CN106863096B - Method for cutting a sheet material and device for cutting a sheet material - Google Patents

Method for cutting a sheet material and device for cutting a sheet material Download PDF

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Publication number
CN106863096B
CN106863096B CN201710071629.9A CN201710071629A CN106863096B CN 106863096 B CN106863096 B CN 106863096B CN 201710071629 A CN201710071629 A CN 201710071629A CN 106863096 B CN106863096 B CN 106863096B
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China
Prior art keywords
cutting
groove
sheet material
plate material
plate
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CN201710071629.9A
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CN106863096A (en
Inventor
何邦明
姜文成
王丽红
郑权
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Dongxu Optoelectronic Technology Co Ltd
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Dongxu Optoelectronic Technology Co Ltd
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Publication of CN106863096A publication Critical patent/CN106863096A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/06Grinders for cutting-off
    • B24B27/0675Grinders for cutting-off methods therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/06Grinders for cutting-off
    • B24B27/0683Accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/06Work supports, e.g. adjustable steadies
    • B24B41/068Table-like supports for panels, sheets or the like

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

The invention discloses a method for cutting a plate, which comprises the following steps: -defining a cutting line on the surface of the sheet (100); cutting a first groove (101) on one side surface of the plate material (100) along the cutting line, wherein the groove depth of the first groove is less than half of the thickness of the plate material; cutting a second groove (102) along the cutting line on the other side surface of the plate material, the second groove having a groove depth less than half the thickness of the plate material to form an uncut chipping prevention portion (103) extending in the extending direction of the cutting line on the cut surface; and cutting the crack prevention part along the direction penetrating through the thickness of the plate material, so that the length of the crack prevention part in the extending direction of the cutting line is gradually shortened until the crack prevention part is completely cut off. The invention also provides a device for cutting the plate. The invention can avoid the problem that the high-strength plate is easy to crack when being cut by the conventional means.

Description

Method for cutting a sheet material and device for cutting a sheet material
Technical Field
The invention relates to the field of glass manufacturing, in particular to a method and a device for cutting a plate.
Background
In a liquid crystal glass substrate production line, a silicon carbide refractory material with high precision needs to be used. The traditional silicon carbide workpiece is manufactured by firstly manufacturing the shape of the workpiece and then sintering, and the sintered silicon carbide has the characteristics of superhard material, the hardness of the silicon carbide is between that of corundum and diamond, and the mechanical strength of the silicon carbide is higher than that of the corundum. Silicon carbide plates used in a liquid crystal glass substrate production line have different shapes and sizes, and need to be cut. Because of the superhard material of carborundum, use cutting tool commonly used to carry out conventional cutting, often produce the incision when will cutting through soon and break apart, lead to the unable condition such as too fast of work piece and cutting tool wearing and tearing, and can't accomplish the cutting process task.
Disclosure of Invention
An object of the present invention is to provide a method and apparatus for cutting a plate material, by which a high-strength silicon carbide plate material can be cut into a desired shape and size and chipping can be prevented from occurring during cutting.
In order to achieve the above object, the present invention provides a method of cutting a plate material, comprising the steps of: determining a cutting line on the surface of the plate; cutting a first groove along the cutting line on one side surface of the plate, wherein the groove depth of the first groove is less than half of the thickness of the plate; cutting a second groove along the cutting line on the other side surface of the plate material, the second groove having a groove depth less than half the thickness of the plate material to form an uncut chipping prevention portion extending in the extending direction of the cutting line on the cut surface; and cutting the crack prevention part along the direction penetrating through the thickness of the plate material, so that the length of the crack prevention part in the extending direction of the cutting line is gradually shortened until the crack prevention part is completely cut off.
Preferably, the thickness of the crack preventing portion is 3 to 8 mm in the thickness direction of the plate material.
Preferably, when the first groove and the second groove are cut, multiple times of cutting are carried out along the extending direction of the cutting line, and the cutting depth of each time of cutting is 0.02 mm to 3 mm until the preset groove depth is reached; and when the anti-crack part is cut, the cutting depth of each cutting is 0.02 mm to 3 mm.
Preferably, the cutting speed along the cutting line is 200 mm/min to 2000 mm/min when cutting the first and second grooves.
Preferably, the sheet material is fixed to form an angle of 10 to 20 degrees with the horizontal.
Preferably, when the crack prevention part is cut, the cutting direction forms an angle of 20 degrees to 60 degrees with the surface of the plate material.
Preferably, the plate is a silicon carbide plate.
In another aspect, the present invention provides an apparatus for cutting a plate material, including: the table top is used for placing plates; the clamp is used for clamping the plate on the table top; and a cutter provided above the table top, height-adjustably movable at least in a direction parallel to the surface of the plate material, and movable in a direction penetrating the thickness of the plate material.
Preferably, the deck is disposed at an angle to the horizontal such that when the sheet is clamped against the deck, the sheet forms an angle of 10 to 20 degrees with the horizontal.
Preferably, the cutter comprises a cutting blade, the cutting blade is a resin bond diamond grinding body blade, and the rotating speed of the cutting blade is 300 to 3000 revolutions per minute.
According to the technical scheme, the first groove and the second groove are respectively cut on the surfaces of the two sides of the plate when the plate is cut, and the groove bottoms of the first groove and the second groove are kept in a non-cutting state, so that the anti-crack part extending in the extending direction of the cutting line is formed on the cutting surface. Thereafter, the chipping prevention portion is cut alone. Therefore, the problem that the high-strength plate is easy to crack when being cut by a conventional method can be avoided.
Additional features and advantages of the invention will be set forth in the detailed description which follows.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic sectional view of a first groove cut by the method of cutting a plate material according to the present invention, showing a cutting trace;
FIG. 2 is a schematic sectional view of a second groove cut by the method of cutting a plate material according to the present invention, showing a cutting trace;
fig. 3 is a schematic view of a cut section when the crack prevention part is not cut according to the method of cutting a plate material of the present invention;
fig. 4 is a perspective view of an apparatus for cutting a plate material according to the present invention;
FIG. 5 is a top view of an apparatus for cutting sheet material according to the present invention;
fig. 6 is a sectional view taken along line B-B shown in fig. 5.
Description of the reference numerals
100 sheet 101 first groove 102 second groove
103 crack prevention part
2 table-board 21 flange 22 notch
3 clamp 31 pressure plate 32 bolt
33 nut 34 counterbore 35 shim
36 cushion block
4 cutting tool 41 cutting blade 42 base
43 cutter bar
5 cutting track
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
Referring to fig. 1 to 3, the present invention provides a method of cutting a plate material. Because the silicon carbide plate is made of super-hard materials and is not easy to cut, the cutting method provided by the invention is particularly suitable for cutting the silicon carbide plate, but is not limited to cutting the silicon carbide plate, and is suitable for all plates which are high in strength and easy to crack in cutting.
According to an embodiment of the present invention, a cutting line is determined on a surface of the sheet material 100 before the sheet material 100 is cut. The cutting line is determined in order to provide an operating path for the cutting operation, making the cutting operation more reliable. The cutting line may be an explicit line directly marked on the panel 100, or may be a hidden line only marked on the construction drawing but not marked on the panel 100.
Next, as shown in fig. 1 to 3, on one side surface of the plate material 100, a first groove 101 is cut along a cutting line. The first groove 101 has a depth extending in the thickness direction of the sheet material 100, and a notch is formed on the surface of the sheet material 100. According to an embodiment of the present invention, the groove depth of the first groove 101 is less than half the thickness of the sheet material 100. That is, when the first groove 101 is cut, the cutting depth is not more than half the thickness of the plate material 100.
After the first groove 100 is cut, a second groove 102 is cut along a cutting line on the other side surface of the plate material 100. The second groove 102 also has a groove depth extending along the thickness direction of the plate 100, and the notch is located on the other side surface of the plate 100. According to an embodiment of the present invention, the second groove 102 has a groove depth less than half the thickness of the sheet 100. That is, the cutting depth does not exceed half the thickness of the sheet material 100 when the second groove 102 is cut.
Thus, as shown in fig. 3, the chipping prevention portion 103 is formed on the cut surface. The chipping prevention part 103 is formed by an uncut portion of the groove bottom of the first groove 101 and the second groove 102, and extends in the extending direction of the dicing line. Since the plate material 100 is not cut through when the first groove 101 and the second groove 102 are cut, a chipping phenomenon does not occur in the process of cutting the first groove 101 and the second groove 102.
Next, according to the embodiment of the present invention, the crack prevention part 103 is gradually cut in a direction penetrating the thickness of the plate material 100. The cutting direction at this time is different from the cutting direction when the first groove 101 and the second groove 102 are cut. When cutting the first groove 101 and the second groove 102, the cutting tool performs cutting in a direction substantially parallel to the surface of the sheet material 100; in cutting the crack preventing portion 103, the cutting tool performs cutting in a direction substantially perpendicular to the surface of the plate material 100. In the process of cutting the crack prevention portion 103, the length of the crack prevention portion 103 in the extending direction of the cutting line is gradually shortened. When the length is shortened to zero, the crack prevention portion 103 is completely cut off; at this time, the sheet material 100 is also completely cut along the cutting line.
Therefore, the present invention completely avoids the problem that the crack easily occurs at the portion near the cut-through in the conventional cutting manner by cutting the first groove 101 and the second groove 102 from both sides of the plate material 100, respectively, and cutting the crack prevention part 103 separately. Because the first groove 101 and the second groove 102 are cut into the plate 100 by less than half of the thickness of the plate 100, the groove bottoms of the first groove 101 and the second groove 102 are not close to the other side surface of the plate 100, so that the situation that the cut is close to the cut-through part is avoided, and the occurrence of the crack phenomenon can be avoided in the process. The crack prevention part 103 is located at the middle of the cutting surface and is far away from the two side surfaces of the plate 100, so that the crack phenomenon does not occur when the crack prevention part 103 is cut alone.
With continued reference to fig. 1 to 3, according to the embodiment of the present invention, the thickness of the crack prevention part 103 is 3 to 8 mm in the thickness direction of the plate material 100. In more detail, when the thickness of the plate material 100 is thick, for example, above 30 mm, the thickness of the crack prevention part 103 may be selected from 5 mm to 8 mm. When the thickness of the plate material 100 is thin, for example, below 30 mm, the thickness of the crack prevention part 103 may be selected from 3 mm to 5 mm. The thickness of the crack prevention portion 103 is appropriately selected, which is not only beneficial to conveniently cutting the crack prevention portion 103, but also beneficial to controlling the groove depth of the first groove 101 and the second groove 102.
According to the embodiment of the present invention, when the first groove 101 and the second groove 102 are cut, it is preferable to perform a plurality of cuts along the extending direction of the cutting line. As shown in fig. 1 and 2, the cutting trajectory 5 is composed of a plurality of sets of substantially parallel trajectory lines. Preferably, the cutting depth of each cutting is 0.02 mm to 3 mm, and the cutting depth gradually goes back and forth until the preset groove depth is reached. Therefore, the cutting is carried out repeatedly, the advancing speed and the cutting depth of the cutting tool can be controlled, the abrasion of the cutting tool is reduced, and the cutting quality is ensured. In addition, according to the embodiment of the present invention, when the crack prevention part 103 is cut, it is preferable that the depth of cut per cutting is 0.02 to 3 mm. This is advantageous in controlling the advancing speed and the depth of cut of the cutting tool, so that the cutting quality can be ensured. In addition, according to the embodiment of the present invention, the cutting speed along the cutting line is 200 mm/min to 2000 mm/min when the first groove 101 and the second groove 102 are cut. The cutting speed is controlled well, the cutting tool can be prevented from being abraded too fast, and the cutting quality is ensured.
According to an embodiment of the present invention, the sheet material 100 is fixed to form an angle of 10 to 20 degrees with the horizontal plane. Thus, cutting tool wear particles and debris of the sheet material 100 generated during the cutting process may slide along the inclined surface from high to low. Particularly, when the cutting fluid is used, the flow of the cutting fluid is facilitated, and thus the chip removal is facilitated. In addition, according to the embodiment of the present invention, the cutting direction forms an angle of 20 to 60 degrees with the surface of the plate material 100 when the crack prevention part 103 is cut. Preferably, the cutting direction forms an angle of about 45 degrees with the surface of sheet material 100. Such a cutting direction makes the cutting force applied to the crack prevention portion 103 be distributed uniformly, and the crack of the plate material 100 due to stress concentration at a certain portion does not occur.
Referring to fig. 4 to 6, another aspect of the present invention provides an apparatus for cutting a plate material. The device comprises a table top 2 for placing the sheet material 100 and a clamp 3 for clamping and fixing the sheet material 100 on the table top 2. The device also comprises a cutter 4 arranged above the table top 2, which cutter 4 can be connected to the machine frame and is capable of performing cutting operations from a plurality of directions. According to an embodiment of the invention, the knife 4 is at least movable in a direction substantially parallel to the surface of the sheet 100 and is height-adjustable relative to the surface of the sheet 100. Thus, for example, but not limiting of, the knife 4 may perform the operations described above for cutting the first groove 101 and the second groove 102 on the sheet material 100. The knife 4 should also be able to move in a direction through the thickness of the sheet material 100. Thus, for example, but not limiting of, the tool may perform the above-described operation of cutting the chipping prevention part 103 on the plate material 100.
As shown in fig. 4, the cutter 4 includes a cutting blade 41. According to an embodiment of the present invention, the cutting blade 41 is a resin bond diamond burr blade having a strength significantly higher than that of a conventional diamond saw blade. The tool 4 further comprises a base 42 located at the inner periphery of the cutting blade 41, the base 42 preferably being of metal to provide strength to the tool 4. A tool bar 43 is attached to the metal base 42 and the tool 4 can be mounted to the frame via the tool bar 43. In addition, according to the embodiment of the present invention, the rotation speed of the cutting blade 41 is preferably 300 to 3000 revolutions per minute. The control of the advancing speed and the cutting depth of the cutting blade 41 is facilitated, the abrasion is reduced, and the cutting quality is ensured.
As shown in fig. 4 and 6, the table top 2 is disposed at an angle to the horizontal. Thus, when the sheet 100 is clamped on the table top 2, the sheet may be fixed at an angle of 10 to 20 degrees to the horizontal. Thus, the abrasion particles of the resin bond diamond grinding body and the chips of the plate material 100 generated during the cutting process can slide along the inclined surface from high to low, which facilitates chip removal. A rib 21 is provided at a lower end of the table top 2 to stop the sheet 100 from slipping off. The rib 21 is provided with a notch 22 such that the notch 22 forms an escape structure when the knife 4 is moved in a direction substantially parallel to the surface of the sheet material 100 to cut the sheet material 100.
As shown in fig. 4 to 6, a plurality of sets of clamps 3 are provided on the table top 2 for clamping the sheet material 100. The clamp 3 includes a pressing plate 31, and a spacer 35, such as but not limited to a plastic spacer, is disposed at one end of the pressing plate 31 to buffer the pressing force and protect the plate 100. The other end of the pressure plate 31 is connected with a cushion block 36 which can support the pressure plate 31, thereby playing a role in stabilizing the pressure plate 31. The clamp 3 further comprises a bolt 32 and a nut 33. The head of the bolt 32 is disposed in a counterbore 34, and the counterbore 34 has a retaining function. The tail of the bolt 32 is engaged with the nut 33 to press the pressing plate 31, and thus the plate 100.
In performing the cutting operation, the sheet material 31 is placed on the table top 2, and the end of the press plate 31 provided with the spacer 35 is pressed against the sheet material 100. The thickness of mat 36 is substantially equal to the thickness of sheet 100. Nuts 33 are fitted over the bolts 32, and tightening the nuts 33 causes the pressing plate 31 to press the plate 100.
Other embodiments of the device for cutting a sheet material correspond to the above-mentioned embodiments of the method for cutting a sheet material, and are not described herein again. Embodiments of the apparatus for cutting a sheet material and embodiments of the method for cutting a sheet material may be combined with each other in any combination, and are within the scope of the present invention.
The preferred embodiments of the present invention have been described in detail with reference to the accompanying drawings, however, the present invention is not limited to the specific details of the above embodiments, and various simple modifications can be made to the technical solution of the present invention within the technical idea of the present invention, and these simple modifications are within the protective scope of the present invention.
It should be noted that the various features described in the above embodiments may be combined in any suitable manner without departing from the scope of the invention. The invention is not described in detail in order to avoid unnecessary repetition.
In addition, any combination of the various embodiments of the present invention is also possible, and the same should be considered as the disclosure of the present invention as long as it does not depart from the spirit of the present invention.

Claims (9)

1. A method of cutting a sheet of material, comprising the steps of:
-defining a cutting line on the surface of the sheet (100);
cutting a first groove (101) on one side surface of the plate material (100) along the cutting line, wherein the groove depth of the first groove (101) is less than half of the thickness of the plate material (100);
cutting a second groove (102) along the cutting line on the other side surface of the plate material (100), wherein the groove depth of the second groove (102) is less than half of the thickness of the plate material (100) so as to form an uncut crack preventing part (103) extending in the extending direction of the cutting line on the cutting surface;
cutting the crack prevention part (103) along a direction penetrating through the thickness of the plate material (100) so that the length of the crack prevention part (103) in the extending direction of the cutting line is gradually shortened until the crack prevention part is completely cut off;
when the first groove (101) and the second groove (102) are cut, multiple times of cutting are carried out along the extending direction of the cutting line, and the cutting depth of each time of cutting is 0.02 mm to 3 mm until the preset groove depth is reached; when the crack prevention portion (103) is cut, the depth of cut per cutting is 0.02 mm to 3 mm.
2. The method of cutting a plate material according to claim 1, wherein the thickness of the chipping prevention part (103) is 3 mm to 8 mm in the thickness direction of the plate material (100).
3. The method of cutting a panel as claimed in claim 1, wherein the cutting speed along the cutting line is 200 mm/min to 2000 mm/min when cutting the first groove (101) and the second groove (102).
4. The method of cutting a sheet material as claimed in claim 1, wherein the sheet material (100) is fixed at an angle of 10 to 20 degrees to the horizontal.
5. The method of cutting a plate material according to claim 1, wherein a cutting direction forms an angle of 20 to 60 degrees with a surface of the plate material (100) when cutting the crack prevention part (103).
6. The method of cutting a sheet material according to claim 1, wherein the sheet material (100) is a silicon carbide sheet.
7. A method of cutting sheet material as claimed in any one of claims 1 to 6, characterised in that the method employs apparatus comprising: the table top (2), the table top (2) is used for placing the plate (100); a clamp (3), the clamp (3) is used for clamping the sheet material (100) on the table top (2); and a cutter (4), which cutter (4) is arranged above the table top (2), is at least height-adjustably movable in a direction parallel to the surface of the sheet material (100), and is movable in a direction through the thickness of the sheet material (100).
8. The method of cutting a sheet material according to claim 7, wherein the deck (2) is arranged at an angle to the horizontal such that when the sheet material (100) is clamped on the deck (2), the sheet material (100) forms an angle of 10 to 20 degrees with the horizontal.
9. The method of cutting a plate material according to claim 7, wherein the cutter (4) comprises a cutting blade (41), the cutting blade (41) is a resin bond diamond-carbide blade, and the rotation speed of the cutting blade (41) is 300 to 3000 rpm.
CN201710071629.9A 2017-02-09 2017-02-09 Method for cutting a sheet material and device for cutting a sheet material Active CN106863096B (en)

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CN201710071629.9A CN106863096B (en) 2017-02-09 2017-02-09 Method for cutting a sheet material and device for cutting a sheet material

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CN106863096B true CN106863096B (en) 2020-11-06

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Publication number Priority date Publication date Assignee Title
CN107645841A (en) * 2017-11-02 2018-01-30 惠州市特创电子科技有限公司 Micro carving machine and its cutting method
CN113618840B (en) * 2020-05-07 2023-06-02 复扬电子(苏州)有限公司 Forming method of process film

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Publication number Priority date Publication date Assignee Title
JPS6434606A (en) * 1987-07-27 1989-02-06 Okawa Hiroo Round bar cutter
JPH03277463A (en) * 1990-03-27 1991-12-09 Fujitsu Ltd Ceramic plate cutting method
US6402004B1 (en) * 1998-09-16 2002-06-11 Hoya Corporation Cutting method for plate glass mother material
US6412677B1 (en) * 1998-09-16 2002-07-02 Hoya Corporation Cutting method for plate glass mother material
JP4163552B2 (en) * 2003-05-20 2008-10-08 株式会社ホンダロック Sheet glass cutting method and apparatus
JP6228044B2 (en) * 2014-03-10 2017-11-08 株式会社ディスコ Processing method of plate
JP2015214002A (en) * 2014-05-13 2015-12-03 株式会社ディスコ Cutting method
CN205928769U (en) * 2016-04-08 2017-02-08 深圳市路维光电股份有限公司 Sheet material cutting device

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Effective date of registration: 20200914

Address after: 050035 No. 9, the Yellow River Avenue, hi tech Zone, Hebei, Shijiazhuang

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Denomination of invention: Method and device for cutting sheet metal

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Record date: 20231010