JP2010109337A5 - - Google Patents
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- Publication number
- JP2010109337A5 JP2010109337A5 JP2009218265A JP2009218265A JP2010109337A5 JP 2010109337 A5 JP2010109337 A5 JP 2010109337A5 JP 2009218265 A JP2009218265 A JP 2009218265A JP 2009218265 A JP2009218265 A JP 2009218265A JP 2010109337 A5 JP2010109337 A5 JP 2010109337A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- electrically connected
- functional
- control circuit
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012212 insulator Substances 0.000 claims 10
- 239000004065 semiconductor Substances 0.000 claims 4
- 238000004519 manufacturing process Methods 0.000 claims 3
- 238000007689 inspection Methods 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 239000004642 Polyimide Substances 0.000 claims 1
- 229910052581 Si3N4 Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009218265A JP5550294B2 (ja) | 2008-10-02 | 2009-09-22 | 半導体装置の作製方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008257059 | 2008-10-02 | ||
| JP2008257059 | 2008-10-02 | ||
| JP2009218265A JP5550294B2 (ja) | 2008-10-02 | 2009-09-22 | 半導体装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010109337A JP2010109337A (ja) | 2010-05-13 |
| JP2010109337A5 true JP2010109337A5 (https=) | 2012-10-25 |
| JP5550294B2 JP5550294B2 (ja) | 2014-07-16 |
Family
ID=42298435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009218265A Expired - Fee Related JP5550294B2 (ja) | 2008-10-02 | 2009-09-22 | 半導体装置の作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5550294B2 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6086781B2 (ja) * | 2013-03-28 | 2017-03-01 | 富士フイルム株式会社 | 有機半導体素子の製造方法 |
| JP6390418B2 (ja) * | 2014-12-24 | 2018-09-19 | 株式会社ソシオネクスト | 半導体装置、半導体装置の製造方法、及び半導体装置の識別方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0760853B2 (ja) * | 1984-07-18 | 1995-06-28 | テキサス インスツルメンツ インコ−ポレイテツド | レ−ザ・ビ−ムでプログラムし得る半導体装置と半導体装置の製法 |
| JPH01125951A (ja) * | 1987-11-11 | 1989-05-18 | Hitachi Ltd | トランジスタ回路装置 |
| JPH02295155A (ja) * | 1989-05-09 | 1990-12-06 | Nec Corp | 多層配線半導体装置 |
| JPH06112321A (ja) * | 1992-09-29 | 1994-04-22 | Matsushita Electron Corp | 半導体集積回路の接続法 |
| JP2006310663A (ja) * | 2005-04-28 | 2006-11-09 | Toshiba Corp | 演算処理装置 |
| JP2007081281A (ja) * | 2005-09-16 | 2007-03-29 | Matsushita Electric Ind Co Ltd | システムlsi |
-
2009
- 2009-09-22 JP JP2009218265A patent/JP5550294B2/ja not_active Expired - Fee Related
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