JP2010129606A - Electronic component mounting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To shorten the time needed to discard of an electronic component. <P>SOLUTION: The electronic component conveying device 1 includes: a plurality of nozzles 3 having ends where an electronic component can be sucked and released; a head 6 mounted with the plurality of nozzles; a first moving means of moving the head between a supply part and a mounted part; a second moving means 8 of moving the nozzles in the head intermittently in a revolution manner along a revolution path R between a suction position R1 where the electronic component can be sucked on the supply part with the nozzles and a mounting position R1 where the electronic component can be mounted on the mounted part with the nozzles; an imaging means 9 of imaging a nozzle on the revolution path from its end side; a control unit which determines whether or not the electronic component held by the nozzle needs to be discarded based upon imaging data obtained by the imaging means, and controls suction and release of the nozzle and the second moving means based upon the determination result; and a discard unit 50 where the electronic component held by the nozzle is discarded. The disposal unit is arranged on the revolution path. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic component mounting apparatus.

As an electronic component mounting apparatus of this type, for example, as shown in Patent Document 1 below, means for supplying an electronic component (supply unit) and a circuit board (production substrate) on which the electronic component is mounted are fixed in place. A circuit board support means (support part), a suction head (nozzle) for picking up a desired electronic component from the component supply means and mounting it on a predetermined position on the circuit board, and a posture of the electronic component sucked by the suction head can be recognized. A configuration comprising a plurality of component imaging devices (imaging means) and a plurality of component discarding units (discarding units) for discarding the components when the component imaging device determines that the suction posture of the components is defective is known. ing.
According to this electronic component mounting apparatus, an increase in tact time can be suppressed by suppressing the movement time of the suction head when discarding the electronic component.
JP-A-11-145698

  However, in the conventional electronic component mounting apparatus, when the electronic component is discarded, the suction head must be moved to the component disposal box, and a reduction in time required for the disposal has been demanded.

  This invention is made | formed in view of the situation mentioned above, The objective is to provide the electronic component mounting apparatus which can reduce the time which disposal of an electronic component requires.

In order to solve the above problems, the present invention proposes the following means.
An electronic component mounting apparatus according to the present invention includes a supply unit that supplies an electronic component and a support unit that supports a mounted portion on which the electronic component is mounted, and transports the electronic component supplied to the supply unit. An electronic component mounting apparatus to be mounted on the mounted portion, a plurality of nozzles having end portions capable of sucking and releasing the electronic components, a head on which the plurality of nozzles are mounted, the supply unit, A first moving means for moving the head to and from the mounted portion; a suction position in the head at which the electronic component can be sucked by the nozzle on the supply portion; A second moving means for intermittently moving around the circulation path between the mounting position where the electronic component can be mounted by the nozzle, and an imaging means for imaging the nozzle on the circulation path from the end side. And the imaging means Control for determining whether or not the electronic component held by the nozzle needs to be discarded based on the obtained imaging data, and controlling the suction and suction release of the nozzle and the second moving unit based on the determination result And a disposal unit for discarding the electronic component held by the nozzle, the disposal unit being disposed on the circuit path.

In the electronic component mounting apparatus, first, the head is moved to the supply unit by the first moving means. Next, the nozzle mounted on the head is rotated by the second moving means along the circular path in the direction from the mounting position toward the suction position, and the nozzle moved to the suction position causes the supply unit to Adsorb electronic components. Thereby, an electronic component can be made to adsorb | suck to all the nozzles mounted in the head.
Next, the head is moved to the mounted portion by the first moving means. Then, the nozzle mounted on the head is adsorbed by the nozzle moved to the mounting position while being moved by the second moving means along the circular path in the direction from the suction position toward the mounting position. The electronic parts that are present are mounted on the mounted part. Thereby, all the electronic components adsorbed by the nozzle mounted on the head can be mounted on the mounted portion.
Thereafter, the head is moved again to the supply unit by the first moving means, and the above operation is repeated.

  Here, since the disposal unit is disposed on the circulation path, the control unit discards the electronic component held by the nozzle based on the imaging data of the nozzle on the circulation path obtained by the imaging unit. In this electronic component mounting apparatus, the nozzle is set to the suction position by the second moving means by controlling whether or not the nozzle is sucked and sucked and the second moving means is controlled based on the determination result. When moving between the mounting positions, the electronic component can be discarded in the disposal unit in parallel with the movement. Accordingly, it is possible to reduce the time required to discard the electronic component.

  The imaging unit may be disposed on the circuit route.

  In this case, since the imaging means is disposed on the circulation path, when the nozzle is moved between the suction position and the mounting position by the second moving means, the nozzle is moved in parallel with this movement. Images can be taken from the end side. Accordingly, it is possible to further reduce the time required to discard the electronic component.

  In addition, the imaging unit is disposed so that the nozzle is positioned on the circulation path from the suction position toward the mounting position, and the disposal unit is configured such that the nozzle is on the imaging path. It may be arranged so as to be located between the head and the mounting position.

In this case, since the imaging means is arranged so that the nozzle is located on the circuit path from the suction position toward the mounting position, the nozzle that sucks the electronic component at the suction position is used as the nozzle. It is possible to take an image with the imaging means before the head moves toward the mounting position. Therefore, the control unit can determine whether or not the electronic component of the supply unit is sucked by the nozzle based on the imaging data obtained by the imaging unit, and determine whether the electronic component needs to be discarded.
In addition, since the disposal unit is arranged so that the nozzle is positioned on the circuit path from the imaging unit to the mounting position, when the control unit determines that the electronic component needs to be discarded. The electronic parts held by the nozzle can be discarded in the disposal unit until the nozzle moves toward the mounting position.
As described above, even when a suction failure of the electronic component of the supply unit due to the nozzle occurs, the time required to discard the electronic component is reduced while the disposal unit reliably discards the electronic component sucked by the nozzle. be able to.

  Further, the imaging means is disposed so that the nozzle is positioned on the circuit path from the mounting position toward the suction position, and the disposal unit is configured such that the nozzle is positioned on the circuit path. It may be arranged so as to be located between the head and the suction position.

In this case, since the imaging unit is arranged so that the nozzle is positioned on the circulation path from the mounting position toward the suction position, the nozzle that has finished mounting the electronic component at the mounting position is It is possible to pick up an image with the image pickup means before the nozzle moves toward the suction position. Therefore, the control unit can determine whether the electronic component mounted on the mounted portion is brought home by the nozzle based on the imaging data obtained by the imaging unit, and can determine whether the electronic component needs to be discarded.
In addition, since the disposal unit is disposed so that the nozzle is located on the circuit path from the imaging unit toward the suction position, when the control unit determines that the electronic component needs to be discarded. The electronic parts held by the nozzle can be discarded in the disposal unit until the nozzle moves toward the suction position.
As described above, even when the electronic component mounted on the mounted part is taken away by the nozzle, the time required for discarding the electronic component while reliably discarding the electronic component brought back to the nozzle to the disposal unit Can be reduced.

  Further, the disposal unit is formed in a bottomed cylindrical shape having an upper end opening, and the disposal unit is cleaned by wiping the end of the nozzle when the nozzle enters the inside from the upper end opening. Cleaning means may be provided.

  In this case, the disposal unit is equipped with a cleaning means for wiping and cleaning the end of the nozzle when the nozzle enters the inside from the upper end opening, so that the nozzle is disposed in order to discard the electronic component to the disposal unit. Can be cleaned by wiping the end of the nozzle with the cleaning means when the nozzle is made to enter the inside of the disposal unit from the upper end opening. Therefore, it is possible to clean the end of the nozzle, and it is possible to suppress the disposal of the electronic component itself.

  According to the electronic component mounting apparatus of the present invention, it is possible to reduce the time required to discard the electronic component.

(First embodiment)
Hereinafter, a first embodiment of an electronic component mounting apparatus according to the present invention will be described with reference to the drawings.
FIG. 1 is a schematic plan view showing a first embodiment of an electronic component mounting apparatus according to the present invention. FIG. 2 is a schematic plan view of a head in the electronic component mounting apparatus shown in FIG. FIG. 3 is an arrow A view shown in FIG. FIG. 4 is an enlarged perspective view of a disposal unit in the electronic component mounting apparatus shown in FIG. FIG. 5 is a view showing a brush body provided in the disposal unit shown in FIG.

  As shown in FIG. 1, the electronic component mounting apparatus 1 includes a component supply device (supply unit) 4 that supplies an electronic component E (see FIG. 3), and a production board (mounted portion) P on which the electronic component E is mounted. And a substrate transfer device (support unit) 5 for supporting the electronic component E. The electronic component E supplied to the component supply device 4 is transferred and mounted on the production substrate P.

  As shown in FIGS. 1 to 3, the electronic component mounting apparatus 1 includes a plurality of nozzles 3 having end portions 2 capable of sucking and releasing the electronic components E, and a head 6 on which the plurality of nozzles 3 are mounted. And a first moving means 7 for moving the head 6 between the component supply device 4 and the production substrate P, and a second moving means 8 for rotating the nozzle 3 in the head 6 along a circular path R to be described later. The image pickup means 9 for picking up an image of the nozzle 3 on the circulation path R from the end 2 side, and the control for controlling the component supply device 4, the substrate transport device 5, the first moving means 7, the second moving means 8 and the image pickup means 9. And a disposal unit 50 for discarding the electronic component E held by the nozzle 3. Furthermore, as shown in FIG. 1, in this embodiment, the base 11 with which each said structure was fixed is provided. In FIG. 1, the imaging means 9 and the disposal unit 50 are not shown for easy viewing of the drawing.

  The base 11 is formed in a rectangular shape in plan view, and the lower surface thereof is placed and fixed on a horizontal plane (not shown). In the following, as shown in FIG. 1, the direction along one side of the base 11 in a plan view from the upper surface of the base 11 is the X direction, the direction orthogonal to the X direction in the plan view is the Y direction, and the X direction. A direction perpendicular to both of the Y directions is referred to as a Z direction.

  The component supply device 4 is provided at one end of the upper surface of the base 11 in the Y direction. In the example shown in the drawing, the component supply device 4 is composed of a plurality of tape feeders 4a arranged in the X direction. Each tape feeder 4a is detachably mounted with a reel-like tape on which electronic parts E are held at regular intervals. The tape feeder 4a feeds the tape to the tip of the tape feeder 4a for a predetermined supply. The electronic component E is supplied to the position.

  The substrate transfer device 5 is provided at the other end in the Y direction on the upper surface of the base 11 and transfers the production substrate P from the previous process to the subsequent process. The production substrate P transported to a predetermined mounting position on the upper surface of the base 11 by the substrate transporting device 5 is supported by the substrate transporting device 5 at the mounting position. In the illustrated example, the substrate transport device 5 is formed so as to transport the production substrate P along the X direction, and both end portions of the substrate transport device 5 in the X direction are connected to the pre-process and the post-process. Yes.

The first moving means 7 includes an X table 13 that moves the head 6 along the X direction, and a Y table 14 that moves the X table 13 along the Y direction.
The Y table 14 is provided along the Y direction at both ends in the X direction on the upper surface of the base 11. The Y table 14 includes, for example, a ball screw extending in the Y direction and a servo motor that rotates the ball screw around the central axis of the ball screw. In the illustrated example, a gap (not shown) along the Z direction is provided between the Y table 14 and the base 11 so that both end portions of the substrate transport device 5 in the X direction are inserted therebetween. I'm open.

  The X table 13 extends along the X direction, and both ends are held by the Y table 14 so as to be movable along the Y direction. The X table 13 is, for example, a table body that extends along the X direction and whose both ends are held by the Y table 14, a ball screw that extends along the X direction, and a ball screw around the central axis of the ball screw. And a servo motor supported by the table body.

  According to the 1st moving means 7 comprised as mentioned above, it becomes possible to move the head 6 to the said X direction and the said Y direction above the base 11 with the X table 13 and the Y table 14, Thereby, The head 6 can be moved between the component supply device 4 and the production substrate P supported at the mounted position. In the present embodiment, the X table 13 and the head 6 are held by the Y table 14 so as to move above the component supply device 4 and the substrate transport device 5.

  As shown in FIG. 1, the head 6 includes a head body 6a formed in a flat plate shape. In the illustrated example, the head main body 6a is formed in a rectangular shape in plan view, and is held by the X table 13 so that the thickness direction coincides with the Z direction. In the illustrated example, the head body 6a is held on the X table 13 so that one side in a plan view is along the X direction and the other side in a plan view is along the Y direction.

The plurality of nozzles 3 are disposed above the head body 6a at equal intervals around the central axis of the head body 6a along the Z direction. In the illustrated example, 16 nozzles 3 are provided. 2 and 3, only one nozzle 3 is shown for easy viewing of the drawings.
As shown in FIG. 3, the nozzle 3 is formed so as to extend in a predetermined direction, and a nozzle hole 3 a that penetrates the nozzle 3 along the extending direction of the nozzle 3 is formed in the nozzle 3. Has been. A flat end surface 2 a is formed on one end side of the nozzle 3 in the extending direction, and a positive pressure / negative pressure supply means 12 that supplies a positive pressure or a negative pressure to the inside of the nozzle 3 to each nozzle 3. Is connected. The positive pressure / negative pressure supply means 12 includes, for example, an ejector, a valve, a compressor, and the like, and its operation is controlled by the control unit 10.

  According to the nozzle 3 configured as described above, the negative pressure is supplied to the inside of the nozzle 3 by the positive pressure / negative pressure supply means 12, thereby adsorbing the electronic component E on the end surface 2 a on one end side (FIG. 3). The suction can be released by supplying positive pressure to the inside of the nozzle 3 by the positive / negative pressure supply means 12.

  In the illustrated example, the size along the orthogonal direction orthogonal to the extending direction on the end surface 2a on the one end side of the nozzle 3 is the size L1, and the end portion 2 on the one end side is the extending direction. Along the direction of the other end, the size along the orthogonal direction is reduced, and the size along the orthogonal direction on the other end side of the end portion 2 is a size L2 ( However, L2> L1). That is, the end portion 2 on one end side of the nozzle 3 is formed in a tapered shape.

The nozzle 3 is held above the head main body 6a by the second moving means 8 in a state where the extending direction coincides with the Z direction.
The second moving means 8 is located between a suction position where the electronic component E can be sucked by the nozzle 3 on the component supply device 4 and a mounting position where the electronic component E can be mounted by the nozzle 3 on the production substrate P. The nozzle 3 is intermittently moved along the circulation path R.

  As shown in FIG. 2, the circulation path R by the second moving means 8 is along the direction around the central axis of the head body 6a. In the illustrated example, the second moving means 8 moves the nozzle 3 in the clockwise direction in plan view from above along the circulation path R. As shown in FIG. 1, in the present embodiment, a plurality of nozzles 3 are arranged along the circulation path R at equal intervals.

Further, as shown in FIG. 3, in the illustrated example, the second moving means 8 is configured such that when the nozzle 3 is moved from one side of the Y direction toward the other side, the nozzle 3 moves in the Z direction. It is formed so as to move gradually upward along. That is, the second moving means 8 moves the nozzle 3 up and down in the Z direction while rotating the nozzle 3 in the X direction and the Y direction.
In the illustrated example, the second moving means 8 is connected to the head body 6a via a connecting member (not shown).

  As shown in FIGS. 2 and 3, the head main body 6a is formed with a lifting hole 6b penetrating in the plate thickness direction on the circulation path R. In the illustrated example, the lifting hole 6b is formed in a portion of the head body 6a that is located on one side in the Y direction on the circulation path R. As shown in FIG. 2, the shape of the lifting hole 6b in plan view is rectangular, and the lifting hole 6b is formed to be larger than the nozzle 3 in plan view.

  Moreover, as shown in FIG. 3, in this embodiment, the nozzle 3 is provided with the raising / lowering means 15 which raises / lowers the nozzle 3 along the said Z direction. In the illustrated example, the elevating means 15 is provided so as to connect the nozzle 3 and the second moving means 8, and is configured by, for example, a small jack mechanism or the like. Can be moved up and down along the Z direction. The operation of the lifting / lowering means 15 is controlled by the control unit 10.

  According to the head 6 and the second moving means 8 configured as described above, as shown in FIG. 3, the nozzle 3 is positioned above the elevating hole 6 b on the circulation path R by the second moving means 8. When moved to the lower access position R1 (hereinafter referred to as the lower access position R1), the nozzle 3 is lowered by the elevating means 15, so that the end 2 of the nozzle 3 is lifted from the upper surface side of the head body 6a. It is possible to move to the lower surface side through 6b (see the two-dot chain line in FIG. 3). Thereby, the nozzle 3 moved to the lower access position R1 can suck the electronic component E by the nozzle 3 on the component supply device 4, and can mount the electronic component E by the nozzle 3 on the production substrate P. It becomes. That is, in the present embodiment, the lower access position R1 is the suction position and the mounting position.

Here, in order to explain the relationship between the suction position and the mounting position and the circulation path R, the operation of the electronic component mounting apparatus 1 will be briefly described (details will be described in the electronic component mounting method described later). ).
First, the nozzle 3 located at the lower access position R1 adsorbs the electronic component E on the component supply device 4, and then moves around the circulation path R one round (hereinafter referred to as nozzle first round movement). As a result, the nozzle 3 is again positioned at the lower access position R1. At this time, the nozzle 3 mounts the electronic component E on the production substrate P, and then further moves around the circulation path R one turn (hereinafter referred to as nozzle second turn movement). As a result, the nozzle 3 is again positioned at the lower access position R1, and at this time, the electronic component E is sucked by the component supply device 4.

  By operating the electronic component mounting apparatus 1 as described above, the nozzle 3 simply moves around the circulation path R around the rotation path R based on the lower access position R1. During the first nozzle movement, the nozzle 3 moves from the suction position toward the mounting position, and during the second nozzle movement, the nozzle 3 moves from the mounting position to the suction position. Will move towards. As described above, the second moving unit 8 intermittently moves the nozzle 3 around between the suction position and the mounting position.

As shown in FIGS. 2 and 3, the imaging unit 9 includes, for example, a camera and an illumination unit that irradiates the nozzle 3 during imaging by the camera, and the imaging data captured by the imaging unit 9 is controlled. Sent to the unit 10.
In the present embodiment, the imaging means 9 is disposed on the circuit route R. As shown in FIG. 2, in the illustrated example, the imaging means 9 is located on the circular path R opposite to the lifting hole 6 b across the central axis of the head body 6 a that is the central axis of the circular path R. It arrange | positions so that it may be located in the side. As shown in FIG. 3, the imaging unit 9 is formed such that there is a gap in the Z direction between the lower end of the nozzle 3 moved above the imaging unit 9 by the second moving unit 8. .

  Here, as shown in FIG. 3, the imaging means 9 is disposed below the position where the nozzle 3 that is orbitally moved by the second moving means 8 is moved upward on the circulation path R. Even if the nozzle 3 is simply moved by the second moving means 8, it is easy to avoid the nozzle 3 above the imaging means 9. Therefore, even if a configuration having a large size (for example, a lens or the like) along the Z direction is employed as the imaging unit 9, for example, it is not necessary to raise the nozzle 3 by the separate lifting / lowering unit 15. Therefore, the movement of the nozzle 3 can be simplified.

  Further, the imaging means 9 is arranged so that the nozzle 3 is positioned on the circulation path R while moving from the suction position to the mounting position when the nozzle first round movement, and In the second round movement of the nozzle, the nozzle 3 is arranged on the circulation path R so as to be positioned between the mounting position and the suction position.

  As shown in FIG. 2, in the present embodiment, the discard unit 50 is disposed on the circuit route R. In the illustrated example, the disposal unit 50 is disposed on the circuit route R from the imaging means 9 to the lifting hole 6b. That is, the disposal unit 50 is disposed so that the nozzle 3 is positioned on the circulation path R while the nozzle 3 moves from the imaging unit 9 toward the mounting position when the nozzle first moves. In the second round movement of the nozzle, the nozzle 3 is arranged on the circulation path R so as to be positioned from the imaging means 9 toward the suction position.

  The disposal unit 50 is formed in a bottomed cylindrical shape having an upper end opening 51, and is fixed to the head body 6a with the upper end opening 51 facing upward. The disposal unit 50 is formed to have a rectangular shape in the plan view so that one side in the plan view matches the X direction and the other side in the plan view matches the Y direction. Is arranged. Further, as shown in FIG. 3, the disposal unit 50 is formed so that a gap is formed in the Z direction between the lower end of the nozzle 3 moved above the disposal unit 50 by the second moving means 8.

  Further, as shown in FIG. 4, in the illustrated example, the disposal unit 50 has cleaning means 52 that wipes and cleans the end portion 2 of the nozzle 3 when the nozzle 3 enters the inside from the upper end opening 51. Is provided. In the present embodiment, the cleaning means 52 includes a plurality of brush bodies 53 that are disposed in the upper end opening 51 and clean the end 2 by contacting the end 2 of the nozzle 3.

As shown in FIG. 5, the brush body 53 includes a core portion 53a made of an elastic body formed in a linear shape, and a hair portion 53b that protrudes radially from the outer surface of the core portion 53a. The core portion 53a is made of, for example, rubber, and the hair portion 53b is made of, for example, nylon.
In the present embodiment, as shown in FIG. 4, the plurality of brush bodies 53 extend along the Y direction and are spaced from each other in the X direction. The brush bodies 53 are arranged so that the distance between the brush bodies 53 adjacent to each other in the X direction is as small as possible while maintaining the size through which the nozzle 3 can pass. In the illustrated example, the interval between the brush bodies 53 adjacent to each other in the X direction is L3 larger than the size L1 and smaller than the size L2. Thereby, these brush bodies 53 can be used as a lid of the disposal unit 50.
In the illustrated example, both ends of the brush body 53 are fixed to upper ends of both end faces 54 of the disposal unit 50 facing the Y direction. Further, in the illustrated example, seven brush bodies 53 are arranged in parallel in the X direction, but the number of brush bodies 53 is not limited to seven.

As shown in FIG. 1, the control unit 10 determines whether or not the electronic component E held in the nozzle 3 needs to be discarded based on the imaging data obtained by the imaging unit 9, and based on the determination result. Thus, the suction and release of the nozzle 3 and the second moving means 8 are controlled.
Further, the control unit 10 can determine whether the posture of the electronic component E sucked by the nozzle 3 is a normal posture or an abnormal posture based on the imaging data sent from the imaging means 9. In the present embodiment, when the imaging data sent from the imaging means 9 matches the image data stored in advance in the control unit 10 corresponding to the electronic component E, the posture is normal, and otherwise the posture is abnormal. Judge that there is.

  Further, the control unit 10 can determine whether or not the electronic component E is held at the end 2 of the nozzle 3 based on the imaging data sent from the imaging means 9. In the present embodiment, when the imaging data sent from the imaging unit 9 matches the image data obtained by imaging the nozzle 3 stored in the control unit 10 in advance from the end 2 side, it is not retained. It is determined that it is held.

Next, an example of an electronic component mounting method using the electronic component mounting apparatus 1 configured as described above will be described.
First, an operator of this apparatus mounts a tape on the component supply apparatus 4, and the control unit 10 performs a preparation process for transporting the production substrate P to the substrate transport apparatus 5 to the mounted position.
Next, the control unit 10 controls the first moving unit 7 to perform a first head moving step of moving the head main body 6a so that the elevation hole 6b is positioned on the supply position. At this time, the control unit 10 controls the second moving unit 8 to move one of the plurality of nozzles 3 to the lower access position R1.

Next, an adsorption process is performed in which the electronic component E supplied by the component supply device 4 is adsorbed by the nozzle 3.
In this process, first, the control unit 10 causes the component supply device 4 to feed out the tape and supply the electronic component E to the supply position. Next, the control unit 10 controls the elevating means 15 to lower the nozzle 3. Then, the control unit 10 controls the positive / negative pressure supply means 12 to adsorb the electronic component E to the end surface 2 a of the nozzle 3, and then controls the elevating means 15 to raise the nozzle 3.

Next, a nozzle circling step is performed in which the nozzle 3 is circulated in the head 6 along the circling path R. At this time, with respect to the nozzle 3 located at the lower access position R1, the nozzle 3 adjacent to the counterclockwise direction around the central axis of the head body 6a in plan view from above is moved to the lower access position R1. Let
And in this embodiment, the nozzle 3 (henceforth the start nozzle 3) which adsorb | sucked the electronic component E first in an adsorption | suction process is the imaging means on the said circumference | surroundings path | route R. Repeat until moved above 9.

In the present embodiment, when the start nozzle 3 is moved above the imaging means 9 on the circulation path R, the nozzle 3 is moved in parallel with the suction process described above after the nozzle circulation process. A first imaging step of imaging from the end 2 side is performed.
At this time, the control unit 10 causes the image pickup unit 9 to pick up an image of the nozzle 3 that has been moved above the image pickup unit 9 on the circulation path R from the end 2 side, and sends the image pickup data to the control unit 10.

Furthermore, in the present embodiment, in parallel with the first imaging step, a first determination step for determining whether or not the electronic component E held in the nozzle 3 needs to be discarded is based on the imaging data obtained by the imaging means 9. I do.
In this process, the control unit 10 determines whether the attitude of the electronic component E sucked by the nozzle 3 is a normal attitude or an abnormal attitude based on the imaging data sent from the imaging means 9. And about the nozzle 3 determined that the electronic component E to hold | maintain is an abnormal attitude | position, it determines with the disposal of the electronic component E being required, and regarding the nozzle 3 determined to be a normal attitude | position, the electronic It is determined that the disposal of the part E is unnecessary.

  As described above, after the start nozzle 3 is moved above the imaging means 9 on the circulation path R, the suction process, the first imaging process, and the first determination process are performed after the nozzle circulation process. Are performed in parallel for different nozzles 3. And in this embodiment, the said start nozzle 3 is moved above the disposal unit 50 on the said circulation path | route R through the adsorption | suction process mentioned above, a 1st imaging process, a 1st determination process, and a nozzle circulation process. Repeat until.

  In the present embodiment, after the start nozzle 3 is moved above the disposal unit 50 on the circulation path R, after the nozzle circulation process, the suction process, the first imaging process, and the first determination process are performed. In parallel, a disposal process for discarding the electronic component E in the disposal unit 50 is performed. The discarding process is performed only for the nozzle 3 that is determined to require the disposal of the held electronic component E, but the following description is based on the assumption that the disposal is determined to be necessary.

  FIG. 6 is a process diagram for explaining an electronic component mounting method using the electronic component mounting apparatus shown in FIG. 1, and is a sectional view of each of the nozzle and the disposal unit before the disposal step. FIG. 7 is a process diagram illustrating a state in which the nozzle has entered the inside of the disposal unit after the state illustrated in FIG. 6. FIG. 8 is a diagram illustrating a state in which the nozzle is turned back to the outside of the disposal unit after the state illustrated in FIG. 7.

In the present embodiment, the discarding process is performed by causing the nozzle 3 to enter the disposal unit 50. Further, in the present embodiment, in the discarding process, an internal cleaning process is performed in which compressed air is supplied to the inside of the nozzle 3 to clean the inside of the nozzle 3.
In this process, as shown in FIG. 6, after the nozzle 3 determined in the first determination process that the electronic component E to be held needs to be discarded is moved above the disposal unit 50 through the nozzle circulation process. As shown in FIG. 7, the control unit 10 controls the elevating means 15 to move the nozzle 3 downward, and causes the nozzle 3 to enter the inside from the upper end opening 51 of the disposal unit 50.

At this time, the core 53a of the brush body 53 is formed of an elastic body, and the end 2 of the nozzle 3 is tapered, so that the nozzle 3 moves to the end 2 while moving downward. The core 53a of the brush body 53 that contacts the outer surface moves so as to be pushed toward the X direction. Thereby, the edge part 2 of the nozzle 3 is wiped by the brush body 53 and cleaned.
That is, at this time, the nozzle 3 enters the inside of the disposal unit 50 while contacting the nozzle 3 and the brush body 53 through the gaps between the plurality of brush bodies 53 adjacent in the X direction. The end 2 can be cleaned. Therefore, for example, compared with the case where the brush body 53 is irregularly arranged as a cleaning means, it becomes easier to pass the cleaning means 52 through the nozzle 3, and the end portion 2 of the nozzle 3 can be easily cleaned. .

Next, the control unit 10 controls the positive pressure / negative pressure supply means 12 to supply compressed air (positive pressure) to the inside of the nozzle 3 so that the electronic component E held at the end 2 of the nozzle 3 is supplied. The electronic component E is discarded in the disposal unit 50 by dropping. Thereby, it becomes possible to perform an internal cleaning process, discarding the electronic component E. FIG.
Further, by performing the internal cleaning process in the disposal process, not only the end 2 of the nozzle 3 but also the inside of the nozzle 3 can be cleaned, and the occurrence of poor suction of the electronic component E can be suppressed. In addition, since the brush body 53 is arranged so as to be a lid of the disposal unit 50, the electronic component E in the disposal unit 50 tends to jump out to the outside by the compressed air supplied to the inside of the nozzle 3. Even in this case, this pop-out can be suppressed by the brush body 53.

  Next, as shown in FIG. 8, the control unit 10 controls the lifting / lowering means 15 to move the nozzle 3 from the inside of the disposal unit 50 to the outside. At this time, the core portion 53a of the brush body 53 that has been pushed in the X direction by the nozzle 3 moves so as to return to the position before being pushed by the elastic force. Thereby, the edge part 2 of the nozzle 3 is wiped by the brush body 53 again and cleaned. At this time, since the electronic component E is not held at the end 2 of the nozzle 3, the end 2 of the nozzle 3 can be more reliably cleaned.

As described above, after the start nozzle 3 is moved above the disposal unit 50 on the circulation path R, the suction process, the first imaging process, and the first determination process are performed after the nozzle circulation process. And a discarding process is performed in parallel with respect to each different nozzle 3 as needed.
As described above, even when the suction failure of the electronic component E of the component supply device 4 by the nozzle 3 occurs, the electronic component E is securely discarded by the disposal unit 50 while the electronic component E sucked by the nozzle 3 is discarded. It is possible to reduce the time required for disposal.

  Then, after performing the suction process for all the nozzles 3 mounted on the head 6, that is, after the nozzle 3 moves around the circulation path R once and completes the first nozzle movement, the control unit 10 Then, the first moving means 7 is controlled to perform a second head moving step of moving the head main body 6a so that the lifting hole 6b is positioned on the mounted position.

  In parallel with the second head moving step, the control unit 10 determines that the lower access position in the circulation path R among the nozzles 3 in which the posture of the electronic component E to be held is determined as the normal posture in the first determination step. At least one nozzle rotation step is performed so that the nozzle 3 located closest to R1 is moved to the lower access position R1. As a result, the start nozzle 3 starts the second nozzle movement. Moreover, after performing a nozzle circumference process, the 1st imaging process and 1st determination process which were mentioned above, and a discard process as needed are implemented in parallel with respect to each different nozzle 3, respectively.

Next, a mounting process for mounting the electronic component E sucked by the nozzle 3 on the production substrate P is performed.
In this process, the control unit 10 controls the elevating means 15 to lower the nozzle 3 moved to the lower access position R1, and then controls the positive / negative pressure supply means 12 to control the end face 2a of the nozzle 3. The suction of the electronic component E is released, and the electronic component E is mounted on the production board P. Thereafter, the control unit 10 controls the elevating means 15 to raise the nozzle 3. At this time, when the mounting of the electronic component E required for one production substrate P is completed, the control unit 10 causes the substrate conveyance device 5 to convey the production substrate P to the next process, and from the previous process. Another production substrate P is transported to and supported by the mounted position.

  Next, after the mounting process is completed, the control unit 10 determines whether the held electronic component E is in the position closest to the lower access position R1 among the nozzles 3 in which the attitude of the electronic component E to be held is determined to be the normal attitude. 3 is performed at least once so that the nozzle 3 is moved to the lower access position R1. And after performing a nozzle circumference process, the electronic component which implements and hold | maintains the 1st imaging process and 1st determination process which were mentioned above, and the discarding process in parallel with respect to each different nozzle 3, respectively as needed After the nozzle 3 in which the posture E is determined to be a normal posture in the first determination step is moved to the lower access position R1, the mounting step is performed.

  As described above, after the second head moving step, after the nozzle turning step, the first imaging step and the first determination step, and if necessary, the discarding step and the mounting step are different from each other. Will be performed in parallel. In the present embodiment, the first imaging step, the first determination step, the discarding step, the mounting step, and the nozzle rotation step described above are performed in the circulation path R when the start nozzle 3 moves in the nozzle second rotation. Repeat until it is moved above the imaging means 9 above.

Further, in this embodiment, after the start nozzle 3 is moved above the imaging means 9 on the circulation path R in the second nozzle movement, after the nozzle circulation process, the production substrate is used in the mounting process. In order to check whether or not the electronic component E mounted on P is brought home by the nozzle 3, a second imaging step and a second determination step are performed.
Here, regarding the second imaging step and the second determination step, the description of the same parts as the first imaging step and the first determination step described above will be omitted, and only different points will be described.

In the second imaging step, the control unit 10 causes the imaging unit 9 to image from the end 2 side only for the nozzle 3 for which the posture of the electronic component E to be held is determined to be the normal posture in the first determination step.
In the second determination step, the control unit 10 determines whether or not the electronic component E is held at the end portion 2 of the nozzle 3 based on the imaging data imaged in the second imaging step, and is not held. If it is determined that the electronic component E has not been taken home, it is determined that the electronic component E has been taken home if it has been held. Then, regarding the nozzle 3 determined to be brought home, it is determined that the electronic component E needs to be discarded, and for the nozzle 3 determined not to be taken home, it is determined that disposal is unnecessary.

  As described above, after the start nozzle 3 is moved above the imaging means 9 on the circulation path R in the second nozzle movement, after the nozzle circulation process, the disposal process and the mounting process are performed. The process, the second imaging process, and the second determination process are performed in parallel for different nozzles 3 as necessary. In this embodiment, the posture of the electronic component E that holds the above-described disposal step, mounting step, second imaging step, second determination step, and nozzle rotation step is determined to be a normal posture in the first determination step. This is repeated until the mounting process is completed for all the nozzles 3.

In addition, after completing the mounting process for all the nozzles 3 in which the attitude of the electronic component E to be held is determined to be the normal attitude in the first determination process, the control unit 10 performs the first head movement process described above. Then, a series of subsequent steps are repeated.
In the present embodiment, since the disposal unit 50 is disposed on the circulation path R so that the nozzle 3 is located from the imaging means 9 toward the suction position, the control unit in the second determination step 10, when it is determined that the electronic component E needs to be discarded, the nozzle 3 moves toward the suction position, and the electronic component E held by the nozzle 3 may be discarded in the disposal unit 50 before the suction process is performed. it can. Therefore, even when the electronic component E mounted on the production board P is brought back by the nozzle 3, the electronic component E is securely discarded by the disposal unit 50 while being brought back to the nozzle 3. It is possible to reduce the time required for disposal.

According to the electronic component mounting apparatus 1 configured as described above, since the disposal unit 50 is disposed on the circulation path R, the nozzle 3 is moved on the circulation path R by the second moving means 8. Sometimes, the electronic component E can be discarded in the disposal unit 50 in parallel with this movement. Therefore, the time required for discarding the electronic component E can be reduced.
Further, since the image pickup means 9 is disposed on the circulation path R, when the nozzle 3 is moved on the rotation path R by the second movement means 8, the nozzle 3 is stopped in parallel with this movement. Images can be taken from the unit 2 side. Therefore, the time required for discarding the electronic component E can be further reduced.

Further, since the disposal unit 50 is provided with cleaning means 52 that wipes and cleans the end 2 of the nozzle 3 when the nozzle 3 enters the inside from the upper end opening 51, the electronic component E is disposed in the disposal unit. When the nozzle 3 is made to enter the disposal unit 50 from the upper end opening 51 for disposal to 50, the end 2 of the nozzle 3 can be wiped and cleaned by the cleaning means 52. Generation | occurrence | production of the adsorption | suction defect of the electronic component E resulting from the contamination of the edge part 2 can be suppressed. Therefore, the disposal of the electronic component E can be suppressed.
Moreover, since the nozzle 3 can be cleaned when the electronic component E is disposed in the disposal unit 50 through the upper end opening 51 in order to discard the electronic component E in the disposal unit 50, for example, the nozzle 3 is replaced. Compared to the case, the end 2 of the nozzle 3 can be cleaned in a short time.

  In addition, since the disposal process is performed by causing the nozzle 3 to enter the interior of the disposal unit 50, it is possible to clean the end 2 of the nozzle 3 every time the disposal process is performed due to an adsorption failure caused by the nozzle 3. The end 2 of the nozzle 3 can be cleaned immediately when the end 2 of the nozzle 3 is contaminated to such an extent that a suction failure occurs. Accordingly, it is possible to suppress the suction operation from being performed by the nozzle 3 whose end 2 is contaminated, and it is possible to suppress the occurrence of poor suction of the electronic component E.

  In addition, since the first determination process and the second determination process are performed both between the suction process and the mounting process and after the mounting process, the suction failure of the electronic component E by the nozzle 3 in the suction process, and the mounting It is possible to determine both the take-back of the electronic component E mounted on the production substrate P in the process by the nozzle 3. Therefore, it is possible to more reliably suppress the suction operation with the nozzle 3 having the contaminated end portion 2 as compared with the case where the determination is performed at only one of the timings.

(Second Embodiment)
Next, a second embodiment of the electronic component mounting apparatus according to the present invention will be described.
In the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, description thereof is omitted, and only different points will be described.
FIG. 9 is a schematic perspective view of a disposal unit in the second embodiment of the electronic component mounting apparatus according to the present invention.

  In the electronic component mounting apparatus 30 of the present embodiment, as shown in FIG. 9, side opening portions 61 that are continuous with the upper end opening portion 51 are formed on both end surfaces 54 facing the Y direction in the disposal unit 60. . In the illustrated example, the side opening 61 is formed over the entire upper portion of the both end faces 54. Hereinafter, of the two side openings 61, the side opening 61 (the back side shown in FIG. 9) positioned on the front side in the circulation path R is referred to as one side opening 61, and the circulation path The side opening 61 (the front side shown in FIG. 9) located on the rear side in R is referred to as the other side opening 61.

  And the brush body 53 with which the cleaning means 62 is provided is discarded along the Z direction gradually from one end located on the front side in the circulation route R toward the other end located on the rear side in the circulation route R. It extends so as to incline toward the inside of the unit 60. Further, in the illustrated example, a plurality of brush bodies 53 are arranged along the Z direction, and at the other end where the adjacent ones along the Z direction are located at the rear side at least in the circulation path R. They are arranged at intervals. In FIG. 9, a part of the cleaning means 62 is not shown for easy viewing of the drawing. In FIG. 9, the number of brush bodies 53 arranged along the Z direction is four, but is not limited to four.

  In the illustrated example, a plurality of support brush bodies 63 that support the brush bodies 53 extend in the Z direction and are spaced from each other in the X direction in each side opening 61. Has been placed. In the illustrated example, the supporting brush body 63 includes a core portion and a hair portion, similarly to the brush body 53, and each of the core portion and the hair portion is formed of the same material as the brush body 53. The supporting brush body 63 disposed in the one side opening 61 and the supporting brush body 63 disposed in the other side opening 61 correspond to each other. They are arranged so that they face each other in the Y direction. In the illustrated example, the upper end of the support brush body 63 is at the same position as the upper end of the disposal unit 60 in the Z direction. One end of the brush body 53 is fixed to a support brush body 63 disposed in the side opening 61 on the one side, and the other end of the brush body 53 is a support to which the one end is fixed. It is fixed to another supporting brush body 63 disposed in the side opening 61 on the other side so as to face the brush body 63.

  Further, one end of each of the plurality of brush bodies 53 arranged in the Z direction is fixed to the upper end of the supporting brush body 63 arranged in the side opening 61 on the one side. Further, the other ends of the plurality of brush bodies 53 arranged in the Z direction are for support arranged in the side opening 61 on the other side with an equal interval between those adjacent in the Z direction. The brush body 63 is fixed.

  In the illustrated example, the brush body 53 arranged in the Z direction has the other end of the uppermost one disposed in the side opening 61 on the other side. The upper end of 63 is fixed. Of the plurality of brush bodies 53 arranged in the Z direction, the other end of the lowermost one of the brush bodies 53 is the support brush body 63 arranged in the side opening 61 on the other side. It is fixed at the lower end.

Next, an example of an electronic component mounting method using the electronic component mounting apparatus 30 configured as described above will be described. FIG. 10 is a process diagram for explaining an electronic component mounting method using the disposal unit shown in FIG.
The electronic component mounting method in the present embodiment is different from the electronic component mounting method in the first embodiment in the disposal process. In the following, as a result of performing the first determination process or the second determination process, the posture of the electronic component E held at the end 2 of the predetermined nozzle 3 is abnormal, or the nozzle 3 brings back the electronic component E. An example of a method for performing the discarding process of the electronic component E held by the nozzle 3 when it is determined and determined that disposal is necessary will be described.

  First, as shown in FIG. 10, the controller 10 determines that the nozzle determined to need to discard the electronic component E held at the end 2 performs a nozzle circulation process on the circulation path R. When it is located between the image pickup means 9 and the disposal unit 60, the elevating means 15 is controlled so that the lower end of the nozzle 3 is above the lower end of the side opening 61 and the side opening in the Z direction. It is lowered in advance so as to be located below the upper end of the part 61.

  After that, when the control unit 10 appropriately performs the nozzle rotation process similarly to the first embodiment, the nozzle 3 is moved along the rotation path R and passes through the side opening 61 and the upper end opening 51 on the one side. This nozzle 3 enters the disposal unit 60. Therefore, after the nozzle 3 enters the disposal unit 60, the control unit 10 controls the positive pressure / negative pressure supply means 12 to supply compressed air to the inside of the nozzle 3, and to the end 2 of the nozzle 3. The electronic component E is discarded in the disposal unit 60 by dropping the held electronic component E.

Here, the nozzle 3 is lowered so that the lower end of the nozzle 3 is located above the lower end of the side opening 61 and below the upper end of the side opening 61 in the Z direction, and the Z Of the plurality of brush bodies 53 arranged in the direction, the other end of the lowermost one is fixed to the lower end of the supporting brush body 63 arranged in the side opening 61 on the other side. ing. Therefore, after that, in the process in which the controller 10 appropriately performs the nozzle turning step and moves the nozzle 3 along the turning path R, a plurality of end portions 2 of the nozzle 3 are arranged at least in the Z direction. The brush body 53 is in contact with the lowermost one. Thereby, the edge part 2 of the nozzle 3 is wiped by the brush body 53 and cleaned.
Thereafter, the control unit 10 appropriately performs the nozzle turning process, and after the nozzle 3 moves the side opening 61 on the other side from the inside of the disposal unit 60 to the outside, the control unit 10 moves the lifting means 15. The nozzle 3 is raised by control.

According to the electronic component mounting apparatus 30 configured as described above, the same operational effects as those of the electronic component mounting apparatus 1 of the first embodiment can be achieved.
Further, in the discard unit 60, the brush body 53 is gradually disposed along the Z direction from one end located on the front side in the circulation path R toward the other end located on the rear side in the circulation path R. The nozzle 3 is simply moved along the circulation path R from the side opening 61 on one side to the side opening 61 on the other side. The end 2 of the nozzle 3 can be cleaned simply by passing the gap between the brush bodies 53. Therefore, compared with the case where, for example, the nozzle 3 is moved from the inside along the Z direction toward the outside after moving from the outside of the disposal unit 60 along the Z direction, the nozzle 3 is moved back again. 3 can be simplified, and the end 2 of the nozzle 3 can be more easily cleaned.

  Further, since the brush bodies 53 that are adjacent to each other along the Z direction are arranged at an interval at the other end located at least on the rear side of the circulation path R, the one side opening portion is provided. By moving the nozzle 3 along the circulation path R from 61 to the side opening 61 on the other side, the end portion 2 of the nozzle 3 at the portion located on the rear side of the circulation path R in the brush body 53. A plurality of brush bodies 53 can be brought into contact with each other. Therefore, the end 2 of the nozzle 3 can be more reliably cleaned.

The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.
For example, in each of the embodiments, the disposal units 50 and 60 include the cleaning units 52 and 62, but the cleaning units 52 and 62 may not be provided. In this case, it is not necessary to raise and lower the nozzle 3 in the disposal step.
In each of the above embodiments, the nozzle 3 is moved with respect to the disposal units 50 and 60 when the nozzle 3 enters the disposal units 50 and 60. However, the present invention is not limited to this. The disposal units 50 and 60 may be moved. That is, it is only necessary that the disposal units 50 and 60 and the nozzle 3 move relatively so that the nozzle 3 enters the interior of the disposal units 50 and 60.

  In each of the above embodiments, the suction position and the mounting position in the head 6 are the same position (the lower access position R1). However, the present invention is not limited to this, and the suction position and the mounting position are not limited thereto. The position may be different from the position. However, since the suction position and the mounting position in the head 6 are the same position, as shown in each of the above embodiments, the nozzle 6 is simply provided by the image pickup means 9 and the disposal units 50 and 60 one by one. No matter whether the electronic component E of the electronic component E of the component supply device 4 due to 3 is defective or when the electronic component E mounted on the production board P is brought back by the nozzle 3, the disposal is required. It is preferable because the electronic component E can be reliably discarded by the disposal units 50 and 60.

Moreover, in each said embodiment, although both the 1st imaging process and the 1st determination process and the 2nd imaging process and the 2nd determination process are performed, you may make it perform only any one.
In each of the above embodiments, the imaging unit 9 is disposed on the circulation path R. However, the imaging unit 9 is not limited thereto, and may be disposed on the base 11, for example. In this case, it is necessary to temporarily move the head main body 6a onto the imaging means 9 regardless of whether the first imaging process or the second imaging process is performed.

  In addition, it is possible to appropriately replace the constituent elements in the embodiment with known constituent elements without departing from the spirit of the present invention, and the above-described modified examples may be appropriately combined.

1 is a schematic plan view showing a first embodiment of an electronic component mounting apparatus according to the present invention. It is a typical top view of the head in the electronic component mounting apparatus shown in FIG. It is arrow A figure shown in FIG. It is an expansion perspective view of the disposal unit in the electronic component mounting apparatus shown in FIG. It is a figure which shows the brush body with which the disposal unit shown in FIG. 4 is equipped. FIG. 2 is a process diagram for explaining an electronic component mounting method using the electronic component mounting apparatus shown in FIG. 1, and is a sectional view of each of a nozzle and a disposal unit before a disposal process. FIG. 7 is a process diagram illustrating a state in which the nozzle has entered the disposal unit after the state illustrated in FIG. 6. It is a figure which shows the state which the nozzle turned back outside the disposal unit after the state shown in FIG. The typical perspective view of the disposal unit in 2nd Embodiment of the electronic component mounting apparatus which concerns on this invention is shown. FIG. 10 is a process diagram for explaining an electronic component mounting method using the disposal unit shown in FIG. 9.

Explanation of symbols

E Electronic parts P Production board (mounted part)
R Circulation route R1 Lower access position (suction position, mounting position)
DESCRIPTION OF SYMBOLS 1, 30 Electronic component mounting apparatus 2 End part 3 Nozzle 4 Component supply apparatus 5 Board | substrate conveyance apparatus 6 Head 7 1st moving means 8 2nd moving means 9 Imaging means 10 Control part 50, 60 Waste unit 51 Upper end opening part 52, 62 Cleaning means

Claims (5)

A supply unit for supplying electronic components;
A support portion for supporting a mounted portion on which an electronic component is mounted,
An electronic component mounting apparatus for transporting an electronic component supplied to the supply unit and mounting the electronic component on the mounted unit,
A plurality of nozzles having ends capable of sucking and releasing electronic components; and
A head on which the plurality of nozzles are mounted;
First moving means for moving the head between the supply section and the mounted section;
In the head, the nozzle is circulated between a suction position where the electronic component can be sucked by the nozzle on the supply unit and a mounting position where the electronic component can be mounted by the nozzle on the mounted portion. Second moving means for intermittently moving around the route;
Imaging means for imaging the nozzle on the circulation path from an end side;
Based on the imaging data obtained by the imaging means, it is determined whether or not the electronic component held by the nozzle needs to be discarded, and based on the determination result, the nozzle is sucked and released, and the second moving means. A control unit for controlling
A disposal unit for discarding the electronic components held by the nozzle,
The electronic component mounting apparatus, wherein the discard unit is disposed on the circuit path. The electronic component mounting apparatus according to claim 1,
The electronic component mounting apparatus according to claim 1, wherein the imaging unit is disposed on the circulation path. The electronic component mounting apparatus according to claim 2,
The imaging means is disposed so that the nozzle is located on the circuit path from the suction position toward the mounting position,
The electronic component mounting apparatus, wherein the disposal unit is disposed on the circuit path while the nozzle is located from the imaging unit toward the mounting position. The electronic component mounting apparatus according to claim 2,
The imaging means is disposed so that the nozzle is located on the circuit path from the mounting position toward the suction position,
The electronic component mounting apparatus according to claim 1, wherein the disposal unit is arranged so that the nozzle is positioned on the circulation path while the nozzle is directed from the imaging unit to the suction position. The electronic component mounting apparatus according to any one of claims 1 to 4,
The disposal unit is formed in a bottomed cylindrical shape having an upper end opening,
The electronic component mounting apparatus according to claim 1, wherein the disposal unit includes a cleaning unit that wipes and cleans an end portion of the nozzle when the nozzle enters the inside from the upper end opening.

Images