JP2010062503A5 - - Google Patents

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Publication number
JP2010062503A5
JP2010062503A5 JP2008229584A JP2008229584A JP2010062503A5 JP 2010062503 A5 JP2010062503 A5 JP 2010062503A5 JP 2008229584 A JP2008229584 A JP 2008229584A JP 2008229584 A JP2008229584 A JP 2008229584A JP 2010062503 A5 JP2010062503 A5 JP 2010062503A5
Authority
JP
Japan
Prior art keywords
wafer
silicon layer
crystal defects
simox wafer
simox
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2008229584A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010062503A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008229584A priority Critical patent/JP2010062503A/ja
Priority claimed from JP2008229584A external-priority patent/JP2010062503A/ja
Priority to US12/551,958 priority patent/US8030183B2/en
Publication of JP2010062503A publication Critical patent/JP2010062503A/ja
Publication of JP2010062503A5 publication Critical patent/JP2010062503A5/ja
Ceased legal-status Critical Current

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JP2008229584A 2008-09-08 2008-09-08 Simoxウェーハの結晶欠陥の低減方法及びsimoxウェーハ Ceased JP2010062503A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008229584A JP2010062503A (ja) 2008-09-08 2008-09-08 Simoxウェーハの結晶欠陥の低減方法及びsimoxウェーハ
US12/551,958 US8030183B2 (en) 2008-09-08 2009-09-01 Method for reducing crystal defect of SIMOX wafer and SIMOX wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008229584A JP2010062503A (ja) 2008-09-08 2008-09-08 Simoxウェーハの結晶欠陥の低減方法及びsimoxウェーハ

Publications (2)

Publication Number Publication Date
JP2010062503A JP2010062503A (ja) 2010-03-18
JP2010062503A5 true JP2010062503A5 (https=) 2011-10-27

Family

ID=42188952

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008229584A Ceased JP2010062503A (ja) 2008-09-08 2008-09-08 Simoxウェーハの結晶欠陥の低減方法及びsimoxウェーハ

Country Status (1)

Country Link
JP (1) JP2010062503A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010118382A (ja) * 2008-11-11 2010-05-27 Sumco Corp Simoxウェーハの結晶欠陥の低減方法
KR20130017914A (ko) * 2011-08-12 2013-02-20 삼성전자주식회사 광전 집적회로 기판 및 그 제조방법

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6169145A (ja) * 1984-09-12 1986-04-09 Toshiba Corp 半導体基体の製造方法
JPH03240230A (ja) * 1990-02-19 1991-10-25 Fujitsu Ltd 半導体装置の製造方法
JPH05291543A (ja) * 1992-04-15 1993-11-05 Fujitsu Ltd 半導体装置の製造方法
JPH06283421A (ja) * 1993-03-18 1994-10-07 Mitsubishi Materials Corp Soi基板およびその製造方法
JPH07193072A (ja) * 1993-12-27 1995-07-28 Nec Corp 半導体基板の製造方法
JP3139904B2 (ja) * 1993-12-28 2001-03-05 新日本製鐵株式会社 半導体基板の製造方法および製造装置
JPH1079355A (ja) * 1996-09-03 1998-03-24 Komatsu Denshi Kinzoku Kk Soi基板の製造方法
JPH10163218A (ja) * 1996-11-28 1998-06-19 Nkk Corp 半導体基板とその製造方法
JPH1126390A (ja) * 1997-07-07 1999-01-29 Kobe Steel Ltd 欠陥発生防止方法
JP2002289552A (ja) * 2001-03-28 2002-10-04 Nippon Steel Corp Simox基板の製造方法およびsimox基板
JP2002343800A (ja) * 2001-05-18 2002-11-29 Fujitsu Ltd シリコン半導体装置及びその製造方法

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