JPH0111416Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] This invention relates to a polisher for polishing stones and the like.

[Conventional technology]

Conventionally, as a polisher for polishing stone materials, there is one described in Japanese Utility Model Application Publication No. 56-83366.

Such a stone polisher has metal bond chips or resinoid bond chips, each of which uses diamond powder as an abrasive grain, attached to a substrate at predetermined intervals.

By the way, in polisher chips for stone polishing, especially in the field of fine grains, the speed of grain change greatly influences the performance of the chips.

[Problem that the invention attempts to solve]

However, since conventional abrasive chips, including the abrasive chips of the stone polisher described in the above publication, are single-layered, it is necessary to install new abrasive chips each time the single layer wears out, and it is necessary to replace the chips. It was not possible to improve the speed.

Furthermore, since the abrasive chips are made of a single material, there is also a problem in that the grinding resistance of the grinding blade is high.

The purpose of this invention is to provide a stone polisher that can quickly and easily change the grain, reduce the grinding resistance of the grinding blade, and significantly improve the grinding performance. .

[Means for solving problems]

In order to achieve the above object, in the present invention, a polisher for stone polishing is made by fixing a large number of grinding blades to the end face of a grinding wheel base, and bonding each grinding blade with diamond abrasive grains using a bonding agent such as metal bond or resin bond. A grinding layer is formed by horizontally adjoining an abrasive layer bonded with a bond layer made of a material that has lower hardness and greater lubricity than the abrasive layer, and a plurality of the abrasive layers are formed vertically. It is constructed by stacking them in a staggered manner.

〔Example〕

This invention will be described below based on embodiments shown in the drawings.

FIG. 1 is a perspective view of the grinding blade, and FIG. 2 is a plan view of the rotating grindstone.

In FIG. 1, 1 is an abrasive material layer, and the abrasive material layer 1 is made of diamond, cubic boron nitride, silicon carbide,
It is made by bonding abrasive grains made of molten alumina or the like with a binder such as metal bond, resin bond, bitrified bond, or metal bond, and in this example, it has an elongated rectangular parallelepiped shape.

Further, 2 is a bond layer that is bonded laterally adjacent to the abrasive layer 1 to form the abrasive layer 3, and the bond layer 2 is softer than the abrasive layer 1 and has lubricating properties. metal bond, resin bond,
Made of synthetic resin such as vitrified bond.
Further, like the abrasive material layer 1, the bond layer 2 also has an elongated rectangular parallelepiped shape.

The grinding layers 3 having such a configuration are stacked in a staggered manner in the vertical direction to form a grinding blade 4.

Although FIG. 1 shows an example in which the abrasive layer 1 and the bond layer 2 are arranged adjacent to each other in one row in the lateral direction, they may be arranged adjacent to each other in multiple rows.

In addition, the particle size and type of abrasive grains constituting the abrasive layer 1 and the bond layer 2, the type and compounding ratio of the binder, the area ratio of the abrasive layer 1 and the bond layer 2, the number of laminated layers, etc. Select as appropriate depending on the characteristics of

FIG. 2 shows how the grinding blades are attached to the base metal 5, in which a plurality of grinding blades 4 are attached concentrically and removably to the end face of the grindstone base metal 5.
However, the grinding blade 4 can also be fixedly mounted.

Next, a description will be given of a polishing operation using the polisher for polishing stone having the above structure.

Grinding blade 4 of a polisher for stone polishing on the workpiece
guess. In this case, the uppermost grinding layer 3 first comes into contact with the workpiece.

As mentioned above, since the bond layer 2 has low hardness and a low coefficient of friction with respect to the abrasive layer 1, the grinding blade 4
Grinding resistance can be reduced.

Thereafter, when the uppermost grinding layer 3 is digested, the next grinding layer 3 is exposed, thereby making it easy to change the grinding layer.

In the manner described above, it is possible to perform polishing up to the lowest grinding layer 3 without reducing the sharpness of the grinding blade.

[Effect of idea]

According to this idea, the grinding resistance of the abrasive grains of the abrasive chip is reduced by placing the abrasive material layer and the soft, lubricating bond layer adjacent to each other in the horizontal direction. Since the layers are laminated, the grinding resistance can be reduced, and the abrasive grains can be easily changed during grinding, thereby improving the sharpness of the grinding blade.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a grinding blade according to an embodiment of the present invention.
FIG. 2 is a plan view of the rotating grindstone. In the figure, 1: abrasive layer, 2: bond layer, 3: grinding layer, 4: grinding blade, 5: grindstone base metal.

Claims (1)

[Scope of utility model registration request] A large number of grinding blades 4 are fixed to the end face of the grindstone base metal 5,
Each grinding blade 4 is made up of an abrasive layer 1 in which diamond abrasive grains are bonded with a binder such as metal bond or resin bond, and a bond layer made of a material that has lower hardness and greater lubricity than the abrasive layer 1. A polisher for polishing stone, characterized in that a grinding layer 3 is formed adjacent to the grinding layer 2 in the horizontal direction, and a plurality of the grinding layers 3 are laminated in a staggered manner in the vertical direction.