JP2010109526A5 - Vibrating piece, vibrator, and method of manufacturing the vibrating piece - Google Patents
Vibrating piece, vibrator, and method of manufacturing the vibrating piece Download PDFInfo
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- JP2010109526A5 JP2010109526A5 JP2008277803A JP2008277803A JP2010109526A5 JP 2010109526 A5 JP2010109526 A5 JP 2010109526A5 JP 2008277803 A JP2008277803 A JP 2008277803A JP 2008277803 A JP2008277803 A JP 2008277803A JP 2010109526 A5 JP2010109526 A5 JP 2010109526A5
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- groove
- resonator element
- vibrating
- wafer
- vibrating piece
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Description
本発明は、上述の課題の少なくとも一部を解決するためになされたものであり、以下の形態または適用例として実現することが可能である。
本発明の第１の形態に係る振動片は、厚み滑り振動を励振する振動部と、前記振動部の厚みよりも厚みの薄い薄肉部と、を含み、前記薄肉部は、前記振動部の周縁の少なくとも一部に沿って配置されている溝を備えていることを特徴する。
本発明の第２の形態に係る振動片は、前記溝は、平面視で、前記振動部の両側の前記薄肉部に配置されていることを特徴する。
本発明の第３の形態に係る振動片は、前記溝は、平面視で、前記振動部の一方の側の薄肉部と他方の側の薄肉部の少なくとも何れかの薄肉部に複数配置されていることを特徴する。
本発明の第４の形態に係る振動片は、前記振動部の表裏の主面上に配置されている励振電極と、前記薄肉部の主面上に配置されている接続電極と、前記励振電極と前記接続電極とを電気的に接続している電極配線と、を含み、前記溝は、平面視で、前記励振電極と前記接続電極との間にあり、前記電極配線は、前記溝が設けられている領域と異なる領域の前記薄肉部に配置されていることを特徴する。
本発明の第５の形態に係る振動子は、本発明の第４の形態に係る振動片と、パッケージと、を備え、前記振動片の前記接続電極が、前記パッケージに設けられているマウント端子に導電性接合部材により電気的に接続されていることを特徴する。
本発明の第６の形態に係る振動片の製造方法は、厚み滑り振動を励振する振動部と、前記振動部の厚みよりも厚みの薄い薄肉部と、を含み、前記薄肉部が、前記振動部の周縁の少なくとも一部に沿って配置されている溝を備えている振動片を、ウェハを加工して製造する振動片の製造方法であって、少なくとも前記溝に対応する領域を除くように前記振動片に対応する領域の主表面上がレジストで覆われているウェハを準備する第１の準備工程と、前記レジストで覆われていない領域の前記ウェハをエッチングして前記振動片に対応する領域と前記溝を形成する外形及び溝形成工程と、前記振動部に対応する領域の主表面上がレジストで覆われているウェハを準備する第２の準備工程と、前記レジストで覆われていない領域の前記ウェハをエッチングして前記振動部を形成する振動部形成工程と、を含むことを特徴とする。
本発明の第７の形態に係る振動片の製造方法は、前記振動部形成工程は、前記外形及び溝形成工程の後に行われることを特徴とする。
SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.
The resonator element according to the first aspect of the invention includes a vibrating portion that excites thickness shear vibration, and a thin portion that is thinner than a thickness of the vibrating portion, and the thin portion is a peripheral edge of the vibrating portion. It is characterized by providing the groove | channel arrange | positioned along at least one part .
The resonator element according to the second aspect of the invention is characterized in that the groove is disposed in the thin portion on both sides of the vibration portion in plan view .
In the resonator element according to the third aspect of the invention, a plurality of the grooves are arranged in at least one of the thin part on one side and the thin part on the other side of the vibration part in a plan view. It is characterized by being .
The resonator element according to the fourth aspect of the invention includes an excitation electrode disposed on the main surfaces of the front and back surfaces of the vibration unit, a connection electrode disposed on the main surface of the thin portion, and the excitation electrode. And the electrode wiring electrically connecting the connection electrode, and the groove is between the excitation electrode and the connection electrode in plan view, and the electrode wiring is provided with the groove It is arrange | positioned at the said thin part of the area | region different from the area | region currently provided .
A vibrator according to a fifth aspect of the present invention includes the resonator element according to the fourth aspect of the present invention and a package, and the connection terminal of the resonator element is provided on the package. It is electrically connected by a conductive bonding member .
A manufacturing method of a resonator element according to a sixth aspect of the invention includes a vibrating portion that excites thickness shear vibration, and a thin portion that is thinner than a thickness of the vibrating portion, and the thin portion includes the vibration portion. A vibrating piece manufacturing method for manufacturing a vibrating piece including a groove disposed along at least a part of a peripheral edge of a portion by processing a wafer so as to exclude at least a region corresponding to the groove A first preparation step of preparing a wafer whose main surface of a region corresponding to the vibration piece is covered with a resist, and etching the wafer in a region not covered with the resist to correspond to the vibration piece A region and an outer shape for forming the groove and a groove forming step, a second preparation step of preparing a wafer in which a main surface of the region corresponding to the vibrating portion is covered with a resist, and the resist is not covered with the resist The wafer in the area Characterized in that it comprises a vibration unit forming step of forming the vibrating portion by quenching, the.
In the method for manufacturing a resonator element according to the seventh aspect of the invention, the vibrating part forming step is performed after the outer shape and the groove forming step .
Claims (7)
前記振動部の厚みよりも厚みの薄い薄肉部と、
を含み、
前記薄肉部は、
前記振動部の周縁の少なくとも一部に沿って配置されている溝を備えていることを特徴とする振動片。 A vibration part for exciting thickness shear vibration;
A thin portion having a thickness smaller than the thickness of the vibrating portion;
Including
The thin portion is
A vibrating piece comprising a groove disposed along at least a part of the periphery of the vibrating portion .
平面視で、前記振動部の両側の前記薄肉部に配置されていることを特徴とする請求項１に記載の振動片。 The groove is
2. The resonator element according to claim 1, wherein the resonator element is disposed in the thin portion on both sides of the vibrating portion in a plan view .
平面視で、前記振動部の一方の側の薄肉部と他方の側の薄肉部の少なくとも何れかの薄肉部に複数配置されていることを特徴とする請求項１又は２に記載の振動片。 The groove is
3. The resonator element according to claim 1, wherein a plurality of the resonator elements are arranged in at least one of the thin part on one side and the thin part on the other side of the vibration part in a plan view .
前記薄肉部の主面上に配置されている接続電極と、
前記励振電極と前記接続電極とを電気的に接続している電極配線と、
を含み、
前記溝は、
平面視で、前記励振電極と前記接続電極との間にあり、
前記電極配線は、
前記溝が設けられている領域と異なる領域の前記薄肉部に配置されていることを特徴とする請求項１乃至３の何れか一項に記載の振動片。 An excitation electrode disposed on the main surface of the front and back of the vibration part;
A connection electrode disposed on the main surface of the thin portion;
An electrode wiring electrically connecting the excitation electrode and the connection electrode;
Including
The groove is
In plan view, between the excitation electrode and the connection electrode;
The electrode wiring is
4. The resonator element according to claim 1, wherein the resonator element is disposed in the thin portion in a region different from a region in which the groove is provided . 5.
パッケージと、
を備え、
前記振動片の前記接続電極が、
前記パッケージに設けられているマウント端子に導電性接合部材により電気的に接続されていることを特徴とする振動子。 The resonator element according to claim 4,
Package and
With
The connection electrode of the vibrating piece is
A vibrator characterized by being electrically connected to a mount terminal provided in the package by a conductive bonding member .
前記振動部の厚みよりも厚みの薄い薄肉部と、
を含み、
前記薄肉部が、
前記振動部の周縁の少なくとも一部に沿って配置されている溝を備えている振動片を、ウェハを加工して製造する振動片の製造方法であって、
少なくとも前記溝に対応する領域を除くように前記振動片に対応する領域の主表面上がレジストで覆われているウェハを準備する第１の準備工程と、
前記レジストで覆われていない領域の前記ウェハをエッチングして前記振動片に対応する領域と前記溝を形成する外形及び溝形成工程と、
前記振動部に対応する領域の主表面上がレジストで覆われているウェハを準備する第２の準備工程と、
前記レジストで覆われていない領域の前記ウェハをエッチングして前記振動部を形成する振動部形成工程と、
を含むことを特徴とする振動片の製造方法。 A vibration part for exciting thickness shear vibration;
A thin portion having a thickness smaller than the thickness of the vibrating portion;
Including
The thin portion is
A vibrating piece manufacturing method for manufacturing a vibrating piece including a groove disposed along at least a part of the periphery of the vibrating portion by processing a wafer,
A first preparation step of preparing a wafer in which a main surface of a region corresponding to the resonator element is covered with a resist so as to exclude at least a region corresponding to the groove;
Etching the wafer in a region not covered with the resist to form a region corresponding to the vibrating piece and the groove, and a groove forming step;
A second preparation step of preparing a wafer in which a main surface of a region corresponding to the vibrating portion is covered with a resist;
A vibrating portion forming step of forming the vibrating portion by etching the wafer in a region not covered with the resist;
A method of manufacturing a resonator element comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008277803A JP5272651B2 (en) | 2008-10-29 | 2008-10-29 | Manufacturing method of vibrating piece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008277803A JP5272651B2 (en) | 2008-10-29 | 2008-10-29 | Manufacturing method of vibrating piece |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010109526A JP2010109526A (en) | 2010-05-13 |
| JP2010109526A5 true JP2010109526A5 (en) | 2011-12-01 |
| JP5272651B2 JP5272651B2 (en) | 2013-08-28 |
Family
ID=42298553
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008277803A Expired - Fee Related JP5272651B2 (en) | 2008-10-29 | 2008-10-29 | Manufacturing method of vibrating piece |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5272651B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20160032600A (en) * | 2014-09-16 | 2016-03-24 | 삼성전기주식회사 | Piezoelectric vibration piece, method of fabricating piezoelectric vibration piece, and piezoelectric device |
| CN106160694B (en) * | 2014-09-16 | 2019-07-30 | 三星电机株式会社 | Piezoelectric vibration component, the method and piezoelectric vibrator for manufacturing piezoelectric vibration component |
| KR102029492B1 (en) * | 2014-09-23 | 2019-10-07 | 삼성전기주식회사 | Crystal oscillator and manufacturing method thereof |
| KR102163053B1 (en) | 2015-09-07 | 2020-10-08 | 삼성전기주식회사 | Piezoelectric vibration piece, and piezoelectric device |
| JP6797764B2 (en) * | 2017-08-09 | 2020-12-09 | 日本電波工業株式会社 | Crystal oscillator and its manufacturing method |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5847316A (en) * | 1981-09-16 | 1983-03-19 | Seikosha Co Ltd | Thickness slip piezoelectric oscillator and its production |
| JPS613514A (en) * | 1984-06-18 | 1986-01-09 | Nippon Dempa Kogyo Co Ltd | Piezoelectric vibrator |
| FR2577362B1 (en) * | 1985-02-13 | 1987-04-17 | Ebauchesfabrik Eta Ag | METHOD FOR MANUFACTURING HIGH FREQUENCY QUARTZ RESONATORS |
| JPH04127709A (en) * | 1990-09-19 | 1992-04-28 | Seiko Epson Corp | At cut crystal oscillator |
| JPH04332212A (en) * | 1991-05-08 | 1992-11-19 | Seiko Epson Corp | Thickness slip piezoelectric oscillator and its production |
| JP4696419B2 (en) * | 2001-07-30 | 2011-06-08 | エプソントヨコム株式会社 | Piezoelectric vibrator |
| JP2004048717A (en) * | 2002-05-24 | 2004-02-12 | Seiko Epson Corp | Forming method of twin crystal, quartz crystal oscillating piece, manufacturing method thereof and quartz crystal device |
| JP4613498B2 (en) * | 2004-03-01 | 2011-01-19 | セイコーエプソン株式会社 | Piezoelectric vibrating piece, piezoelectric vibrator and piezoelectric oscillator |
| JP2008187322A (en) * | 2007-01-29 | 2008-08-14 | Epson Toyocom Corp | Manufacturing method of mesa type piezoelectric vibrating element |
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2008
- 2008-10-29 JP JP2008277803A patent/JP5272651B2/en not_active Expired - Fee Related
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