JP2010087425A5 - - Google Patents

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Publication number
JP2010087425A5
JP2010087425A5 JP2008257722A JP2008257722A JP2010087425A5 JP 2010087425 A5 JP2010087425 A5 JP 2010087425A5 JP 2008257722 A JP2008257722 A JP 2008257722A JP 2008257722 A JP2008257722 A JP 2008257722A JP 2010087425 A5 JP2010087425 A5 JP 2010087425A5
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JP
Japan
Prior art keywords
substrate
contact
holding member
substrate holding
stress
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008257722A
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English (en)
Japanese (ja)
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JP2010087425A (ja
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Publication date
Application filed filed Critical
Priority to JP2008257722A priority Critical patent/JP2010087425A/ja
Priority claimed from JP2008257722A external-priority patent/JP2010087425A/ja
Publication of JP2010087425A publication Critical patent/JP2010087425A/ja
Publication of JP2010087425A5 publication Critical patent/JP2010087425A5/ja
Pending legal-status Critical Current

Links

JP2008257722A 2008-10-02 2008-10-02 基板保持部材および接合装置 Pending JP2010087425A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008257722A JP2010087425A (ja) 2008-10-02 2008-10-02 基板保持部材および接合装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008257722A JP2010087425A (ja) 2008-10-02 2008-10-02 基板保持部材および接合装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014053022A Division JP6044570B2 (ja) 2014-03-17 2014-03-17 基板保持部材および接合装置

Publications (2)

Publication Number Publication Date
JP2010087425A JP2010087425A (ja) 2010-04-15
JP2010087425A5 true JP2010087425A5 (https=) 2012-05-17

Family

ID=42251058

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008257722A Pending JP2010087425A (ja) 2008-10-02 2008-10-02 基板保持部材および接合装置

Country Status (1)

Country Link
JP (1) JP2010087425A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012089623A (ja) * 2010-10-18 2012-05-10 Tokyo Electron Ltd 押圧用アダプタ
JP2013102080A (ja) * 2011-11-09 2013-05-23 Disco Abrasive Syst Ltd ウエーハの支持基板およびウエーハの加工方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6343327A (ja) * 1986-08-11 1988-02-24 Canon Inc エピスパイククラツシユ装置
JP4954663B2 (ja) * 2005-10-17 2012-06-20 東京エレクトロン株式会社 貼り合せ装置
JP2007300033A (ja) * 2006-05-02 2007-11-15 Hitachi Cable Ltd ウェハ接合用ジグ及び発光素子用ウェハの製造方法
JP5061515B2 (ja) * 2006-06-29 2012-10-31 株式会社ニコン ウェハ接合装置及びウェハ接合方法

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