JP2010098099A - Molded package and method for manufacturing the same - Google Patents

Molded package and method for manufacturing the same Download PDF

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JP2010098099A
JP2010098099A JP2008267235A JP2008267235A JP2010098099A JP 2010098099 A JP2010098099 A JP 2010098099A JP 2008267235 A JP2008267235 A JP 2008267235A JP 2008267235 A JP2008267235 A JP 2008267235A JP 2010098099 A JP2010098099 A JP 2010098099A
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substrate
lead terminal
plate surface
wiring member
mold
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JP5359176B2 (en
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Wataru Kobayashi
渉 小林
Norihisa Imaizumi
典久 今泉
Toshio Suzuki
俊夫 鈴木
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Denso Corp
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Denso Corp
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45014—Ribbon connectors, e.g. rectangular cross-section
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
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    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
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Abstract

<P>PROBLEM TO BE SOLVED: To properly prevent a lead terminal from lifting, when performing the bonding of a wiring member, without having to paste the lead terminal to a substrate in advance, in a molded package that is sealed with a mold resin after the substrate and the lead terminal are connected, using a wiring member. <P>SOLUTION: A lead terminal 30 is mounted on a support base 100 using the lead terminal 30 with an extension part 30a, which extends from the edge of a substrate 10 so that the lead terminal 30 overlaps the substrate 10. The lead terminal 30 is fixed as the substrate 10 presses down on the extension part 30a of the lead terminal from above; while direct contact is made between the other plate surface of the substrate 10 and the extension part 30a. In this fixed state, the lead terminal 30 and one side of the plate surface of the substrate 10 is wire-connected by the wiring member 40 ; thereafter, sealing is made using a mold resin 50; and since the contact part of the extension part 30a and the other plate surface of the substrate 10 is sealed with the mold resin 50, the two members of 30a and 10 are fixed. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、基板とリード端子とを、ワイヤやリボンなどの線状の配線部材で接続したものをモールド樹脂で封止してなるモールドパッケージ、および、そのようなモールドパッケージの製造方法に関する。   The present invention relates to a mold package formed by sealing a substrate and a lead terminal connected by a linear wiring member such as a wire or a ribbon with a mold resin, and a method for manufacturing such a mold package.

従来より、この種のモールドパッケージとしては、電子部品などが搭載された基板と、基板の端部よりも外側に設けられたリード端子と、基板の一方の板面とリード端子とを電気的・機械的に接続する線状の配線部材と、これら基板、リード端子および配線部材を包み込むように封止するモールド樹脂と、を備え、リード端子における配線部材との接続部とは反対側の部位が、アウターリードとしてモールド樹脂より露出しているものが一般である。   Conventionally, as this type of mold package, a board on which electronic components and the like are mounted, a lead terminal provided outside the end of the board, one plate surface of the board and the lead terminal are electrically connected. A linear wiring member that is mechanically connected, and a mold resin that seals the substrate, the lead terminal, and the wiring member so that the portion of the lead terminal opposite to the connection portion with the wiring member The outer leads are generally exposed from the mold resin.

このようなパッケージは、一般に、基板の一方の板面に電子部品を搭載し、ワイヤボンディングやリボンボンディングなどにより、線状の配線部材を介して基板の一方の板面とリード端子とを結線した後、上記アウターリードが露出するように、これらをモールド樹脂で封止することにより、製造される。   In such a package, generally, an electronic component is mounted on one plate surface of a substrate, and one plate surface of the substrate and a lead terminal are connected via a linear wiring member by wire bonding or ribbon bonding. Thereafter, they are manufactured by sealing them with a mold resin so that the outer leads are exposed.

この場合、基板からリード端子への接続を、太線のアルミワイヤボンディングや幅広のリボンボンディングにて行う際に、治具によるリード端子の固定が不十分で、ボンディング工程中にリード端子が浮き上がってしまい、ボンディング接続の品質が低下するという問題があった。   In this case, when the connection from the substrate to the lead terminal is made by thick aluminum wire bonding or wide ribbon bonding, the lead terminal is not sufficiently fixed by a jig, and the lead terminal floats during the bonding process. There is a problem that the quality of the bonding connection deteriorates.

ここで、リード端子を先にモールド樹脂で封止して固定した状態で、ボンディングする方法も考えられるが、コストが高いという問題がある。また、特許文献１では、基板とリード端子とを予め接着剤にて接続することでリード端子を固定している。
特開平８−３７２５２号公報 Here, a method of bonding in a state where the lead terminals are first sealed and fixed with a mold resin is also conceivable, but there is a problem that the cost is high. In Patent Document 1, the lead terminal is fixed by connecting the substrate and the lead terminal in advance with an adhesive.
JP-A-8-37252

しかしながら、上記特許文献１では、接着剤のヒューム等によりボンディング接続部が汚染され、ボンディング接続の品質が低下するという問題が発生する。   However, in the above-mentioned Patent Document 1, there arises a problem that the bonding connection portion is contaminated by the fumes of the adhesive and the quality of the bonding connection is deteriorated.

本発明は、上記問題に鑑みてなされたものであり、基板とリード端子とを、ワイヤやリボンなどの線状の配線部材で接続したものをモールド樹脂で封止してなるモールドパッケージにおいて、基板とリード端子とを予め接着することなく、配線部材をボンディングする際のリード端子の浮き上りを適切に防止することを目的とする。   The present invention has been made in view of the above problems, and in a mold package formed by sealing a substrate and a lead terminal connected by a linear wiring member such as a wire or a ribbon with a mold resin, the substrate An object of the present invention is to appropriately prevent the lead terminals from being lifted up when bonding a wiring member without bonding them in advance.

上記目的を達成するため、請求項１に記載の発明においては、リード端子（３０）は、基板（１０）と重なるように基板（１０）の端部より延設された延設部（３０ａ）を有しており、この延設部（３０ａ）が、基板（１０）の一方の板面とは反対側の他方の板面に直接接触しており、この延設部（３０ａ）と基板（１０）の他方の板面との接触部は、モールド樹脂（５０）によって封止されることで、当該延設部（３０ａ）と基板（１０）とが固定されていることを特徴とする。   In order to achieve the above object, in the first aspect of the present invention, the lead terminal (30) extends from the end of the substrate (10) so as to overlap the substrate (10). The extended portion (30a) is in direct contact with the other plate surface opposite to the one plate surface of the substrate (10), and the extended portion (30a) and the substrate ( The contact portion with the other plate surface of 10) is sealed with the mold resin (50), whereby the extended portion (30a) and the substrate (10) are fixed.

それによれば、ボンディング時に基板（１０）でリード端子（３０）を押さえて固定することが可能であるから、リード端子（３０）の固定が従来よりも確実になるとともに、リード端子（３０）と基板（１０）との接触部をモールド樹脂（５０）で封止・固定できるため、基板（１０）とリード端子（３０）とを予め接着することなく、配線部材（４０）をボンディングする際のリード端子（３０）の浮き上りを、適切に防止することができる。   According to this, since it is possible to hold and fix the lead terminal (30) with the substrate (10) at the time of bonding, the lead terminal (30) is more securely fixed than before, and the lead terminal (30) and Since the contact portion with the substrate (10) can be sealed and fixed with the mold resin (50), the wiring member (40) can be bonded without bonding the substrate (10) and the lead terminal (30) in advance. The floating of the lead terminal (30) can be prevented appropriately.

ここで、請求項２に記載の発明のように、基板（１０）の他方の板面のうちリード端子（３０）の延設部（３０ａ）が接触する部位には、延設部（３０ａ）が嵌り込む凹部（１１）が設けられており、この凹部（１１）に延設部（３０ａ）が嵌められることで、リード端子（３０）が、基板（１０）の板面方向に位置ずれするのを防止しているものであってもよい。   Here, as in the invention described in claim 2, the extended portion (30a) is located at a portion of the other plate surface of the substrate (10) where the extended portion (30a) of the lead terminal (30) contacts. The recess (11) into which the lead is inserted is provided, and the extension portion (30a) is fitted into the recess (11), so that the lead terminal (30) is displaced in the plate surface direction of the substrate (10). It is possible to prevent this.

それによれば、リード端子（３０）の延設部（３０ａ）と基板（１０）の他方の板面との接触部においては、凹部（１１）に延設部（３０ａ）が嵌められているので、リード端子（３０）が、基板（１０）の板面方向に位置ずれしにくくなる。   According to this, in the contact portion between the extended portion (30a) of the lead terminal (30) and the other plate surface of the substrate (10), the extended portion (30a) is fitted in the concave portion (11). The lead terminal (30) is less likely to be displaced in the plate surface direction of the substrate (10).

また、請求項３に記載の発明のように、基板（１０）の他方の板面のうちリード端子（３０）の延設部（３０ａ）が接触する部位には、突出する凸部（１３）が設けられており、この凸部（１３）と延設部（３０ａ）とが直接接触しているものであってもよい。   Further, as in the third aspect of the present invention, a protruding convex portion (13) is formed on a portion of the other plate surface of the substrate (10) where the extended portion (30a) of the lead terminal (30) contacts. The projecting portion (13) and the extending portion (30a) may be in direct contact with each other.

それによれば、基板（１０）に反りやうねりが発生しても、凸部（１３）によってリード端子（３０）と基板（１０）との接触性が確保される。   According to this, even if warpage or undulation occurs in the substrate (10), the contact between the lead terminal (30) and the substrate (10) is ensured by the convex portion (13).

請求項４に記載の発明は、モールドパッケージの製造方法であり、リード端子（３０）として、基板（１０）と重なるように基板（１０）の端部より延設された延設部（３０ａ）を有するものを用い、リード端子（３０）を支持台（１００）上に搭載し、基板（１０）の一方の板面とは反対側の他方の板面に延設部（３０ａ）を直接接触させつつ、リード端子（３０）の延設部（３０ａ）をその上から基板（１０）で押さえつけることにより、リード端子（３０）を固定し、基板（１０）によって固定されたリード端子（３０）と基板（１０）の一方の板面とを配線部材（４０）によって結線し、しかる後、モールド樹脂（５０）による封止を行い、リード端子（３０）の延設部（３０ａ）と基板（１０）の他方の板面との接触部を、モールド樹脂（５０）によって封止することによって、当該延設部（３０ａ）と基板（１０）とを固定することを特徴としている。   Invention of Claim 4 is a manufacturing method of a mold package, and is extended as the lead terminal (30) from the end portion of the substrate (10) so as to overlap the substrate (10). The lead terminal (30) is mounted on the support base (100), and the extended portion (30a) is in direct contact with the other plate surface opposite to the one plate surface of the substrate (10). The lead terminal (30) is fixed by pressing the extended portion (30a) of the lead terminal (30) with the substrate (10) from above, and the lead terminal (30) fixed by the substrate (10). And one plate surface of the substrate (10) are connected by the wiring member (40), and then sealed with the mold resin (50), and the extended portion (30a) of the lead terminal (30) and the substrate ( 10) the contact portion with the other plate surface By sealing with resin (50), it is characterized by fixing the extending portion and (30a) and the substrate (10).

それによれば、基板（１０）をリード端子（３０）に直接接触させて押さえ・固定した状態で、配線部材（４０）のボンディングを行うから、リード端子（３０）の固定が従来よりも確実になり、その後、リード端子（３０）と基板（１０）との接触部をモールド樹脂（５０）で封止・固定しているため、基板（１０）とリード端子（３０）とを予め接着することなく、配線部材（４０）をボンディングする際のリード端子（３０）の浮き上りを、適切に防止することができる。   According to this, since the wiring member (40) is bonded in a state in which the substrate (10) is directly brought into contact with the lead terminal (30) and pressed and fixed, the lead terminal (30) is more securely fixed than before. Then, since the contact portion between the lead terminal (30) and the substrate (10) is sealed and fixed with the mold resin (50), the substrate (10) and the lead terminal (30) are bonded in advance. In addition, it is possible to appropriately prevent the lead terminal (30) from floating when the wiring member (40) is bonded.

この製造方法の場合、請求項５に記載の発明のように、リード端子（３０）を予め支持台（１００）上にて上方に凸となるように屈曲させた後、リード端子（３０）を支持台（１００）上に搭載し、基板（１０）によるリード端子（３０）の押さえつけにより、リード端子（３０）を支持台（１００）上で真っ直ぐに変形させるようにしてもよい。   In the case of this manufacturing method, as in the invention described in claim 5, after the lead terminal (30) is bent in a convex manner on the support base (100) in advance, the lead terminal (30) is The lead terminal (30) may be straightly deformed on the support base (100) by mounting on the support base (100) and pressing the lead terminal (30) by the substrate (10).

それによれば、支持台（１００）上にて、基板（１０）にて押さえつけられたリード端子（３０）が、支持台（１００）から浮き上がるのを極力防止できる。   According to this, it is possible to prevent the lead terminal (30) pressed by the substrate (10) on the support base (100) from floating from the support base (100) as much as possible.

また、請求項６に記載の発明のように、基板（１０）の他方の板面のうちリード端子（３０）の延設部（１０ａ）が接触する部位に、電気絶縁性の絶縁樹脂（１２）を設けた後、基板（１０）によるリード端子（３０）の押さえつけを行い、リード端子（３０）の延設部（３０ａ）を絶縁樹脂（１２）にめり込ませるようにしてもよい。   Further, as in the invention described in claim 6, an electrically insulating insulating resin (12) is formed on a portion of the other plate surface of the substrate (10) where the extended portion (10a) of the lead terminal (30) contacts. ), The lead terminal (30) may be pressed by the substrate (10), and the extended portion (30a) of the lead terminal (30) may be embedded in the insulating resin (12).

それによれば、リード端子（３０）の延設部（３０ａ）と基板（１０）の他方の板面との接触部においては、延設部（３０ａ）が絶縁樹脂（１２）にめり込んだ状態となるので、リード端子（３０）が、基板（１０）の板面方向に位置ずれしにくくなる。   According to this, in the contact portion between the extended portion (30a) of the lead terminal (30) and the other plate surface of the substrate (10), the extended portion (30a) is embedded in the insulating resin (12). Therefore, the lead terminal (30) is less likely to be displaced in the plate surface direction of the substrate (10).

なお、特許請求の範囲およびこの欄で記載した各手段の括弧内の符号は、後述する実施形態に記載の具体的手段との対応関係を示す一例である。   In addition, the code | symbol in the bracket | parenthesis of each means described in the claim and this column is an example which shows a corresponding relationship with the specific means as described in embodiment mentioned later.

以下、本発明の実施形態について図に基づいて説明する。なお、以下の各実施形態相互において、互いに同一もしくは均等である部分には、説明の簡略化を図るべく、図中、同一符号を付してある。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, parts that are the same or equivalent to each other are given the same reference numerals in the drawings in order to simplify the description.

（第１実施形態）
図１は、本発明の第１実施形態に係るモールドパッケージの概略構成を示す図であり、（ａ）は平面図、（ｂ）は断面図である。ここで、図１（ａ）は、図１（ｂ）の上面図である。 (First embodiment)
FIG. 1 is a diagram showing a schematic configuration of a mold package according to a first embodiment of the present invention, in which (a) is a plan view and (b) is a cross-sectional view. Here, FIG. 1A is a top view of FIG.

本実施形態のモールドパッケージは、大きくは、基板１０と、基板１０に搭載された電子部品２０と、基板１０の外側に設けられたリード端子３０と、基板１０とリード端子３０とを結線する線状の配線部材４０と、これら各部材１０〜４０を封止するモールド樹脂５０とを備えて構成されている。   The mold package of the present embodiment is roughly divided into a substrate 10, an electronic component 20 mounted on the substrate 10, a lead terminal 30 provided outside the substrate 10, and a wire connecting the substrate 10 and the lead terminal 30. A wiring member 40 having a shape and a mold resin 50 for sealing the members 10 to 40 are provided.

基板１０は、この種のモールドパッケージに用いられる一般的な配線基板であり、セラミック基板、樹脂基板、あるいは半導体基板でもよい。ここでは、基板１０は、矩形板状をなすものであり、その全体がモールド樹脂５０に包み込まれている。そして、モールド樹脂５０の内部にて、この基板１０の一方の板面（図１（ｂ）の上面）には、電子部品２０が搭載されている。   The substrate 10 is a general wiring substrate used for this type of mold package, and may be a ceramic substrate, a resin substrate, or a semiconductor substrate. Here, the substrate 10 has a rectangular plate shape, and is entirely encased in the mold resin 50. The electronic component 20 is mounted on one plate surface of the substrate 10 (upper surface in FIG. 1B) inside the mold resin 50.

この電子部品２０は、一般的な電子部品であり、特に限定されないが、たとえば基板１０に表面実装されるＩＣチップ、コンデンサ素子、抵抗素子などである。これら電子部品２０は、たとえば図示しないダイボンド材やボンディングワイヤなどにより基板１０に電気的・機械的に接続されている。   The electronic component 20 is a general electronic component and is not particularly limited. For example, the electronic component 20 is an IC chip, a capacitor element, a resistance element, or the like that is surface-mounted on the substrate 10. These electronic components 20 are electrically and mechanically connected to the substrate 10 by, for example, a die bond material or a bonding wire (not shown).

リード端子３０は、この種のモールドパッケージに用いられるリードフレームやバスバーなどであり、特に限定されない。ここでは、リード端子３０は、銅などよりなるリードフレームである。このリードフレームは、リード端子３０とアイランド３１とを備えたものである。   The lead terminal 30 is a lead frame, a bus bar or the like used in this type of mold package, and is not particularly limited. Here, the lead terminal 30 is a lead frame made of copper or the like. This lead frame includes a lead terminal 30 and an island 31.

具体的には、リードフレームは、板材に対して、エッチングなどによりリード端子３０とアイランド３１とを形成し、最終的にモールド樹脂５０で封止された後には、リードカットされることで形成されるものである。   Specifically, the lead frame is formed by forming lead terminals 30 and islands 31 on a plate material by etching or the like, and finally being sealed with a mold resin 50 and then being lead cut. Is.

ここで、アイランド３１は、モールド樹脂５０の内部にて、基板１０における一方の板面とは反対側の板面である他方の板面側に設けられておいる。ここで、アイランド３１は基板１０よりも小さい平面サイズを持つものであり、その全体がモールド樹脂５０に包み込まれている。   Here, the island 31 is provided inside the mold resin 50 on the other plate surface side which is the plate surface opposite to the one plate surface of the substrate 10. Here, the island 31 has a plane size smaller than that of the substrate 10, and is entirely encased in the mold resin 50.

つまり、モールド樹脂５０内にて、アイランド３１上に、接着剤などを介して、基板１０が搭載されて固定されており、基板１０のすなわち基板１０の外周端部は、アイランド３１の外周端部よりもはみ出した位置にある。   That is, the substrate 10 is mounted and fixed on the island 31 via an adhesive or the like in the mold resin 50, and the outer peripheral end of the substrate 10, that is, the outer peripheral end of the substrate 10 is the outer peripheral end of the island 31. It is in a position that protrudes more.

そして、リード端子３０は、基板１０の外周端部よりも外側に設けられている。ここでは、リード端子３０は、基板１０の外周端部より外方に延びる細長短冊板状をなし、基板１０側に位置する部位がモールド樹脂５０内に位置するインナーリードとして構成され、それとは反対側に位置する部位がモールド樹脂５０より突出してモールド樹脂５０の外部に露出するアウターリードとして構成されている。   The lead terminal 30 is provided outside the outer peripheral end of the substrate 10. Here, the lead terminal 30 is formed in an elongated strip shape extending outward from the outer peripheral end portion of the substrate 10, and a portion located on the substrate 10 side is configured as an inner lead located in the mold resin 50, which is opposite to that. A portion located on the side protrudes from the mold resin 50 and is configured as an outer lead that is exposed to the outside of the mold resin 50.

モールド樹脂５０内にて、リード端子３０のインナーリードと基板１０の一方の板面とは、配線部材４０により結線されている。基板１０の一方の板面には、図示しないパッドが設けられ、このパッドと配線部材４０とが接続されている。それにより、リード端子３０と基板１０とは配線部材４０を介して、電気的および機械的に接続されている。   Inside the mold resin 50, the inner lead of the lead terminal 30 and one plate surface of the substrate 10 are connected by the wiring member 40. A pad (not shown) is provided on one plate surface of the substrate 10, and the pad and the wiring member 40 are connected to each other. Thereby, the lead terminal 30 and the substrate 10 are electrically and mechanically connected via the wiring member 40.

この配線部材４０は線状をなすものであり、具体的には、一般的なアルミや金などのボンディングワイヤ、あるいは、アルミや銅のリボンよりなる。これらは、一般的なワイヤボンディング、アルミリボン材を用いた超音波によるリボンボンディング、Ｃｕリボンをレーザー溶接にて接続するボンディングなどの方法により形成される。   The wiring member 40 has a linear shape, and is specifically made of a general bonding wire such as aluminum or gold, or a ribbon of aluminum or copper. These are formed by methods such as general wire bonding, ribbon bonding by ultrasonic waves using an aluminum ribbon material, and bonding in which a Cu ribbon is connected by laser welding.

さらに、本実施形態においては、モールド樹脂５０内にて、リード端子３０の配線基板１０側の部位は、配線基板１０の外周端部から配線基板１０の下側、すなわち配線基板１０の他方の板面側に入り込んでいる。   Furthermore, in the present embodiment, the portion of the lead terminal 30 on the side of the wiring board 10 in the mold resin 50 is located on the lower side of the wiring board 10 from the outer peripheral end of the wiring board 10, that is, the other plate of the wiring board 10. It has entered the surface side.

つまり、リード端子３０は、配線基板１０の外周端部より内周側に延設された延設部３０ａを有しており、それによって、このリード端子３０の延設部３０ａは、配線基板１０と重なって配置されている。   That is, the lead terminal 30 has an extending portion 30 a extending from the outer peripheral end portion of the wiring board 10 to the inner peripheral side, and thereby the extending portion 30 a of the lead terminal 30 is connected to the wiring board 10. It is arranged to overlap.

そして、この延設部３０ａと配線基板１０の他方の板面とは、何も介在物を介することなく、直接、接触している。そして、この延設部３０ａと基板１０の他方の板面との接触部は、モールド樹脂５０によって封止されており、このモールド樹脂５０によって延設部３０ａと基板１０とが機械的に固定されている。   And this extension part 30a and the other board surface of the wiring board 10 are contacting directly, without interposing anything. A contact portion between the extended portion 30a and the other plate surface of the substrate 10 is sealed with a mold resin 50, and the extended portion 30a and the substrate 10 are mechanically fixed by the mold resin 50. ing.

また、上記モールド樹脂５０は、上述したように、基板１０、電子部品２０、リード端子３０および配線部材４０を包み込むように封止している。このモールド樹脂５０はエポキシ樹脂などの一般的なモールド材料よりなり、トランスファーモールド法などにより成形される。   Further, as described above, the mold resin 50 is sealed so as to enclose the substrate 10, the electronic component 20, the lead terminal 30, and the wiring member 40. The mold resin 50 is made of a general mold material such as an epoxy resin, and is molded by a transfer mold method or the like.

そして、上述のように、リード端子３０における配線部材４０との接続部とは反対側の部位が、アウターリードとしてモールド樹脂５０より露出している。そして、このアウターリードの部分にて、外部と電気的に接続されるようになっており、それによって、モールドパッケージと外部との電気的接続がなされるようになっている。   As described above, a portion of the lead terminal 30 opposite to the connection portion with the wiring member 40 is exposed from the mold resin 50 as an outer lead. The outer lead portion is electrically connected to the outside, whereby the mold package and the outside are electrically connected.

次に、本実施形態のモールドパッケージの製造方法について、図１に加えて、図２も参照して述べる。図２は、本製造方法における要部工程である基板１０によるリード端子３０の押さえつけ工程を示す概略断面図であり、（ａ）は第１の例、（ｂ）は第２の例を示している。   Next, the manufacturing method of the mold package of this embodiment will be described with reference to FIG. 2 in addition to FIG. 2A and 2B are schematic cross-sectional views showing a pressing process of the lead terminal 30 by the substrate 10, which is a main process in the manufacturing method. FIG. 2A shows a first example, and FIG. 2B shows a second example. Yes.

まず、本製造方法では、基板１０の一方の板面に電子部品２０を搭載するとともに、基板１０の外周端部よりも外側にリード端子３０を配置し、配線部材４０を介して基板１０の一方の板面とリード端子３０とを結線して電気的・機械的に接続する。ここで、電子部品２０の搭載と配線部材４０の接続とは、どちらを先に行ってもよい。   First, in this manufacturing method, the electronic component 20 is mounted on one plate surface of the substrate 10, the lead terminals 30 are arranged outside the outer peripheral end of the substrate 10, and one of the substrates 10 is interposed via the wiring member 40. The plate surface and the lead terminal 30 are connected and electrically and mechanically connected. Here, either mounting of the electronic component 20 or connection of the wiring member 40 may be performed first.

本実施形態では、配線部材４０の接続工程において、リード端子３０として、配線部材４０の接続完了後において基板１０と重なるように基板１０の端部より延設された延設部３０ａを有するものを用いる。   In the present embodiment, in the connection process of the wiring member 40, the lead terminal 30 has an extended portion 30 a that extends from the end of the substrate 10 so as to overlap the substrate 10 after the connection of the wiring member 40 is completed. Use.

そして、図２に示されるように、リード端子３０を支持台１００上に搭載して、基板１０によるリード端子３０の押さえつけ工程を行う。この支持台１００は、その搭載面が平坦な面となっているものである。   Then, as shown in FIG. 2, the lead terminal 30 is mounted on the support base 100, and the lead terminal 30 is pressed by the substrate 10. The support base 100 has a flat mounting surface.

この押さえつけ工程では、基板１０の他方の板面に延設部３０ａを直接接触させつつ、延設部３０ａを、当該延設部上から基板１０で押さえつける。それによって、リード端子３０を基板１０と支持台１００とで挟み込んで固定する。   In this pressing step, the extended portion 30a is pressed from above the extended portion with the substrate 10 while the extended portion 30a is in direct contact with the other plate surface of the substrate 10. Thereby, the lead terminal 30 is sandwiched and fixed between the substrate 10 and the support base 100.

ここで、本実施形態では、好ましい形態として、図２に示されるように、リード端子３０を予め支持台１００上にて上方に凸となるように屈曲させておく。つまり、支持台１００に搭載されたときに、リード端子３０の両端が支持台１００に接触し、当該両端の中間部が支持台１００から離れるように、リード端子３０を屈曲させる。この屈曲は一般の曲げ加工により行える。その後、この屈曲されたリード端子３０を支持台１００上に搭載する。   Here, in the present embodiment, as a preferred embodiment, the lead terminal 30 is bent in advance so as to be convex upward on the support base 100 as shown in FIG. That is, when mounted on the support base 100, the lead terminal 30 is bent so that both ends of the lead terminal 30 come into contact with the support base 100 and an intermediate portion between the both ends is separated from the support base 100. This bending can be performed by a general bending process. Thereafter, the bent lead terminal 30 is mounted on the support base 100.

そして、リード端子３０の上から支持台１００に向かって、基板１０によるリード端子３０の押さえつけを行う。このとき、基板１０で押さえる部位は、延設部３０ａであるが、図２（ａ）に示されるように、屈曲形状における頂部であってもよいし、当該頂部よりも外れた部位であってもよい。   Then, the lead terminal 30 is pressed by the substrate 10 from the top of the lead terminal 30 toward the support base 100. At this time, the portion to be pressed by the substrate 10 is the extended portion 30a, but as shown in FIG. 2A, it may be a top portion in a bent shape, or a portion that is separated from the top portion. Also good.

それにより、リード端子３０を支持台１００上で真っ直ぐに変形させる。つまり、基板１０と支持台１００との間で押さえつけられたリード端子３０は、上記図１に示されるように、真っ直ぐな形状になる。   Thereby, the lead terminal 30 is deformed straight on the support base 100. That is, the lead terminal 30 pressed between the substrate 10 and the support base 100 has a straight shape as shown in FIG.

そして、このようにリード端子３０を、基板１０によって支持台１００上に固定した状態で、リード端子３０と基板１０の一方の板面とを配線部材４０によって結線する。この結線は、上述したように、ワイヤボンディングやリボンボンディングなどにより行う。   Then, the lead terminal 30 and one plate surface of the substrate 10 are connected by the wiring member 40 in a state where the lead terminal 30 is fixed on the support base 100 by the substrate 10 in this way. As described above, this connection is performed by wire bonding or ribbon bonding.

このように、本実施形態の押さえつけ工程によれば、予め支持台１００上にて上方に凸となるように屈曲させたリード端子３０を、真っ直ぐになるように基板１０で押さえつけるから、リード端子３０における配線部材４０との接続部分が、支持台１００から浮き上がるのを極力防止できる。なお、この押さえつけ工程においては、リード端子３０を屈曲させずに真っ直ぐなままの状態で、基板１０による押さえつけを行ってもよい。   As described above, according to the pressing step of the present embodiment, the lead terminal 30 bent in advance so as to be convex upward on the support base 100 is pressed by the substrate 10 so as to be straight. It is possible to prevent as much as possible that the connecting portion with the wiring member 40 from being lifted from the support base 100. In this pressing step, pressing by the substrate 10 may be performed in a state where the lead terminal 30 is kept straight without being bent.

また、本実施形態では、押さえつけ工程においては、支持台１００上には、リード端子３０とともにアイランド３１も搭載されるものであり、基板１０の押さえつけにより、基板１０をアイランド３１に接着する。   In this embodiment, in the pressing step, the island 31 is also mounted on the support base 100 together with the lead terminals 30, and the substrate 10 is bonded to the island 31 by pressing the substrate 10.

こうして、基板１０とリード端子３０とを配線部材４０により結線した後、このものを図示しない金型に設置し、基板１０、リード端子３０および配線部材４０を包み込むようにモールド樹脂５０で封止する。また、このとき、リード端子３０における上記アウターリードはモールド樹脂５０より露出させるようにする。   Thus, after the substrate 10 and the lead terminal 30 are connected by the wiring member 40, this is placed in a mold (not shown) and sealed with the mold resin 50 so as to wrap the substrate 10, the lead terminal 30 and the wiring member 40. . At this time, the outer lead in the lead terminal 30 is exposed from the mold resin 50.

この樹脂封止によって、単に直接接触していただけのリード端子３０の延設部３０ａと基板１０の他方の板面との接触部は、モールド樹脂５０によって封止され、それにより、延設部３０ａと基板１０とは固定される。その後は、上記金型からワークを取り出し、リードカットなどを行うことにより、本実施形態のモールドパッケージができあがる。   By this resin sealing, the contact portion between the extended portion 30a of the lead terminal 30 and the other plate surface of the substrate 10 that is simply in direct contact with the other plate surface is sealed with the mold resin 50, thereby extending the extended portion 30a. And the substrate 10 are fixed. Thereafter, the workpiece is taken out from the mold and lead cutting or the like is performed to complete the mold package of the present embodiment.

ところで、本実施形態によれば、基板１０をリード端子３０に直接接触させて押さえ・固定した状態で、配線部材４０のボンディングを行うから、リード端子３０の固定が従来よりも確実になる。   By the way, according to this embodiment, since the wiring member 40 is bonded in a state where the substrate 10 is directly brought into contact with the lead terminal 30 and pressed and fixed, the fixing of the lead terminal 30 is more reliable than before.

また、その後、リード端子３０と基板１０との接触部をモールド樹脂５０で封止しているため、当該接触部はモールド樹脂５０によって固定される。このように、本実施形態によれば、基板１０とリード端子３０とを予め接着することなく、配線部材４０をボンディングする際のリード端子３０の浮き上りを適切に防止することができる。   Moreover, since the contact portion between the lead terminal 30 and the substrate 10 is sealed with the mold resin 50 thereafter, the contact portion is fixed by the mold resin 50. Thus, according to the present embodiment, it is possible to appropriately prevent the lead terminal 30 from being lifted up when the wiring member 40 is bonded without bonding the substrate 10 and the lead terminal 30 in advance.

（第２実施形態）
図３は、本発明の第２実施形態に係るモールドパッケージの製造方法の要部である基板１０によるリード端子３０の押さえつけ工程を示す図であり、（ａ）は概略断面図、（ｂ）は概略平面図である。本実施形態では、上記第１実施形態との相違点を中心に述べることとする。 (Second Embodiment)
FIGS. 3A and 3B are diagrams illustrating a pressing process of the lead terminal 30 by the substrate 10 which is a main part of the method for manufacturing a mold package according to the second embodiment of the present invention. FIG. 3A is a schematic cross-sectional view, and FIG. It is a schematic plan view. In this embodiment, the difference from the first embodiment will be mainly described.

図３に示されるように、本実施形態では、基板１０の他方の板面のうちリード端子３０の延設部３０ａが接触する部位に、延設部３０ａが嵌り込む凹部１１を設けておく。ここで、凹部１１は、基板１０に対してプレス、エッチング、切削などの加工を施すことにより形成する。   As shown in FIG. 3, in the present embodiment, a recess 11 into which the extended portion 30 a is fitted is provided in a portion of the other plate surface of the substrate 10 that is in contact with the extended portion 30 a of the lead terminal 30. Here, the concave portion 11 is formed by subjecting the substrate 10 to processing such as pressing, etching, and cutting.

そして、当該押さえつけ工程において、この凹部１１に延設部３０ａを嵌め込む。それにより、本実施形態のモールドパッケージにおいては、凹部１１に延設部３０ａが嵌めこまれた構成となる。   In the pressing step, the extended portion 30a is fitted into the recess 11. Thereby, in the mold package of this embodiment, it becomes the structure by which the extension part 30a was engage | inserted by the recessed part 11. FIG.

本実施形態によれば、リード端子３０の延設部３０ａと基板１０の他方の板面との接触部においては、凹部１１に延設部３０ａが嵌められているので、配線部材４０の接続時に、リード端子３０が、基板１０の板面方向に位置ずれしにくくなる。   According to the present embodiment, at the contact portion between the extended portion 30 a of the lead terminal 30 and the other plate surface of the substrate 10, the extended portion 30 a is fitted in the concave portion 11. The lead terminals 30 are less likely to be displaced in the plate surface direction of the substrate 10.

（第３実施形態）
図４は、本発明の第３実施形態に係るモールドパッケージの製造方法の要部である基板１０によるリード端子３０の押さえつけ工程を示す図であり、（ａ）は概略断面図、（ｂ）は概略平面図である。本実施形態は、上記第２実施形態を一部変形したものであり、その変形部分を中心に述べることとする。 (Third embodiment)
4A and 4B are diagrams showing a pressing process of the lead terminal 30 by the substrate 10 which is a main part of the method for manufacturing a mold package according to the third embodiment of the present invention. FIG. 4A is a schematic sectional view, and FIG. It is a schematic plan view. The present embodiment is a partial modification of the second embodiment, and the deformation will be mainly described.

図４に示されるように、本実施形態も、上記第２実施形態と同様、基板１０の他方の板面のうちリード端子３０の延設部３０ａが接触する部位に、延設部３０ａが嵌り込む凹部１１を設け、この凹部１１に延設部３０ａを嵌め込むものである。   As shown in FIG. 4, in the present embodiment as well, in the same manner as in the second embodiment, the extended portion 30a is fitted into a portion of the other plate surface of the substrate 10 where the extended portion 30a of the lead terminal 30 contacts. The recessed part 11 to insert is provided, and the extending part 30a is inserted into the recessed part 11.

ここで、本実施形態では、基板１０の他方の板面に、電気絶縁性の樹脂よりなる層状の絶縁樹脂１２を設け、この樹脂１２に対して、リード端子３０の延設部３０ａが嵌まり込む開口部を開け、この開口部を凹部１１として構成するものである。この樹脂１２としては、基板１０上の配線や抵抗体の保護などに用いられる紫外線硬化樹脂や、ソルダーレジストなどが用いられ、当該開口部は、エッチングなどで形成することが可能である。   Here, in the present embodiment, a layered insulating resin 12 made of an electrically insulating resin is provided on the other plate surface of the substrate 10, and the extended portion 30 a of the lead terminal 30 is fitted into the resin 12. The opening to be inserted is opened, and this opening is configured as the recess 11. As the resin 12, an ultraviolet curable resin, a solder resist, or the like used for protection of wirings and resistors on the substrate 10 is used, and the opening can be formed by etching or the like.

（第４実施形態）
図５は、本発明の第４実施形態に係るモールドパッケージの製造方法の要部である基板１０によるリード端子３０の押さえつけ工程を示す図であり、（ａ）は押さえつけ前の状態を示す概略断面図、（ｂ）は押さえつけ後の状態を示す概略断面図、（ｃ）は押さえつけ後の状態を示す概略平面図である。本実施形態では、上記第１実施形態との相違点を中心に述べることとする。 (Fourth embodiment)
FIG. 5 is a view showing a pressing process of the lead terminal 30 by the substrate 10 which is a main part of the method for manufacturing a mold package according to the fourth embodiment of the present invention, and (a) is a schematic cross section showing a state before pressing. FIG. 4B is a schematic cross-sectional view showing a state after pressing, and FIG. 4C is a schematic plan view showing a state after pressing. In this embodiment, the difference from the first embodiment will be mainly described.

図５に示されるように、本実施形態では、基板１０の他方の板面のうちリード端子３０の延設部１０ａが接触する部位に、上記第３実施形態に示したものと同様の電気絶縁性の絶縁樹脂１２を設けておく。ただし、ここでは、上記第３実施形態のような開口部としての凹部は設けずに、当該接触する部位に絶縁樹脂１２を存在させる。   As shown in FIG. 5, in the present embodiment, the same electrical insulation as that shown in the third embodiment is applied to a portion of the other plate surface of the substrate 10 that is in contact with the extended portion 10 a of the lead terminal 30. Insulating resin 12 is provided. However, here, the insulating resin 12 is present at the contacted portion without providing the concave portion as the opening as in the third embodiment.

そして、当該押さえつけ工程において、基板１０によるリード端子３０の押さえつけを行い、図５（ａ）、（ｂ）に示されるように、リード端子３０の延設部３０ａを絶縁樹脂１２にめり込ませる。   In the pressing step, the lead terminal 30 is pressed by the substrate 10, and the extended portion 30 a of the lead terminal 30 is sunk into the insulating resin 12 as shown in FIGS. 5A and 5B. .

それによれば、リード端子３０の延設部３０ａと基板１０の他方の板面との接触部においては、延設部３０ａが絶縁樹脂１２にめり込んだ状態となり、上記凹部１１と同様の効果が発揮され、本実施形態によっても、配線部材４０の接続時に、リード端子３０が基板１０の板面方向に位置ずれしにくくなる。   According to this, at the contact portion between the extended portion 30 a of the lead terminal 30 and the other plate surface of the substrate 10, the extended portion 30 a is in a state of being sunk into the insulating resin 12, and the same effect as the concave portion 11 is exhibited. Even in this embodiment, the lead terminal 30 is less likely to be displaced in the plate surface direction of the substrate 10 when the wiring member 40 is connected.

（第５実施形態）
図６は、本発明の第５実施形態に係るモールドパッケージの製造方法の要部である基板１０によるリード端子３０の押さえつけ工程を示す図であり、（ａ）は概略断面図、（ｂ）は概略平面図である。本実施形態では、上記第１実施形態との相違点を中心に述べることとする。 (Fifth embodiment)
FIGS. 6A and 6B are diagrams showing a pressing process of the lead terminal 30 by the substrate 10 which is a main part of the mold package manufacturing method according to the fifth embodiment of the present invention. FIG. 6A is a schematic cross-sectional view, and FIG. It is a schematic plan view. In this embodiment, the difference from the first embodiment will be mainly described.

図６に示されるように、本実施形態では、基板１０の他方の板面のうちリード端子３０の延設部３０ａが接触する部位に、突出する凸部１３を設けておく。この凸部１３は、基板１０に対してプレス、エッチング、切削などの加工を施すことにより形成する。   As shown in FIG. 6, in the present embodiment, a protruding convex portion 13 is provided in a portion of the other plate surface of the substrate 10 that contacts the extended portion 30 a of the lead terminal 30. The convex portion 13 is formed by processing the substrate 10 such as pressing, etching, and cutting.

そして、当該押さえつけ工程において、この凸部１３と延設部３０ａとを直接接触させる。この接触状態は、最終的なモールドパッケージに継承される。それによれば、基板１０に反りやうねりが存在していても、凸部１３がリード端子３０に接触するため、リード端子３０と基板１０との接触性が確保される。   And in the said pressing process, this convex part 13 and the extension part 30a are made to contact directly. This contact state is inherited by the final mold package. According to this, even if warpage or undulation is present on the substrate 10, the convex portion 13 contacts the lead terminal 30, so that the contact between the lead terminal 30 and the substrate 10 is ensured.

（第６実施形態）
図７は、本発明の第６実施形態に係るモールドパッケージの製造方法の要部である基板１０によるリード端子３０の押さえつけ工程を示す図であり、（ａ）は概略断面図、（ｂ）は概略平面図である。本実施形態は、上記第５実施形態を一部変形したものであり、その変形部分を中心に述べることとする。 (Sixth embodiment)
FIGS. 7A and 7B are diagrams showing a pressing process of the lead terminal 30 by the substrate 10 which is a main part of the method for manufacturing a mold package according to the sixth embodiment of the present invention. FIG. 7A is a schematic cross-sectional view, and FIG. It is a schematic plan view. The present embodiment is a partial modification of the fifth embodiment, and the modified portion will be mainly described.

図７に示されるように、本実施形態も、上記第５実施形態と同様、基板１０の他方の板面のうちリード端子３０の延設部３０ａが接触する部位に、突出する凸部１３を設けておき、この凸部１３と延設部３０ａとを直接接触させるものである。   As shown in FIG. 7, in the present embodiment as well, in the same manner as in the fifth embodiment, the protruding convex portion 13 is formed on a portion of the other plate surface of the substrate 10 where the extended portion 30 a of the lead terminal 30 contacts. It is provided and this convex part 13 and the extended part 30a are made to contact directly.

ここで、本実施形態では、凸部１３を、上記第３実施形態に示したものと同様の樹脂よりなる電気絶縁性の樹脂により形成している。このような樹脂よりなる凸部１３は、フォトリソグラフ法などにより形成される。   Here, in this embodiment, the convex part 13 is formed with the electrically insulating resin which consists of resin similar to what was shown in the said 3rd Embodiment. The convex portion 13 made of such a resin is formed by a photolithographic method or the like.

（他の実施形態）
なお、上記各実施形態において、基板１０とリード端子３０との接続を、ワイヤボンディングを用いて行う場合には、リード端子３０の厚さがワイヤ４０の直径よりも薄い場合に適用するとよい。また、当該接続をリボンにて行う場合には、リード端子３０の厚さがリボンの厚さよりも薄い場合に適用するとよい。 (Other embodiments)
In each of the embodiments described above, when the connection between the substrate 10 and the lead terminal 30 is performed using wire bonding, it may be applied when the thickness of the lead terminal 30 is smaller than the diameter of the wire 40. In addition, when the connection is performed using a ribbon, it may be applied when the thickness of the lead terminal 30 is smaller than the thickness of the ribbon.

また、基板１０としては、一方の板面に電子部品２０が搭載された配線基板でなくてもよく、たとえばベアチップＩＣなどであってもよい。   Further, the substrate 10 may not be a wiring substrate in which the electronic component 20 is mounted on one plate surface, and may be a bare chip IC, for example.

また、上記図１では、基板１０よりも平面サイズが小さいアイランド３１を基板１０の下に設けているが、図１において、このアイランド１０が無い構造としてもよい。   In FIG. 1, the island 31 having a smaller planar size than the substrate 10 is provided below the substrate 10. However, in FIG. 1, the island 10 may be omitted.

本発明の第１実施形態に係るモールドパッケージの概略構成を示す図であり、（ａ）は平面図、（ｂ）は断面図である。It is a figure which shows schematic structure of the mold package which concerns on 1st Embodiment of this invention, (a) is a top view, (b) is sectional drawing. 上記第1実施形態のモールドパッケージの製造方法における基板によるリード端子の押さえつけ工程を示す概略断面図であり、（ａ）は第１の例、（ｂ）は第２の例を示す。It is a schematic sectional drawing which shows the pressing process of the lead terminal by the board | substrate in the manufacturing method of the mold package of the said 1st Embodiment, (a) shows a 1st example, (b) shows a 2nd example. 本発明の第２実施形態に係るモールドパッケージの製造方法における基板によるリード端子の押さえつけ工程を示す図であり、（ａ）は概略断面図、（ｂ）は概略平面図である。It is a figure which shows the pressing process of the lead terminal by the board | substrate in the manufacturing method of the mold package which concerns on 2nd Embodiment of this invention, (a) is a schematic sectional drawing, (b) is a schematic plan view. 本発明の第３実施形態に係るモールドパッケージの製造方法における基板によるリード端子の押さえつけ工程を示す図であり、（ａ）は概略断面図、（ｂ）は概略平面図である。It is a figure which shows the pressing process of the lead terminal by the board | substrate in the manufacturing method of the mold package which concerns on 3rd Embodiment of this invention, (a) is a schematic sectional drawing, (b) is a schematic plan view. 本発明の第４実施形態に係るモールドパッケージの製造方法における基板によるリード端子の押さえつけ工程を示す図であり、（ａ）は押さえつけ前の状態を示す概略断面図、（ｂ）は押さえつけ後の状態を示す概略断面図、（ｃ）は押さえつけ後の状態を示す概略平面図である。It is a figure which shows the pressing process of the lead terminal by the board | substrate in the manufacturing method of the mold package which concerns on 4th Embodiment of this invention, (a) is a schematic sectional drawing which shows the state before pressing, (b) is the state after pressing (C) is a schematic plan view which shows the state after pressing down. 本発明の第５実施形態に係るモールドパッケージの製造方法における基板によるリード端子の押さえつけ工程を示す図であり、（ａ）は概略断面図、（ｂ）は概略平面図である。It is a figure which shows the pressing process of the lead terminal by the board | substrate in the manufacturing method of the mold package which concerns on 5th Embodiment of this invention, (a) is a schematic sectional drawing, (b) is a schematic plan view. 本発明の第６実施形態に係るモールドパッケージの製造方法における基板によるリード端子の押さえつけ工程を示す図であり、（ａ）は概略断面図、（ｂ）は概略平面図である。It is a figure which shows the pressing process of the lead terminal by the board | substrate in the manufacturing method of the mold package which concerns on 6th Embodiment of this invention, (a) is a schematic sectional drawing, (b) is a schematic plan view.

符号の説明Explanation of symbols

１０ 基板
１１ 凹部
１２ 絶縁樹脂
１３ 凸部
３０ リード端子
３０ａ リード端子の延設部
４０ 配線部材
５０ モールド樹脂
１００ 支持台 DESCRIPTION OF SYMBOLS 10 Board | substrate 11 Concave part 12 Insulation resin 13 Convex part 30 Lead terminal 30a Extension part of a lead terminal 40 Wiring member 50 Mold resin 100 Support stand

Claims (6)

基板（１０）と、
前記基板（１０）の端部よりも外側に設けられたリード端子（３０）と、
前記基板（１０）の前記一方の板面と前記リード端子（３０）とを結線し、電気的・機械的に接続する線状の配線部材（４０）と、
前記基板（１０）、前記リード端子（３０）および前記配線部材（４０）を包み込むように封止するモールド樹脂（５０）と、を備え、
前記リード端子（３０）における前記配線部材（４０）との接続部とは反対側の部位が、前記モールド樹脂（５０）より露出しているモールドパッケージにおいて、
前記リード端子（３０）は、前記基板（１０）と重なるように前記基板（１０）の端部より延設された延設部（３０ａ）を有しており、
この延設部（３０ａ）が、前記基板（１０）の前記一方の板面とは反対側の他方の板面に直接接触しており、
この延設部（３０ａ）と前記基板（１０）の前記他方の板面との接触部は、前記モールド樹脂（５０）によって封止されることで、当該延設部（３０ａ）と前記基板（１０）とが固定されていることを特徴とするモールドパッケージ。 A substrate (10);
A lead terminal (30) provided outside the end of the substrate (10);
A linear wiring member (40) for connecting the one plate surface of the substrate (10) and the lead terminal (30) and electrically and mechanically connecting them;
A mold resin (50) for sealing the substrate (10), the lead terminal (30), and the wiring member (40);
In the mold package in which a portion of the lead terminal (30) opposite to the connection portion with the wiring member (40) is exposed from the mold resin (50),
The lead terminal (30) has an extending portion (30a) extending from an end portion of the substrate (10) so as to overlap the substrate (10),
The extending portion (30a) is in direct contact with the other plate surface opposite to the one plate surface of the substrate (10),
A contact portion between the extended portion (30a) and the other plate surface of the substrate (10) is sealed with the mold resin (50), so that the extended portion (30a) and the substrate ( 10) is fixed to a mold package. 前記基板（１０）の前記他方の板面のうち前記リード端子（３０）の前記延設部（３０ａ）が接触する部位には、前記延設部（３０ａ）が嵌り込む凹部（１１）が設けられており、この凹部（１１）に前記延設部（３０ａ）が嵌められることで、前記リード端子（３０）が、前記基板（１０）の板面方向に位置ずれするのを防止していることを特徴とする請求項１に記載のモールドパッケージ。   A concave portion (11) into which the extended portion (30a) is fitted is provided at a portion of the other plate surface of the substrate (10) where the extended portion (30a) of the lead terminal (30) contacts. The extension portion (30a) is fitted in the recess (11), thereby preventing the lead terminal (30) from being displaced in the plate surface direction of the substrate (10). The mold package according to claim 1. 前記基板（１０）の前記他方の板面のうち前記リード端子（３０）の前記延設部（３０ａ）が接触する部位には、突出する凸部（１３）が設けられており、この凸部（１３）と前記延設部（３０ａ）とが直接接触していることを特徴とする請求項１に記載のモールドパッケージ。   A protruding protrusion (13) is provided at a portion of the other plate surface of the substrate (10) where the extended portion (30a) of the lead terminal (30) contacts, and this protruding portion is provided. The mold package according to claim 1, wherein (13) and the extending portion (30a) are in direct contact with each other. 前記基板（１０）の端部よりも外側にリード端子（３０）を設け、線状の配線部材（４０）を介して前記基板（１０）の前記一方の板面と前記リード端子（３０）とを結線して電気的・機械的に接続した後、
前記基板（１０）、前記リード端子（３０）および前記配線部材（４０）を包み込むようにモールド樹脂（５０）で封止するとともに、前記リード端子（３０）における前記配線部材（４０）との接続部とは反対側の部位を、前記モールド樹脂（５０）より露出させるようにしたモールドパッケージの製造方法において、
前記リード端子（３０）として、前記基板（１０）と重なるように前記基板（１０）の端部より延設された延設部（３０ａ）を有するものを用い、
前記リード端子（３０）を支持台（１００）上に搭載し、前記基板（１０）の前記一方の板面とは反対側の他方の板面に前記延設部（３０ａ）を直接接触させつつ、前記リード端子（３０）の前記延設部（３０ａ）をその上から前記基板（１０）で押さえつけることにより、前記リード端子（３０）を固定し、
前記基板（１０）によって固定された前記リード端子（３０）と前記基板（１０）の前記一方の板面とを前記配線部材（４０）によって結線し、
しかる後、前記モールド樹脂（５０）による封止を行い、前記リード端子（３０）の前記延設部（３０ａ）と前記基板（１０）の前記他方の板面との接触部を、前記モールド樹脂（５０）によって封止することによって、当該延設部（３０ａ）と前記基板（１０）とを固定することを特徴とするモールドパッケージの製造方法。 A lead terminal (30) is provided outside the end of the substrate (10), and the one plate surface of the substrate (10) and the lead terminal (30) are arranged via a linear wiring member (40). After connecting and electrically and mechanically connecting,
The substrate (10), the lead terminal (30), and the wiring member (40) are sealed with a mold resin (50) so as to wrap, and the lead terminal (30) is connected to the wiring member (40). In the method for manufacturing a mold package, the part opposite to the part is exposed from the mold resin (50).
As the lead terminal (30), one having an extended portion (30a) extended from an end portion of the substrate (10) so as to overlap the substrate (10) is used.
The lead terminal (30) is mounted on a support base (100), and the extending portion (30a) is in direct contact with the other plate surface opposite to the one plate surface of the substrate (10). The lead terminal (30) is fixed by pressing the extended portion (30a) of the lead terminal (30) with the substrate (10) from above.
The lead terminal (30) fixed by the substrate (10) and the one plate surface of the substrate (10) are connected by the wiring member (40),
Thereafter, sealing with the mold resin (50) is performed, and a contact portion between the extended portion (30a) of the lead terminal (30) and the other plate surface of the substrate (10) is formed as the mold resin. (50) The mold package manufacturing method characterized by fixing the said extending part (30a) and the said board | substrate (10) by sealing. 前記リード端子（３０）を予め支持台（１００）上にて上方に凸となるように屈曲させた後、前記リード端子（３０）を支持台（１００）上に搭載し、
前記基板（１０）による前記リード端子（３０）の押さえつけにより、前記リード端子（３０）を前記支持台（１００）上で真っ直ぐに変形させることを特徴とする請求項４に記載のモールドパッケージの製造方法。 The lead terminal (30) is bent in advance so as to protrude upward on the support base (100), and then the lead terminal (30) is mounted on the support base (100).
The mold package according to claim 4, wherein the lead terminal (30) is straightly deformed on the support base (100) by pressing the lead terminal (30) with the substrate (10). Method. 前記基板（１０）の前記他方の板面のうち前記リード端子（３０）の前記延設部（１０ａ）が接触する部位に、電気絶縁性の絶縁樹脂（１２）を設けた後、前記基板（１０）による前記リード端子（３０）の押さえつけを行い、前記リード端子（３０）の前記延設部（３０ａ）を前記絶縁樹脂（１２）にめり込ませることを特徴とする請求項４または５に記載のモールドパッケージの製造方法。   An electrical insulating insulating resin (12) is provided on a portion of the other plate surface of the substrate (10) where the extended portion (10a) of the lead terminal (30) contacts, and then the substrate ( The lead terminal (30) is pressed by 10), and the extended portion (30a) of the lead terminal (30) is sunk into the insulating resin (12). A method for producing a mold package according to 1.
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JPH01120856A (en) * 1987-11-04 1989-05-12 Sony Corp Lead frame
JPH04164353A (en) * 1990-10-29 1992-06-10 Nec Corp Resin-sealed semiconductor device
JPH0645476A (en) * 1992-07-21 1994-02-18 Fujitsu Ltd Fabrication of hybrid integrated circuit
JPH08125105A (en) * 1993-12-08 1996-05-17 Matsushita Electric Ind Co Ltd Semiconductor device and production thereof
JPH09162330A (en) * 1995-12-11 1997-06-20 Hitachi Ltd Semiconductor integrated circuit device
JPH09289269A (en) * 1996-04-19 1997-11-04 Hitachi Ltd Semiconductor device
JPH10242370A (en) * 1997-02-27 1998-09-11 Nec Kyushu Ltd Semiconductor device
JP2003298008A (en) * 2002-04-05 2003-10-17 Oki Electric Ind Co Ltd Semiconductor device
JP2004221615A (en) * 2004-04-01 2004-08-05 Oki Electric Ind Co Ltd Semiconductor device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01120856A (en) * 1987-11-04 1989-05-12 Sony Corp Lead frame
JPH04164353A (en) * 1990-10-29 1992-06-10 Nec Corp Resin-sealed semiconductor device
JPH0645476A (en) * 1992-07-21 1994-02-18 Fujitsu Ltd Fabrication of hybrid integrated circuit
JPH08125105A (en) * 1993-12-08 1996-05-17 Matsushita Electric Ind Co Ltd Semiconductor device and production thereof
JPH09162330A (en) * 1995-12-11 1997-06-20 Hitachi Ltd Semiconductor integrated circuit device
JPH09289269A (en) * 1996-04-19 1997-11-04 Hitachi Ltd Semiconductor device
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