JPS60134555U

JPS60134555U - Base plate for cutting hard and brittle materials, etc.

Info

Publication number: JPS60134555U
Application number: JP1984022200U
Authority: JP
Inventors: 斉木　昭治
Original assignee: Individual
Current assignee: Individual
Priority date: 1984-02-18
Filing date: 1984-02-18
Publication date: 1985-09-07

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図イは合板素材の斜視図、第１図口は第１図の合板
素材の組成図、第２図はドレッシング用台板の成型工程
を示す縦断面図、第３図はドレン　９シング用台板の斜
視図、第４図は他の実施例を示すドレッシング用台板の
斜視図、第５図は加工機の切断用砥石によりワークを切
断加工している状態を示す側面図、第６図は切断用砥石
でワークを切断加工している状態を正面からみた縦断面
図、第７図は切断用砥石とドレッシング用台板との当接
状態を示す部分拡大図である。Ｌ　　ｌａ、ｌｂｔ　　ｌｃ・・・台板素材、２・・・
研削材、３・・・砥粒率調整材、４・・・結合材、１４
．１４ａｔ　　１４ｂｔ　　１４ｃ・・・切断用台板、
１３・・・載置部。第６図第７図Figure 1A is a perspective view of the plywood material, the opening in Figure 1 is a composition diagram of the plywood material in Figure 1, Figure 2 is a longitudinal cross-sectional view showing the forming process of the dressing base plate, and Figure 3 is the drain 9sing. FIG. 4 is a perspective view of a dressing base plate showing another embodiment; FIG. FIG. 6 is a longitudinal sectional view from the front showing a state in which a workpiece is being cut with a cutting whetstone, and FIG. 7 is a partially enlarged view showing a state in which the cutting whetstone and the dressing base plate are in contact with each other. L la, lbt lc...base plate material, 2...
Abrasive material, 3... Abrasive grain rate adjustment material, 4... Binding material, 14
．． 14at 14bt 14c... Cutting base plate,
13... Placement section. Figure 6 Figure 7

Claims

[Scope of utility model registration request]

An abrasive material such as diamond abrasive grains, charcoal-fired silicon abrasive grains, aluminum oxide abrasive grains, and borazone abrasive grains; an abrasive grain ratio adjusting material such as silicon or silica stone mixed in the abrasive material; and the abrasive material and the abrasive grain ratio. A plywood material made of ceramic-containing synthetic resin that binds the mixed material with the conditioning material, a binder such as rubber, and
In addition, it is hardened at a temperature of room temperature to 1300°C depending on the material of the binder, and is dressed when the cutting edge of the cutting wheel of the processing machine comes into contact with the abrasive material of the base plate material during the cutting operation. A cutting base plate having a structure such that a bar, plate or spherical workpiece made of a hard brittle material such as a semiconductor substrate, a ceramic, or a core of a magnetic head is stably placed on the cutting base plate. A mounting part for cutting is formed by a combination of integrally molded or separately molded from the same material as the cutting base plate, so that the contact area with the workpiece is large, and the front The cutting edge of the cutting whetstone in the writing section first comes into contact with the part to be cut, and the part to be cut is formed as a lead for the cutting edge, and the cutting whetstone is placed in the placement section while the workpiece is securely positioned. 1. A base plate for cutting hard and brittle materials, characterized in that the cutting edge of the workpiece is dressed and led while machining the workpiece.