconductor stacked circuit device. Are known. In the manufacture of this three-dimensional semiconductor laminated circuit device, a semiconductor device or a semiconductor integrated circuit is laminated by laminating an upper layer substrate (wafer) and a lower layer substrate (wafer) prepared in advance, and between two upper and lower layers (wafer). A three-dimensional semiconductor laminated circuit device is manufactured by injecting an insulating adhesive resin.
例えば、特許文献１では、積層ウェハの製造に際し、ウェハの貼り合わせ時にウェハ面に矩形のＣｕ壁を設けてシールを形成し、真空差圧法によって樹脂を注入する方法が開示されている。 For example, Patent Document 1 discloses a method of injecting a resin by a vacuum differential pressure method by forming a seal by providing a rectangular Cu wall on the wafer surface when bonding the wafers when manufacturing a laminated wafer.
図２５は、シールを用いてウェハ間の隙間に絶縁性接着材を注入する工程を説明するための図である。この注入工程では、接着剤注入装置２００は、ウェハ２０１に設けたＣｕバンプ２０２を囲むと共に、一部に入り口２０４を残してＣｕ壁２０３を形成して真空室内に置き（図２５（ａ））、真空状態において入り口２０４を絶縁性接着剤２０５に浸し（図２５（ｂ））、次いで、Ｎ2ガスをリークして真空状態を破って大気状態とし（図２５（ｃ））、ウェハの隙間に絶縁性接着剤２０５を注入させる（図２５（ｄ））。 FIG. 25 is a diagram for explaining a process of injecting an insulating adhesive into a gap between wafers using a seal. In this injection step, the adhesive injection device 200 surrounds the Cu bumps 202 provided on the wafer 201 and leaves the entrance 204 in a part to form a Cu wall 203 and place it in the vacuum chamber (FIG. 25A). In the vacuum state, the entrance 204 is immersed in the insulating adhesive 205 (FIG. 25B), and then the N 2 gas is leaked to break the vacuum state to the atmospheric state (FIG. 25C). Insulating adhesive 205 is injected into the substrate (FIG. 25D).
また、特許文献２には、積層ウェハへの樹脂の注入方法として、積層されたウェハにシールを設けることなくウェハの全周に接着剤を配し、真空差圧法によって樹脂を注入する方法が開示されている。 Patent Document 2 discloses a method of injecting a resin by a vacuum differential pressure method as a method of injecting a resin into a laminated wafer by arranging an adhesive all around the wafer without providing a seal on the laminated wafer. Has been.
図２６において、接着剤注入装置２１０は、真空チャンバ２１９内には、上治具２１２と下治具２１３からなる容器２１１と、この容器２１１を固定する上ステージ２１４と下ステージ２１５を備え、容器２１１内に積層ウェハ２２０を配置する。真空チャンバ２１９には、内部を真空状態とする真空排気装置２１６と、内部に不活性ガスを導入する不活性ガス導入部２１７と、容器２１１内に接着剤を供給する接着剤供給部２１８と接続されている。 In FIG. 26, the adhesive injection device 210 includes a container 211 composed of an upper jig 212 and a lower jig 213, and an upper stage 214 and a lower stage 215 for fixing the container 211 in a vacuum chamber 219. The laminated wafer 220 is arranged in the 211. The vacuum chamber 219 is connected to an evacuation device 216 that evacuates the interior, an inert gas introduction unit 217 that introduces an inert gas into the interior, and an adhesive supply unit 218 that supplies an adhesive into the container 211. Has been.
不活性ガスを容器２１１内に導入することによって、容器と積層ウェハとの間に圧力差を生じさせ、これによって、積層ウェハの全周から接着剤を注入する。
基板の外周部分の一部分を除いてシールを形成し、このシールを形成していない部分を注入口とし、注入口に絶縁接着剤の樹脂を接液させることによって積層した基板間の隙間に絶縁接着剤の樹脂を注入する際、注入口の接液部分には絶縁接着剤の樹脂が付着する。また、絶縁接着剤の樹脂を脱泡した際に、この脱泡時に樹脂の泡が崩壊すると、崩壊で生じた樹脂の飛沫が飛散して基板の外側表面に付着する。 A seal is formed except for a part of the outer peripheral portion of the substrate, and the portion where the seal is not formed is used as an injection port, and an insulating adhesive resin is in contact with the injection port to insulate the gap between the stacked substrates. When the agent resin is injected, the insulating adhesive resin adheres to the liquid contact portion of the injection port. Further, when the resin of the insulating adhesive is defoamed, if the foam of the resin collapses at the time of defoaming, the resin splash generated by the collapse is scattered and adheres to the outer surface of the substrate.
絶縁接着剤は、基板間の隙間に注入した後に硬化させることで基板を接合する。この絶縁接着剤を硬化する処理において、注入口部分や基板の外表面に付着した絶縁接着剤の樹脂は、絶縁接着剤の樹脂を硬化させる前の段階で除去しておく必要がある。基板の外側に絶縁接着剤の樹脂を付着したままの状態で硬化させると、基板面に凹凸が形成され、外径寸法や厚さが不均一となって寸法精度が低下するという問題がある。この基板の寸法精度の低下は、移行処理における基板の位置決め精度に影響することにもなる。 The insulating adhesive is injected into the gap between the substrates and then cured to bond the substrates. In the process of curing the insulating adhesive, it is necessary to remove the insulating adhesive resin adhering to the inlet portion and the outer surface of the substrate at a stage before the insulating adhesive resin is cured. If the insulating adhesive resin is cured on the outside of the substrate while being cured, there is a problem that irregularities are formed on the surface of the substrate, the outer diameter size and thickness are not uniform, and the dimensional accuracy is lowered. This reduction in the dimensional accuracy of the substrate also affects the positioning accuracy of the substrate in the transfer process.
基板の外側に付着した絶縁接着剤の樹脂の除去は、一般的には、例えば拭き取り材等による機械的な除去方法が考えられるが、絶縁接着剤の樹脂は概して高粘度であるため、このような機械的な除去方法では、多数の工程を必要とするという問題がある。 For the removal of the resin of the insulating adhesive adhering to the outside of the substrate, a mechanical removal method such as a wiping material is generally considered. However, since the resin of the insulating adhesive is generally highly viscous, In such a mechanical removal method, there is a problem that many steps are required.
また、基板に付着した絶縁接着剤の樹脂を除法する方法として、上記した機械的な方法の他に、薬液を用いた湿式洗浄が考えられる。しかしながら、湿式洗浄では、薬液が注入口を通して基板間の隙間に浸入し、基板間に注入した絶縁接着剤の樹脂を変質させるおそれがある。 In addition to the mechanical method described above, wet cleaning using a chemical solution is conceivable as a method for removing the insulating adhesive resin adhering to the substrate. However, in the wet cleaning, there is a possibility that the chemical solution enters the gap between the substrates through the injection port and alters the resin of the insulating adhesive injected between the substrates.
そこで、本発明は前記した従来の問題点を解決し、基板に付着した剰余の絶縁接着剤を簡易な工程で除去することを目的とし、また、基板間に注入した絶縁接着剤に薬液等が浸入することなく除去することを目的とする。 Therefore, the present invention aims to solve the above-mentioned conventional problems, and to remove the surplus insulating adhesive adhering to the substrate by a simple process. Also, the insulating adhesive injected between the substrates contains a chemical solution or the like. The purpose is to remove without intrusion.
本発明は、積層した基板間に絶縁接着剤を注入した後、この絶縁接着剤の注入に用いた注入口を封止する。このとき、基板間に注入した絶縁接着剤は硬化させない。注入口を封止した後に基板を洗浄液で洗浄し、注入口や基板の外側に付着した絶縁接着剤を除去する。この洗浄時には注入口は封止されているため、洗浄液が基板間に注入した絶縁接着剤に浸入することを防ぐことができる。余剰の絶縁接着剤を除去した後、基板間に注入した絶縁接着剤を硬化させる。 In the present invention, after injecting an insulating adhesive between the laminated substrates, the injection port used for injecting the insulating adhesive is sealed. At this time, the insulating adhesive injected between the substrates is not cured. After sealing the inlet, the substrate is washed with a cleaning solution to remove the insulating adhesive adhering to the outside of the inlet and the substrate. Since the injection port is sealed at the time of this cleaning, it is possible to prevent the cleaning liquid from entering the insulating adhesive injected between the substrates. After removing the excess insulating adhesive, the insulating adhesive injected between the substrates is cured.
注入口を封止した状態で基板の外側を洗浄液で洗浄することによって、基板間に注入した絶縁接着剤に浸入することなく余剰の絶縁接着剤を除去することができる。 By cleaning the outside of the substrate with a cleaning liquid while the inlet is sealed, excess insulating adhesive can be removed without entering the insulating adhesive injected between the substrates.
本発明は方法の態様と装置の態様とすることができる。 The present invention may be a method aspect and an apparatus aspect.
本発明の積層基板の形成方法は、少なくとも２枚の複数枚の基板を積層して積層基板を形成する積層基板の形成方法であり、積層基板は一部を除いて外周端面に外周シールが設けられている。 The method for forming a multilayer substrate according to the present invention is a method for forming a multilayer substrate by laminating at least two substrates, and the multilayer substrate is provided with an outer peripheral seal on an outer peripheral end surface except for a part. It has been.
本発明の積層基板の形成方法は、積層基板の外周シールの一部に設けられた注入口から、基板間と外周シールとで囲まれる隙間内に、真空差圧法によって絶縁接着剤を注入する注入工程と、絶縁接着剤を注入した後に注入口を封止する封止工程と、積層基板を洗浄液を用いて湿式洗浄を行う洗浄工程と、絶縁接着剤を硬化させる絶縁接着剤硬化工程とを、順に備える。 The method for forming a laminated substrate of the present invention is an injection in which an insulating adhesive is injected by a vacuum differential pressure method from an injection port provided in a part of the outer peripheral seal of the laminated substrate into a gap surrounded by the substrate and the outer peripheral seal. A process, a sealing process for sealing the injection port after injecting the insulating adhesive, a cleaning process for performing wet cleaning on the laminated substrate using a cleaning liquid, and an insulating adhesive curing process for curing the insulating adhesive. Prepare in order.
図１、２は、本発明の積層基板の形成方法を説明するためのフローチャートおよび説明図である。なお、このフローチャートでは、積層基板の外周部分に外周シールを形成する工程から説明しているが、積層基板の外周部分に外周シールが形成された状態からはじめても良い。 1 and 2 are a flowchart and an explanatory diagram for explaining a method for forming a laminated substrate according to the present invention. In this flowchart, the process of forming the outer peripheral seal on the outer peripheral portion of the multilayer substrate is described. However, the process may be started from the state in which the outer peripheral seal is formed on the outer peripheral portion of the multilayer substrate.
積層基板１０の外周部分に外周シール２８を形成する（S1）。このとき、外周部分の一部に外周シール２８を設けない部分を設け、この部分を絶縁接着剤の基板間への注入口１６とする（図２（ａ））。注入工程によって外周シール２８と基板１０間とで囲まれる空間内に絶縁接着剤４１を注入する。空間内に注入した絶縁接着剤４４を硬化させることで基板１０は接着される。この注入時において、注入前の絶縁接着剤４１を脱泡した際に、絶縁接着剤の樹脂の泡が崩壊すると、飛散した樹脂４５が基板１０の外側に付着する。また、注入口１６の付近には、絶縁接着剤４１を接液した際に付着した絶縁接着剤４６が残る（S2）。 An outer peripheral seal 28 is formed on the outer peripheral portion of the multilayer substrate 10 (S1). At this time, a part where the outer peripheral seal 28 is not provided is provided in a part of the outer peripheral part, and this part is used as the injection port 16 between the substrates of the insulating adhesive (FIG. 2A). Insulating adhesive 41 is injected into the space surrounded by the peripheral seal 28 and the substrate 10 by the injection process. The substrate 10 is bonded by curing the insulating adhesive 44 injected into the space. At the time of this injection, when the insulating adhesive 41 before injection is defoamed, if the resin foam of the insulating adhesive collapses, the scattered resin 45 adheres to the outside of the substrate 10. Further, the insulating adhesive 46 attached when the insulating adhesive 41 is wetted remains in the vicinity of the inlet 16 (S2).
絶縁接着剤４１を注入した後、封止工程によって封止シール２９を形成し、注入口１６を封止する。この封止によって、内部の絶縁接着剤４４への浸入は抑制される（S3）。 After injecting the insulating adhesive 41, a sealing seal 29 is formed by a sealing process, and the injection port 16 is sealed. By this sealing, intrusion into the internal insulating adhesive 44 is suppressed (S3).
次に、洗浄工程によって洗浄液を用いて積層基板１０の外側を湿式洗浄する。封止工程によって注入口１６は封止されているため、基板１０間に注入した絶縁接着剤４４に洗浄液が浸入することによる絶縁接着剤の変質を防ぐことができる（S4）。洗浄工程によって、積層基板の外側に付着した余剰の絶縁接着剤は除去されるため、絶縁接着剤硬化工程は基板間に注入された絶縁接着剤のみを硬化する（S5）。 Next, the outside of the laminated substrate 10 is wet-cleaned using a cleaning liquid in a cleaning process. Since the injection port 16 is sealed by the sealing process, it is possible to prevent the insulating adhesive from being deteriorated due to the cleaning liquid entering the insulating adhesive 44 injected between the substrates 10 (S4). Since the excess insulating adhesive adhered to the outside of the laminated substrate is removed by the cleaning process, the insulating adhesive curing process cures only the insulating adhesive injected between the substrates (S5).
注入口を封止する封止工程は、注入口にシール材を塗布する塗布工程と、塗布したシール材を硬化させるシール材硬化工程とを含む。塗布工程は、シール材を含浸あるは付着させたローラを注入口に接触させることにより注入口にシール材を塗布する他、ディスペンサによって塗布することができる。 The sealing process for sealing the injection port includes an application process for applying a seal material to the injection port and a seal material curing process for curing the applied seal material. In the application step, the roller impregnated with or attached to the sealing material is brought into contact with the injection port to apply the sealing material to the injection port, or can be applied by a dispenser.
シール材と絶縁接着剤とは異なる硬化特性とし、シール材の硬化特性は絶縁接着剤の硬化条件に含まれない硬化条件を有している。シール材硬化工程は、絶縁接着剤の硬化条件に含まれないシール材の硬化条件でシール材を硬化する。 The sealing material and the insulating adhesive have different curing characteristics, and the curing characteristics of the sealing material have curing conditions that are not included in the curing conditions of the insulating adhesive. In the sealing material curing step, the sealing material is cured under curing conditions of the sealing material that are not included in the curing conditions of the insulating adhesive.
シール材と絶縁接着剤とを異なる硬化特性とするものとして、例えば、シール材および絶縁接着剤を熱硬化性樹脂とする。これらの硬化特性は、シール材の硬化温度を絶縁接着剤の硬化温度よりも低温とする。シール材硬化工程において、少なくともシール材の硬化温度以上で、かつ、絶縁接着剤の硬化温度よりも低温の温度でシール材を硬化させる。一方、絶縁接着剤硬化工程において、少なくとも絶縁接着剤の硬化温度以上の温度で絶縁接着剤を硬化させる。 As what makes a sealing material and an insulating adhesive different hardening characteristics, a sealing material and an insulating adhesive are made into a thermosetting resin, for example. These curing characteristics make the curing temperature of the sealing material lower than the curing temperature of the insulating adhesive. In the sealing material curing step, the sealing material is cured at a temperature that is at least equal to or higher than the curing temperature of the sealing material and lower than the curing temperature of the insulating adhesive. On the other hand, in the insulating adhesive curing step, the insulating adhesive is cured at least at a temperature equal to or higher than the curing temperature of the insulating adhesive.
また、シール材と絶縁接着剤とを異なる硬化特性とする他のものとして、シール材を紫外線硬化樹脂とし、絶縁接着剤を熱硬化性樹脂とする。シール材硬化工程において、シール材に紫外線を照射して硬化させる。一方、絶縁接着剤硬化工程において、少なくとも絶縁接着剤の温度以上の温度で絶縁接着剤を硬化させる。 Moreover, as another thing which makes a sealing material and an insulating adhesive different hardening characteristics, let a sealing material be an ultraviolet curable resin, and let an insulating adhesive be a thermosetting resin. In the sealing material curing step, the sealing material is irradiated with ultraviolet rays and cured. On the other hand, in the insulating adhesive curing step, the insulating adhesive is cured at least at a temperature equal to or higher than the temperature of the insulating adhesive.
シール材と絶縁接着剤とを上記にように異なる硬化特性とすることにより、シール材と絶縁接着剤とを個別に硬化させることができる。 By making the sealing material and the insulating adhesive have different curing characteristics as described above, the sealing material and the insulating adhesive can be individually cured.
洗浄工程は、例えば、積層基板を洗浄液中に浸漬することで行う他に、積層基板を軸回転させ、軸回転する積層基板の面に洗浄液を滴下することで行うことができる。 The cleaning step can be performed, for example, by immersing the multilayer substrate in the cleaning liquid, or by rotating the multilayer substrate axially and dropping the cleaning liquid onto the surface of the multilayer substrate rotating axially.
また、本発明の積層基板の形成装置は、少なくとも２枚の複数枚の基板を積層して積層基板を形成する積層基板の形成装置である。本発明の積層基板の形成装置は、積層基板の一部を除いて外周端面に外周シールを形成する外周シール形成部と、積層基板の外周シールの一部に設けた注入口から、基板間と前記外周シールとで囲まれる隙間内に、真空差圧法によって絶縁接着剤を注入する注入部と、絶縁接着剤を注入した後に注入口を封止する封止シール形成部と、積層基板を洗浄液を用いて湿式洗浄を行う洗浄部と、絶縁接着剤を硬化させる絶縁接着剤硬化部とを備える。 The laminated substrate forming apparatus of the present invention is a laminated substrate forming apparatus that forms a laminated substrate by laminating at least two plural substrates. The laminated substrate forming apparatus of the present invention includes an outer peripheral seal forming portion that forms an outer peripheral seal on the outer peripheral end surface excluding a part of the laminated substrate, an inlet provided in a part of the outer peripheral seal of the laminated substrate, and between the substrates. An injection part for injecting an insulating adhesive by a vacuum differential pressure method in a gap surrounded by the outer peripheral seal, a seal seal forming part for sealing the injection port after injecting the insulating adhesive, and a cleaning liquid for the laminated substrate A cleaning unit that performs wet cleaning using the insulating adhesive, and an insulating adhesive curing unit that cures the insulating adhesive.
さらに、外周シール形成部は、積層基板の一部を除く外周端面にシール材を塗布する第１のシール塗布手段と、シール材を硬化する第１のシール材硬化手段とを有する構成とすることができる。 Furthermore, the outer peripheral seal forming part includes a first seal applying unit that applies a sealing material to an outer peripheral end surface excluding a part of the laminated substrate, and a first sealing material curing unit that cures the sealing material. Can do.
また、封止シール形成部は、注入口にシール材を塗布する第２の塗布手段と、塗布したシール材を硬化させる第２のシール材硬化手段とを含む構成とすることができる。 Further, the sealing seal forming part may include a second application unit that applies a seal material to the inlet and a second seal material curing unit that cures the applied seal material.
塗布手段は、例えば、シール材を含浸あるいは付着させたローラを有し、ローラを注入口に接触させることにより注入口にシール材を塗布する構成とする他、シール材を滴下するディスペンサの構成とすることができる。 The application means includes, for example, a roller impregnated with or adhering to a sealing material, and a configuration in which the sealing material is applied to the injection port by bringing the roller into contact with the injection port. can do.
第２のシール材硬化手段と絶縁接着剤硬化部とは異なる硬化条件で硬化させ、第２のシール材硬化手段は、絶縁接着剤の硬化条件に含まれない硬化条件で硬化させる。 The second sealing material curing means and the insulating adhesive curing portion are cured under different curing conditions, and the second sealing material curing means is cured under a curing condition that is not included in the insulating adhesive curing conditions.
シール材および絶縁接着剤として熱硬化性樹脂を用いる場合には、熱硬化の硬化条件として硬化温度を設定する。シール材の硬化温度は、絶縁接着剤の硬化温度よりも低温とする。第２のシール材硬化手段は、硬化条件として、少なくともシール材の硬化温度以上であり、かつ、絶縁接着剤の硬化温度よりも低温の温度とし、この硬化条件でシール材を硬化させる。一方、絶縁接着剤硬化部は、少なくとも絶縁接着剤の硬化温度以上の温度を硬化条件とし、この硬化条件で絶縁接着剤を硬化させる。 When a thermosetting resin is used as the sealing material and the insulating adhesive, a curing temperature is set as a curing condition for thermosetting. The curing temperature of the sealing material is lower than the curing temperature of the insulating adhesive. The second sealing material curing means cures the sealing material at a curing temperature that is at least equal to or higher than the curing temperature of the sealing material and lower than the curing temperature of the insulating adhesive. On the other hand, the insulating adhesive curing portion cures the insulating adhesive under the curing condition using at least a temperature equal to or higher than the curing temperature of the insulating adhesive.
また、シール材として紫外線硬化樹脂を用い、絶縁接着剤として熱硬化性樹脂を用いる場合には、硬化条件として紫外線と熱硬化の硬化温度を設定する。 Further, when an ultraviolet curable resin is used as the sealing material and a thermosetting resin is used as the insulating adhesive, the ultraviolet ray and the thermosetting curing temperature are set as the curing conditions.
第２のシール材硬化手段は、シール材に紫外線を照射して硬化させる。一方、絶縁接着剤硬化部は、少なくとも絶縁接着剤の温度以上の温度で絶縁接着剤を硬化させる。 The second sealing material curing means cures the sealing material by irradiating with ultraviolet rays. On the other hand, the insulating adhesive curing unit cures the insulating adhesive at a temperature at least equal to or higher than the temperature of the insulating adhesive.
洗浄部の一構成として、洗浄液を収容した容器を有する。この容器の洗浄液中に積層基板を浸漬することで基板の外側に付着した余剰の絶縁接着剤を除去する。 As a configuration of the cleaning unit, a container containing a cleaning liquid is included. By immersing the laminated substrate in the cleaning liquid of the container, excess insulating adhesive adhered to the outside of the substrate is removed.
また、洗浄部の他の構成として、積層基板を軸回転させる回転駆動手段と、積層基板の面上に洗浄液を滴下する洗浄液手段とを備える構成とすることができる。積層基板の面上に滴下された洗浄液は、回転する基板の遠心力によって面上を外周部に向かって拡がり、その間に基板面上に付着する絶縁接着剤を除去する。基板面上から除去された余剰の絶縁接着剤は、洗浄液と共に基板の外周端から放出される。 In addition, as another configuration of the cleaning unit, a configuration including rotation driving means for rotating the multilayer substrate and cleaning liquid means for dropping the cleaning liquid on the surface of the multilayer substrate can be employed. The cleaning liquid dropped on the surface of the laminated substrate spreads on the surface toward the outer peripheral portion by the centrifugal force of the rotating substrate, and the insulating adhesive adhering to the substrate surface is removed during that time. Excess insulating adhesive removed from the substrate surface is released from the outer peripheral edge of the substrate together with the cleaning liquid.
本発明によれば、基板に付着した剰余の絶縁接着剤を簡易な工程で除去することができ、また、基板間に注入した絶縁接着剤に浸入することなく除去することができる。 According to the present invention, surplus insulating adhesive adhering to the substrate can be removed by a simple process, and can be removed without entering the insulating adhesive injected between the substrates.
以下、本発明の実施の形態について、図を参照しながら詳細に説明する。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
図３は、本発明の積層基板の形成方法を説明するためのフローチャートである。なお、このフローチャートにおいても、図１のフローチャートと同様に、積層基板の外周部分に外周シールを形成する工程から説明しているが、積層基板の外周部分に外周シールが形成された状態からはじめても良い。 FIG. 3 is a flowchart for explaining the method for forming a laminated substrate of the present invention. In this flowchart, as in the flowchart of FIG. 1, the process of forming the outer periphery seal on the outer peripheral portion of the multilayer substrate is described. However, even if the outer periphery seal is formed on the outer peripheral portion of the multilayer substrate, good.
S1の外周シールの形成工程では、注入口を除く積層基板の外周部分にシール材を塗布し（S1a）、このシールを硬化させて外周シールを形成する(S1b)。S2の絶縁接着剤の注入工程では、外周シールが設けられていない注入口から、外周シールと基板１０間とで囲まれる隙間内に絶縁接着剤を注入する。 In the outer peripheral seal forming step of S1, a sealing material is applied to the outer peripheral portion of the laminated substrate excluding the injection port (S1a), and this seal is cured to form an outer peripheral seal (S1b). In the step of injecting the insulating adhesive in S2, the insulating adhesive is injected into a gap surrounded by the outer peripheral seal and the substrate 10 from the injection port where the outer peripheral seal is not provided.
S3の封止シールの形成工程では、絶縁接着剤を注入した後、注入口にシール材を塗布し(S3a)、このシール材を硬化させて封止シールを形成する。 In the step of forming a sealing seal in S3, after injecting an insulating adhesive, a sealing material is applied to the injection port (S3a), and the sealing material is cured to form a sealing seal.
S4の基板の洗浄工程では、洗浄液を用いて積層基板の外側に付着する絶縁接着剤を除去する。洗浄工程で絶縁接着剤を除去した後、S5の絶縁接着剤硬化工程によって、基板間に注入した絶縁接着剤を硬化し、積層した基板を接着する。 In the substrate cleaning step in S4, the insulating adhesive adhering to the outside of the multilayer substrate is removed using a cleaning liquid. After removing the insulating adhesive in the cleaning step, the insulating adhesive injected between the substrates is cured by the insulating adhesive curing step in S5, and the stacked substrates are bonded.
以下、S1の外周シールの形成工程、およびS3の封止シールの形成工程で行うシール材の塗布について図４〜図９を用いて説明し、S2の絶縁接着剤の注入工程を図１０〜図１２を用いて説明し、S3〜S5の封止、洗浄、および硬化の各工程について図１３〜図１５を用いて説明し、S5の洗浄工程について図１６，１７を用いて説明する。 Hereinafter, application of the sealing material performed in the forming process of the outer peripheral seal of S1 and the forming process of the sealing seal of S3 will be described with reference to FIGS. 4 to 9, and the injection process of the insulating adhesive of S2 will be described with reference to FIGS. 12, the steps of sealing, cleaning, and curing S3 to S5 will be described with reference to FIGS. 13 to 15, and the cleaning step of S5 will be described with reference to FIGS.
S1の外周シールの形成工程では積層基板の外周部分にシール材を塗布し、S3の封止シールの形成工程では積層基板の注入口にシール材を塗布する。以下、このシール材の塗布の例として、転写ロールを用いる塗布の例と、ディスペンサを用いる塗布の例について説明する。 In the outer peripheral seal forming step of S1, a sealing material is applied to the outer peripheral portion of the multilayer substrate, and in the sealing seal forming step of S3, the sealing material is applied to the inlet of the multilayer substrate. Hereinafter, as an example of application of the sealing material, an example of application using a transfer roll and an example of application using a dispenser will be described.
転写ロールを用いた塗布は、積層基板の外周端面にシール材の樹脂を浸透させた塗布ローラを接触させ、積層基板を軸回転させることによって、積層基板の外周端面を連続的にシールする。また、ディスペンサを用いた塗布は、積層基板の外周端面にディスペンサからシール材の樹脂を連続的に線引き滴下させ、積層基板を軸回転させることによって、積層基板の外周端面を連続的にシールする。 In application using the transfer roll, an outer peripheral end face of the multilayer substrate is continuously sealed by bringing a coating roller into which a sealing material resin has penetrated into contact with the outer peripheral end face of the multilayer substrate and rotating the multilayer substrate. Moreover, the application | coating using a dispenser seals the outer peripheral end surface of a laminated substrate continuously by drawing and dripping the resin of the sealing material from a dispenser to the outer peripheral end surface of a laminated substrate, and rotating a laminated substrate axially.
はじめに、転写ロールを用いたシール材の塗布構成例について、図４〜図６を用いて説明する。図４は転写ロールを用いたシール材の塗布構成例の概略斜視図であり、図５、６は転写ロールを用いたシール材の塗布動作を説明するフローチャートおよび動作図である。 First, an application configuration example of a sealing material using a transfer roll will be described with reference to FIGS. FIG. 4 is a schematic perspective view of an application configuration example of a sealing material using a transfer roll, and FIGS. 5 and 6 are a flowchart and an operation diagram illustrating an application operation of the sealing material using a transfer roll.
図４において、シール塗布部は、積層基板１０を支持すると共に、積層基板１０を軸回転させる駆動ローラ２３と従動ローラ２４を備える他、積層基板１０を下方に押圧する押さえローラ２５を備える。押さえローラ２５は、例えば押さえバネ２６によって積層基板１０を下方に押させる。なお、従動ローラ２４は駆動ローラとしてもよい。 In FIG. 4, the seal application unit includes a driving roller 23 and a driven roller 24 for supporting the laminated substrate 10 and rotating the laminated substrate 10, and a pressing roller 25 for pressing the laminated substrate 10 downward. The pressing roller 25 presses the laminated substrate 10 downward by a pressing spring 26, for example. The driven roller 24 may be a driving roller.
また、シール塗布部は、シール材の樹脂２０を保持する容器２１と、積層基板１０の外周端面１１と接触してシール材の樹脂２０を塗布する塗布ローラ２２を備える。塗布ローラ２２の一部は、容器２１内に保持されるシール材の樹脂２０に漬すことによって、ローラ面にシール材の樹脂を含浸あるいは付着させ、このシール材を積層基板１０の外周端面１１に付着させる転写ローラの役を成している。 In addition, the seal application unit includes a container 21 that holds the resin 20 of the sealing material, and an application roller 22 that contacts the outer peripheral end surface 11 of the laminated substrate 10 and applies the resin 20 of the sealing material. A part of the application roller 22 is immersed in a sealing resin 20 held in the container 21 so that the roller surface is impregnated with or adhered to the sealing material, and this sealing material is attached to the outer peripheral end surface 11 of the laminated substrate 10. It serves as a transfer roller that adheres to the surface.
シール塗布部は、駆動ローラ２３、従動ローラ２４、および押さえローラ２５によって積層基板１０を回転させると共に、積層基板１０の外周端面１１の一部に塗布ローラ２２を押し当てる。塗布ローラ２２のローラ面には、シール材の樹脂が含浸あるいは付着されているため、塗布ローラ２２を積層基板１０の外周端面１１の接触させることによって、シール材の樹脂はローラ面上から外周端面１１に転写され、外周端面１１には樹脂が塗布される。 The seal application unit rotates the laminated substrate 10 by the driving roller 23, the driven roller 24, and the pressing roller 25, and presses the application roller 22 against a part of the outer peripheral end surface 11 of the laminated substrate 10. Since the roller surface of the application roller 22 is impregnated or adhered with the resin of the sealing material, the resin of the sealing material is removed from the roller surface to the outer peripheral end surface by bringing the application roller 22 into contact with the outer peripheral end surface 11 of the laminated substrate 10. 11 and the outer peripheral end face 11 is coated with resin.
なお、塗布ローラ２２の外周面にスクレーバ２７を当接することによって、ローラ面に余剰に付着した樹脂を取り除き、積層基板１０の外周端面１１と接触する塗布面での樹脂量を一定に保持させることができる。 The scraper 27 is brought into contact with the outer peripheral surface of the application roller 22 to remove excess resin adhering to the roller surface and to keep the amount of resin on the application surface in contact with the outer peripheral end surface 11 of the laminated substrate 10 constant. Can do.
次に、第１の構成例によるシール材に樹脂の塗布動作について、図５のフローチャートおよび図６の動作を説明する図を用いて説明する。 Next, the operation of applying the resin to the sealing material according to the first configuration example will be described with reference to the flowchart of FIG. 5 and the diagram illustrating the operation of FIG.
積層基板１０をシール塗布部に取り付ける（図６（ａ））（S11）。積層基板１０の外周端面１１に設けるシールは、真空差圧法による圧力差によって基板間の隙間に絶縁接着剤を注入するために基板の外周部分を囲む外周シールを構成する部材である。この外周シールは、この囲み部分を形成するために、シール材の樹脂を塗布する部分（塗布範囲１２）と、接着剤を内部に注入する注入口１６を形成するために、シール材の樹脂を塗布しない部分（塗布除外範囲１３）とを備える。塗布ローラ２２を図示していない上昇機構によって上昇させて、積層基板１０の外周部分の任意の開始点２８ａに接触させる。図６（ｂ）は上昇前の状態を示し、図６（ｃ）は上昇後の状態を示している(S12)。 The laminated substrate 10 is attached to the seal application part (FIG. 6A) (S11). The seal provided on the outer peripheral end face 11 of the laminated substrate 10 is a member that constitutes an outer peripheral seal that surrounds the outer peripheral portion of the substrate in order to inject an insulating adhesive into the gap between the substrates by a pressure difference by a vacuum differential pressure method. In order to form the enclosed portion, the outer peripheral seal is formed by applying a resin of the sealing material to form a portion where the resin of the sealing material is applied (application range 12) and an injection port 16 for injecting the adhesive into the inside. A portion not to be applied (application exclusion range 13). The application roller 22 is lifted by a lifting mechanism (not shown), and is brought into contact with an arbitrary starting point 28 a on the outer peripheral portion of the laminated substrate 10. FIG. 6B shows a state before the ascent, and FIG. 6C shows a state after the ascent (S12).
塗布ローラ２２を積層基板１０の開始点２８ａに接触させた後、駆動ローラ２３によって積層基板１０を回転させ、シール材の樹脂２０を塗布ローラ２２から積層基板１０の外周端面１１に転写させる。図６（ｄ）は、塗布ローラ２２から積層基板１０の外周端面１１にシール材の樹脂２０を転写する途中状態を示している(S13)。 After the coating roller 22 is brought into contact with the starting point 28 a of the multilayer substrate 10, the multilayer substrate 10 is rotated by the driving roller 23, and the sealing resin 20 is transferred from the coating roller 22 to the outer peripheral end surface 11 of the multilayer substrate 10. FIG. 6D shows a state in the middle of transferring the resin 20 as the sealing material from the application roller 22 to the outer peripheral end face 11 of the laminated substrate 10 (S13).
積層基板１０を回転させながら樹脂２０を所定位置まで塗布する。図６（ｅ）は、積層基板１０を終点２８ｂまで所定角度回転させた状態を示している。これによって、積層基板１０の外周端面１１において、塗布範囲１２にはシール材の樹脂２０が塗布され、塗布除外範囲にはシール材の樹脂２０は塗布されない(S14)。 The resin 20 is applied to a predetermined position while rotating the laminated substrate 10. FIG. 6E shows a state in which the laminated substrate 10 is rotated by a predetermined angle to the end point 28b. As a result, on the outer peripheral end face 11 of the multilayer substrate 10, the sealing material resin 20 is applied to the application range 12, and the sealing material resin 20 is not applied to the application exclusion range (S14).
樹脂２０を塗布した後、図示しない昇降機構によって、塗布ローラ２２を積層基板１０の外周端面１１から移動して、塗布ローラ２２を積層基板１０の外周端面１１から切り離す（S15）。 After the resin 20 is applied, the application roller 22 is moved from the outer peripheral end surface 11 of the multilayer substrate 10 by an elevator mechanism (not shown), and the application roller 22 is separated from the outer peripheral end surface 11 of the multilayer substrate 10 (S15).
シール塗布部において、積層基板１０の外周端面１１にシール材の樹脂を塗布した後、積層基板１０を硬化部に移動させる。硬化部において、積層基板１０に塗布した樹脂を硬化させる。この樹脂の硬化は、例えば樹脂が紫外線硬化性樹脂である場合には紫外線を照射することで硬化させ、また、樹脂が熱硬化性樹脂である場合には硬化温度に加熱することで硬化させる(S16)。シール材の樹脂を硬化させた後、積層基板をシール形成装置から取り出し(S17)、その後、積層基板の基板間の隙間に絶縁接着剤を注入して基板どうしを接着させる。 In the seal application part, after the resin of the sealing material is applied to the outer peripheral end face 11 of the multilayer substrate 10, the multilayer substrate 10 is moved to the curing part. In the curing unit, the resin applied to the laminated substrate 10 is cured. For example, when the resin is an ultraviolet curable resin, the resin is cured by irradiation with ultraviolet rays, and when the resin is a thermosetting resin, the resin is cured by heating to a curing temperature ( S16). After the resin of the sealing material is cured, the laminated substrate is taken out from the seal forming device (S17), and then an insulating adhesive is injected into the gap between the laminated substrates to bond the substrates together.
次に、ディスペンサを用いたシール材の塗布構成例について、図７〜図９を用いて説明する。図７はディスペンサを用いたシール材の塗布構成例の概略斜視図であり、図８、９はディスペンサを用いたシール材の塗布動作を説明するフローチャートおよび動作図である。 Next, an application configuration example of a sealing material using a dispenser will be described with reference to FIGS. FIG. 7 is a schematic perspective view of a sealing material application configuration example using a dispenser, and FIGS. 8 and 9 are a flowchart and an operation diagram for explaining a sealing material application operation using a dispenser.
図７において、シール塗布部は、積層基板１０を支持すると共に、積層基板１０を軸回転させる駆動ローラ２３、従動ローラ２４および押えローラ２５を備える。また、シール塗布部は、積層基板１０の外周端面１１にシール材の樹脂を線引き滴下するディスペンサ３０を備える。 In FIG. 7, the seal application unit includes a driving roller 23, a driven roller 24, and a pressing roller 25 that support the laminated substrate 10 and rotate the laminated substrate 10. In addition, the seal application unit includes a dispenser 30 that draws and drops the resin of the seal material on the outer peripheral end surface 11 of the laminated substrate 10.
シール塗布部は、ディスペンサ３０から積層基板１０の外周端面１１にシール材の樹脂を滴下させ、この状態で駆動ローラ２３、従動ローラ２４によって積層基板１０を回転させることによって、外周端面１１にシール材の樹脂を線引きする。これによって、外周端面１１には樹脂が連続して塗布される。 The seal application unit drops the resin of the sealing material from the dispenser 30 onto the outer peripheral end surface 11 of the laminated substrate 10, and rotates the laminated substrate 10 by the driving roller 23 and the driven roller 24 in this state, whereby the sealing material is applied to the outer peripheral end surface 11. Draw the resin. As a result, the resin is continuously applied to the outer peripheral end face 11.
次に、ディスペンサを用いた構成例によるシール材に樹脂の塗布動作について、図８のフローチャートおよび図９の動作を説明する図を用いて説明する。 Next, an operation of applying a resin to a sealing material according to a configuration example using a dispenser will be described with reference to a flowchart of FIG. 8 and a diagram illustrating the operation of FIG.
はじめに、積層基板１０をシール塗布部に取り付ける（図９（ａ））（S21）。積層基板１０の外周端面１１に設けるシールは、真空差圧法による圧力差によってウェハ間の隙間に絶縁接着剤を注入するためにウェハの外周部分を囲む構成部材である。このシールは、この囲み部分を形成するために、シール材の樹脂を塗布する部分（塗布範囲１２）と、絶縁接着剤を内部に注入する注入口１６を形成するために、シール材の樹脂を塗布しない部分（塗布除外範囲１３）とを備える。 First, the laminated substrate 10 is attached to the seal application part (FIG. 9A) (S21). The seal provided on the outer peripheral end surface 11 of the multilayer substrate 10 is a component that surrounds the outer peripheral portion of the wafer in order to inject the insulating adhesive into the gap between the wafers by a pressure difference by a vacuum differential pressure method. In order to form the enclosed portion, this seal is formed by applying a resin for the sealing material in order to form a portion for applying the resin for the sealing material (application range 12) and an injection port 16 for injecting an insulating adhesive into the inside. A portion not to be applied (application exclusion range 13).
ディスペンサ３０を図示していない上昇機構によって下降させて、積層基板１０の任意の開始点２８ａに接触させる。図９（ｂ）は下降前の状態を示し、図９（ｃ）は下降後の状態を示している(S22)。 The dispenser 30 is lowered by a raising mechanism (not shown) and brought into contact with an arbitrary starting point 28a of the laminated substrate 10. FIG. 9B shows a state before the lowering, and FIG. 9C shows a state after the lowering (S22).
ディスペンサ３０を積層基板１０の開始点２８ａに接触させた後、ディスペンサ３０からシール材の樹脂の吐出を開始し(S23)、ディスペンサ３０を積層基板１０から離す。樹脂は粘度を有しているため、樹脂は、糸を引くようにして積層基板１０の外周端面１１に繋がっている(S24)。 After the dispenser 30 is brought into contact with the starting point 28a of the multilayer substrate 10, discharge of the sealing material resin from the dispenser 30 is started (S23), and the dispenser 30 is separated from the multilayer substrate 10. Since the resin has a viscosity, the resin is connected to the outer peripheral end surface 11 of the laminated substrate 10 so as to pull a thread (S24).
ディスペンサ３０の吐出口から樹脂を吐出されながら、駆動ローラ２３によって積層基板０を回転させると、外周端面１１には樹脂が線引き滴下される。図９（ｄ）は、ディスペンサ３０から積層基板１０の外周端面１１にシール材の樹脂２０を線引き滴下する途中状態を示している(S25)。 When the laminated substrate 0 is rotated by the drive roller 23 while the resin is being discharged from the discharge port of the dispenser 30, the resin is drawn and dripped onto the outer peripheral end surface 11. FIG. 9D shows a state in which the resin 20 as the sealing material is drawn and dropped from the dispenser 30 onto the outer peripheral end surface 11 of the multilayer substrate 10 (S25).
積層基板１０を回転させながら樹脂２０を所定位置まで塗布する。図９（ｅ）は、積層基板１０を終点２８ｂまで所定角度回転させた状態を示している。これによって、積層基板１０の外周端面１１において、塗布範囲１２にシール材の樹脂２０が塗布され、塗布除外範囲にはシール材の樹脂２０は塗布されない(S26)。 The resin 20 is applied to a predetermined position while rotating the laminated substrate 10. FIG. 9E shows a state in which the laminated substrate 10 is rotated by a predetermined angle to the end point 28b. As a result, on the outer peripheral end face 11 of the laminated substrate 10, the sealing material resin 20 is applied to the application range 12, and the sealing material resin 20 is not applied to the application exclusion range (S26).
樹脂２０を塗布した後、図示しない昇降機構によって、ディスペンサ３０を積層基板１０の外周端面１１から移動させて、ディスペンサ３０を積層基板１０の外周端面１１に一端接触させ（図９（ｅ））(S27)、ディスペンサ３０からの樹脂の吐出を停止した後(S28)、切り離す（図９（ｆ））。ディスペンサ３０を一端接触させた後に、ディスペンサ３０を遠ざけて切り離すことによって、樹脂の終点位置２８ｂを位置決めすることができる（S29）。 After the resin 20 is applied, the dispenser 30 is moved from the outer peripheral end surface 11 of the multilayer substrate 10 by an elevating mechanism (not shown), and the dispenser 30 is brought into contact with the outer peripheral end surface 11 of the multilayer substrate 10 (FIG. 9 (e)) S27) After stopping the discharge of the resin from the dispenser 30 (S28), it is cut off (FIG. 9F). After bringing the dispenser 30 into contact with one end, the end point position 28b of the resin can be positioned by separating the dispenser 30 away (S29).
シール塗布部において、積層基板１０の外周端面１１にシール材の樹脂を塗布した後、積層基板１０を硬化部に移動させる。硬化部において、積層基板１０に塗布した樹脂を硬化させる。この樹脂の硬化は、例えば樹脂が紫外線硬化性樹脂である場合には紫外線を照射することで硬化させ、また、樹脂が熱硬化性樹脂である場合には加熱することで硬化させる(S30)。シール材の樹脂を硬化させた後、積層基板をシール形成装置から取り出し(S31)、その後、積層基板の基板間の隙間に絶縁接着剤を注入して基板を接着させる。 In the seal application part, after the resin of the sealing material is applied to the outer peripheral end face 11 of the multilayer substrate 10, the multilayer substrate 10 is moved to the curing part. In the curing unit, the resin applied to the laminated substrate 10 is cured. For example, when the resin is an ultraviolet curable resin, the resin is cured by irradiation with ultraviolet rays, and when the resin is a thermosetting resin, the resin is cured by heating (S30). After the resin of the sealing material is cured, the laminated substrate is taken out from the seal forming device (S31), and then an insulating adhesive is injected into the gap between the laminated substrates to adhere the substrates.
次に、接着剤注入部の構成例について説明する。図１０は接着剤注入部の構成例の概略斜視図である。 Next, a configuration example of the adhesive injection part will be described. FIG. 10 is a schematic perspective view of a configuration example of the adhesive injection portion.
図１０において、接着剤注入部は、カセット１００に保持された積層基板１０を導入し、積層基板１０の基板１０ａ，１０ｂ間に絶縁接着剤を注入する。積層基板１０は、カセット１００内に注入口を下方位置に位置あわせた状態で接着剤注入室内に取り付けられる。接着剤注入部は、積層基板１０の注入口と接液して絶縁接着剤を注入するために、絶縁接着剤４１の絶縁樹脂を保持する容器４２を備える。接着剤注入室は、内部を真空に減圧する真空ポンプと、内部を大気圧に戻すあるいは加圧するためにガスを導入するガス導入部を備える。 In FIG. 10, the adhesive injection unit introduces the laminated substrate 10 held in the cassette 100 and injects an insulating adhesive between the substrates 10 a and 10 b of the laminated substrate 10. The laminated substrate 10 is mounted in the adhesive injection chamber in a state where the injection port is positioned at a lower position in the cassette 100. The adhesive injection part includes a container 42 that holds the insulating resin of the insulating adhesive 41 in order to inject the insulating adhesive in contact with the injection port of the laminated substrate 10. The adhesive injection chamber includes a vacuum pump that depressurizes the inside to a vacuum, and a gas introduction unit that introduces a gas to return the interior to atmospheric pressure or pressurize it.
容器４２は昇降部（図示していない）によって上下動自在である。容器４２を上昇させることによって、絶縁接着剤４１を積層基板１０の注入口１６に接液させることができ、一方、容器４２を下降させることによって、絶縁接着剤４１を積層基板１０の注入口から離すことができる。 The container 42 can be moved up and down by an elevating part (not shown). By raising the container 42, the insulating adhesive 41 can be brought into contact with the inlet 16 of the laminated substrate 10, while by lowering the container 42, the insulating adhesive 41 is removed from the inlet of the laminated substrate 10. Can be released.
次に、絶縁接着剤の樹脂の注入動作について、図１１のフローチャート、および図１２の注入動作を説明するための図を用いて説明する。 Next, the operation of injecting the resin of the insulating adhesive will be described with reference to the flowchart of FIG. 11 and the drawing for explaining the injection operation of FIG.
はじめに真空ポンプによって接着剤注入室内を真空に排気する(S41)。外周端面にシールを形成した積層基板１０を接着剤注入室内に導入し(S42)、接着剤注入室内でカセット１００を位置決めすることによって積層基板１０の位置決めを行う（図１２（ａ））(S43)。 First, the adhesive injection chamber is evacuated to a vacuum by a vacuum pump (S41). The laminated substrate 10 having a seal formed on the outer peripheral end face is introduced into the adhesive injection chamber (S42), and the cassette 100 is positioned in the adhesive injection chamber to position the laminated substrate 10 (FIG. 12A) (S43). ).
真空状態の接着剤注入室内に導入された積層基板１０は、積層基板１０の基板間の隙間も真空状態となっている。昇降部４３を駆動して容器４２を上昇させ、積層基板１０の注入口１６に絶縁接着剤４１の液を接液させる（図１２（ｂ））（S44） In the laminated substrate 10 introduced into the adhesive injection chamber in a vacuum state, the gap between the laminated substrates 10 is also in a vacuum state. The raising / lowering unit 43 is driven to raise the container 42, and the liquid of the insulating adhesive 41 is brought into contact with the injection port 16 of the laminated substrate 10 (FIG. 12B) (S44).
その後、ガス導入部（図示していない）によって接着剤注入室内にＮ2ガスを導入し、接着剤注入室内の圧力を、大気圧あるいは大気圧以上の圧力に高める。このガス導入による容器内の圧力上昇によって、積層基板１０の内外に圧力差を生じさせる。この圧力差によって、絶縁接着剤４１の樹脂は積層基板１０の基板間の隙間に浸透し、絶縁接着剤の注入を行うことができる。このとき、絶縁接着剤４１を加熱して粘性を下げることによって、絶縁接着剤４１の注入を容易とすることができる（図１２（ｃ））(S45)。 Thereafter, N 2 gas is introduced into the adhesive injection chamber by a gas introduction unit (not shown), and the pressure in the adhesive injection chamber is increased to atmospheric pressure or a pressure higher than atmospheric pressure. A pressure difference is caused between the inside and outside of the laminated substrate 10 by the pressure increase in the container due to the gas introduction. Due to this pressure difference, the resin of the insulating adhesive 41 penetrates into the gaps between the substrates of the laminated substrate 10, and the insulating adhesive can be injected. At this time, the insulating adhesive 41 can be easily injected by heating the insulating adhesive 41 to lower the viscosity (FIG. 12 (c)) (S45).
絶縁接着剤４１の注入が完了した後、昇降部を駆動して容器を下降させ、絶縁接着剤４１を積層基板０の注入口１６から離す（S46）。 After the injection of the insulating adhesive 41 is completed, the lift is driven to lower the container, and the insulating adhesive 41 is separated from the injection port 16 of the laminated substrate 0 (S46).
次に、S3〜S5の封止、洗浄、および硬化の各工程において、封止用のシール材を先に硬化させ、次に絶縁接着剤を硬化させるための手順について、図１３〜図１５を用いて説明する。 Next, in each step of sealing, cleaning, and curing of S3 to S5, a procedure for curing the sealing material for sealing first and then curing the insulating adhesive is shown in FIGS. It explains using.
図１３（ａ）は封止用のシール材と絶縁接着剤とが共に熱硬化性樹脂である場合を示し、図１３（ｂ）は封止用のシール材は紫外線硬化樹脂であり、絶縁接着剤は熱硬化性樹脂である場合を示している。図１４は図１３（ａ）の場合のフローチャートを示し、図１５は図１３（ｂ）の場合のフローチャートを示している。 FIG. 13 (a) shows a case where both the sealing material for sealing and the insulating adhesive are thermosetting resins, and FIG. 13 (b) shows that the sealing material for sealing is an ultraviolet curable resin, which is an insulating adhesive. The case where the agent is a thermosetting resin is shown. FIG. 14 shows a flowchart in the case of FIG. 13A, and FIG. 15 shows a flowchart in the case of FIG.
封止用のシール材と絶縁接着剤とが共に熱硬化性樹脂である場合、加熱することによって封止用のシール材を硬化させたとき絶縁接着剤も同時に硬化してしまい、剰余の絶縁接着剤を除去することが困難となる。 When the sealing material for sealing and the insulating adhesive are both thermosetting resins, when the sealing material for sealing is cured by heating, the insulating adhesive is also cured at the same time, and the remaining insulating adhesive It becomes difficult to remove the agent.
そこで、封止用のシール材と絶縁接着剤とが共に熱硬化性樹脂である場合には、封止用のシール材の硬化温度と熱硬化性樹脂の硬化温度とを異ならせることによって、封止用のシール材を熱硬化した際に、絶縁接着剤が熱硬化しないようにする。より詳細には、封止用のシール材の硬化温度を熱硬化性樹脂の硬化温度よりも低温とし、シール材硬化工程には、シール材の硬化温度以上であって、かつ、絶縁接着剤の硬化温度よりも低温の温度に加熱することでシール材を硬化させ、その後の絶縁接着剤硬化工程において、絶縁接着剤の硬化温度以上の温度に加熱することで絶縁接着剤を硬化させる。 Therefore, when the sealing material for sealing and the insulating adhesive are both thermosetting resins, the sealing temperature is made different from the curing temperature of the sealing material for sealing and the curing temperature of the thermosetting resin. When the sealing material for fixing is thermally cured, the insulating adhesive is prevented from being thermally cured. More specifically, the curing temperature of the sealing material for sealing is set to be lower than the curing temperature of the thermosetting resin, and the sealing material curing step is performed at a temperature equal to or higher than the curing temperature of the sealing material and of the insulating adhesive. The sealing material is cured by heating to a temperature lower than the curing temperature, and the insulating adhesive is cured by heating to a temperature equal to or higher than the curing temperature of the insulating adhesive in the subsequent insulating adhesive curing step.
はじめに、積層基板の注入口から基板間の隙間内に絶縁接着剤を注入する（図１３（ａ）中の１）(S51)。 First, an insulating adhesive is injected from the inlet of the laminated substrate into the gap between the substrates (1 in FIG. 13A) (S51).
シール材の硬化温度Ｔ１以上であって絶縁接着剤の硬化温度Ｔ２よりも低い温度まで加熱する。この加熱によって、絶縁接着剤を硬化することなくシール材のみを硬化することができる。これによって、積層基板の注入口は封止シールによって封止される（図１３（ａ）中の２）(S52)。 The sealing material is heated to a temperature not lower than the curing temperature T1 and lower than the curing temperature T2 of the insulating adhesive. By this heating, only the sealing material can be cured without curing the insulating adhesive. As a result, the inlet of the laminated substrate is sealed by the sealing seal (2 in FIG. 13A) (S52).
次に、基板を洗浄する。この洗浄時には、注入口は封止シールでふさがれているため、基板間に注入した絶縁接着剤に洗浄液が侵入することはない（図１３（ａ）中の３）(S53)。基板を洗浄して余剰の絶縁接着剤を除去した後、絶縁接着剤の硬化温度Ｔ２以上まで加熱する。この加熱によって絶縁接着剤は硬化され、基板は接着される（図１３（ａ）中の４）(S54)。 Next, the substrate is cleaned. At the time of this cleaning, since the injection port is blocked by the sealing seal, the cleaning liquid does not enter the insulating adhesive injected between the substrates (3 in FIG. 13A) (S53). After the substrate is washed to remove the excess insulating adhesive, the substrate is heated to a curing temperature T2 or higher of the insulating adhesive. The insulating adhesive is cured by this heating, and the substrate is bonded (4 in FIG. 13A) (S54).
封止用のシール材が紫外線硬化性樹脂であり、絶縁接着剤が熱硬化性樹脂である場合には、硬化条件が一方は紫外線照射であり、他方は加熱であるため、それぞれ個別の硬化条件を適用することによって、封止用のシール材を熱硬化した際に、絶縁接着剤が熱硬化しないようにする。シール材硬化工程には、シール材に紫外線を照射することによりシール材を硬化させ、その後の絶縁接着剤硬化工程において、絶縁接着剤の硬化温度以上の温度に加熱することで絶縁接着剤を硬化させる。 When the sealing material for sealing is an ultraviolet curable resin and the insulating adhesive is a thermosetting resin, the curing condition is one of ultraviolet irradiation and the other is heating. Is applied to prevent the insulating adhesive from being thermally cured when the sealing material for sealing is thermally cured. In the sealing material curing process, the sealing material is cured by irradiating the sealing material with ultraviolet rays, and in the subsequent insulating adhesive curing process, the insulating adhesive is cured by heating to a temperature equal to or higher than the curing temperature of the insulating adhesive. Let
はじめに、積層基板の注入口から基板間の隙間内に絶縁接着剤を注入する（図１３（ｂ）中の１）(S61)。 First, an insulating adhesive is injected from the inlet of the laminated substrate into the gap between the substrates (1 in FIG. 13B) (S61).
シール材に紫外線を照射する。この紫外線照射によって、絶縁接着剤を硬化することなくシール材のみを硬化することができる。これによって、積層基板の注入口は封止シールによって封止される（図１３（ｂ）中の２）(S62)。 Irradiate the sealing material with ultraviolet light. By this ultraviolet irradiation, only the sealing material can be cured without curing the insulating adhesive. Thereby, the inlet of the laminated substrate is sealed with a sealing seal (2 in FIG. 13B) (S62).
次に、基板を洗浄する。この洗浄時には、注入口は封止シールでふさがれているため、基板間に注入した絶縁接着剤に洗浄液が侵入することはない（図１３（ｂ）中の３）(S63)。基板を洗浄して余剰の絶縁接着剤を除去した後、絶縁接着剤の硬化温度Ｔ２以上まで加熱する。この加熱によって絶縁接着剤は硬化され、基板は接着される（図１３（ｂ）中の４）(S64)。 Next, the substrate is cleaned. At the time of this cleaning, since the injection port is blocked by the sealing seal, the cleaning liquid does not enter the insulating adhesive injected between the substrates (3 in FIG. 13B) (S63). After the substrate is washed to remove the excess insulating adhesive, the substrate is heated to a curing temperature T2 or higher of the insulating adhesive. By this heating, the insulating adhesive is cured and the substrate is bonded (4 in FIG. 13B) (S64).
次に、S5の洗浄工程について図１６，１７を用いて説明する。ここでは、２つの洗浄形態について説明する。 Next, the cleaning process of S5 will be described with reference to FIGS. Here, two cleaning modes will be described.
第１の洗浄の形態は、積層基板を洗浄液中に浸漬するものである。図１６は第１の洗浄の形態を説明するための図である。 In the first cleaning mode, the laminated substrate is immersed in a cleaning liquid. FIG. 16 is a diagram for explaining the first cleaning mode.
洗浄槽５０に洗浄液を貯めておき、この洗浄液中に積層基板１０を浸漬することで、積層基板１０の外側に付着する絶縁接着剤を除去する。このとき、積層基板１０を揺動させることで、洗浄効率を高めることができる。積層基板１０は、基板カセット１００に保持した状態で、基板カセット１００と共に洗浄液内に浸漬することができる。洗浄液は、例えば界面活性剤を用いることができる。 A cleaning liquid is stored in the cleaning tank 50, and the insulating substrate attached to the outside of the multilayer substrate 10 is removed by immersing the multilayer substrate 10 in the cleaning liquid. At this time, the cleaning efficiency can be increased by swinging the laminated substrate 10. The laminated substrate 10 can be immersed in the cleaning liquid together with the substrate cassette 100 while being held in the substrate cassette 100. As the cleaning liquid, for example, a surfactant can be used.
第２の洗浄の形態は、遠心力を利用して積層基板上に洗浄液を拡散させるものである。図１７は第２の洗浄の形態を説明するための図である。 In the second cleaning mode, the cleaning liquid is diffused on the laminated substrate using centrifugal force. FIG. 17 is a diagram for explaining the second cleaning mode.
容器５２内において、積層基板１０をモータ５３によって軸回転自在とし、この積層基板１０上に洗浄液５１を滴下させる構成である。回転中の積層基板１０に面上に洗浄液５１を滴下させると、洗浄液５１は回転する基板と接触することで遠心力を受け、積層基板１０の外周端方向に向かって移動し、基板面上に拡散する。これによって、基板面上に付着した絶縁接着剤は洗浄液によって除去される。また、注入口の近傍に付着した絶縁接着剤についても、洗浄液によって除去される。この第２の形態によれば、洗浄液の消費量を低減させることができる。 In the container 52, the laminated substrate 10 is axially rotatable by a motor 53, and the cleaning liquid 51 is dropped onto the laminated substrate 10. When the cleaning liquid 51 is dropped onto the rotating laminated substrate 10 on the surface, the cleaning liquid 51 receives a centrifugal force by coming into contact with the rotating substrate, moves toward the outer peripheral edge of the laminated substrate 10, and moves onto the substrate surface. Spread. Thereby, the insulating adhesive adhering to the substrate surface is removed by the cleaning liquid. Moreover, the insulating adhesive adhering to the vicinity of the inlet is also removed by the cleaning liquid. According to the second embodiment, the consumption of the cleaning liquid can be reduced.
上記した第１の洗浄形態では、洗浄液内に積層基板の全体を浸漬しているが、積層基板の一部を接液させた状態で積層基板を回転させる構成としてもよい。 In the first cleaning mode described above, the entire laminated substrate is immersed in the cleaning liquid. However, the laminated substrate may be rotated while a part of the laminated substrate is in contact with the liquid.
次に、図１８〜図２４を用いて本発明の積層基板の形成装置の構成例について説明する。積層基板形成装置は、積層基板の外周端面にシールを形成する外周シール形成工程を行う部分と、外周シールを形成した積層基板の基板間の隙間に絶縁接着剤を注入する注入工程を行う部分と、外周シールの一部に設けた注入口を封止する封止シール形成工程を行う部分と、基板の外側を洗浄する洗浄工程を行う部分と、積層基板の基板を接着するために絶縁接着剤を硬化させる硬化工程を行う部分とを備える。 Next, a configuration example of the laminated substrate forming apparatus of the present invention will be described with reference to FIGS. The laminated substrate forming apparatus includes a portion for performing an outer periphery seal forming step for forming a seal on the outer peripheral end surface of the laminated substrate, and a portion for performing an injection step for injecting an insulating adhesive into a gap between the substrates of the laminated substrate on which the outer peripheral seal is formed. Insulating adhesive for adhering a portion of the sealing seal forming step for sealing the injection port provided in a part of the outer peripheral seal, a portion for performing a cleaning step of cleaning the outside of the substrate, and the substrate of the laminated substrate And a portion for performing a curing step of curing the material.
図１８は、積層基板を形成する構成例の概略を説明するための概略図である。図１８に示す構成例は、外周シール形成工程、絶縁接着剤の注入工程、封止シールの形成工程、洗浄工程、および絶縁接着剤の硬化工程の各工程に対応する部位をライン状に配置したインライン形式の例を示している。 FIG. 18 is a schematic diagram for explaining an outline of a configuration example for forming a laminated substrate. In the configuration example shown in FIG. 18, portions corresponding to the respective steps of the outer peripheral seal forming step, the insulating adhesive injection step, the sealing seal forming step, the cleaning step, and the insulating adhesive curing step are arranged in a line. An example of inline format is shown.
外周シール形成工程は第１シール材塗布部２Ａと第１シール材硬化部３Ａによって行われ、絶縁接着剤の注入工程は注入部４によって行われ、封止シールの形成工程は第２シール材塗布部２Ｂと第２シール材硬化部３Ｂによって行われ、洗浄工程は洗浄部５によって行われ、硬化工程は硬化部６によって行われる。各部は仕切弁を介して連接されるチャンバによって構成される。 The outer peripheral seal forming process is performed by the first sealing material application part 2A and the first sealing material curing part 3A, the insulating adhesive injection process is performed by the injection part 4, and the sealing seal forming process is performed by the second sealing material application process. The cleaning process is performed by the cleaning unit 5, and the curing process is performed by the curing unit 6. Each part is constituted by a chamber connected via a gate valve.
第１シール材塗布部２Ａは、シール材塗布室２Aａ内にシール材２Abを貯めた容器を昇降部２Aｃによって昇降自在に備える。仕切弁を通して積層基板１０を基板カセット１００と共にシール材塗布室２Aａ内に導入し、導入した積層基板１０の外周端面にシール材の樹脂を塗布する。 The first sealing material application unit 2A includes a container in which the sealing material 2Ab is stored in the sealing material application chamber 2Aa so as to be movable up and down by the lifting unit 2Ac. The laminated substrate 10 is introduced into the sealing material application chamber 2Aa together with the substrate cassette 100 through the gate valve, and a sealing material resin is applied to the outer peripheral end face of the introduced laminated substrate 10.
第１シール材硬化部３Ａは、第１シール材硬化室３Aａ内にシール材を硬化させる硬化装置３Aｂを備える。硬化装置３Abは、シール材が熱硬化性樹脂である場合には加熱装置とし、シール材が紫外線硬化性樹脂である場合には紫外線照射装置とすることができる。積層基板１０を基板カセット１００と共に、仕切弁を通してシール材塗布室２Aａから第１シール材硬化室３Aａ内に導入し、導入した積層基板１０の外周端面に塗布したシール材を硬化して外周シールを形成する。 The first sealing material curing unit 3A includes a curing device 3Ab that cures the sealing material in the first sealing material curing chamber 3Aa. The curing device 3Ab can be a heating device when the sealing material is a thermosetting resin, and can be an ultraviolet irradiation device when the sealing material is an ultraviolet curable resin. The laminated substrate 10 is introduced into the first sealant curing chamber 3Aa from the sealant application chamber 2Aa through the gate valve together with the substrate cassette 100, and the sealant applied to the outer peripheral end surface of the introduced laminated substrate 10 is cured to provide an outer peripheral seal. Form.
注入部４は、注入室４ａ内に絶縁接着剤４ｂを貯めた容器を昇降部４ｃによって昇降自在に備える。注入部４は、注入室４ａを真空排気する真空ポンプ４ｄ、注入室４ａを大気に戻すためにＮ2ガス等のガスを導入するガス導入部４ｅを備える。注入部４は、真空ポンプ４ｄの真空排気による真空状態と、ガス導入部４ｅのガス導入による大気圧あるいは大気圧を越える圧力による圧力状態との圧力差を利用した真空差圧法によって、積層基板１０の基板間の隙間に絶縁接着剤を導入する。 The injection unit 4 includes a container in which the insulating adhesive 4b is stored in the injection chamber 4a so that the container can be moved up and down by the lifting unit 4c. The injection unit 4 includes a vacuum pump 4d that evacuates the injection chamber 4a, and a gas introduction unit 4e that introduces a gas such as N 2 gas to return the injection chamber 4a to the atmosphere. The injection part 4 is formed by a vacuum differential pressure method using a pressure difference between a vacuum state caused by evacuation of the vacuum pump 4d and a pressure state caused by a gas introduction part 4e and a pressure state caused by a pressure exceeding the atmospheric pressure. Insulating adhesive is introduced into the gap between the substrates.
積層基板１０を基板カセット１００と共に、仕切弁を通してシール材硬化室３Aaから注入室４ａ内に導入し、導入した積層基板１０の基板間の隙間に絶縁接着剤を注入する。 The laminated substrate 10 is introduced into the injection chamber 4a from the sealing material curing chamber 3Aa together with the substrate cassette 100 through the gate valve, and an insulating adhesive is injected into the gap between the introduced laminated substrates 10.
第２シール材塗布部２Ｂは、シール材塗布室２Bａ内にシール材２Bｂを貯めた容器を昇降部２Bｃによって昇降自在に備える。仕切弁を通して積層基板１０を基板カセット１００と共に注入室４aからシール材塗布室２Bａ内に導入し、導入した積層基板１０の注入口にシール材の樹脂を塗布する。 The second sealing material application unit 2B includes a container in which the sealing material 2Bb is stored in the sealing material application chamber 2Ba so that the container can be moved up and down by the elevating unit 2Bc. The laminated substrate 10 is introduced into the sealing material application chamber 2Ba from the injection chamber 4a together with the substrate cassette 100 through the gate valve, and the sealing material resin is applied to the inlet of the introduced laminated substrate 10.
第２シール材硬化部３Ｂは、第２シール材硬化室３Bａ内にシール材を硬化させる硬化装置３Bｂを備える。硬化装置３Bbは、シール材が熱硬化性樹脂である場合には加熱装置とし、シール材が紫外線硬化性樹脂である場合には紫外線照射装置とすることができる。積層基板１０を基板カセット１００と共に、仕切弁を通してシール材塗布室２Bａから第２シール材硬化室３Bａ内に導入し、導入した積層基板１０の注入口に塗布したシール材を硬化して封止シールを形成する。 The second sealing material curing unit 3B includes a curing device 3Bb that cures the sealing material in the second sealing material curing chamber 3Ba. The curing device 3Bb can be a heating device when the sealing material is a thermosetting resin, and can be an ultraviolet irradiation device when the sealing material is an ultraviolet curable resin. The laminated substrate 10 is introduced into the second sealant curing chamber 3Ba from the sealant application chamber 2Ba through the gate valve together with the substrate cassette 100, and the sealant applied to the inlet of the introduced laminated substrate 10 is cured and sealed. Form.
洗浄部５は、洗浄室５ａ内に、洗浄液５ｃを貯めた容器５ｂを備える。積層基板１０を基板カセット１００と共に、仕切弁を通して第２シール材硬化室３Bａから洗浄室５ａ内に導入し、導入した積層基板１０の基板の外側に付着した絶縁接着剤を除去する。 The cleaning unit 5 includes a container 5b in which a cleaning liquid 5c is stored in a cleaning chamber 5a. The laminated substrate 10 is introduced into the cleaning chamber 5a from the second sealant curing chamber 3Ba through the gate valve together with the substrate cassette 100, and the insulating adhesive adhered to the outside of the introduced laminated substrate 10 is removed.
硬化部６は、硬化室６ａ内に絶縁接着剤を硬化させる硬化装置６ｂを備える。硬化装置６bは、絶縁接着剤の熱硬化性樹脂を加熱して硬化させる加熱装置を備える。積層基板１０を基板カセット１００と共に、仕切弁を通して洗浄室５ａから硬化室６a内に導入し、導入した積層基板１０の基板間に注入した絶縁接着剤を硬化して基板を接着する。 The curing unit 6 includes a curing device 6b that cures the insulating adhesive in the curing chamber 6a. The curing device 6b includes a heating device that heats and cures the thermosetting resin of the insulating adhesive. The laminated substrate 10 is introduced into the curing chamber 6a from the cleaning chamber 5a through the gate valve together with the substrate cassette 100, and the insulating adhesive injected between the introduced laminated substrates 10 is cured to adhere the substrates.
図１９は、図１８に示したインライン配置の構成を概略的に示している。各部の配置は、図１９に示すインライン配置に限らず他の配置とすることができる。以下、他の配置例について図２０〜図２４を用いて説明する。 FIG. 19 schematically shows the configuration of the inline arrangement shown in FIG. The arrangement of each part is not limited to the inline arrangement shown in FIG. Hereinafter, other arrangement examples will be described with reference to FIGS.
図２０，２１は、第２，３の配置例を説明するための図である。第２，３の配置例は、一つのシール材塗布部２によって外周シールのシール材塗布と封止シールのシール材塗布とを行い、一つのシール材硬化部３によって外周シールのシール材硬化と封止シールのシール材の硬化を行う構成である。図２０の構成では、シール材硬化部３は加熱によってシール材を硬化させる。図２１の構成では、シール材硬化部３は紫外線照射によってシール材を硬化させる。 20 and 21 are diagrams for explaining the second and third arrangement examples. In the second and third arrangement examples, the sealing material application of the outer peripheral seal and the sealing material application of the sealing seal are performed by one sealing material application unit 2, and the sealing material curing of the outer peripheral seal is performed by one sealing material curing unit 3. It is the structure which hardens the sealing material of a sealing seal. In the configuration of FIG. 20, the sealing material curing unit 3 cures the sealing material by heating. In the configuration of FIG. 21, the sealing material curing unit 3 cures the sealing material by ultraviolet irradiation.
この第２，３の配置例の構成では、シール材塗布部２とシール材硬化部３とに併設させて絶縁接着剤注入部４を備える。はじめに、シール材塗布部２とシール材硬化部３とによって外周シールを形成した後、絶縁接着剤注入部４で絶縁接着剤を注入し、その後、再びシール材塗布部２とシール材硬化部３によって封止シールを形成する。この構成によれば、シール材塗布部２とシール材硬化部３の構成を簡略化することができる。 In the configuration of the second and third arrangement examples, the insulating adhesive injection unit 4 is provided in parallel with the sealing material application unit 2 and the sealing material curing unit 3. First, an outer peripheral seal is formed by the sealing material application part 2 and the sealing material curing part 3, and then an insulating adhesive is injected by the insulating adhesive injection part 4, and then the sealing material application part 2 and the sealing material curing part 3 again. To form a sealing seal. According to this structure, the structure of the sealing material application part 2 and the sealing material hardening part 3 can be simplified.
なお、図２０のシール材硬化部３の加熱温度はシール材の硬化温度に対応して設定し、絶縁接着剤硬化部６の加熱温度は絶縁接着剤の硬化温度に対応して設定する。 In addition, the heating temperature of the sealing material hardening part 3 of FIG. 20 is set corresponding to the hardening temperature of a sealing material, and the heating temperature of the insulating adhesive hardening part 6 is set corresponding to the hardening temperature of an insulating adhesive.
図２２は、第４の配置例を説明するための図である。第４の配置例は、図２０に示した構成において、シール材の硬化と絶縁接着剤の硬化とを一つの一つのシール材硬化部３に行う構成である。絶縁接着剤の硬化は、絶縁接着剤洗浄部５で洗浄した後の積層基板を硬化部３に導入し、絶縁接着剤の硬化温度Ｔ２以上に加熱することで絶縁接着剤を硬化させる。この構成によれば、シール材硬化部の構成をより簡略化することができる。 FIG. 22 is a diagram for explaining a fourth arrangement example. The fourth arrangement example is a configuration in which, in the configuration shown in FIG. 20, curing of the sealing material and curing of the insulating adhesive are performed on one sealing material curing portion 3. The insulating adhesive is cured by introducing the laminated substrate cleaned by the insulating adhesive cleaning unit 5 into the curing unit 3 and heating the insulating adhesive to a temperature equal to or higher than the curing temperature T2 of the insulating adhesive. According to this structure, the structure of a sealing material hardening part can be simplified more.
図２３，２４は、中央に配置した搬送室９の周囲に各工程部を配置する構成である。図２３に示す構成は、シール材塗装部２，硬化部７，絶縁接着剤注入部４、絶縁接着剤洗浄部５、および搬出入部８を配置する構成であり、図２４に示す構成は、シール材塗装部２，シール材硬化部３，絶縁接着剤注入部４、絶縁接着剤洗浄部５、絶縁接着剤硬化部６，および搬出入部８を配置する構成である。 23 and 24 show a configuration in which each process unit is arranged around the transfer chamber 9 arranged in the center. The configuration shown in FIG. 23 is a configuration in which the sealing material coating unit 2, the curing unit 7, the insulating adhesive injection unit 4, the insulating adhesive cleaning unit 5, and the carry-in / out unit 8 are arranged. The configuration shown in FIG. The material coating part 2, the seal material curing part 3, the insulating adhesive injection part 4, the insulating adhesive cleaning part 5, the insulating adhesive curing part 6, and the carry-in / out part 8 are arranged.
図２３，２４の構成では、各処理部に対して積層基板を搬送する搬送装置（図示していない）を搬送室９内に備える。積層基板を搬出入部８から搬送室９内に導入した後、搬送装置によって各処理部に搬入し、処理が終了した積層基板は再度搬送室９内に戻す。この搬出入の動作を順次繰り返すことによって、積層基板の形成を行う。 In the configuration of FIGS. 23 and 24, a transfer device (not shown) for transferring the laminated substrate to each processing unit is provided in the transfer chamber 9. After the laminated substrate is introduced into the transfer chamber 9 from the carry-in / out unit 8, it is carried into each processing unit by the transfer device, and the processed laminated substrate is returned to the transfer chamber 9 again. By sequentially repeating this carry-in / out operation, a laminated substrate is formed.
本発明のシール形成方法、シール形成装置は、３次元の半導体装置、３次元の半導体回路装置に適用することができる。 The seal forming method and the seal forming apparatus of the present invention can be applied to a three-dimensional semiconductor device and a three-dimensional semiconductor circuit device.
１…積層基板形成装置、２，２Ａ，２Ｂ…シール材塗布部、２Aａ…シール材塗布室、２Aｂ…シール材、２Aｃ…昇降部、２Bａ…シール材塗布室、２Bｂ…シール材、２Bｃ…昇降部、３…シール材硬化部，３Ａ，３Ｂ…シール材硬化部、３Ab…硬化装置、３Aａ…シール材硬化室、３Aｂ…硬化装置、３Bａ…シール材硬化室、３Bｂ…硬化装置、４…絶縁接着剤注入部、４ａ…注入室、４ｂ…絶縁接着剤、４ｃ…昇降部、４ｄ…真空ポンプ、４ｅ…ガス導入部、５…洗浄部、５ａ…洗浄室、５ｂ…容器、５ｃ…洗浄液、６…絶縁接着剤硬化部、６ａ…硬化室、６ｂ…硬化装置、７…硬化部、８…搬出入部、９…搬送室、１０…積層基板、１０ａ，１０ｂ…基板、１１…外周端面、１２…塗布範囲、１３…塗布除外範囲、１４…下ステージ、１６…注入口、２０…樹脂、２１…容器、２２…塗布ローラ、２３…駆動ローラ、２４…従動ローラ、２５…ローラ、２６…バネ、２７…スクレーバ、２８…外周シール、２８ａ…開始点、２８ｂ…終点、２９…封止シール、３０…ディスペンサ、４１…絶縁接着剤、４２…容器、４３…昇降部、４４…絶縁接着剤、４５…樹脂、４６…絶縁接着剤、５０…洗浄槽、５１…洗浄液、５２…容器、５３…モータ、１００…基板カセット、２００…接着剤注入装置、２０１…ウェハ、２０２…Cuバンプ、２０３…Cu壁、２０４…入り口、２０５…絶縁性接着剤、２１０…接着剤注入装置、２１１…容器、２１２…上治具、２１３…下治具、２１４…上ステージ、２１５…下ステージ、２１６…真空排気装置、２１７…不活性ガス導入部、２１８…接着剤供給部、２１９…真空チャンバ、２２０…積層ウェハ。 DESCRIPTION OF SYMBOLS 1 ... Laminated substrate formation apparatus, 2, 2A, 2B ... Sealing material application part, 2Aa ... Sealing material application chamber, 2Ab ... Sealing material, 2Ac ... Lifting part, 2Ba ... Sealing material application chamber, 2Bb ... Sealing material, 2Bc ... Elevation 3, 3 ... Sealing material curing unit, 3A, 3B ... Sealing material curing unit, 3Ab ... Curing device, 3Aa ... Sealing material curing chamber, 3Ab ... Curing device, 3Ba ... Sealing material curing chamber, 3Bb ... Curing device, 4 ... Insulation Adhesive injection part, 4a ... injection chamber, 4b ... insulating adhesive, 4c ... elevating part, 4d ... vacuum pump, 4e ... gas introduction part, 5 ... cleaning part, 5a ... cleaning room, 5b ... container, 5c ... cleaning liquid, DESCRIPTION OF SYMBOLS 6 ... Insulating adhesive hardening part, 6a ... Curing chamber, 6b ... Curing apparatus, 7 ... Curing part, 8 ... Carrying in / out part, 9 ... Transfer chamber, 10 ... Laminated substrate, 10a, 10b ... Substrate, 11 ... Outer peripheral end surface, 12 ... coating range, 13 ... coating exclusion range, 14 ... lower stage, 16 ... note Mouth, 20 ... resin, 21 ... container, 22 ... coating roller, 23 ... drive roller, 24 ... driven roller, 25 ... roller, 26 ... spring, 27 ... scraper, 28 ... outer periphery seal, 28a ... start point, 28b ... end point 29 ... Sealing seal, 30 ... Dispenser, 41 ... Insulating adhesive, 42 ... Container, 43 ... Lifting part, 44 ... Insulating adhesive, 45 ... Resin, 46 ... Insulating adhesive, 50 ... Cleaning tank, 51 ... Cleaning liquid 52 ... Container, 53 ... Motor, 100 ... Substrate cassette, 200 ... Adhesive injection device, 201 ... Wafer, 202 ... Cu bump, 203 ... Cu wall, 204 ... Entrance, 205 ... Insulating adhesive, 210 ... Adhesive Injecting device, 211 ... container, 212 ... upper jig, 213 ... lower jig, 214 ... upper stage, 215 ... lower stage, 216 ... vacuum exhaust device, 217 ... inert gas introduction part, 218 ... adhesive supply , 219 ... vacuum chamber, 220 ... laminated wafers.
Claims (17)
前記積層基板は一部を除いて外周端面に外周シールが設けられており、
前記積層基板の外周シールの一部に設けられた注入口から、基板間と前記外周シールとで囲まれる隙間内に、真空差圧法によって絶縁接着剤を注入する注入工程と、
前記絶縁接着剤を注入した後に注入口を封止する封止工程と、
前記積層基板を洗浄液を用いて湿式洗浄を行う洗浄工程と、
前記絶縁接着剤を硬化させる絶縁接着剤硬化工程とを、順に備えることを特徴とする、積層基板の形成方法。 A method for forming a laminated substrate, comprising: laminating at least two substrates to form a laminated substrate,
The laminated substrate is provided with an outer peripheral seal on the outer peripheral end face except for a part thereof,
An injection step of injecting an insulating adhesive by a vacuum differential pressure method from an injection port provided in a part of the outer peripheral seal of the laminated substrate into a gap surrounded by the substrate and the outer peripheral seal;
A sealing step of sealing the injection port after injecting the insulating adhesive;
A cleaning step of performing wet cleaning on the multilayer substrate using a cleaning liquid;
An insulating adhesive curing step for curing the insulating adhesive in order.
前記注入口にシール材を塗布する塗布工程と、
前記塗布したシール材を硬化させるシール材硬化工程とを含むことを特徴とする、請求項１に記載の積層基板の形成方法。 The sealing step of sealing the injection port is
An application step of applying a sealing material to the inlet;
The method for forming a laminated substrate according to claim 1, further comprising a sealing material curing step of curing the applied sealing material.
前記シール材の硬化特性は、前記絶縁接着剤の硬化条件に含まれない硬化条件を有し、
前記シール材硬化工程は、前記絶縁接着剤の硬化条件に含まれないシール材の硬化条件でシール材を硬化することを特徴とする、請求項２又は３に記載の積層基板の形成方法。 The sealing material and the insulating adhesive have different curing characteristics,
The curing characteristics of the sealing material have curing conditions not included in the curing conditions of the insulating adhesive,
The method for forming a laminated substrate according to claim 2, wherein the sealing material curing step cures the sealing material under a curing condition of the sealing material that is not included in the curing condition of the insulating adhesive.
前記シール材の硬化温度は前記絶縁接着剤の硬化温度よりも低温であり、
前記シール材硬化工程は、少なくとも前記シール材の硬化温度以上であり、かつ、前記絶縁接着剤の硬化温度よりも低温の温度でシール材を硬化させ、
前記絶縁接着剤硬化工程は、少なくとも前記絶縁接着剤の硬化温度以上の温度で絶縁接着剤を硬化させることを特徴とする、請求項２又は４に記載の積層基板の形成方法。 The sealing material and the insulating adhesive are thermosetting resins,
The curing temperature of the sealing material is lower than the curing temperature of the insulating adhesive,
The sealing material curing step is to cure the sealing material at a temperature that is at least equal to or higher than the curing temperature of the sealing material and lower than the curing temperature of the insulating adhesive;
5. The method for forming a laminated substrate according to claim 2, wherein the insulating adhesive curing step cures the insulating adhesive at a temperature that is at least equal to or higher than a curing temperature of the insulating adhesive.
前記絶縁接着剤は熱硬化性樹脂であり、
前記シール材硬化工程は、前記シール材に紫外線を照射して硬化させ、
前記絶縁接着剤硬化工程は、少なくとも前記絶縁接着剤の温度以上の温度で絶縁接着剤を硬化させることを特徴とする、請求項２又は４に記載の積層基板の形成方法。 The sealing material is an ultraviolet curable resin,
The insulating adhesive is a thermosetting resin,
In the sealing material curing step, the sealing material is cured by irradiating with ultraviolet rays,
5. The method for forming a laminated substrate according to claim 2, wherein in the insulating adhesive curing step, the insulating adhesive is cured at least at a temperature equal to or higher than the temperature of the insulating adhesive.
前記積層基板を洗浄液中に浸漬することを特徴とする、請求項１から６のいずれか一つに記載の積層基板の形成方法。 The washing step includes
The method for forming a multilayer substrate according to claim 1, wherein the multilayer substrate is immersed in a cleaning liquid.
前記積層基板を軸回転させ、当該軸回転する積層基板の面に洗浄液を滴下する、
又は、
前記積層基板の面に洗浄液を滴下し、当該積層基板を軸回転させることを特徴とする、請求項１から６のいずれか一つに記載の積層基板の形成方法。 The washing step includes
The laminated substrate is axially rotated, and a cleaning liquid is dropped on the surface of the axially rotated laminated substrate.
Or
The method for forming a multilayer substrate according to claim 1, wherein a cleaning liquid is dropped on the surface of the multilayer substrate, and the multilayer substrate is axially rotated.
前記積層基板の一部を除いて外周端面に外周シールを形成する外周シール形成部と、
前記積層基板の外周シールの一部に設けた注入口から、基板間と前記外周シールとで囲まれる隙間内に、真空差圧法によって絶縁接着剤を注入する注入部と、
前記絶縁接着剤を注入した後に注入口を封止する封止シール形成部と、
前記積層基板を洗浄液を用いて湿式洗浄を行う洗浄部と、
前記絶縁接着剤を硬化させる絶縁接着剤硬化部とを備えることを特徴とする、積層基板の形成装置。 A laminated substrate forming apparatus for laminating at least two substrates to form a laminated substrate,
An outer peripheral seal forming part that forms an outer peripheral seal on the outer peripheral end surface excluding a part of the laminated substrate;
An injection part for injecting an insulating adhesive by a vacuum differential pressure method from an injection port provided in a part of the outer peripheral seal of the laminated substrate into a gap surrounded by the substrate and the outer peripheral seal,
A sealing seal forming part for sealing the injection port after injecting the insulating adhesive;
A cleaning unit that performs wet cleaning on the multilayer substrate using a cleaning liquid;
An apparatus for forming a laminated substrate, comprising: an insulating adhesive curing unit that cures the insulating adhesive.
前記積層基板の一部を除く外周端面にシール材を塗布する第１のシール塗布手段と、
前記シール材を硬化する第１のシール材硬化手段とを有することを特徴とする、請求項９に記載の積層基板の形成装置。 The outer peripheral seal forming part is
First seal applying means for applying a sealing material to an outer peripheral end face excluding a part of the laminated substrate;
The laminated substrate forming apparatus according to claim 9, further comprising a first sealing material curing unit that cures the sealing material.
前記注入口にシール材を塗布する第２の塗布手段と、
前記塗布したシール材を硬化させる第２のシール材硬化手段とを含むことを特徴とする、請求項９又は１０に記載の積層基板の形成装置。 The sealing seal forming part is
Second application means for applying a sealing material to the injection port;
11. The laminated substrate forming apparatus according to claim 9, further comprising a second sealing material curing unit that cures the applied sealing material.
前記第２のシール材硬化手段は、前記絶縁接着剤の硬化条件に含まれない硬化条件で硬化させることを特徴とする、請求項１１に記載の積層基板の形成装置。 The second sealing material curing means and the insulating adhesive curing part are cured under different curing conditions,
The apparatus for forming a laminated substrate according to claim 11, wherein the second sealing material curing means is cured under a curing condition not included in the curing condition of the insulating adhesive.
前記シール材の硬化温度は前記絶縁接着剤の硬化温度よりも低温であり、
前記第２のシール材硬化手段は、少なくとも前記シール材の硬化温度以上であり、かつ、前記絶縁接着剤の硬化温度よりも低温の温度でシール材を硬化させ、
前記絶縁接着剤硬化部は、少なくとも前記絶縁接着剤の硬化温度以上の温度で絶縁接着剤を硬化させることを特徴とする、請求項１１又は１３に記載の積層基板の形成装置。 The sealing material and the insulating adhesive are thermosetting resins,
The curing temperature of the sealing material is lower than the curing temperature of the insulating adhesive,
The second sealing material curing means cures the sealing material at a temperature that is at least equal to or higher than the curing temperature of the sealing material and lower than the curing temperature of the insulating adhesive,
The laminated substrate forming apparatus according to claim 11, wherein the insulating adhesive curing unit cures the insulating adhesive at a temperature at least equal to or higher than a curing temperature of the insulating adhesive.
前記絶縁接着剤は熱硬化性樹脂であり、
前記第２のシール材硬化手段は、前記シール材に紫外線を照射して硬化させ、
前記絶縁接着剤硬化部は、少なくとも前記絶縁接着剤の温度以上の温度で絶縁接着剤を硬化させることを特徴とする、請求項１１又は１３に記載の積層基板の形成装置。 The sealing material is an ultraviolet curable resin,
The insulating adhesive is a thermosetting resin,
The second sealing material curing means is cured by irradiating the sealing material with ultraviolet rays,
The laminated substrate forming apparatus according to claim 11, wherein the insulating adhesive curing unit cures the insulating adhesive at a temperature at least equal to or higher than the temperature of the insulating adhesive.
洗浄液を収容した容器を有し、当該容器内の洗浄液中に前記積層基板を浸漬することを特徴とする、請求項９から１５のいずれか一つに記載の積層基板の形成装置。 The cleaning unit
The multilayer substrate forming apparatus according to claim 9, further comprising a container containing a cleaning liquid, wherein the multilayer substrate is immersed in the cleaning liquid in the container.
前記積層基板を軸回転させる回転駆動手段と、
前記積層基板の面上に洗浄液を滴下する洗浄液手段とを備えることを特徴とする、請求項９から１５のいずれか一つに記載の積層基板の形成装置。 The cleaning unit
Rotation driving means for rotating the laminated substrate;
The laminated substrate forming apparatus according to claim 9, further comprising a cleaning liquid unit that drops a cleaning liquid on a surface of the multilayer substrate.
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