JP2010123658A5 - - Google Patents

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Publication number
JP2010123658A5
JP2010123658A5 JP2008294259A JP2008294259A JP2010123658A5 JP 2010123658 A5 JP2010123658 A5 JP 2010123658A5 JP 2008294259 A JP2008294259 A JP 2008294259A JP 2008294259 A JP2008294259 A JP 2008294259A JP 2010123658 A5 JP2010123658 A5 JP 2010123658A5
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JP
Japan
Prior art keywords
substrate
liquid
back surface
disk
nozzle device
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Application number
JP2008294259A
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English (en)
Japanese (ja)
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JP5198223B2 (ja
JP2010123658A (ja
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Priority to JP2008294259A priority Critical patent/JP5198223B2/ja
Priority claimed from JP2008294259A external-priority patent/JP5198223B2/ja
Publication of JP2010123658A publication Critical patent/JP2010123658A/ja
Publication of JP2010123658A5 publication Critical patent/JP2010123658A5/ja
Application granted granted Critical
Publication of JP5198223B2 publication Critical patent/JP5198223B2/ja
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JP2008294259A 2008-11-18 2008-11-18 基板処理装置および基板処理方法 Active JP5198223B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008294259A JP5198223B2 (ja) 2008-11-18 2008-11-18 基板処理装置および基板処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008294259A JP5198223B2 (ja) 2008-11-18 2008-11-18 基板処理装置および基板処理方法

Publications (3)

Publication Number Publication Date
JP2010123658A JP2010123658A (ja) 2010-06-03
JP2010123658A5 true JP2010123658A5 (cg-RX-API-DMAC7.html) 2012-01-12
JP5198223B2 JP5198223B2 (ja) 2013-05-15

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ID=42324766

Family Applications (1)

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JP2008294259A Active JP5198223B2 (ja) 2008-11-18 2008-11-18 基板処理装置および基板処理方法

Country Status (1)

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JP (1) JP5198223B2 (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6158737B2 (ja) 2014-03-31 2017-07-05 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
JP6454123B2 (ja) * 2014-10-09 2019-01-16 ライト工業株式会社 法面吹付装置及び法面吹付工法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05234868A (ja) * 1992-01-30 1993-09-10 Nec Corp スピン式レジスト塗布装置
JP3479602B2 (ja) * 1998-10-08 2003-12-15 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP2005311150A (ja) * 2004-04-23 2005-11-04 Seiko Epson Corp スピンコータ及び基板裏面の洗浄方法
JP2006114884A (ja) * 2004-09-17 2006-04-27 Ebara Corp 基板洗浄処理装置及び基板処理ユニット
JP4757126B2 (ja) * 2005-10-11 2011-08-24 東京エレクトロン株式会社 基板処理方法及び基板処理装置

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