JPS59132759U - Whetstone for stone polishing machine - Google Patents

Whetstone for stone polishing machine

Info

Publication number
JPS59132759U
JPS59132759U JP2586183U JP2586183U JPS59132759U JP S59132759 U JPS59132759 U JP S59132759U JP 2586183 U JP2586183 U JP 2586183U JP 2586183 U JP2586183 U JP 2586183U JP S59132759 U JPS59132759 U JP S59132759U
Authority
JP
Japan
Prior art keywords
whetstone
polishing machine
stone polishing
binder
abrasive grains
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2586183U
Other languages
Japanese (ja)
Inventor
高橋 康幸
Original Assignee
株式会社高橋産業
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社高橋産業 filed Critical 株式会社高橋産業
Priority to JP2586183U priority Critical patent/JPS59132759U/en
Publication of JPS59132759U publication Critical patent/JPS59132759U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、石材用研磨盤の斜視説明図、第2図は、従来
の石材加工用砥石の一部切欠き斜視図、第3図は、砥石
の一部拡大説明図、第4図は、本願考案に係る砥石の一
実施例を示す斜視説明図である。 3・・・砥石、3a・・・砥粒(ダイヤ)、3b、・・
・結合剤、4・・・研磨部、5・・・チップポケット部
Fig. 1 is a perspective explanatory view of a stone polishing machine, Fig. 2 is a partially cutaway perspective view of a conventional stone processing whetstone, Fig. 3 is a partially enlarged explanatory view of the whetstone, and Fig. 4 is an explanatory perspective view of a conventional stone processing grindstone. , is a perspective explanatory view showing one embodiment of a grindstone according to the present invention. 3... Grindstone, 3a... Abrasive grain (diamond), 3b...
・Binding agent, 4... Polishing part, 5... Chip pocket part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 砥粒を結合剤と共に焼結固化してなる砥石において砥粒
および結合剤とで形成される研磨部と結合剤のみで形成
されるチップポケット部とから構成したことを特徴とす
る石材研磨盤用砥石。
A grinding wheel made by sintering and solidifying abrasive grains together with a binder, and comprising: a polishing part formed by the abrasive grains and the binder; and a chip pocket part formed only by the binder. Whetstone.
JP2586183U 1983-02-25 1983-02-25 Whetstone for stone polishing machine Pending JPS59132759U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2586183U JPS59132759U (en) 1983-02-25 1983-02-25 Whetstone for stone polishing machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2586183U JPS59132759U (en) 1983-02-25 1983-02-25 Whetstone for stone polishing machine

Publications (1)

Publication Number Publication Date
JPS59132759U true JPS59132759U (en) 1984-09-05

Family

ID=30156834

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2586183U Pending JPS59132759U (en) 1983-02-25 1983-02-25 Whetstone for stone polishing machine

Country Status (1)

Country Link
JP (1) JPS59132759U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6146157U (en) * 1984-08-30 1986-03-27 ノリタケダイヤ株式会社 Polisher for stone polishing
JPH11156724A (en) * 1997-11-28 1999-06-15 Kozo Ishizaki Preliminary molded material and girding wheel made of said preliminary molded material having controlled abrasive grain intervals

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6146157U (en) * 1984-08-30 1986-03-27 ノリタケダイヤ株式会社 Polisher for stone polishing
JPH11156724A (en) * 1997-11-28 1999-06-15 Kozo Ishizaki Preliminary molded material and girding wheel made of said preliminary molded material having controlled abrasive grain intervals

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