JP5187287B2 - Ingot cutting device and ingot cutting method - Google Patents

Description

  The present invention relates to an ingot cutting apparatus and an ingot cutting method for cutting an ingot, in particular, a silicon ingot pulled up by the Czochralski method (CZ method) or the like.

An ingot such as a silicon ingot manufactured by the CZ method or the like has a cone-shaped end portion (top portion and tail portion) in a cylindrical body portion. In the processing of the ingot, these cone-shaped end portions are cut off to form only a cylindrical body portion, and the body portion is cut into a plurality of blocks as necessary. Next, processing for making the block into a wafer is performed.
When cutting such a cone-shaped end portion or cutting the body portion into a plurality of blocks, an inner peripheral blade slicer, an outer peripheral blade slicer, and the like have been often used. Band saws and wire saws have come to be used in many cases with the recent increase in wafer diameter.

Here, FIG. 4 shows an outline of a block cutting method when the blade of the ingot cutting device is a band saw.
As shown in FIG. 4, the ingot cutting device 101 is provided with a cutting table 105 having a V-shaped upper surface for placing the ingot 104 during cutting. As the material of the V-shaped upper surface of the cutting table 105, SUS metal is mainly used.

Further, the ingot cutting device 101 includes an endless belt-like blade (band saw) 102 formed of a blade abrasive portion formed by adhering diamond abrasive grains to an end portion of a thin blade base metal between pulleys 103 and 103 ′. Is stretched.
Then, the ingot 104 is horizontally arranged on the cutting table 105 before cutting. The cutting table 105 is provided with a gap 108 for preventing the blade 102 for cutting the ingot 104 from coming into contact with the cutting table 105. Then, the placement position of the ingot 104 is adjusted so that the cutting position of the ingot 104 matches the gap 108.

The blade 102 is driven to rotate by the rotation of the pulleys 103 and 103 ′, and the blade 102 is fed from the upper side to the lower side at the position of the gap 108 of the cutting table 105, thereby cutting the ingot 104 into blocks (cutout block portions). To do.
At this time, portions other than the cut-out block portion of the ingot 104 are pressed and held by the clamp 107.

By the way, when the sitting accuracy of the ingot 104 placed on the placing surface of the cutting table 105 is deteriorated, the cutting end face or side face of the ingot 104, particularly the cutting end portion, is cut when the ingot 104 is cut as described above. Chips, chips or cracks may occur.
Conventionally, the outer peripheral surface of the ingot 104 is cylindrically ground before the block cutting of the ingot 104, and the surface accuracy of the mounting surface on which the ingot 104 of the cutting table 105 is placed is ensured to some extent. Even if it did in this way, the clearance gap between the ingot 104 and the cutting table 105 was not able to be eliminated completely, but generation | occurrence | production of a crack, a crack, etc. was not able to be prevented.

  In recent years, there is a demand for cutting the outer peripheral surface of the ingot 104 into blocks in an unprocessed state without cylindrical grinding for reasons such as shortening the process time and reducing costs. This requirement tends to increase particularly when cutting an ingot having a diameter of 300 mm or less. As shown in FIG. 5, the shape of the so-called as-grown ingot having an unprocessed outer peripheral surface after such pulling is a shape in which the outer peripheral surface is uneven and protruding, and the surface accuracy of the mounting surface of the cutting table 105 Even if the accuracy is improved, the ingot 104 cannot be stably placed on the cutting table 105. Further, at the time of cutting, as shown in FIG. 5, the holding part 109 of the ingot is pressed and held by the clamp 107 to cut out the cutting block part 110, but such an asgron ingot 104 is held by the clamp 107. Is not stable.

  For example, as a conventional technique related to a cutting method in the case where the shape of one end of a workpiece is complex, one end of a workpiece made of a hard and brittle material is coated with a hardened cement, and then the hardened cement is held. A method is disclosed in which a workpiece can be cut without causing cracks by cutting the workpiece (see Patent Document 1).

JP 2005-238578 A

  Conventionally, when an ingot having an uneven outer peripheral surface as described above is cut, the ingot on the cutting table is lifted by an air cylinder or the like, and the pad is in contact with the portion where the air cylinder and the ingot are in contact. In some cases, the method of holding the ingot by locking the air cylinder has been used. However, such a method cannot follow the uneven shape of the raw ingot, and the occurrence of cracks, chips or cracks is significant. Met.

  In addition, when the length of the ingot 104 is about 60 cm or less, for example, a shim (wedge) is inserted into the gap between the ingot 104 and the cutting table 105 by an operator's manual work, and the ingot 104 is seated on the cutting table 105. There is also a method of cutting by adjusting. Although it is possible to suppress the occurrence of cracks and cracks during cutting of the ingot 104 to some extent by such a method, such adjustment is difficult in terms of work and needs to be performed by a skilled worker. Thus, the occurrence of cracks and cracks could not be suppressed, and the rate of occurrence could not be sufficiently suppressed. Further, when the length of the ingot 104 is, for example, about 60 cm or more, adjustment is difficult and the ingot becomes heavy, and it is difficult for even an expert to perform it.

  The present invention has been made in view of the above-described problems. In particular, even when cutting an ingot having a low sitting accuracy such as an azgron ingot, it is possible to suppress the occurrence of cracks, chips and cracks, and to improve the product yield. It is an object of the present invention to provide an ingot cutting device and a cutting method capable of performing the above.

  In order to achieve the above object, according to the present invention, a cutting table having a V-shaped upper surface and an ingot placed horizontally, and a blade for cutting the ingot into a cutting block portion and a holding portion. An ingot cutting device that cuts the ingot by feeding the blade relatively downward from above while holding the holding portion of the ingot by a clamp, and an impact on the ingot at the time of cutting A cushioning material to be relaxed is provided on the upper surface of the cutting table, and the cushioning material has a hardness of a portion where the cutting block portion of the ingot is placed smaller than a hardness of a portion where the holding portion of the ingot is placed. An ingot cutting device is provided.

  As described above, the cushioning material for reducing the impact on the ingot at the time of cutting is provided on the upper surface of the cutting table, and the cushioning material has a hardness of a portion on which the cutting block portion of the ingot is placed. If it is smaller than the hardness of the part where the holding part is placed, the gap between the ingot and the cutting table can be reduced, and the cutting block part is cut by reducing the impact of the ingot on the cutting block part It can suppress that it moves on a table, and can suppress that a crack, a crack, etc. generate | occur | produce.

At this time, the ingot may be an as-grown ingot.
Thus, even if the ingot is an as-grown ingot having large irregularities, the present invention can reduce the impact of the ingot on the cut-out block portion and suppress the occurrence of cracks, cracks, and the like.

At this time, it is preferable that the Shore hardness of the buffer material is 70 or less.
Thus, when the Shore hardness of the cushioning material is 70 or less, the impact mitigating action on the ingot at the time of cutting is large, and in particular, the impact on the cut block portion of the ingot can be more reliably mitigated. .

At this time, the material of the cushioning material can be urethane resin.
Thus, if the material of the cushioning material is a urethane resin, the impact on the cut block portion of the ingot can be reliably mitigated. Moreover, the thing of various Shore hardness can be selected and the hardness of the buffer material to be used can be adjusted easily.

  Further, according to the present invention, the ingot is horizontally placed on a cutting table whose upper surface is formed in a V shape, and a blade for cutting the ingot into a block part and a holding part is relatively lowered from above. The ingot cutting method is to cut the ingot while holding the holding portion of the ingot by a clamp, and provided with a cushioning material on the upper surface of the cutting table for reducing the impact on the ingot at the time of cutting. The ingot cutting method characterized in that the ingot is cut using a material having a hardness of a portion on which the cut block portion of the ingot is placed being smaller than a hardness of a portion on which the holding portion of the ingot is placed. Is provided.

  As described above, the cushioning material for reducing the impact on the ingot at the time of cutting is provided on the upper surface of the cutting table, and the hardness of the portion on which the cutting block portion of the ingot is placed is held as the cushioning material. If the ingot is cut using a piece having a hardness smaller than that of the portion on which the portion is placed, the gap between the ingot and the cutting table can be reduced, and the impact on the cutting block portion of the ingot can be reduced. It can suppress that a cutting block part moves on a cutting table, and can suppress that a crack, a crack, etc. generate | occur | produce.

At this time, the ingot can be an as-grown ingot.
Thus, even if the ingot is an as-grown ingot having large irregularities, the present invention can alleviate the impact of the ingot on the cut-out block portion and suppress the occurrence of cracks, cracks, and the like.

At this time, it is preferable to use a cushioning material having a Shore hardness of 70 or less.
As described above, when the cushioning material having a Shore hardness of 70 or less is used, the impact mitigating action on the ingot at the time of cutting is large, and in particular, the impact on the cutting block portion of the ingot can be more reliably mitigated. .

At this time, the cushioning material may be made of urethane resin.
As described above, when the cushioning material is made of urethane resin, the impact on the cut-out block portion of the ingot can be reliably mitigated. Moreover, the thing of various Shore hardness can be selected and the hardness of the buffer material to be used can be adjusted easily.

  In the present invention, in the ingot cutting device, a cushioning material for reducing the impact on the ingot at the time of cutting is provided on the upper surface of the cutting table, and the hardness of the portion on which the cutting block portion of the ingot is placed is used as the cushioning material. Since the ingot is cut using a material whose hardness is smaller than that of the portion on which the holding portion is placed, the gap between the ingot and the cutting table can be reduced, and the impact on the cutting block portion of the ingot can be reduced. It can suppress that a cutting block part moves on a cutting table, and can suppress that a crack, a chip | tip, a crack, etc. generate | occur | produce.

It is the schematic which shows an example of the ingot cutting device of this invention. It is the schematic which looked at the cutting table in the state where the ingot was mounted from the front of a longitudinal direction. It is the schematic which looked at the cutting table in the state where the ingot was mounted from the side. It is the schematic which shows an example of the conventional ingot cutting device. It is explanatory drawing which shows a mode that an asgron ingot is cut | disconnected by the conventional ingot cutting device.

Hereinafter, although an embodiment is described about the present invention, the present invention is not limited to this.
Conventionally, when cutting the ingot, if the sitting accuracy of the ingot placed on the placing surface of the cutting table is deteriorated, chips, chips, cracks, etc. are generated on the cut end face and side face of the ingot, particularly the cut end portion. There was a thing. In recent years, there has been a tendency to increase demands for cutting into blocks while maintaining an as-grown ingot having large irregularities, for example, for the purpose of shortening process time and reducing costs.

  The shape of the outer peripheral surface of this asgron ingot is a shape having irregularities and protrusions due to the variation in diameter and the presence of crystal habit lines, and even if the surface accuracy of the mounting surface of the cutting table is determined, Even if the holding portion of the ingot is held by the clamp, it cannot be stably placed on the cutting table, and the sitting accuracy of the ingot will deteriorate.

  Conventionally, when cutting such an ingot with poor sitting accuracy, if the ingot is short enough, the operator manually adjusts the sitting of the ingot with the cutting table by inserting a shim in the gap between the ingot and the cutting table. Although cutting and cracking could be suppressed to a certain extent by cutting, the adjustment is difficult in work and requires skill. The generation rate of cracks, cracks, etc. could not be sufficiently suppressed. In addition, depending on the length of the ingot, it is difficult for such an expert to perform such adjustment work.

  Therefore, the present inventors have made extensive studies to solve such problems. And we investigated and examined in detail the situation where burrs, cracks, etc. occur when cutting ingots. As a result, when the ingot is cut, the ingot cut-out block portion is slightly on the cutting table due to the impact on the ingot due to the deterioration of the sitting accuracy of the ingot or the uneven shape of the outer peripheral surface, or the friction with the blade or its reaction. It has been found that this movement is a cause of occurrence of cracks, chips, cracks and the like.

  And, by providing a cushioning material on the upper surface of the cutting table such that the hardness of the portion on which the ingot cutout block portion is placed is smaller than the hardness of the portion on which the ingot holding portion is placed, in particular, the ingot cutout block The present invention has been completed by conceiving that the occurrence of cracks, chips, cracks and the like can be suppressed even if there are some gaps between the ingot and the cutting table.

FIG. 1 is a schematic view showing an example of the ingot cutting device of the present invention.
As shown in FIG. 1, the blade of the ingot cutting device 1 of the present invention can be a band saw, for example.
The ingot cutting device 1 is provided with a cutting table 5 for placing the ingot 4 at the time of cutting. Then, the ingot 4 is placed horizontally on the cutting table 5.
Further, the ingot cutting device 1 includes an endless belt-like blade (band saw) 2 formed of a blade abrasive grain portion formed by adhering diamond abrasive grains to an end portion of a thin blade base metal between pulleys 3 and 3 ′. Is stretched. Here, as the material of the cutting table 5, for example, SUS metal can be used.

  FIG. 2 is a schematic view of the cutting table 5 on which the ingot 4 is placed as viewed from the front in the longitudinal direction. As shown in FIG. 2, the upper surface of the cutting table 5 is formed in a V shape, and the angle θ of the V shape is not particularly limited in the present invention. For example, an angle of 25 to 30 ° is provided. Can be. In addition, a cushioning material 6 is disposed on the upper surface of the cutting table 5. Then, the ingot 4 is placed on the cutting table 5 via a cushioning material 6 provided on the upper surface of the cutting table 5. Here, the material of the buffer material 6 can be, for example, a resin such as a rubber material or a urethane resin.

  Thus, if the ingot 4 is placed via the cushioning material 6 provided on the upper surface of the cutting table 5, the gap between the ingot 4 and the cutting table 5 can be reduced. For example, when the cushioning material 6 is made of urethane resin, the gap of about 1 mm between the ingot 4 and the cutting table 5 can be reduced to about 0.5 mm and about half. Moreover, if the material of the buffer material 6 is a urethane resin, the thing of various Shore hardness can be selected, and since the hardness of the buffer material 6 to be used can be adjusted easily, it is preferable.

Further, the ingot 4 may be a so-called azuron ingot whose outer peripheral surface after the ingot is pulled is not processed.
FIG. 3 is a schematic view of the cutting table 5 with the ingot 4 placed thereon as seen from the side. As shown in FIG. 3, the ingot 4 is cut by the blade 2 into a cutting block portion 10 and a holding portion 9. The holding portion 9 is pressed and held by the clamp 7. Here, the clamping force by the clamp 7 can be set to, for example, 500 to 1000 kgf.

In the present invention, the cushioning material 6 is such that the hardness of the portion 6A where the cut-out block portion 10 of the ingot 4 is placed is smaller than the hardness of the portion 6B where the holding portion 9 of the ingot 4 is placed. .
As described above, the holding portion 9 of the ingot 4 is held by the clamp 7, while the cutout block portion 10 of the ingot 4 is not held. For this reason, the cutout block portion 10 of the ingot 4 is impacted by the reaction of the downward clamping force to the holding portion 9 of the ingot 4 particularly at the end of cutting of the ingot 4, but the cushioning material 6A of the present invention as described above. Therefore, the impact can be mitigated, and the cutout block portion 10 of the ingot 4 can be prevented from moving in the vertical direction (see A in FIG. 2).

  Then, when the ingot 4 is cut by the ingot cutting device 1 configured as described above, the ingot 4 is placed via the cushioning material 6 provided on the upper surface of the cutting table 5 as shown in FIG. In a state where the holding portion 9 of the ingot 4 is held by the clamp 7, the blade 2 is driven by the rotation of the pulleys 3, 3 ′, and the blade 2 is sent from the upper side to the lower side to cut the ingot 4. It is supposed to be.

  In this way, if the ingot 4 is cut using the ingot cutting device 1 of the present invention, the ingot 4 and the ingot 4 can be cut even when the outer peripheral surface such as an Azron ingot is cut. The sitting accuracy can be improved by reducing the clearance of the table 5, and the sudden impact on the cutting block portion 10 of the ingot 4 especially at the end of cutting is mitigated by the cushioning material 6A softer than the cushioning material 6B of the holding portion 9. Therefore, it is possible to prevent the cutting block unit 10 from moving on the cutting table 5 in the vertical direction or in the traveling direction of the blade 2 (see B in FIG. 2) or in the opposite direction (see C in FIG. 2). be able to. As a result, it is possible to suppress the occurrence of chips, chips, cracks, and the like.

At this time, as shown in FIGS. 1 and 3, the cutting table 5 may have a gap 8 for preventing the blade 2 for cutting the ingot 4 from coming into contact with the cutting table 5. And the ingot 4 can be cut | disconnected by sending out the braid | blade 2 relatively downward from upper direction in the position of this clearance gap 8. FIG.
At this time, it is preferable that the Shore hardness of the cushioning material 6 is 70 or less.
As described above, if the Shore hardness of the cushioning material 6 is 70 or less, the impact mitigating action on the ingot at the time of cutting is great, and in particular, the impact on the cutting block portion 10 of the ingot 4 can be more reliably mitigated. It becomes.

Next, the ingot cutting method of the present invention will be described.
Here, the case where the ingot cutting device 1 as shown in FIG. 1 is used will be described.
First, as shown in FIGS. 1 and 2, a cushioning material 6 is provided on the upper surface of the cutting table 5 to reduce the impact on the ingot 4 during cutting. Here, as shown in FIG. 3, as the buffer material 6, the hardness of the portion 6 </ b> A where the cut-out block portion 10 of the ingot 4 is placed is smaller than the hardness of the portion 6 </ b> B where the holding portion 9 of the ingot 4 is placed. Use things.

Then, as shown in FIG. 1, the ingot 4 is placed via the cushioning material 6 provided on the upper surface of the cutting table 5, and the blade 2 is moved to the pulley while the holding portion 9 of the ingot 4 is held by the clamp 7. The ingot 4 is cut by rotating around 3 and 3 'and feeding the blade 2 relatively downward from above.
Here, the ingot 4 may be a so-called azuron ingot having an unprocessed outer peripheral surface after the ingot is pulled up.

  If the ingot 4 is cut in this manner, the gap between the ingot 4 and the cutting table 5 can be reduced even when cutting an ingot having an outer peripheral surface such as an asgron ingot. Sitting accuracy can be improved, and a sudden impact on the cutout block portion 10 of the ingot 4 can be alleviated, particularly at the end of cutting, so that the cutout block portion 10 can be moved vertically on the cutting table 5 (see FIG. 2). A) or the movement of the blade 2 in the traveling direction (see B in FIG. 2) or the opposite direction (see C in FIG. 2) can be suppressed. As a result, it is possible to suppress the occurrence of chips, chips, cracks, and the like.

At this time, it is preferable to use a buffer material having a Shore hardness of 70 or less.
In this way, if the shock absorbing material 6 having a Shore hardness of 70 or less is used, the impact mitigating action on the ingot at the time of cutting is increased, and in particular, the impact on the cutting block portion 10 of the ingot 4 is more reliably mitigated. can do.

At this time, the cushioning material 6 may be made of urethane resin.
Thus, if the material used is a urethane resin as the buffer material 6, the impact on the cut-out block portion 10 of the ingot 4 can be reliably mitigated. Moreover, the thing of various Shore hardness can be selected and the hardness of the buffer material 6 to be used can be adjusted easily.
Alternatively, a rubber material may be used as the buffer material 6, and any material may be used as long as the material can relieve the impact on the ingot 4. For example, if the hardness of the portion 6A where the cut-out block portion 10 of the ingot 4 is placed is smaller than the hardness of the portion 6B where the holding portion 9 of the ingot 4 is placed, the portions 6A and 6B are made of different materials. May be.

  EXAMPLES Hereinafter, the present invention will be described more specifically with reference to examples and comparative examples of the present invention, but the present invention is not limited to these.

Example 1
The ingot cutting device of the present invention as shown in FIG. 1 is used to cut the single crystal silicon ingot by pressing the clamping force of the holding portion of the ingot with 1000 kgf in accordance with the ingot cutting method of the present invention. The amount of movement of the block part was measured. Here, the cut single crystal silicon ingot was an asgron ingot having a diameter of 250 mm and a weight of 250 kg. Moreover, the length of the cut-out block part was 600 mm. Further, the moving amount of the cut-out block portion is measured using a dial gauge, and the vertical direction (see A in FIG. 2), the blade traveling direction (see B in FIG. 2), and the opposite direction (see C in FIG. 2). Each was measured.

  Moreover, this cut block part was cut 200 times, and the occurrence rate of cracks was evaluated. Here, the used cushioning material is made of urethane resin, the Shore hardness of the portion where the ingot cutout block portion is placed is 30, and the Shore hardness of the portion where the ingot holding portion is placed is 70 Was used.

Table 1 shows the result of the movement amount of the cutout block portion. As shown in Table 1, it can be seen that the amount of movement in either direction is smaller than the result of the comparative example described later. Also. It can be seen that there is almost no amount of movement in the vertical direction, and that the amount is greatly suppressed.
Table 2 shows the results of the crack occurrence rate. As shown in Table 2, it can be seen that the occurrence of cracks is completely suppressed. Thus, although the movement of the cutout block part at the time of the cutting | disconnection has generate | occur | produced somewhat, generation | occurrence | production of a crack can be suppressed by relieving the impact to a cutout block part by this invention. On the other hand, in the comparative example which will be described later, cracks occur after about half of the cuts.

  Thus, it was confirmed that the ingot cutting device and the ingot cutting method of the present invention can suppress the occurrence of cracks, cracks and the like during the cutting of the ingot and can improve the product yield.

(Example 2)
The material used for the cushioning material is a rubber material, except that a portion having a Shore hardness of 30 in which the cutout block portion of the ingot is placed and a portion having a Shore hardness of 50 in which the holding portion of the ingot is placed are used. The silicon single crystal ingot was cut into blocks under the same conditions as in Example 1, and the crack generation rate was evaluated in the same manner as in Example 1.
The results are shown in Table 2. As shown in Table 2, it can be seen that the crack generation rate is 20% and the crack generation rate is higher than that of Example 1, but the crack generation rate is improved as compared with the comparative example described later.

(Comparative example)
Using an ingot cutting device that does not have the buffer material of the present invention as shown in FIG. 4 (the buffer material as a whole has a Shore hardness of 70), a silicon single crystal ingot is formed under the same conditions as in Example 1. The block was cut and evaluated in the same manner as in Example 1.
Table 1 shows the result of the movement amount of the cutout block portion. As shown in Table 1, the amount of movement of the blade in the traveling direction is 0.3 mm, and the amount of movement in the opposite direction is 0.8 mm, which is worse than the result of Example 1. It is considered that this is because the cutout block portion of the ingot first moves in the traveling direction of the blade and greatly moves in the direction opposite to the traveling direction of the blade without relieving the impact caused by the reaction. The movement of the ingot cut-out block part is because the contact between the ingot and the cutting table is not a surface contact but a point contact, particularly when the outer peripheral surface is an uneven shape such as an Azgron ingot. It is thought that it is easy to generate.

  In addition, when the ingot is being cut, clamping pressure is applied to the entire ingot during the up and down movement, so the moving amount of the ingot cutting block and the holding portion of the ingot becomes the same moving amount, but the moment the ingot is cut In addition, the clamping pressure of the ingot is applied only to the holding portion of the ingot, and the cutting block portion is released from the clamping pressure. As a result, in the case of the comparative example in which the Shore hardness of the cushioning material of the ingot cut-out block portion and the ingot holding portion is the same 70, the ingot cut-out block portion and The ingot holding part was displaced by 0.6 mm in the vertical direction. As a result, 48% of cracks occurred as shown in Table 2.

  On the other hand, in the case of Example 1 in which the Shore hardness of the cushioning material of the ingot cutting block portion is 30 and the Shore hardness of the cushioning material of the holding portion of the ingot is 70, the Shore hardness of the cushioning material of the cutting block portion is the holding strength of the ingot. Because it is smaller than the Shore hardness of the cushioning material of the part, the sinking amount of the ingot of the cutting block at the moment when the ingot is cut can be made larger than that of the comparative example. As a result, the ingot at the moment when the cutting of the ingot is finished The vertical displacement between the cut-out block portion and the ingot holding portion can be reduced, and the occurrence of cracks can be prevented.

The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has any configuration that has substantially the same configuration as the technical idea described in the claims of the present invention and that exhibits the same effects. Are included in the technical scope.
For example, in the above description, a band saw is specifically shown as the blade of the ingot cutting device, but the present invention is not limited to this. A blade in a cutting apparatus that places an ingot horizontally on a table and sends the blade relatively downward from above and cuts the blade can be similarly applied. That is, the present invention can be applied to a so-called outer peripheral blade, inner peripheral blade, or wire saw, and the same effects as described above can be achieved.

DESCRIPTION OF SYMBOLS 1 ... Ingot cutting device, 2 ... Blade, 3, 3 '... Pulley,
4 ... Ingot, 5 ... Cutting table, 6 ... Buffer material, 7 ... Clamp,
8: Clearance between cutting tables, 9 ... Holding part of ingot,
10: Ingot cutout block.

Claims (8)

The upper surface is formed in a V-shape, and has a cutting table on which the ingot is placed horizontally, a blade for cutting the ingot into a block portion and a holding portion, and holding the holding portion of the ingot by a clamp An ingot cutting device that cuts the ingot by relatively sending the blade downward from above,
A cushioning material is provided on the upper surface of the cutting table to mitigate the impact on the ingot during cutting, and the cushioning material has a hardness of a portion on which the cutting block portion of the ingot is placed on the holding portion of the ingot. An ingot cutting device characterized in that it is smaller than the hardness of the portion to be placed.   The ingot cutting device according to claim 1, wherein the ingot is an asgron ingot.   The ingot cutting device according to claim 1, wherein a Shore hardness of the cushioning material is 70 or less.   The ingot cutting device according to any one of claims 1 to 3, wherein a material of the buffer material is urethane resin. An ingot is horizontally placed on a cutting table having an upper surface formed in a V-shape, and a blade for cutting the ingot into a block part and a holding part is relatively sent out from above to below, and the holding part for the ingot An ingot cutting method for cutting the ingot while holding it by a clamp,
A cushioning material that reduces the impact on the ingot during cutting is provided on the upper surface of the cutting table, and the holding portion of the ingot is placed as the cushioning material with a hardness of a portion on which the cutting block portion of the ingot is placed. An ingot cutting method comprising cutting the ingot using a material having a hardness lower than that of the portion to be formed.   The ingot cutting method according to claim 5, wherein the ingot is an asgron ingot.   The ingot cutting method according to claim 5 or 6, wherein a material having a Shore hardness of 70 or less is used as the buffer material. The ingot cutting method according to any one of claims 5 to 7, wherein a material made of urethane resin is used as the buffer material.

Images