JP2010058249A - Ingot cutting device and cutting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an ingot cutting device capable of improving productivity by automatically and precisely dressing a blade and a cutting method. <P>SOLUTION: This ingot cutting device with a cutting table on which ingot is horizontally placed and which has a clearance to make the blade to cut the ingot not contact with the cutting table cuts the ingot by relatively delivering the blade from above to below at a position of the clearance of the cutting table. The ingot cutting device is equipped with an ingot supporting member comprising a dressing material to support a cutting finishing part of the ingot from below at least at a position to cut the ingot by the blade and dresses the blade by forming a groove by cutting an upper part of the ingot supporting member in cutting the ingot. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an ingot cutting device for cutting an ingot, particularly a single crystal silicon ingot pulled up by the Czochralski method (CZ method) or the like, and a cutting method using the same.

A silicon ingot manufactured by the CZ method or the like has a cone-shaped end portion (top portion and tail portion) in a cylindrical body portion. In the processing of the silicon ingot, these cone-shaped end portions are separated to form only a cylindrical body portion, and the body portion is cut into a plurality of blocks as necessary. Next, processing for making the block into a wafer is performed.
When cutting the cone-shaped end portion or cutting the body portion into a plurality of blocks, an inner peripheral blade slicer, an outer peripheral blade slicer, and the like have been often used. With the recent increase in wafer diameter, many band saws have been used.

Here, the outline | summary about the cutting method of the said block at the time of making an ingot cutting device into a band saw in FIG. 7 is shown.
As shown in FIG. 7, the ingot cutting device 101 is provided with a cutting table 105 for supporting the ingot at the time of cutting. Then, the ingot 104 is horizontally arranged on the cutting table 105 before cutting. The cutting table 105 includes a cutting table 105 a and a cutting table 105 b, and has a gap 106 for preventing the blade 102 for cutting the ingot 104 from contacting the cutting table 105.

Then, the placement position of the ingot 104 is adjusted so that the position where the ingot 104 is cut is matched with the gap 106.
Further, the ingot cutting device 101 includes an endless belt-like blade (band saw) 102 formed of a blade abrasive portion formed by adhering diamond abrasive grains to an end portion of a thin blade base metal between pulleys 103 and 103 ′. Is stretched.

  The blade 102 is driven to rotate by the rotation of the pulleys 103 and 103 ′, and the ingot 104 is cut by sending the blade 102 from the upper side to the lower side at the position of the gap of the cutting table 105.

  If the cutting is repeated in this way, the cutting powder is deposited on the blade abrasive grains, and the abrasive grains are buried, or the abrasive grains are worn by the cutting, so that the cutting ability is lowered. When cutting is performed in such a state, there is a problem that the blade 102 is displaced due to an increase in cutting resistance and the blade 102 is shaken and the wafer to be cut is warped.

  For this reason, the blade needs to be dressed regularly, and conventionally, dressing is performed by a so-called hand dressing method. In this method, the operator presses the dressing member against the blade while adjusting the pressing force and angle based on experience. However, since it largely depends on the skill of the individual worker, the dressing accuracy varies, and a wafer with stable quality cannot be cut. In addition, there is a problem that the process time is increased by performing dressing by the operator in this way, and the productivity is lowered.

  To address such problems, a dressing device is disclosed in which a dressing device is provided in a slicing machine for an inner peripheral blade, and after the cut wafer is collected, the dressing device automatically performs dressing of the inner peripheral blade with the dressing device. (See cited document 1).

  Further, when the ingot 104 is placed on the conventional cutting table 105 as described above and the ingot 104 is cut, if there is a step in the gap between the cutting tables 105a and 105b, the cut surface will be cut when the ingot 104 is cut. There was also a problem that the ingot 104 was chipped at the end of cutting because it moved left and right in the longitudinal direction or moved up and down.

JP 11-48141 A

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide an ingot cutting device and a cutting method capable of automatically and accurately performing blade dressing and improving productivity.

  To achieve the above object, according to the present invention, an ingot is horizontally placed on a cutting table, and the cutting table has a gap for preventing a blade for cutting the ingot from coming into contact with the cutting table. An ingot cutting device that cuts the ingot by relatively feeding the blade downward from above at a position of a gap in the cutting table, at least at the position at which the ingot is cut by the blade It comprises an ingot support member made of a dressing material for supporting a cutting end portion of the ingot from below, and at the time of cutting the ingot, the upper part of the ingot support member is cut to form a groove to perform dressing of the blade. An ingot cutting device is provided (claim 1).

  As described above, at least the ingot support member made of the dressing material for supporting the cut end portion of the ingot from below at the position where the ingot is cut by the blade is provided, and the ingot support member is cut when the ingot is cut. If the blade is dressed by cutting the upper part of the blade, the ingot support member becomes a fulcrum for cutting, and the effect of the step in the gap portion of the cutting table is suppressed, and the end of the ingot is missing. It is possible to automatically dress the entire abrasive part of the blade after the ingot has been cut, while preventing the occurrence of. Thereby, the quality of the ingot cut | disconnected by reducing the variation in dressing precision can be maintained stably. In addition, the dressing time can be significantly reduced, productivity can be improved, and dressing can be performed without increasing the cost of the ingot cutting device itself.

At this time, the blade of the ingot cutting device can be a band saw.
Thus, if the blade of the ingot cutting device is a band saw, the present invention can be applied to cut a large-diameter silicon ingot in recent years with stable quality.

At this time, it is preferable that the shape of the contact surface of the ingot support member with the ingot is a shape along the shape of the contact surface of the ingot.
Thus, if the shape of the contact surface of the ingot support member with the ingot is a shape that conforms to the shape of the contact surface of the ingot, the dressing of the blade can be performed more accurately, and the cutting accuracy of the ingot Can be further improved.

  Further, at this time, the cutting table is moved relative to the side surface of the blade in the vertical direction so that the side surface of the blade comes into contact with the inner surface of the groove of the ingot support member formed when the ingot is cut. Therefore, it is preferable to dress the side surface of the blade.

  In this way, the cutting table is moved in the vertical direction relative to the side surface of the blade, and the side surface of the blade is brought into contact with the inner surface of the groove of the ingot support member formed when the ingot is cut. Thus, if the side surface of the blade is dressed, the side surface of the blade can be dressed a plurality of times with one groove of the ingot support member, and the blade edge deflection can be adjusted, which is advantageous in terms of cost. Further, the dressing of the side surface of the blade in one groove can be automated, and the dressing accuracy can be performed more stably.

At this time, it is preferable to provide an air nozzle that removes the waste by blowing air onto the cutting waste and dress waste generated at the time of cutting the ingot.
Thus, if it has an air nozzle which eliminates the waste by blowing air on the cutting waste and dress waste generated at the time of cutting the ingot, the variation in the dressing accuracy of the blade can be improved more effectively. be able to.

Moreover, at this time, the support member raising mechanism for raising the said ingot support member from the downward direction and making it closely_contact | adhere to the said ingot can be comprised (Claim 6).
In this way, if the ingot support member is provided with a support member raising mechanism for raising the ingot support member from below and bringing it into close contact with the ingot, the ingot support member serves as a fulcrum at the time of cutting, and the step of the gap portion of the cutting table It is possible to more reliably exhibit the effect of preventing the occurrence of chipping at the end portion of the ingot by suppressing the influence of.

  In the present invention, an ingot is horizontally placed on a cutting table, and a gap is provided on the cutting table so that a blade for cutting the ingot does not come into contact with the cutting table. A method of cutting an ingot that cuts the ingot by feeding it from the upper side to the lower side at a position of the gap, wherein the end portion of the ingot is made of dressing material at a position where the blade is cut by the blade A method for cutting an ingot is provided, characterized in that the ingot is supported by cutting from an ingot support member from below, the upper portion of the ingot support member is cut by the blade to form a groove, and the blade is dressed. Item 7).

  Thus, at the position where the ingot is cut by the blade, the end portion of the ingot is supported from below by the ingot support member made of a dressing material to cut the ingot, and the upper part of the ingot support member is cut by the blade. By cutting and forming a groove and dressing the blade, the ingot support member is used as a fulcrum at the time of cutting, and the influence of the step of the gap portion of the cutting table is suppressed to prevent chipping at the end portion of the ingot. On the other hand, the entire abrasive part of the blade can be dressed automatically after the ingot is cut. Thereby, the quality of the ingot cut | disconnected by reducing the variation in dressing precision can be maintained stably. In addition, the dressing time can be significantly reduced and the productivity can be improved.

At this time, the ingot can be cut by a band saw.
Thus, if the ingot is cut with a band saw, the present invention can be applied to cut a large-diameter silicon ingot with a stable quality in recent years.

At this time, as the ingot support member, it is preferable to use a member whose contact surface with the ingot of the ingot support member has a shape along the shape of the contact surface of the ingot.
Thus, if the shape of the contact surface of the ingot support member with the ingot is a shape along the shape of the contact surface of the ingot as the ingot support member, blade dressing can be performed with higher accuracy. This can be performed, and the ingot cutting accuracy can be further improved.

Further, at this time, the cutting table is moved in the vertical direction relative to the side surface of the blade, and the side surface of the blade is brought into contact with the inner surface of the groove of the ingot support member formed when the ingot is cut. It is preferable to dress the side surface of the blade.
In this way, the cutting table is moved in a direction perpendicular to the side surface of the blade, and the side surface of the blade is brought into contact with the inner surface of the groove of the ingot support member formed when the ingot is cut. Therefore, if the side surface of the blade is dressed, the side surface of the blade can be dressed a plurality of times with one groove of the ingot support member, and the blade tip deflection can be adjusted, which is advantageous in terms of cost. Further, the dressing of the side surface of the blade in one groove can be automated, and the dressing accuracy can be performed more stably.

Further, at this time, it is preferable to eliminate the waste by blowing air to the cutting waste and dress waste generated at the time of cutting the ingot.
Thus, if the waste is eliminated by blowing air onto the cutting waste and dress waste generated at the time of cutting the ingot, variation in the dressing accuracy of the blade can be improved more effectively.

Further, at this time, the ingot can be cut by raising the ingot support member from below by using the support member raising mechanism to be brought into close contact with the ingot.
In this way, if the ingot support member is lifted from below by the support member raising mechanism and brought into close contact with the ingot to cut the ingot, the ingot support member becomes a fulcrum at the time of cutting, and the effect of the step in the gap portion of the cutting table It is possible to more reliably achieve the effect of preventing the occurrence of chipping at the end of the ingot by suppressing the ingot.

  According to the present invention, the ingot cutting device includes an ingot support member made of a dressing material for supporting an ingot cutting end portion from below at least at a position where the ingot is cut with a blade, and when the ingot is cut, the ingot support member Since the blade is dressed by cutting the upper part of the blade, the ingot support member serves as a fulcrum during cutting, and the effect of the step in the gap portion of the cutting table is suppressed, and the ingot end portion is generated. It is possible to automatically dress the entire abrasive part of the blade after the ingot has been cut. Thereby, the quality of the ingot cut | disconnected by reducing the variation in dressing precision can be maintained stably. In addition, the dressing time can be significantly reduced and the productivity can be improved.

Hereinafter, although an embodiment is described about the present invention, the present invention is not limited to this.
Conventionally, blade dressing is performed by a method called so-called hand dressing. In this method, the operator presses the dressing member against the blade while adjusting the pressing force and angle based on experience. However, since it largely depends on the skill of the individual worker, the dressing accuracy varies, and a wafer with stable quality cannot be cut. In addition, there is also a problem that the process time increases due to the dressing by the operator and the productivity is lowered. There is also a safety problem because the work is performed near the blade.

  Therefore, the present inventor has intensively studied to solve such problems. As a result, if the dressing material is placed below the end of the ingot and the upper part of the dressing material is cut to form a groove and the blade is dressed, the dressing can be automated. It was conceived that the variation of the process and the process time can be reduced. And the best form for implementing these was scrutinized and the present invention was completed.

FIG. 1 shows a schematic diagram of an example of an ingot cutting device that can be used in the present invention.
As shown in FIG. 1, the blade of the ingot cutting device 1 is a band saw.
The ingot cutting device 1 is provided with a cutting table 5 for placing the ingot 4 at the time of cutting. The cutting table 5 includes a cutting table 5a and a cutting table 5b.

Further, the ingot cutting device 1 includes an endless belt-like blade (band saw) 2 constituted by a blade abrasive grain portion 12 formed by adhering diamond abrasive grains to an end portion of a thin blade base metal, and pulleys 3 and 3 ′. It is stretched between.
A gap 6 is provided between the cutting table 5 a and the cutting table 5 b so that the blade 2 for cutting the ingot does not contact the cutting table 5.

FIG. 2 is a schematic side view showing a state where the ingot 4 is placed on the cutting table 5.
As shown in FIG. 2, the ingot 4 is placed horizontally on the cutting table 5. Further, an ingot support member 7 made of a dressing material is installed below the ingot 4 at a position of the gap 6 of the cutting table 5. The ingot support member 7 supports a cut end portion of the ingot 4 from below at a position where the ingot 4 is cut by the blade 2. Here, the material of the ingot support member 7 can be made of alumina or SiC.

FIG. 3 is a schematic explanatory view showing a state in which the blade 2 cuts the ingot 4 when the ingot 4 is cut.
As shown in FIG. 3, the ingot 4 is cut by sending the blade 2 from the upper side to the lower side at the position of the gap of the cutting table 5. At that time, the ingot support member 7 supports the cut end portion from below.

  Thus, if the ingot support member 7 supports and cuts the cutting end portion of the ingot 4 from below at the position where the ingot 4 is cut by the blade 2, the ingot support member 7 becomes a fulcrum at the time of cutting, and the cutting table It is possible to prevent the occurrence of chipping at the cut end portion of the ingot 4 by suppressing the influence of the step of the gap portion 5.

  Then, after the blade 2 cuts the ingot 4, the blade 2 is further sent relatively downward, and the upper portion of the ingot support member 7 is cut to form the groove 11. At this time, dressing of the tip and both side surfaces of the blade abrasive grain portion 12 is automatically performed.

  If the dressing of the blade 2 is automatically performed at the time of cutting the ingot in this manner, the quality of the ingot 4 to be cut can be stably maintained while reducing the variation in dressing accuracy. In addition, the dressing time can be significantly reduced, productivity can be improved, and dressing can be performed without increasing the cost of the ingot cutting device itself. Furthermore, safety can be improved.

At this time, as shown in FIG. 4, the shape of the contact surface of the ingot support member 7 with the ingot 4 is preferably a shape along the shape of the contact surface of the ingot 4.
Thus, if the shape of the contact surface of the ingot support member 7 with the ingot 4 is a shape that follows the shape of the contact surface of the ingot 4, the cut end portion of the ingot 4 is chipped at the end of cutting. And the dressing of the blade 2 can be performed more accurately, and the cutting accuracy of the ingot 4 can be further improved.

  At this time, as shown in FIG. 5A, when the cutting table 5 is moved, the ingot support member 7 is also moved in synchronization therewith, and the cutting table 5 is relatively perpendicular to the side surface of the blade 2. 5 (A), (B), and (C), the side of the abrasive grain portion 12 of the blade 2 is supported by an ingot support formed when the ingot 4 is cut. Dressing can also be performed by contacting the inner surface of the groove 11 of the member 7.

  Thus, as shown in FIG. 5A, when the cutting table 5 is moved, the ingot support member 7 is also moved in synchronization therewith, and the cutting table 5 is relatively perpendicular to the side surface of the blade 2. If the dressing is performed by bringing the side surface of the blade 2 into contact with the inner surface of the groove 11 of the ingot support member 7 formed when the ingot 4 is cut, one groove formed in the ingot support member 7 by cutting 11 can be dressed multiple times, which is advantageous in terms of cost. Further, the runout of the blade 2 can be adjusted, and the straight running stability at the time of cutting the band saw can be improved.

At this time, by moving the cutting table 5 or the blade 2 by the movement amount set in advance by the NC program, the dressing of the side surface of the blade 2 can be automated, and the dressing accuracy can be performed more stably. Can do.
Further, at this time, as shown in FIG. 5A, the displacement amount of the blade 2 is measured by the overcurrent sensor 13, and the amount of relative movement between the cutting table 5 and the blade 2 is determined according to the measured displacement amount. You may do it.

At this time, as shown in FIG. 3, it is preferable to provide an air nozzle 14 that removes the waste by blowing air onto the cutting waste and dress waste generated when the ingot 4 is cut.
As described above, if the air nozzle 14 for removing the waste by blowing air to the cutting waste and dress waste generated when the ingot 4 is cut is provided, the variation in dressing accuracy of the blade 2 is more effectively achieved. Can be improved.

At this time, as shown in FIGS. 4 and 6, a support member raising mechanism 8 for raising the ingot support member 7 from below and bringing it into close contact with the ingot 4 can be provided.
Here, as shown in FIG. 6, the supporting member raising mechanism 8 is constituted by a moving portion 9 and a fixed portion 10, and the ingot supporting member 7 is raised by moving the moving portion 9 upward by a spring or hydraulic pressure. It can also be.

  In this manner, if the support member raising mechanism 8 for raising the ingot support member 7 from below and closely contacting the ingot 4 is provided, the ingot support member 7 serves as a fulcrum at the time of cutting, and the gap of the cutting table 5 The effect of preventing the occurrence of chipping at the cut end portion of the ingot 4 by suppressing the influence due to the level difference of the portion can be more reliably exhibited.

Next, the ingot cutting method according to the present invention will be described.
Here, the case where the ingot cutting device according to the present invention as shown in FIG. 1 is used will be described.

  First, as shown in FIG. 2, the ingot 4 to be cut into blocks is placed horizontally on the cutting table 5. Then, the mounting position of the ingot 4 is adjusted so that the position at which the ingot 4 is cut matches the gap 6 of the cutting table 5. At this time, the end portion of the ingot 4 is supported from below at the position where the blade 2 cuts the ingot 4 with the ingot support member 7 made of dressing material.

  Thereafter, the blade 2 is driven to rotate by the rotation of the pulleys 3 and 3 ′, and the ingot 4 is cut by sending the blade 2 from the upper side to the lower side at the position of the gap of the cutting table 5. In this case, the blade 2 may be sent from the top to the bottom, or the ingot 4 may be sent from the bottom to the top. Of course, both may be performed.

  Thus, in the ingot cutting method of the present invention, the end of the ingot 4 is supported from below by the ingot support member 7 made of a dressing material at the position where the ingot 4 is cut by the blade 2, so that at least the ingot support is supported. Even if the member 7 becomes a fulcrum at the time of cutting, and there is a certain level of difference in the gap portion of the cutting table 5, the influence can be suppressed and the occurrence of chipping at the cutting end portion of the ingot 4 can be prevented.

Then, as shown in FIG. 3, after the blade 2 cuts the ingot 4, the blade 2 is further sent relatively downward, the upper portion of the ingot support member 7 is cut to form the groove 11, and the blade abrasive grain portion The dressing of the tip and both sides is automatically performed.
If the dressing of the blade 2 is automatically performed at the time of cutting the ingot in this manner, the quality of the ingot 4 to be cut can be stably maintained while reducing the variation in dressing accuracy. In addition, the dressing time can be significantly reduced and the productivity can be improved. Furthermore, safety can be improved.

In the ingot cutting method of the present invention, it can be cut with a band saw as illustrated in FIG.
Thus, if the ingot is cut with a band saw, the present invention can be applied to cut a large-diameter silicon ingot with a stable quality in recent years.

Further, at this time, as shown in FIG. 4, as the ingot support member 7, the ingot support member 7 having a shape of a contact surface with the ingot 4 that conforms to the shape of the contact surface of the ingot 4 is used. preferable.
Thus, if the shape of the contact surface with the ingot 4 of the ingot support member 7 is the shape along the shape of the contact surface of the ingot 4 as the ingot support member 7, the dressing of the blade 2 is more accurate. This can be performed well, and the cutting accuracy of the ingot 4 can be improved.

  In this way, the ingot 4 is cut into blocks, and the blocks after cutting are carried out from the cutting table 5. Then, the cutting position is adjusted by placing the ingot to be cut next on the cutting table 5 and moving the ingot, and at the same cutting position as when the groove 11 is formed in the ingot support member 7 as described above. The ingot 4 is cut. Further, when a sample is taken from the ingot 4 or when the remaining portion of the ingot 4 is divided into blocks, the position of the ingot 4 is adjusted again so as to match the cutting position with the gap 6 of the cutting table 5. The ingot 4 is cut by the following procedure.

  At the time of this cutting, the position of the upper part of the ingot support member 7 with respect to the cutting position of the ingot 4 may be slightly shifted each time for cutting to form a new groove 11 and dressing, but the same ingot support member 7 It is also possible to perform dressing of the blade 2 a plurality of times in the groove 11. That is, after cutting the ingot 4, the blade 2 is further sent downward, and the abrasive grain portion 12 of the blade 2 enters the groove 11 of the ingot support member 7. 2 is fed further downward, and as shown in FIGS. 5 (A), 5 (B), and 5 (C), the cutting table 5 is placed against the side surface of the blade 2 with respect to the left and right side surfaces of the blade abrasive grain portion 12. Thus, dressing can be performed by relatively moving in the vertical direction and bringing the side surface of the blade abrasive grain portion 12 into contact with the inner surface of the groove 11 of the ingot support member 7.

  In this way, the cutting table 5 is moved in the vertical direction relative to the side surface of the blade 2, and the side surface of the blade abrasive grain portion 12 is brought into contact with the inner surface of the groove 11 of the ingot support member 7 formed when the ingot 4 is cut. If dressing is performed by contact, it is possible to perform dressing multiple times with one groove 11 of the ingot support member 7, which is advantageous in terms of cost, and the blade edge of the blade 2 can be adjusted, and when the blade 2 is cut. The straight running stability can be improved. Also, the dressing of the side surface of the blade 2 in one groove can be automated by moving the cutting table 5 or the blade 2 by the amount of movement set in advance by the NC program, for example, and the dressing accuracy can be performed more stably. Can do.

The relative movement amount of the cutting table 5 and the blade 2 at this time is not particularly limited, but can be set to, for example, 10 μm to 150 μm.
By repeatedly cutting the ingot 4 in this manner, the groove 11 of the ingot support member 7 gradually increases, but an upper limit of the number of dressings that can be performed on one groove 11 is set in advance. What is necessary is just to change the position which forms the groove | channel 11, or to replace | exchange the ingot support member 7 regularly. Here, for example, when the setting of the relative movement amount of the cutting table 5 and the blade 2 is 100 μm, the upper limit of the dressing frequency can be 10 times, and when the setting is 50 μm, the upper limit can be 20 times.

At this time, as shown in FIG. 3, it is preferable to remove the waste by blowing air onto the cutting waste and dress waste generated when the ingot 4 is cut.
Thus, if the waste is eliminated by blowing air on the cutting waste and dress waste generated when the ingot 4 is cut, the variation in dressing accuracy of the blade 2 can be improved more effectively.

Further, at this time, the ingot support member 7 can be lifted from below by the support member raising mechanism 8 and brought into close contact with the ingot 4 to cut the ingot 4.
In this way, if the ingot support member 7 is lifted from below by the support member raising mechanism 8 and brought into close contact with the ingot 4 to cut the ingot 4, the ingot support member 7 becomes a fulcrum at the time of cutting, and the gap portion of the cutting table 5 Thus, the effect of preventing the occurrence of chipping at the cut end portion of the ingot 4 by suppressing the influence of the step can be more reliably exhibited.

  EXAMPLES Hereinafter, the present invention will be described more specifically with reference to examples and comparative examples of the present invention, but the present invention is not limited to these.

Example 1
Using the ingot cutting device of the present invention as shown in FIG. 1, the ingot is cut into blocks by the ingot cutting method of the present invention, and blade dressing is performed, and a plurality of wafer samples are cut from the block to cut the wafer. Cutting accuracy was evaluated.
The dressing of the blade at the time of block cutting was performed by cutting the upper part of the ingot support member. Further, when cutting the wafer sample, the position where the ingot was placed on the cutting table was changed to adjust the cutting position, and the relative positions of the cutting table and the blade were made the same.

Then, the cutting of the wafer sample was repeated, the displacement of the blade after cutting was measured with an eddy current sensor, and the cutting accuracy of the wafer cut when the displacement was 100 μm or more was evaluated. The wafer cutting accuracy was evaluated by measuring the cut surface of the cut wafer from the start to the end with a pick gauge.
As a result, it was confirmed that the maximum value of the pick gauge measurement was 50 μm, which was improved as compared with 100 μm which is the result of Comparative Example 1 described later.

  Thus, it has been confirmed that the ingot cutting device and the cutting method according to the present invention can improve the dressing accuracy.

(Example 2)
Using the ingot cutting apparatus of the present invention as shown in FIG. 1, the ingot block cutting was repeated by the ingot cutting method of the present invention, and the displacement of the blade was measured by an eddy current sensor. The ingot block was cut 250 times.

  When the measured displacement of the blade becomes 50 μm or more, the abrasive table of the blade enters the groove of the ingot support member at the next cutting, and then the cutting table is moved by 50 μm in the direction opposite to the displacement of the blade. Then, dressing was performed by bringing the side surface of the blade into contact with the inner surface of the groove of the ingot support member, and adjustment was made so as to eliminate the blade runout.

  FIG. 8 shows the result of the blade displacement with respect to the number of cuttings. As shown in FIG. 8, it can be seen that variation in the amount of displacement of the blade due to each cutting is reduced as compared with the result of Comparative Example 2 described later. Moreover, the frequency | count of having performed dressing is 25 times, and is a frequency | count small compared with 50 times of a comparative example. In the present invention, since dressing is performed by extending the cutting of the ingot, it is possible to hardly consider an increase in process time. On the other hand, Comparative Example 2 takes 17 hours of dressing process time.

  Thus, it was confirmed that the ingot cutting device and the cutting method according to the present invention can significantly reduce the dressing time and improve the productivity. Further, it was confirmed that the variation in the displacement amount of the blade was reduced, that is, the quality of the ingot to be cut could be stably maintained by reducing the variation in the dressing accuracy.

(Comparative Example 1)
A plurality of wafer samples were cut under the same conditions as in Example 1 except that a conventional band saw as shown in FIG. 7 was used and a hand dressing method by an operator was used, and the wafer cutting accuracy was evaluated.
As a result, the maximum value of the pick gauge measurement was 100 μm, and it was confirmed that the dressing accuracy was deteriorated as compared with the result of Example 1.

(Comparative Example 2)
Using a conventional band saw as shown in FIG. 7, the block cutting was repeated 250 times under the same conditions as in Example 2 except that the hand dressing method by the operator was used, and the displacement of the blade was measured.

  FIG. 8 shows the result of the blade displacement with respect to the number of cuttings. As shown in FIG. 8, it can be seen that the variation in the amount of displacement of the blade by each cutting is larger than the result of Example 2. Further, the number of times dressing was performed was 50 times, which is larger than the number of times of 25 in Example 2. Moreover, the process time of the hand dressing per time was 20 minutes, and the process time of 17 hours was required for 50 dressings.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has any configuration that has substantially the same configuration as the technical idea described in the claims of the present invention and that exhibits the same effects. Are included in the technical scope.

It is the schematic which shows an example of the ingot cutting device which concerns on this invention. It is a schematic side view which shows a mode that the ingot was mounted in the cutting table. It is a schematic explanatory drawing which shows a mode that a braid | blade cut | disconnects an ingot at the time of the cutting | disconnection of an ingot. It is the schematic which shows the shape of the contact surface of an ingot and an ingot support member. It is a schematic explanatory drawing which shows a mode that the side surface of a blade is dressed by the inner surface of the groove | channel of an ingot supporting member. (A) The cutting table moves left and right, and the side surface of the blade is dressed with the inner surface of the groove of the ingot support member. (B) The cutting table moves to the right, and the left side surface of the blade is dressed with the inner surface of the groove of the ingot support member. (C) The cutting table moves to the left, and the right side surface of the blade is dressed with the inner surface of the groove of the ingot support member. It is the schematic which showed an example of the support member raising mechanism of the ingot cutting device which concerns on this invention. It is the schematic which shows an example of the conventional ingot cutting device. It is a figure which shows the result of Example 2 and Comparative Example 2.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Ingot cutting device, 2 ... Blade, 3, 3 '... Pulley,
4 ... Ingot, 5, 5a, 5b ... Cutting table, 6 ... Gap,
7 ... Ingot support member, 8 ... Support member raising mechanism, 9 ... Moving part, 10 ... Fixed part,
DESCRIPTION OF SYMBOLS 11 ... Groove, 12 ... Blade abrasive grain part, 13 ... Eddy current sensor, 14 ... Air nozzle.

Claims (12)

  An ingot is horizontally placed on the cutting table, and the cutting table has a gap for preventing a blade for cutting the ingot from coming into contact with the cutting table, and the blade is placed at the position of the gap of the cutting table. An ingot cutting device for cutting the ingot by feeding it relatively downward from above, and at least a dressing material for supporting the cut end portion of the ingot from below at a position where the ingot is cut by the blade An ingot cutting device comprising: an ingot support member comprising: an ingot support member configured to cut an upper portion of the ingot support member to form a groove to perform dressing of the blade when the ingot is cut.   The ingot cutting device according to claim 1, wherein the blade of the ingot cutting device is a band saw.   The ingot cutting device according to claim 1 or 2, wherein a shape of a contact surface of the ingot support member with the ingot is a shape along a shape of the contact surface of the ingot.   The cutting table is moved in the vertical direction relative to the side surface of the blade, and the side surface of the blade is brought into contact with the inner surface of the groove of the ingot support member formed when the ingot is cut. The ingot cutting device according to any one of claims 1 to 3, wherein the side surface of the blade is dressed.   5. The air nozzle according to claim 1, further comprising an air nozzle that removes the waste by blowing air to the cut waste and dress waste generated when the ingot is cut. Ingot cutting device.   The ingot cutting device according to any one of claims 1 to 5, further comprising a support member raising mechanism for raising the ingot support member from below and bringing the ingot support member into close contact with the ingot. .   An ingot is horizontally placed on the cutting table, and a gap is provided on the cutting table so that a blade for cutting the ingot does not contact the cutting table, and the blade is relatively positioned at the position of the gap of the cutting table. A method for cutting an ingot that cuts the ingot by feeding it downward from above, wherein an ingot support member made of a dressing material is used to form a cutting end portion of the ingot at a position where the ingot is cut by the blade. A method for cutting an ingot comprising: cutting an ingot by supporting, cutting an upper portion of the ingot support member with the blade to form a groove, and dressing the blade.   The ingot cutting method according to claim 7, wherein the ingot is cut by a band saw.   9. The ingot support member according to claim 7, wherein a shape of a contact surface of the ingot support member with the ingot is a shape along a shape of the contact surface of the ingot. The ingot cutting method described.   The blade is moved by moving the cutting table in a direction perpendicular to a side surface of the blade, and the side surface of the blade is brought into contact with an inner surface of a groove of the ingot support member formed when the ingot is cut. The method for cutting an ingot according to any one of claims 7 to 9, wherein a side surface of the ingot is dressed.   The method for cutting an ingot according to any one of claims 7 to 10, wherein the waste is removed by blowing air to the cutting waste and dress waste generated when the ingot is cut. The method for cutting an ingot according to any one of claims 7 to 11, wherein the ingot is cut by causing the support member raising mechanism to raise the ingot support member from below to be brought into close contact with the ingot.

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