JP2010114401A - リードフレームの内部接続構造、及び、その接続方法 - Google Patents

リードフレームの内部接続構造、及び、その接続方法 Download PDF

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JP2010114401A
JP2010114401A JP2008318106A JP2008318106A JP2010114401A JP 2010114401 A JP2010114401 A JP 2010114401A JP 2008318106 A JP2008318106 A JP 2008318106A JP 2008318106 A JP2008318106 A JP 2008318106A JP 2010114401 A JP2010114401 A JP 2010114401A
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thin film
lead frame
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internal connection
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Chin-Fa Wang
進發 王
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Powertech Technology Inc
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Abstract

【課題】リードフレームの内部接続構造、及び、その接続方法を提供する。
【解決手段】リードフレームの内部接続構造は、複数のリード１０、１０’と、一部のリードの第一表面に設置される絶縁薄膜２０と、絶縁薄膜上に設置されて、一部のリードの第一表面を露出する複数の開口２２と、絶縁薄膜を露出するリードに選択的に電気的接続される少なくとも一つの導電素子３０と、からなる。リードフレームの内部接続方法は、絶縁薄膜により、導電素子とリードフレームを隔離して、リードフレームの接続を行う。
【選択図】図１

Description

本発明は、リードフレームの内部接続構造、及び、その接続方法に関するものである。
半導体産業の高度発展に伴い、電子製品は、IC素子の設計上、多ピン数と多功能化が求められ、素子外観上では、軽薄短小の発展趨勢にある。よって、パッケージ工程において、リードフレームの設計はますます複雑になり、パッケージ材料の選択、薄型パッケージの変形、散熱性や構造強度の問題を解決しなければならない。
更に、リードフレーム設計がインナーリードを横切る場合、インナーリードがワイヤーボンド箇所に延伸する大きな空間が必要で、時に、他のインナーリードの干渉により延伸できず、設計上の困難が生じる。
上述の問題を解決するため、本発明は、リードフレームの内部接続構造、及び、その接続方法を提供し、絶縁薄膜により、導電素子とリードフレームを隔離して、リードフレームピンの連接を容易にすることを目的とする。
上述の目的を達成するため、本発明の実施例によるリードフレームの内部接続構造は、複数のリードと、一部のリードの第一表面に設置される絶縁薄膜と、絶縁薄膜上に設置されて、一部のリードの第一表面を露出する複数の開口と、絶縁薄膜を露出するリードに選択的に電気的接続される少なくとも一つの導電素子と、からなる。
本発明の実施例によるリードフレームの内部接続方法は、複数のリードを有するリードフレームを提供する工程と、絶縁薄膜を一部のリードの第一表面に設置し、絶縁薄膜上に複数の開口を有して、一部のリードの第一表面を露出する工程と、少なくとも一つの導電素子を形成し、絶縁薄膜を露出するリードを選択的に電気的接続する工程と、からなる。
本発明のリードフレームの内部接続構造、及び、その接続方法は、絶縁薄膜により、導電素子とリードフレームを隔離し、リードフレームピンの接続を容易にすることができる。
図１（Ａ）と図１（Ｂ）は、本発明の実施例によるリードフレーム内部接続の局部構造を示す図と局部拡大図である。本発明の実施例によるリードフレーム内部接続構造は、図のように、複数のリード１０、１０'を有し、リード１０、１０'の長さは不相同でもよい。絶縁薄膜２０は一部のリード１０、１０'の第一表面に設置され、リード１０、１０'は絶縁薄膜２０上に固定される。複数の開口２２が絶縁薄膜２０上に設置されて、電気的接続が必要な一部のリード１０、１０'の第一表面を露出する。少なくとも一つの導電素子３０は、絶縁薄膜２０の開口２２から露出するリード１０、１０'を選択的に電気的接続する。
実施例中、絶縁薄膜２０は絶縁テープを含み、リード１０、或いは、１０'と導電素子３０のショートを防止する。絶縁薄膜２０の保護があるので、リードフレームのリード設計が更に簡潔になる。この他、絶縁薄膜２０は、リード１０、１０'の固定を省略して、後続の電気的接続を容易にすることができる。本実施例中、導電素子３０は、金属線によるワイヤボンディングの方式で、リード１０と１０'を電気的に接続する。別の実施例中、導電素子３０は、導電ペーストによる適当な方式で、絶縁薄膜２０上に形成し、導通させたいリードを電気的に接続する。また、本実施例中、図中の第一表面はリード１０、１０'の下表面であるが、この構造は、リード１０、１０'の上表面に形成してもよく、つまり、第一表面はリード１０、１０'の上表面である。この他、別の実施例中、図２で示されるように、更に、チップ４０をリードフレーム上に設置して、チップ４０とリードを電気的に接続する。
本発明の実施例によるリードフレームの内部接続方法は、複数のリードを有するリードフレームを提供する工程と、絶縁薄膜を一部のリードの第一表面に設置し、絶縁薄膜上に複数の開口を有して、一部のリードの第一表面を露出する工程と、少なくとも一つの導電素子を形成し、絶縁薄膜を露出するリードを選択的に電気的接続する工程と、からなる。第一表面はリードの上表面でも下表面でもよい。
実施例中、絶縁薄膜上の開口は、絶縁薄膜製作時に一緒に形成することができる。絶縁薄膜の設置工程後に、開孔工程により形成してもよい。この他、別の実施例中、少なくとも一つの導電素子を形成する方法は、ワイヤーボンディングと塗布方式がある。即ち、ワイヤーボンディング方式により、金属線の導電素子でリードを導通させる。また、塗布方式で、導電ペーストの導電素子を絶縁薄膜上に形成し、絶縁薄膜上の開口により、導通が必要なリードを電気的に接続してもよい。絶縁薄膜の使用により、ワイヤーボンディング中に生じるショートを防止することができる。この他、絶縁薄膜の使用により、煩雑なワイヤーボンディングの内部接続工程を簡潔にすることができ、簡単な工程で、製造歩留まりを向上させる。
総合すると、本発明のリードフレームの内部接続構造、及び、その接続方法は、絶縁薄膜により、導電素子とリードフレームを隔離し、リードフレームピンの接続を容易にすることができる。
本発明では好ましい実施例を前述の通り開示したが、これらは決して本発明に限定するものではなく、当該技術を熟知する者なら誰でも、本発明の精神と領域を脱しない範囲内で各種の変動や潤色を加えることができ、従って本発明の保護範囲は、特許請求の範囲で指定した内容を基準とする。
（Ａ）は本発明の実施例によるリードフレーム内部接続の局部構造であり、（Ｂ）は本発明の実施例によるリードフレーム内部接続の局部拡大図である。 図１（Ｂ）のAA'に沿った断面図である。
符号の説明
１０、１０' リード
２０ 絶縁薄膜
２２ 開口
３０ 導電素子
４０ チップ

Claims (10)

  1. リードフレームの内部接続構造であって、
    複数のリードと、
    一部の前記リードの第一表面に設置される絶縁薄膜と、
    前記絶縁薄膜上に設置されて、一部の前記リードの前記第一表面を露出する複数の開口と、
    前記絶縁薄膜を露出する前記リードに選択的に電気的接続される少なくとも一つの導電素子と、
    からなることを特徴とするリードフレームの内部接続構造。
  2. 前記絶縁薄膜は絶縁テープであることを特徴とする請求項１に記載のリードフレームの内部接続構造。
  3. 前記導電素子は金属線と金属ペーストであることを特徴とする請求項１または請求項２に記載のリードフレームの内部接続構造。
  4. 前記リードの長さは異なっていてもよいことを特徴とする請求項１から請求項３の何れかに記載のリードフレームの内部接続構造。
  5. 前記第一表面は前記リードの上表面か下表面であることを特徴とする請求項１から請求項４の何れかに記載のリードフレームの内部接続構造。
  6. リードフレームの内部接続方法であって、
    複数のリードを有するリードフレームを提供する工程と、
    絶縁薄膜を一部の前記リードの第一表面に設置し、前記絶縁薄膜上に複数の開口を有して、一部の前記リードの前記第一表面を露出する工程と、
    少なくとも一つの導電素子を形成し、前記絶縁薄膜を露出する前記リードを選択的に電気的接続する工程と、
    からなることを特徴とするリードフレームの内部接続方法。
  7. 前記開口は前記絶縁薄膜製作時に一緒に形成することを特徴とする請求項６に記載のリードフレームの内部接続方法。
  8. 前記絶縁薄膜設置工程後、更に、開孔工程を有し、前記開口を前記絶縁薄膜上に形成することを特徴とする請求項６または請求項７に記載のリードフレームの内部接続方法。
  9. 前記第一表面は前記リードの上表面か下表面であることを特徴とする請求項６から請求項８の何れかに記載のリードフレームの内部接続方法。
  10. 前記導電素子の形成方法はワイヤーボンディングと塗布方法があることを特徴とする請求項６から請求項９の何れかに記載のリードフレームの内部接続方法。
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