JP2010062556A - Light-emitting module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting module capable of being adapted to a high-density line light source including a plurality of light-emitting diodes, as well as minimizing an externally-emitted optical loss. <P>SOLUTION: The light-emitting module includes a printed circuit board, a plurality of light-emitting diode chips disposed remote to each other in a wiring pattern on the upper side of the printed circuit board, and a connector electrically connected to the plurality of light-emitting diode chips and formed on the lower side of the printed circuit board. The light-emitting module can be adapted to the high-density line light source including a plurality of light-emitting diode chips, and also can minimize the externally-emitted optical loss by optimizing the allocating structure of the light-emitting diode chip and the connector. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a light emitting module, and more particularly, to a light emitting module suitable for use as a high-density line light source.

  In the case of a light emitting module used for an LCD backlight, a cold cathode fluorescent lamp (CCFL) has been used in the past. However, since CCFL uses mercury gas, it may cause environmental pollution. Not only is the speed slow and the color reproducibility is low, but it is also not suitable for light and thin LCD panels. Compared to this, light emitting diodes (LEDs) are environmentally friendly, have a response speed of a few nanoseconds, and are effective for video signal streams. Impulsive driving and color reproducibility Is 100% or more, and not only can the luminance, color temperature, etc. be changed arbitrarily by adjusting the light intensity of the red, green, and blue light emitting diodes, but it also has the advantage of being suitable for light and thin LCD panels In recent years, it has been actively adopted as a light emitting module for backlight.

  FIG. 1 is a perspective view schematically showing a light emitting module according to the prior art. Referring to FIG. 1, the conventional light emitting module includes a plurality of light emitting diode chips 12 respectively disposed on a plurality of substrates 11, and a resin portion 13 is formed to cover the light emitting diode chips 12. In this case, the respective substrates 11 are arranged in the mutual length direction for use as a line light source, and are electrically connected to each other by the wire 14. The plurality of substrates 11 can be used by being accommodated in a chassis structure (not shown).

  However, in the case of the light emitting module 10, the light emitted from the light emitting diode chip 12 may be reflected or scattered by the wire 14 to reduce the light emitting efficiency, and the light emitting diode chip 12 is relatively large in a predetermined space. Since it is difficult to mount the LED, there is a problem that it is not suitable for use in a TV or the like that requires a high-density light source.

  The present invention is intended to solve the above-described problems, and one object of the present invention is not only suitable for use as a high-density line light source including a large number of light-emitting diode chips, but also emitted to the outside. An object of the present invention is to provide a light emitting module capable of minimizing the loss of light.

  In order to achieve the above object, an embodiment of the present invention includes a printed circuit board, a plurality of light emitting diode chips spaced apart from each other by a wiring pattern on an upper surface of the printed circuit board, and the plurality of light emitting diode chips. And a light emitting module including a connector formed on a lower surface of the printed circuit board.

  According to an embodiment of the present invention, the plurality of light emitting diode chips may be arranged in one direction. In this case, it is preferable that the printed circuit board has a bar shape, and the plurality of light emitting diode chips are arranged in a length direction of the printed circuit board.

  According to an embodiment of the present invention, the connector may be formed at at least one end of both ends of the printed circuit board.

  The heat sink may further include a heat sink formed on the lower surface of the printed circuit board.

  The chassis may further include a chassis formed on a lower surface of the printed circuit board, and the chassis may include a groove for receiving the connector.

  According to an embodiment of the present invention, the connector may include a female connector portion or a male connector portion formed toward the outside of the printed circuit board. In this case, a plurality of the printed circuit boards are provided, and the plurality of printed circuit boards are connected to the adjacent ones by the connector to form a line light source.

  According to the embodiment of the present invention, a resin part covering each of the plurality of light emitting diode chips may be further included. In this case, the resin part may have a lens shape.

  According to another embodiment of the present invention, a printed circuit board having a plurality of holes spaced apart from each other, a heat sink formed on a lower surface of the printed circuit board, and a plurality of holes in the printed circuit board, respectively. Provided is a light emitting module including a plurality of light emitting diode chips arranged to contact the heat sink and a connector formed on a lower surface of the printed circuit board and electrically connected to the plurality of light emitting diode chips.

  According to an embodiment of the present invention, it may further include a wire for electrically connecting the light emitting diode chip and a wiring pattern formed on the upper surface of the printed circuit board.

  According to an embodiment of the present invention, the reflective layer may further include a reflective layer formed in a region of the surface of the heat sink exposed through the plurality of holes of the printed circuit board that does not contact the plurality of light emitting diode chips.

  According to an embodiment of the present invention, the plurality of holes of the printed circuit board may be arranged in one direction. In this case, the printed circuit board may have a bar shape, and the plurality of holes of the printed circuit board may be arranged in a length direction of the printed circuit board.

  According to the present invention, by optimizing the arrangement structure of the light emitting diode chip and the connector, it is not only suitable for use as a high density line light source including a large number of light emitting diode chips, but also the loss of light emitted to the outside. Can be provided.

It is the perspective view which represented the light emitting module by a prior art schematically. 1 is a perspective view schematically illustrating a light emitting module according to an embodiment of the present invention. 3 illustrates a connection structure of the light emitting modules illustrated in FIG. 2. FIG. 4 is a cross-sectional view illustrating a structure in which light emitting modules having a connection structure as illustrated in FIG. It is sectional drawing showing the light emitting module by other embodiment of this invention. It is sectional drawing showing the light emitting module by other embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the embodiments of the present invention can be modified in various other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art. Accordingly, the shape and size of elements in the drawings may be exaggerated for a clearer description, and elements denoted by the same reference numerals in the drawings are the same elements.

  FIG. 2 is a perspective view schematically illustrating a light emitting module according to an embodiment of the present invention. FIG. 3 illustrates a connection structure of the light emitting modules illustrated in FIG.

  First, referring to FIG. 2, the light emitting module 100 according to the present embodiment has a bar shape formed long in one direction (hereinafter, referred to as a length direction), and can be used as a line light source. . Therefore, the light emitting module 100 includes a bar-shaped printed circuit board 101, and a plurality of light emitting diode chips (LEDs 102) are arranged in the length direction of the printed circuit board 101 on the wiring pattern of the printed circuit board 101. Be placed. This corresponds to a COB (Chip On Board) structure in which the light emitting diode chip 102 is directly mounted on the printed circuit board 101.

  The printed circuit board 101 may be made of a material such as ceramic or epoxy, and may be made of a polymer material in order to maintain a stable bar shape. In particular, unlike the conventional case, the printed circuit board 101 can be formed with a wiring pattern on both the upper surface and the lower surface. By arranging the connector 104 on the wiring pattern on the lower surface as described later, The number of light emitting diode chips 102 that can be arranged can be increased, and reflection or scattering of light emitted to the outside can be minimized.

  A resin portion 103 covering the light emitting diode chip 102 is formed on the printed circuit board 101. The resin part 103 is made of a resin such as silicon and protects the light emitting diode chip 102. When the resin part 103 has a lens shape as shown in FIG. 2, the directivity angle at which light is emitted can be improved. Further, the resin part 103 includes phosphor particles dispersed therein, so that the light emitting module 100 can emit white light.

  Although not an essential component in the present embodiment, a heat sink 105 for effectively releasing heat from the printed circuit board 101 and the light emitting diode chip 102 is disposed on the lower surface of the printed circuit board 101. Can do. The heat sink 105 can be configured by appropriately laminating a material having high thermal conductivity such as metal or AlN. On the lower surface of the printed circuit board 101, an electrical signal is transmitted to the light emitting diode chip 102, and a connector 104 provided to connect to another light emitting module is disposed.

  Therefore, as shown in FIG. 2, the connectors 104 may be disposed at both ends in the length direction of the printed circuit board 101. In addition, the connector 104 is disposed to be electrically connected to the light emitting diode chip 102 in a wiring pattern on the lower surface of the printed circuit board 101. For this reason, the printed circuit board 101 has an appropriate conductive via structure. be able to.

  As described above, the connector 104 may include a female or male connector portion for connection with another adjacent light emitting module. That is, as shown in FIG. 3, a plurality of the light emitting modules 100 are provided and connected to each other in the longitudinal direction, so that they can be used for a longer line light source. In this case, the female connector of the connector 104 is used. The male connector part of the connector 104 included in another light emitting module adjacent to the part can be interconnected.

  As described above, in the case of the present embodiment, the connector 104 is arranged on the lower surface of the printed circuit board 101 using the printed circuit board 101 in which the wiring pattern is formed on both sides instead of the wiring pattern formed on only one side. As a result, a space for disposing the light emitting diode chip 102 can be relatively increased on the upper surface. Accordingly, the light emitting module 100 can be usefully used in a field requiring a high-density light source such as a TV. In addition, no wire is used for the electrical connection between the light emitting diode chip 102 and the wiring pattern of the printed circuit board 101, and the light emitted from the light emitting diode chip 102 is not obstructed. You can expect.

  FIG. 4 is a cross-sectional view showing a structure in which light emitting modules having a connection structure as shown in FIG. 3 are arranged in a chassis. Referring to FIG. 4, the light emitting module having the structure described with reference to FIGS. 2 and 3 may be disposed on the chassis 106. In this case, the chassis 106 may be made of aluminum (Al) or the like so as to be advantageous for heat release, and in particular, the chassis 106 is provided in close contact with the heat sink 105 by being provided with a groove that can accommodate the connector 104. Can be done. As a result, the chassis 106 can release heat to the outside more effectively.

  FIG. 5 is a cross-sectional view illustrating a light emitting module according to another embodiment of the present invention. Referring to FIG. 5, the light emitting module 200 according to the present embodiment includes a printed circuit board 201, a light emitting diode chip 202, a resin portion 203, a connector 204, and a heat sink 205 as in the previous embodiment. A description will be given centering on matters different from the embodiment. The printed circuit board 201 has a wiring pattern formed on both the upper surface and the lower surface, and has holes formed in the thickness direction. The holes formed in the printed circuit board 201 are provided as a space for arranging the light emitting diode chip 202, and a plurality of holes may be provided and arranged in the length direction of the printed circuit board 201.

  The light emitting diode chip 202 is not directly in contact with the printed circuit board 201 but is electrically connected by a wire 207 and is in direct contact with the upper surface of the heat sink 205. By having such a structure, the heat generated from the light emitting diode chip 202 can be more efficiently transferred to the heat sink 205.

  Meanwhile, as illustrated in FIG. 5, a reflective layer 208 may be formed on the upper surface of the heat sink 205. That is, one or more layers of silver (Ag), aluminum (Al), etc. are laminated on the upper surface of the heat sink 205 exposed through the holes of the printed circuit board 201 except for the region where the light emitting diode chip 202 is formed. The reflective layer 208 having the above structure can be formed to further increase the amount of light emitted to the outside.

  Meanwhile, the connector connection method can be modified as shown in FIG. FIG. 6 is a cross-sectional view illustrating a light emitting module according to another embodiment of the present invention.

  Referring to FIG. 6, the light emitting module 300 according to the present embodiment includes a printed circuit board 301, a light emitting diode chip 302, a resin portion 303, a connector 304, and a heat sink 305, as in the above embodiment. The connector 304 is a male connector. Corresponds to the division. Such a male connector portion 304 is connected to a female connector portion 307 disposed on the chassis 306, and the light emitting modules 300 are not connected to each other by a connector. In this case, unlike the configuration illustrated in FIG. 6, the connector 304 provided in the light emitting module 300 may be a female connector portion, and the connector 307 provided in the chassis 306 may be a male connector portion. In the case of the method of connecting the connector 304 provided in the light emitting module 300 with the connector 307 provided in the chassis 306 as in the present embodiment, there is inconvenience that the light emitting module 300 must be connected in advance and then incorporated into the chassis. Therefore, the built-in defect rate can be reduced in the manufacturing process.

  The present invention is not limited by the embodiments described above and the accompanying drawings, but by the appended claims. Accordingly, various forms of substitutions, modifications and changes can be made by persons having ordinary knowledge in the art without departing from the technical idea of the present invention described in the claims. Belongs to a range.

DESCRIPTION OF SYMBOLS 101 Printed circuit board 102 Light emitting diode chip 103 Resin part 104 Connector 105 Heat sink 106 Chassis 207 Wire 208 Reflective layer

Claims (17)

A printed circuit board;
A plurality of light emitting diode chips disposed on the wiring pattern on the upper surface of the printed circuit board and spaced apart from each other;
A connector electrically connected to the plurality of light emitting diode chips and formed on a lower surface of the printed circuit board;
Including light emitting module.   The light emitting module according to claim 1, wherein the plurality of light emitting diode chips are arranged in one direction.   The light emitting module according to claim 2, wherein the printed circuit board has a bar shape, and the plurality of light emitting diode chips are arranged in a length direction of the printed circuit board.   The light emitting module according to claim 1, wherein the connector is formed at least at one end of both ends of the printed circuit board.   5. The light emitting module according to claim 1, further comprising a heat sink formed on a lower surface of the printed circuit board. Further comprising a chassis formed on a lower surface of the printed circuit board;
The light emitting module according to claim 1, wherein the chassis includes a groove for receiving the connector.   The light emitting module according to claim 6, further comprising another connector formed in the chassis groove and having a shape capable of being coupled to the connector. A plurality of the printed circuit boards are provided,
The light emitting module according to claim 7, wherein each of the plurality of printed circuit boards forms a line light source in a state where it is not connected to an adjacent one by the connector.   The light emitting module according to claim 1, wherein the connector includes a female connector portion or a male connector portion formed toward the outside of the printed circuit board. A plurality of the printed circuit boards are provided,
The light emitting module according to claim 9, wherein each of the plurality of printed circuit boards is connected to an adjacent one by the connector to form a line light source.   The light emitting module according to claim 1, further comprising a resin portion covering each of the plurality of light emitting diode chips.   The light emitting module according to claim 11, wherein the resin portion has a lens shape. A printed circuit board comprising a plurality of holes spaced apart from each other;
A heat sink formed on a lower surface of the printed circuit board;
A plurality of light emitting diode chips each disposed to contact the heat sink in a plurality of holes of the printed circuit board;
A connector electrically connected to the plurality of light emitting diode chips and formed on a lower surface of the printed circuit board;
Including light emitting module.   The light emitting module according to claim 13, further comprising a wire for electrically connecting the light emitting diode chip and a wiring pattern formed on an upper surface of the printed circuit board.   15. The light emitting device according to claim 13, further comprising a reflective layer formed in a region of the surface of the heat sink exposed by the plurality of holes of the printed circuit board that does not contact the plurality of light emitting diode chips. module.   The light emitting module according to claim 13, wherein the plurality of holes of the printed circuit board are arranged in one direction.   The light emitting module according to claim 16, wherein the printed circuit board has a bar shape, and the plurality of holes of the printed circuit board are arranged in a length direction of the printed circuit board.

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